WO2008012460A3 - Dispositif électroluminescent encapsulé - Google Patents
Dispositif électroluminescent encapsulé Download PDFInfo
- Publication number
- WO2008012460A3 WO2008012460A3 PCT/FR2007/051697 FR2007051697W WO2008012460A3 WO 2008012460 A3 WO2008012460 A3 WO 2008012460A3 FR 2007051697 W FR2007051697 W FR 2007051697W WO 2008012460 A3 WO2008012460 A3 WO 2008012460A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- protective
- substrate
- electrodes
- metallic part
- electroluminescent
- Prior art date
Links
- 230000001681 protective effect Effects 0.000 abstract 7
- 239000000758 substrate Substances 0.000 abstract 4
- 239000011521 glass Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10541—Functional features of the laminated safety glass or glazing comprising a light source or a light guide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10761—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/1077—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing polyurethane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2068—Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
- H01G9/2077—Sealing arrangements, e.g. to prevent the leakage of the electrolyte
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07823615A EP2047540A2 (fr) | 2006-07-28 | 2007-07-20 | Dispositif électroluminescent encapsulé |
CN2007800356974A CN101517771B (zh) | 2006-07-28 | 2007-07-20 | 封装发光器件 |
US12/375,217 US8395319B2 (en) | 2006-07-28 | 2007-07-20 | Encapsulated light-emmitting device |
KR1020097004450A KR101409885B1 (ko) | 2006-07-28 | 2007-07-20 | 캡슐봉입된 전계 발광 장치 |
JP2009521309A JP5372752B2 (ja) | 2006-07-28 | 2007-07-20 | 封入発光素子 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0653172 | 2006-07-28 | ||
FR0653172A FR2904508B1 (fr) | 2006-07-28 | 2006-07-28 | Dispositif electroluminescent encapsule |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008012460A2 WO2008012460A2 (fr) | 2008-01-31 |
WO2008012460A3 true WO2008012460A3 (fr) | 2008-03-13 |
Family
ID=37668308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2007/051697 WO2008012460A2 (fr) | 2006-07-28 | 2007-07-20 | Dispositif électroluminescent encapsulé |
Country Status (7)
Country | Link |
---|---|
US (1) | US8395319B2 (fr) |
EP (1) | EP2047540A2 (fr) |
JP (1) | JP5372752B2 (fr) |
KR (1) | KR101409885B1 (fr) |
CN (1) | CN101517771B (fr) |
FR (1) | FR2904508B1 (fr) |
WO (1) | WO2008012460A2 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107208874A (zh) * | 2015-02-05 | 2017-09-26 | 飞利浦灯具控股公司 | Led模块及密封方法 |
CN110951410B (zh) * | 2010-11-02 | 2022-05-31 | Lg化学株式会社 | 粘合膜和使用其包封有机电子装置的方法 |
Families Citing this family (96)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100110728A1 (en) * | 2007-03-19 | 2010-05-06 | Nanosys, Inc. | Light-emitting diode (led) devices comprising nanocrystals |
KR101056197B1 (ko) * | 2008-10-29 | 2011-08-11 | 삼성모바일디스플레이주식회사 | 발광 표시 장치 및 그의 제조 방법 |
KR20110034649A (ko) * | 2008-07-02 | 2011-04-05 | 세인트-고베인 퍼포먼스 플라스틱스 코포레이션 | 프레임 장치, 시일, 및 이들을 제조하기 위한 방법 |
US20110146793A1 (en) * | 2008-07-02 | 2011-06-23 | Saint-Gobain Performance Plastics Chaineux | Framed device, seal, and method for manufacturing same |
JP5170020B2 (ja) * | 2008-10-03 | 2013-03-27 | セイコーエプソン株式会社 | 有機el装置及び電子機器 |
US8102119B2 (en) * | 2008-12-17 | 2012-01-24 | General Electric Comapny | Encapsulated optoelectronic device and method for making the same |
US8350470B2 (en) | 2008-12-17 | 2013-01-08 | General Electric Company | Encapsulation structures of organic electroluminescence devices |
US8847480B2 (en) * | 2009-03-18 | 2014-09-30 | Semiconductor Energy Laboratory Co., Ltd. | Lighting device |
US20100294526A1 (en) * | 2009-05-21 | 2010-11-25 | General Electric Company | Hermetic electrical package |
JP5533073B2 (ja) * | 2010-03-16 | 2014-06-25 | セイコーエプソン株式会社 | 電気光学装置、および照明装置 |
JP5672669B2 (ja) * | 2009-07-06 | 2015-02-18 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
CN102598345B (zh) * | 2009-09-11 | 2015-11-25 | 皇家飞利浦电子股份有限公司 | 具有保护覆盖物的oled器件 |
CN102157512B (zh) * | 2009-11-30 | 2015-07-22 | 精材科技股份有限公司 | 芯片封装体及其形成方法 |
ES2642386T3 (es) * | 2009-12-18 | 2017-11-16 | Arcelormittal | Dispositivo electroluminiscente de gran superficie comprendiendo diodos electroluminiscentes orgánicos |
US8253329B2 (en) * | 2010-01-21 | 2012-08-28 | General Electric Company | Enhanced edge seal design for organic light emitting diode (OLED) encapsulation |
KR101073564B1 (ko) * | 2010-02-02 | 2011-10-17 | 삼성모바일디스플레이주식회사 | 유기 발광 표시장치 및 이의 제조방법 |
US8154183B2 (en) * | 2010-03-04 | 2012-04-10 | General Electric Company | Mitigating shorting risks in encapsulated organic light emitting devices (OLEDs) |
JP2011192567A (ja) * | 2010-03-16 | 2011-09-29 | Rohm Co Ltd | 有機el装置 |
US8617638B2 (en) | 2010-04-22 | 2013-12-31 | Dennis Michael Hill | Method of manufacturing photoluminescent pavers at a paver manufacturing facility |
FR2959963B1 (fr) * | 2010-05-12 | 2015-04-24 | Michelin Soc Tech | Objet pneumatique pourvu d'une couche etanche aux gaz a base d'un elastomere thermoplastique et d'un thermoplastique |
KR20110125931A (ko) * | 2010-05-14 | 2011-11-22 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
FR2961916B1 (fr) * | 2010-06-25 | 2013-04-12 | Saint Gobain | Vitrage feuillete a diffusion variable par cristaux liquides, son procede de fabrication et dispositif pour sa fabrication |
US9035545B2 (en) * | 2010-07-07 | 2015-05-19 | Lg Chem, Ltd. | Organic light emitting device comprising encapsulating structure |
JP5611460B2 (ja) * | 2010-07-08 | 2014-10-22 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 弾性電極を有するオプトエレクトロニクス装置およびその製造方法 |
KR101947194B1 (ko) * | 2010-07-16 | 2019-02-12 | 오엘이디워크스 게엠베하 | Oled 장치 및 이를 제조하는 방법 |
CN106887522B (zh) | 2010-07-26 | 2018-09-18 | 默克专利有限公司 | 包含纳米晶体的器件 |
JP5412634B2 (ja) * | 2010-09-14 | 2014-02-12 | 後藤電子 株式会社 | 有機el表示装置および有機el照明装置 |
KR101769586B1 (ko) * | 2010-09-24 | 2017-08-21 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치 |
CN103299448B (zh) * | 2010-09-29 | 2016-09-07 | Posco公司 | 使用辊形状母基板的柔性电子器件的制造方法、柔性电子器件及柔性基板 |
US8434904B2 (en) * | 2010-12-06 | 2013-05-07 | Guardian Industries Corp. | Insulated glass units incorporating emitters, and/or methods of making the same |
TW201242414A (en) * | 2011-01-25 | 2012-10-16 | Panasonic Corp | Planate light emitting device |
EP2675524B1 (fr) | 2011-02-14 | 2017-05-10 | Merck Patent GmbH | Dispositif et procédé de traitement de cellules et de tissu cellulaire |
WO2012126566A1 (fr) | 2011-03-24 | 2012-09-27 | Merck Patent Gmbh | Matériaux fonctionnels ioniques organiques |
EP2693841B1 (fr) | 2011-03-29 | 2021-08-18 | HotaluX, Ltd | Dispositif électroluminescent organique, procédé de fabrication associé, et dispositif d'éclairage électroluminescent organique |
EP2707911B1 (fr) | 2011-05-12 | 2017-07-05 | Merck Patent GmbH | Compositions et dispositifs électroniques |
CN102278623B (zh) * | 2011-05-13 | 2013-07-31 | 严为民 | 一种搪瓷电致发光板边缘结构及其制作方法 |
FR2976730B1 (fr) | 2011-06-17 | 2013-12-06 | Astron Fiamm Safety | Delo encapsulee en colle pleine plaque avec un capot troue |
DE102011079014A1 (de) * | 2011-07-12 | 2013-01-17 | Ledon Oled Lighting Gmbh & Co. Kg | Leuchtmodul mit reduziertem Flächenbedarf |
CN103733724B (zh) * | 2011-08-04 | 2017-05-17 | 3M创新有限公司 | 边缘受保护的阻隔组件 |
KR101911581B1 (ko) * | 2011-08-04 | 2018-10-24 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 에지 보호된 배리어 조립체 |
US20140283910A1 (en) * | 2011-08-04 | 2014-09-25 | 3M Innovative Properties Company | Edge protected barrier assemblies |
EP2740326A4 (fr) * | 2011-08-04 | 2015-05-20 | 3M Innovative Properties Co | Ensembles barrière à bords protégés |
US20140290736A1 (en) * | 2011-08-04 | 2014-10-02 | 3M Innovative Properties Company | Barrier assemblies |
US20120175667A1 (en) * | 2011-10-03 | 2012-07-12 | Golle Aaron J | Led light disposed on a flexible substrate and connected with a printed 3d conductor |
KR101219351B1 (ko) * | 2011-11-30 | 2013-01-22 | 현대자동차주식회사 | 염료감응 태양전지 모듈 및 그 제조방법 |
KR20130065219A (ko) * | 2011-12-09 | 2013-06-19 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
DE102012201801A1 (de) | 2012-02-07 | 2013-08-08 | Osram Opto Semiconductors Gmbh | Organische leuchtdiode und vorrichtung mit einer organischen leuchtdiode |
WO2013124766A1 (fr) * | 2012-02-21 | 2013-08-29 | Koninklijke Philips N.V. | Élément luminaire |
CN103325808B (zh) * | 2012-03-19 | 2016-06-08 | 群康科技(深圳)有限公司 | 显示装置及其制造方法 |
DE102012207229B4 (de) * | 2012-05-02 | 2020-06-04 | Osram Oled Gmbh | Elektronisches Bauelement und Verfahren zum Herstellen eines elektronischen Bauelements |
JP5984495B2 (ja) * | 2012-05-09 | 2016-09-06 | 株式会社カネカ | 有機el装置、有機el装置の製造方法、及び有機elモジュール |
WO2014003196A1 (fr) * | 2012-06-29 | 2014-01-03 | コニカミノルタ株式会社 | Dispositif électronique et procédé de fabrication |
BR112015001314B1 (pt) * | 2012-08-01 | 2021-12-21 | Saint-Gobain Glass France | Painel compósito com meios de contato elétrico e método para produzir painel compósito |
US9625764B2 (en) | 2012-08-28 | 2017-04-18 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic device |
KR20140029202A (ko) * | 2012-08-28 | 2014-03-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
KR102161078B1 (ko) | 2012-08-28 | 2020-09-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 그 제작 방법 |
FR2998096B1 (fr) * | 2012-11-14 | 2015-01-30 | Astron Fiamm Safety | Connexion electrique d'un dispositif oled |
BE1024011B1 (fr) * | 2012-11-29 | 2017-10-27 | Agc Glass Europe | Dispositif organique électronique ou optoélectronique laminé |
KR20150143638A (ko) | 2013-04-15 | 2015-12-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 |
DE102013106855B4 (de) * | 2013-07-01 | 2017-10-12 | Osram Oled Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement unter Verwendung einer flüssigen ersten Legierung |
CN103383992B (zh) * | 2013-08-13 | 2015-12-02 | 深圳市华星光电技术有限公司 | Oled器件的封装方法及用该方法封装的oled器件 |
US10008689B2 (en) * | 2013-09-27 | 2018-06-26 | Boe Technology Group Co., Ltd. | Display panel, display device and method of manufacturing display panel |
DE102013111409B4 (de) * | 2013-10-16 | 2019-12-05 | Osram Oled Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
KR102249051B1 (ko) * | 2014-05-19 | 2021-05-10 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
US20150372251A1 (en) * | 2014-06-19 | 2015-12-24 | Toshishige Fujii | Electric element package |
JP6439188B2 (ja) * | 2014-06-27 | 2018-12-19 | 株式会社Joled | 有機el表示パネル及び有機el表示装置 |
EP3179832B1 (fr) * | 2014-08-08 | 2018-09-12 | Kaneka Corporation | Panneau luminescent plan et chemise élastique |
JP2016072127A (ja) | 2014-09-30 | 2016-05-09 | ソニー株式会社 | 有機el表示装置およびその製造方法、並びに電子機器 |
US10297572B2 (en) * | 2014-10-06 | 2019-05-21 | Mc10, Inc. | Discrete flexible interconnects for modules of integrated circuits |
US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
CN104834399B (zh) * | 2015-04-15 | 2018-06-22 | 业成光电(深圳)有限公司 | 触控显示模组 |
KR102392671B1 (ko) * | 2015-05-11 | 2022-04-29 | 삼성디스플레이 주식회사 | 가요성 표시 장치 |
CN104916789B (zh) | 2015-06-30 | 2018-02-16 | 京东方科技集团股份有限公司 | 一种oled封装方法及oled器件 |
CN105244365B (zh) | 2015-11-18 | 2018-09-25 | 上海天马有机发光显示技术有限公司 | 显示装置、制造方法及显示设备 |
EP3455326B1 (fr) | 2016-05-11 | 2021-02-24 | Merck Patent GmbH | Compositions pour cellules électrochimiques |
KR102554290B1 (ko) * | 2016-05-23 | 2023-07-13 | 삼성디스플레이 주식회사 | 표시 장치 |
JP6938131B2 (ja) * | 2016-11-01 | 2021-09-22 | パイオニア株式会社 | 発光素子及び発光システム |
US10141215B2 (en) | 2016-11-03 | 2018-11-27 | Rohinni, LLC | Compliant needle for direct transfer of semiconductor devices |
US10504767B2 (en) | 2016-11-23 | 2019-12-10 | Rohinni, LLC | Direct transfer apparatus for a pattern array of semiconductor device die |
US10471545B2 (en) | 2016-11-23 | 2019-11-12 | Rohinni, LLC | Top-side laser for direct transfer of semiconductor devices |
CN108206196A (zh) * | 2016-12-16 | 2018-06-26 | 京东方科技集团股份有限公司 | 一种有机电致发光显示装置 |
US10062588B2 (en) | 2017-01-18 | 2018-08-28 | Rohinni, LLC | Flexible support substrate for transfer of semiconductor devices |
KR20190034368A (ko) * | 2017-09-22 | 2019-04-02 | 삼성디스플레이 주식회사 | 백라이트 유닛 및 이를 포함하는 표시 장치 |
CN109727530A (zh) * | 2017-10-31 | 2019-05-07 | 昆山工研院新型平板显示技术中心有限公司 | 柔性显示模组及柔性显示模组制备方法 |
CN107768418B (zh) * | 2017-11-02 | 2019-05-03 | 武汉华星光电技术有限公司 | 有机发光显示装置及其封装方法 |
CN108281566B (zh) * | 2018-01-03 | 2020-04-10 | 深圳市华星光电半导体显示技术有限公司 | Oled面板及其制作方法 |
KR102420438B1 (ko) * | 2018-01-08 | 2022-07-14 | 삼성디스플레이 주식회사 | 표시 장치 및 휴대용 단말기 |
US10410905B1 (en) | 2018-05-12 | 2019-09-10 | Rohinni, LLC | Method and apparatus for direct transfer of multiple semiconductor devices |
CN108877521A (zh) * | 2018-06-28 | 2018-11-23 | 京东方科技集团股份有限公司 | 信息显示器和信息显示装置 |
US11094571B2 (en) | 2018-09-28 | 2021-08-17 | Rohinni, LLC | Apparatus to increase transferspeed of semiconductor devices with micro-adjustment |
CN109860432B (zh) * | 2018-12-17 | 2021-01-15 | 深圳市华星光电技术有限公司 | 显示器封装结构及其制造方法 |
KR20200132150A (ko) * | 2019-05-15 | 2020-11-25 | 삼성전자주식회사 | 폴더블 전자 장치 |
JP2021064520A (ja) * | 2019-10-15 | 2021-04-22 | セイコーエプソン株式会社 | 発光装置および電子機器 |
KR20220142269A (ko) * | 2021-04-14 | 2022-10-21 | 삼성전자주식회사 | 회로 기판과 결합된 쉴딩 부재 및 이를 포함하는 전자 장치 |
FR3122482B1 (fr) * | 2021-04-29 | 2023-06-30 | Was Light | Module électroluminescent pour signalisation routière horizontale |
CN117334644B (zh) * | 2023-11-29 | 2024-02-13 | 四川弘智远大科技有限公司 | 一种集成电路封装的实时固化结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5189405A (en) * | 1989-01-26 | 1993-02-23 | Sharp Kabushiki Kaisha | Thin film electroluminescent panel |
US20020068191A1 (en) * | 2000-09-27 | 2002-06-06 | Seiko Epson Corporation | Organic electroluminescent device, method for manufacturing organic electroluminescent device, and electronic apparatus |
WO2002067342A2 (fr) * | 2001-02-16 | 2002-08-29 | Universal Display Corporation | Region barriere amelioree pour dispositifs optoelectroniques |
US20040120155A1 (en) * | 2001-04-17 | 2004-06-24 | Ryoma Suenaga | Light-emitting apparatus |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6383797A (ja) | 1986-09-29 | 1988-04-14 | 株式会社東芝 | 表示文字属性制御装置 |
JPH0422558Y2 (fr) * | 1986-11-21 | 1992-05-22 | ||
JPH03192688A (ja) * | 1989-12-21 | 1991-08-22 | Nippon Kasei Kk | 分散型電界発光素子の製造方法 |
JP3755252B2 (ja) * | 1997-08-21 | 2006-03-15 | 三菱化学株式会社 | 有機電界発光素子及びその製造方法 |
JPH11219782A (ja) | 1998-01-30 | 1999-08-10 | Hokuriku Electric Ind Co Ltd | El素子とその製造方法 |
JP2000156170A (ja) * | 1998-11-19 | 2000-06-06 | Mitsubishi Electric Corp | ガス放電表示パネル及びその製造方法 |
US6204906B1 (en) * | 1999-03-22 | 2001-03-20 | Lawrence E. Tannas, Jr. | Methods of customizing the physical size and shape of commercial off-the-shelf (COTS) electronic displays |
KR100682561B1 (ko) * | 1999-03-25 | 2007-02-15 | 닛폰 이타가라스 가부시키가이샤 | 유리 패널 및 그 제조 방법 |
JP3942770B2 (ja) * | 1999-09-22 | 2007-07-11 | 株式会社半導体エネルギー研究所 | El表示装置及び電子装置 |
JP2002093573A (ja) * | 2000-09-14 | 2002-03-29 | Nisshin Steel Co Ltd | 有機el素子用絶縁性封止部材 |
FR2815374B1 (fr) * | 2000-10-18 | 2003-06-06 | Saint Gobain | Vitrage feuillete et ses moyens d'etancheification peripherique |
EP1280179A3 (fr) * | 2001-07-23 | 2003-09-03 | Asahi Glass Company Ltd. | Panneau d'affichage plat |
US6936131B2 (en) * | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
JP2003317938A (ja) * | 2002-04-25 | 2003-11-07 | Harison Toshiba Lighting Corp | 有機エレクトロルミネッセンス発光装置 |
JP2003317940A (ja) * | 2002-04-25 | 2003-11-07 | Harison Toshiba Lighting Corp | 有機エレクトロルミネッセンス発光装置 |
US20060087224A1 (en) * | 2002-04-25 | 2006-04-27 | Harison Toshiba Lighting Corporation | Organic electroluminescence light-emitting device |
JP2003334911A (ja) * | 2002-05-21 | 2003-11-25 | Mitsubishi Polyester Film Copp | ディスプレイ表面保護フィルム |
JP4254154B2 (ja) | 2002-08-13 | 2009-04-15 | パナソニック電工株式会社 | 有機電界発光素子の封止方法 |
CN1891014A (zh) * | 2003-12-09 | 2007-01-03 | 日本板硝子株式会社 | 面发光体及其制造方法 |
-
2006
- 2006-07-28 FR FR0653172A patent/FR2904508B1/fr not_active Expired - Fee Related
-
2007
- 2007-07-20 WO PCT/FR2007/051697 patent/WO2008012460A2/fr active Application Filing
- 2007-07-20 KR KR1020097004450A patent/KR101409885B1/ko not_active IP Right Cessation
- 2007-07-20 EP EP07823615A patent/EP2047540A2/fr not_active Withdrawn
- 2007-07-20 US US12/375,217 patent/US8395319B2/en not_active Expired - Fee Related
- 2007-07-20 CN CN2007800356974A patent/CN101517771B/zh not_active Expired - Fee Related
- 2007-07-20 JP JP2009521309A patent/JP5372752B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5189405A (en) * | 1989-01-26 | 1993-02-23 | Sharp Kabushiki Kaisha | Thin film electroluminescent panel |
US20020068191A1 (en) * | 2000-09-27 | 2002-06-06 | Seiko Epson Corporation | Organic electroluminescent device, method for manufacturing organic electroluminescent device, and electronic apparatus |
WO2002067342A2 (fr) * | 2001-02-16 | 2002-08-29 | Universal Display Corporation | Region barriere amelioree pour dispositifs optoelectroniques |
US20040120155A1 (en) * | 2001-04-17 | 2004-06-24 | Ryoma Suenaga | Light-emitting apparatus |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110951410B (zh) * | 2010-11-02 | 2022-05-31 | Lg化学株式会社 | 粘合膜和使用其包封有机电子装置的方法 |
CN107208874A (zh) * | 2015-02-05 | 2017-09-26 | 飞利浦灯具控股公司 | Led模块及密封方法 |
CN107208874B (zh) * | 2015-02-05 | 2020-02-18 | 飞利浦灯具控股公司 | Led模块及密封方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101517771B (zh) | 2012-07-25 |
KR101409885B1 (ko) | 2014-06-20 |
FR2904508A1 (fr) | 2008-02-01 |
WO2008012460A2 (fr) | 2008-01-31 |
US8395319B2 (en) | 2013-03-12 |
JP2009545113A (ja) | 2009-12-17 |
US20090302760A1 (en) | 2009-12-10 |
JP5372752B2 (ja) | 2013-12-18 |
KR20090039817A (ko) | 2009-04-22 |
EP2047540A2 (fr) | 2009-04-15 |
CN101517771A (zh) | 2009-08-26 |
FR2904508B1 (fr) | 2014-08-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2008012460A3 (fr) | Dispositif électroluminescent encapsulé | |
WO2009021741A3 (fr) | Composants électroniques organiques | |
WO2007000542A3 (fr) | Electrode de dispositifs electrochimiques/electrocommandables | |
TW200634671A (en) | Optically variable element comprising an electrically active layer | |
SG142140A1 (en) | Display device and method of manufacturing thereof | |
WO2008023980A3 (fr) | Barrière d'étanchéité sur un dispositif flexible | |
WO2005119803A3 (fr) | Encapsulation de dispositifs oled | |
WO2008029060A3 (fr) | Substrat pour dispositif electroluminescent organique, utilisation et procede de fabrication de ce substrat, ainsi que dispositif electroluminescent organique. | |
WO2009006110A3 (fr) | Dispositifs photovoltaïques avec éléments de couvercle et systèmes photovoltaïques, réseaux, toits, et méthodes d'utilisation | |
TW200629618A (en) | Electronic devices and processes for forming electronic devices | |
MXPA03006682A (es) | Substrato transparente provisto con un electrodo. | |
WO2003106329A3 (fr) | Dispositif micro-electromecanique avec blindage conducteur integre | |
TW200608303A (en) | External package capable of being radio-tagged | |
TW200737506A (en) | Semiconductor device and manufacturing method of the same | |
WO2008012461A3 (fr) | Dispositif actif à propriétés énergétiques/optiques variables | |
EP1892831A4 (fr) | Dispositif piézoélectrique et son procédé de fabrication | |
WO2008093414A1 (fr) | Dispositif semi-conducteur et son procédé de fabrication | |
ATE518804T1 (de) | Flexibler, mehrschichtiger getter | |
TW200709476A (en) | Side view LED with improved arrangement of protection device | |
TW200731850A (en) | Organic light-emitting transistor element and method for manufacturing the same | |
EP1536494A3 (fr) | Dispositif d'affichage électroluminescent organique | |
WO2005043585A3 (fr) | Structures de diode electroluminescente organique (oled) a couche barriere et relaxation de contraintes | |
WO2005089452A3 (fr) | Isolant de fil de connexion cathodique | |
WO2011030283A3 (fr) | Dispositifs d'oled dotés d'un cache de protection | |
WO2006089128A3 (fr) | Composants photoniques extremement fiables presentant des facettes gravees |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200780035697.4 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07823615 Country of ref document: EP Kind code of ref document: A2 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009521309 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2007823615 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007823615 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: RU |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020097004450 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12375217 Country of ref document: US |