WO2007086525A1 - 基板構造および電子機器 - Google Patents
基板構造および電子機器 Download PDFInfo
- Publication number
- WO2007086525A1 WO2007086525A1 PCT/JP2007/051307 JP2007051307W WO2007086525A1 WO 2007086525 A1 WO2007086525 A1 WO 2007086525A1 JP 2007051307 W JP2007051307 W JP 2007051307W WO 2007086525 A1 WO2007086525 A1 WO 2007086525A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- region
- substrate
- electronic component
- lid member
- hole
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Definitions
- the present invention relates to a substrate structure and an electronic device in which an electronic component is mounted along a mounting surface of a substrate, the electronic component is covered with a resin portion, and the resin portion is closely attached to the mounting surface.
- a casing of a portable terminal is required to be small and thin, and to have a small number of parts.
- a circuit board structure using a flexible thin film substrate is adopted as a circuit board accommodated in a casing.
- the substrate structure is configured such that the electronic components 101 mounted on the substrate 100 are collectively covered with a resin portion 102 so that the electronic components 101 are mounted on the substrate 100.
- the reinforcing member is used to maintain the substrate 100 in a flat plate shape.
- the display device 103 such as an LCD provided in the portable terminal is provided in the housing by being supported by a support member (not shown) provided in the substrate 100 so as to straddle the resin part 101. It arrange
- the resin portion 102 shown in FIG. 4 is composed of a reinforcing frame 102A and a resin 102B.
- Patent Document 1 Japanese Patent No. 3241669
- the soft wiring 105 drawn from the end surface 103A of the display device 103 is routed so that the end portion 105A is laminated on the back surface 100A side of the base material 100 on the lamination side.
- the height dimension H of the electronic component 106 increases the thickness dimension of the entire substrate structure, which becomes an obstacle to downsizing and thinning the portable terminal.
- the present invention has been made to solve the above-described disadvantages, and an object of the present invention is to provide a substrate structure and an electronic device that can reduce the size and thickness of a casing of a portable terminal. .
- the substrate structure of the present invention includes a first surface, a second surface opposite to the first surface, a first region on the first surface, and a first surface on the first surface.
- a substrate having a second region surrounding the first region, a through hole inside the first region and penetrating between the first surface and the second surface; and the through hole
- a lid member mounted on the first surface at the boundary between the first region and the second region, and in close contact with the lid member, in the second region of the first surface It also has a rosin portion that consists of closely adhered rosin and power.
- the resin of the resin part is in close contact with the substrate and the lid member, the attachment strength of the lid member to the substrate can be improved.
- a movable part such as a mechanical switch
- the volume of the movable part in a state (initial state) before pressing the operation unit is considered in consideration of the main body force movable part protruding. While it is necessary to secure the above occupied space inside the housing, it is necessary to secure a space larger than the volume of moving parts inside the housing in electronic devices that have recently been required to be smaller and thinner. Is an obstacle to making the housing smaller and thinner.
- the substrate structure of the present invention includes a first surface, a second surface opposite to the first surface, a first region on the first surface, and the first surface.
- a surface having a second region surrounding the first region, and a through-hole that is inside the first region and penetrates between the first surface and the second surface.
- a cover member that covers the substrate, covers the through hole, and is mounted on the first surface at a boundary between the first region and the second region; And a first electronic component that is mounted on the second region of the first surface and is covered with the resin portion, and a force applied to the second region of the first surface.
- the lid member is covered with the grease part, the attachment strength of the lid member to the board can be improved, and the electronic component is covered with the grease part, so that the lid member is covered with the grease part.
- the mounting strength of electronic parts can be improved.
- the substrate structure of the present invention since the substrate, the lid member, and the electronic component are brought into close contact with each other by the grease portion, the combined effect of improving the mounting strength of the lid member and improving the mounting strength of the electronic component
- the rigidity including bending strength and torsional strength as a substrate will be improved.
- the substrate structure of the present invention includes a first surface, a second surface opposite to the first surface, a first region on the first surface, and the first surface.
- a substrate having a second region surrounding the first region on a surface, and a through hole that is inside the first region and passes between the first surface and the second surface;
- a lid member that covers the through-hole, is mounted on the first surface at a boundary between the first region and the second region, and is in close contact with the lid member;
- a second electronic component mounted on the first region of the first surface.
- the second electronic component is mounted in a space formed in the first region of the first surface of the substrate by the lid member.
- the second electronic component that does not want to be exposed to a grease having a magnetic permeability and dielectric constant different from air can be mounted on the first surface of the substrate.
- the air in the space formed of the cover member is Since it communicates with the outside through the through-hole, the temperature in the space formed by the lid member can be maintained equal to the external temperature, thereby preventing overheating of the second electronic component. Further, when the temperature of the substrate structure of the present invention rises, the air in the space formed by the lid member expands, but the expanded air communicates with the outside through the through hole, so that the atmospheric pressure in the space Can be matched to the atmospheric pressure outside the substrate structure.
- the substrate structure of the present invention includes a first surface, a second surface opposite to the first surface, a first region on the first surface, and the first surface.
- the third electronic component disposed in the through hole is a force.
- the third electronic component whether or not the force is in contact with the inner surface of the through hole or the lid member, or whether or not the force protrudes through the through hole is arbitrary.
- substrate can be improved.
- the substrate structure of the present invention includes a first surface, a second surface opposite to the first surface, a first region on the first surface, and the first surface.
- a first region having a second region that surrounds the first region on a surface, and a through-hole that is inside the first region and passes between the first surface and the second surface.
- a lid member that covers the substrate, covers the through-hole, and is mounted on the first surface at the boundary between the first region and the second region; and is in close contact with the lid member;
- the second substrate separate from the first substrate is connected to the fourth substrate. Therefore, multiple types of fourth electronic components of different types and functions are prepared in advance as modules mounted on the second board, and these modules are selected as appropriate. If the second board is joined to the first board, the degree of freedom in design such as easy design changes can be increased, and the module alone can be easily evaluated.
- the fourth electronic component and the first substrate are connected by the fourth substrate bonded to the second surface of the first substrate, and the fourth electronic component and the first substrate are connected. It is difficult to connect the boards at short distances.
- the substrate structure of the present invention includes a first surface, a second surface opposite to the first surface, a first region on the first surface, and the first surface.
- a third substrate a lid member that covers the through hole and is mounted on the first surface at a boundary between the first region and the second region, and is in close contact with the lid member;
- a fourth substrate having a resin part made of a resin closely adhering to the second region of the first surface, a first surface, and a second surface opposite to the first surface;
- a fifth electronic component mounted on the first surface of the fourth substrate, wherein the second surface of the fourth substrate is the first surface of the third substrate. 1st region, the fifth electronic part There is characterized in that arranged in front Symbol first region.
- the fifth electronic component is mounted in the space formed in the first region of the first surface of the substrate by the lid member.
- a fifth electronic component that does not want to be exposed to a resin with a dielectric constant different from that of air can be mounted on the first surface of the board.
- the substrate structure of the present invention since the fifth electronic component is mounted on the third substrate separate from the first substrate, the fifth electric device having a different type and function in advance is mounted.
- the substrate structure of the present invention includes a first surface, a second surface opposite to the first surface, a first region on the first surface, and the first surface.
- a third region having a second region surrounding the first region on a surface, and a through-hole that is inside the first region and passes between the first surface and the second surface.
- a lid member that covers the substrate, covers the through-hole, and is mounted on the first surface at the boundary between the first region and the second region; and is in close contact with the lid member;
- a fourth substrate having a resin portion made of a resin closely adhering to the second region, a first surface, and a second surface opposite to the first surface; and the fourth substrate
- a fifth electronic component mounted on the first surface of the substrate, and a sixth electronic component mounted on the second surface of the fourth substrate, wherein the second electronic component is mounted on the second surface of the fourth substrate.
- Side of the third substrate It is joined to the first region of the first surface, the fifth electronic component is disposed in the first region, and the sixth electronic component is disposed in the through hole.
- the fifth electronic component is mounted in the space formed in the first region of the first surface of the substrate by the lid member.
- a fifth electronic component that does not want to be exposed to a resin with a dielectric constant different from that of air can be mounted on the first surface of the board.
- the fifth electronic component is mounted on the first surface of the fourth substrate, and the sixth electronic component is mounted on the second surface of the fourth substrate.
- the mounting density per unit surface area of the fourth substrate is improved.
- the fifth electronic component and the sixth electronic component are mounted on the fourth substrate separate from the first substrate.
- the substrate structure of the present invention is characterized in that an upright portion is provided on a peripheral portion of the lid member.
- the upright portion is provided in the peripheral portion of the lid member, so that the top portion of the lid member can be separated from the through hole by the amount of the upright portion. That is, in the substrate structure of the present invention, a space continuous to the through hole can be formed by the lid member, so that even when the electronic component is larger than the thickness of the substrate, the rising dimension of the rising portion is appropriately selected. By accommodating a part of the electronic component in the space formed by the lid member, the electronic component can be arranged so that the second surface force of the base material does not protrude without touching the resin portion.
- an electronic apparatus of the present invention has the above-described substrate structure.
- the present invention by covering the through hole with the lid member, it is possible to prevent the electronic component from coming into contact with the resin portion.
- FIG. 1 is a cross-sectional view and a plan view showing a substrate structure (first embodiment) according to the present invention.
- FIG. 2 is a cross-sectional view showing a substrate structure (second embodiment) according to the present invention.
- FIG. 3 is a cross-sectional view showing a substrate structure (third embodiment) according to the present invention.
- FIG. 4 is a cross-sectional view showing a conventional substrate structure.
- FIG. 5 is a cross-sectional view showing a substrate structure (fourth embodiment) according to the present invention.
- FIG. 6 is a cross-sectional view showing a substrate structure (fifth embodiment) according to the present invention.
- FIG. 7 is a cross-sectional view showing a substrate structure (sixth embodiment) according to the present invention.
- the substrate structure 10 of the first embodiment includes a substrate 11, a plurality of electronic components 12 mounted along one mounting surface 11A of the substrate 11, and each electronic component 12 is lubricated. 13 It is provided with a resin part 13 that is covered with 3A and is in close contact with the mounting surface 11A of the substrate 11, and is accommodated in a casing of an electronic device such as a portable terminal.
- a through hole 14 is provided in the substrate 11, the mounting surface 11 A side in the through hole 14 is closed by the lid member 15, and the electronic component 16 is accommodated in the through hole 14. Yes.
- the base material 11 is provided with a support member (not shown) so as to straddle the resin part 13, and a display device 18 such as an LCD is supported on the support member.
- the soft wiring 19 is pulled out from the end surface 18A of the display device 18, and the end 19A of the soft wiring 19 is laminated on the back surface 11B (that is, the surface opposite to the mounting surface 11A) of the base material 11. It is routed.
- the through hole 14 is covered with the end 19A of the soft wiring 19, and the electronic component 16 is mounted on the end 19A.
- the resin portion 13 is obtained by covering the electronic component 12 and the lid member 15 with a reinforcing frame (frame body) 13B, and filling the reinforcing frame 13B with the resin 13A.
- the mounting strength of the electronic components 12 on the substrate 11 is ensured and the substrate 11 is maintained in a flat plate shape.
- the through hole 14 is provided in the thickness direction of the substrate 11 and has a size L that can accommodate the electronic component 16.
- the lid member 15 is formed to have a substantially U-shaped cross section by providing an upright portion 21 having a height dimension HI on the peripheral portion and an apex portion 22 on the upper edge 21A of the upright portion 21.
- the lid member 15 is made of a metal, a resin, an inorganic material, or the like. Furthermore, when the resin 13A of the resin part 13 is melted and supplied into the reinforcing frame 13B, the viscosity and pressure at the time of melting are taken into consideration, and if the resin 13A does not ooze out to the electronic component 16 side, the lid It is also possible to use a mesh as the member 15.
- a metal is preferably used.
- electrical shield is “high-frequency electrical shield”, use mesh.
- V it is also possible. In this case, it can be used if the size of the mesh (mesh) corresponds to the maximum length based on the frequency of the high frequency.
- the top portion 22 of the lid member 15 can be separated from the mounting surface 11A side of the through hole 14 by the height dimension HI of the upright portion 21. it can.
- the protruding dimension H2 is also smaller than the height dimension HI.
- the large electronic component 16 can be accommodated in the through hole 14 without touching the resin portion 13.
- the electronic component 16 By accommodating the electronic component 16 in the through hole 14, the electronic component 16 can be prevented from protruding from the substrate 11, and the casing of the mobile terminal can be reduced in size and thickness.
- the substrate 11 that is the first substrate in the substrate structure 10 as described above includes the first surface 11A, the second surface 11B on the opposite side of the first surface 11A, and the first surface 11A.
- the lid member 15 covers the through hole 14, and is mounted on the first surface 11A at the boundary between the first region 10A and the second region 10B.
- the resin portion 13 is made of a resin 13A that is in close contact with the lid member 15 and in close contact with the second region 10B of the first surface 11A.
- the electronic component 12 that is the first electronic component in the substrate structure 10 is mounted on the second region 10B of the first surface 11A.
- the soft wiring 19 that is the second substrate is bonded to the second surface 11B of the substrate 14 that is the first substrate.
- the electronic component 16 that is the fourth electronic component is mounted on the soft wiring 19 that is the second substrate, and is disposed in the through hole 14.
- the through hole 14 penetrating the substrate 11 which is the first substrate is covered with the lid member 15, so that the fourth structure which is not affected by the resin portion 13 is used.
- a space in which the electronic component 16, which is an electronic component, can be placed can be formed in the through hole 14.
- the attachment strength of the lid member 15 to the substrate 11 which is the first substrate can be improved.
- the electronic component 12 that is the first electronic component is covered with the resin portion 13, so that the mounting strength of the electronic component 12 on the substrate 11 that is the first substrate can be improved.
- the lid member 15 and the electronic component 12 that is the first electronic component 12 are collectively covered with the grease portion 13, so that the mounting strength of the lid member 15 is improved and the electronic component 1 2 Due to the synergistic effect with the improved mounting strength, the rigidity including the bending strength and torsional strength as the first substrate 11 is improved.
- the electronic component 16 as the fourth electronic component is mounted on the soft wiring 19 as the second substrate separate from the substrate 11 as the first substrate. Therefore, several types of electronic components 16 of different types and functions are prepared as modules that are mounted on the soft wiring 19 that is the second board, and these modules are selected as appropriate so that the soft wiring 1 9 If the (second substrate) is joined to the substrate 11 (first substrate), the degree of freedom in design such as easy design changes can be increased, and evaluation of the module alone can be performed easily.
- the substrate structure 30 of the second embodiment uses a lid member 31 instead of the lid member 15 of the first embodiment, and the other configuration is the same as that of the first embodiment.
- the lid member 31 is a flat plate material that closes the mounting surface 11A side in the through hole 14.
- An electronic component 32 is accommodated in the through hole 14, and the electronic component 32 is mounted on the end 19 A of the soft wiring 19.
- the height dimension H3 is smaller than the depth dimension H4 of the through hole 14.
- the electronic component 32 can be accommodated in the through hole 14 without touching the resin portion 13.
- the lid member 31 is made of the same material as the lid member 15.
- the same effect as the substrate structure 10 of the first embodiment can be obtained.
- the substrate 11 that is the first substrate in the substrate structure 30 as described above includes the first surface 11A, the second surface 11B on the opposite side of the first surface 11A, and the first surface 11A.
- the lid member 31 covers the through hole 14, and is mounted on the first surface 11A at the boundary between the first region 30A and the second region 30B.
- the resin part 13 is made of a resin 13 A that is in close contact with the lid member 31 and in close contact with the second region 30 B of the first surface 11 A.
- the electronic component 12 that is the first electronic component in the substrate structure 30 is mounted on the second region 30B of the first surface 11A.
- the soft wiring 19 that is the second substrate is bonded to the second surface 11B of the substrate 14 that is the first substrate.
- the electronic component 32 that is the fourth electronic component is mounted on the soft wiring 19 that is the second substrate, and is disposed in the through hole 14.
- the through-hole 14 that penetrates the substrate 11 that is the first substrate is covered with the lid member 31, so that the fourth structure that is not affected by the resin portion 13 is used.
- a space where an electronic component 32 or the like can be placed can be formed in the through hole 14.
- the attachment strength of the lid member 31 to the substrate 11 which is the first substrate can be improved.
- the electronic component 12 that is the first electronic component is covered with the resin portion 13, so that the mounting strength of the electronic component 12 on the substrate 11 that is the first substrate can be improved.
- the lid member 31 and the electronic component 12 that is the first electronic component 12 are collectively covered by the grease portion 13, so that the mounting strength of the lid member 31 is improved and the electronic component 1 2 Due to the synergistic effect with the improved mounting strength, the rigidity including the bending strength and torsional strength as the first substrate 11 is improved.
- the electronic component 32 which is the fourth electronic component, is mounted on the soft wiring 19, which is the second substrate separate from the substrate 11, which is the first substrate. Therefore, several types of modules with electronic components 32 of different types and functions mounted on soft wiring 19 on the second board are prepared, and these modules are selected as appropriate to make flexible wiring 1 9 If the (second substrate) is joined to the substrate 11 (first substrate), the degree of freedom in design such as easy design changes can be increased, and evaluation of the module alone can be performed easily.
- a through hole 41 is provided instead of the through hole 14 of the first embodiment, and the wiring 19 is routed by avoiding the end 19A of the soft wiring 19 from the through hole 41. Therefore, other configurations are the same as those of the first embodiment.
- the through hole 41 is provided in the thickness direction of the substrate 11 and is closed with a lid member 15 from the mounting surface 11A side. Through the through hole 41, the inner space 42 of the lid member 15 is communicated with the outside.
- the electronic component 43 is mounted on the mounting surface 11A of the substrate 11, and the electronic component 43 is covered with the lid member 15.
- the electronic component 43 is mounted on the mounting surface 11A of the substrate 11, and the electronic component 43 is covered with the lid member 15, so that the electronic component 43 can be 13 can be prevented from touching. Furthermore, the internal space 42 of the lid member 15 is communicated with the outside through the through hole 41, so that the heat in the internal space 42 can be released to the outside through the through hole 41.
- the electronic component 43 By mounting the electronic component 43 on the mounting surface 11A of the substrate 11, the electronic component 43 can be prevented from protruding from the back surface 11B of the substrate 11, and the housing of the mobile terminal can be made smaller and thinner. .
- the substrate 11 includes the first surface 11A, the second surface 11B opposite to the first surface 11A, and the first surface 11A.
- the lid member 15 covers the through hole 41 and is mounted on the first surface 11A at the boundary between the first region 40A and the second region 40B.
- the resin portion 13 is made of a resin 13A that is in close contact with the lid member 15 and in close contact with the second region 40B of the first surface 11A.
- the electronic component 12 that is the first electronic component is mounted on the second region 40B of the first surface 11A.
- the electronic component 43 which is the second child component, is mounted in the first region 40A of the first surface 11A.
- the through-hole 14 penetrating the substrate 11 is covered with the lid member 15, so that the electronic component which is the second electronic component that is not affected by the resin portion 13
- An internal space 42 in which 43 or the like can be placed can be formed.
- the attachment strength of the lid member 15 to the substrate 11 can be improved.
- the electronic component 12 that is the first electronic component is covered with the resin portion 13, so that the mounting strength of the electronic component 12 on the substrate 11 can be improved.
- the lid member 15 and the electronic component 12 which is the first electronic component 12 are collectively covered by the grease portion 13, so that the mounting strength of the lid member 15 is improved and the electronic component 1 2 Due to the synergistic effect with the improvement in mounting strength, the rigidity including bending strength and torsional strength as the substrate 11 is improved.
- the electronic component 43 as the second electronic component is provided in the internal space 42 formed in the first region 40A of the first surface 11A of the substrate 11 by the lid member 15. Since it is mounted, it is possible to mount the electronic component 43 on the first surface 11A of the substrate 11 that does not want to be contacted with the resin 13A having a magnetic permeability and dielectric constant different from those of air.
- the internal space 42 formed by the lid member 15 since the air in the internal space 42 formed by the lid member 15 communicates with the outside through the through hole 41, the internal space 42 formed by the lid member 15 is used.
- the internal temperature can be maintained at the same level as the external temperature, thereby preventing overheating of the electronic component 43, which is the second electronic component.
- FIG. 5 shows a substrate structure 50 according to the fourth embodiment.
- the substrate 11 includes a first surface 11A, a second surface 11B on the opposite side of the first surface 11A, and a first region 50A on the first surface 11A.
- a second region 50B surrounding the first region 50A and a through-hole that is inside the first region 50A and penetrates between the first surface 11A and the second surface 11B And 14.
- the lid member 31 covers the through hole 14, and is mounted on the first surface 11A at the boundary between the first region 50A and the second region 50B.
- the resin portion 13 is made of a resin 13A that is in close contact with the lid member 31 and in close contact with the second region 10B of the first surface 11A.
- the electronic component 12 is mounted in the second region 50B of the first surface 11A.
- the substrate structure 50 since the through hole 14 penetrating the substrate 11 is covered by the lid member 31, a predetermined space corresponding to the movable part 51 that is not affected by the grease portion 13 is obtained. Can be formed in the through hole 14.
- the movable part 51 such as a mechanical switch
- the operation part 53 provided on the front side of the main body 52
- the user can move from the back side of the main body 52 in conjunction with the operation part 53.
- the structure in which the part 54 protrudes is known.
- a space corresponding to the through hole 14 is newly formed by the structure in which the through hole 14 is covered with the lid member 31, so that the above-described movable It is not necessary to secure a separate space to accommodate the movable part 54 of the component 51. This makes it possible to reduce the size and thickness of electronic equipment housings! ⁇ ⁇ effect can be obtained.
- the attachment strength of the lid member 31 to the substrate 11 can be improved.
- the substrate structure 50 since the electronic component 12 is covered with the resin portion 13, the mounting strength of the electronic component 12 on the substrate 11 can be improved.
- the lid member 31 and the electronic component 12 are collectively covered by the grease portion 13, a synergistic effect of improving the mounting strength of the lid member 31 and improving the mounting strength of the electronic component 12 is achieved. As a result, the rigidity including the bending strength and torsional strength of the substrate 11 is improved.
- FIG. 6 shows a substrate structure 60 of the fifth embodiment.
- the substrate 11 includes a first surface 11A, a second surface 11B on the opposite side of the first surface 11A, and a first region 60A on the first surface 11A.
- the second region 60B surrounding the first region 60A, and the through-hole that is inside the first region 60A and passes between the first surface 11A and the second surface 11B And 14.
- the lid member 31 covers the through hole 14, and is mounted on the first surface 11A at the boundary between the first region 60A and the second region 60B.
- the resin part 13 is made of a resin 13A that is in close contact with the lid member 31 and in close contact with the second region 60B of the first surface 11A.
- the electronic component 12 that is the first electronic component is mounted on the second region 60B of the first surface 11A. Further, the electronic component 66 that is the fourth electronic component in the substrate structure 60 is disposed in the through hole 14. The electronic component 66 may or may not touch one or both of the inner surface of the lid member 31 and the through hole 14.
- the substrate structure 60 since the through hole 14 penetrating the substrate 11 is covered with the lid member 31, a predetermined space corresponding to the electronic component 66 that is not affected by the grease portion 13 is obtained. Can be formed in the through hole 14.
- the attachment strength of the lid member 31 to the substrate 11 can be improved.
- the board structure 60 since the electronic component 12 is covered with the resin portion 13, the mounting strength of the electronic component 12 on the board 11 can be improved.
- the lid member 31 and the electronic component 12 are collectively covered by the grease portion 13, a synergistic effect of improving the mounting strength of the lid member 31 and improving the mounting strength of the electronic component 12 is achieved. As a result, the rigidity including the bending strength and torsional strength of the substrate 11 is improved.
- FIG. 7 shows a substrate structure 70 of the sixth embodiment.
- the substrate 11, which is the third substrate includes the first surface 11A, the second surface 11B opposite to the first surface 11A, and the first surface 11A.
- the lid member 15 covers the through hole 14, and is mounted on the first surface 11A at the boundary between the first region 70A and the second region 70B.
- the resin portion 13 is made of a resin 13A that is in close contact with the lid member 31 and in close contact with the second region 70B of the first surface 11A.
- the electronic component 12 that is the first electronic component is mounted on the second region 70B of the first surface 11A.
- the substrate 71 which is the fourth substrate includes the first surface 72 of the fourth substrate and the fourth substrate on the opposite side to the first surface 72 of the fourth substrate.
- the second surface 73 and the fourth substrate And a communication hole 74 penetrating between the first surface 72 and the second surface 73 of the fourth substrate.
- an electronic component 75 which is a fifth electronic component, is mounted on the first surface 72 of the fourth substrate, and an electronic component, which is a sixth electronic component, is mounted on the second surface 73 of the fourth substrate.
- Part 76 is mounted.
- the second surface 73 of the fourth substrate is bonded to the first region 70A of the first surface 11A of the substrate 11 which is the third substrate.
- the electronic component 75 that is the fifth electronic component is disposed in the first region 70A, and the electronic component 76 that is the sixth electronic component is disposed in the through hole 14.
- the resin 13A of the resin part 13 is in close contact with the lid member 15, so that the mounting strength of the lid member 15 on the substrate 11 can be improved.
- the electronic component 12 that is the first electronic component is covered with the resin portion 13, so that the mounting strength of the electronic component 12 on the substrate 11 can be improved.
- the lid member 15 and the electronic component 12 which is the first electronic component 12 are collectively covered by the grease part 13, so that the mounting strength of the lid member 15 is improved and the electronic component 1 2 Due to the synergistic effect with the improvement in mounting strength, the rigidity including bending strength and torsional strength as the substrate 11 is improved.
- the electronic component 75 is mounted in the internal space 42 formed in the first region 70A of the first surface 11A of the substrate 11 by the lid member 15, so that the magnetic permeability
- an electronic component 75 that does not want to be exposed to a resin having a dielectric constant different from that of air can be mounted on the first surface 11A of the substrate 11.
- the air in the internal space 42 formed by the lid member 15 communicates with the outside through the communication hole 74 provided in the substrate 71 which is the fourth substrate.
- the temperature in the internal space 42 formed by the lid member 15 can be maintained equal to the external temperature, thereby preventing the electronic component 45 from being overheated.
- the electronic component 75 is mounted on the substrate 71, which is a separate body from the substrate 11. Since multiple types of electronic components of different types and functions are prepared in advance as modules mounted on the board 71, these modules are selected as appropriate and the board 71 is bonded to the board 11. In addition, the degree of freedom in design such as easy design changes can be increased, and evaluation of a single module can be easily performed.
- the electronic component 75 which is the fifth electronic component
- the substrate structure 70 the electronic component 75, which is the fifth electronic component
- the substrate which is the fourth substrate
- the substrate which is the fourth substrate
- the electronic component 76 which is the sixth electronic component
- the mounting density per unit surface area of the substrate 71 is improved, and the electronic device is reduced in size and thickness. It is advantageous.
- first surface, the second surface, the first region, the second region, the through hole, the substrate (the first substrate to the fourth substrate), the lid exemplified in each of the embodiments described above
- the material, shape, form, number, position, etc. of the parts, grease, grease parts, electronic parts (1st to 6th electronic parts), uprights, etc. are not limited to each embodiment. Changes within a range where the present invention can be implemented can be appropriately made.
- the present invention is applied to a substrate structure and an electronic device in which an electronic component is mounted along one mounting surface of a substrate, the electronic component is covered with a resin portion, and the resin portion is closely attached to the mounting surface. It is suitable for.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Telephone Set Structure (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200780003636XA CN101375645B (zh) | 2006-01-26 | 2007-01-26 | 基板结构及电子设备 |
EP07707539A EP1978792B1 (en) | 2006-01-26 | 2007-01-26 | Substrate structure and electronic device |
JP2007556024A JPWO2007086525A1 (ja) | 2006-01-26 | 2007-01-26 | 基板構造および電子機器 |
US12/162,211 US8106307B2 (en) | 2006-01-26 | 2007-01-26 | Substrate structure and electronic apparatus |
DE602007013002T DE602007013002D1 (de) | 2006-01-26 | 2007-01-26 | Substratstruktur und elektronische anordnung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-017844 | 2006-01-26 | ||
JP2006017844 | 2006-01-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007086525A1 true WO2007086525A1 (ja) | 2007-08-02 |
Family
ID=38308961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/051307 WO2007086525A1 (ja) | 2006-01-26 | 2007-01-26 | 基板構造および電子機器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8106307B2 (ja) |
EP (1) | EP1978792B1 (ja) |
JP (1) | JPWO2007086525A1 (ja) |
KR (1) | KR20080087108A (ja) |
CN (1) | CN101375645B (ja) |
DE (1) | DE602007013002D1 (ja) |
WO (1) | WO2007086525A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008040501A1 (de) * | 2008-07-17 | 2010-01-21 | Robert Bosch Gmbh | Verbesserte Wärmeabfuhr aus einem Steuergerät |
DE102010062758A1 (de) * | 2010-12-09 | 2012-06-14 | Zf Friedrichshafen Ag | Leiterplattenanordnung |
DE102010062759A1 (de) * | 2010-12-09 | 2012-06-14 | Zf Friedrichshafen Ag | Leiterplattenanordnung |
EP2473012A1 (en) * | 2010-12-30 | 2012-07-04 | Research In Motion Limited | Combining printed circuit boards |
KR102046864B1 (ko) | 2013-03-13 | 2019-11-20 | 삼성전자주식회사 | 유연성 디스플레이 장치 |
KR102042678B1 (ko) * | 2013-03-25 | 2019-11-11 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
WO2015198870A1 (ja) * | 2014-06-23 | 2015-12-30 | 株式会社村田製作所 | 部品内蔵基板および部品内蔵基板の製造方法 |
CN204884440U (zh) * | 2015-08-27 | 2015-12-16 | 京东方科技集团股份有限公司 | 柔性显示面板和柔性显示装置 |
DE102018211105A1 (de) * | 2018-07-05 | 2020-01-09 | Zf Friedrichshafen Ag | Elektronikmodul für eine Getriebesteuereinheit und Getriebesteuereinheit |
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JP2006017844A (ja) | 2004-06-30 | 2006-01-19 | Ricoh Co Ltd | 帯電装置、プロセスカートリッジ及び画像形成装置 |
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JPS5548973B2 (ja) * | 1973-02-06 | 1980-12-09 | ||
JPH03211756A (ja) * | 1990-01-16 | 1991-09-17 | Nec Corp | 混成集積回路装置 |
JPH0590448A (ja) | 1991-09-27 | 1993-04-09 | Sanyo Electric Co Ltd | 混成集積回路 |
JP2511733Y2 (ja) * | 1993-12-16 | 1996-09-25 | 株式会社石井表記 | 電子部品付メンブレンスイッチ装置 |
JPH088509A (ja) * | 1993-12-28 | 1996-01-12 | Ibiden Co Ltd | Icカード用プリント配線板 |
JP3127699B2 (ja) * | 1994-01-31 | 2001-01-29 | 国産電機株式会社 | 樹脂モールド型電子回路ユニット及びその製造方法 |
JP2000150325A (ja) * | 1998-11-13 | 2000-05-30 | Matsushita Electric Ind Co Ltd | 電子部品およびこれを実装する配線板 |
JP3241699B2 (ja) | 1999-07-27 | 2001-12-25 | サミー株式会社 | 遊技機 |
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JP2001267710A (ja) | 2000-03-15 | 2001-09-28 | Sony Corp | 電子回路装置および多層プリント配線板 |
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JP2004020703A (ja) * | 2002-06-13 | 2004-01-22 | Nanox Corp | 液晶表示装置 |
JP2004039723A (ja) * | 2002-07-01 | 2004-02-05 | Matsushita Electric Ind Co Ltd | 回路部品内蔵モジュールおよびその製造方法 |
JP3858801B2 (ja) * | 2002-10-10 | 2006-12-20 | 株式会社日立製作所 | 車載ミリ波レーダ装置,ミリ波レーダモジュールおよびその製造方法 |
JP4543772B2 (ja) * | 2003-09-19 | 2010-09-15 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
JP4473141B2 (ja) * | 2005-01-04 | 2010-06-02 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
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2007
- 2007-01-26 KR KR1020087015909A patent/KR20080087108A/ko active IP Right Grant
- 2007-01-26 DE DE602007013002T patent/DE602007013002D1/de active Active
- 2007-01-26 WO PCT/JP2007/051307 patent/WO2007086525A1/ja active Application Filing
- 2007-01-26 JP JP2007556024A patent/JPWO2007086525A1/ja active Pending
- 2007-01-26 US US12/162,211 patent/US8106307B2/en not_active Expired - Fee Related
- 2007-01-26 EP EP07707539A patent/EP1978792B1/en not_active Expired - Fee Related
- 2007-01-26 CN CN200780003636XA patent/CN101375645B/zh not_active Expired - Fee Related
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JPH08236876A (ja) * | 1995-02-28 | 1996-09-13 | Canon Inc | 基 板 |
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See also references of EP1978792A4 |
Also Published As
Publication number | Publication date |
---|---|
CN101375645A (zh) | 2009-02-25 |
US8106307B2 (en) | 2012-01-31 |
EP1978792A4 (en) | 2009-08-12 |
CN101375645B (zh) | 2010-09-08 |
EP1978792A1 (en) | 2008-10-08 |
KR20080087108A (ko) | 2008-09-30 |
JPWO2007086525A1 (ja) | 2009-06-25 |
DE602007013002D1 (de) | 2011-04-21 |
US20090032298A1 (en) | 2009-02-05 |
EP1978792B1 (en) | 2011-03-09 |
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