Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
  • C23F1/00—Etching metallic material by chemical means
  • C23F1/10—Etching compositions
  • C23F1/14—Aqueous compositions
  • C23F1/16—Acidic compositions
  • C23F1/28—Acidic compositions for etching iron group metals
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
  • C23F1/00—Etching metallic material by chemical means
  • C23F1/10—Etching compositions
  • C23F1/14—Aqueous compositions
  • C23F1/16—Acidic compositions
• • C—CHEMISTRY; METALLURGY
  • C01—INORGANIC CHEMISTRY
  • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
  • C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
  • C01B15/01—Hydrogen peroxide
  • C01B15/037—Stabilisation by additives
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
  • C23F1/00—Etching metallic material by chemical means
  • C23F1/10—Etching compositions
  • C23F1/14—Aqueous compositions
  • C23F1/16—Acidic compositions
  • C23F1/18—Acidic compositions for etching copper or alloys thereof

Definitions

• the present invention relates to novel, storage-stable solutions, with the help of which in semiconductor technology targeted metallization layers of copper but also Cu / Ni layers can be etched. With the new etching solutions, it is possible to etch and pattern pure copper metallizations, layers of copper-nickel alloys as well as superimposed copper and nickel layers.
• Etching mixtures containing H2 ⁇ 2-for stabilization of acidic and prevent the decomposition of H2O2 by Fe ions is known from DE 2405214 A, the addition of EDTMPA (Dequest ® 2041).
• multilayer layers consisting of Cu and Ni layers are used, which are closed at the top by a noble metal layer (Au) for external contacts and down through a Ti or TiW layer.
• Au noble metal layer
• these layers are individually etched by individual etching solutions.
• a larger number of process steps corresponding to the layer structure is required for structuring.
• the number of process steps increases the requirements for process accuracy, since possible residual layers in each subsequent process step can have extremely disruptive effects.
• layer sequences of Cu and Ni are usually processed so far in separate etching steps with different etching solutions.
• a copper layer are etched by means of a H2 ⁇ 2 / NH4 ⁇ H solution, while a nickel layer by means of an acidic Ammoniumperoxodisulfatans etch.
• a solution of HNO3 / H2O2 can be used to etch a layer sequence of Cu and Ni in a single operation.
• strongly decreasing etch rates occur during etching. The reason for this is to be found in the fact that the entry of Cu and / or Ni ions in the solution, a catalytic decomposition of the hydrogen peroxide contained in the solution.
• the composition of the etching solution changes after the first etching attack on Cu-containing metallizations, regardless of whether another Cu entry occurs or not.
• the etching rates for Cu and Ni change dramatically. This means that the use of unstabilized etching solutions based on is only partially possible for the etching of Cu and Ni layers and stable ⁇ tzraten would be achieved only with greater technological complexity.
• the solution of the present object is achieved by new, stabilized etching solutions for etching copper and nickel layers, or layers of corresponding alloys containing nitric acid (HNO3), hydrogen peroxide (H2O2), citric acid and water, in particular by etching solutions containing nitric acid in an amount of from 5 to 50% by weight, based on the total composition, and hydrogen peroxide in an amount of from 1 to 10% by weight, based on the total composition.
• citric acid may be contained in an amount of 0.5 to 10% by weight based on the total composition.
• etching results are found with corresponding solutions in which nitric acid (HNO 3) in an amount of 15 to 35 wt .-%, based on the total composition, of hydrogen peroxide (H 2 O 2) in an amount of 2 to 6% by weight, based to the total composition, and citric acid in an amount of 2.5 to 6.5% by weight, based on the total composition.
• HNO 3 nitric acid
• H 2 O 2 hydrogen peroxide
• citric acid in an amount of 2.5 to 6.5% by weight
• these etching solutions can be used in semiconductor technology.
• the invention also relates to a method of etching successive copper and nickel layers in semiconductor technology, wherein semiconductor elements having respective layers are immersed in an etching solution as described above for a sufficiently long time and after in a single step Metal layers have been etched away, be removed from the etching solution and washed with water and dried.
• the concentration of the added citric acid may be in the range of 0.5-10% by weight based on the total composition, with the range of 2.5-6.5% by weight being preferred.
• Suitable solutions for etching metallizations from pure copper or nickel layers or from corresponding alloys may contain from 5 to 50% by weight of HNO 3, based on the total composition. Preference is given to using etching solutions in which the concentration is in the range from 15 to 35% by weight.
• the content of H2O2 may range from 1 to 10% by weight, based on the total composition.
• Particularly preferred are compositions having a hfeG ⁇ content in the range between 2 to 6 wt .-%.
• etching solutions highly purified salicylic acid having a concentration of 69.5% by weight and a quality such as is commonly used in semiconductor technology can be used.
• the effective as etchant hydrogen peroxide can be used in the form of a high purity aqueous solution. This solution may be considered unstabilized when freshly prepared. However, it can also be stabilized, for example by suitable amounts of dipicolinic acid or EDTMPA. Preference is given to H2O2 as purified, 31
• Wt .-% commercial, aqueous solution used, which is stabilized with dipicolinic acid.
• appropriate amounts of highly purified water having a quality suitable for use in semiconductor technology are added.
• the preparation of the etching solutions may be accomplished by adding a weighed amount of citric acid to an appropriate amount of undiluted hydrogen peroxide solution which may be stabilized.
• the citric acid-containing hydrogen peroxide solution thus obtained can now be suitably mixed, optionally with cooling, with a measured amount of concentrated nitric acid and diluted with highly purified water.
• the first variant has proved to be more suitable.
• aqueous etching solutions containing nitric acid, hydrogen peroxide and water in addition to citric acid as stabilizer for the hydrogen peroxide contained and optionally in small amounts one or more stabilizers which were contained in the concentrated hydrogen peroxide solution.
• the latter compounds may be such as dipicolinic acid, EDTMPA or other commercially used stabilizers.
• these solutions are particularly suitable in semiconductor technology for etching copper and nickel layers or of corresponding alloy layers and can have a virtually unchanged etching rate for a long time in the etching process.
• additives such as wetting agents, surfactants u. a., are added.
• Such additives serve to improve the wettability of the metallic surfaces and can thus contribute to the improvement of the etching process.
• corresponding additives are not absolutely necessary since, in general, without further additions at high etching rates, excellent etching results are achieved.
• the etching solutions according to the invention are problem-free, even at elevated temperatures, virtually unchanged and sufficiently stable. They can be used up to a temperature of about 90 ° C. Particularly good results are achieved when using the solutions in the temperature range from about 10 to 40 ° C.
• the etching steps to be carried out in semiconductor technology can therefore preferably take place at room temperature.
• the use of the described novel etching solutions for etching Cu / Ni layers in semiconductor technology takes place in a manner known per se.
• the wafers to be treated on which copper, nickel or copper / nickel layers are to be etched are immersed in an immersion bath with etching solution as described above at a suitable temperature.
• the etching process is terminated after an etching period of 20 seconds to a few minutes by removing the wafers from the etching solution and rinsing with high-purity water.
• the rinsing process can be done several times. Subsequently, the wafers are dried in a known manner.
• the novel compositions of the etching solutions according to the invention have the advantage that it is possible to work with a high etch rate over the entire duration of the process step and that the etching solution can be used for a longer time. At the same time, it has been found that the shortened etch time can almost completely avoid adverse effects of the etching solution on the remaining structure of the wafer. This is especially true for otherwise common "lift-off effects and in terms of unwanted redeposition of metal ions on the wafer surface. It has been shown in this connection that the addition of citric acid prevents the catalytic decomposition of the hydrogen peroxide by Cu or Ni ions as well as a contamination of the surfaces by etching products.
• the etching process under the action of the The compositions according to the invention obviously proceed according to a different mechanism than when using the etching solutions previously used for these metallization layers.
• the dissolution of the metallization layers does not occur by the simple detachment of metal particles, but apparently by dissolution of the exposed metal layers. Accordingly, as good as no particles can be detected in the etching solution after the etching process has taken place. This has the particular advantage that no quality reductions due to unwanted deposition of particles on the wafer surfaces occurs.
• the short reaction times minimize possible etching of the exposed layers and remaining areas of the wafer to a minimum.
• the etching solutions according to the invention are capable of etching both copper and nickel layers, it is readily possible to etch successive copper and nickel layers in a single process step with these solutions, so that the previous two-stage etching process using different etching solutions for copper and nickel can be replaced by a single process step and only one etching solution must be used. In this way, the use of the etching solutions according to the invention leads to considerable material, time and cost savings.
• the one-step etching step for successive layers of copper and nickel can avoid problems that previously resulted from remaining remnants of copper and nickel.

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• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Inorganic Chemistry (AREA)
• ing And Chemical Polishing (AREA)
• Weting (AREA)
• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

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• 2005
  • 2005-08-12 DE DE102005038414A patent/DE102005038414A1/de not_active Withdrawn
• 2006
  • 2006-08-07 CN CN2006800285160A patent/CN101238242B/zh active Active
  • 2006-08-07 KR KR1020087003474A patent/KR101339492B1/ko not_active Expired - Fee Related
  • 2006-08-07 EP EP06764305.6A patent/EP1917381B1/de active Active
  • 2006-08-07 WO PCT/EP2006/065104 patent/WO2007020206A1/de not_active Ceased
  • 2006-08-07 JP JP2008525563A patent/JP5101505B2/ja not_active Expired - Fee Related
  • 2006-08-07 US US12/063,033 patent/US8652972B2/en not_active Expired - Fee Related
  • 2006-08-11 TW TW095129626A patent/TWI424091B/zh active
• 2008
  • 2008-01-22 IL IL188939A patent/IL188939A/en active IP Right Grant

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