WO2008114634A1 - 発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法 - Google Patents

発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法 Download PDF

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Publication number
WO2008114634A1
WO2008114634A1 PCT/JP2008/054255 JP2008054255W WO2008114634A1 WO 2008114634 A1 WO2008114634 A1 WO 2008114634A1 JP 2008054255 W JP2008054255 W JP 2008054255W WO 2008114634 A1 WO2008114634 A1 WO 2008114634A1
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WIPO (PCT)
Prior art keywords
potting
silicone resin
resin composition
electronic part
semiconductor electronic
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PCT/JP2008/054255
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English (en)
French (fr)
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Yoshiteru Miyawaki
Osamu Tanaka
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Sanyu Rec Co., Ltd.
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Publication date
Application filed by Sanyu Rec Co., Ltd. filed Critical Sanyu Rec Co., Ltd.
Priority to EP08721671A priority Critical patent/EP2128201A4/en
Priority to US12/449,921 priority patent/US8202933B2/en
Priority to KR20097019436A priority patent/KR101487203B1/ko
Publication of WO2008114634A1 publication Critical patent/WO2008114634A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Abstract

　本発明は、ポッティング方式で封止すること及びレンズ形状（例えば、半球状、放物線形状等）に成形することが容易であり、ポッティング方式で成形された封止レンズが高い透明性を備えることが可能な、発光素子封止用シリコーン樹脂組成物を提供する。 　本発明は、具体的には、発光素子封止用シリコーン樹脂組成物であって、平均粒子径が１～３０ｎｍのシリカを（Ａ）及び（Ｂ）の総量に対して２～２５重量％含有し、該組成物の粘度（２３°C）が１０Ｐａ・Ｓ超～７０Ｐａ・Ｓ未満、チクソトロピック性が２．０～５．５であり、封止がポッティング方式である組成物。また、発光素子を備えた基板に前記組成物を封止樹脂として使用したポッティングにより該封止樹脂をレンズ状に成形することを特徴とする、光半導体電子部品の製造方法を提供する。
PCT/JP2008/054255 2007-03-19 2008-03-10 発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法 WO2008114634A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08721671A EP2128201A4 (en) 2007-03-19 2008-03-10 SILICONE RESIN COMPOSITION FOR THE PLASTERING OF LUMINESCENE ELEMENTS AND METHOD FOR PRODUCING AN OPTOHALBLEITER ELECTRONIC ITEM THEREFORE BY FORGING
US12/449,921 US8202933B2 (en) 2007-03-19 2008-03-10 Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting
KR20097019436A KR101487203B1 (ko) 2007-03-19 2008-03-10 발광소자 봉지용 실리콘 수지 조성물 및 이를 이용한 포팅 방식에 따른 광 반도체 전자부품의 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007070852A JP4895879B2 (ja) 2007-03-19 2007-03-19 発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法
JP2007-070852 2007-03-19

Publications (1)

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WO2008114634A1 true WO2008114634A1 (ja) 2008-09-25

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PCT/JP2008/054255 WO2008114634A1 (ja) 2007-03-19 2008-03-10 発光素子封止用シリコーン樹脂組成物及びこれを用いたポッティング方式による光半導体電子部品の製造方法

Country Status (8)

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US (1) US8202933B2 (ja)
EP (1) EP2128201A4 (ja)
JP (1) JP4895879B2 (ja)
KR (1) KR101487203B1 (ja)
CN (1) CN101636450A (ja)
MY (1) MY148465A (ja)
TW (1) TWI437673B (ja)
WO (1) WO2008114634A1 (ja)

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EP2223973A1 (en) * 2009-02-26 2010-09-01 Nitto Denko Corporation Metal oxide fine particles, silicone resin composition and use thereof
JP2011162741A (ja) * 2010-02-15 2011-08-25 Yokohama Rubber Co Ltd:The シリコーン樹脂組成物、およびこれを用いる光半導体封止体
CN102959015A (zh) * 2010-06-29 2013-03-06 道康宁东丽株式会社 可固化的有机聚硅氧烷组合物及光学半导体器件
WO2020261766A1 (ja) * 2019-06-25 2020-12-30 豊田合成株式会社 発光装置及びその製造方法

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JP5000566B2 (ja) * 2008-03-27 2012-08-15 信越化学工業株式会社 硬化性シリコーンゴム組成物、およびそれを封止材料として用いた光半導体装置
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KR101148392B1 (ko) * 2010-07-13 2012-05-21 삼성전기주식회사 반도체 패키지 기판의 제조방법
WO2012147611A1 (ja) 2011-04-26 2012-11-01 サンユレック株式会社 オプトデバイスの製造方法および製造装置
JP5522116B2 (ja) * 2011-04-28 2014-06-18 信越化学工業株式会社 付加硬化型シリコーン組成物及びそれを用いた光半導体装置
CN103827216B (zh) * 2011-07-22 2016-03-16 Lg化学株式会社 可固化组合物
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KR101628727B1 (ko) 2012-03-20 2016-06-09 공주대학교 산학협력단 발광소자 봉지재용 조성물 및 발광소자
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See also references of EP2128201A4

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2223973A1 (en) * 2009-02-26 2010-09-01 Nitto Denko Corporation Metal oxide fine particles, silicone resin composition and use thereof
JP2011162741A (ja) * 2010-02-15 2011-08-25 Yokohama Rubber Co Ltd:The シリコーン樹脂組成物、およびこれを用いる光半導体封止体
CN102959015A (zh) * 2010-06-29 2013-03-06 道康宁东丽株式会社 可固化的有机聚硅氧烷组合物及光学半导体器件
WO2020261766A1 (ja) * 2019-06-25 2020-12-30 豊田合成株式会社 発光装置及びその製造方法
JP2021002632A (ja) * 2019-06-25 2021-01-07 豊田合成株式会社 発光装置及びその製造方法
JP7226131B2 (ja) 2019-06-25 2023-02-21 豊田合成株式会社 発光装置及びその製造方法

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JP2008231199A (ja) 2008-10-02
TWI437673B (zh) 2014-05-11
EP2128201A1 (en) 2009-12-02
EP2128201A4 (en) 2010-08-04
KR20090127885A (ko) 2009-12-14
MY148465A (en) 2013-04-30
US8202933B2 (en) 2012-06-19
KR101487203B1 (ko) 2015-01-28
CN101636450A (zh) 2010-01-27
TW200849508A (en) 2008-12-16
US20100062552A1 (en) 2010-03-11
JP4895879B2 (ja) 2012-03-14

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