TW200738114A - Heat sink - Google Patents

Heat sink

Info

Publication number
TW200738114A
TW200738114A TW095110316A TW95110316A TW200738114A TW 200738114 A TW200738114 A TW 200738114A TW 095110316 A TW095110316 A TW 095110316A TW 95110316 A TW95110316 A TW 95110316A TW 200738114 A TW200738114 A TW 200738114A
Authority
TW
Taiwan
Prior art keywords
heat
fins
heat sink
wave structure
dissipating
Prior art date
Application number
TW095110316A
Other languages
Chinese (zh)
Other versions
TWI284500B (en
Inventor
Ching-Bai Hwang
Jie Zhang
Xi-Jian Zhu
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95110316A priority Critical patent/TWI284500B/en
Application granted granted Critical
Publication of TWI284500B publication Critical patent/TWI284500B/en
Publication of TW200738114A publication Critical patent/TW200738114A/en

Links

Abstract

The present invention is related to a heat sink adapted for dissipating heat generated by a heat generating unit. The heat sink includes a plurality of fins, at least one heat pipe and a base. A runner is formed between adjacent fins for cooling air flowing therethrough. One side of the heat pipe is attached to the fins and the opposite side of the heat pipe is attached to the base. Each fin has a wave structure. A plurality of protrusions is formed at the troughs of the wave structure. The wave structure and the protrusions of the fins increase the heat dissipating area and the heat exchange coefficient of the fins, thereby enhancing the heat dissipating efficiency of the heat sink.
TW95110316A 2006-03-24 2006-03-24 Heat sink TWI284500B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95110316A TWI284500B (en) 2006-03-24 2006-03-24 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95110316A TWI284500B (en) 2006-03-24 2006-03-24 Heat sink

Publications (2)

Publication Number Publication Date
TWI284500B TWI284500B (en) 2007-07-21
TW200738114A true TW200738114A (en) 2007-10-01

Family

ID=39455128

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95110316A TWI284500B (en) 2006-03-24 2006-03-24 Heat sink

Country Status (1)

Country Link
TW (1) TWI284500B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561965B (en) * 2009-09-11 2016-12-11 Foxconn Tech Co Ltd Heat dissipating device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI812136B (en) * 2022-03-31 2023-08-11 宏碁股份有限公司 Electronic device, heat dissipation assembly, and thermal fin thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561965B (en) * 2009-09-11 2016-12-11 Foxconn Tech Co Ltd Heat dissipating device

Also Published As

Publication number Publication date
TWI284500B (en) 2007-07-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees