TW200738114A - Heat sink - Google Patents
Heat sinkInfo
- Publication number
- TW200738114A TW200738114A TW095110316A TW95110316A TW200738114A TW 200738114 A TW200738114 A TW 200738114A TW 095110316 A TW095110316 A TW 095110316A TW 95110316 A TW95110316 A TW 95110316A TW 200738114 A TW200738114 A TW 200738114A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- fins
- heat sink
- wave structure
- dissipating
- Prior art date
Links
Abstract
The present invention is related to a heat sink adapted for dissipating heat generated by a heat generating unit. The heat sink includes a plurality of fins, at least one heat pipe and a base. A runner is formed between adjacent fins for cooling air flowing therethrough. One side of the heat pipe is attached to the fins and the opposite side of the heat pipe is attached to the base. Each fin has a wave structure. A plurality of protrusions is formed at the troughs of the wave structure. The wave structure and the protrusions of the fins increase the heat dissipating area and the heat exchange coefficient of the fins, thereby enhancing the heat dissipating efficiency of the heat sink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95110316A TWI284500B (en) | 2006-03-24 | 2006-03-24 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95110316A TWI284500B (en) | 2006-03-24 | 2006-03-24 | Heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI284500B TWI284500B (en) | 2007-07-21 |
TW200738114A true TW200738114A (en) | 2007-10-01 |
Family
ID=39455128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95110316A TWI284500B (en) | 2006-03-24 | 2006-03-24 | Heat sink |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI284500B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI561965B (en) * | 2009-09-11 | 2016-12-11 | Foxconn Tech Co Ltd | Heat dissipating device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI812136B (en) * | 2022-03-31 | 2023-08-11 | 宏碁股份有限公司 | Electronic device, heat dissipation assembly, and thermal fin thereof |
-
2006
- 2006-03-24 TW TW95110316A patent/TWI284500B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI561965B (en) * | 2009-09-11 | 2016-12-11 | Foxconn Tech Co Ltd | Heat dissipating device |
Also Published As
Publication number | Publication date |
---|---|
TWI284500B (en) | 2007-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |