WO2008047892A1 - Curable polyorganosiloxane composition - Google Patents
Curable polyorganosiloxane composition Download PDFInfo
- Publication number
- WO2008047892A1 WO2008047892A1 PCT/JP2007/070404 JP2007070404W WO2008047892A1 WO 2008047892 A1 WO2008047892 A1 WO 2008047892A1 JP 2007070404 W JP2007070404 W JP 2007070404W WO 2008047892 A1 WO2008047892 A1 WO 2008047892A1
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- WIPO (PCT)
- Prior art keywords
- unit
- polyorganosiloxane
- group
- cured product
- polyorganosiloxane composition
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 56
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 37
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 15
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 230000003287 optical effect Effects 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 8
- -1 Platinum group metal compound Chemical class 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 125000004429 atom Chemical group 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000003566 sealing material Substances 0.000 claims description 2
- 229940126062 Compound A Drugs 0.000 claims 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims 1
- 238000004383 yellowing Methods 0.000 abstract description 8
- 150000001875 compounds Chemical class 0.000 abstract description 2
- 229910020485 SiO4/2 Inorganic materials 0.000 abstract 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- 150000002430 hydrocarbons Chemical group 0.000 abstract 1
- 230000035699 permeability Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 40
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 238000002834 transmittance Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- 229920005601 base polymer Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 7
- 239000008096 xylene Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 6
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- 229910021485 fumed silica Inorganic materials 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000007259 addition reaction Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- 239000004848 polyfunctional curative Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000006837 decompression Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- SZIFAVKTNFCBPC-UHFFFAOYSA-N 2-chloroethanol Chemical compound OCCCl SZIFAVKTNFCBPC-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000006043 5-hexenyl group Chemical group 0.000 description 1
- 235000018185 Betula X alpestris Nutrition 0.000 description 1
- 235000018212 Betula X uliginosa Nutrition 0.000 description 1
- SRBFZHDQGSBBOR-IOVATXLUSA-N D-xylopyranose Chemical group O[C@@H]1COC(O)[C@H](O)[C@H]1O SRBFZHDQGSBBOR-IOVATXLUSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical class [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- 102000016397 Methyltransferase Human genes 0.000 description 1
- 108060004795 Methyltransferase Proteins 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 125000000066 S-methyl group Chemical group [H]C([H])([H])S* 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- GJWAPAVRQYYSTK-UHFFFAOYSA-N [(dimethyl-$l^{3}-silanyl)amino]-dimethylsilicon Chemical compound C[Si](C)N[Si](C)C GJWAPAVRQYYSTK-UHFFFAOYSA-N 0.000 description 1
- WYUIWUCVZCRTRH-UHFFFAOYSA-N [[[ethenyl(dimethyl)silyl]amino]-dimethylsilyl]ethene Chemical compound C=C[Si](C)(C)N[Si](C)(C)C=C WYUIWUCVZCRTRH-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229940045985 antineoplastic platinum compound Drugs 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 150000001785 cerium compounds Chemical class 0.000 description 1
- FXNONNRUNQPNLF-UHFFFAOYSA-N cerium;2-ethylhexanoic acid Chemical compound [Ce].CCCCC(CC)C(O)=O.CCCCC(CC)C(O)=O.CCCCC(CC)C(O)=O FXNONNRUNQPNLF-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000012074 organic phase Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- ZOUWOGOTHLRRLS-UHFFFAOYSA-N palladium;phosphane Chemical class P.[Pd] ZOUWOGOTHLRRLS-UHFFFAOYSA-N 0.000 description 1
- LBSKEFWQPNVWTP-UHFFFAOYSA-N pent-1-yn-3-ol Chemical compound CCC(O)C#C LBSKEFWQPNVWTP-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- PKELYQZIUROQSI-UHFFFAOYSA-N phosphane;platinum Chemical class P.[Pt] PKELYQZIUROQSI-UHFFFAOYSA-N 0.000 description 1
- WJIBZZVTNMAURL-UHFFFAOYSA-N phosphane;rhodium Chemical class P.[Rh] WJIBZZVTNMAURL-UHFFFAOYSA-N 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 150000003284 rhodium compounds Chemical class 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BVJAAVMKGRODCT-UHFFFAOYSA-N sulfanylidenerhodium Chemical class [Rh]=S BVJAAVMKGRODCT-UHFFFAOYSA-N 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Definitions
- the present invention relates to a polyorganosiloxane composition that cures by an addition reaction, and in particular, a cured product suitable for optical applications such as a sealant for a light emitting diode (hereinafter referred to as LED) and a lens.
- the polyorganosiloxane composition is given.
- the present invention also relates to a cured product obtained by curing such a polyorganosiloxane composition, particularly a cured product suitable for optics and LEDs.
- Silicone resins and silicone rubbers are used in various optical applications because they are transparent in addition to heat resistance, cold resistance, electrical insulation, etc., including polymers that exhibit intermediate physical properties. ing.
- polyorganosiloxane compositions that are cured to give a hardened and transparent cured product are useful for applications such as LED sealing, protection, and lenses.
- Patent Document 1 discloses that a branched polyorganosiloxane having an alkenyl group bonded to a silicon atom, particularly the above polysiloxane having a phenyl group to obtain a high refractive index, is crosslinked with a polyorganohydrogensiloxane. It is disclosed that the resin-like cured product force LED obtained in this way can be used for LED protection, adhesion, wavelength change adjustment, and lens.
- the phenyl group content of the polyorganosiloxane is increased, the resulting resinous cured product has a problem of poor transparency in the short wavelength region from blue to ultraviolet region. Further, this cured product has a problem that yellowing occurs when exposed to heat. In recent years, high brightness has been achieved in the LED field, but the amount of heat generated increases accordingly, so it is urgent to deal with this problem.
- Patent Document 2 discloses a monovalent hydrocarbon group bonded to a silicon atom. More than 80% strength excluding alkenyl groups Resinous curing obtained by cross-linking polyorganosiloxanes having hydroxyl groups or alkoxy groups that are S methyl groups and bonded to silicon atoms with polyorganohydride siloxanes Things are disclosed.
- the obtained resinous cured product has a problem that hydrolysis / polycondensation proceeds due to the presence of the remaining hydroxyl group or alkoxy group, and the hardness or the like changes with time, and the cured product becomes brittle.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2004-186168
- Patent Document 2 JP 2004-221308 A
- the present inventor has used a branched alkenyl group-containing polyorganosiloxane containing a large amount of methyl groups as a base polymer, and a branched agent as a crosslinking agent.
- a branched agent as a crosslinking agent.
- the present invention provides:
- each R is independently a monovalent unsubstituted or substituted
- (A2) a linear polyorganosiloxane in which R (R is as described above) is bonded to a key atom, and at least two R are alkenyl groups per molecule; ,
- An alkenyl group-containing polyorganosiloxane wherein, in R present in (A1) and (A2), 90 mol% or more of R other than an alkenyl group is a methyl group; (B) SiO unit and R 3 (CH 3 ) SiO unit (where, each independently represents hydrogen
- a polyalkylhydrogensiloxane comprising at least three R 3 hydrogen atoms per molecule
- the present invention also relates to a transparent cured product suitable for LED encapsulants and optical lenses, obtained by curing the above curable polyorganosiloxane composition.
- the curable polyorganosiloxane composition of the present invention is superior in transparency in a short wavelength region from blue to ultraviolet region, and is suppressed in yellowing due to exposure to heat.
- a cured product suitable for the material and the optical lens can be provided.
- the curable polyorganosiloxane composition of the present invention comprises (A) a base polymer, (B) a crosslinking agent, and (C) a curing catalyst, and (A) an alkenyl group and (B) a monohydrogen hydrogen. It hardens by an addition reaction (hydrosilylation reaction) between the bonds to give a cured product.
- composition of the present invention as (A), (A1) a branched polyorganosiloxane and optionally (A2) a linear polyorganosiloxane are used.
- (A1) is SiO unit and R SiO unit, and in some cases
- R SiO and / or RSiO units (wherein each R is independently an unsubstituted or
- R SiO units having at least three R alkenyl groups per molecule so as to be a crosslinking point in the curing reaction.
- the ratio of 3 1/2 to SiO units is a solid ratio at a normal temperature in the range of 1: 0.8 to 1: 3 as a molar ratio.
- a viscous semi-solid resinous or liquid material is preferred.
- R is an alkenyl group
- examples include buyl, allyl, 3-butyl, 5-hexenyl, etc., which are easy to synthesize, and the fluidity of the composition before curing and the composition after curing.
- the bull group is the most preferred because it does not impair the heat resistance!
- An alkenyl group can exist as R in the R SiO unit. Alkenyl groups are
- it may exist as R SiO unit or R of RSiO unit, but at room temperature.
- At least part of the alkenyl group is present in the S, R SiO unit
- R other than an alkenyl group includes an unsubstituted or substituted monovalent hydrocarbon group that does not contain an aliphatic unsaturated carbon bond, and includes methyl, ethyl, propyl, butyl, pentyl, Alkyl groups such as xyl, octyl, decyl, dodecyl; cycloalkyl groups such as cyclohexyl; aryl groups such as phenyl; aralkyl groups such as 2-phenylethyl and 2-phenylpropyl; chloromethyl, chlorophenyl And monovalent hydrocarbon groups substituted by halogen or cyano, such as 2-cyanoamino, 3,3,3-trifluoropropyl. In view of heat resistance, a methyl group is preferable.
- (A1) is a co-hydrolysis and polycondensation by a normal production method, followed by treatment with an aqueous solution of an alkaline substance such as sodium hydroxide or potassium hydroxide, followed by a conventional method. After neutralizing power and water removal, treatment with hexamethyldisilazane, 1,3-divinylulose, 1,1,3,3-tetramethyldisilazane, to form the key atoms derived from raw materials It can be made substantially free of bonded hydroxyl groups or alkoxy.
- an alkaline substance such as sodium hydroxide or potassium hydroxide
- (A2) is a linear chain in which R (where R is as described above) is independently bonded to a silicon atom, and at least two R are alkenyl groups per molecule.
- R is as described above
- (A2) should be substantially linear. Some branches may exist.
- (A2) has R Si such as a dimethylvinylsiloxy group or a trimethylsilyl group as a terminal group.
- 3 o group is introduced and substantially contains a hydroxyl group or an alkoxy group bonded to a silicon atom.
- R which is an alkenyl group may be present at the end or in the middle of the molecular chain of (A2), or may be present at both of them, but has excellent mechanical properties in the cured composition. To give It is preferable to be present at least at both ends.
- the viscosity of (A2) is such that the uncured composition has good fluidity and excellent workability, and the cured composition has excellent mechanical strength and moderate elasticity and hardness.
- the viscosity at ° C is from 0.01 to 10; more preferably 0.1 to 100
- R 1 represents an alkenyl group
- R 2 represents an unsubstituted or substituted monovalent hydrocarbon group containing no aliphatic unsaturated carbon-carbon bond
- a is 1 or 2, preferably 1;
- b is an integer of 0 to 2, provided that a + b is 2 or 3.
- R 1 Illustrative and preferred groups for R 1 are the same as those for R which is the alkenyl group of (A1) described above, and exemplary and preferred groups for R 2 are those other than the alkenyl group of (A) described above R The same as for.
- (A1) is optionally used together with (A2).
- (A) As a whole, 90 mol% of R other than alkenyl group out of R present or a methyltransferase group, preferably a 95 mole 0/0 or more, more preferably 100 mole 0/0 Ca butyl group.
- the R present in (A1), of R other than the alkenyl groups, more than 90 mol% are methyl groups, preferably 95 mol 0/0 or more, more preferably 100 mole 0/0 It is a acetyl group.
- the R present in (A2), among the R other than the alkenyl groups, more than 90% molar is a methyl group, preferably 95 mol 0/0 above, preferred and more Basically ⁇ .
- the ratio of (A1) and (A2) in (A) is preferably (8) 100% by weight of (A1) from 50 to; 100% by weight, and (A2) from 50 to 0% by weight. %. By setting it in such a range, it is compatible with (B) to form a uniform composition, and has excellent mechanical properties in the cured product, in particular, the hardness required for cured products for LEDs and lenses. A low linear expansion coefficient can be imparted. More preferably, (A1) is 60 to 100% by weight, and (A2) is 0 to 40% by weight.
- (B) is a polyorganohydrogensiloxane having a Si—H bond in the molecule, and is cured by a hydrosilylation reaction between the Si—H bond and the alkenyl group of the base polymer (A). It contributes as a crosslinking agent that gives (A) is compatible with (A) to form a homogeneous composition and give the cured product a high crosslinking density, thereby imparting a high hardness to the cured product.
- the branched polymethylnodrosiloxane is selected from the group consisting of R 3 (CH 3 ) 2 SiO units and SiO 2
- the ratio of 3 2 1/2 4/2 units is as follows: R 3 (CH 3 ) SiO units 1.5 to 2.2 mol per 1 mol of SiO units
- 1.8 to 2 ⁇ 1 mol is more preferable.
- Typical birch includes [R 3 (CH) SiO] [SiO] or [R 3 (CH) SiO] [SiO].
- each Q unit forms a cyclic or chain siloxane skeleton, and each Q unit has 2 (chain siloxane In the case of a skeleton, 3 terminal MH units) and / or M units (provided that the molecule has at least 3 MH units) are particularly preferred. .
- the number of hydrogen atoms directly bonded to the silicon atom contained in R 3 in (B) is 3 or more per molecule on average as a whole (B). If the average number is less than 3, a sufficient crosslinking density cannot be obtained to obtain a cured product having the required hardness. The remainder is a methyl group because it is easy to synthesize and imparts a good balance of siloxane characteristics such as heat resistance.
- the amount of (B) is such that the ratio (H / Vi) of the number of hydrogen atoms bonded to the silicon atom to one alkenyl group present in (A) is 0.5 to 2.0. Preferably it is an amount that becomes 0 ⁇ 7 to 1 ⁇ 8.
- H / Vi is less than 0.5, a cured product having sufficient physical properties cannot be obtained. If it exceeds 2.0, Si—H bonds remain in the cured product, and the polycondensation reaction is caused by heating. Since it becomes brittle, it tends to crack due to thermal history and immediately yellows, resulting in poor heat resistance and thermal shock resistance.
- the platinum-based catalyst (C) used in the present invention is a catalyst for promoting the addition reaction between the alkenyl group (A) and the hydrosilyl group (B).
- the platinum group metal compound is a compound of a platinum group metal atom such as platinum, rhodium, and palladium.
- Platinum chloride acid, reaction product of chloroplatinic acid and alcohol, platinum-olefin complex, platinum bur siloxane complex, platinum-ketone Examples include complexes, platinum compounds such as platinum phosphine complexes; rhodium-phosphine complexes, rhodium compounds such as rhodium sulfide complexes; palladium compounds such as palladium phosphine complexes. Of these, platinum-bulusiloxane complexes are preferred because of their good catalytic activity and good solubility in (!).
- the blending amount of (C) is usually 0.;! To 1,000 ppm by weight, preferably in terms of platinum group metal atoms, with respect to (A), preferably from (A). 0.5 to 200-ppm by weight
- a fine powder inorganic filler may be added as long as the characteristics are not impaired.
- examples of such an inorganic filler include dry fine powder silica such as fumed silica and arc silica, and fumed silica is preferred.
- the silica surface is treated with hexamethyldisilazane, 1,3-divinyl-1,1,3,3-tetramethyldisilazane, etc. It is preferable. The amount of these fillers added does not impair the intended use of the composition!
- the composition of the present invention may contain 3-methyl-1-butyn-3-ol, 3-methyl-dioxygenated as necessary, unless the object of the present invention such as hardness and transparency of the cured product is impaired.
- the composition of the present invention may be dissolved and dispersed in an organic solvent such as toluene or xylene.
- the composition of the present invention is prepared by uniformly kneading (A) to (C) and other components to be blended as necessary by a mixing means such as a universal kneader or a kneader. You can.
- a mixing means such as a universal kneader or a kneader.
- co-hydrolysis is performed in the presence of an organic solvent such as toluene or xylene, and the subsequent steps are performed as an organic solvent solution.
- the solvent may be removed by heating under reduced pressure to form (A).
- (B) and (C) are stored in separate containers. For example, a part of (A) and a main agent part containing (C), a remainder of (A) and ( Store the hardener parts containing B) in separate containers, mix them immediately before use, and defoam with reduced pressure before use.
- the polyorganosiloxane composition of the present invention is injected into a site to be used, dropped, cast, cast, extruded from a container, or integrally formed by transfer molding or injection molding. By combining with such an object and allowing it to harden by standing or heating at room temperature, it is possible to obtain a hard object.
- the cured product obtained by curing the composition of the present invention is excellent in transmittance in a short wavelength region from blue to ultraviolet region, and has a light transmittance at a wavelength of 400 nm with respect to a cured product having a thickness of 2 mm. However, it is usually 80% or more, more preferably 85% or more.
- the light transmittance power S at a wavelength of 350 ⁇ m is usually 75% or more, preferably 80% or more. Furthermore, in the cured product, yellowing due to exposure to heat is suppressed, and the transmittance is unlikely to decrease.
- the cured product obtained by curing the composition of the present invention has a refractive index of usually 1.40 to
- the cured product obtained by curing the composition of the present invention has a tang value measured by autograph, a value measured at 150 ° C with respect to a value measured at 23 ° C, usually 1 / 3 It is above and can suppress the hardness change of the hardened
- a cured product obtained by curing the composition of the present invention usually has a hardness force of 60 or more according to JIS K6253 type A durometer, and a hardness force S of type D durometer, usually 20 More preferably, it can be set to 40 or more. Therefore, it has mechanical strength, the surface is hardly scratched, and dust or the like hardly adheres.
- the curable composition of the present invention can be used for LED sealing.
- the LED is sealed on the substrate on which the LED is mounted, and no bubbles remain.
- the cured product of the curable composition of the present invention is preferred as an LED sealing material and also suitable for an optical lens.
- siloxane unit is represented by the following symbols.
- T f unit CH SiO (trifunctional)
- the polyorganosiloxane al-1 is prepared as follows. Xylene
- Dimethinolevininochlorosilane 60.3 ⁇ and tetraethoxysilane 832 parts were charged into a reaction vessel equipped with a stirrer, dripping device, heating / cooling device and decompression device, and dissolved uniformly. It was. Excess water was added dropwise thereto, and co-hydrolysis and condensation were performed at 80 ° C while removing the heat of dissolution of the by-produced hydrochloric acid by cooling. The obtained organic layer is washed with water until the washing water shows neutrality, dehydrated, added with KOH to 200 ppm, and dehydrated and condensed while removing water outside the system at 140 ° C. It was. Thereafter, the solution was neutralized with phosphoric acid, and the resulting salt was filtered and diluted with xylene to adjust the non-volatile content to 60%.
- the polyorganosiloxane a2-1 is prepared as follows. 98.8 parts of oxane was charged into a reaction vessel equipped with a stirrer, a dropping device, a heating / cooling device, and a decompression device, and stirred and dehydrated at 140 ° C. with N flowing. Then 1, 7—Jibi
- crosslinking agent b used in Examples and Comparative Examples is prepared as follows. Toluene
- the curing retarder used in Examples and Comparative Examples is 1 ethynyl-1-cyclohexanol.
- fumed silica has a specific surface area of 300 m 2 / g and is surface-treated with hexamethyldisilazane.
- al-1 is a xylene solution, so al-1 and a2 1 are charged into a container equipped with a vacuum heating device and a stirrer and stirred until they are uniform. After mixing, xylene contained in al-1 At 140 ° C / 667Pa ⁇ 5mmHg ⁇ to prepare a liquid base polymer mixture.
- the main component part consisting of part of the base polymer, the catalyst, part of the fumed silica, the remainder of the base polymer, the crosslinking agent, the curing retarder, and A hardener part containing the remainder of the hazy silica was prepared respectively.
- the base polymer and fumed silica were distributed so that the weight ratio of the main agent and hardener was approximately 1: 1.
- the main agent part and the hardener part were mixed, degassed, cast into a 2 mm thick sheet, and cured by heating in a 150 ° C oven for 1 hour. A resinous cured product which was colorless and transparent and had a slight elongation was obtained.
- composition and its cured product were evaluated as follows.
- Refractive index The refractive index at 23 ° C of the composition before curing was measured with an Abbe refractometer manufactured by ATAGO.
- Table 1 shows the compounding ratio of each example and comparative example, and the curability of the composition and the physical properties of the cured product.
- the amount of al-1 is shown in terms of siloxane content.
- the composition in Table 1 shows the total amount.
- the composition of Comparative Example 1 uses a polyorganosiloxane containing a phenyl group, and the obtained cured product is inferior in light transmittance of 350 nm. Further, after the heating test, 400 nm due to yellowing. 'All light transmittances at 350nm decreased, especially at 350nm. The Young's modulus is also less than 1/3 of the measured value at 150 ° C and the measured value at 23 ° C. it was under.
- the obtained cured product has a good light transmittance of 400 nm '350 nm, and further suppresses a decrease in light transmittance after the heating test. It had been.
- the fact that the decrease in transmittance at 400 nm is suppressed indicates that yellowing has been suppressed.
- the Young's modulus was also more than 1/3 of the measured value at 150 ° C and the measured value at 23 ° C.
- the curable polyorganosiloxane composition of the present invention can provide a cured product having excellent transparency in a short wavelength region from blue to ultraviolet region and having good heat resistance, and various optical properties. It is useful as an objective lens. It is also useful for LED sealing, protection, and lenses.
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Description
Claims
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KR1020097009933A KR101395027B1 (ko) | 2006-10-19 | 2007-10-19 | 경화성 폴리오르가노실록산 조성물 |
EP20070830138 EP2083049B1 (en) | 2006-10-19 | 2007-10-19 | Curable polyorganosiloxane composition |
JP2008539877A JPWO2008047892A1 (ja) | 2006-10-19 | 2007-10-19 | 硬化性ポリオルガノシロキサン組成物 |
US12/311,710 US8129480B2 (en) | 2006-10-19 | 2007-10-19 | Curable polyorganosiloxane composition |
US13/240,397 US8389650B2 (en) | 2006-10-19 | 2011-09-22 | Curable polyorganosiloxane composition |
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US13/240,397 Continuation US8389650B2 (en) | 2006-10-19 | 2011-09-22 | Curable polyorganosiloxane composition |
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EP (2) | EP2083049B1 (ja) |
JP (1) | JPWO2008047892A1 (ja) |
KR (1) | KR101395027B1 (ja) |
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-
2007
- 2007-10-19 WO PCT/JP2007/070404 patent/WO2008047892A1/ja active Application Filing
- 2007-10-19 KR KR1020097009933A patent/KR101395027B1/ko active IP Right Grant
- 2007-10-19 TW TW96139123A patent/TWI447176B/zh active
- 2007-10-19 EP EP20070830138 patent/EP2083049B1/en not_active Revoked
- 2007-10-19 US US12/311,710 patent/US8129480B2/en active Active
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2011
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TWI447176B (zh) | 2014-08-01 |
US20090281243A1 (en) | 2009-11-12 |
EP2463343B1 (en) | 2014-04-02 |
EP2083049A4 (en) | 2009-09-23 |
US8389650B2 (en) | 2013-03-05 |
US20120029151A1 (en) | 2012-02-02 |
EP2463343A1 (en) | 2012-06-13 |
TW200833790A (en) | 2008-08-16 |
KR101395027B1 (ko) | 2014-05-22 |
KR20090077955A (ko) | 2009-07-16 |
EP2083049A1 (en) | 2009-07-29 |
EP2083049B1 (en) | 2013-09-11 |
US8129480B2 (en) | 2012-03-06 |
JPWO2008047892A1 (ja) | 2010-02-25 |
MY150228A (en) | 2013-12-31 |
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