JP7226664B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP7226664B2 JP7226664B2 JP2022549893A JP2022549893A JP7226664B2 JP 7226664 B2 JP7226664 B2 JP 7226664B2 JP 2022549893 A JP2022549893 A JP 2022549893A JP 2022549893 A JP2022549893 A JP 2022549893A JP 7226664 B2 JP7226664 B2 JP 7226664B2
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- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
図1は、本実施形態に係る製造方法によって製造される半導体装置の一例を模式的に示す断面図である。図1に示すように、半導体装置1は、例えばファンアウト構造を有する装置であり、半導体素子10、封止材層11、保護層12、再配線層13、及び、半田ボール14を備える。半導体装置1は、例えばファンアウトパッケージ(FO-PKG)技術によって作製されるものであり、例えばファンアウトウエハレベルパッケージ(FO-WLP)技術によって作製されてもよく、又は、ファンアウトパネルレベルパッケージ(FO-PLP)技術によって作製されてもよい。封止材層11は、半導体素子10を樹脂等の封止材により封止した層である。保護層12は、半導体素子10を保護する層であり、半導体素子10の第2面10b及び封止材層11の面11a上に配置された硬化層である。保護層12は、後述する硬化性接着剤層22を硬化することにより形成される(図2を参照)。保護層12は、半導体素子10の第2面10b及び封止材層11に対して剥離しないように固定されており、半導体素子10の第2面10b及び封止材層11の面11aと保護層12との接着強度は、例えば、4.0MPa以上であってもよい。再配線層13は、半導体素子10の第1面10a側の接続端子10cの端子ピッチを広げるための層であり、例えばポリイミド等の絶縁部分13a及び銅配線等の配線部分13bから構成される。半田ボール14は、再配線層13によって端子ピッチが広げられた端子に接続され、これにより半導体素子10の接続端子10cがピッチ変換されて(広げられて)半田ボール14に接続される。
次に、図2~図4を参照して、半導体装置1を製造する方法について説明する。図2~図4は、半導体装置1を製造する方法を順に示す図である。この半導体装置の製造方法では、まず、接続端子10cが形成された第1面10aと第1面10aの逆側にある第2面10bとをそれぞれが有する複数の半導体素子10を準備する(図1及び図2の(b)を参照)。複数の半導体素子10は、例えば、通常の半導体プロセスによってまとめて形成され、その後、ダイシングによって個片化され、各半導体素子10が作製される。この作製工程は、従来の工法を用いることができるため、説明を省略する。
図5の(a)に示すように、比較例に係る第1方法では、まず、金属製のキャリア120上に粘着層122を設ける。粘着層122としては、例えば常温では粘着力を有するものの加熱により粘着力が低下する剥離シートなどが用いられる。そして、図5の(b)に示すように、粘着層122に複数の半導体素子10の第2面10bが向くように(つまりフェイスアップ)、粘着層122上に複数の半導体素子10を配置する。その後、図5の(c)に示すように、半導体素子10を封止材で封止して封止材層124を形成し、封止が終了すると、粘着層122等を加熱して半導体素子10から粘着層122を剥離してキャリア120を除去する(図5の(d)を参照)。
次に、図8~図10に示す比較例に係る第2方法及びそれとの対比について説明する。図8の(a)に示すように、第2方法では、まず、ガラス製のキャリア220上に硬化性剥離層222を設ける。そして、図8の(b)に示すように、硬化性剥離層222を熱等によりベーキングして硬化層222aとする。その後、図8の(c)及び図8の(d)に示すように、熱可塑性の仮固定層224を硬化層222a上に形成し、仮固定層224を熱等によりベーキングして硬化させて硬化層224aとする。
[熱可塑性樹脂]
・エポキシ基を有するアクリルポリマー:(ガラス転移温度:12℃)
[エポキシ樹脂]
・ビスフェノールF型液状エポキシ樹脂:YDF-8170C(商品名、日鉄ケミカル&マテリアル株式会社)
・クレゾールノボラック型エポキシ樹脂:N-500P-10(商品名、DIC株式会社)
[硬化剤]
・フェノール樹脂:PSM-4326(商品名、群栄化学工業株式会社)
・フェノール樹脂:MEH-7800M(商品名、明和化成株式会社)
[シリカフィラー]
・SC2050-HLG(商品名、アドマテックス株式会社)
・R972(商品名、日本アエロジル株式会社)
[光吸収剤]
・カーボンブラック:FP-Black(商品名、山陽色素株式会社)
[カップリング剤]
・(3-メルカプトプロピル)トリメトキシシラン:A-189(商品名、モメンティブ社)
・3-ウレイドプロピルトリエトキシシラン:A-1160(商品名、モメンティブ社)
[硬化促進剤]
・1-シアノエチル-2-フェニルイミダゾール:2PZ-CN(商品名、四国化成工業株式会社)
ブレードダイサ(製品名、DAD3360、DISCO社製)を用いて12inchサイズのガラス基板(厚さ700μm)を9mm×9mmサイズに切り出した。フィルムA又はフィルムBから保護フィルムを剥がして、露出した硬化性樹脂フィルムを、9mm×9mmサイズのガラス基板の上にフィルムA又はBを載せて、硬化性樹脂フィルムとガラス基板とを真空ラミネータ(製品名、V-130、ニッコーマテリアルズ社製)を用いて貼り付けた。真空ラミネータの条件は、上プラテン温度90℃、下プラテン温度40℃、圧力0.5MPa、加圧時間60秒とした。
次に、上述した実施例1~8の試験と同様のフィルムA及びフィルムBを準備し、フィルムA又はフィルムBから保護フィルムを剥がして露出した硬化性樹脂フィルムをガラス基板(60mm×60mm、厚さ700μm)に載せて硬化性樹脂フィルムとガラス基板との真空ラミネータ(製品名、V-130、ニッコーマテリアルズ社製)によって貼り合わせた。真空ラミネータの条件は上プラテン温度90℃、下プラテン温度40℃、圧力0.5MPa、加圧時間60秒とした。オーブンを用いて130℃で20分間の加熱とそれに続く170℃で2時間の加熱により硬化性樹脂フィルムを硬化させた。硬化した硬化性樹脂フィルムである保護層上に、エポキシ樹脂を含む封止材とモールド装置(製品名、CPM1080、TOWA社製)を用いて、150℃で300秒の条件で封止材層を形成した。形成された封止材層を150℃で6時間の加熱により更に硬化させた。これにより、ガラス基板、保護層及び封止材層から構成される3層構造の評価用積層体を得た。
Claims (21)
- 接続端子が形成された第1面と該第1面の逆側にある第2面とをそれぞれが有する複数の半導体素子を準備する工程と、
キャリア上に硬化性接着剤層が形成された支持部材を準備する工程と、
前記複数の半導体素子の前記各第2面が前記硬化性接着剤層に向くように前記複数の半導体素子を前記支持部材に取り付ける工程と、
前記硬化性接着剤層を硬化して前記複数の半導体素子を前記支持部材に固定する工程と、
前記複数の半導体素子を封止材により封止する工程と、
前記キャリアを除去する工程と、を備え、
硬化した前記硬化性接着剤層と前記封止材との接着強度が4.0MPa以上である、半導体装置の製造方法。 - 硬化した前記硬化性接着剤層と前記封止材との接着強度が8.0MPa以下である、
請求項1に記載の半導体装置の製造方法。 - 硬化した前記硬化性接着剤層と前記封止材との接着強度が20MPa以上である、
請求項1に記載の半導体装置の製造方法。 - 接続端子が形成された第1面と該第1面の逆側にある第2面とをそれぞれが有する複数の半導体素子を準備する工程と、
キャリア上に硬化性接着剤層が形成された支持部材を準備する工程と、
前記複数の半導体素子の前記各第2面が前記硬化性接着剤層に向くように前記複数の半導体素子を前記支持部材に取り付ける工程と、
前記硬化性接着剤層を硬化して前記複数の半導体素子を前記支持部材に固定する工程と、
前記複数の半導体素子を封止材により封止する工程と、
前記キャリアを除去する工程と、を備え、
硬化した前記硬化性接着剤層と前記複数の半導体素子との接着強度が4.0MPa以上である、半導体装置の製造方法。 - 硬化した前記硬化性接着剤層と前記複数の半導体素子との接着強度が4.0MPa以上である、
請求項1~3の何れか1項に記載の半導体装置の製造方法。 - 硬化した前記硬化性接着剤層が前記複数の半導体素子それぞれの前記第2面を保護した状態である前記半導体装置を取得する、
請求項1~5の何れか一項に記載の半導体装置の製造方法。 - 前記キャリアがガラス基板であり、
前記硬化性接着剤層の前記ガラス基板への接着強度は、前記硬化性接着剤層を硬化した場合に1MPa以上であり、且つ、前記硬化性接着剤層へレーザを照射した場合に5MPa以下となる、
請求項1~6の何れか一項に記載の半導体装置の製造方法。 - 前記硬化性接着剤層は、熱可塑性樹脂、及びエポキシ硬化剤を含む樹脂組成物から形成され、前記熱可塑性樹脂のガラス転移温度が-40℃以上40℃以下である、
請求項1~7の何れか一項に記載の半導体装置の製造方法。 - 前記硬化性接着剤層の厚みは、硬化後において1μm以上400μm以下である、
請求項1~8の何れか一項に記載の半導体装置の製造方法。 - 前記キャリアは、ガラス基板又は透明樹脂基板であり、その厚さが0.1mm以上2.0mm以下である、
請求項1~9の何れか一項に記載の半導体装置の製造方法。 - 前記複数の半導体素子が前記支持部材に固定された状態で、前記支持部材に固定された前記複数の半導体素子を封止する封止材層を研磨する工程を更に備える、
請求項1~10の何れか一項に記載の半導体装置の製造方法。 - 前記複数の半導体素子が前記支持部材に固定された状態で、前記支持部材に固定された前記複数の半導体素子の前記第1面上に再配線層を形成する工程を更に備える、
請求項1~11の何れか一項に記載の半導体装置の製造方法。 - 前記複数の半導体素子が前記支持部材に固定された状態で、前記複数の半導体素子の前記接続端子に半田ボールを接続する工程を更に備える、
請求項1~12の何れか一項に記載の半導体装置の製造方法。 - 前記複数の半導体素子が前記支持部材に固定された状態で、前記再配線層に半田ボールを取り付ける工程を更に備える、
請求項12に記載の半導体装置の製造方法。 - 前記キャリアが光透過性基板であり、前記硬化性接着剤層が光吸収剤を含み、
前記除去する工程では、硬化した前記硬化性接着剤層に対して前記キャリア側からレーザ光を照射して、前記キャリアを除去する、
請求項1~14の何れか一項に記載の半導体装置の製造方法。 - 前記除去する工程では、前記キャリアを剥離する剥離エネルギーが1kW/cm2以上200kW/cm2以下となるようにレーザ光を照射して、前記キャリアを除去する、
請求項1~15の何れか一項に記載の半導体装置の製造方法。 - 前記除去する工程では、前記キャリアを削る又は溶かすことにより、前記キャリアを除去する、
請求項1~14の何れか一項に記載の半導体装置の製造方法。 - 前記除去する工程の後に、硬化した前記硬化性接着剤層又は前記封止材による封止材層の何れかの露出面をクリーニングする工程を更に備える、
請求項1~17の何れか一項に記載の半導体装置の製造方法。 - 前記除去する工程の後に前記複数の半導体素子を個片化する工程を更に備える、
請求項1~18の何れか一項に記載の半導体装置の製造方法。 - 前記個片化する工程において、硬化した前記硬化性接着剤層を前記複数の半導体素子と共に個片化し、
前記硬化性接着剤層に前記第2面が保護された前記複数の半導体素子のそれぞれから前記半導体装置を取得する、
請求項19に記載の半導体装置の製造方法。 - 前記取り付ける工程では、前記複数の半導体素子と共に複数の電子部品を前記支持部材に取り付け、
前記固定する工程では、前記硬化性接着剤層を硬化して前記複数の電子部品を前記支持部材に固定する、
請求項1~20の何れか一項に記載の半導体装置の製造方法。
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JP2006222164A (ja) | 2005-02-08 | 2006-08-24 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
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WO2017149810A1 (ja) | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
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JP2019129179A (ja) | 2018-01-22 | 2019-08-01 | 日立化成株式会社 | 半導体装置の製造方法 |
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JP2006222164A (ja) | 2005-02-08 | 2006-08-24 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP2013168594A (ja) | 2012-02-17 | 2013-08-29 | Fujitsu Ltd | 半導体装置の製造方法及び電子装置の製造方法 |
WO2017149810A1 (ja) | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法 |
JP2018009138A (ja) | 2016-07-05 | 2018-01-18 | 日立化成株式会社 | 仮固定用樹脂組成物、仮固定用樹脂フィルム及び仮固定用樹脂フィルムシート |
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