KR20120087985A - Copper alloy sheet and process for producing same - Google Patents

Abstract

Provided are copper alloy plate materials excellent in bending workability, excellent strength, and suitable for connectors, terminal materials, relays, switches, and the like for automotive vehicle materials such as lead frames, connectors, and terminal materials for electric and electronic devices.
In the crystal orientation analysis in the EBSD (Electron Back Scatter Diffraction) measurement, the angle formed by the normal of the (111) plane and the TD with respect to the integration of the atomic plane in the width direction (TD) of the rolled sheet. A copper alloy sheet material having an area rate of 50% or less, a yield strength of 500 MPa or more, and a conductivity of 30% IACs or more, and a method of manufacturing the same.

Description

Copper alloy sheet and its manufacturing method {COPPER ALLOY SHEET AND PROCESS FOR PRODUCING SAME}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a copper alloy sheet material and a method for manufacturing the same, and more particularly, to a copper alloy sheet material applied to a lead frame, a connector, a terminal material, a relay, a switch, a socket, and the like for a vehicle component or an electric / electronic device. will be.

Examples of the characteristic items required for copper alloy sheet materials used for automotive parts, such as lead frames, connectors, terminal materials, relays, switches, and sockets for electric and electronic devices include, for example, electrical conductivity and yield strength (yield). Stress), tensile strength, bending workability, and stress relaxation resistance. In recent years, with the miniaturization, weight reduction, high functionality, high density mounting, and high temperature of the use environment of electric and electronic devices, the level of such required characteristics is increasing.

For this reason, the following changes are mentioned in the situation where the recent copper alloy sheet material is used.

First of all, with the advancement of automobiles, electric and electronic devices, and the increase of connectors, the polarization of connectors is progressing, and the miniaturization of terminals and contact parts is progressing. For example, the movement of miniaturizing the terminal whose tab width is about 1.0 mm to 0.64 mm is progressing.

Secondly, on the background of the reduction of mineral resources and the weight reduction of parts, thinning of the base material is progressing, and in order to maintain the spring contact pressure, a high-strength base material is used.

Third, the high temperature of the use environment is progressing. For example, in automobile parts, in order to reduce the amount of carbon dioxide generated, vehicle body weight reduction is in progress. For this reason, the operation | movement which shortens the wire harness between an electronic device and an engine is provided in the past by installing electronic devices, such as ECU for engine control, provided in the door in the engine room or an engine vicinity.

And with the said change, the following problems arise with a copper alloy plate material.

First, with the miniaturization of the terminal, the bending radius of the bending processing performed on the contact portion or the spring portion becomes small, and the material is subjected to strict bending processing than before. Therefore, the problem which a crack generate | occur | produces in a material arises.

Secondly, with the increase in the strength of the material, there is a problem that a crack occurs in the material. This is because the bending property of the material is generally in a relationship between strength and trade off.

Third, when a crack occurs in the bending portion applied to the contact portion or the spring portion, the contact pressure of the contact portion decreases, the contact resistance of the contact portion increases, the electrical connection is insulated, and the function as a connector is reduced. Because it disappears, it becomes a serious problem.

Several proposals are made to solve this request for improvement in bending workability by controlling the crystal orientation. In Patent Literature 1, in a Cu-Ni-Si-based copper alloy, when the crystal grain diameter and the X-ray diffraction intensity from {311}, {220}, and {200} planes satisfy certain conditions, It is found that the bending workability is excellent. Further, in Patent Document 2, in the Cu-Ni-Si-based copper alloy, when the X-ray diffraction strength from the {200} plane and the {220} plane is a crystal orientation that satisfies a certain condition, it is excellent in bending workability. Found. Moreover, in patent document 3, it is discovered that Cu-Ni-Si type copper alloy is excellent in bending workability by control of the ratio of Cube orientation {100} <001>. In addition, in patent documents 4-8, the material excellent in the bending property prescribed | regulated by the X-ray diffraction intensity | strength with respect to various atomic planes is proposed. In Patent Document 4, in the Cu-Ni-Co-Si-based copper alloy, the X-ray diffraction intensity from the {200} plane is from the {111} plane, the {200} plane, the {220} plane, and the {311} plane. It has been found that when the crystal orientation satisfies certain conditions with respect to the X-ray diffraction strength of, the bending property is excellent. In Patent Literature 5, it is found that Cu-Ni-Si-based copper alloy is excellent in bending workability when the X-ray diffraction intensity from the {420} plane and the {220} plane satisfies a certain condition. have. In patent document 6, when Cu-Ni-Si type copper alloy is a crystal orientation which satisfy | fills a certain condition regarding {123} <412> orientation, it is discovered that it is excellent in bending workability. Patent Document 7 discloses a bad way in the Cu-Ni-Si-based copper alloy in the case where the X-ray diffraction intensity from the {111} plane, the {311} plane, and the {220} plane satisfies certain conditions. It has been found that the warpage property (described later) is excellent. Further, in Patent Document 8, when the X-ray diffraction intensity from the {200} plane, the {311} plane, and the {220} plane is a crystal orientation satisfying certain conditions in the Cu-Ni-Si-based copper alloy, It is found that the bending workability is excellent.

The regulation by X-ray diffraction intensity | strength in patent document 1, 2, 4, 5, 7, 8 prescribed | regulated about integration of the specific crystal surface in a plate surface direction (rolling normal direction, ND).

Japanese Unexamined Patent Publication No. 2006-009137 Japanese Unexamined Patent Publication No. 2008-013836 Japanese Unexamined Patent Publication No. 2006-283059 Japanese Unexamined Patent Publication No. 2009-007666 Japanese Unexamined Patent Publication No. 2008-223136 Japanese Unexamined Patent Publication No. 2007-092135 Japanese Unexamined Patent Publication No. 2006-016629 Japanese Unexamined Patent Publication No. 11-335756

By the way, the invention described in patent document 1 or patent document 2 is based on the measurement of the crystal orientation by X-ray diffraction from a specific crystal plane, and relates only to a very specific part of the crystal orientation distribution having a certain area. In addition, only the crystal plane of the plate surface direction ND is measured, and it cannot control which crystal surface is facing in the rolling direction RD and the plate width direction TD. Therefore, in order to completely control the bending workability, it was a rather insufficient method. In addition, in the invention described in Patent Literature 3, the effectiveness of Cube orientation has been pointed out, but other crystal orientation components are not controlled, and there is a case where the improvement of bending workability is insufficient. In addition, in patent documents 4-8, only the examination which measures and controls with respect to the said specific crystal surface or orientation is carried out, respectively, and the improvement of bending workability may be inadequate like patent documents 1-3.

In view of the above problems, an object of the present invention is to provide excellent bending property, excellent strength, connectors, terminal materials, relays, and the like for automotive automobile materials such as lead frames, connectors, and terminal materials for electric and electronic devices. A copper alloy sheet material suitable for a switch and the like and a method of manufacturing the same are provided.

MEANS TO SOLVE THE PROBLEM The present inventors made various examinations, researched about the copper alloy suitable for an electrical / electronic component use, and reduces the area | region to which the (111) surface faces in the width direction (TD) of a rolled sheet, and performs bending processing. It was found that cracks in the city were suppressed, and furthermore, it was found that the warp workability could be remarkably improved by setting the area ratio of the area to a predetermined value or less. In addition, it was found that by using a specific additive element in the present alloy system, the strength and the stress relaxation resistance can be improved without impairing the electrical conductivity and the bending property. This invention is made | formed based on these knowledge.

That is, the present invention provides the following solutions.

(1) In the crystal orientation analysis in the EBSD (Electron Back Scatter Diffraction) measurement, the normal of the (111) plane and the TD regarding the integration of the atomic plane in the width direction (TD) of the rolled sheet. A copper alloy sheet material, characterized in that the area ratio of the region having an atomic plane with an angle of 20 degrees or less is 50% or less, a yield strength of 500 MPa or more, and a conductivity of 30% IACS or more.

(2) The alloy composition contains 0.5 to 5.0 mass% and Si to 0.1 to 1.5 mass% in total of any one or two of Ni and Co, and the balance is made of copper and unavoidable impurities. Copper alloy plate material of description).

(3) Furthermore, at least one selected from the group consisting of Sn, Zn, Ag, Mn, B, P, Mg, Cr, Fe, Ti, Zr, and Hf contains 0.005 to 2.0 mass% in total. The copper alloy sheet material as described in (1) or (2).

(4) The copper alloy sheet material according to any one of (1) to (3), which is a material for a connector.

(5) The method for producing the copper alloy sheet material according to any one of (1) to (4), wherein the copper alloy having the alloy composition to which the copper alloy sheet is applied is cast [step 1], homogenizing heat treatment [step 2] ], Hot working [step 3], cold rolling [step 6], heat treatment [step 7], cold rolling [step 8], intermediate recrystallization heat step [step 9], and final solution heat treatment [step 10]. Then, the aging precipitation heat treatment [step 11] is performed, and the intermediate recrystallization heat treatment [step 9] is equal to or more than (P-200) ° C. when the complete solidus temperature of the solute atoms is P ° C. It is maintained for 1 second-20 hours at the temperature of -10) degrees C or less, The said final solution heat treatment [step 10] is (P + 10) degrees C or more, and is maintained for 1 second-10 minutes at (P + 150) degrees C or less. Method for producing a copper alloy sheet material.

(6) The method for producing a copper alloy sheet material according to (5), wherein after the aging precipitation heat treatment [step 11], cold rolling [step 12] and temper annealing [step 13] are performed in this order. .

The copper alloy sheet material of the present invention is excellent in bending workability, has excellent strength, and is suitable for connectors, terminal materials, relays, switches, and the like for automotive automobile materials such as lead frames, connectors, and terminal materials for electric and electronic devices.

Moreover, the manufacturing method of the copper alloy plate material of this invention is excellent in the said bending workability, and has the outstanding strength, The connector, terminal material, relays, such as for automobile vehicle materials, such as lead frames, connectors, terminal materials, etc. for electrical and electronic equipment. It is suitable as a method of manufacturing the copper alloy plate material suitable for a switch, etc.

1: is explanatory drawing of the test method of the stress relaxation resistance, (a) shows before a heat processing, (b) shows the state after heat processing, respectively.
FIG. 2 is a graph showing a typical example of the conductivity change caused by the increase in the heat treatment temperature, and schematically shows a method of determining the temperature P ° C. at which the solute atoms are completely dissolved.
Fig. 3 shows an example of an atomic plane in which the angle of the angle formed by the normal of the (111) plane and the TD is within 20 °, and (b) shows the normal and the TD of the (111) plane. It shows the example of the atomic plane in which the angle of the making angle exceeds 20 degrees. 3 (a) and 3 (b) show a region in which the angle formed by the normal of the (111) plane is within 20 degrees.
Fig. 4 shows an atomic plane in which the angle between the normal of the (111) plane and the angle formed by the TD is within 20 degrees in the rolling plate width direction (TD) among typical representative texture orientation components in FCC (face-centered cubic lattice) metal. An example of the aggregated tissue orientation component is shown.

EMBODIMENT OF THE INVENTION Preferred embodiment of the copper alloy plate material of this invention is described in detail. Here, the "copper alloy material" means that the copper alloy material was processed into a predetermined shape (for example, plate, jaw, foil, rod, line, etc.). The board | plate material is what has a specific thickness, is stable in shape, and has a width | variety in a surface direction, and it means the meaning including a crude material in a wide meaning. Here, in a board | plate material, a "material surface layer" means a "plate surface layer", and a "depth position of a material" means the "position of a plate thickness direction." Although the thickness of a board | plate material is not specifically limited, 8-800 micrometers is preferable and 50-70 micrometers is more preferable, considering that the effect of this invention is shown further and is suitable for a practical application.

On the other hand, although the copper alloy plate material of this invention defines the characteristic by the accumulation ratio of the atomic plane in the predetermined direction of a rolled sheet, this should just have such characteristics as a copper alloy plate material, and copper The shape of the alloy plate is not limited to the plate or the crude material. In the present invention, a pipe can also be interpreted as a plate and handled.

(Regulation by EBSD measurement)

In order to clarify the cause of cracking during bending of the copper alloy sheet, the inventors examined the metal structure of the material after bending deformation in detail. As a result, it was observed that the gaseous material was not uniformly deformed, but deformation was concentrated only in a region of a specific crystal orientation, and uneven deformation proceeded. And by the nonuniform deformation, although the wrinkle of the several microns depth and a minute crack generate | occur | produce on the surface of the base material after bending processing, the solution was not known. However, the present inventors have diligently reduced the area of the atomic plane to which the (111) plane faces in the width direction (TD) of the rolled plate specified by the EBDS measurement (this area will be described in detail below). When it made it, it was discovered that nonuniform deformation | transformation is suppressed, the wrinkle which generate | occur | produces on the surface of a base material is reduced, and a crack is suppressed.

As a mechanism of this phenomenon, the (111) plane is one of the orientations which are most easily work hardened against tensile stress, and it can be considered that the dislocations tend to propagate even under stress during bending deformation. The densified potential becomes a source of microvoids and causes cracks. By reducing the ratio of the area of the atomic plane where the (111) plane faces the TD, it is considered that the bending workability is improved, particularly in the BW bending in which the bending axis is parallel to the rolling direction.

4 shows an example of the orientation components of the aggregate structure in which the atomic angle between the (111) plane and the angle formed by the TD is less than 20 ° in which the atomic plane is directed to the TD. P direction {0 1 1} <1 1 1>, SB direction {1 8 6} <2 1 1>, S direction {1 3 2} <6 4 3>, Z direction {1 1 1} <1 1 0 >, A twin bearing {1 2 2} <2 2 1> of a cube bearing, a brass bearing {1 1}, and a <1 1 2>. The state in which the ratio of the aggregate structure orientation component in which (111) plane which contains these orientation components toward TD is suppressed comprehensively is an aggregate structure which has the predetermined area ratio prescribed | regulated by this invention. Conventionally, it is not known to simultaneously control the area ratio of atomic planes having these orientations.

The above-mentioned effect can be acquired when the area ratio of the area | region which has an atomic plane whose angle between the normal of the (111) plane and the angle which TD makes in the width direction TD of a rolled plate is 20 degrees or less is 50% or less. Preferably it is 45% or less, More preferably, it is 1% or more and 40% or less, Especially preferably, it is 30% or more and 35% or less. By defining this area ratio and specifying it in the above range, as described above, the bending workability can be improved.

In the display method of the crystal orientation in the present specification, the X-axis for the rolling direction (RD) of the material, the Y-axis for the plate width direction (TD), and the rectangular coordinate system of the Z-axis for the rolling normal direction (ND), The ratio of the area | region to which the) face is prescribed | regulated by the area ratio. Calculate the angle of the angle between the normal of the (111) plane of each grain in the measurement area and the two vectors of TD, and add up the total area for this angle to have an atomic plane within 20 °. The value obtained by excluding from the measurement area was defined as the area ratio (%) of the region having an atomic plane whose angle between the normal of the (111) plane and the TD was 20 degrees or less.

That is, in the present invention, with respect to the integration of the atomic plane in the width direction TD of the rolled sheet, the region having an atomic plane whose angle between the normal of the (111) plane and the angle formed by the TD is within 20 ° is rolled. (111) plane itself with the normal of the width direction TD of the rolled plate which is an ideal orientation regarding the integration of the atomic plane facing the width direction TD of the plate, ie facing TD, and (111) It is the sum of the area of the plane orientation where the atomic plane, which combines the atomic planes of the plane normal and the angle formed by the TD, is within 20 °. Hereinafter, these areas are also referred to as the area of the atomic plane that the (111) plane faces in TD.

3 shows the above contents. FIG. 3 (a) shows an example of an atomic plane whose angle between the normal of the (111) plane and the TD is 20 degrees or less, and in this specification, the atomic plane shown in this example is the rolling plate width direction ( TD) is used as the atomic plane having the orientation toward which the (111) plane faces, so even when described as the atomic plane having the orientation toward which the (111) plane faces in the rolled sheet width direction (TD) (111) The angle between the normal of the plane and the TD shall represent the sum of the plane orientations of the atomic planes within 20 °.

FIG. 3 (b) shows an example of an atomic plane in which the angle between the normal of the (111) plane and the TD angle exceeds 20 °, and the atomic plane shown in this example is shown in the rolled sheet width direction TD ( 111) is called an atomic plane with an orientation that does not face. Although there are eight (111) planes in the copper alloy, only the (111) plane whose normal vector is closest to the TD, the area of the vector whose angle of the angle formed by the normal of the (111) plane is within 20 ° is plotted. It is indicated by a cone (dotted line) in the middle.

Although the information obtained in the orientation analysis by EBSD contains the orientation information to the depth of several 10 nm which an electron beam penetrates into a sample, since it is small enough with respect to the area measured, it described as area ratio in this specification. .

The EBSD method was used for the analysis of the said crystal orientation in this invention. EBSD is an abbreviation of Electron Back Scatter Diffraction, which is a reflection electron Kikuchi line diffraction (Kikuchi pattern) that occurs when a sample is irradiated with an electron beam in a scanning electron microscope (SEM). Crystal orientation analysis technique using In the present invention, a 500 µm square sample area including 200 or more crystal grains was scanned in 0.5 µm steps to analyze the orientation.

The use of EBSD measurements in the analysis of crystal orientations is significantly different from the measurement of the integration of specific atomic planes in the plate direction (ND) according to the conventional X-ray diffraction method. Since it is obtained with higher resolution, a completely new knowledge can be obtained with respect to the crystal orientation that governs the bending workability.

On the other hand, about EBSD measurement, in order to obtain a clear Kikuchi-line diffraction image, it is preferable to perform measurement after mirror polishing of a base surface using the abrasive particle of colloidal silica after mechanical polishing. In addition, the measurement was performed from the board surface.

(Alloy furtherance)

Ni, Co, Si

Copper or a copper alloy is used as a connector material of this invention. In addition to copper, copper alloys such as phosphor bronze, brass, silver silver, beryllium copper, and Colson-based alloys (Cu-Ni-Si) are preferred as the connector having conductivity, mechanical strength, and heat resistance required for the connector. In particular, when it is desired to obtain an area ratio that satisfies the specific crystal orientation integration relationship of the present invention, a precipitation type alloy including a pure copper material, a beryllium copper, and a Colson-based alloy is preferable. Moreover, in order to make high strength and high conductivity compatible with the smallest terminal material at the uppermost level, Cu-Ni-Si-based, Cu-Ni-Co-Si-based and Cu-Co-Si-based precipitated copper alloys are preferable. .

This is because in solid solution alloys, such as phosphor bronze and brass, the micro area | region which has Cube orientation in cold rolling material which becomes a nucleus of Cube orientation grain growth in grain growth during heat processing reduces. This is because in a system having a low stacking defect energy such as phosphor bronze or brass, a shearing band tends to develop during cold rolling.

In the present invention, Ni-Si, Co- is controlled by controlling the respective amounts of addition to nickel (Ni), cobalt (Co), and silicon (Si) which are the first group of additive elements added to copper (Cu). The strength of the copper alloy can be improved by depositing a compound of Si and Ni-Co-Si. The addition amount adds any 1 type or 2 types of Ni and Co, Preferably it is 0.5-5.0 mass%, More preferably, it is 0.6-4.5 mass%, More preferably, it is 0.8-4.0 mass%. The addition amount of Ni is preferably 1.5 to 4.2 mass%, more preferably 1.8 to 3.9 mass%, while the addition amount of Co is preferably 0.3 to 1.8 mass%, more preferably 0.5 to 1.5 mass%. In particular, it is preferable to make Co essential if the electrical conductivity is to be increased. The electrical conductivity can be sufficiently secured by not excessively adding the total amount of these elements, and the strength can be sufficiently secured by not excessively decreasing. Moreover, content of Si becomes like this. Preferably it is 0.1-1.5 mass%, More preferably, it is 0.2-1.2 mass%.

● Other elements

Next, the effect of the additive element which improves characteristics (secondary characteristics), such as a stress relaxation resistance, is shown. Preferred additional elements include Sn, Zn, Ag, Mn, B, P, Mg, Cr, Fe, Ti, Zr and Hf. In order to fully utilize an addition effect and not to reduce an electrical conductivity, it is preferable that it is 0.005-2.0 mass% in total amount, More preferably, it is 0.01-1.5 mass%, More preferably, it is 0.03-0.8 mass%. The electrical conductivity can be fully secured by not adding these elements in excess of the total amount. On the other hand, the effect which added these elements can fully be exhibited because these added elements do not underestimate the total amount.

The addition effect of each element is shown below. Mg, Sn, and Zn are added to Cu-Ni-Si-based, Cu-Ni-Co-Si-based and Cu-Co-Si-based copper alloys to improve stress relaxation resistance. The stress relaxation resistance is further improved by the synergistic effect when added together than when added alone. In addition, there is an effect of remarkably improving solder embrittlement.

Addition of Mn, Ag, B, and P improves hot workability and improves strength.

Cr, Fe, Ti, Zr, and Hf are finely precipitated by a compound or a single substance with Ni, Co, or Si which are main addition elements, and contribute to precipitation hardening. Moreover, it precipitates in the size of 50-500 nm as a compound, and it has the effect of making a grain size fine by suppressing particle growth, and makes bending workability favorable.

(Manufacturing method, etc.)

Next, the manufacturing method (method of controlling the crystal orientation) of the copper alloy sheet material of the present invention will be described. Here, although the board | plate material (crude material) of a precipitation type copper alloy is demonstrated as an example, it can develop into a solid solution type alloy material, a lean type alloy material, and a pure copper type material.

Generally, the precipitated copper alloy is thinned ingots subjected to homogenization heat treatment at each step of hot and cold, and subjected to final solution heat treatment in a temperature range of 700 to 1020 ° C. to re-resolve the solute atoms, followed by aging precipitation heat treatment and finishing. It is manufactured to satisfy the required strength by cold rolling. The conditions of the aging precipitation heat treatment and the finish cold rolling are adjusted according to the characteristics such as desired strength and conductivity. As for the texture of the copper alloy, most of them are determined by recrystallization during the final solution heat treatment in this series of steps, and finally determined by rotation of the orientation occurring during finish rolling.

As a manufacturing method of the copper alloy plate material of this invention, the copper alloy raw material which consists of a predetermined | prescribed alloy component composition is melt | dissolved by a high frequency melting furnace, and this is cast and obtained an ingot [step 1], The ingot is 700 degreeC? Performed by homogenization heat treatment for 10 minutes to 10 hours at 1020 ℃ [Step 2], and hot rolling [Process 3], water cooling [Step 4], faceting [ Step 5], 50-99% cold rolling [step 6], heat treatment maintained at 600-900 ° C. for 10 seconds to 5 minutes [step 7], 5-55% cold processing [step 8], ( Intermediate recrystallization heat treatment [Step 9] maintained at P-200) ° C or higher (P-10) ° C or lower for 1 second to 20 hours, and held for 1 second to 10 minutes at higher than (P + 10) ° C and lower than (P + 150) ° C. The final solution heat treatment [step 10] is carried out, and then the aging precipitation heat treatment [step 11] for 5 minutes to 20 hours at 350 ° C. to 600 ° C., the final rolling [step 12] of a processing rate of 2 to 45%, The method of obtaining the copper alloy plate material of this invention by performing the said [step 1]-[step 13] in this order by performing the temper annealing [step 13] hold | maintained at 300-700 degreeC for 10 second-2 hours. Can be mentioned.

TABLE A

Although it is preferable to manufacture the copper alloy plate material of this invention according to the manufacturing method of said embodiment, if the said predetermined area ratio is satisfied in the crystallographic orientation analysis in EBSD measurement, the said [process 1]? 13] is not necessarily bound to do all of them in this order. Although it is contained in said method, you may complete [step 11] as a final process among the said [step 1]-[step 13], for example. Alternatively, the above [Step 11] to [Step 13] may be repeated one or more of these two or more times. For example, before performing [Process 11], you may perform cold rolling (process 12 ') of the processing rate of 2 to 45%.

When the end temperature of hot rolling [step 3] is low, the precipitation rate is lowered, so that water cooling [step 4] is not necessary. When hot rolling is terminated below a certain temperature, whether or not water cooling becomes unnecessary depends on the alloy concentration and the amount of precipitation during hot rolling, and may be appropriately selected. The roughing [process 5] may be omitted depending on the scale of the material surface after hot rolling. Moreover, you may remove a scale by melt | dissolution by pickling and the like.

Although hot rolling is performed by hot rolling performed above the dynamic recrystallization temperature, and hot rolling below the dynamic recrystallization temperature at a high temperature of room temperature or more is sometimes referred to as warm rolling, it is common to use hot rolling including both. Also in this invention, both are called hot rolling.

In the manufacturing method of the copper alloy plate material of this invention, in the said final solution heat processing, in order to reduce the ratio of the (111) surface which faces to a plate width direction, the following manufacturing methods are effective.

As a conventional manufacturing method of the precipitation type copper alloy, since recrystallization also occurs during the solution heat treatment, the two objectives of solid solution and recrystallization of solute atoms can be achieved. On the other hand, in the manufacturing method of the copper alloy plate material of this invention, these two objectives are achieved one by one, and together, it controls a crystal orientation of an aggregate structure, and for this purpose, it performs by separate heat processing, respectively. That is, first, the recrystallization heat treatment [step 9] is performed on the providing material, and then the final solution heat treatment [step 10] is performed.

The temperature of this intermediate recrystallization heat treatment and final solution heat treatment is defined as a specific temperature range defined using P ° C., which is a temperature at which solute atoms are completely dissolved.

The temperature of the intermediate recrystallization heat treatment is (P-200) ° C or more and (P-10) ° C or less. When this temperature is too low, recrystallization is inadequate, and when too high, on the contrary, when the temperature is too high, the ratio of the (111) plane toward TD does not sufficiently decrease. The temperature of the intermediate recrystallization heat treatment is preferably (P-170) ° C-(P-20) ° C, more preferably (P-140) ° C-(P-30) ° C.

The temperature of final solution heat treatment is (P + 10) degreeC or more, and (P + 150) degreeC or less. If this temperature is too low, the solid solution of the solute atoms is insufficient. On the contrary, if the temperature is too high, the grains coarsen. The temperature of the final solution heat treatment is preferably (P + 20) ° C-(P + 130) ° C, more preferably (P + 30) ° C-(P + 100) ° C.

The temperature P (° C) at which the solute atoms were completely dissolved was determined by the following method. After homogenizing the ingot at 1000 ° C. for 1 hour, hot rolling and cold rolling are performed to form a plate, and then water quenching is performed after heat treatment for 30 seconds at 10 ° C. to 700 ° C. to 1000 ° C. in a salt bath. The solid solution and the precipitated state in the solution were frozen, and the electrical conductivity was measured. The conductivity was used as a substitute characteristic of the amount of solid solution element, and the temperature at which the decrease in the conductivity accompanying the increase in the heat treatment temperature was saturated was defined as the complete employment temperature P (° C). A typical change in conductivity and a method of determining the temperature P (° C.) accordingly are shown in FIG. 2. Although the complete employment temperature P (degreeC) with respect to a specific composition changes with the kind of alloy, the conditions of processing and a process, etc., when it shows as a typical example, it is common that it is about 720-980 degreeC.

The processing time of the intermediate recrystallization heat treatment is 1 second-20 hours, More preferably, it is 5 second-10 hours. If the processing time of the intermediate recrystallization heat treatment is too short, recrystallization does not proceed. If this is too long, the crystal grains coarsen and the moldability deteriorates.

The processing time of the final solution heat treatment is 1 second-10 minutes, More preferably, it is 5 second-5 minutes. If the treatment time of the final solution heat treatment is too short, the solid solution of the solute atoms is insufficient, and if it is too long, the crystal grains coarsen and the moldability deteriorates.

In this invention, since intermediate heat processing (process 7) also has a special technical meaning, it demonstrates here. A slightly lower temperature with respect to the complete employment temperature P ° C., and furthermore, a structure in which the entire surface is not recrystallized can be obtained by heat treatment under relatively low temperature conditions. That is, among the crystallographic orientations in the rolled material, there is a crystal orientation with a quick recovery and a slower crystallographic orientation, so that the structure becomes non-uniformly recrystallized by the difference. This intentionally created nonuniformity promotes preferential development of recrystallized texture in intermediate recrystallization heat treatment [step 9]. Part of the slow recovery orientation becomes recrystallized tissue, but fast-recovering tissue crystal orientation does not recrystallize.

The copper alloy plate material of this invention can satisfy the characteristic calculated | required, for example for the copper alloy plate material for connectors. Particularly, the minimum bending radius (r: mm) that can be cracked and bendable in the 90 ° W bending test for bending performance is 500MPa or more (preferably 600MPa or more, more preferably 700MPa or more) for 0.2% yield strength. The value (r / t) divided by (t: mm) satisfies 1 or less and 30% IACS or more (preferably 35% IACS or more, more preferably 40% IACS or more) for the conductivity. About the stress relaxation resistance, the favorable characteristic that the stress relaxation rate (SR) 30% or less (preferably 25% or less) can also be fulfilled by the measuring method hold | maintained at 150 degreeC mentioned later for 1000 hours.

[ Example ]

EMBODIMENT OF THE INVENTION Below, although this invention is demonstrated in detail based on an Example, this invention is not limited to this.

&Lt; Example 1 >

As shown in the composition of the alloy component item of Table 1-1, 0.5-5.0 mass% and 0.1-1.5 mass% of Si are included in total at least 1 type or 2 types in at least Ni and Co, and remainder is Cu and an unavoidable impurity. The alloy which consists of was melt | dissolved by the high frequency melting furnace, and this was cast and the ingot was obtained. After that, the homogenization heat treatment for 10 minutes to 10 hours at 700 ° C to 1020 ° C, hot rolling at a processing rate of 500 to 1020 ° C of 30 to 98%, water cooling and cold rolling to 50 to 99%, and this sequence The copper alloy of Examples 1-1 to 1-19 and Comparative Examples 1-1 to 1-9 of the present invention was carried out in the process of any one of the following A to F. The test material of the plate was prepared.

(Step A)

Heat treatment for 10 seconds to 5 minutes at 600 to 900 ° C, cold processing at a processing rate of 5 to 55%, and intermediate holding for 1 second to 20 hours at (P-200) ° C or more and (P-10) ° C or less Recrystallization heat treatment and final solution heat treatment which hold | maintain for 1 second-1 minute in (P + 10) degreeC or more (P + 150) degreeC or less are performed. Thereafter, aging precipitation heat treatment for 5 minutes to 20 hours at 350 to 600 ° C, finish rolling with a processing rate of 2 to 45%, and temper annealing at 10 to 2 hours at 300 to 700 ° C are performed.

(Step B)

Heat treatment for 10 seconds to 5 minutes at 600 to 900 ° C, cold processing at a processing rate of 5 to 55%, and intermediate holding for 1 second to 20 hours at (P-200) ° C or more and (P-10) ° C or less Recrystallization heat treatment and final solution heat treatment which hold | maintain for 1 second-1 minute in (P + 10) degreeC or more (P + 150) degreeC or less are performed. Thereafter, a rolling rate of 2 to 40%, a aging precipitation heat treatment for 5 minutes to 20 hours at 350 to 600 ° C, a finish rolling of 2 to 45%, and 10 seconds to 2 hours at 300 to 700 ° C Temper annealing to hold is performed.

(Step C)

Heat treatment for 10 seconds to 5 minutes at 600 to 900 ° C, cold processing at a processing rate of 5 to 55%, and intermediate holding for 1 second to 20 hours at (P-200) ° C or more and (P-10) ° C or less Recrystallization heat treatment and final solution heat treatment which hold | maintain for 1 second-1 minute in (P + 10) degreeC or more (P + 150) degreeC or less are performed. Thereafter, the aging precipitation heat treatment is performed at 350 to 600 ° C. for 5 minutes to 20 hours.

(Step D)

Heat treatment for 10 seconds to 5 minutes at 600 to 900 ° C, cold processing at a processing rate of 5 to 55%, and intermediate holding for 1 second to 20 hours at (P-200) ° C or more and (P-10) ° C or less Recrystallization heat treatment and final solution heat treatment which hold | maintain for 1 second-1 minute in (P + 10) degreeC or more (P + 150) degreeC or less are performed. Thereafter, an aging precipitation heat treatment is performed for 5 minutes to 20 hours at a rolling rate of 2 to 45% and 350 to 600 ° C.

(Step E)

Intermediate recrystallization heat treatment maintained at (P-200) ° C or higher (P-10) ° C or lower for 1 second to 20 hours, and final solution for 1 second to 1 minute at (P + 10) ° C or higher and (P + 150) ° C or lower. Heat treatment is performed. Thereafter, aging precipitation heat treatment for 5 minutes to 20 hours at 350 to 600 ° C, finish rolling at a processing rate of 2 to 45%, and temper annealing to be maintained at 300 to 700 ° C for 10 seconds to 2 hours are performed.

(Step F)

Heat treatment is performed at 600 to 900 ° C for 10 seconds to 5 minutes, cold working at a processing rate of 5 to 55%, and final solution heat treatment to be held at 1 to 1 minute at (P + 10) ° C or more and (P + 150) ° C or less. . Thereafter, aging precipitation heat treatment for 5 minutes to 20 hours at 350 to 600 ° C, finish rolling with a processing rate of 2 to 45%, and temper annealing at 10 to 2 hours at 300 to 700 ° C are performed.

On the other hand, after each heat treatment and rolling, pickling and surface polishing were corrected by a tension leveler depending on the shape depending on the oxidation and roughness of the material surface.

TABLE B

The following characteristic investigation was done about this test material. Here, the thickness of the test material was 0.15 mm. The result of the example of this invention is shown in Table 1-1, and the result of a comparative example is shown in Table 1-2, respectively.

a. Area ratio of the area of the atomic plane that the (111) plane faces in TD:

According to the EBSD method, the scanning step was measured on the conditions of 0.5 micrometer in about 500 micrometer square. The measurement area was adjusted on the basis of including 200 or more crystal grains. As described above, a region in which each of the (111) planes having TD as the normal anomalies as normals and the atomic planes whose angles between the normals of the (111) plane and TD are within 20 degrees is combined (along with these The area ratio of these sum totals was computed according to the following formula | equation about TD (the area | region of the atomic plane which the (111) plane faces).

Area ratio (%) = {(total area of atomic plane whose angle between the normal of (111) plane and TD is within 20 °) / total measurement area} × 100

In each following table | surface, this is shown only as an area ratio (%).

On the other hand, TIM OIM5.0 HIKARI manufactured as an EBSD measuring apparatus was used.

b. Flexibility:

Cut in width 10mm and length 25mm vertically in the rolling direction, and the W bent so that the B bend is perpendicular to the rolling direction, and the W bent so as to be parallel to the rolling direction. ), The bend was observed with a 50x optical microscope, and the presence or absence of cracks was examined.

It was determined that there was no crack in the bending processing part, and that the wrinkle was slight, 'good' (◎), and that there was no crack, but there was no practical problem that the wrinkle was large, and that the crack was 'non' (×). The bending angle of each bending part was 90 degrees, and the inner radius of the bending part was 0.15 mm.

c. 0.2% yield strength [YS]:

Three test pieces of JIS Z 2201-13B cut out from the rolling parallel direction were measured according to JIS Z 2241, and the average value thereof was shown.

d: conductivity [EC]:

The conductivity was calculated by measuring the specific resistance by a four-terminal method in a thermostat maintained at 20 ° C (± 0.5 ° C). On the other hand, the distance between terminals was 100 mm.

e. Stress Relief [SR]:

According to the Japan Shindong Association JCBA T309: 2001 (this is a temporary standard. The old standard was "Japan Electronic Materials Industry Association Standard Standard EMAS-3003".) As shown below, it is 1000 hours at 150 degreeC. It measured on the conditions after maintenance. An initial stress of 80% of the proof strength was loaded by the cantilever method.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing of the test method of the stress relaxation resistance, (a) is before heat processing, (b) is a state after heat processing. As shown to Fig.1 (a), the position of the test piece 1 when the initial stress of 80% of a proof strength is applied to the test piece 1 hold | maintained by the cantilever on the test bench 4 is (delta) ₀ from a reference | standard. Is the distance. This in a constant temperature bath at 150 ℃ held 1000 hours of H _t from the reference as shown in position, one (b) view of the test piece (2) (the test piece (1) Heat treatment in the state of a), and after removal of the load Distance. 3 is a test piece when no load stress, the location is the distance H ₁ from the reference. From this relationship, the stress relaxation rate (%) was calculated as (H _t -H ₁ ) / (δ ₀ -H ₁ ) × 100. In the formula, δ ₀ is the distance from the reference to the test piece ₁ , H ₁ is the distance from the reference to the test piece 3, and H _t is the distance from the reference to the test piece 2.

Table 1-1

Table 1-2

As shown in Table 1-1, Examples 1-1 to 19 of the present invention were excellent in warpage processing resistance, yield strength, electrical conductivity, and stress relaxation resistance.

On the other hand, as shown in Table 1-2, when not satisfy | filling the prescription | regulation of this invention, the result was inferior to a characteristic.

That is, in Comparative Example 1-1, since the total amount of Ni and Co was small, the density of the compound (precipitate) which contributed to precipitation hardening fell and was inferior in strength. In addition, Si which did not form a compound with Ni or Co was excessively dissolved in the metal structure, resulting in inferior electrical conductivity. In Comparative Example 1-2, since the total amount of Ni and Co was large, electrical conductivity was inferior. Comparative Example 1-3 was inferior in strength because of less Si. Since Comparative Example 1-4 had many Si, electrical conductivity was inferior.

In Comparative Examples 1-5 to 1-9, the ratio of the (111) plane toward TD was high, and the warp workability was inferior. Especially in the BW warpage, a remarkable crack was seen.

<Example 2>

With respect to the copper alloy composed of Cu and unavoidable impurities in the composition shown in the alloy component items of Table 2, as in Example 1, Inventive Examples 2-1 to 2-17 and Comparative Examples 2-1 to 2- The test material of the copper alloy plate material of 3 was produced, and the characteristic was investigated like Example 1. The results are shown in Table 2.

[Table 2]

As shown in Table 2, Inventive Example 2-1 to Inventive Example 2-17 were excellent in bending processing resistance, yield strength, electrical conductivity, and stress relaxation resistance.

On the other hand, the characteristic was inferior when it did not satisfy | fill the prescription of this invention. That is, in Comparative Examples 2-1, 2-2 and 2-3 (all of the comparative examples of the invention according to the above (3)), since the addition amount of other elements other than Ni, Co, and Si is large, the electrical conductivity is low. Lagged behind.

<Example 3>

With the composition shown in Table 3, after the homogenization heat treatment of the ingot for 10 minutes-10 hours at 700-1020 degreeC with respect to the copper alloy which consists of Cu and an unavoidable impurity, it water-cools after hot rolling like Example 1, Cold rolling of 50 to 99%, heat treatment for 10 seconds to 5 minutes at 600 to 900 ° C, and cold processing to a processing rate of 5 to 55% were performed in this order.

Thereafter, intermediate recrystallization heat treatment and final solution heat treatment were performed as shown in Table 4. Thereafter, aging precipitation heat treatment at 350 to 600 ° C. for 5 minutes to 20 hours, finish rolling at a processing rate of 2 to 45%, and temper annealing to be maintained at 300 to 700 ° C. for 10 seconds to 2 hours are performed. Prepared. The properties were examined in the same manner as in Example 1. The results are shown in Table 4.

[Table 3]

[Table 4]

As shown in Table 4, Inventive Example 3-1 to Inventive Example 3-6 were excellent in flexural workability, yield strength, electrical conductivity, and stress relaxation resistance.

On the other hand, the characteristic was inferior when it did not satisfy | fill the prescription of this invention. That is, in the comparative example 3-1, since the temperature of the intermediate recrystallization heat treatment is low, the area | region which the (111) surface faces to TD became high, and it was inferior to curvature. In the comparative example 3-2, since the temperature of the intermediate recrystallization heat processing was high, the area | region which a (111) surface faces to TD became high and it was inferior to curability. In Comparative Example 3-3, since the treatment time of the intermediate recrystallization heat treatment was long, the solute atoms became coarse precipitates, and the solid solution was not sufficiently dissolved in the final solution heat treatment, and the yield strength was inferior. In Comparative Example 3-4, since the treatment temperature of the final solution heat treatment was low, the solid solution of the solute atoms was insufficient and the strength was inferior. In Comparative Example 3-5, since the treatment temperature of the final solution heat treatment was high, the grains were coarsened and the yield strength was inferior. In Comparative Example 3-6, the processing time of the final solution heat treatment was long, so that the crystal grains coarsened and the yield strength was inferior. Further, Comparative Examples 3-5 and 3-6 had large warpage wrinkles because of their large grain diameters and were not good.

As described above, the present invention can realize a very suitable characteristic as a material for vehicle parts such as connector materials and materials for electric and electronic devices (particularly the base materials thereof).

Subsequently, in order to clarify the difference with the copper alloy plate material which concerns on this invention about the copper alloy plate material manufactured by conventional manufacturing conditions, a copper alloy plate material is produced on the conditions, and evaluation of the above-mentioned characteristic item is carried out. It was done. On the other hand, the thickness of each board | plate material adjusted the processing rate so that it might become the same thickness as the said Example unless a special acknowledgment was carried out.

(Comparative Example 101) Conditions of Japanese Unexamined Patent Publication No. 2009-007666

The metal element similar to the said Example 1-1 of this invention was mix | blended, and the remainder melt | dissolved the alloy which consists of Cu and an unavoidable impurity by the high frequency melting furnace, cast this at the cooling rate of 0.1-100 degreeC / sec, and obtained the ingot. After holding this at 900-1020 degreeC for 3 minutes to 10 hours, after performing a hot working, water quenching was performed and the surface was cut in order to remove an oxidized scale. In the subsequent step, copper alloy c01 was produced by the following steps A-3 and B-3.

The manufacturing process includes one or two or more solution heat treatments, wherein the process is classified before and after the final solution heat treatment therein, and the process until the intermediate solution is made into the A-3 process, and the intermediate solution is prepared. In the subsequent step, B-3 step was used.

Process A-3: Cold working of 20% or more in cross-sectional reduction rate, heat-processing for 5 minutes-10 hours at 350-750 degreeC, cold working of 5-50% in cross-section reduction, 800-1000 Solution heat treatment for 5 seconds-30 minutes is performed at ° C.

Process B-3: Cold working of 50% or less in cross section reduction, heat treatment for 5 minutes to 10 hours at 400 to 700 ° C, cold working of 30% or less in cross section reduction, 200 to 550 Crude annealing is performed at 5 ° C. for 10 hours.

The obtained test body c01 differs from the above-mentioned Example in the presence or absence of intermediate recrystallization heat treatment [process 9 in this application] with respect to manufacturing conditions, and has a high area ratio in which the (111) plane faces TD, and is required for bending workability. The result was not to meet the characteristics.

(Comparative Example 102) Conditions of Japanese Patent Application Laid-Open No. 2006-283059

The copper alloy of the composition of this invention example 1-1 was melt | dissolved in the air by the electric furnace under the charcoal coating, and casting or not was judged. The molten ingot was hot rolled to finish thickness 15mm. Subsequently, the hot rolled material was subjected to cold rolling and heat treatment (cold rolling 1 → solution continuous annealing → cold rolling 2 → aging treatment → cold rolling 3 → short time annealing) to form a thin copper alloy sheet having a predetermined thickness ( c04).

The obtained test body c02 differs from Example 1 in the presence or absence of heat treatment [process 7 in this application] and intermediate recrystallization heat treatment [process 9 in this application] with respect to manufacturing conditions, and it is a T111 (111) plane. This heading area ratio was high and resulted in not satisfying warp workability.

(Comparative Example 103) Conditions of Japanese Unexamined Patent Publication No. 2006-152392

The alloy having the composition of Inventive Example 1-1 was melted in air in a kryptol furnace under charcoal coating and cast into a cast iron book mold, having a thickness of 50 mm, a width of 75 mm, and a length of Ingot of 180 mm was obtained. Then, after the surface of the ingot was chamfered, hot rolling was performed at a temperature of 950 ° C. until the thickness became 15 mm, and quenched in water from a temperature of 750 ° C. or more. Next, after removing the oxidation scale, it cold-rolled and obtained the board of predetermined thickness.

Subsequently, after carrying out the solution treatment which heats for 20 second using the salt bath, it quenched in water, and was made into the cold rolled plate of each thickness by the finishing cold rolling of the latter half. At this time, as shown below, the cold-rolled sheet c03 was changed into various cold-rolling rates (%). As shown below, these cold rolled sheets were aged at various temperatures (° C.) and time (hr).

Cold work rate: 95%

Solution treatment temperature: 900 degrees Celsius

Artificial age hardening treatment temperature X time: 450 degrees Celsius * 4 time

Plate thickness: 0.6㎜

The obtained test body c03 differs from the said Example 1 in the presence or absence of heat processing [process 7 in this application] and intermediate recrystallization heat treatment [process 9 in this application] with respect to manufacturing conditions, and it is a T111 (111) plane. This area ratio is high, and the result is that the bending workability is not satisfied.

(Comparative Example 104) Conditions of Japanese Patent Application Laid-Open No. 2008-223136

The copper alloy shown in Example 1 was melted and cast using the vertical type continuous casting machine. A 50-mm-thick sample was cut out from the obtained cast (180 mm thick), heated to 950 ° C, extracted, and hot rolling was started. At that time, the pass schedule was set such that the rolling ratio in the temperature range of 950 ° C to 700 ° C was 60% or more, and the rolling was performed in the temperature range of less than 700 ° C. The final pass temperature of hot rolling is between 600 degreeC-400 degreeC. The overall hot rolling rate from the cast steel is about 90%. After hot rolling, the oxide layer of the surface layer was removed (faced) by mechanical polishing.

Subsequently, after cold rolling, it was subjected to the solution treatment. The temperature change at the time of solution treatment was monitored by the thermocouple attached to the sample surface, and the temperature increase time from 100 degreeC to 700 degreeC in a temperature rising process was calculated | required. The temperature reached is adjusted within the range of 700 to 850 ° C, depending on the alloy composition, so that the average grain diameter after the solution treatment is 10 to 60 µm (the twin boundary is not regarded as a grain boundary). The holding time of was adjusted in the range of 10 sec-10 min. Subsequently, about the board | plate material after the said solution treatment, the intermediate cold rolling was performed by the rolling rate, and then the aging process was performed. The aging treatment temperature was set at the material temperature of 450 ° C., and the aging time was adjusted to the time when the hardness peaked at aging at 450 ° C. depending on the alloy composition. Depending on such alloy composition, the optimum solution treatment condition and the aging treatment time are grasped | ascertained by the preliminary experiment. Next, finish cold rolling was performed at the rolling ratio. About cold-rolled finish, low temperature annealing was carried out after charging 5min in 400 degreeC furnace. In this manner, test material c04 was obtained. On the other hand, the surface was cut in the middle as needed, and the plate | board thickness of the test material was equipped with 0.2 mm. Main production conditions are described below.

[Condition of Example 1 of Unexamined-Japanese-Patent No. 2008-223136]

Hot rolling rate under 700 ℃ ~ 400 ℃: 56% (1 pass)

Cold rolling rate before solution treatment: 92%

Medium cold rolling Cold rolling rate: 20%

Finish Cold Rolled Cold Rolling Rate: 30%

Temperature rise time from 100 degreeC to 700 degreeC: 10 second

The obtained test body c04 differs from the said Example 1 in the presence or absence of heat processing [process 7 in this application] and intermediate recrystallization heat processing [process 9 in this application] with respect to manufacturing conditions, and it is a T111 (111) plane. This heading area ratio was high and resulted in not satisfying warp workability.

1: Test piece when initial stress was applied
2: test piece after removing the load
3: Test piece when stress was not loaded
4: test bench

Claims (6)

In the crystal orientation analysis in the EBSD (Electron Back Scatter Diffraction) measurement, the angle formed by the normal of the (111) plane and the TD with respect to the integration of the atomic plane in the width direction (TD) of the rolled sheet. A copper alloy sheet material, characterized in that the area ratio of the region having an atomic plane with an angle of 20 ° or less is 50% or less, a yield strength of 500 MPa or more, and a conductivity of 30% IACs or more. It has an alloy composition containing 0.5 to 5.0 mass% of Si and 0.1 to 1.5 mass% in total of any one or two kinds of Ni and Co, and the balance is made of copper and unavoidable impurities. EBSD (Electron Back Scatter Diffraction: In the crystal orientation analysis in the scattering diffraction measurement, an atomic plane whose angle between the normal of the (111) plane and the angle formed by the TD is within 20 ° with respect to the integration of the atomic plane toward the width direction (TD) of the rolled sheet. A copper alloy sheet material having an area ratio of 50% or less, a proof strength of 500 MPa or more and a conductivity of 30% IACs or more. It contains 0.5 to 5.0 mass% and Si to 0.1 to 1.5 mass% in total of any one or two of Ni and Co, and Sn, Zn, Ag, Mn, B, P, Mg, Cr, Fe, Ti, Zr And 0.005 to 2.0 mass% of at least one selected from the group consisting of Hf in total, the balance having an alloy composition composed of copper and unavoidable impurities, and in EBSD (Electron Back Scatter Diffraction: electron back scattering diffraction) measurement In the crystal orientation analysis, the area ratio of the region having the atomic plane in which the angle between the normal of the (111) plane and the angle formed by the TD is within 20 ° with respect to the accumulation of the atomic plane in the width direction (TD) of the rolled plate is A copper alloy sheet material having 50% or less, withstand strength of 500 MPa or more and electrical conductivity of 30% IACS or more. The method according to any one of claims 1 to 3,
Copper alloy sheet material characterized by the connector material. A method for producing the copper alloy sheet material according to any one of claims 1 to 4, wherein the copper alloy having an alloy composition to which the copper alloy sheet is applied is cast [step 1], homogenizing heat treatment [step 2], and hot Processing [step 3], cold rolling [step 6], heat treatment [step 7], cold rolling [step 8], intermediate recrystallization heat step [step 9], and final solution heat treatment [step 10] are performed in this order. Subsequently, an aging precipitation heat treatment [step 11] is performed, and the intermediate recrystallization heat treatment [step 9] is equal to or more than (P-200) ° C. when the complete solidus temperature of the solute atoms is P ° (P-10). It is hold | maintained for 1 second-20 hours at the temperature of degrees C or less, The said final solution heat treatment [step 10] is more than (P + 10) degreeC, and it is hold | maintained for 1 second-10 minutes at (P + 150) degreeC or less, The copper characterized by the above-mentioned. Method for producing alloy sheet. The method of claim 5, wherein
After the aging precipitation heat treatment [step 11], cold rolling [step 12] and temper annealing [step 13] are performed in this order.

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