CN101395710A - 安装方法、带有电气部件的基板以及电气装置 - Google Patents

安装方法、带有电气部件的基板以及电气装置 Download PDF

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Publication number
CN101395710A
CN101395710A CNA2007800079609A CN200780007960A CN101395710A CN 101395710 A CN101395710 A CN 101395710A CN A2007800079609 A CNA2007800079609 A CN A2007800079609A CN 200780007960 A CN200780007960 A CN 200780007960A CN 101395710 A CN101395710 A CN 101395710A
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Prior art keywords
electric component
bond layer
substrate
radioactive ray
resin
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CN101395710B (zh
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古田和隆
蟹泽士行
谷口雅树
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Dexerials Corp
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Sony Chemical and Information Device Corp
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract

本发明涉及安装方法、带有电气部件的基板以及电气结构。制造可靠性较高的电气装置。粘接剂层(20)含有有热硬化性树脂和放射线硬化性树脂，粘接剂层(20)的一部分与电气部件(15)的边缘相比露出到外侧。放射线(29)不透过电气部件(15)，在粘接剂层(20)的位于电气部件(15)的正背面的部分，放射线硬化性树脂不聚合，在露出部分(26)中放射线硬化性树脂进行聚合。电气部件(15)由聚合的放射线硬化型树脂固定，所以，当对电气部件(15)进行加热按压时，不会引起电气部件(15)的位置偏移。

Description

安装方法、带有电气部件的基板以及电气装置
技术领域
本发明涉及将电气部件安装到基板上的安装方法。
背景技术
以往，在半导体元件这样的电气部件的安装中使用粘接剂。
在使用粘接剂安装电气部件的情况下，基板和电气部件夹着粘接剂，将按压头压在电气部件上进行按压。
按压头通常多使用金属、陶瓷等硬质头，但是也使用具有硅橡胶(silicon rubber)等弹性体(按压橡胶)的弹性体头。当将弹性体头的按压橡胶压在电气部件上进行按压时，与使用硬质头的情况相比，较好地避免粘接剂的气泡(空隙)，因此可以提高电气部件和基板的连接可靠性。
但是，在现有技术的安装方法中，在按压时容易引起电气部件的位置偏移，特别是在使用弹性体头的情况下，存在该位置偏移量较大的问题。
在粘接剂含有热硬化性树脂的情况下，在由弹性体头按压电气部件之前，若加热到粘接剂半硬化的程度，则由半硬化的粘接剂固定电气部件，所以，某种程度上防止位置偏移。但是，即便使用该方法，电气部件也存在25μm左右的位置偏移。
专利文献1：特开平11-45904号公报
专利文献2：特开2000-105388号公报
专利文献3：特开2005-32952号公报
发明内容
本发明是为了解决所述课题而进行的，其目的是提供一种能够精度良好地安装电气部件的安装方法。
为了解决所述问题，本发明是一种电气部件的安装方法，其中，使用含有热硬化性树脂和放射线硬化性树脂的粘接剂层，使所述粘接剂层、基板、电气部件成为所述粘接剂层位于所述基板和所述电气部件之间并且所述粘接剂层的一部分露出到电气部件的边缘外侧的状态，向所述粘接剂层的露出的部分照射放射线之后，一边对所述粘接剂层进行加热，一边在所述电气部件和所述基板之间施按压力，机械地连接所述电气部件和所述基板。
在本发明的安装方法中，作为所述放射线，使用不透过所述电气部件的波长的放射线，从所述基板的配置有所述电气部件的一侧的面进行所述放射线的照射，同时向所述露出的部分与所述电气部件射入所述放射线。
在本发明的安装方法中，使用平面形状比所述电气部件的平面形状大的粘接剂层，在使所述粘接剂层位于所述基板和所述电气部件之间时，由所述露出的部分包围所述电气部件的边缘。
本发明是一种利用粘接剂层暂时固定有电气部件的带有电气部件的基板，其中，所述粘接剂层含有放射线硬化性树脂和热硬化性树脂，所述粘接剂层的一部分位于所述基板和所述电气部件之间，另一部分露出到电气部件边缘的外侧，所述粘接剂层的露出到所述电气部件的边缘的外侧的部分含有所述放射线硬化性树脂由于放射线照射而聚合后的光聚合物。
本发明是一种利用粘接剂层将电气部件固定到基板上的电气装置，其中，所述粘接剂层含有放射线硬化性树脂和热硬化性树脂，一部分位于所述电气部件和所述基板之间，另一部分露出到所述电气部件的边缘的外侧，所述粘接剂层的露出到所述电气部件的边缘的外侧的部分含有所述放射线硬化性树脂由于放射线照射而聚合后的光聚合物，所述粘接剂层的所述电气部件和所述基板之间的部分含有所述热硬化性树脂由于加热而聚合后的热聚合物。
本发明以如上所述的方式构成，带有电气部件的基板是对粘接剂层进行加热按压之前的状态，由粘接剂层的位于电气部件和基板之间的部分，将电气部件暂时地固定到基板上。
在该带有电气部件的基板中，不产生热硬化性树脂的热聚合物，粘接剂层的电气部件的正背面的部分和露出到电气部件的边缘的外侧的部分，含有热聚合前的热硬化性树脂。
此外，粘接剂层的露出到电气部件的边缘外侧的部分含有放射线硬化性树脂的光聚合物，电气部件的正背面的部分含有光聚合前的放射线硬化性树脂。对于电气部件的正背面的部分来说，放射线硬化性树脂和热硬化性树脂都不聚合，所以，将电气部件暂时固定到基板上的力较弱，能够将电气部件从基板上剥离。
对于本发明的电气装置来说，在对带有电气部件的基板进行加热之后的状态下，对于粘接剂层中含有的热硬化性树脂来说，从电气部件的边缘露出到外侧的部分、和基板与电气部件之间的部分都成为热聚合物，粘接剂层整体硬化，但是，在硬化后的粘接剂层的电气部件和基板之间的部分含有没有进行光聚合的放射线硬化性树脂。
对电气部件机械地连接时，不引起电气部件的位置偏移，所以，得到可靠性较高的电气装置。在对电气部件机械地连接时，粘接剂层的位于电气部件的背面的部分的放射线硬化型树脂不聚合，流动性较高，所以，与现有那样的使粘接剂层整体半硬化的情况相比较，能够以较小的压力使电气部件的端子与基板的焊盘抵接。
附图说明
图1(a)～(d)是说明本发明安装方法的截面图。
图2是说明电气装置的截面图。
图3(a)是示出放射线照射前的状态的平面图，(b)是示出放射线照射后的状态的平面图。
图4是说明粘接剂层的配置的其他例子的平面图。
图5是说明本发明的安装方法的其他例子的截面图。
符号说明
1   电气装置
2   带有电气部件的基板
10  基板
15  电气部件
20  粘接剂层
21  粘结剂
22  导电性粒子
26  露出部分
29  放射线
具体实施方式
图1(a)的符号10示出本发明中使用的基板的一例，基板10具有基板主体11和在基板主体11表面所配置的焊盘12。
在基板10的表面设置一个或多个安装下述电气部件的安装区域14，焊盘12分别配置在安装区域14。
对于基板10来说，使配置有焊盘12的一侧的面向上地配置在按压台35上，在各安装区域14配置由从粘接膜原板切取的粘接膜小片构成的粘接剂层20。
粘接剂层20具有粘结剂(binder)21和分散在粘结剂21中的导电性粒子22，粘结剂21含有热硬化性树脂、放射线硬化性树脂和热可塑性树脂。粘接剂层20含有热可塑性树脂，由此，即使在室温下也具有粘接性，将粘接剂层20向基板10轻轻按压，从而粘接剂层20与基板10紧贴。
决定在各安装区域14安装的电气部件的大小，贴附在各安装区域14的粘接剂层20的大小切取得比在该安装区域14安装的电气部件的大小大，如下所述，在对位后，将电气部件载放在粘接剂层20上时，粘接剂层20从电气部件的周围露出。
图1(b)的符号15示出半导体元件这样的电气部件，该电气部件15具有部件主体16和配置在部件主体16底面上的端子17。
将该电气部件15保持在未图示的搭载头上，使配置有端子17的底面朝向下侧，配置在相对应的安装区域14上。移动搭载头，以端子17位于相对应的安装区域14的焊盘12正上方的方式进行对位后，使搭载头下降，使电气部件15与粘接剂层20接触。
如上所述，由于粘接剂层20在室温下具有粘接性，所以，由该搭载头或者其他压接头将电气部件15压在粘接剂层20上，当使电气部件15的底面与粘接剂层20紧贴时，电气部件15由粘接剂层20粘接到基板10上，被暂时固定。
将使电气部件15与粘接剂层20接触、并且使电气部件15暂时固定在基板10上的步骤作为第一暂时固定步骤，在第一暂时固定步骤之后的状态下，粘接剂层20中的热硬化性树脂和放射线硬化性树脂不聚合，由于粘接剂层20的机械强度较弱，所以，在重新进行对位的情况下或者电气部件15不良的情况下，能够将电气部件15从粘接剂层20剥落。
如上所述，由于粘接剂20在电气部件15的周围露出，所以，在电气部件15被暂时固定的状态下，粘接剂层20的从电气部件15的边缘露出的露出部分26包围电气部件15的整个外围(图3(a))。
在暂时固定有电气部件15的基板10的上方配置光源28。光源28以放射不透过电气部件15的波长的放射线29的方式构成，从该光源28向基板10的配置有电气部件15的一侧的面照射放射线29时，放射线29射入到露出部分26(图1(c))。
粘结剂21中的放射线硬化性树脂是由于预定波长区域的光而进行聚合的树脂，在该波长区域中也含有所述放射线29的波长。
因此，放射线29射入到露出部分26时，放射线硬化性树脂进行光聚合而生成光聚合物。如上所述，粘接剂层20粘接到基板10上，对于放射线硬化性树脂来说，露出部分26在与基板10紧贴的状态下进行光聚合，所以，露出部分26内部的放射线硬化性树脂的光聚合物固定到基板10上，在露出部分26中产生光聚合物，由此，电气部件15被固定到基板10上。
将使放射线29射入到露出的部分26、生成光聚合物来固定电气部件15的步骤作为第二暂时固定步骤时，在第二暂时固定步骤中，放射线29也射入到电气部件15，但是，该放射线29不透过电气部件15而是被吸收或反射。因此，粘接剂层20的位于电气部件15的正背面的部分的放射线硬化性树脂不进行光聚合。
图1(d)、图3(b)的符号2示出第二暂时固定步骤后的带有电气部件的基板，在该带有电气部件的基板2的上方配置按压头30。
在按压头30的一面设置有橡胶制或金属制的抵接部32，使按压头30下降，从而使抵接部32与电气部件15接触，并使按压头30进一步下降，按压电气部件15，在电气部件15和基板10之间施加按压力。
粘接剂层20a的电气部件15的正背面位置未被照射放射线29，该正背面位置的部分不含有放射线硬化性树脂的光聚合物。因此，对于粘接剂层20a的电气部件15的正背面位置的部分来说，维持粘结剂21的流动性，粘结剂21由于所述按压力而被压开。
此时，如果使粘结剂21的温度上升，则粘结剂21中的热可塑性树脂软化，流动性进一步变高，所以，以较小的按压力将粘结剂21压开。
如上所述，露出部分26内部的放射线硬化性树脂的光聚合物固定到基板10上，露出部分26位于电气部件15的周围，所以，压开粘结剂21时，即使对电气部件15施加哪个方向的水平移动的力，电气部件15也不会位置偏移，而是被压向正下方。
端子17位于焊盘12的正上方，所以，当电气部件15未位置偏移地被压向正下方时，端子17直接或通过导电性粒子22而与焊盘12抵接，电气部件15和基板10被电连接。
在按压头30中设置有加热单元33，抵接部32被加热单元33加热，利用热传导来加热粘接剂层20a，当温度上升到热硬化性树脂的硬化温度以上时，粘结剂21、27中的热硬化性树脂由于加热而进行聚合，变为热聚合物，在电气部件15和基板10被电连接的状态下被固定。
图2的符号1表示由生成了热聚合物的粘接剂层25固定电气部件15的状态下的电气装置，基板10和电气部件15不仅被电连接，而且由粘接剂层25机械地连接。
在电气部件15的背面位置，在粘接剂层25使基板10和电气部件15紧贴的状态下，粘结剂24的热硬化性树脂进行热聚合，所以，将电气部件15和基板10牢固地连接。因此，电气部件15或基板10难以从粘接剂层25剥离。
此外，露出部分26的热硬化性树脂不进行热聚合也可以，在电气部件15的背面位置使热硬化性树脂进行热聚合时，露出部分26也一起加热并使热硬化性树脂进行热聚合也可以。
以上说明了使用平面形状比电气部件15的平面形状大的粘接剂层20、并且使粘接剂层20位于电气部件15的背面全部及其周围的情况，但是，本发明不限于此。
如果粘接剂层20位于端子17和焊盘12抵接的部分，则如图4所示，在电气部件15背面一部分可以存在不配置粘接剂层20的部分。
此外，露出部分26不一定包围电气部件15的整个外围，缺少一部分也可以，如果按照电气部件15的种类或按压条件知道电气部件15容易移动的方向，则可以相应地设置露出部分26，以妨碍其移动即可。
但是，当电气部件15的位置偏移方向不能够预测时，优选粘接剂层的一部分从构成电气部件15的平面形状的边缘的各边露出(图4)，使得在哪个方向施加电气部件15移动的力都可以，更优选地，如图3(a)所示，由露出部分26包围电气部件15的整个外围。
以上说明了由一个粘接膜小片构成粘接剂层20的情况，但是，本发明不限于此，也可以由多个粘接膜小片构成一个粘接剂层20。
此外，在电气部件15的配置有端子17的一侧的面以从电气部件15的边缘露出方式形成粘接剂层20之后，将该电气部件15的形成有粘接剂层20的一侧的面推碰到基板10上，使粘接剂层20位于基板10和电气部件15之间也可以。
此外，粘接剂层20不限于膜状，也可以在基板10的安装区域14涂敷膏状的粘接剂层，作为粘接剂层。在这种情况下，粘接剂层20可以为膏状，可以在涂敷粘接剂之后、第二暂时固定之前将粘接剂中的溶剂蒸发除去并进行固化。
以上，说明了对于一个安装区域14形成一个粘接剂层20的情况，但是本发明不限于此，如图5所示，也可以跨过多个安装区域14形成大面积的粘接剂层50。
在将多个电气部件15安装在相同的基板10上的情况下，可以在各电气部件15上逐个地按压按压头30来进行电气部件15的机械连接，也可以如图5所示，由一个按压头30一次按压多个电气部件15来进行电气部件15的机械连接。
以上，说明了在按压头30中设置加热单元的情况，但是，本发明不限于此，如图5所示，可以在按压台55中设置加热单元59，也可以在按压台55和按压头30这二者中设置加热单元33、59。
基板10的种类也不特别限定，也可以使用硬质基板、挠性基板等。此外，除了基板10和电气部件15的连接以外，电气部件15和其他电气部件的连接也可以使用本申请的安装方法。
电气部件15的种类不特别限定，也可以使用各种半导体元件(裸芯片、封装IC)、电阻元件等各种部件。
如果由弹性材料构成按压头30的抵接部32，则即使在电气部件15的高度不同的情况下，也能够由一个按压头30一次按压多个电气部件15。
按压头30的抵接部32可以由橡胶(弹性体)这样的弹性材料或金属这样的硬质材料的任何一种构成，但是，抵接部32由弹性材料构成的情况与由硬质材料构成抵接部32的情况相比，容易引起电气部件15的位置偏移，所以，本发明是特别有效的。
利用在按压台55上设置的加热单元59进行粘接剂层20a的加热的情况下，可以在进行加热的步骤和第一、第二暂时固定步骤中改变按压台。
此外，在由按压头30按压电气部件15时，可以将载放有电气部件15的基板10配置在被加热到高温的炉的内部，在该炉的内部进行电气部件15的按压。
对于放射线硬化性树脂来说，若是由预定波长的放射线进行硬化的树脂，则不特别地限定，例如，是分子内具有双键((甲基)丙烯酸系双键)的树脂，更具体地说，有1，4丁二醇丙烯酸酯、新戊二醇二丙烯酸酯、三羟甲基丙烷三丙烯酸酯、四羟甲基甲烷三丙烯酸酯、四羟甲基甲烷四丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、氢化双酚A环氧乙烯加成物二丙烯酸酯、三羟甲基丙烷三甲基丙烯酸酯等的(甲基)丙烯酸酯单体或(甲基)丙烯酸酯低聚物类、氨基甲酸酯丙烯酸酯低聚物类、环氧丙烯酸酯类、低聚酯丙烯酸酯类、三烯丙基异氰酸酯等烯丙基系化合物、对聚合物的侧链上具有羧酸或羟基这样的反应性官能基的聚合物使甲基丙烯酸缩水甘油酯或甲基丙烯酰氧基乙基异氰酸酯这样的、在分子内具有双键和在聚合物侧链上具有官能基的单体(低聚物)反应而得到的、在分子内侧链上引入了(甲基)丙烯酸酯的聚合物(低聚物)等。
可以单独地使用这些放射线硬化性树脂中的一种，也可以混合两种以上来使用，此外，为了提高放射线硬化性树脂的灵敏性，优选在粘结剂21中添加光聚合起始剂。
放射线硬化性树脂进行聚合的波长区域不特别地限定，但是，使用在可见光区域进行聚合的树脂时，在粘接剂层20的搬运以及保存、或者制造电气装置1的步骤中使用的照明中，需要使用特殊的条件，所以，优选放射线硬化性树脂在紫外线区域聚合。
放射线硬化性树脂不特别地限定，例如，是在分子内具有环氧基的环氧树脂，更具体地说，能够使用双酚A型环氧树脂、双酚F型环氧树脂、酚醛清漆型环氧树脂等具有缩水甘油醚骨架的环氧树脂类，在环状结构上具有环氧基的脂环型环氧树脂类，由一价或多价羧酸所衍生的缩水甘油酯型环氧树脂类，由一级或二级胺化物和环氧氨丙烷所衍生的具有缩水甘油胺基的环氧树脂类，在分子内具有三嗪骨架的环氧树脂类，聚丁二烯改质环氧树脂，如NBR改质环氧树脂这样的在橡胶材料内含有环氧基的材料，(甲基)丙烯酸树脂内具有甲基丙烯酸缩水甘油、丙烯酸缩水甘油等这样的缩水甘油基的丙烯酸树脂等。
可以单独地使用这些热硬化性树脂中的一种，也可以混合两种以上来使用。此外，可以将热硬化性树脂的硬化剂添加到粘结剂21中。
如上所述，在粘结剂21中含有热可塑性树脂时，第一暂时固定时的粘接剂层20的粘接性提高。热可塑性树脂也不特别地限定，例如，可以使用苯氧树脂、丙烯酸橡胶等。对于热可塑性树脂来说，粘接剂中可以单独地含有一种，也可以混合两种以上含在粘接剂中。
对于放射线29来说，若是不透过电气部件15的波长，则没有特别地限定，例如，在电气部件15是硅芯片(裸芯片)的情况下，不能够使用红外线或X射线这样的透过硅的波长的放射线，但是，能够使用可见光、紫外线这样的不透过硅的波长的放射线。
此外，在裸芯片由陶瓷或环氧树脂封装后的封装IC构成电气部件15的情况下，能够使用可见光或紫外线这样的不透过陶瓷或环氧树脂的波长的放射线。
此外，在电气部件15相对于较宽的波长区域为透明的情况下，由掩模覆盖电气部件15、或使用激光从而选择性地使放射线29仅射入到露出部分26。
实施例
混合作为放射线硬化性树脂的三羟甲基丙烷三丙烯酸酯5g、作为光聚合起始剂的日本汽巴嘉基(チバ·ガイギ一)(股)公司制的商品名为“IRGACURE184”0.1g、作为热硬化性树脂的环氧树脂(日本环氧树脂(股)公司制的商品名为“EPIKOTE 828”)20g、作为热可塑性树脂的苯氧树脂(东都化成(股)公司制的商品名为“YP50”)10g、热硬化性树脂的硬化剂(旭化成化学品(股)公司制的商品名为“HX3941HP”)40g、作为导电性粒子的镍粒子(直径为5μm、球形)10g，制成实施例中的粘接剂。该粘接剂是茶色～灰褐色，在室温下为膏状。
比较例
根据所述实施例的粘接剂的配合，除了放射线硬化性树脂和光聚合起始剂以外，并且，除了将导电性粒子的添加量从10g变为8g以外，以与所述实施例相同的条件制成比较例的粘接剂。该粘接剂在室温下为膏状。
评价试验
以在基板10的安装区域14载放电气部件15时从电气部件15的周围露出的方式，涂敷实施例的粘接剂，形成粘接剂层20，在该粘接剂层20上载放作为电气部件15的硅芯片(裸芯片)。
接下来，对基板10的载置有电气部件15的面，照射作为不透过硅的放射线的紫外线之后(1000mJ/cm2)，以抵接部32是橡胶制的按压头30对载放有电气部件15的基板10进行加热按压。
对于所得到的电气装置1，利用X射线观察装置测量电气部件15的位置偏移量(试验数为50个)。
在此，电气部件15的平面形状是四角形，对于位置偏移量来说，对电气部件15的四个边中相互平行的两个边延伸的方向(X轴方向)和相互平行的另两个边的延伸方向(Y轴方向)进行测量。
在下表1中示出位置偏移量的测量结果。
表1
           表1：评价试验的结果
Figure A200780007960D00121
由所述表1可知，使用实施例的粘接剂，利用放射线照射使露出部分26的放射线硬化型树脂聚合之后，进行电气部件15的机械连接时，位置偏移量较小。
与此相对，使用所述比较例中的粘接剂，代替放射线照射，热硬化性树脂在不完全硬化的程度的低温下进行加热，使粘接剂半硬化之后，进行电气部件的机械连接，如表1的比较例一栏所记载的那样，X轴方向和Y轴方向的位置偏移量都较大。
根据以上结果，确认利用放射线照射使粘接剂层的露出到电气部件15周围的部分硬化，由此，使电气部件15的位置偏移变小。

Claims (5)

1.一种电气部件的安装方法，其中，
使用含有热硬化性树脂和放射线硬化性树脂的粘接剂层，
使所述粘接剂层、基板、电气部件成为所述粘接剂层位于所述基板和所述电气部件之间并且所述粘接剂层的一部分露出到所述电气部件的边缘外侧的状态，
向所述粘接剂层的露出的部分照射放射线之后，一边对所述粘接剂层进行加热，一边在所述电气部件和所述基板之间施加按压力，机械地连接所述电气部件和所述基板。
2.根据权利要求1的安装方法，其中，
作为所述放射线，使用不透过所述电气部件的波长的放射线，
从所述基板的配置有所述电气部件的一侧的面进行所述放射线的照射，同时向所述露出的部分与所述电气部件射入所述放射线。
3.根据权利要求1的安装方法，其中，
使用平面形状比所述电气部件的平面形状大的粘接剂层，
在使所述粘接剂层位于所述基板和所述电气部件之间时，由所述露出的部分包围所述电气部件的边缘。
4.一种利用粘接剂层暂时固定有电气部件的带有电气部件的基板，其中，
所述粘接剂层含有放射线硬化性树脂和热硬化性树脂，
所述粘接剂层的一部分位于所述基板和所述电气部件之间，另一部分露出到电气部件的边缘外侧，
所述粘接剂层的露出到所述电气部件的边缘外侧的部分含有所述放射线硬化性树脂由于放射线照射而聚合后的光聚合物。
5.一种利用粘接剂层将电气部件固定到基板上的电气装置，其中，
所述粘接剂层含有放射线硬化性树脂和热硬化性树脂，一部分位于所述电气部件和所述基板之间，另一部分露出到所述电气部件的边缘外侧，
所述粘接剂层的露出到所述电气部件的边缘外侧的部分含有所述放射线硬化性树脂由于放射线照射而聚合后的光聚合物，
所述粘接剂层的所述电气部件和所述基板之间的部分含有所述热硬化性树脂由于加热而聚合后的热聚合物。
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