WO2007102482A1 - 実装方法、電気部品付き基板及び電気装置 - Google Patents

実装方法、電気部品付き基板及び電気装置 Download PDF

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Publication number
WO2007102482A1
WO2007102482A1 PCT/JP2007/054267 JP2007054267W WO2007102482A1 WO 2007102482 A1 WO2007102482 A1 WO 2007102482A1 JP 2007054267 W JP2007054267 W JP 2007054267W WO 2007102482 A1 WO2007102482 A1 WO 2007102482A1
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WIPO (PCT)
Prior art keywords
electrical component
adhesive layer
substrate
radiation
electrical
Prior art date
Application number
PCT/JP2007/054267
Other languages
English (en)
French (fr)
Inventor
Kazutaka Furuta
Shiyuki Kanisawa
Masaki Taniguchi
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to CN2007800079609A priority Critical patent/CN101395710B/zh
Priority to KR1020087024412A priority patent/KR101088577B1/ko
Priority to EP07715235A priority patent/EP1993124A4/en
Publication of WO2007102482A1 publication Critical patent/WO2007102482A1/ja
Priority to US12/230,741 priority patent/US20090039291A1/en
Priority to HK09105327.4A priority patent/HK1127960A1/xx

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a mounting method for mounting an electrical component on a substrate.
  • an adhesive has been used for mounting an electrical component such as a semiconductor element.
  • the adhesive When an electrical component is mounted using an adhesive, the adhesive is sandwiched between the substrate and the electrical component, and a pressing head is pressed against the electrical component and pressed.
  • a hard head made of metal or ceramic is used as the pressing head, but an elastic head having an elastic body (pressing rubber) such as a silicon rubber may be used.
  • pressing rubber such as a silicon rubber
  • the adhesive contains a thermosetting resin
  • the adhesive is heated to the extent that it is semi-cured before pressing the electrical component with the elastic head, the semi-cured adhesive Since the electrical components are fixed, displacement can be prevented to some extent. However, even when using this method, the electrical components were displaced by about 25 ⁇ m.
  • Patent Document 1 Japanese Patent Laid-Open No. 11-45904
  • Patent Document 2 JP 2000-105388 A
  • Patent Document 3 Japanese Patent Laid-Open No. 2005-32952
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a mounting method capable of mounting electrical components with high accuracy. Means for solving the problem
  • the present invention uses an adhesive layer containing a thermosetting resin and a radiation-curable resin, and uses the adhesive layer, the substrate, and the electrical component.
  • the adhesive layer is located between the substrate and the electric component, and a part of the adhesive layer protrudes outside the edge of the electric component, and the adhesive layer protrudes into the protruding portion.
  • the present invention is a mounting method, wherein the radiation does not transmit the electrical component and has a wavelength that is not transmitted, and the radiation is applied from a surface of the substrate on which the electrical component is disposed, In this mounting method, the radiation is incident on the electrical component together with the protruding portion.
  • the present invention is a mounting method, wherein an adhesive layer having a larger planar shape than a planar shape of the electrical component is used, and when the adhesive layer is positioned between the substrate and the electrical component, the protrusion is caused.
  • This is a mounting method in which the edge of the electrical component is enclosed by a portion.
  • the present invention is a substrate with an electrical component in which an electrical component is temporarily fixed by an adhesive layer, and the adhesive layer contains a radiation curable resin and a thermosetting resin, and one of the adhesive layers.
  • the portion is located between the substrate and the electrical component, the other part protrudes outside the edge of the electrical component, and the portion of the adhesive layer that protrudes outside the edge of the electrical component is It is a substrate with an electrical component containing a photopolymerized product of radiation curable resin polymerized by irradiation.
  • the present invention is an electrical device in which an electrical component is fixed to a substrate with an adhesive layer, wherein the adhesive layer contains a radiation curable resin and a thermosetting resin, and part of the electrical device Located between the component and the substrate, the other part protrudes outside the edge of the electrical component, and the portion of the adhesive layer that protrudes outside the edge of the electrical component is the radiation curing.
  • the part of the adhesive layer between the electrical component and the substrate contains a thermal polymer obtained by polymerizing the thermosetting resin by heating. It is an electric device.
  • the present invention is configured as described above, and the substrate with an electrical component heat-presses the adhesive layer. Before pressing, the electrical component is temporarily fixed to the substrate by the portion of the adhesive layer located between the electrical component and the substrate.
  • thermosetting resin of thermosetting resin is generated, and the part directly behind the electric part of the adhesive layer and the part protruding outside the edge of the electric part are not It contains a thermosetting resin prior to thermal polymerization.
  • the portion that protrudes outside the edge of the adhesive layer contains a photocured resin of radiation curable resin, but the portion directly behind the electrical component is the radiation curable resin before photopolymerization. Including! Since the radiation curable resin and the thermosetting resin are not polymerized at the back of the electrical component, the electrical component temporarily weakened to the substrate can be peeled off from the substrate.
  • the electrical device of the present invention is in a state after heating the substrate with the electrical component, and the thermosetting resin contained in the adhesive layer has a portion protruding outward from the edge of the electrical component; Both the part between the board and the electrical component becomes a thermal polymer, and the entire adhesive layer is cured, but the part of the cured adhesive layer between the electrical part and the board is photopolymerized. Contains uncured radiation curable resin.
  • the electrical components are mechanically connected, the electrical components are not misaligned! /, So that a highly reliable electrical device can be obtained.
  • the portion of the adhesive layer located on the back side of the electrical component is not polymerized with radiation-curing resin and has high fluidity. Compared with the case of semi-curing, the terminal of the electrical component can be brought into contact with the land of the board with a small pressing force.
  • FIG. L (a) to (d): Cross-sectional views illustrating the mounting method of the present invention
  • FIG. 2 is a cross-sectional view illustrating an electric device
  • FIG. 3 (a): Plan view showing the state before irradiation, (b): Plan view showing the state after irradiation
  • FIG. 5 is a sectional view for explaining another example of the mounting method of the present invention. Explanation of symbols
  • Reference numeral 10 in FIG. 1 (a) shows an example of a substrate used in the present invention, and the substrate 10 is a substrate body.
  • One or a plurality of mounting regions 14 on which electric components to be described later are mounted are provided on the surface of the substrate 10, and the lands 12 are arranged in the mounting regions 14, respectively.
  • the substrate 10 is disposed on the pressing table 35 with the surface on which the land 12 is disposed facing upward, and in each mounting region 14, an adhesive film cut out from the original film of the adhesive film An adhesive layer 20 consisting of a small piece is placed.
  • the adhesive layer 20 includes a binder 21 and conductive particles 22 dispersed in the binder 21, and the binder 21 includes a thermosetting resin, a radiation curable resin, and a thermoplastic resin. Contains.
  • Adhesive layer 20 contains thermoplastic resin and has adhesive properties even at room temperature.
  • the adhesive layer 20 When the adhesive layer 20 is pressed lightly against the substrate 10, the adhesive layer 20 is
  • the size of the electrical component mounted in each mounting region 14 is determined, and the size of the adhesive layer 20 attached to each mounting region 14 is the size of the electrical component mounted in the mounting region 14 It is cut out larger than the size, and the adhesive layer 20 protrudes from the periphery of the electrical component when the electrical component is placed on the adhesive layer 20 after alignment as described later.
  • Reference numeral 15 in FIG. 1 (b) denotes an electrical component such as a semiconductor element.
  • the electrical component 15 includes a component body 16 and a terminal 17 disposed on the bottom surface of the component body 16. Yes.
  • the electrical component 15 is held by a mounting head (not shown), and the bottom surface on which the terminal 17 is disposed is directed downward, and is disposed on the corresponding mounting region 14. After the mounting head is moved and aligned so that the terminals 17 are positioned directly above the lands 12 of the corresponding mounting area 14, the mounting head is lowered to bring the electrical component 15 into contact with the adhesive layer 20.
  • this mounting head or other When the electrical component 15 is pressed against the adhesive layer 20 with the crimping head and the bottom surface of the electrical component 15 is brought into close contact with the adhesive layer 20, the electrical component 15 is adhered to the substrate 10 by the adhesive layer 20 and temporarily fixed.
  • the adhesive in the state after the first temporary fixing step is the first temporary fixing step
  • the thermosetting resin and radiation curable resin in layer 20 are not polymerized and the mechanical strength of adhesive layer 20 is weak, so if realignment is performed or if electrical component 15 is defective, It is possible to peel the part 15 from the adhesive layer 20.
  • the adhesive layer 20 protrudes around the electrical component 15, when the electrical component 15 is temporarily fixed, the adhesive layer 20 does not protrude from the edge of the electrical component 15.
  • the protruding part 26 that protrudes surrounds the entire circumference of the electrical component 15 (Fig. 3 (a)).
  • a light source 28 is disposed above the substrate 10 on which the electrical component 15 is temporarily fixed.
  • the light source 28 is configured to emit radiation 29 having a wavelength that does not pass through the electrical component 15.When the radiation 29 is emitted from the light source 28 toward the surface of the substrate 10 where the electrical component 15 is disposed, the light source 28 protrudes. Radiation 29 enters part 26 (Fig. 1 (c))
  • the radiation curable resin in the node 21 is polymerized with light of a predetermined wavelength region, and the wavelength region includes the wavelength of the radiation 29.
  • the radiation curable resin is photopolymerized to produce a photopolymerized product.
  • the adhesive layer 20 is bonded to the substrate 10, and the radiation curable resin is photopolymerized while the protruding portion 26 is in close contact with the substrate 10. Therefore, the radiation curable resin in the protruding portion 26
  • the photopolymer is fixed to the substrate 10, and the electrical component 15 is fixed to the substrate 10 by generating the photopolymer at the protruding portion 26.
  • the radiation 29 is an electrical component in the second temporary fixing step. Although it is also incident on 15, the radiation 29 is absorbed or reflected without passing through the electrical component 15. Therefore, the radiation curable resin in the portion of the adhesive layer 20 located directly behind the electrical component 15 is not photopolymerized.
  • Reference numeral 2 in FIG. 1 (d) and FIG. 3 (b) denotes a substrate with electrical components after the second temporary fixing step.
  • a pressing head 30 is disposed above the substrate 2 with electrical parts.
  • a rubber or metal abutting portion 32 is provided on one surface of the pressing head 30, and the pressing head 30 is lowered to bring the abutting portion 32 into contact with the electrical component 15, so that the pressing head 30 Is further lowered to press the electric component 15, and a pressing force is applied between the electric component 15 and the substrate 10.
  • the radiation 29 is not irradiated on the backside of the electrical component 15, and the part on the backside of the adhesive layer 20a does not contain a photopolymerized radiation curable resin. Therefore, the fluidity of the binder 21 is maintained in the portion of the adhesive layer 20a located directly behind the electrical component 15, and the binder 21 is pushed away by the pressing force.
  • thermoplastic resin in the binder 21 softens and becomes more fluid, so that the binder 21 is pushed away with a small pressing force.
  • the protruding portion 26 has a photopolymer of radiation curable resin inside fixed to the substrate 10, and the protruding portion 26 is located around the electrical component 15.
  • the electric component 15 is pushed away, the electric component 15 is pushed right below without being displaced regardless of the direction in which the electric component 15 moves horizontally.
  • the terminal 17 Since the terminal 17 is located immediately above the land 12, when the electrical component 15 is pressed directly below without being displaced, the terminal 17 is brought into contact with the land 12 directly or via the conductive particles 22, The electrical component 15 and the substrate 10 are electrically connected.
  • the pressing head 30 is provided with a heating means 33, and the contact portion 32 is heated by the heating means 33, and the adhesive layer 20a is heated by heat conduction, and the temperature of the thermosetting resin exceeds the curing temperature.
  • the temperature is raised to 1
  • the thermosetting resin in the binders 21 and 27 is polymerized by heating to become a thermopolymer, and the electrical component 15 and the substrate 10 are fixed in an electrically connected state.
  • Reference numeral 1 in FIG. 2 indicates an electrical device in which the electrical component 15 is fixed by the adhesive layer 25 in which the thermal polymer is generated.
  • the substrate 10 and the electrical component 15 are electrically connected. Not only V, but also mechanically connected by an adhesive layer 25!
  • thermosetting resin of the binder 24 is thermally polymerized while the adhesive layer 25 is in close contact with the electrical component 15, so that the electrical component 15 and the electrical substrate 10 Are firmly connected. Therefore, the electrical component 15 and the substrate 10 are difficult to peel off from the adhesive layer 25. Yes.
  • thermosetting resin in the protruding portion 26 may not be thermally polymerized, and when the thermosetting resin is thermally polymerized at the back surface position of the electrical component 15, the protruding portion 26 is also heated together. You can then heat polymerize the thermosetting resin.
  • the force described above is for the case where the adhesive layer 20 whose planar shape is larger than the planar shape of the electrical component 15 is used, and the adhesive layer 20 is positioned around the entire back surface of the electrical component 15 and its periphery.
  • the present invention is not limited to this.
  • the adhesive layer 20 is located at the portion where the terminal 17 and the land 12 abut, the adhesive layer 20 is disposed on a part of the back surface of the electrical component 15 as shown in FIG. There may be parts.
  • the protruding portion 26 does not need to surround the entire circumference of the electrical component 15, and may be partially covered. So, if you have a protruding part 26 to prevent movement,
  • the edge of the planar shape of the electrical component 15 is configured so that the direction in which the force that the electrical component 15 moves can be applied. It is preferable that a part of the adhesive layer protrudes from each side (FIG. 4), more preferably, as shown in FIG. It is to surround.
  • the adhesive layer 20 is composed of a single piece of adhesive film.
  • the present invention is not limited to this, and a single adhesive layer 20 is composed of a plurality of pieces of adhesive film. May be.
  • the adhesive layer 20 is formed on the surface of the electrical component 15 on the side where the terminals 17 are arranged so as to protrude from the edge of the electrical component 15, and then the adhesive layer 20 of the electrical component 15 is formed. Place the adhesive layer 20 between the substrate 10 and the electrical component 15 by pressing the surface on the side to the substrate 10.
  • the adhesive layer 20 is not limited to a film-like one, and a paste-like one may be applied to the mounting region 14 of the substrate 10 to form an adhesive layer.
  • the adhesive layer 20 may be in the form of a paste, or after the adhesive is applied, the solvent in the adhesive is removed by evaporation before the second temporary fixing. It may leave and solidify.
  • the electrical components 15 may be mechanically connected by pressing the pressing heads 30 one by one on each electrical component 15. As shown in FIG. 5, the electrical components 15 may be mechanically connected by pressing a plurality of electrical components 15 at a time with a single pressing head 30.
  • the heating means 59 may be provided in the pressing table 55 as shown in FIG.
  • the heating means 33 and 59 may be provided on both the pressing base 55 and the pressing head 30.
  • the type of the substrate 10 is not particularly limited, and a rigid substrate, a flexible substrate, or the like can be used.
  • the mounting method of the present application can be used for the connection between the electrical component 15 and another electrical component.
  • the type of the electrical component 15 is not particularly limited, and various types such as a semiconductor element (bare chip, knocker IC), resistance element, and the like can be used.
  • the abutting portion 32 of the pressing head 30 is made of an elastic material, even if the heights of the electrical components 15 are different, a plurality of electrical components 15 can be brought together at one time with the pressing head 30. It can be pressed.
  • the abutting portion 32 of the pressing head 30 may be composed of an elastic material such as rubber (elastomer) or a hard material such as metal, but the abutting portion 32 is made of an elastic material.
  • the present application is particularly effective because the position of the electrical component 15 is more likely to be displaced than when the contact portion 32 is configured of a hard material.
  • the pressing table may be changed between the heating process and the first and second temporary fixing processes.
  • the radiation curable resin is not particularly limited as long as it is cured with radiation having a predetermined wavelength.
  • the radiation curable resin has a double bond ((meth) acrylic double bond) in the molecule.
  • One type of these radiation curable resin may be used alone, or two or more types may be used in combination.
  • a binder 21 is used. It is preferable to add a photopolymerization initiator.
  • the wavelength region in which the radiation-curable resin is polymerized is not particularly limited! However, when a material that overlaps in the visible light region is used, the adhesive layer 20 is transported and stored, and the electric device 1 is manufactured. Since it is necessary to use special lighting for the process, radiation curable resin is preferably polymerized in the ultraviolet region.
  • the thermosetting resin is not particularly limited.
  • epoxy resin having an epoxy group in the molecule and more specifically, bisphenol A type epoxy resin, bisphenol F type epoxy resin.
  • Epoxy resins having a glycidyl ether skeleton such as resin and phenol novolac type epoxy resins, alicyclic epoxy resins having an epoxy group in the cyclic structure, and glycidyl derived from monovalent or polyvalent carboxylates
  • Ester-type epoxy resins, primary or secondary amine compounds and epichlorohydrin-derived epoxy resins having glycidylamine groups epoxy resins having a triazine skeleton in the molecule, polybutadiene A material that contains an epoxy group in a rubber material such as N-modified epoxy resin or NBR-modified epoxy resin, or a glycidyl group such as glycidyl methacrylate or glycidyl acrylate in (meth) acrylic resin. It is possible to use acrylic rosin or the like
  • thermosetting resins may be used alone, or two or more types may be used in combination. Further, a thermosetting resin hardener may be added to the binder 21.
  • thermoplastic resin is contained in the binder 21, the adhesiveness of the adhesive layer 20 during the first temporary fixing is improved.
  • the thermoplastic resin is not particularly limited.
  • phenoxy resin, acrylic rubber, or the like can be used.
  • One kind of thermoplastic resin may be contained in the adhesive alone, or two or more kinds may be mixed and contained in the adhesive.
  • the radiation 29 is not particularly limited as long as it has a wavelength that does not transmit the electrical component 15.
  • the electrical component 15 when it is a silicon chip (bare chip), it transmits silicon such as infrared rays and X-rays.
  • silicon such as infrared rays and X-rays.
  • radiation of a wavelength that does not transmit through silicon such as visible light and ultraviolet light, can be used.
  • the electrical component 15 is formed of a package IC in which a bare chip is packaged with ceramic or epoxy resin, radiation having a wavelength that does not transmit the ceramic or epoxy resin, such as visible light or ultraviolet light, is emitted. Can be used.
  • the radiation 29 is selectively incident only on the protruding portion 26 by covering the electrical component 15 with a mask or using laser light. You may let them.
  • the adhesive layer 20 is formed by applying the adhesive of the example so that the electrical component 15 protrudes from the periphery of the electrical component 15 when the electrical component 15 is placed on the mounting region 14 of the substrate 10.
  • a silicon chip (bare chip), which is electrical component 15, was placed.
  • the contact portion 32 is pressed by the rubber-made pressing head 30.
  • the substrate 10 on which was placed was heated and pressed.
  • the amount of displacement of the electrical component 15 was measured with an X-ray observation device (number of tests, 50).
  • the planar shape of the electrical component 15 is a quadrangle, and the amount of displacement is the direction in which two parallel sides of the electrical component 15 extend (the X-axis direction) and the other two parallel to each other. The measurement was performed in the direction in which the side extends (Y-axis direction).
  • Table 1 shows the measurement results of the displacement.
  • the adhesive of the above comparative example after the thermosetting resin was not completely cured instead of irradiation with radiation, the adhesive was semi-cured by heating at a low temperature.
  • the amount of displacement in both the X-axis direction and the Y-axis direction was significant.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　信頼性の高い電気装置を製造する。 　接着剤層２０は熱硬化性樹脂と放射線硬化性樹脂を含有しており、接着剤層２０の一部は電気部品１５の縁よりも外側にはみ出ている。放射線２９は電気部品１５を透過せず、接着剤層２０の電気部品１５の真裏に位置する部分では、放射線硬化性樹脂は重合しないが、はみ出し部分２６では放射線硬化性樹脂が重合する。電気部品１５は重合した放射線硬化型樹脂によって固定されるから、電気部品１５を加熱押圧する時に、電気部品１５の位置ずれが起こらない。

Description

明 細 書
実装方法、電気部品付き基板及び電気装置
技術分野
[0001] 本発明は電気部品を基板に実装する実装方法に関する。
背景技術
[0002] 従来より、半導体素子のような電気部品の実装には接着剤が使用されている。
接着剤を用いて電気部品を実装する場合、基板と電気部品で接着剤を挟み込み、 電気部品に押圧ヘッドを押し付けて押圧する。
[0003] 押圧ヘッドには、通常、金属.セラミック等の硬質のヘッドを用いることが多いが、シ リコンラバー等の弾性体 (押圧ゴム）を有する弾性体ヘッドを用いることもある。弹体性 ヘッドの押圧ゴムを電気部品に押し付けて押圧を行った場合、硬質のヘッドを用いる 場合と比べて、接着剤の気泡 (ボイド)抜けが良ぐその結果、電気部品と基板との接 続信頼性が向上するという利点がある。
[0004] しかし、従来技術の実装方法では押圧の際に電気部品の位置ずれが起こりやすく
、特に弾性体ヘッドを用いた場合に、その位置ずれ量が大きくなるという問題があつ た。
[0005] 接着剤が熱硬化性榭脂を含有する場合には、弾性体ヘッドで電気部品を押圧する 前に、接着剤が半硬化する程度に加熱しておけば、半硬化した接着剤で電気部品 が固定されるので、位置ずれがある程度は防げる。しかし、その方法を用いた場合で も、 25 μ m程度は電気部品が位置ずれした。
特許文献 1：特開平 11—45904号公報
特許文献 2 :特開 2000— 105388号公報
特許文献 3：特開 2005 - 32952号公報
発明の開示
発明が解決しょうとする課題
[0006] 本発明は上記課題を解決するためになされたものであり、その目的は、電気部品を 精度良く実装可能な実装方法を提供することである。 課題を解決するための手段
[0007] 上記課題を解決するために、本発明は、熱硬化性榭脂と放射線硬化性榭脂とが含 有された接着剤層を用い、前記接着剤層と、基板と、電気部品とを、前記接着剤層 が前記基板と、前記電気部品の間に位置し、前記接着剤層の一部が前記電気部品 の縁よりも外側にはみ出す状態にし、前記接着剤層のはみ出した部分に放射線を照 射した後、前記接着剤層を加熱しながら、前記電気部品と前記基板の間に押圧力を 加え、前記電気部品と前記基板とを機械的に接続する電気部品の実装方法である。 本発明は実装方法であって、前記放射線として前記電気部品を透過しな!ヽ波長の ものを用い、前記放射線の照射は、前記基板の前記電気部品が配置された側の面 から行い、前記はみ出した部分と一緒に、前記電気部品にも前記放射線を入射させ る実装方法である。
本発明は実装方法であって、平面形状が前記電気部品の平面形状よりも大きい接 着剤層を用い、前記接着剤層を前記基板と前記電気部品の間に位置させる際に、 前記はみ出した部分で前記電気部品の縁を囲う実装方法である。
本発明は、電気部品が接着剤層によって仮固定された電気部品付き基板であって 、前記接着剤層は放射線硬化性榭脂と、熱硬化性榭脂を含有し、前記接着剤層の 一部は前記基板と前記電気部品の間に位置し、他の一部は前記電気部品の縁より も外側にはみ出し、前記接着剤層の前記電気部品の縁よりも外側にはみ出した部分 は、前記放射線硬化性榭脂が放射線照射によって重合した光重合物を含有する電 気部品付き基板である。
本発明は、電気部品が接着剤層によって基板に固定された電気装置であって、前 記接着剤層は放射線硬化性榭脂と、熱硬化性榭脂とを含有し、一部が前記電気部 品と前記基板の間に位置し、他の一部が前記電気部品の縁よりも外側にはみ出し、 前記接着剤層の前記電気部品の縁よりも外側にはみ出した部分は、前記放射線硬 化性榭脂が放射線照射によって重合した光重合物を含有し、前記接着剤層の前記 電気部品と前記基板との間の部分は、前記熱硬化性榭脂が加熱によって重合した 熱重合物を含有する電気装置である。
[0008] 本発明は上記のように構成されており、電気部品付き基板は、接着剤層を加熱押 圧する前の状態であり、接着剤層の電気部品と基板との間に位置する部分によって 、電気部品が基板に仮に固定されている。
[0009] この電気部品付き基板では、熱硬化性榭脂の熱重合物は生成されておらず、接着 剤層の電気部品の真裏の部分と、電気部品の縁よりも外側にはみ出した部分は、熱 重合前の熱硬化性榭脂を含有する。
[0010] また、接着剤層の縁よりも外側にはみ出した部分は、放射線硬化性榭脂の光重合 物を含有するが、電気部品の真裏の部分は光重合する前の放射線硬化性榭脂を含 有して!/ヽる。電気部品の真裏の部分は放射線硬化性榭脂も熱硬化性榭脂も重合し ていないから、電気部品を基板に仮固定する力は弱ぐ電気部品は基板から剥がす ことが可能である。
[0011] 本発明の電気装置は、電気部品付き基板を加熱した後の状態であって、接着剤層 に含有される熱硬化性榭脂は、電気部品の縁から外側にはみ出した部分と、基板と 電気部品の間の部分の両方で熱重合物となり、接着剤層全体が硬化しているが、硬 化後の接着剤層のうち、電気部品と基板との間の部分は、光重合していない放射線 硬化性榭脂を含有する。
発明の効果
[0012] 電気部品を機械的に接続する時に、電気部品の位置ずれが起こらな!/、ので、信頼 性の高い電気装置が得られる。電気部品を機械的に接続する時には、接着剤層の 電気部品の裏面に位置する部分は、放射線硬化型榭脂が重合しておらず、流動性 が高いので、従来のように接着剤層全体を半硬化させた場合と比べて、小さい押圧 力で電気部品の端子を基板のランドに当接させることができる。
図面の簡単な説明
[0013] [図 l] (a)〜(d)：本発明の実装方法を説明する断面図
[図 2]電気装置を説明する断面図
[図 3] (a)：放射線照射前の状態を示す平面図、（b)：放射線照射後の状態を示す平 面図
圆 4]接着剤層の配置の他の例を説明する平面図
[図 5]本発明の実装方法の他の例を説明する断面図 符号の説明
[0014] 1……電気装置 2……電気部品付き基板 10……基板 15……電気部品
20……接着剤層 21……バインダー 22……導電性粒子 26……はみ出し 部分 29……放射線
発明を実施するための最良の形態
[0015] 図 1 (a)の符号 10は本発明に用いる基板の一例を示しており、基板 10は基板本体
11と、基板本体 11表面に配置されたランド 12とを有して 、る。
基板 10表面には、後述する電気部品が実装される実装領域 14が 1又は複数個設 けられており、ランド 12は実装領域 14にそれぞれ配置されている。
[0016] 基板 10は、ランド 12が配置された側の面を上に向けて押圧台 35上に配置されて おり、各実装領域 14には、接着フィルム原反カゝら切り取られた接着フィルムの小片か らなる接着剤層 20が配置されて ヽる。
[0017] 接着剤層 20はバインダー 21と、バインダー 21中に分散された導電性粒子 22とを 有しており、バインダー 21は熱硬化性榭脂と放射線硬化性榭脂と熱可塑性榭脂とを 含有している。接着剤層 20は熱可塑性榭脂を含有することで室温でも接着性を有し
、接着剤層 20は基板 10に向カゝつて軽く押圧されることによって、接着剤層 20が基板
10に密着している。
[0018] 各実装領域 14に実装される電気部品の大きさは決まっており、各実装領域 14に貼 付された接着剤層 20の大きさは、その実装領域 14に実装される電気部品の大きさよ りも大きく切り取られており、後述するように位置合わせ後に電気部品を接着剤層 20 に載せた時に、接着剤層 20が電気部品の周囲からはみ出すようにされている。
[0019] 図 1 (b)の符号 15は半導体素子のような電気部品を示しており、この電気部品 15 は部品本体 16と、部品本体 16の底面に配置された端子 17とを有している。
[0020] この電気部品 15を不図示の搭載ヘッドに保持させ、端子 17が配置された底面を下 側に向け、対応する実装領域 14上に配置する。搭載ヘッドを移動させて、端子 17が 対応する実装領域 14のランド 12の真上に位置するように位置合わせをした後、搭載 ヘッドを下降させて電気部品 15を接着剤層 20に接触させる。
[0021] 上述したように、接着剤層 20は室温で接着性を有するから、この搭載ヘッド又は他 の圧着ヘッドで電気部品 15を接着剤層 20に押し付け、電気部品 15の底面を接着 剤層 20に密着させると、電気部品 15は接着剤層 20によって基板 10に接着され、仮 固定される。
[0022] 電気部品 15を接着剤層 20に接触させ、電気部品 15を基板 10に仮固定する工程 を第一の仮固定工程とすると、第一の仮固定工程の後の状態では、接着剤層 20中 の熱硬化性榭脂と放射線硬化性榭脂は重合しておらず、接着剤層 20の機械的強度 が弱いので、位置あわせをやり直す場合や、電気部品 15が不良の場合、電気部品 1 5を接着剤層 20から剥がすことが可能になっている。
[0023] 上述したように、接着剤層 20は電気部品 15の周囲にはみ出すようにされているか ら、電気部品 15が仮固定された状態では、接着剤層 20の電気部品 15の縁からはみ 出したはみ出し部分 26で、電気部品 15の全周が囲まれている（図 3 (a) )。
[0024] 電気部品 15が仮固定された基板 10の上方には光源 28が配置されている。光源 2 8は電気部品 15を透過しない波長の放射線 29を放射するよう構成されており、この 光源 28から基板 10の電気部品 15が配置された側の面に向かって放射線 29を照射 すると、はみ出し部分 26に放射線 29が入射する（図 1 (c) )
ノインダー 21中の放射線硬化性榭脂は、所定の波長領域の光で重合するもので あって、その波長領域には上記放射線 29の波長も含まれて 、る。
[0025] 従って、はみ出し部分 26に放射線 29が入射すると、放射線硬化性榭脂は光重合 して光重合物が生成される。上述したように接着剤層 20は基板 10に接着されており 、放射線硬化性榭脂は、はみ出し部分 26が基板 10に密着したまま光重合するから、 はみ出し部分 26内部の放射線硬化性榭脂の光重合物が基板 10に固定され、電気 部品 15は、はみ出し部分 26に光重合物が生成されることで基板 10に固定される。
[0026] はみ出し部分 26に放射線 29を入射させ、光重合物を生成して電気部品 15を固定 する工程を第二の仮固定工程とすると、第二の仮固定工程では、放射線 29は電気 部品 15にも入射するが、その放射線 29は電気部品 15を透過せずに吸収又は反射 される。従って、接着剤層 20のうち、電気部品 15の真裏に位置する部分の放射線硬 化性榭脂は光重合しない。
[0027] 図 1 (d)、図 3 (b)の符号 2は、第二の仮固定工程後の電気部品付き基板を示して おり、この電気部品付き基板 2の上方には押圧ヘッド 30が配置されている。
[0028] 押圧ヘッド 30の一面にはゴム製又は金属製の当接部 32が設けられており、押圧へ ッド 30を下降させて当接部 32を電気部品 15に接触させ、押圧ヘッド 30を更に下降 させて電気部品 15を押圧し、電気部品 15と基板 10の間に押圧力を加える。
[0029] 接着剤層 20aのうち、電気部品 15の真裏位置には放射線 29が照射されておらず、 その真裏位置の部分は放射線硬化性榭脂の光重合物を含有しない。従って、接着 剤層 20aの電気部品 15の真裏位置の部分は、バインダー 21の流動性が維持されて おり、上記押圧力によってバインダー 21が押し退けられる。
[0030] このとき、バインダー 21を昇温させておけば、バインダー 21中の熱可塑性榭脂が 軟ィ匕して流動性がより高くなるので、小さい押圧力でバインダー 21が押し退けられる
[0031] 上述したように、はみ出し部分 26は内部の放射線硬化性榭脂の光重合物が基板 1 0に固定されており、はみ出し部分 26は電気部品 15の周囲に位置するから、ノイン ダー 21が押し退けられるときに、電気部品 15にどの方向に水平移動する力が加わつ ても、電気部品 15は位置ずれせずに、真下に押し付けられる。
[0032] 端子 17はランド 12の真上に位置するから、電気部品 15が位置ずれせずに真下に 押し付けられると、端子 17がランド 12に直接又は導電性粒子 22を介して当接され、 電気部品 15と基板 10とが電気的に接続される。
[0033] 押圧ヘッド 30には加熱手段 33が設けられ、当接部 32は加熱手段 33によって加熱 されており、熱伝導によって接着剤層 20aが加熱され、熱硬化性榭脂の硬化温度以 上に昇温すると、バインダー 21、 27中の熱硬化性榭脂が加熱によって重合して熱重 合物となり、電気部品 15と基板 10とが電気的に接続された状態で固定される。
[0034] 図 2の符号 1は、熱重合物が生成された接着剤層 25によって、電気部品 15が固定 された状態の電気装置を示しており、基板 10と電気部品 15は電気的に接続されて V、るだけでなく、接着剤層 25によって機械的に接続されて!、る。
[0035] 電気部品 15の裏面位置では、接着剤層 25が基板 10と電気部品 15が密着したま ま、バインダー 24の熱硬化性榭脂が熱重合しているから、電気部品 15と基板 10は 強固に接続されている。従って、電気部品 15や基板 10が接着剤層 25から剥がれ難 い。
[0036] 尚、はみ出し部分 26の熱硬化性榭脂は熱重合していなくてもよいし、電気部品 15 の裏面位置で熱硬化性榭脂を熱重合させる時に、はみ出し部分 26も一緒に加熱し て熱硬化性榭脂を熱重合させてもょ ヽ。
[0037] 以上は、平面形状が電気部品 15の平面形状よりも大きい接着剤層 20を用い、電 気部品 15の裏面全部と、その周囲に接着剤層 20を位置させる場合について説明し た力 本発明はこれに限定されるものではない。
[0038] 端子 17とランド 12が当接する部分に接着剤層 20が位置するのであれば、図 4に示 したように、電気部品 15の裏面の一部に接着剤層 20が配置されて ヽな 、部分があ つてもよい。
[0039] また、はみ出し部分 26は電気部品 15の全周を取り囲む必要も無ぐ一部がかけて もよぐ電気部品 15の種類や押圧条件毎に電気部品 15の移動しやすい方向が分か つて 、れば、移動を妨げるようにはみ出し部分 26を設ければょ 、。
[0040] しかし、電気部品 15の位置ずれ方向が予測できない場合には、電気部品 15が移 動する力がどの方向に加わってもよ 、ように、電気部品 15の平面形状の縁を構成す る各辺から、接着剤層の一部がはみ出るようにすることが好ましく（図 4)、より好ましく は、図 3 (a)に示したように、電気部品 15の全周をはみ出し部分 26で取り囲むことで ある。
[0041] 以上は 1枚の接着フィルムの小片で接着剤層 20を構成する場合について説明した 力 本発明はこれに限定されず、複数枚の接着フィルムの小片で 1つの接着剤層 20 を構成してもよい。
[0042] また、電気部品 15の端子 17が配置された側の面に、電気部品 15の縁からはみ出 すよう接着剤層 20を形成してから、該電気部品 15の接着剤層 20が形成された側の 面を基板 10に押し当てて、基板 10と電気部品 15との間に接着剤層 20を位置させて ちょい。
[0043] また、接着剤層 20はフィルム状のものに限定されず、ペースト状のものを基板 10の 実装領域 14に塗布して接着剤層としてもよい。この場合、接着剤層 20はペースト状 であってもよいし、接着剤を塗布後、第二の仮固定の前に接着剤中の溶剤を蒸発除 去して、固化させてもよい。
[0044] 以上は 1つの実装領域 14に対し、 1つの接着剤層 20を形成する場合について説 明したが、本発明はこれに限定されず、図 5に示すように、複数の実装領域 14に亘っ て大面積の接着剤層 50を形成してもよい。
[0045] 複数の電気部品 15を同じ基板 10に実装する場合には、各電気部品 15に一つず つ押圧ヘッド 30を押圧して電気部品 15の機械的接続を行ってもよいし、図 5に示す ように、一つの押圧ヘッド 30で複数の電気部品 15を一度に押圧して電気部品 15の 機械的接続を行ってもよい。
[0046] 以上は、押圧ヘッド 30に加熱手段を設ける場合について説明した力 本発明はこ れに限定されるものではなぐ図 5に示すように、加熱手段 59を押圧台 55に設けても よぐ加熱手段 33、 59を押圧台 55と押圧ヘッド 30の両方に設けてもよい。
[0047] 基板 10の種類も特に限定されず、リジッド基板、フレキシブル基板等を用いることも できる。また、基板 10と電気部品 15の接続以外にも、電気部品 15と他の電気部品と の接続に本願の実装方法を用いることができる。
電気部品 15の種類は特に限定されず、半導体素子 (ベアチップ、ノッケージ IC)、 抵抗素子等種々のものを用いることができる。
[0048] 押圧ヘッド 30の当接部 32を弾性材料で構成しておけば、電気部品 15の高さが異 なる場合であっても、一つの押圧ヘッド 30で複数の電気部品 15を一度に押圧するこ とがでさる。
[0049] 押圧ヘッド 30の当接部 32は、ゴム（エラストマ一）のような弾性材料又は金属のよう な硬質材料の 、ずれで構成してもよ ヽが、当接部 32が弾性材料で構成された場合、 当接部 32を硬質材料で構成された場合に比べて、電気部品 15の位置ずれが起こり やすいので、本願が特に有効である。
[0050] 押圧台 55に設けた加熱手段 59により接着剤層 20aの加熱を行う場合には、加熱を 行う工程と、第一、第二の仮固定工程とで、押圧台を変えてもよい。
また、押圧ヘッド 30で電気部品 15を押圧する時に、電気部品 15が載せられた基 板 10を高温に加熱された炉の内部に配置し、該炉の内部で電気部品 15の押圧を 行ってもよい。 [0051] 放射線硬化性榭脂は、所定の波長の放射線で硬化するものであれば特に限定さ れな 、が、例えば分子内に二重結合（ (メタ）アクリル系二重結合)を有する榭脂であ り、より具体的には、 1, 4ブタンジオールジアタリレート、ネオペンチルグリコールジァ タリレート、トリメチロールプロパントリアタリレート、テトラメチロールメタントリアタリレー ト、テトラメチロールメタンテトラアタリレート、ペンタエリス口トールトリアタリレート、ペン タエリスリトールテトラアタリレート、水素化ビスフエノール Aエチレンォキサイト付加物 ジアタリレート、トリメチロールプロパントリメタタリレートなどの（メタ）アタリレートモノマ 一又は (メタ）アタリレートオリゴマー類、ウレタンアタリレートオリゴマー類、エポキシァ タリレート類、オリゴエステルアタリレート類、トリアリルイソシァヌレート、トリアリルイソシ ァヌレートなどのァリル系化合物、ポリマーの側鎖にカルボン酸や水酸基のような反 応性官能基を有するポリマーに、グリシジルメタクリレートゃメタクリロイルォキシェチ ルイソシァネートのように分子内に二重結合とポリマー側鎖に官能基を有するモノマ 一 (オリゴマー）を反応させて得た、分子内側鎖に (メタ)アタリレート基を導入したポリ マー (オリゴマー）等がある。
[0052] これらの放射線硬化性榭脂は 1種類を単独で用いてもよいし、 2種類以上を混合し て用いてもよぐまた、放射線硬化性榭脂の感度を上げるために、バインダー 21には 光重合開始剤を添加することが好まし 、。
[0053] 放射線硬化性榭脂が重合する波長領域は特に限定されな!、が、可視光領域で重 合するものを用いると、接着剤層 20の搬送及び保存や、電気装置 1を製造する工程 で使用する照明に特殊なものを使用する必要があるので、放射線硬化性榭脂は紫 外線領域で重合するものが好まし 、。
[0054] 熱硬化性榭脂も特に限定されないが、例えば、分子内にエポキシ基を有するェポ キシ榭脂であり、より具体的には、ビスフエノール A型エポキシ榭脂、ビスフエノール F 型エポキシ榭脂、フエノールノボラック型エポキシ榭脂などのグリシジルエーテル骨格 を有するエポキシ榭脂類、環状構造にエポキシ基を有する脂環式エポキシ榭脂類、 一価または多価カルボン酸カゝら誘導されるグリシジルエステル型エポキシ榭脂類、 1 級または 2級ァミン化合物とェピクロルヒドリンカ 誘導されるグリシジルァミン基を有 するエポキシ榭脂類、分子内にトリァジン骨格を持つエポキシ榭脂類、ポリブタジェ ン変性エポキシ榭脂、 NBR変性エポキシ榭脂のようにゴム材料内にエポキシ基を含 有させた材料、（メタ)アクリル榭脂内にグリシジルメタタリレート、グリシジルアタリレート などのようにグリシジル基を有するアクリル榭脂等を用いることができる。
[0055] これらの熱硬化性榭脂は 1種類を単独で用いてもよいし、 2種類以上を混合して用 いてもよい。また、熱硬化性榭脂の硬化剤をバインダー 21に添加させてもよい。
[0056] 上述したように、バインダー 21に熱可塑性榭脂を含有させると、第一の仮固定の時 の接着剤層 20の接着性が向上する。熱可塑性榭脂も特に限定されないが、例えば フエノキシ榭脂、アクリルゴム等を用いることができる。熱可塑性榭脂は 1種類を単独 で接着剤に含有させてもよいし、 2種類以上を混合して接着剤に含有させてもよい。
[0057] 放射線 29は電気部品 15を透過しない波長のものであれば特に限定されず、例え ば、電気部品 15がシリコンチップ (ベアチップ）の場合は、赤外線や X線のようにシリ コンを透過する波長の放射線は使用できないが、可視光、紫外線のようにシリコンを 透過しな 、波長の放射線を使用することができる。
[0058] また、ベアチップがセラミックやエポキシ榭脂でパッケージングされたパッケージ IC で電気部品 15が構成された場合は、可視光や紫外線のように、セラミックやエポキシ 榭脂を透過しない波長の放射線を使用することができる。
[0059] また、電気部品 15が広い波長領域に対して透明な場合には、マスクで電気部品 1 5を覆うか、レーザー光を用いることで、はみ出し部分 26だけに選択的に放射線 29 を入射させてもよい。
実施例
[0060] <実施例 >
放射線硬化性榭脂であるトリメチロールプロパントリアタリレートを 5gと、光重合開始 剤である日本チノ 'ガイギー (株)社製の商品名「ィルガキュア 184」を 0. lgと、熱硬 化性榭脂であるエポキシ榭脂 (ジャパンエポキシレジン (株)社製の商品名「ェピコ一 ト 828」 )を 20gと、熱可塑性榭脂であるフエノキシ榭脂 (東都化成 (株)社製の商品名 「YP50」）を 10gと、熱硬化性榭脂の硬化剤 (旭化成ケミカルズ (株)社製の商品名「 HX3941HPJ )を 40gと、導電性粒子であるニッケル粒子（直径 5 μ m、球形）を 10g とを混合し、実施例の接着剤を作成した。この接着剤は茶色〜灰褐色であり、室温で ペースト状であった。
[0061] <比較例 >
上記実施例の接着剤の配合から、放射線硬化性榭脂と、光重合開始剤を除き、更 に、導電性粒子の添加量を lOgから 8gに変えた以外は、上記実施例と同じ条件で比 較例の接着剤を作成した。この接着剤は室温でペースト状であった。
上記実施例と比較例の接着剤を用いて下記に示す評価試験を行った。
[0062] <評価試験 >
基板 10の実装領域 14に、電気部品 15を載せた時に電気部品 15の周囲からはみ 出すように、実施例の接着剤を塗布して接着剤層 20を形成し、該接着剤層 20に電 気部品 15であるシリコンチップ (ベアチップ)を載せた。
[0063] 次いで、シリコンを透過しない放射線である紫外線を基板 10の電気部品 15が載置 された面に照射した後（lOOOmiZcm2)、当接部 32がゴム製の押圧ヘッド 30で電気 部品 15が載せられた基板 10を加熱押圧した。
得られた電気装置 1について、 X線観察装置により電気部品 15の位置ずれ量を測 定した (試験数、 50個)。
[0064] ここでは電気部品 15の平面形状は四角形であり、位置ずれ量は、電気部品 15の 四辺のうち、互いに平行な二辺の伸びる方向（X軸方向）と、互いに平行な他の二辺 の伸びる方向（Y軸方向）について測定した。
位置ずれ量の測定結果を下記表 1に示す。
[0065] [表 1]
：評価試験の結果
位置ずれ量
第二の仮固定
X軸 Y軸
比較例 熱硬化 25 At m 22 /x m 実施例 放射線硬化 1 0 m 9 μ, νη
[0066] 上記表 1から明らかなように、実施例の接着剤を用いて、放射線照射によりはみ出 し部分 26の放射線硬化型榭脂を重合させてから、電気部品 15の機械的接続を行つ た時には、位置ずれ量が小さ!/、ことがわかる。
[0067] これに対し、上記比較例の接着剤を用いて、放射線照射の変わりに、熱硬化性榭 脂が完全に硬化しな 、程度の低温で加熱して接着剤を半硬化させた後、電気部品 の機械的接続を行ったところ、表 1の比較例の欄に記載したように、 X軸方向も Y軸 方向も位置ずれ量が大き力つた。
[0068] 以上の結果から、接着剤層の電気部品 15の周囲にはみ出した部分を放射線照射 によって硬化させることで、電気部品 15の位置ずれが小さくなることが確認された。

Claims

請求の範囲
[1] 熱硬化性榭脂と放射線硬化性榭脂とが含有された接着剤層を用い、
前記接着剤層と、基板と、電気部品とを、前記接着剤層が前記基板と、前記電気部 品の間に位置し、前記接着剤層の一部が前記電気部品の縁よりも外側にはみ出す 状態にし、
前記接着剤層のはみ出した部分に放射線を照射した後、
前記接着剤層を加熱しながら、前記電気部品と前記基板の間に押圧力を加え、前 記電気部品と前記基板とを機械的に接続する電気部品の実装方法。
[2] 前記放射線として前記電気部品を透過しな 、波長のものを用い、
前記放射線の照射は、前記基板の前記電気部品が配置された側の面から行 ヽ、 前記はみ出した部分と一緒に、前記電気部品にも前記放射線を入射させる請求項 1 記載の実装方法。
[3] 平面形状が前記電気部品の平面形状よりも大きい接着剤層を用い、
前記接着剤層を前記基板と前記電気部品の間に位置させる際に、
前記はみ出した部分で前記電気部品の縁を囲う請求項 1記載の実装方法。
[4] 電気部品が接着剤層によって仮固定された電気部品付き基板であって、
前記接着剤層は放射線硬化性榭脂と、熱硬化性榭脂を含有し、
前記接着剤層の一部は前記基板と前記電気部品の間に位置し、他の一部は前記 電気部品の縁よりも外側にはみ出し、
前記接着剤層の前記電気部品の縁よりも外側にはみ出した部分は、前記放射線 硬化性榭脂が放射線照射によって重合した光重合物を含有する電気部品付き基板
[5] 電気部品が接着剤層によって基板に固定された電気装置であって、
前記接着剤層は放射線硬化性榭脂と、熱硬化性榭脂とを含有し、一部が前記電気 部品と前記基板の間に位置し、他の一部が前記電気部品の縁よりも外側にはみ出し 前記接着剤層の前記電気部品の縁よりも外側にはみ出した部分は、前記放射線 硬化性榭脂が放射線照射によって重合した光重合物を含有し、 前記接着剤層の前記電気部品と前記基板との間の部分は、前記熱硬化性榭脂が 加熱によって重合した熱重合物を含有する電気装置。
PCT/JP2007/054267 2006-03-07 2007-03-06 実装方法、電気部品付き基板及び電気装置 WO2007102482A1 (ja)

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