TWI306368B - Attaching apparatus and attaching method thereof - Google Patents

Attaching apparatus and attaching method thereof Download PDF

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Publication number
TWI306368B
TWI306368B TW95138633A TW95138633A TWI306368B TW I306368 B TWI306368 B TW I306368B TW 95138633 A TW95138633 A TW 95138633A TW 95138633 A TW95138633 A TW 95138633A TW I306368 B TWI306368 B TW I306368B
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short
substrate
conductive material
anisotropic conductive
indenter
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TW95138633A
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Chinese (zh)
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TW200820854A (en
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Chung Hao Hsieh
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Chi Mei Optoelectronics Corp
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13063681306368

、 三達編號:TW2332PA 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種貼附裝置及其貼附方法,且特別 是有關於一種移動長壓頭及短壓頭,而對應地貼附異方性 導電材於基板上之貼附裝置及其貼附方法。 【先前技術】 目前液晶顯示器產業採用玻璃覆晶製程(chip on glass,COG)將晶片貼附於玻璃基板上或捲帶封裝(Tap Carrier Packing,TCP )、薄膜覆晶封裝(Chip on Film, COF ) 等將晶片承載於捲帶或薄膜之電路板上後再藉由捲帶或 薄膜之電路板與基板電性連接。以捲帶封裝(Tap Carrier Packing,TCP)、薄膜覆晶封裝(Chip on Film,COF)為例 將晶片承載於捲帶或薄膜之電路板上後再藉由具有導電 顆粒之異方性導電材(anisotropic conductive film,ACF)貼 附於基板後,再利用熱壓製程將承載晶片之電路板壓著於 異方性導電材,藉由異方性導電材中之導電顆粒電性連接 基板與晶片。以玻璃覆晶製程為例乃是採用具有導電顆粒 之異方性導電材(anisotropic conductive film,ACF)貼附於 基板後,再利用熱壓製程將晶片壓著於異方性導電材,藉 由異方性導電材中之導電顆粒電性連接基板與晶片。 傳統之異方性導電材貼附裝置可以就所'貼附之異方 性導電材長度或晶片數目做區分,分為長貼裝置(可貼附多 數個晶片)及短職置(可貼附少數個晶片),為分離且各自 5 1306368达2号号: TW2332PA IX. Description of the Invention: [Technical Field] The present invention relates to an attachment device and a method for attaching the same, and particularly to a moving long indenter and a short indenter, A device for attaching an anisotropic conductive material to a substrate and a method of attaching the same. [Prior Art] At present, the liquid crystal display industry uses a chip on glass (COG) to attach a wafer to a glass substrate or a tape carrier package (TCP) or a chip on film (Chip on Film, COF). After the wafer is carried on the circuit board of the tape or film, the circuit board of the tape or film is electrically connected to the substrate. Taking Tape Carrier Packing (TCP) and Chip On Film (COF) as an example, the wafer is carried on a circuit board of a tape or film, and then an anisotropic conductive material having conductive particles is used. After the anisotropic conductive film (ACF) is attached to the substrate, the circuit board carrying the wafer is pressed against the anisotropic conductive material by a hot pressing process, and the substrate and the wafer are electrically connected by the conductive particles in the anisotropic conductive material. . Taking the glass flip chip process as an example, an anisotropic conductive film (ACF) having conductive particles is attached to the substrate, and then the wafer is pressed against the anisotropic conductive material by a hot pressing process. The conductive particles in the anisotropic conductive material are electrically connected to the substrate and the wafer. The traditional anisotropic conductive material attaching device can distinguish between the length of the anisotropic conductive material or the number of wafers to be attached, and is divided into a long sticking device (a plurality of wafers can be attached) and a short position (can be attached) a few wafers), for separation and each 5 1306368

三達編號:TW2332PASanda number: TW2332PA

•C 獨立運作之機台。長貼裝置需要貼附較長異方性導電持, 短貼裝置則需要貼附較短異方性導電材。由於兩種裝复的 壓頭不同,在貼附不同長度之異方性導電材(不同數目之晶 片)時’可以節省貼附機構移動所需的作業時間。長貼裝复 包括一具有滾輪組之貼附機構,可一次貼附連續之長異方 性導電材’可供多顆晶片貼附之用。但若基板上對應於晶 片貼附處之間需做間隔,例如需預留連接一軟性印刷電格 板(flexible printed circuit,FPC )之空間時,則需分段壤行 ⑩ 貼附。若是貼附分段過多,則會浪費大量時間在貼附機構 的移動上’此時長貼裝置就不適用。而短貼裝置具有—短 壓頭,對於短異方性導電材可快速貼附,可有效縮短分段 . 貼附的時間。但若基板上之貼附區域連續且長度較長時, 則較長貼裝置費時。因此若是一基板上之貼附區域分段數 多’且各貼附區域長短差異極大時,現有的貼附裝置皆無 法有效率的進行貼附動作》 ❿【發明内容】 有鏗於此,本發明的目的就是在提供一種異方性導電 材貼附裝置及其貼附方法,將長壓頭及短壓頭共同設置於 一機台,以增加貼附效率,其中可將貼附機構及短壓頭互 相連接之方式進行貼附或者將長壓頭與短壓頭位於同一 侧。並利用程式上的設定調整其貼附作業程序,使貼附機 台症視基板尺寸及貼附區域大小選择合適的貼附機構,可 於同-機台上以長壓頭及短壓頭進行貼附。本發明可有效 6 1306368• C independently operated machine. The long stick device needs to be attached with a long anisotropic conductive holder, and the short stick device needs to be attached with a short anisotropic conductive material. Since the two types of loaded indenters are different, when the anisotropic conductive materials of different lengths (different numbers of wafers) are attached, the working time required for the movement of the attaching mechanism can be saved. The long placement package includes a affixing mechanism with a roller set that can be attached to a single long strip of electrically conductive material at a time for multiple wafers to be attached. However, if the substrate needs to be spaced between the wafer attachment points, for example, when a space for a flexible printed circuit (FPC) is to be reserved, it is required to be segmented and attached 10 . If there are too many attached segments, it will waste a lot of time on the movement of the attachment mechanism. The short sticking device has a short indenter, which can be quickly attached to the short anisotropic conductive material, which can effectively shorten the segmentation time. However, if the attachment area on the substrate is continuous and the length is long, the longer attachment device takes time. Therefore, if the number of the attachment regions on one substrate is large and the length of each attachment region is extremely different, the existing attachment devices cannot perform the attachment operation efficiently. ❿ [Summary of the Invention] The object of the invention is to provide an anisotropic conductive material attaching device and a attaching method thereof, and the long indenter and the short indenter are jointly set on a machine to increase the attaching efficiency, wherein the attaching mechanism and the short can be The pressure heads are attached to each other or the long head and the short head are on the same side. And use the program settings to adjust the attaching operation procedure, so that the size of the attached device and the size of the attached area can be selected as appropriate. The long and low heads can be used on the same machine. Attach it. The invention is effective 6 1306368

. 三達編號:TW2332PA 之作業時 有極大幫 降低玻璃覆晶製程貼附異方性導電材於基板上 間,並對於滿足產品所需貼附之晶片數多樣性 助。 根據本發月的-〜π — JJ·里只5咐装置,包括、, 用以置放基板;一貼附機構用以貼附異方性導带 平台 上;一長壓頭及一短壓頭用以施加外力於貼附^材於基板 材之基板上。根據本發明的另一目的,提出 随導電The three-way number: TW2332PA has a great deal to help reduce the amount of wafers attached to the substrate and reduce the number of wafers that need to be attached to the product. According to this month's -~π - JJ · only 5 device, including, for placing the substrate; an attachment mechanism for attaching the anisotropic guide band platform; a long indenter and a short pressure The head is used to apply an external force to the substrate on which the substrate is attached. According to another object of the present invention, it is proposed to

法,包括置放-基板於-平台上;移動附方 附異方性導電材於該基板上;利用一長壓頭及 用以貼 以施加外力於貼附異方性導電材之基板上。首先^壓碩用 基板於一平台上,平台之表面具有一法線,接著,置玫〜 法線之方向移動-貼附機構於平台上,使貼 ^垂直 異方性導騎關於基板上。然後,以平行法線之^長 動長壓頭於平台上,使長壓頭將複數個晶片或承載晶^ 電路板貼附於^:板上,再者H蘭機構於平台上, 使貼附機構將-短異方性導電㈣附於基板上。然後,以 平灯法線之方向移動短壓頭於平台上,使短壓頭將複數個 晶片或承載晶片之電路板貼附於基板上。其中可將貼附機 構及短壓頭互相連接之方歧行賴;或者長朗與短壓 頭鄰近設置於平台上方。 ,,為讓本發明之上述目的、特徵、和優點能更明顯易 )·董下文特舉一較佳實施例,並配合所附圖式,作詳細說 明如下: 7 1306368The method comprises: placing the substrate on the platform; moving the attached side with the anisotropic conductive material on the substrate; using a long indenter and a substrate for applying an external force to the anisotropic conductive material. Firstly, the substrate is mounted on a platform. The surface of the platform has a normal line. Then, the direction of the rose to the normal line is moved - the attachment mechanism is placed on the platform, so that the vertical anisotropy is guided on the substrate. Then, the long indenter is pressed on the platform by the parallel normal line, so that the long indenter attaches a plurality of wafers or carrying crystal circuit boards to the ^: board, and then the H-blue mechanism is on the platform, so that the stickers The attached mechanism attaches a short anisotropic conductive (four) to the substrate. Then, the short indenter is moved on the platform in the direction of the normal of the flat lamp, so that the short indenter attaches a plurality of wafers or a circuit board carrying the wafer to the substrate. Among them, the attached mechanism and the short head can be connected to each other; or Changlang and the short head are placed adjacent to the platform. The above objects, features, and advantages of the present invention will become more apparent.) A preferred embodiment will be described in detail with reference to the accompanying drawings, which are described in detail below: 7 1306368

4 三達編號:TW2332PA 【實施方式】 本發明特別設計一貼附裝置,其具有可移動之贴附機 構,用以對應地貼附長異方性導電材及短異方性導電材於 基板上。而且,此貼附裝置具有兩壓頭,一為長壓頭、一 為短壓頭,因此,本發明之貼附裝置提供了基板上貼附異 方性導電材時,更寬廣的彈性空間,確實較傳統上之長貼 裝置及短貼裝置有效地降低貼附時間。如此一來,本發明 之貼附裝置不僅結合傳統上長貼裝置及短貼裝置的功 能,更可提昇基板上異方性導電材多樣性貼附的需求。至 於本發明之貼附裝置的長貼流程及短貼流程將以較佳實 施例附圖說明如下,但本發明之技術並不侷限在此。 請同時參照第1〜5圖,其續示本發明一較佳實施例 之貼附裝置用以貼附長異方性導電材(可貼附多數個晶片) 於基板之作動流程圖。首先請參照第1圖,本實施例之貼 附裝置100,包括平台130、貼附機構110、短壓頭120、 長壓頭160、裁切機構180及吸引機構170。平台130用 以置放基板140例如為一薄膜電晶體基板,基板140上具 有長貼區142及短貼區144,供晶片與基板140進行玻璃 覆晶技術(chip on glass ’ COG)接合之用,同理,亦可用 於TCP與COF ;平台13〇之表面具有一法線135。平台 130之兩侧外,分別定義貼附機構11〇及短壓頭12〇於貼 附流程中所在之一第一位置192及一第二位置194。貼附 機構110及短壓頭120,以垂直法線135之方式來回移動 於第一位置192及第二位置194之間。本實施例中,貼附 8 13063684 Sanda Number: TW2332PA [Embodiment] The present invention specifically designs an attaching device having a movable attaching mechanism for correspondingly attaching a long anisotropic conductive material and a short anisotropic conductive material to the substrate. . Moreover, the attaching device has two indenters, one being a long indenter and the other being a short indenter. Therefore, the attaching device of the present invention provides a wider elastic space when the anisotropic conductive material is attached to the substrate. It is indeed more effective than the conventional long sticking device and short sticking device to reduce the attachment time. In this way, the attachment device of the present invention not only combines the functions of the conventional long-attach device and the short-attach device, but also enhances the need for the diversity of the anisotropic conductive material on the substrate. The long sticking process and the short sticking process of the attaching apparatus of the present invention will be described below with reference to the preferred embodiment, but the technique of the present invention is not limited thereto. Referring also to Figures 1 to 5, there is shown a flow chart of the attachment device of the preferred embodiment of the present invention for attaching a long anisotropic conductive material (a plurality of wafers can be attached) to the substrate. First, referring to Fig. 1, the attaching device 100 of the present embodiment includes a platform 130, an attaching mechanism 110, a short indenter 120, a long indenter 160, a cutting mechanism 180, and a suction mechanism 170. The substrate 130 for placing the substrate 140 is, for example, a thin film transistor substrate. The substrate 140 has a long bonding region 142 and a short bonding region 144 for performing chip-on-glass (COG) bonding on the wafer and the substrate 140. Similarly, it can also be used for TCP and COF; the surface of the platform 13 has a normal 135. On both sides of the platform 130, a first position 192 and a second position 194 in which the attaching mechanism 11 and the short indenter 12 are located in the attaching process are respectively defined. Attachment mechanism 110 and short ram 120 move back and forth between first position 192 and second position 194 in a vertical normal line 135. In this embodiment, attaching 8 1306368

* 三達編號:TW2332PA 機構110及短壓頭120互相連接;其中,貼附機構u〇及 短壓頭120移動時穿越過平台130之上方。裁切機構18〇 設置於第一位置192之外,用以從具有異方性導電材154 及離形紙152之膠帶150,裁切出適當大小之異方性導電 材以供貼附。吸引機構170位於第二位置194之外,用以 將膠帶150貼附完畢所剩下之離形紙152,吸引並將離形 紙152帶離貼附裝置100。長壓頭ι60設置於平台13〇之 上方,可沿一平行法線135之方向來回移動,而靠近或遠 9 離平台130。貼附機構110包括一失持單元112以及一下 壓單元,下壓單元例如一滚輪組114,夾持單元112用以 在第一位置192處夾緊且帶動膠帶150往第二位置194移 動。滾輪組114以平行法線135之方向移動於非壓著位置 及壓著位置,並於壓著位置時壓著膠帶15〇,以於貼附機 構110及短壓頭120移動期間完成異方性導電材之貼附。 如第1圖所示,裁切機構18〇從膠帶15〇裁切出一長 • 裁切異方性導電材I56,並與其餘之異方性導電材154間 形成一孔隙157 ^此時貼附機構11〇及短壓頭12〇位於第 一位置192,而滚輪組114此時位於非壓著位置。 首先’由爽持單元112夾緊膠帶15〇,並與滾輪址ιΐ4 及短壓頭120往長壓頭⑽及平台⑽之間移動,使長裁 切異方性導電材156 4皮夾持單元112㈣,而到達與長貼 區142相對應之一長貼位置。然後,爽持單元112放開膠 帶150,同時吸引機構17〇吸引完成貼附後所剩餘之離形 紙152。此時,貼附機構11〇及短壓頭12〇可能經過長貼 9 1306368* Sanda number: TW2332PA The mechanism 110 and the short head 120 are connected to each other; wherein the attaching mechanism u and the short head 120 move over the platform 130 when moving. The cutting mechanism 18 is disposed outside the first position 192 for cutting an anisotropic conductive material of an appropriate size from the tape 150 having the anisotropic conductive material 154 and the release paper 152 for attachment. The suction mechanism 170 is located outside of the second position 194 for attaching the adhesive tape 150 to the remaining release paper 152, and attracting and holding the release paper 152 away from the attachment device 100. The long head ι 60 is disposed above the platform 13 , and is movable back and forth along a parallel normal 135 to be close to or far from the platform 130. The attachment mechanism 110 includes a drop-off unit 112 and a lower pressure unit, such as a roller set 114, for clamping at the first position 192 and driving the tape 150 to move toward the second position 194. The roller set 114 moves in the direction of the parallel normal line 135 to the non-pressing position and the pressing position, and presses the tape 15 于 in the pressing position to complete the anisotropy during the movement of the attaching mechanism 110 and the short ram 120. Attachment of conductive material. As shown in Fig. 1, the cutting mechanism 18 〇 cuts a length from the tape 15 and cuts the anisotropic conductive material I56, and forms a hole 157 with the remaining anisotropic conductive material 154. The attachment mechanism 11〇 and the short indenter 12〇 are in the first position 192, and the roller set 114 is now in the non-pressing position. Firstly, the adhesive tape 15 is clamped by the holding unit 112, and moved between the roller ιΐ4 and the short ram 120 to the long ram (10) and the platform (10), so that the long-cut anisotropic conductive material 156 4 skin clamping unit 112 (4), and arrive at a long position corresponding to the long sticking area 142. Then, the holding unit 112 releases the tape 150 while the suction mechanism 17 〇 attracts the release paper 152 remaining after the attachment is completed. At this time, the attaching mechanism 11〇 and the short indenter 12〇 may pass the long stick 9 1306368

三達編號:TW2332PA 區142 ’但並未對應於長贴冃 # 负貼L 142。接者,貼附機構n〇 及短壓頭120往第一位置】 戎傅 必直92移動而後退,使滾輪組114 移動亚對應於長裁切異方性導電材156之起點。然後,滾 輪^ 114下降至S著位置以下磨谬帶15〇 ’使長裁切異方 性導電=156之1接觸長貼區142,如第2圖所示。 接者,以垂直法、線135之方向,將貼附機構110及短 壓頭120從平台130上拄笸—你婆1〇4你去 4第一位置194移動。在貼附機構 110及短壓頭120移動過程中,滚輪、组114將長裁切異方 性導電材156完全貼附於長㈣142,如第3圖所示:、 然後’滾輪組114上升至非壓著位置,貼附機構ιι〇 及短壓頭120往第-位^ 192移動,將離形紙152與長裁 切異方性導電材156分離,如第4圖所示。 接著’將晶片或承載晶片之電路板,如第5圖所示之 電路板146對應於長貼區142,利用長壓頭16〇沿一平行 法線13 5之方向往平台! 3 〇移動,下$貼附晶片或承載晶 片之電路板於長貼區142之長裁切異方性導電材156,使 長裁切異方性導電材156緊密貼附晶片或承載晶片之電路 板於基板長貼區142上,如第5圖所示。其中長壓頭16〇 提供- 3Gt〜2G{rc可調整溫度之熱壓頭。至此_長裁切 異方性導電材156於基板140之作業告〜段落。 請同時參照第6〜9圖,其繪示本發明一較佳實施例 之貼附裝置用以貼附短異方性導電材(可貼附少數個晶片) 於基板之作動流程圖。首先,裁切機構18〇裁切出一短裁 切異方性導電材158 ’並與其餘之異方性導電材154之間 1306368Sanda number: TW2332PA area 142 ‘but does not correspond to long stickers # negative stickers L 142. The pick-up mechanism n 〇 and the short ram 120 are in the first position. 戎 Fu must move 92 and retreat, so that the roller set 114 moves sub-corresponding to the starting point of the long-cut anisotropic conductive material 156. Then, the roller ^ 114 is lowered to the S-position below the honing tape 15 〇 ' so that the long-cut anisotropic conduction = 156 of 1 contacts the long attachment area 142, as shown in Fig. 2. Then, in the direction of the vertical method and the line 135, the attaching mechanism 110 and the short indenter 120 are lifted from the platform 130. Your mother moves to the first position 194. During the movement of the attachment mechanism 110 and the short indenter 120, the roller and the group 114 completely attach the long-cut anisotropic conductive material 156 to the long (four) 142, as shown in FIG. 3, and then the 'roller group 114 rises to The non-clamping position, the attaching mechanism ιι〇 and the short ram 120 move to the first position ^ 192, separating the release paper 152 from the long-cut anisotropic conductive material 156, as shown in FIG. Next, the wafer or wafer-carrying circuit board, such as the circuit board 146 shown in Fig. 5, corresponds to the long bonding area 142, and the long ram 16 利用 is directed toward the platform along a parallel normal line 13 5! 3 〇 move, the next $ affixed wafer or chip-carrying circuit board cuts the anisotropic conductive material 156 in the long bonding area 142, so that the long-cut anisotropic conductive material 156 is closely attached to the wafer or the circuit carrying the chip The board is on the substrate long attaching area 142 as shown in FIG. Among them, the long indenter 16〇 provides - 3Gt~2G{rc adjustable temperature thermal head. So far, the length of the anisotropic conductive material 156 on the substrate 140 is reported to the paragraph. Referring to Figures 6-9, a flow chart of the attachment device for attaching a short anisotropic conductive material (a small number of wafers can be attached) to the substrate is shown. First, the cutting mechanism 18 cuts a short cut anisotropic conductive material 158' and is interposed with the remaining anisotropic conductive material 154 1306368

, 三達編號:TW2332PA 形成一孔隙159 ’如第6圖所示。 然後,夹持單元112再次央緊膠帶150,貼附機構ιι〇 及短壓頭120往長壓頭16〇及平台13〇之間移動,使短裁 切異方性導電材158位於與短貼區144相對應之—短貼位 置。然後,夾持單元112放開膠帶150,吸引機構17〇將 膠帶150貼附完畢所剩下之離形紙152吸引,並將離形紙 152帶離貼附裝置1〇〇。接著,滾輪組114下壓該膠帶 後,貼附機構U〇及短壓頭120朝第二位置194之方向移 動,使短異方性導電材15 8貼附於短貼區144,如第;圖 所示。 然後,滾輪組114上升至非壓著位置。貼附機構ιι〇 及短壓頭120由平台13〇往第一位置192移動,將離形紙 152與短裁切異方性導電材158分離,如第8圖所示。 接著,將晶片或承載晶片之電路板,如第9圖所示之 電路板148對應置放於短貼區14扣然後,將貼附機構ιι〇 Φ 及短壓頭12〇沿平行法線135之方向移動於平台13〇上, 使短$頭120位於短貼區144上方。接著,短壓頭12〇下 壓’將電路板148貼附於基板140之短貼區144上,如第 9圖所示。其中短壓頭120提供一 30〇C〜2〇〇ΐ之可調整溫 度之熱壓頭。然後,貼附機構Π0及短壓頭120回到第一 位置192,貼附裝置1〇〇將長裁切異方性導電材156及短 裁切異方性導電材158貼附於基板140之工作,至此便告 完成。 然而本實施例所屬之技術領域具有通常知識者,可明 11 1306368, Sanda number: TW2332PA forms a hole 159 ' as shown in Figure 6. Then, the clamping unit 112 clamps the tape 150 again, and the attaching mechanism ιι and the short ram 120 move between the long ram 16 〇 and the platform 13 ,, so that the short-cut anisotropic conductive material 158 is located and short. Area 144 corresponds to the short position. Then, the gripping unit 112 releases the tape 150, and the suction mechanism 17 sucks the remaining release paper 152 to which the tape 150 is attached, and takes the release paper 152 away from the attaching device 1''. Then, after the roller set 114 presses the tape, the attaching mechanism U 〇 and the short ram 120 move in the direction of the second position 194, so that the short anisotropic conductive material 15 8 is attached to the short attaching area 144, such as the first; The figure shows. The roller set 114 then rises to a non-pressed position. The attaching mechanism ιι〇 and the short ram 120 are moved from the platform 13 to the first position 192 to separate the release paper 152 from the short-cut anisotropic conductive material 158, as shown in FIG. Next, the wafer or the circuit board carrying the wafer, such as the circuit board 148 shown in FIG. 9 , is placed in the short attachment area 14 and then the attachment mechanism ιι Φ and the short pressure head 12 〇 are along the parallel normal line 135. The direction is moved on the platform 13A such that the short $head 120 is located above the short patch area 144. Next, the short indenter 12 is pressed down to attach the circuit board 148 to the short attaching region 144 of the substrate 140 as shown in Fig. 9. The short indenter 120 provides a 30 ° C to 2 可 adjustable temperature thermal head. Then, the attaching mechanism Π0 and the short ram 120 are returned to the first position 192, and the attaching device 1 贴 attaches the long-cut anisotropic conductive material 156 and the short-cut anisotropic conductive material 158 to the substrate 140. Work, it will be completed. However, the technical field to which the present embodiment pertains has a general knowledge, and it is clear that 11 1306368

α 三達編號:TW2332PA 白本實施例之技術並不僅限於上述實施例所描述之具體 内容。例如,長壓頭160或短壓頭120進一步更包含氣壓 缸,短壓頭120更包含可升降之短壓頭。長壓頭16〇及短 壓頭120之表面更具有緩衝材料,避免對貼附之膠帶ι5〇 造成傷害。此外,本實施例雖以貼附機構110及短壓頭12〇 同步移動為例做說明,事實上兩者亦可分開移動。也就是 說短壓頭120可以單獨移動至短貼區144上方以進行貼 附。 鲁 請參照第10圖,其繪示本發明另一實施例之貼附裝 置的不意圖。本實施例與前述實施例之貼附裝置1〇〇的主 要差異,在於長壓頭160a與短壓頭12〇&係鄰近設置於平 台130上方,短壓頭120a不與貼附機構1〇〇互相連接。 而平台130亦可以没什為可垂直於法線135之方向移動的 活動平台’可以移動基板以對應於長壓頭16〇&與短壓頭α 三达编号: TW2332PA The technology of the present embodiment is not limited to the specific contents described in the above embodiments. For example, the long ram 160 or the short ram 120 further includes a pneumatic cylinder, and the short ram 120 further includes a short ram that can be raised and lowered. The surface of the long ram 16 〇 and the short ram 120 is more cushioned to avoid damage to the attached tape ι5〇. In addition, in the present embodiment, the simultaneous movement of the attaching mechanism 110 and the short indenter 12〇 is taken as an example, and in fact, the two can be moved separately. That is, the short indenter 120 can be individually moved over the short attachment area 144 for attachment. Referring to Figure 10, there is shown a schematic view of an attachment device according to another embodiment of the present invention. The main difference between the embodiment and the attaching device 1 of the foregoing embodiment is that the long indenter 160a and the short indenter 12〇& are disposed adjacent to the platform 130, and the short indenter 120a is not attached to the attaching mechanism. 〇 Connect to each other. The platform 130 may also be a movable platform that can move perpendicular to the normal 135. The substrate can be moved to correspond to the long head 16 〇 & and the short head

本發明上述實施例所揭露之異方性導電材貼附裝置 :其貼附方法,係將長壓頭及短廢頭共同設置於同一機 ^並以㈣機構及短壓頭軸之方式進行貼附。而且本 錢頭與短壓頭均為可控制溫度與壓力之熱壓 附裝置可針對貼附基板之尺寸及貼附區 用短壓頭之貼附機構進行貼附。對於短貼附區採 用域碩,可即省移動貼附機構所需之 貼附區採用貼附機構,除可節 ”,、:長 _外’亦可減少裁切分段作t,節省貼附材料。 12 1306368The anisotropic conductive material attaching device disclosed in the above embodiment of the present invention has a method of attaching a long indenter and a short waste head to the same machine and is attached by means of a mechanism and a short indenter shaft. Attached. Moreover, both the head and the short head are heat-pressable devices that can control the temperature and pressure. The attachment device can be attached to the size of the attached substrate and the attachment area by the attachment mechanism of the short indenter. For the short attachment area, the domain is used, and the attachment area required for the mobile attachment mechanism can be attached. In addition to the section, the long_outer can also reduce the cutting segment and save the sticker. Attached material. 12 1306368

. 三達編號:TW2332PA 綜上所述,雖然本發明已以一較佳實施例揭露如上, 然其並非用以限定本發明,任何熟習此技藝者,在不脫離 本發明之精神和範圍内,當可作各種之更動與潤飾,因此 本發明之保護範圍當視後附之申請專利範圍所界定者為 準。。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The scope of the present invention is defined by the scope of the appended claims.

13 130636813 1306368

. 三達編號:TW2332PA 【圖式簡單說明】 第1〜5圖繪示本發明一較佳實施例之貼附裝置用以 貼附長異方性導電材(多數晶片)於基板之作動流程圖; 第6〜9圖繪示本發明一較佳實施例之貼附裝置用以 貼附短異方性導電材(少數晶片)於基板之作動流程圖;以 及 第10圖繪示本發明另一實施例之貼附裝置的示意 圖。达达编号号: TW2332PA [Simple Description of the Drawings] FIGS. 1 to 5 are diagrams showing the operation of the attaching device for attaching a long anisotropic conductive material (most wafers) to the substrate according to a preferred embodiment of the present invention. 6 to 9 are diagrams showing an operation of attaching a device for attaching a short anisotropic conductive material (a few wafers) to a substrate according to a preferred embodiment of the present invention; and FIG. 10 is a view showing another embodiment of the present invention; A schematic view of the attachment device of the embodiment.

14 130636814 1306368

三達編號:TW2332PA 【主要元件符號說明】 100 :貼附裝置 110 :貼附機構 112 :夾持單元 114 ·滾輪組 120、120a :短壓頭 130 :平台 140 :基板 142 .長貼區 144 :短貼區 146、148 :電路板 150 :膠帶 152:離形紙 154 :異方性導電材 156 :長裁切異方性導電材 157、159 :孔隙 158 :短裁切異方性導電材 160、160a :長壓頭 170 :吸引機構 180 :裁切機構 192 :第一位置 194 :第二位置Sanda number: TW2332PA [Description of main component symbols] 100: Attachment device 110: Attachment mechanism 112: Clamping unit 114 • Roller set 120, 120a: Short indenter 130: Platform 140: Substrate 142. Long attachment area 144: Short-pad areas 146, 148: circuit board 150: tape 152: release paper 154: anisotropic conductive material 156: long-cut anisotropic conductive material 157, 159: aperture 158: short-cut anisotropic conductive material 160 , 160a: long indenter 170: suction mechanism 180: cutting mechanism 192: first position 194: second position

Claims (1)

1306368 _ 三達編號:TW2332PA 十、申請專利範圍: 1. 一種貼附裝置,包括: 一平台用以置放一基板; 一貼附機構用以貼附一異方性導電材於該基板上; 一長壓頭及一短壓頭用以施加外力於貼附該異方性 導電材之該基板。 2. 如申請專利範圍第1項之裝置,其中該短壓頭與該 貼附機構互相連接。 • 3.如申請專利範圍第1項之裝置,其中該短壓頭與該 長壓頭係鄰近設置於該平台上方。 4. 如申請專利範圍第1項之裝置,其中該短壓頭與該 貼附機構以垂直該平台法線之方式來回移動。 5. 如申請專利範圍第1項之裝置,其中該短壓頭與該 長壓頭以平行平台法線之方式施加外力於該基板。 6. 如申請專利範圍第5項之裝置,其中該長壓頭與該 短壓頭於施加外力時,在該長壓頭或該短壓頭與該基板之 B 間具有一緩衝材料。 7. 如申請專利範圍第1項之裝置,更包括一裁切機 構,用以裁切該異方性導電材。 8. 如申請專利範圍第1項之裝置,其中該貼附機構更 包括一夾持單元,該夹持單元用以夾緊或放開包含一離形 紙與該異方性導電材之一膠帶。 9. 如申請專利範圍第1項之裝置,其中該貼附機構更 包括一下壓單元,該下壓單元以平行該法線之方向移動。 16 1306368 , 三達編號:TW2332PA 10. 如申請專利範圍第9項之裝置,其中該下壓單元 為一滾輪組。 11. 如申請專利範圍第1項之裝置,更包括一吸引機 構用以吸引一離形紙。 12. 如申請專利範圍第1項之裝置,其中該長壓頭或 該短壓頭包含一氣壓缸。 13. 如申請專利範圍第1項之裝置,其中該長壓頭與 該短壓頭可控制溫度與壓力。 * 14.如申請專利範圍第1項之裝置,用以將晶片或一 承載晶片之電路板貼附於該基板上。 15. —種貼附方法,包括: 置放一基板於一平台上; 移動一貼附機構用以貼附一異方性導電材於該 基板上;以及 利用一長壓頭及一短壓頭用以施加外力於貼附 0 該異方性導電材之該基板上。 16. 如申請專利範圍第15項之方法,其中該短壓頭與 該貼附機構互相連接。 17. 如申請專利範圍第15項之方法,其中該長壓頭與 該短壓頭係鄰近設置於該平台上方。 18. 如申請專利範圍第15項之方法,其中該短壓頭與 該貼附機構以垂直該平台法線之方式來回移動。 19. 如申請專利範圍第15項之方法,其中該短壓頭與 該長壓頭以平行於平台法線之方式施加外力於該基板。 17 1306368 , 三達編號:TW2332PA 20. 如申請專利範圍第19項之方法,其中該長壓頭與 短壓頭於下壓時,於該長壓頭或該短壓頭與該基板之間具 有一缓衝材料。 21. 如申請專利範圍第15項之方法,於貼附該異方性 導電材於該基板上之步驟前更包括: 從具有該異方性導電材及一離形紙之一膠帶裁切出 一裁切異方性導電材。 22. 如申請專利範圍第21項之方法,其中該貼附機構 * 更包括一夾持單元,於該裁切該異方性導電材的步驟後更 包括: 以該貼附機構下壓該膠帶,使該裁切異方性導電材貼 附於該基板。 23. 如申請專利範圍第22項之方法,於將該裁切異方 性導電材貼附於該基板之步驟後更包括: 將複數個晶片或一承載晶片之電路板置於貼附該裁 I 切異方性導電材之該基板上。 24. 如申請專利範圍第23項之方法,於將該些晶片或 該承載晶片之電路板置於點附該裁切異方性導電材之該 基板上之步驟後更包括: 以一長壓頭往該平台移動而下壓該裁切異方性導電 材。 25. 如申請專利範圍第23項之方法,於將該些晶片或 該承載晶片之電路板置於貼附該裁切異方性導電材之該 基板上之步驟前更包括: 18 1306368 _ 三達編號:TW2332PA 移動該貼附機構與該短壓頭至一第二位置,該第二位 置位於該平台之另一侧外。 26.如申請專利範圍第23項之方法,於將該些晶片或 該承載晶片之電路板置於貼附該裁切異方性導電材之該 基板上之步驟後更包括: 移動該短壓頭至該平台上方;以及 以該短壓頭往該平台移動而下壓該裁切異方性導電 材。 • 27.如申請專利範圍第23項之方法,於將該些晶片或 該承載晶片之電路板置於貼附該裁切異方性導電材之該 基板上之步驟前更包括: 移動該貼附機構與該短壓頭至該第一位置。 28. 如申請專利範圍第23項之方法,於將該些晶片或 該承載晶片之電路板置於貼附該裁切異方性導電材之該 基板上之步驟後更包括: 移動該貼附機構與該短壓頭至該平台上方;以及 以該短壓頭往該平台移動而下壓該裁切異方性導電 材。 29. 如申請專利範圍第15項之方法,其中該長壓頭與 短壓頭於施加外力時,在該長壓頭或該短壓頭與該基板之 間具有一緩衝材料。 30. 如申請專利範圍第15項之方法,其中該長壓頭與 該短壓頭可控制溫度與壓力。 191306368 _ Sanda number: TW2332PA X. Patent application scope: 1. A patching device comprising: a platform for placing a substrate; and an attaching mechanism for attaching an anisotropic conductive material to the substrate; A long indenter and a short indenter are used to apply an external force to the substrate to which the anisotropic conductive material is attached. 2. The device of claim 1, wherein the short indenter is interconnected with the attachment mechanism. 3. The device of claim 1, wherein the short indenter is disposed adjacent to the platform adjacent to the long head. 4. The device of claim 1, wherein the short indenter and the attachment mechanism move back and forth perpendicular to the normal of the platform. 5. The device of claim 1, wherein the short indenter and the long indenter apply an external force to the substrate in a parallel plate normal. 6. The device of claim 5, wherein the long head and the short head have a cushioning material between the long head or the short head and the substrate B when an external force is applied. 7. The apparatus of claim 1, further comprising a cutting mechanism for cutting the anisotropic conductive material. 8. The device of claim 1, wherein the attaching mechanism further comprises a clamping unit for clamping or releasing a tape comprising a release paper and the anisotropic conductive material. . 9. The device of claim 1, wherein the attaching mechanism further comprises a lower pressing unit that moves in a direction parallel to the normal. 16 1306368, Sanda number: TW2332PA 10. The apparatus of claim 9, wherein the pressing unit is a roller set. 11. The device of claim 1 further includes a suction mechanism for attracting a release paper. 12. The device of claim 1, wherein the long head or the short head comprises a pneumatic cylinder. 13. The device of claim 1, wherein the long head and the short head control temperature and pressure. * 14. The device of claim 1, wherein a wafer or a circuit board carrying the wafer is attached to the substrate. 15. A method of attaching, comprising: placing a substrate on a platform; moving an attaching mechanism for attaching an anisotropic conductive material to the substrate; and utilizing a long indenter and a short indenter An external force is applied to the substrate to which the anisotropic conductive material is attached. 16. The method of claim 15, wherein the short indenter is interconnected with the attachment mechanism. 17. The method of claim 15, wherein the long head and the short head are disposed adjacent to the platform. 18. The method of claim 15, wherein the short indenter and the attachment mechanism move back and forth perpendicular to the normal to the platform. 19. The method of claim 15, wherein the short indenter and the long indenter apply an external force to the substrate in a manner parallel to the normal to the platform. The method of claim 19, wherein the long head and the short head are pressed down, between the long head or the short head and the substrate A cushioning material. 21. The method of claim 15, wherein the step of attaching the anisotropic conductive material to the substrate further comprises: cutting out the tape having the anisotropic conductive material and a release paper A cutting of the anisotropic conductive material. 22. The method of claim 21, wherein the attaching mechanism* further comprises a clamping unit, after the step of cutting the anisotropic conductive material, further comprising: pressing the tape with the attaching mechanism The cut anisotropic conductive material is attached to the substrate. 23. The method of claim 22, after the step of attaching the cut anisotropic conductive material to the substrate, further comprising: placing a plurality of wafers or a circuit board carrying the wafer on the cutting board I cut the anisotropic conductive material on the substrate. 24. The method of claim 23, after the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: The head moves toward the platform to press the cut anisotropic conductive material. 25. The method of claim 23, before the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: 18 1306368 _ three Number: TW2332PA Moves the attachment mechanism and the short head to a second position that is outside the other side of the platform. 26. The method of claim 23, after the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: moving the short pressure Heading to the top of the platform; and moving the cutting anisotropic conductive material by moving the short indenter toward the platform. 27. The method of claim 23, before the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: moving the sticker Attaching the mechanism and the short indenter to the first position. 28. The method of claim 23, after the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: moving the attachment The mechanism and the short indenter are above the platform; and the cutting of the anisotropic conductive material is pressed by moving the short indenter toward the platform. 29. The method of claim 15, wherein the long head and the short head have a cushioning material between the long head or the short head and the substrate when an external force is applied. 30. The method of claim 15, wherein the long head and the short head control temperature and pressure. 19
TW95138633A 2006-10-19 2006-10-19 Attaching apparatus and attaching method thereof TWI306368B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI622487B (en) * 2014-11-14 2018-05-01 深圳市豫鑫達科技有限公司 A fpc automatic tape laminating machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI622487B (en) * 2014-11-14 2018-05-01 深圳市豫鑫達科技有限公司 A fpc automatic tape laminating machine

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