WO2008012460A3 - Dispositif électroluminescent encapsulé - Google Patents

Dispositif électroluminescent encapsulé Download PDF

Info

Publication number
WO2008012460A3
WO2008012460A3 PCT/FR2007/051697 FR2007051697W WO2008012460A3 WO 2008012460 A3 WO2008012460 A3 WO 2008012460A3 FR 2007051697 W FR2007051697 W FR 2007051697W WO 2008012460 A3 WO2008012460 A3 WO 2008012460A3
Authority
WO
WIPO (PCT)
Prior art keywords
protective
substrate
electrodes
metallic part
electroluminescent
Prior art date
Application number
PCT/FR2007/051697
Other languages
English (en)
Other versions
WO2008012460A2 (fr
Inventor
Svetoslav Tchakarov
Didier Jousse
Original Assignee
Saint Gobain
Svetoslav Tchakarov
Didier Jousse
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain, Svetoslav Tchakarov, Didier Jousse filed Critical Saint Gobain
Priority to EP07823615A priority Critical patent/EP2047540A2/fr
Priority to CN2007800356974A priority patent/CN101517771B/zh
Priority to US12/375,217 priority patent/US8395319B2/en
Priority to KR1020097004450A priority patent/KR101409885B1/ko
Priority to JP2009521309A priority patent/JP5372752B2/ja
Publication of WO2008012460A2 publication Critical patent/WO2008012460A2/fr
Publication of WO2008012460A3 publication Critical patent/WO2008012460A3/fr

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/10165Functional features of the laminated safety glass or glazing
    • B32B17/10541Functional features of the laminated safety glass or glazing comprising a light source or a light guide
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10761Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/1077Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing polyurethane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10788Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/20Light-sensitive devices
    • H01G9/2068Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
    • H01G9/2077Sealing arrangements, e.g. to prevent the leakage of the electrolyte
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8423Metallic sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/846Passivation; Containers; Encapsulations comprising getter material or desiccants
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/542Dye sensitized solar cells

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention porte sur un dispositif électroluminescent encapsulé (100) comportant un système électroluminescent (1) comprenant une couche active électroluminescente (12) disposée sur un substrat protecteur (2) et entre deux électrodes (11 à 13), un capot protecteur (3) de ladite couche 15 électroluminescente, solidaire du substrat, des moyens d'étanchéité à l'eau liquide et vapeur, un entourage (50') sur le pourtour du dispositif en au moins une pièce, l'entourage (50) est en au moins une pièce métallique (5a, 5b) ou en au moins une pièce en plastique ou en verre ayant une partie métallique, la pièce métallique ou la partie métallique servant au moins 20 pour une première connexion électrique à l'une des électrodes, ou en ce qu'il comprend au moins une couche électroconductrice déposée sur l'un des bords de la tranche du substrat ou du capot et débordante, entre l'entourage et le substrat ou le capot, pour une première connexion électrique à l'une des électrodes.
PCT/FR2007/051697 2006-07-28 2007-07-20 Dispositif électroluminescent encapsulé WO2008012460A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP07823615A EP2047540A2 (fr) 2006-07-28 2007-07-20 Dispositif électroluminescent encapsulé
CN2007800356974A CN101517771B (zh) 2006-07-28 2007-07-20 封装发光器件
US12/375,217 US8395319B2 (en) 2006-07-28 2007-07-20 Encapsulated light-emmitting device
KR1020097004450A KR101409885B1 (ko) 2006-07-28 2007-07-20 캡슐봉입된 전계 발광 장치
JP2009521309A JP5372752B2 (ja) 2006-07-28 2007-07-20 封入発光素子

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0653172 2006-07-28
FR0653172A FR2904508B1 (fr) 2006-07-28 2006-07-28 Dispositif electroluminescent encapsule

Publications (2)

Publication Number Publication Date
WO2008012460A2 WO2008012460A2 (fr) 2008-01-31
WO2008012460A3 true WO2008012460A3 (fr) 2008-03-13

Family

ID=37668308

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2007/051697 WO2008012460A2 (fr) 2006-07-28 2007-07-20 Dispositif électroluminescent encapsulé

Country Status (7)

Country Link
US (1) US8395319B2 (fr)
EP (1) EP2047540A2 (fr)
JP (1) JP5372752B2 (fr)
KR (1) KR101409885B1 (fr)
CN (1) CN101517771B (fr)
FR (1) FR2904508B1 (fr)
WO (1) WO2008012460A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107208874A (zh) * 2015-02-05 2017-09-26 飞利浦灯具控股公司 Led模块及密封方法
CN110951410B (zh) * 2010-11-02 2022-05-31 Lg化学株式会社 粘合膜和使用其包封有机电子装置的方法

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100110728A1 (en) * 2007-03-19 2010-05-06 Nanosys, Inc. Light-emitting diode (led) devices comprising nanocrystals
KR101056197B1 (ko) * 2008-10-29 2011-08-11 삼성모바일디스플레이주식회사 발광 표시 장치 및 그의 제조 방법
KR20110034649A (ko) * 2008-07-02 2011-04-05 세인트-고베인 퍼포먼스 플라스틱스 코포레이션 프레임 장치, 시일, 및 이들을 제조하기 위한 방법
US20110146793A1 (en) * 2008-07-02 2011-06-23 Saint-Gobain Performance Plastics Chaineux Framed device, seal, and method for manufacturing same
JP5170020B2 (ja) * 2008-10-03 2013-03-27 セイコーエプソン株式会社 有機el装置及び電子機器
US8102119B2 (en) * 2008-12-17 2012-01-24 General Electric Comapny Encapsulated optoelectronic device and method for making the same
US8350470B2 (en) 2008-12-17 2013-01-08 General Electric Company Encapsulation structures of organic electroluminescence devices
US8847480B2 (en) * 2009-03-18 2014-09-30 Semiconductor Energy Laboratory Co., Ltd. Lighting device
US20100294526A1 (en) * 2009-05-21 2010-11-25 General Electric Company Hermetic electrical package
JP5533073B2 (ja) * 2010-03-16 2014-06-25 セイコーエプソン株式会社 電気光学装置、および照明装置
JP5672669B2 (ja) * 2009-07-06 2015-02-18 セイコーエプソン株式会社 電気光学装置および電子機器
CN102598345B (zh) * 2009-09-11 2015-11-25 皇家飞利浦电子股份有限公司 具有保护覆盖物的oled器件
CN102157512B (zh) * 2009-11-30 2015-07-22 精材科技股份有限公司 芯片封装体及其形成方法
ES2642386T3 (es) * 2009-12-18 2017-11-16 Arcelormittal Dispositivo electroluminiscente de gran superficie comprendiendo diodos electroluminiscentes orgánicos
US8253329B2 (en) * 2010-01-21 2012-08-28 General Electric Company Enhanced edge seal design for organic light emitting diode (OLED) encapsulation
KR101073564B1 (ko) * 2010-02-02 2011-10-17 삼성모바일디스플레이주식회사 유기 발광 표시장치 및 이의 제조방법
US8154183B2 (en) * 2010-03-04 2012-04-10 General Electric Company Mitigating shorting risks in encapsulated organic light emitting devices (OLEDs)
JP2011192567A (ja) * 2010-03-16 2011-09-29 Rohm Co Ltd 有機el装置
US8617638B2 (en) 2010-04-22 2013-12-31 Dennis Michael Hill Method of manufacturing photoluminescent pavers at a paver manufacturing facility
FR2959963B1 (fr) * 2010-05-12 2015-04-24 Michelin Soc Tech Objet pneumatique pourvu d'une couche etanche aux gaz a base d'un elastomere thermoplastique et d'un thermoplastique
KR20110125931A (ko) * 2010-05-14 2011-11-22 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조 방법
FR2961916B1 (fr) * 2010-06-25 2013-04-12 Saint Gobain Vitrage feuillete a diffusion variable par cristaux liquides, son procede de fabrication et dispositif pour sa fabrication
US9035545B2 (en) * 2010-07-07 2015-05-19 Lg Chem, Ltd. Organic light emitting device comprising encapsulating structure
JP5611460B2 (ja) * 2010-07-08 2014-10-22 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH 弾性電極を有するオプトエレクトロニクス装置およびその製造方法
KR101947194B1 (ko) * 2010-07-16 2019-02-12 오엘이디워크스 게엠베하 Oled 장치 및 이를 제조하는 방법
CN106887522B (zh) 2010-07-26 2018-09-18 默克专利有限公司 包含纳米晶体的器件
JP5412634B2 (ja) * 2010-09-14 2014-02-12 後藤電子 株式会社 有機el表示装置および有機el照明装置
KR101769586B1 (ko) * 2010-09-24 2017-08-21 삼성디스플레이 주식회사 유기 발광 디스플레이 장치
CN103299448B (zh) * 2010-09-29 2016-09-07 Posco公司 使用辊形状母基板的柔性电子器件的制造方法、柔性电子器件及柔性基板
US8434904B2 (en) * 2010-12-06 2013-05-07 Guardian Industries Corp. Insulated glass units incorporating emitters, and/or methods of making the same
TW201242414A (en) * 2011-01-25 2012-10-16 Panasonic Corp Planate light emitting device
EP2675524B1 (fr) 2011-02-14 2017-05-10 Merck Patent GmbH Dispositif et procédé de traitement de cellules et de tissu cellulaire
WO2012126566A1 (fr) 2011-03-24 2012-09-27 Merck Patent Gmbh Matériaux fonctionnels ioniques organiques
EP2693841B1 (fr) 2011-03-29 2021-08-18 HotaluX, Ltd Dispositif électroluminescent organique, procédé de fabrication associé, et dispositif d'éclairage électroluminescent organique
EP2707911B1 (fr) 2011-05-12 2017-07-05 Merck Patent GmbH Compositions et dispositifs électroniques
CN102278623B (zh) * 2011-05-13 2013-07-31 严为民 一种搪瓷电致发光板边缘结构及其制作方法
FR2976730B1 (fr) 2011-06-17 2013-12-06 Astron Fiamm Safety Delo encapsulee en colle pleine plaque avec un capot troue
DE102011079014A1 (de) * 2011-07-12 2013-01-17 Ledon Oled Lighting Gmbh & Co. Kg Leuchtmodul mit reduziertem Flächenbedarf
CN103733724B (zh) * 2011-08-04 2017-05-17 3M创新有限公司 边缘受保护的阻隔组件
KR101911581B1 (ko) * 2011-08-04 2018-10-24 쓰리엠 이노베이티브 프로퍼티즈 컴파니 에지 보호된 배리어 조립체
US20140283910A1 (en) * 2011-08-04 2014-09-25 3M Innovative Properties Company Edge protected barrier assemblies
EP2740326A4 (fr) * 2011-08-04 2015-05-20 3M Innovative Properties Co Ensembles barrière à bords protégés
US20140290736A1 (en) * 2011-08-04 2014-10-02 3M Innovative Properties Company Barrier assemblies
US20120175667A1 (en) * 2011-10-03 2012-07-12 Golle Aaron J Led light disposed on a flexible substrate and connected with a printed 3d conductor
KR101219351B1 (ko) * 2011-11-30 2013-01-22 현대자동차주식회사 염료감응 태양전지 모듈 및 그 제조방법
KR20130065219A (ko) * 2011-12-09 2013-06-19 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
DE102012201801A1 (de) 2012-02-07 2013-08-08 Osram Opto Semiconductors Gmbh Organische leuchtdiode und vorrichtung mit einer organischen leuchtdiode
WO2013124766A1 (fr) * 2012-02-21 2013-08-29 Koninklijke Philips N.V. Élément luminaire
CN103325808B (zh) * 2012-03-19 2016-06-08 群康科技(深圳)有限公司 显示装置及其制造方法
DE102012207229B4 (de) * 2012-05-02 2020-06-04 Osram Oled Gmbh Elektronisches Bauelement und Verfahren zum Herstellen eines elektronischen Bauelements
JP5984495B2 (ja) * 2012-05-09 2016-09-06 株式会社カネカ 有機el装置、有機el装置の製造方法、及び有機elモジュール
WO2014003196A1 (fr) * 2012-06-29 2014-01-03 コニカミノルタ株式会社 Dispositif électronique et procédé de fabrication
BR112015001314B1 (pt) * 2012-08-01 2021-12-21 Saint-Gobain Glass France Painel compósito com meios de contato elétrico e método para produzir painel compósito
US9625764B2 (en) 2012-08-28 2017-04-18 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
KR20140029202A (ko) * 2012-08-28 2014-03-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
KR102161078B1 (ko) 2012-08-28 2020-09-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 그 제작 방법
FR2998096B1 (fr) * 2012-11-14 2015-01-30 Astron Fiamm Safety Connexion electrique d'un dispositif oled
BE1024011B1 (fr) * 2012-11-29 2017-10-27 Agc Glass Europe Dispositif organique électronique ou optoélectronique laminé
KR20150143638A (ko) 2013-04-15 2015-12-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치
DE102013106855B4 (de) * 2013-07-01 2017-10-12 Osram Oled Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement unter Verwendung einer flüssigen ersten Legierung
CN103383992B (zh) * 2013-08-13 2015-12-02 深圳市华星光电技术有限公司 Oled器件的封装方法及用该方法封装的oled器件
US10008689B2 (en) * 2013-09-27 2018-06-26 Boe Technology Group Co., Ltd. Display panel, display device and method of manufacturing display panel
DE102013111409B4 (de) * 2013-10-16 2019-12-05 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
KR102249051B1 (ko) * 2014-05-19 2021-05-10 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US20150372251A1 (en) * 2014-06-19 2015-12-24 Toshishige Fujii Electric element package
JP6439188B2 (ja) * 2014-06-27 2018-12-19 株式会社Joled 有機el表示パネル及び有機el表示装置
EP3179832B1 (fr) * 2014-08-08 2018-09-12 Kaneka Corporation Panneau luminescent plan et chemise élastique
JP2016072127A (ja) 2014-09-30 2016-05-09 ソニー株式会社 有機el表示装置およびその製造方法、並びに電子機器
US10297572B2 (en) * 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
CN104834399B (zh) * 2015-04-15 2018-06-22 业成光电(深圳)有限公司 触控显示模组
KR102392671B1 (ko) * 2015-05-11 2022-04-29 삼성디스플레이 주식회사 가요성 표시 장치
CN104916789B (zh) 2015-06-30 2018-02-16 京东方科技集团股份有限公司 一种oled封装方法及oled器件
CN105244365B (zh) 2015-11-18 2018-09-25 上海天马有机发光显示技术有限公司 显示装置、制造方法及显示设备
EP3455326B1 (fr) 2016-05-11 2021-02-24 Merck Patent GmbH Compositions pour cellules électrochimiques
KR102554290B1 (ko) * 2016-05-23 2023-07-13 삼성디스플레이 주식회사 표시 장치
JP6938131B2 (ja) * 2016-11-01 2021-09-22 パイオニア株式会社 発光素子及び発光システム
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US10471545B2 (en) 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
CN108206196A (zh) * 2016-12-16 2018-06-26 京东方科技集团股份有限公司 一种有机电致发光显示装置
US10062588B2 (en) 2017-01-18 2018-08-28 Rohinni, LLC Flexible support substrate for transfer of semiconductor devices
KR20190034368A (ko) * 2017-09-22 2019-04-02 삼성디스플레이 주식회사 백라이트 유닛 및 이를 포함하는 표시 장치
CN109727530A (zh) * 2017-10-31 2019-05-07 昆山工研院新型平板显示技术中心有限公司 柔性显示模组及柔性显示模组制备方法
CN107768418B (zh) * 2017-11-02 2019-05-03 武汉华星光电技术有限公司 有机发光显示装置及其封装方法
CN108281566B (zh) * 2018-01-03 2020-04-10 深圳市华星光电半导体显示技术有限公司 Oled面板及其制作方法
KR102420438B1 (ko) * 2018-01-08 2022-07-14 삼성디스플레이 주식회사 표시 장치 및 휴대용 단말기
US10410905B1 (en) 2018-05-12 2019-09-10 Rohinni, LLC Method and apparatus for direct transfer of multiple semiconductor devices
CN108877521A (zh) * 2018-06-28 2018-11-23 京东方科技集团股份有限公司 信息显示器和信息显示装置
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
CN109860432B (zh) * 2018-12-17 2021-01-15 深圳市华星光电技术有限公司 显示器封装结构及其制造方法
KR20200132150A (ko) * 2019-05-15 2020-11-25 삼성전자주식회사 폴더블 전자 장치
JP2021064520A (ja) * 2019-10-15 2021-04-22 セイコーエプソン株式会社 発光装置および電子機器
KR20220142269A (ko) * 2021-04-14 2022-10-21 삼성전자주식회사 회로 기판과 결합된 쉴딩 부재 및 이를 포함하는 전자 장치
FR3122482B1 (fr) * 2021-04-29 2023-06-30 Was Light Module électroluminescent pour signalisation routière horizontale
CN117334644B (zh) * 2023-11-29 2024-02-13 四川弘智远大科技有限公司 一种集成电路封装的实时固化结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5189405A (en) * 1989-01-26 1993-02-23 Sharp Kabushiki Kaisha Thin film electroluminescent panel
US20020068191A1 (en) * 2000-09-27 2002-06-06 Seiko Epson Corporation Organic electroluminescent device, method for manufacturing organic electroluminescent device, and electronic apparatus
WO2002067342A2 (fr) * 2001-02-16 2002-08-29 Universal Display Corporation Region barriere amelioree pour dispositifs optoelectroniques
US20040120155A1 (en) * 2001-04-17 2004-06-24 Ryoma Suenaga Light-emitting apparatus

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6383797A (ja) 1986-09-29 1988-04-14 株式会社東芝 表示文字属性制御装置
JPH0422558Y2 (fr) * 1986-11-21 1992-05-22
JPH03192688A (ja) * 1989-12-21 1991-08-22 Nippon Kasei Kk 分散型電界発光素子の製造方法
JP3755252B2 (ja) * 1997-08-21 2006-03-15 三菱化学株式会社 有機電界発光素子及びその製造方法
JPH11219782A (ja) 1998-01-30 1999-08-10 Hokuriku Electric Ind Co Ltd El素子とその製造方法
JP2000156170A (ja) * 1998-11-19 2000-06-06 Mitsubishi Electric Corp ガス放電表示パネル及びその製造方法
US6204906B1 (en) * 1999-03-22 2001-03-20 Lawrence E. Tannas, Jr. Methods of customizing the physical size and shape of commercial off-the-shelf (COTS) electronic displays
KR100682561B1 (ko) * 1999-03-25 2007-02-15 닛폰 이타가라스 가부시키가이샤 유리 패널 및 그 제조 방법
JP3942770B2 (ja) * 1999-09-22 2007-07-11 株式会社半導体エネルギー研究所 El表示装置及び電子装置
JP2002093573A (ja) * 2000-09-14 2002-03-29 Nisshin Steel Co Ltd 有機el素子用絶縁性封止部材
FR2815374B1 (fr) * 2000-10-18 2003-06-06 Saint Gobain Vitrage feuillete et ses moyens d'etancheification peripherique
EP1280179A3 (fr) * 2001-07-23 2003-09-03 Asahi Glass Company Ltd. Panneau d'affichage plat
US6936131B2 (en) * 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
JP2003317938A (ja) * 2002-04-25 2003-11-07 Harison Toshiba Lighting Corp 有機エレクトロルミネッセンス発光装置
JP2003317940A (ja) * 2002-04-25 2003-11-07 Harison Toshiba Lighting Corp 有機エレクトロルミネッセンス発光装置
US20060087224A1 (en) * 2002-04-25 2006-04-27 Harison Toshiba Lighting Corporation Organic electroluminescence light-emitting device
JP2003334911A (ja) * 2002-05-21 2003-11-25 Mitsubishi Polyester Film Copp ディスプレイ表面保護フィルム
JP4254154B2 (ja) 2002-08-13 2009-04-15 パナソニック電工株式会社 有機電界発光素子の封止方法
CN1891014A (zh) * 2003-12-09 2007-01-03 日本板硝子株式会社 面发光体及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5189405A (en) * 1989-01-26 1993-02-23 Sharp Kabushiki Kaisha Thin film electroluminescent panel
US20020068191A1 (en) * 2000-09-27 2002-06-06 Seiko Epson Corporation Organic electroluminescent device, method for manufacturing organic electroluminescent device, and electronic apparatus
WO2002067342A2 (fr) * 2001-02-16 2002-08-29 Universal Display Corporation Region barriere amelioree pour dispositifs optoelectroniques
US20040120155A1 (en) * 2001-04-17 2004-06-24 Ryoma Suenaga Light-emitting apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110951410B (zh) * 2010-11-02 2022-05-31 Lg化学株式会社 粘合膜和使用其包封有机电子装置的方法
CN107208874A (zh) * 2015-02-05 2017-09-26 飞利浦灯具控股公司 Led模块及密封方法
CN107208874B (zh) * 2015-02-05 2020-02-18 飞利浦灯具控股公司 Led模块及密封方法

Also Published As

Publication number Publication date
CN101517771B (zh) 2012-07-25
KR101409885B1 (ko) 2014-06-20
FR2904508A1 (fr) 2008-02-01
WO2008012460A2 (fr) 2008-01-31
US8395319B2 (en) 2013-03-12
JP2009545113A (ja) 2009-12-17
US20090302760A1 (en) 2009-12-10
JP5372752B2 (ja) 2013-12-18
KR20090039817A (ko) 2009-04-22
EP2047540A2 (fr) 2009-04-15
CN101517771A (zh) 2009-08-26
FR2904508B1 (fr) 2014-08-22

Similar Documents

Publication Publication Date Title
WO2008012460A3 (fr) Dispositif électroluminescent encapsulé
WO2009021741A3 (fr) Composants électroniques organiques
WO2007000542A3 (fr) Electrode de dispositifs electrochimiques/electrocommandables
TW200634671A (en) Optically variable element comprising an electrically active layer
SG142140A1 (en) Display device and method of manufacturing thereof
WO2008023980A3 (fr) Barrière d'étanchéité sur un dispositif flexible
WO2005119803A3 (fr) Encapsulation de dispositifs oled
WO2008029060A3 (fr) Substrat pour dispositif electroluminescent organique, utilisation et procede de fabrication de ce substrat, ainsi que dispositif electroluminescent organique.
WO2009006110A3 (fr) Dispositifs photovoltaïques avec éléments de couvercle et systèmes photovoltaïques, réseaux, toits, et méthodes d'utilisation
TW200629618A (en) Electronic devices and processes for forming electronic devices
MXPA03006682A (es) Substrato transparente provisto con un electrodo.
WO2003106329A3 (fr) Dispositif micro-electromecanique avec blindage conducteur integre
TW200608303A (en) External package capable of being radio-tagged
TW200737506A (en) Semiconductor device and manufacturing method of the same
WO2008012461A3 (fr) Dispositif actif à propriétés énergétiques/optiques variables
EP1892831A4 (fr) Dispositif piézoélectrique et son procédé de fabrication
WO2008093414A1 (fr) Dispositif semi-conducteur et son procédé de fabrication
ATE518804T1 (de) Flexibler, mehrschichtiger getter
TW200709476A (en) Side view LED with improved arrangement of protection device
TW200731850A (en) Organic light-emitting transistor element and method for manufacturing the same
EP1536494A3 (fr) Dispositif d'affichage électroluminescent organique
WO2005043585A3 (fr) Structures de diode electroluminescente organique (oled) a couche barriere et relaxation de contraintes
WO2005089452A3 (fr) Isolant de fil de connexion cathodique
WO2011030283A3 (fr) Dispositifs d'oled dotés d'un cache de protection
WO2006089128A3 (fr) Composants photoniques extremement fiables presentant des facettes gravees

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200780035697.4

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07823615

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2009521309

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

REEP Request for entry into the european phase

Ref document number: 2007823615

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2007823615

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: RU

WWE Wipo information: entry into national phase

Ref document number: 1020097004450

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 12375217

Country of ref document: US