WO2008090855A1 - 発熱体冷却構造及び駆動装置 - Google Patents

発熱体冷却構造及び駆動装置 Download PDF

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Publication number
WO2008090855A1
WO2008090855A1 PCT/JP2008/050744 JP2008050744W WO2008090855A1 WO 2008090855 A1 WO2008090855 A1 WO 2008090855A1 JP 2008050744 W JP2008050744 W JP 2008050744W WO 2008090855 A1 WO2008090855 A1 WO 2008090855A1
Authority
WO
WIPO (PCT)
Prior art keywords
generation body
heat generation
cooling structure
heat radiation
body cooling
Prior art date
Application number
PCT/JP2008/050744
Other languages
English (en)
French (fr)
Inventor
Kazuo Aoki
Junji Tsuruoka
Seiji Yasui
Yasushi Kabata
Hideyuki Miyahara
Masaharu Kumagai
Original Assignee
Aisin Aw Co., Ltd.
Nakamura Mfg. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aisin Aw Co., Ltd., Nakamura Mfg. Co., Ltd. filed Critical Aisin Aw Co., Ltd.
Priority to CN2008800009920A priority Critical patent/CN101548589B/zh
Priority to DE112008000040T priority patent/DE112008000040B4/de
Publication of WO2008090855A1 publication Critical patent/WO2008090855A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
    • B21J5/068—Shaving, skiving or scarifying for forming lifted portions, e.g. slices or barbs, on the surface of the material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/20—Casings or enclosures characterised by the shape, form or construction thereof with channels or ducts for flow of cooling medium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/20—Casings or enclosures characterised by the shape, form or construction thereof with channels or ducts for flow of cooling medium
    • H02K5/203—Casings or enclosures characterised by the shape, form or construction thereof with channels or ducts for flow of cooling medium specially adapted for liquids, e.g. cooling jackets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Inverter Devices (AREA)

Abstract

　発熱体と熱的に接続された放熱面（５３ａ）と、放熱面（５３ａ）と対向配置された対向面との間に、冷媒空間（Ｒ）が形成され、冷媒空間（Ｒ）に、放熱面（５３ａ）から対向面に向けて立設された複数の放熱フィン（５６）が並列配置されて、複数の放熱フィン（５６）の夫々の隣接間に冷媒が通流するフィン間通路（Ｒｐ）が形成されている発熱体冷却構造（５０）及びそれを備えた駆動装置であって、放熱フィン（５６）が、冷媒の通流方向に沿って複数の曲部を有する蛇行状に形成されていると共に、放熱フィン（５６）の両側壁面（５６ｃ），（５６ｄ）が、互いに異なる形状に形成されている。
PCT/JP2008/050744 2007-01-26 2008-01-22 発熱体冷却構造及び駆動装置 WO2008090855A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800009920A CN101548589B (zh) 2007-01-26 2008-01-22 发热体冷却构造以及驱动装置
DE112008000040T DE112008000040B4 (de) 2007-01-26 2008-01-22 Kühlstruktur einer Wärmesenke für eine Wärme erzeugende Komponente und Antriebseinheit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-016279 2007-01-26
JP2007016279A JP4861840B2 (ja) 2007-01-26 2007-01-26 発熱体冷却構造及び駆動装置

Publications (1)

Publication Number Publication Date
WO2008090855A1 true WO2008090855A1 (ja) 2008-07-31

Family

ID=39644431

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050744 WO2008090855A1 (ja) 2007-01-26 2008-01-22 発熱体冷却構造及び駆動装置

Country Status (5)

Country Link
US (1) US7728467B2 (ja)
JP (1) JP4861840B2 (ja)
CN (1) CN101548589B (ja)
DE (1) DE112008000040B4 (ja)
WO (1) WO2008090855A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO2022131064A1 (ja) * 2020-12-14 2022-06-23 パナソニックＩｐマネジメント株式会社 冷却装置

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Also Published As

Publication number Publication date
DE112008000040B4 (de) 2013-12-12
CN101548589A (zh) 2009-09-30
US20080179972A1 (en) 2008-07-31
JP4861840B2 (ja) 2012-01-25
DE112008000040T5 (de) 2009-10-15
US7728467B2 (en) 2010-06-01
CN101548589B (zh) 2012-02-15
JP2008186820A (ja) 2008-08-14

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