WO2006073098A1 - Procede et dispositif destines a briser un ouvrage, procede destine a rainurer et briser un ouvrage et dispositif de rainurage avec fonction de bris - Google Patents

Procede et dispositif destines a briser un ouvrage, procede destine a rainurer et briser un ouvrage et dispositif de rainurage avec fonction de bris Download PDF

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Publication number
WO2006073098A1
WO2006073098A1 PCT/JP2005/023953 JP2005023953W WO2006073098A1 WO 2006073098 A1 WO2006073098 A1 WO 2006073098A1 JP 2005023953 W JP2005023953 W JP 2005023953W WO 2006073098 A1 WO2006073098 A1 WO 2006073098A1
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WO
WIPO (PCT)
Prior art keywords
workpiece
sheet
work
break
scribe line
Prior art date
Application number
PCT/JP2005/023953
Other languages
English (en)
Japanese (ja)
Inventor
Toji Nakazawa
Takayoshi Shimotsuchi
Takanobu Hoshino
Masanori Mito
Akio Hanyu
Takaya Kono
Yoshiaki Shishido
Original Assignee
Thk Co., Ltd.
Beldex Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thk Co., Ltd., Beldex Corporation filed Critical Thk Co., Ltd.
Priority to JP2006550818A priority Critical patent/JP5037138B2/ja
Priority to KR1020077017975A priority patent/KR101170587B1/ko
Publication of WO2006073098A1 publication Critical patent/WO2006073098A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Definitions

  • the present invention relates to a work breaking method and apparatus for breaking a work made of a brittle material such as a semiconductor wafer and glass, a scribing and breaking method, and a scribing apparatus with a break function.
  • a dicing method As a method for breaking (breaking) a work having brittle material strength such as a semiconductor wafer and glass into a predetermined shape, a dicing method has been employed in which the work is fed into a rotary blade and divided into dice. In this dicing method, the volume of the part sent to the rotary blade of the workpiece is removed.
  • FIG. 29 shows a principle diagram of a conventional break method.
  • a work 2 is placed between two support points la and lb, and a pressure is applied between the support points la and lb by a break head 3 from above.
  • the pressure force is applied from the side opposite to the side on which the scribe line is engraved.
  • a bending moment is generated in the work 2
  • tensile stress is generated in the part where the scribe line is carved by this bending moment. Due to this bow I tension stress, the cracks on the scribe line propagate with the surface force toward the back surface (in FIG. 29, from bottom to top). When the crack reaches the back of the workpiece, the workpiece is divided.
  • Patent Document 2 describes that “a glass substrate bonded body W formed by bonding a pair of glass substrates SI and S2 is provided for each liquid crystal cell.
  • a glass substrate S1 with a cut-out groove formed along the dividing line S1 is placed on the spherical support head 71 with the surface facing upward, and a sufficiently flexible presser sheet 73 is mounted on this through the exhaust pipe 71b.
  • the glass substrate assembly W is brought into close contact with the support head surface 71a that forms a spherical surface.
  • a method of dividing the substrate SI along the notch groove is disclosed (see Patent Document 2 and Claim 1).
  • Patent Document 1 Japanese Patent Laid-Open No. 9 202635
  • Patent Document 2 Japanese Patent Laid-Open No. 2004-354836
  • an object of the present invention is to provide a workpiece breaking method and apparatus capable of preventing occurrence of chipping due to rubbing on a divided section of a workpiece when a workpiece having a scribe line is cut. .
  • the invention according to claim 1 is a work breaking method for dividing a work (5) having a scribe line on its surface along the scribe line (5c).
  • a sheet pulling step of pulling the sheet (9) to which the workpiece (5) is attached, and the sheet ( 9) Pull the scribe line (5c) to the back of the workpiece while pulling A dividing step, wherein the divided workpiece (5) is separated by a tensile force of the sheet (9).
  • the workpiece is separated at the same time as being divided, the rubs between the divided workpieces are reduced, and the occurrence of chipping on the back surface can be prevented.
  • the tensile force can assist in parting the workpiece, so it is possible to break with a smaller force.
  • the divided work is not separated or rubbed. Therefore, handling of the workpiece becomes easy.
  • the invention according to claim 2 is the workpiece breaking method according to claim 1, wherein in the workpiece dividing step, the surface side of the workpiece (5) is in a bay while the sheet (9) is pulled. The workpiece (5) is bent so as to be on the outer side of the tune, whereby the scribe line (5c) reaches the back surface of the workpiece (5).
  • a thick workpiece can be divided without causing chipping by using a bending moment and a tensile force in combination.
  • the invention according to claim 3 is the work breaking method according to claim 1 or 2, wherein in the sheet pulling step, after the sheet (9) is pulled, around the work (5).
  • the frame member (12) is attached to the sheet (9) with a gap, and the tension of the sheet (9) is confined in the frame member (12).
  • the tensile force can be continuously applied to the workpiece.
  • the invention according to claim 4 is a workpiece breaking device for cutting a workpiece (5) having a scribe line on its surface along the scribe line (5c), the workpiece (5)
  • the sheet tension means (10, 11, 14a, 14b) that stretches the stretchable sheet (9) to which the back surface of the workpiece (9) is attached, and the surface of the workpiece (5) with the sheet (9) being pulled
  • the divided work (5) is separated by the tensile force of the sheet (9).
  • the workpiece is separated at the same time as being divided, It is possible to prevent the occurrence of chipping on the back surface. Also, by using bending moment and tensile force in combination, a thick workpiece can be divided without causing chipping. In addition, since the work is pasted on the sheet, after the work is broken, the divided work is not separated or rubbed. Therefore, handling of the workpiece becomes easy.
  • the invention according to claim 5 is directed to the scribe and break of a work that divides the cake (5) along the scribe line (5c) while scribing the scribe line (5c) on the surface of the work (5).
  • a workpiece dividing step to be reached wherein the divided workpiece (5) is separated by a tensile force of the sheet (9).
  • the friction between the divided works is reduced, and the occurrence of chipping on the back surface can be prevented.
  • the tensile force assists the workpiece division, so that the workpiece can be broken simultaneously with the scribe.
  • the divided workpiece does not break apart or rub. Therefore, the handling of the workpiece becomes easy.
  • the invention described in claim 6 is a scribing device with a break function that cuts the cake (5) along the scribe line while scoring the scribe line (5c) on the surface of the workpiece (5).
  • (5c) and a workpiece cutting means (20) for cutting the workpiece (5) by reaching the back surface of the workpiece (5) with the scribe line (5c) on the surface of the workpiece (5). ), And the separated workpiece (5) is separated by a tensile force of the sheet (9).
  • the workpiece is separated at the same time as being divided, the rubs between the divided workpieces are reduced, and the occurrence of chipping on the back surface can be prevented. Also ⁇ By applying a tensile force to the workpiece, the tensile force assists the workpiece separation, so it is possible to break simultaneously with the scribe of the workpiece. In addition, since the workpiece is pasted on the sheet, after the workpiece is broken, the divided workpiece does not break apart or rub. Therefore, the handling of the workpiece becomes easy.
  • the invention described in claim 7 is a method of breaking a work (51) in which a work (51) having a scribe line (52) engraved on a surface thereof is divided along the scribe line (52).
  • the workpiece (51) is bent so as to be on the outside, and thereby the scribe line (52) on the surface of the workpiece (51) reaches the back surface of the workpiece (51) to divide the workpiece (51). It is characterized by comprising a work dividing process.
  • the sheet since the sheet is on the back side of the workpiece, the sheet does not prevent the workpiece from breaking by opening the scribe line on the front side of the workpiece. Therefore, it is possible to prevent the chipping from being generated by rubbing the work section. In addition, by attaching the workpiece to the sheet, the workpiece after splitting does not fall apart.
  • the invention according to claim 8 is the workpiece breaking method according to claim 7, wherein in the workpiece dividing step, the workpiece (51) in which a plurality of scribe lines (52) are cut vertically and horizontally is used. A step of cutting along the semi-cylindrical break table (55) to divide the work (51) into a plurality of strips, and then the sheet (53) retracted from the break table (55). ) With respect to the break table (55), the relative rotation step of rotating 90 degrees in a plane including the sheet (53), and the work (51) divided into strips, A chip cutting step of bending again along the table (55) and cutting the workpiece (51) into a plurality of chips.
  • a work in which scribe lines are engraved vertically and horizontally can be divided into chips that do not cause chipping. Then, the workpiece is divided in two steps using a semi-cylindrical break table. Therefore, the workpiece is curved along the break table as compared with the case where the workpiece is divided in one step using a spherical break table. At this time, the force along the scribe line becomes difficult to work, and the work section is not rubbed.
  • the invention according to claim 9 is the workpiece breaking method according to claim 7 or 8, wherein in the workpiece dividing step, the workpiece (51) is provided by suction holes (56, 66) for sucking air. The workpiece (51) is bent along the break table (55, 65) by adsorbing the sheet (53) to which the workpiece is attached to the break table (55, 65).
  • the work can be curved along the break table by sucking the suction hole force air.
  • the invention according to claim 10 is the workpiece breaking method according to claim 7 or 8, wherein in the workpiece dividing step, the workpiece (53) is perpendicular to the plane including the sheet (53).
  • the break table (55, 65) By moving the break table (55, 65) relative to the sheet (53) and pressing the break table (55, 65) against the sheet (53) to which the workpiece (51) is attached The workpiece (51) is curved along the break table (55, 65).
  • the work can be curved along the break table by pressing the sheet to which the work is attached to the break table. Also, since the tensile force is applied to each workpiece before dividing the workpiece, when the workpiece is divided, the divided workpieces tend to be separated from each other. Therefore, the work section is not rubbed.
  • the invention according to claim 11 is a workpiece breaking device for cutting a workpiece (51) having a scribe line (52) engraved on a surface thereof along the scribe line (52), the workpiece (51) 51) and a work table (55, 65) to bend the sheet (53) to which the back surface of the work (51) is attached, is brought into close contact with the work table (55, 65).
  • Sheet contact means (56, 66, 64) for bending the workpiece (51) so that the surface of the workpiece (51) is outside the curve, and the scribe line (52) on the surface of the workpiece (51) is provided.
  • the workpiece (51) is made to reach the back surface to divide the workpiece (51).
  • the sheet since the sheet is on the back side of the workpiece, the sheet does not prevent the workpiece from breaking by opening the scribe line on the front side of the workpiece. Therefore, it is possible to prevent the chipping from being generated by rubbing the work section. In addition, by attaching the workpiece to the sheet, the workpiece after splitting does not fall apart.
  • the invention described in claim 12 is the workpiece breaker according to claim 11, wherein the contact means (56, 66) is configured such that the break table (55, 65) is high, the positional force is low, Height difference in position And a plurality of suction holes (56, 66) for sucking air, and by sucking the sheet (53) through the suction holes (56, 66), the workpiece (51) is It is characterized by being in close contact with the break table (55, 65).
  • the work can be brought into close contact with the break table in order toward the position where the high position force of the break table is low. Since the high position force of the work is divided in order toward the low position, it is possible to prevent the cross section of the work from rubbing and chipping.
  • the invention described in claim 13 is the workpiece breaker according to claim 12, wherein the contact means further supplies air in order to the suction holes (56, 66) at a position with a high position force and a low position.
  • a plurality of solenoid valves (63) for suction are provided.
  • the workpiece is high !, the position force is low !, and the workpiece can be securely brought into close contact with the brake table toward the position.
  • the invention according to claim 14 is the workpiece breaker according to claim 11, wherein the contact means is disposed so as to sandwich the break table (55, 65), and the sheet (53) A seat fixing base (64) for holding the end of the sheet base, and the break base (55, 65) relative to the sheet fixing base (64) in a direction perpendicular to a plane including the seat (53).
  • a pressing mechanism for moving the workpiece (51), and the workpiece (51) is pressed against the break table (55, 65) by pressing the sheet (53) to which the workpiece (51) is adhered. (55,65) characterized by a curve.
  • the work can be curved along the break table by pressing the sheet to which the work is attached to the break table. Also, since the tensile force is applied to each workpiece before dividing the workpiece, when the workpiece is divided, the divided workpieces tend to be separated from each other. Therefore, the work section is not rubbed.
  • the invention of claim 15 is the workpiece breaker according to any one of claims 11 to 14, wherein the breaker has a plurality of scribe lines carved vertically and horizontally. Is bent along a semi-cylindrical break table (55), the work (51) is divided into a plurality of strips, and then the sheet (53) retracted from the break table (55) Relative to the break table (55) by 90 degrees relative to the plane including the seat (53). Then, the work (51) divided into strips is bent again along the break table (55) to divide the work (51) into a plurality of chips.
  • a work in which scribe lines are engraved vertically and horizontally can be divided into chips that do not cause chipping. Then, the workpiece is divided in two steps using a semi-cylindrical break table. Therefore, the workpiece is curved along the break table as compared with the case where the workpiece is divided in one step using a spherical break table. At this time, the force along the scribe line becomes difficult to work, and the work section is not rubbed.
  • FIG. 1 is a principle diagram of a work breaking method according to a first embodiment of the present invention.
  • FIG. 3 is a principle diagram of a work breaking method according to a second embodiment of the present invention.
  • FIG.4 Schematic diagram of a method of applying tensile force to a workpiece using a sheet
  • FIG. 5 is a perspective view showing the breaking device according to the first embodiment of the present invention.
  • FIG. 6 Perspective view showing a tensioning mechanism for applying a tensile force to the workpiece
  • FIG. 7 A diagram showing cracks generated by the break device ((A) in the figure shows the case where the break device of this embodiment is used, and (B) in the figure uses a conventional break device as a comparative example) Show the case)
  • FIG. 8 is a perspective view showing a scribing device with a break function according to a second embodiment of the present invention.
  • FIG. 9 A diagram showing the scribing device with a break function shown in Fig. 8 ((A) shows a plan view and (B) shows a side view).
  • FIG. 10 is a diagram showing cracks generated by the scribing device with a break function shown in FIG. 8 ((A) in the figure shows the case where the scribing device of this embodiment is used, and (B) in the figure is a conventional example as a comparative example) Shows the case of using the scribe device of
  • FIG. 11 is a perspective view showing a scribing device with a break function according to a third embodiment of the present invention.
  • FIG. 12 is a diagram showing cracks generated by the scribe device with a break function shown in FIG. 11 ((A) in the figure shows the case where the scribe device with a break function of the present embodiment is used)
  • FIG. 22 Perspective view showing an example in which a stretchable sheet is pulled in a state where a workpiece is attached to the sheet.
  • FIG. 23 is a plan view showing another example of suction holes formed in the break table.
  • FIG. 30 is a cross-sectional view showing a conventional break device ((A) in the figure shows before the workpiece is sucked, and (B) in the figure shows after the workpiece is sucked).
  • FIG. 1 shows a principle diagram of a work breaking method according to the first embodiment of the present invention.
  • a scribe line is engraved by a scribing device.
  • the scribing device presses a pointed point or a freely rotating thin disk (wheel) as a cutter against the surface of the workpiece, and moves the cutter along the surface of the workpiece to engrave the scribe line on the surface of the workpiece.
  • the workpiece 5 After scribing a scribe line on the surface of the workpiece, the workpiece 5 is set on the breaking device.
  • the breaking device gives a bending moment to the workpiece 5 so that the side 5a on which the scribe line is engraved is outside the curve.
  • a workpiece 5 is placed between two support points 6a and 6b (table), and an upward force and pressure are applied to the workpiece 5 between the support points 6a and 6b by the break head 7.
  • the pressure force is also applied to the opposite side of the scribe line 5a.
  • a bending moment is generated in the workpiece 5, and tensile stress is generated as bending stress in the portion where the scribe line is engraved by this bending moment. Due to the tensile stress, the crack propagates from the surface force toward the back surface (in this figure, from bottom to top).
  • a tensile force P is applied to the workpiece 5 in a direction perpendicular to the scribe line.
  • the workpiece 5 is pulled away at the same time as being divided, so the friction between the divided workpieces 5 is reduced and chipping occurs on the back surface (opposite side of the scribe side). Can be suppressed.
  • the tensile force P assists the workpiece division, so that the workpiece 5 can be broken with a smaller pressure of the break head 7.
  • the workpiece 5 can be broken only by applying a tensile force to the workpiece 5, the bending moment may not be applied to the workpiece 5.
  • a break roller can be used instead of the break head 7, or a linearly extending projection is formed on the table, and suction is performed to suck the workpiece onto the tables on both sides of the projection.
  • An apparatus may be provided, and the workpiece may be curved with the protrusion as a vertex.
  • FIG. 2 shows the bending stress generated by the bending moment.
  • bending stress ⁇ is generated in workpiece due to bending moment M.
  • the distribution of the bending stress ⁇ is shown in the figure, and tensile stress is generated below the neutral axis 5e, and compressive stress is generated above.
  • the compressive stress ⁇ generated on the upper side of the workpiece 5 causes the workpiece 5 to rub. Even if the tensile force ⁇ applied to the workpiece is smaller than the compressive stress ⁇ , the workpiece 5 can be pulled away at the same time as it is divided, so the friction of the workpiece 5 can be reduced.
  • FIG. 3 shows a principle diagram of a work breaking method according to the second embodiment of the present invention.
  • the work 5 is broken by applying a tensile force ⁇ to the work 5 in a direction perpendicular to the scribe line while scribing a scribe line on the surface of the work 5. That is, this In this embodiment, the scribing process for marking a scribe line on the work 5 and the breaking process for dividing the work are performed simultaneously.
  • the crack may not propagate to the back surface 5b only by applying a tensile force to the workpiece 5.
  • a tensile force is applied, and a bending moment is applied to the workpiece 5 so that the side 5a on which the scribe line is engraved is outside the curve.
  • FIG. 4 shows a principle diagram of a method for applying a tensile force to the workpiece 5 using the sheet 9.
  • the workpiece 5 is attached to the extendable sheet 9.
  • the sheet 9 has been previously given adhesiveness. Both ends of the sheet 9 are clamped to an expanding jig composed of, for example, a fixed side 10 and a movable side 11 movable with respect to the fixed side 10 as sheet pulling means. With the workpiece 5 attached to the sheet 9, the movable side 11 of the expanding jig is moved to pull the sheet 9 in a predetermined direction and apply a tensile force (tension) to the sheet 9.
  • the force shown in the example in which the workpiece 5 is pulled only in the X direction is not limited to the X direction.
  • the X direction and the Y direction perpendicular to the X direction may be pulled.
  • FIG. 4 (B) shows a state in which the sheet outside the ring 12 is cut.
  • Fig. 4 (C) shows a state in which the sheet outside the ring 12 is cut.
  • the tension is confined in the seat 9 between the workpiece 5 and the ring 12.
  • the portion of the sheet 9 to which the workpiece 5 is attached is not tensioned.
  • the work 5 to which tension is applied is transferred to the break device or the scribe device with a break function, and the work 5 is broken by the break device or the scribe device with the break function as shown in Fig. 4 (D).
  • tension is applied to the workpiece 5
  • the workpieces 5 are separated from each other at the same time as the division, and a gap is left between the workpieces 5.
  • UV irradiation etc. the adhesiveness of the sheet 9 is removed, and the work 5 is peeled off from the sheet 9.
  • the method for applying tension to the workpiece 5 by the sheet 9 as described above can be suitably used for a semiconductor wafer having a small size of the workpiece 5.
  • FIG. 5 shows a breaking device according to the first embodiment of the present invention.
  • the work 5 is set with the surface of the work 5 on which the scribe line 5c is engraved facing down.
  • a bar-shaped break head 16 extending in the direction of the scribe line 5c is disposed immediately above the scribe line 5c as a work dividing means.
  • the breaking device also presses the break head 16 with the upper surface force of the workpiece 5 to bend the workpiece 5 so that the side on which the scribe line is engraved is on the outside.
  • FIG. 6 shows a tension applying mechanism as a sheet pulling means for applying a tensile force to the work 5.
  • the workpiece 5 is attached to the sheet 9, and the sheet 9 is fixed to the pair of stages 14a and 14b by vacuum or the like. Thereafter, the stages 14a and 14b are moved in opposite directions, and the sheet 9 is pulled. Both stages 14a and 14b may be moved in opposite directions, or one stage 14a may be fixed and only the remaining one stage 14b may be moved.
  • the workpiece 5 may be attached to the sheet 9, and then the sheet 9 may be pulled with a clamping jig 22 that clamps both ends of the sheet 9.
  • two sets of force tensioning mechanisms that apply tensile force only to the X direction of the workpiece may be provided, and tensile force may be applied in the X and Y directions perpendicular to each other.
  • the ring 12 shown in Fig. 4 may be used.
  • Fig. 7 (A) shows the crack 5d generated in the workpiece 5. Pull on workpiece 5 Since the crack 5d can be developed by applying the force P, the work 5 can be broken with a small pressure from the break head 16. In addition, since the workpieces 5 are separated after being divided, it is possible to suppress the occurrence of chipping on the workpiece edge, and it is possible to break without applying an extra load (damage) to the divided section. Fig.
  • FIG. 7 (B) shows a comparative example when no tensile force is applied to workpiece 5. If no tensile force is applied to workpiece 5, there is no escape in the horizontal direction, so when the break head 16 is pressed against workpiece 5, chipping occurs on part A on the back, and the sectional surface of workpiece 5 is also rubbed and damaged. I will receive it. If the workpiece is thin, it can be cut only with the pulling force P without applying a bending moment M. In this case, the break head 16 that gives the bending moment M becomes unnecessary.
  • FIG. 8 and 9 show a scribing device with a break function according to the second embodiment of the present invention.
  • Fig. 8 shows a perspective view of the scribing device with a breaking function
  • Fig. 9 (A) shows a plan view of the scribing device with a breaking function
  • Fig. 9 (B) shows a side view of the scribing device with a breaking function.
  • This scribing device with a break function performs a scribing process and a breaking process at the same time.
  • a scribing head 20 (work cutting means) having a table 18 for supporting the work 5, a cutter 19 in contact with the work 5, and a scribing head. And a moving mechanism 21 for moving 20 linearly.
  • the scribe head 20 is provided with a vibrator such as a magnetostrictive vibrator or a piezoelectric element.
  • the magnetostrictive vibrator is vibrated by the current of the transmitter force, and the cutter 19 is vibrated by this vibrator.
  • an impact force is applied from the cutter 19 to the work 5, so that a crack develops in the thickness direction of the work 5.
  • the moving mechanism 21 for moving the scribe head 20 is a known moving mechanism such as a ball screw mechanism.
  • the workpiece 5 having the scribe line 5c engraved on the front surface is attached to a sheet 9 whose back surface can be expanded and contracted. Then, the sheet 9 to which the workpiece 5 is attached is pulled so that the tensile force P can be applied to the workpiece 5. That is, as shown in FIG. 9, the workpiece 5 is attached to the sheet 9, and then the sheet 9 is pulled with a clamping jig 22 that clamps both ends of the sheet 9. Of course, instead of the clamping jig 22, a tension applying mechanism shown in FIG. 9 may be pulled.
  • FIG. 8 shows the crack 5d.
  • the vertical crack 5d generated by the cutter 19 of the scribe head 20 can be further grown, and finally a full cut is also possible.
  • a tensile force P to the workpiece 5
  • a large vertical crack 5d can be formed even when the load from the cutter 19 is low.
  • Fig. 10 (B) shows a comparative example in which tensile force P is not applied to workpiece 5. If the tensile force P is not applied to the workpiece 5, the vertical crack 5d is difficult to grow and there is no escape space for the vertical crack 5d, so an extra load (damage) is applied to the sectional surface of the workpiece 5. When the load of the cutter 19 is increased to form a long vertical crack 5d, a large load is applied to the divided section, and the quality of the divided product's fracture strength is reduced.
  • FIG. 11 shows a scribing device with a break function according to the third embodiment of the present invention.
  • a feature of this embodiment is that a bending moment M is applied to the workpiece in the scribing device with a break function of the second embodiment.
  • the bending moment M is applied so that the side on which the scribe line 5c is engraved is outside the curve.
  • a bending moment M is also applied to the workpiece 5 to make it easy to divide the workpiece.
  • the method of giving a bending moment to the workpiece includes a method of giving a bending moment by three-point bending, a method of tilting one of a pair of tables holding the workpiece with respect to the scribe line to the other by a predetermined angle, A system is used in which one of a pair of clamping devices that hold a workpiece with a scribe line as a boundary is inclined with respect to the other by a predetermined angle. Since the scribing head 20 and the moving mechanism 21 are the same as those of the scribing apparatus of the second embodiment, the same reference numerals are given and description thereof is omitted.
  • Fig. 12 (A) is generated when the scribing device with a break function of the third embodiment is used. Indicates a crack that is born.
  • a tensile force P and bending moment M By applying a tensile force P and bending moment M to the workpiece 5, the vertical crack 5d generated by the scribing device can be further grown, and finally full cutting is also possible.
  • Fig. 12 (B) shows a comparative example in which tensile force ⁇ and bending moment M are not applied to workpiece 5.
  • the tensile force 'bending moment is not applied to the workpiece 5
  • the vertical crack 5d is difficult to grow and there is no escape space for the vertical crack 5d, so an extra load (damage) is applied to the dividing surface of the workpiece 5.
  • Increasing the load of the force tutter 19 to form long vertical cracks also applies a large load to the section, which reduces the quality of the product that is broken.
  • the dicing tape used is D-650 and expanding tape D-675 (manufactured by Adwill, width 300m, thickness 80m), which are generally used when dicing silicon wafers. Cut to an appropriate length and used.
  • Silicon wafer was affixed on dicing tape (D-675) and pulled 15mm each in X and Y directions.
  • dicing tape D-675
  • the sheet tensioned in the sheet pulling direction (X direction) and in the orthogonal direction (Y direction) (Fig. 14 (a)
  • Fig. 14 (b) When expanded, no wrinkles were seen (Fig. 14 (b)).
  • FIG. 18 to 21 show a breaking device according to a fourth embodiment of the present invention.
  • the thin plate semiconductor wafer as the work 51 is engraved with grid-like scribe lines 52 vertically and horizontally by a scriber.
  • the scribe line 52 is formed by, for example, pressing a pointed pyramid tool (point) or a freely rotating thin disk (wheel) against the surface of the workpiece and moving these tools along the surface of the workpiece 51.
  • a scribe line 52 is engraved on the surface of the work 51. When moving the tool along the workpiece 51, the tool may be vibrated.
  • the breaking device of the fourth embodiment unlike the breaking device of the first embodiment, a tensile force may be applied to the sheet 53 or may not be applied.
  • the workpiece 51 attached to the sheet 53 is placed on the middle / high break table 55 with the sheet 53 on the back side.
  • the break table 55 has a semi-cylindrical shape, and a plurality of suction holes 56 are formed on the surface as sheet contact means.
  • the suction hole 56 is connected to a suction path 57, and the suction path 57 finally communicates with one suction port 58.
  • the suction hole 56 in the central portion of the break table 55 is omitted.
  • a plurality of suction holes 56 are provided in the circumferential direction of the break table 55.
  • a vacuum pump (not shown) is connected to the suction port 58, and air is sucked from the suction port 58.
  • FIG. 20 shows a plan view of the semi-cylindrical break table 55
  • FIG. 21 shows a back view.
  • the plurality of suction holes 56 are arranged at the highest part of the break table 55 (on the line hi), and in addition to the highest part of the break table 55, the height is increased toward the position where the highest part force is low (line h2). Multiple columns are arranged with a difference.
  • the horizontal rows are the suction holes 56 having the same height.
  • Wl and W2 indicate the planar shapes of circular workpieces of different sizes.
  • the suction holes 56 are arranged so as to suck only the sheet 53 while avoiding the periphery of the work 51 or the lower surface of the work 51.
  • the suction holes 56 in the lower row are arranged in a larger number than in the higher row. These suction holes 56 are connected to suction grooves 59 formed on the back surface of the break table 55. As shown in FIG. 21, the suction groove 59 extends in the vertical direction and the horizontal direction, and is finally connected to the suction port 58.
  • the break table 55 is placed on a base having a flat surface (not shown), and a space between the surface of the base and the suction groove 59 of the break table serves as a passage for sucking air.
  • the suction hole 56 connected to the suction port 58 sucks air, and the sheet 53 is moved to the break table. Adheres to 55.
  • the sheets 53 are in close contact with the break table 55 in order. When the sheet 53 comes into close contact with the break table 55, the workpiece 51 attached to the sheet 53 also moves along the break table 55 so that the scribe line 52 is outside the curve as shown in FIG. Bend.
  • the sheet 53 is placed on the back side of the work 51 to facilitate the progress of the crack 54 to the work 51 as shown in FIG. If the sheet 53 is pasted on the front side of the work 51, the sheet 53 prevents the groove of the scribe line 52 from being opened by its elastic force, so that it is difficult to break. Further, by making the break table 55 into a semi-cylindrical shape and arranging the scribe line 52 of the workpiece 51 in parallel with the center line 55a of the break table, stress acts in the normal direction of the curved workpiece 51. For this reason, it can be prevented that the cross section of the work 51 is rubbed and chipping occurs.
  • the work 51 is divided only by the scribe line 52 parallel to the center line 55a of the break table 55.
  • the work 51 is divided into strips on the sheet 53 at the stage where the vertical and horizontal divisions are finished (the strip cutting process).
  • suction by the suction hole 56 is released, and the sheet 53 is retracted from the break table 55.
  • either the sheet 53 or the break table 55 is rotated 90 degrees in a plane including the sheet 53, for example, a horizontal plane (relative rotation process).
  • the remaining one of the vertical and horizontal scribe lines 52 becomes parallel to the center line 55a of the break table 55.
  • the workpiece 51 divided into strips is bent again along the break table 55 to divide the workpiece 51 into a plurality of chips (chip cutting step).
  • chip cutting step By dividing the work cutting process into a strip cutting process and a chip cutting process, the work 51 in which scribe lines are engraved vertically and horizontally can be divided into chips that do not cause chipping.
  • FIG. 22 shows an example in which the stretchable sheet 53 is pulled in a state where the workpiece 51 is attached to the sheet 53. If a tensile force is applied to the workpiece 51 when the workpiece 51 is divided, the workpieces 51 are separated at the same time as the workpiece 51 is divided, and a gap is left between the workpieces 51. Can be prevented. Therefore, as shown in FIG. 22, before the work 51 is divided, a tensile force may be applied to the stretchable sheet 53 with the work 51 attached to the sheet 53. Specifically, the periphery of the sheet 53 is pulled in the X direction and the Y direction, and a tensile force (tension t) is applied to the sheet 53 in the X direction and the Y direction.
  • the frame member 60 is pasted around the work 51 while maintaining the tension t.
  • a space is provided between the periphery of the work 51 and the frame member 60, and the tension is confined in the sheet 53 exposed around the work 51.
  • the suction hole 56 be disposed at a position where only the sheet 53 is sucked away from the lower surface of the work 51. This is because if the suction holes 56 are arranged on the lower surface of the workpiece 51, the workpieces 51 that are separated by the tensile force of the sticking force sheet 53 are separated from each other, but the workpieces 51 are not easily separated by the suction of the suction holes 56. Because.
  • the scribe line 52 is not required to be on a straight line, either in a strip cutting process in which the workpiece 51 is easily cut into strips, or in a chip cutting process in which the workpiece 51 is rotated by 90 degrees. Therefore, chipping is possible.
  • FIG. 23 shows another example of the suction hole 56 formed in the break table 55.
  • a groove 61 extending in a direction parallel to the center line 55 a of the break table 55 is formed on the surface of the break table 55.
  • the suction holes 56 are connected to the grooves 61, and a row of suction holes 56 are grouped by the grooves 61. If the suction holes 56 are grouped by the grooves 61, the workpieces 51 can be sucked evenly in the direction of the center line of the break table 55. Further, as shown in FIG. 24, it is also effective to enclose the periphery of the break table 55 with a box 62 in order to make the adsorption of the sheet 53 to the break table 55 stronger.
  • FIG. 25 shows an example in which a plurality of electromagnetic valves 63 are provided in the suction path 57 in order to suck air into the suction holes 56 in a position with a high position force and a low position in order.
  • the plurality of suction holes 56 are arranged up to the lower left and right positions as well.
  • a plurality of suction paths 57 are provided according to the height of the suction holes 56, and a plurality of suction holes 56 having the same height are connected to one suction path 57.
  • Each suction path 57 is provided with an electromagnetic valve 63.
  • the electromagnetic valve 63 is opened in order from the suction path 57 connected to the suction hole 56 at the higher position to the suction path connected to the suction hole 56 at the lower position.
  • the solenoid valve 63 opens in order of 1, 2, 3,.
  • the work 51 can be brought into close contact with the break table 55 in the order that the central force of the work 51 is also directed outwardly and surely visually.
  • FIG. 26 shows a breaking device according to the fifth embodiment of the present invention.
  • the sheet contact means for bringing the sheet 53 into close contact with the break table 55 is composed of the sheet fixing table 14 and the sheet pressing mechanism. That is, as shown in FIG. 26 (A), a pair of sheet fixing bases 14 are arranged with the break base 55 interposed therebetween, and both ends of the sheet 53 are clamped by the sheet fixing bases 14. Then, as shown in FIG. 26 (B), the break table 55 is raised from below to the sheet 53 by the pressing mechanism, and the sheet 53 is brought into close contact with the break table 55.
  • Push A known uniaxial moving mechanism such as a ball screw is used for the mechanism. Since the movement of the break table 55 relative to the seat 53 is relative, the seat fixing table 14 may be pushed down instead of lifting the break table 55.
  • the sheet 53 is pressed against the break table 55 by the push-up of the break table 55, and is curved along the surface of the break table 55.
  • the work 51 attached to the sheet 53 is also curved along the break table 55. Since the work 51 is divided when the work 51 is curved along the break table 55, the work 51 is gradually divided from the center toward both ends, and the divided work 51 is sequentially broken. Adhere closely. Thus, the work 51 is divided into strips.
  • the break table 55 is retracted downward from the sheet 53 and both ends of the sheet 53 are removed from the sheet fixing table 14.
  • the sheet 53 is rotated 90 degrees in the horizontal plane, the sheet 53 is held on the seat fixing base 14 again.
  • a rotation mechanism for rotating the break base 55 90 degrees in the horizontal plane may be provided.
  • the work table 51 which is divided into strips by raising the break table 55 again, is divided into chips.
  • the sheet 53 can be brought into close contact with the breaking table 55 without providing the suction holes 56 in the breaking table 55. Also, when the sheet 53 is pushed up by the break table 55, the tensile force acts naturally on the sheet 53, so that it is possible to prevent the divided sections of the divided workpieces 51 from rubbing.
  • FIG. 27 and FIG. 28 show another example of the break table 65.
  • the break table 65 may be formed on a part of a spherical surface as in this example.
  • the suction holes 66 are arranged on a concentric circle with the highest part C of the break table 65 as the center.
  • the suction hole 66 is connected to a suction path 67, and the suction path 67 communicates with one suction port 68.
  • the central force of the work 51 is also directed toward the outer peripheral side, so that the work 51 can be brought into close contact with the break table 65 in order.
  • the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.
  • a thin glass instead of a semiconductor wafer is used for the workpiece.
  • a substrate may be used.
  • the work in the work bonding step, the work may be pasted on the sheet after the scribe line is cut on the work, or the scribe line may be cut on the work after the work is attached on the sheet.
  • the semi-cylindrical break table may be semi-cylindrical.

Abstract

La présente invention concerne un procédé et un dispositif destinés à briser un ouvrage, un procédé destiné à rainurer et briser l’ouvrage et un dispositif de rainurage avec une fonction de bris. Le procédé destiné à briser l’ouvrage (5) capable d’empêcher l’écaillage de la surface arrière de l’ouvrage entraîné par le frottement lorsque l’ouvrage ayant une ligne de rainurage marquée sur sa surface est brisé comprend une étape de collage d’ouvrage destinée à estamper la surface arrière de l’ouvrage (5) sur une feuille extensible (9), une étape de tirage de feuille destinée à tirer la feuille (9) sur laquelle l’ouvrage (5) est estampé et une étape de séparation d’ouvrage destinée à déplacer la ligne de rainurage (5c) jusqu’à la surface arrière de l’ouvrage (5) dans l’état tiré de la feuille (9). Du fait que l’ouvrage (5) est retiré immédiatement après que l’ouvrage (5) est séparé par la force de traction de la feuille (9), le frottement de l’ouvrage séparé (5) est réduit et l’écaillage peut être empêché sur la surface arrière de l’ouvrage. Egalement, du fait que la force de traction fournie sur l’ouvrage (5) aide à séparer l’ouvrage, l’ouvrage (5) peut être séparé avec une force plus faible.
PCT/JP2005/023953 2005-01-05 2005-12-27 Procede et dispositif destines a briser un ouvrage, procede destine a rainurer et briser un ouvrage et dispositif de rainurage avec fonction de bris WO2006073098A1 (fr)

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JP2006550818A JP5037138B2 (ja) 2005-01-05 2005-12-27 ワークのブレイク方法及び装置、スクライブ及びブレイク方法、並びにブレイク機能付きスクライブ装置
KR1020077017975A KR101170587B1 (ko) 2005-01-05 2005-12-27 워크의 브레이크 방법 및 장치, 스크라이브 및 브레이크방법, 및 브레이크 기능을 갖는 스크라이브 장치

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TW200636846A (en) 2006-10-16
KR20070121640A (ko) 2007-12-27
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JPWO2006073098A1 (ja) 2008-06-12
KR101170587B1 (ko) 2012-08-01

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