WO2007058159A1 - Composition d'adhésif, matériau de connexion de circuits, structure de connexion et procédé de connexion d'éléments de circuits - Google Patents

Composition d'adhésif, matériau de connexion de circuits, structure de connexion et procédé de connexion d'éléments de circuits Download PDF

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Publication number
WO2007058159A1
WO2007058159A1 PCT/JP2006/322628 JP2006322628W WO2007058159A1 WO 2007058159 A1 WO2007058159 A1 WO 2007058159A1 JP 2006322628 W JP2006322628 W JP 2006322628W WO 2007058159 A1 WO2007058159 A1 WO 2007058159A1
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WIPO (PCT)
Prior art keywords
circuit
particles
connection
adhesive composition
conductive
Prior art date
Application number
PCT/JP2006/322628
Other languages
English (en)
Japanese (ja)
Inventor
Tomomi Yokozumi
Masaki Fujii
Kenzou Takemura
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2007545234A priority Critical patent/JP4877230B2/ja
Priority to KR1020087011623A priority patent/KR101049609B1/ko
Priority to CN2006800430380A priority patent/CN101309993B/zh
Priority to KR1020117009581A priority patent/KR20110048079A/ko
Publication of WO2007058159A1 publication Critical patent/WO2007058159A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution

Abstract

Composition d'adhésif comprenant un composant adhésif et des particules conductrices (10) dispersées dans le composant adhésif. La particule conductrice (10) comprend une particule de matériau de base (1) constituant la partie centrale, une couche de placage métallique (3) recouvrant au moins une partie de la surface de la particule de matériau de base (1), et une pluralité de fines particules de métal (2) agencées à l'intérieur de la couche de placage métallique (3) et sur la surface de la particule de matériau de base (1).
PCT/JP2006/322628 2005-11-18 2006-11-14 Composition d'adhésif, matériau de connexion de circuits, structure de connexion et procédé de connexion d'éléments de circuits WO2007058159A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007545234A JP4877230B2 (ja) 2005-11-18 2006-11-14 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法
KR1020087011623A KR101049609B1 (ko) 2005-11-18 2006-11-14 접착제 조성물, 회로 접속 재료, 접속 구조 및 회로부재의접속방법
CN2006800430380A CN101309993B (zh) 2005-11-18 2006-11-14 粘接剂组合物、电路连接材料、连接结构及电路部件连接方法
KR1020117009581A KR20110048079A (ko) 2005-11-18 2006-11-14 접착제 조성물

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JP2005-334235 2005-11-18
JP2005334235 2005-11-18
JP2006178346 2006-06-28
JP2006-178346 2006-06-28

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WO2013129438A1 (fr) * 2012-03-02 2013-09-06 デクセリアルズ株式会社 Matière de connexion de circuit et procédé de fabrication d'une unité montée l'utilisant
JP2014510192A (ja) * 2011-11-24 2014-04-24 ハンワ ケミカル コーポレイション 導電性粒子およびその製造方法
WO2014088095A1 (fr) * 2012-12-06 2014-06-12 積水化学工業株式会社 Matériau conducteur, structure de connexion et procédé de production d'une structure de connexion
JP2015057757A (ja) * 2013-08-09 2015-03-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
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KR101049609B1 (ko) 2011-07-14
TW200730599A (en) 2007-08-16
TWI367246B (fr) 2012-07-01
KR20110048079A (ko) 2011-05-09
JPWO2007058159A1 (ja) 2009-04-30
TW201202375A (en) 2012-01-16
JP2011231326A (ja) 2011-11-17
CN101309993B (zh) 2012-06-27
CN101309993A (zh) 2008-11-19
KR20080072658A (ko) 2008-08-06

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