TWI306368B - Attaching apparatus and attaching method thereof - Google Patents

Attaching apparatus and attaching method thereof Download PDF

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Publication number
TWI306368B
TWI306368B TW95138633A TW95138633A TWI306368B TW I306368 B TWI306368 B TW I306368B TW 95138633 A TW95138633 A TW 95138633A TW 95138633 A TW95138633 A TW 95138633A TW I306368 B TWI306368 B TW I306368B
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TW
Taiwan
Prior art keywords
short
substrate
anisotropic conductive
indenter
attaching
Prior art date
Application number
TW95138633A
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Chinese (zh)
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TW200820854A (en
Inventor
Chung Hao Hsieh
Original Assignee
Chi Mei Optoelectronics Corp
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Priority to TW95138633A priority Critical patent/TWI306368B/en
Publication of TW200820854A publication Critical patent/TW200820854A/en
Application granted granted Critical
Publication of TWI306368B publication Critical patent/TWI306368B/en

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Description

1306368
达2号号: TW2332PA IX. Description of the Invention: [Technical Field] The present invention relates to an attachment device and a method for attaching the same, and particularly to a moving long indenter and a short indenter, A device for attaching an anisotropic conductive material to a substrate and a method of attaching the same. [Prior Art] At present, the liquid crystal display industry uses a chip on glass (COG) to attach a wafer to a glass substrate or a tape carrier package (TCP) or a chip on film (Chip on Film, COF). After the wafer is carried on the circuit board of the tape or film, the circuit board of the tape or film is electrically connected to the substrate. Taking Tape Carrier Packing (TCP) and Chip On Film (COF) as an example, the wafer is carried on a circuit board of a tape or film, and then an anisotropic conductive material having conductive particles is used. After the anisotropic conductive film (ACF) is attached to the substrate, the circuit board carrying the wafer is pressed against the anisotropic conductive material by a hot pressing process, and the substrate and the wafer are electrically connected by the conductive particles in the anisotropic conductive material. . Taking the glass flip chip process as an example, an anisotropic conductive film (ACF) having conductive particles is attached to the substrate, and then the wafer is pressed against the anisotropic conductive material by a hot pressing process. The conductive particles in the anisotropic conductive material are electrically connected to the substrate and the wafer. The traditional anisotropic conductive material attaching device can distinguish between the length of the anisotropic conductive material or the number of wafers to be attached, and is divided into a long sticking device (a plurality of wafers can be attached) and a short position (can be attached) a few wafers), for separation and each 5 1306368
Sanda number: TW2332PA
• C independently operated machine. The long stick device needs to be attached with a long anisotropic conductive holder, and the short stick device needs to be attached with a short anisotropic conductive material. Since the two types of loaded indenters are different, when the anisotropic conductive materials of different lengths (different numbers of wafers) are attached, the working time required for the movement of the attaching mechanism can be saved. The long placement package includes a affixing mechanism with a roller set that can be attached to a single long strip of electrically conductive material at a time for multiple wafers to be attached. However, if the substrate needs to be spaced between the wafer attachment points, for example, when a space for a flexible printed circuit (FPC) is to be reserved, it is required to be segmented and attached 10 . If there are too many attached segments, it will waste a lot of time on the movement of the attachment mechanism. The short sticking device has a short indenter, which can be quickly attached to the short anisotropic conductive material, which can effectively shorten the segmentation time. However, if the attachment area on the substrate is continuous and the length is long, the longer attachment device takes time. Therefore, if the number of the attachment regions on one substrate is large and the length of each attachment region is extremely different, the existing attachment devices cannot perform the attachment operation efficiently. ❿ [Summary of the Invention] The object of the invention is to provide an anisotropic conductive material attaching device and a attaching method thereof, and the long indenter and the short indenter are jointly set on a machine to increase the attaching efficiency, wherein the attaching mechanism and the short can be The pressure heads are attached to each other or the long head and the short head are on the same side. And use the program settings to adjust the attaching operation procedure, so that the size of the attached device and the size of the attached area can be selected as appropriate. The long and low heads can be used on the same machine. Attach it. The invention is effective 6 1306368
The three-way number: TW2332PA has a great deal to help reduce the amount of wafers attached to the substrate and reduce the number of wafers that need to be attached to the product. According to this month's -~π - JJ · only 5 device, including, for placing the substrate; an attachment mechanism for attaching the anisotropic guide band platform; a long indenter and a short pressure The head is used to apply an external force to the substrate on which the substrate is attached. According to another object of the present invention, it is proposed to
The method comprises: placing the substrate on the platform; moving the attached side with the anisotropic conductive material on the substrate; using a long indenter and a substrate for applying an external force to the anisotropic conductive material. Firstly, the substrate is mounted on a platform. The surface of the platform has a normal line. Then, the direction of the rose to the normal line is moved - the attachment mechanism is placed on the platform, so that the vertical anisotropy is guided on the substrate. Then, the long indenter is pressed on the platform by the parallel normal line, so that the long indenter attaches a plurality of wafers or carrying crystal circuit boards to the ^: board, and then the H-blue mechanism is on the platform, so that the stickers The attached mechanism attaches a short anisotropic conductive (four) to the substrate. Then, the short indenter is moved on the platform in the direction of the normal of the flat lamp, so that the short indenter attaches a plurality of wafers or a circuit board carrying the wafer to the substrate. Among them, the attached mechanism and the short head can be connected to each other; or Changlang and the short head are placed adjacent to the platform. The above objects, features, and advantages of the present invention will become more apparent.) A preferred embodiment will be described in detail with reference to the accompanying drawings, which are described in detail below: 7 1306368
4 Sanda Number: TW2332PA [Embodiment] The present invention specifically designs an attaching device having a movable attaching mechanism for correspondingly attaching a long anisotropic conductive material and a short anisotropic conductive material to the substrate. . Moreover, the attaching device has two indenters, one being a long indenter and the other being a short indenter. Therefore, the attaching device of the present invention provides a wider elastic space when the anisotropic conductive material is attached to the substrate. It is indeed more effective than the conventional long sticking device and short sticking device to reduce the attachment time. In this way, the attachment device of the present invention not only combines the functions of the conventional long-attach device and the short-attach device, but also enhances the need for the diversity of the anisotropic conductive material on the substrate. The long sticking process and the short sticking process of the attaching apparatus of the present invention will be described below with reference to the preferred embodiment, but the technique of the present invention is not limited thereto. Referring also to Figures 1 to 5, there is shown a flow chart of the attachment device of the preferred embodiment of the present invention for attaching a long anisotropic conductive material (a plurality of wafers can be attached) to the substrate. First, referring to Fig. 1, the attaching device 100 of the present embodiment includes a platform 130, an attaching mechanism 110, a short indenter 120, a long indenter 160, a cutting mechanism 180, and a suction mechanism 170. The substrate 130 for placing the substrate 140 is, for example, a thin film transistor substrate. The substrate 140 has a long bonding region 142 and a short bonding region 144 for performing chip-on-glass (COG) bonding on the wafer and the substrate 140. Similarly, it can also be used for TCP and COF; the surface of the platform 13 has a normal 135. On both sides of the platform 130, a first position 192 and a second position 194 in which the attaching mechanism 11 and the short indenter 12 are located in the attaching process are respectively defined. Attachment mechanism 110 and short ram 120 move back and forth between first position 192 and second position 194 in a vertical normal line 135. In this embodiment, attaching 8 1306368
* Sanda number: TW2332PA The mechanism 110 and the short head 120 are connected to each other; wherein the attaching mechanism u and the short head 120 move over the platform 130 when moving. The cutting mechanism 18 is disposed outside the first position 192 for cutting an anisotropic conductive material of an appropriate size from the tape 150 having the anisotropic conductive material 154 and the release paper 152 for attachment. The suction mechanism 170 is located outside of the second position 194 for attaching the adhesive tape 150 to the remaining release paper 152, and attracting and holding the release paper 152 away from the attachment device 100. The long head ι 60 is disposed above the platform 13 , and is movable back and forth along a parallel normal 135 to be close to or far from the platform 130. The attachment mechanism 110 includes a drop-off unit 112 and a lower pressure unit, such as a roller set 114, for clamping at the first position 192 and driving the tape 150 to move toward the second position 194. The roller set 114 moves in the direction of the parallel normal line 135 to the non-pressing position and the pressing position, and presses the tape 15 于 in the pressing position to complete the anisotropy during the movement of the attaching mechanism 110 and the short ram 120. Attachment of conductive material. As shown in Fig. 1, the cutting mechanism 18 〇 cuts a length from the tape 15 and cuts the anisotropic conductive material I56, and forms a hole 157 with the remaining anisotropic conductive material 154. The attachment mechanism 11〇 and the short indenter 12〇 are in the first position 192, and the roller set 114 is now in the non-pressing position. Firstly, the adhesive tape 15 is clamped by the holding unit 112, and moved between the roller ιΐ4 and the short ram 120 to the long ram (10) and the platform (10), so that the long-cut anisotropic conductive material 156 4 skin clamping unit 112 (4), and arrive at a long position corresponding to the long sticking area 142. Then, the holding unit 112 releases the tape 150 while the suction mechanism 17 〇 attracts the release paper 152 remaining after the attachment is completed. At this time, the attaching mechanism 11〇 and the short indenter 12〇 may pass the long stick 9 1306368
Sanda number: TW2332PA area 142 ‘but does not correspond to long stickers # negative stickers L 142. The pick-up mechanism n 〇 and the short ram 120 are in the first position. 戎 Fu must move 92 and retreat, so that the roller set 114 moves sub-corresponding to the starting point of the long-cut anisotropic conductive material 156. Then, the roller ^ 114 is lowered to the S-position below the honing tape 15 〇 ' so that the long-cut anisotropic conduction = 156 of 1 contacts the long attachment area 142, as shown in Fig. 2. Then, in the direction of the vertical method and the line 135, the attaching mechanism 110 and the short indenter 120 are lifted from the platform 130. Your mother moves to the first position 194. During the movement of the attachment mechanism 110 and the short indenter 120, the roller and the group 114 completely attach the long-cut anisotropic conductive material 156 to the long (four) 142, as shown in FIG. 3, and then the 'roller group 114 rises to The non-clamping position, the attaching mechanism ιι〇 and the short ram 120 move to the first position ^ 192, separating the release paper 152 from the long-cut anisotropic conductive material 156, as shown in FIG. Next, the wafer or wafer-carrying circuit board, such as the circuit board 146 shown in Fig. 5, corresponds to the long bonding area 142, and the long ram 16 利用 is directed toward the platform along a parallel normal line 13 5! 3 〇 move, the next $ affixed wafer or chip-carrying circuit board cuts the anisotropic conductive material 156 in the long bonding area 142, so that the long-cut anisotropic conductive material 156 is closely attached to the wafer or the circuit carrying the chip The board is on the substrate long attaching area 142 as shown in FIG. Among them, the long indenter 16〇 provides - 3Gt~2G{rc adjustable temperature thermal head. So far, the length of the anisotropic conductive material 156 on the substrate 140 is reported to the paragraph. Referring to Figures 6-9, a flow chart of the attachment device for attaching a short anisotropic conductive material (a small number of wafers can be attached) to the substrate is shown. First, the cutting mechanism 18 cuts a short cut anisotropic conductive material 158' and is interposed with the remaining anisotropic conductive material 154 1306368
, Sanda number: TW2332PA forms a hole 159 ' as shown in Figure 6. Then, the clamping unit 112 clamps the tape 150 again, and the attaching mechanism ιι and the short ram 120 move between the long ram 16 〇 and the platform 13 ,, so that the short-cut anisotropic conductive material 158 is located and short. Area 144 corresponds to the short position. Then, the gripping unit 112 releases the tape 150, and the suction mechanism 17 sucks the remaining release paper 152 to which the tape 150 is attached, and takes the release paper 152 away from the attaching device 1''. Then, after the roller set 114 presses the tape, the attaching mechanism U 〇 and the short ram 120 move in the direction of the second position 194, so that the short anisotropic conductive material 15 8 is attached to the short attaching area 144, such as the first; The figure shows. The roller set 114 then rises to a non-pressed position. The attaching mechanism ιι〇 and the short ram 120 are moved from the platform 13 to the first position 192 to separate the release paper 152 from the short-cut anisotropic conductive material 158, as shown in FIG. Next, the wafer or the circuit board carrying the wafer, such as the circuit board 148 shown in FIG. 9 , is placed in the short attachment area 14 and then the attachment mechanism ιι Φ and the short pressure head 12 〇 are along the parallel normal line 135. The direction is moved on the platform 13A such that the short $head 120 is located above the short patch area 144. Next, the short indenter 12 is pressed down to attach the circuit board 148 to the short attaching region 144 of the substrate 140 as shown in Fig. 9. The short indenter 120 provides a 30 ° C to 2 可 adjustable temperature thermal head. Then, the attaching mechanism Π0 and the short ram 120 are returned to the first position 192, and the attaching device 1 贴 attaches the long-cut anisotropic conductive material 156 and the short-cut anisotropic conductive material 158 to the substrate 140. Work, it will be completed. However, the technical field to which the present embodiment pertains has a general knowledge, and it is clear that 11 1306368
α 三达编号: TW2332PA The technology of the present embodiment is not limited to the specific contents described in the above embodiments. For example, the long ram 160 or the short ram 120 further includes a pneumatic cylinder, and the short ram 120 further includes a short ram that can be raised and lowered. The surface of the long ram 16 〇 and the short ram 120 is more cushioned to avoid damage to the attached tape ι5〇. In addition, in the present embodiment, the simultaneous movement of the attaching mechanism 110 and the short indenter 12〇 is taken as an example, and in fact, the two can be moved separately. That is, the short indenter 120 can be individually moved over the short attachment area 144 for attachment. Referring to Figure 10, there is shown a schematic view of an attachment device according to another embodiment of the present invention. The main difference between the embodiment and the attaching device 1 of the foregoing embodiment is that the long indenter 160a and the short indenter 12〇& are disposed adjacent to the platform 130, and the short indenter 120a is not attached to the attaching mechanism. 〇 Connect to each other. The platform 130 may also be a movable platform that can move perpendicular to the normal 135. The substrate can be moved to correspond to the long head 16 〇 & and the short head
The anisotropic conductive material attaching device disclosed in the above embodiment of the present invention has a method of attaching a long indenter and a short waste head to the same machine and is attached by means of a mechanism and a short indenter shaft. Attached. Moreover, both the head and the short head are heat-pressable devices that can control the temperature and pressure. The attachment device can be attached to the size of the attached substrate and the attachment area by the attachment mechanism of the short indenter. For the short attachment area, the domain is used, and the attachment area required for the mobile attachment mechanism can be attached. In addition to the section, the long_outer can also reduce the cutting segment and save the sticker. Attached material. 12 1306368
。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The scope of the present invention is defined by the scope of the appended claims.
13 1306368
达达编号号: TW2332PA [Simple Description of the Drawings] FIGS. 1 to 5 are diagrams showing the operation of the attaching device for attaching a long anisotropic conductive material (most wafers) to the substrate according to a preferred embodiment of the present invention. 6 to 9 are diagrams showing an operation of attaching a device for attaching a short anisotropic conductive material (a few wafers) to a substrate according to a preferred embodiment of the present invention; and FIG. 10 is a view showing another embodiment of the present invention; A schematic view of the attachment device of the embodiment.
14 1306368
Sanda number: TW2332PA [Description of main component symbols] 100: Attachment device 110: Attachment mechanism 112: Clamping unit 114 • Roller set 120, 120a: Short indenter 130: Platform 140: Substrate 142. Long attachment area 144: Short-pad areas 146, 148: circuit board 150: tape 152: release paper 154: anisotropic conductive material 156: long-cut anisotropic conductive material 157, 159: aperture 158: short-cut anisotropic conductive material 160 , 160a: long indenter 170: suction mechanism 180: cutting mechanism 192: first position 194: second position

Claims (1)

1306368 _ Sanda number: TW2332PA X. Patent application scope: 1. A patching device comprising: a platform for placing a substrate; and an attaching mechanism for attaching an anisotropic conductive material to the substrate; A long indenter and a short indenter are used to apply an external force to the substrate to which the anisotropic conductive material is attached. 2. The device of claim 1, wherein the short indenter is interconnected with the attachment mechanism. 3. The device of claim 1, wherein the short indenter is disposed adjacent to the platform adjacent to the long head. 4. The device of claim 1, wherein the short indenter and the attachment mechanism move back and forth perpendicular to the normal of the platform. 5. The device of claim 1, wherein the short indenter and the long indenter apply an external force to the substrate in a parallel plate normal. 6. The device of claim 5, wherein the long head and the short head have a cushioning material between the long head or the short head and the substrate B when an external force is applied. 7. The apparatus of claim 1, further comprising a cutting mechanism for cutting the anisotropic conductive material. 8. The device of claim 1, wherein the attaching mechanism further comprises a clamping unit for clamping or releasing a tape comprising a release paper and the anisotropic conductive material. . 9. The device of claim 1, wherein the attaching mechanism further comprises a lower pressing unit that moves in a direction parallel to the normal. 16 1306368, Sanda number: TW2332PA 10. The apparatus of claim 9, wherein the pressing unit is a roller set. 11. The device of claim 1 further includes a suction mechanism for attracting a release paper. 12. The device of claim 1, wherein the long head or the short head comprises a pneumatic cylinder. 13. The device of claim 1, wherein the long head and the short head control temperature and pressure. * 14. The device of claim 1, wherein a wafer or a circuit board carrying the wafer is attached to the substrate. 15. A method of attaching, comprising: placing a substrate on a platform; moving an attaching mechanism for attaching an anisotropic conductive material to the substrate; and utilizing a long indenter and a short indenter An external force is applied to the substrate to which the anisotropic conductive material is attached. 16. The method of claim 15, wherein the short indenter is interconnected with the attachment mechanism. 17. The method of claim 15, wherein the long head and the short head are disposed adjacent to the platform. 18. The method of claim 15, wherein the short indenter and the attachment mechanism move back and forth perpendicular to the normal to the platform. 19. The method of claim 15, wherein the short indenter and the long indenter apply an external force to the substrate in a manner parallel to the normal to the platform. The method of claim 19, wherein the long head and the short head are pressed down, between the long head or the short head and the substrate A cushioning material. 21. The method of claim 15, wherein the step of attaching the anisotropic conductive material to the substrate further comprises: cutting out the tape having the anisotropic conductive material and a release paper A cutting of the anisotropic conductive material. 22. The method of claim 21, wherein the attaching mechanism* further comprises a clamping unit, after the step of cutting the anisotropic conductive material, further comprising: pressing the tape with the attaching mechanism The cut anisotropic conductive material is attached to the substrate. 23. The method of claim 22, after the step of attaching the cut anisotropic conductive material to the substrate, further comprising: placing a plurality of wafers or a circuit board carrying the wafer on the cutting board I cut the anisotropic conductive material on the substrate. 24. The method of claim 23, after the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: The head moves toward the platform to press the cut anisotropic conductive material. 25. The method of claim 23, before the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: 18 1306368 _ three Number: TW2332PA Moves the attachment mechanism and the short head to a second position that is outside the other side of the platform. 26. The method of claim 23, after the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: moving the short pressure Heading to the top of the platform; and moving the cutting anisotropic conductive material by moving the short indenter toward the platform. 27. The method of claim 23, before the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: moving the sticker Attaching the mechanism and the short indenter to the first position. 28. The method of claim 23, after the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: moving the attachment The mechanism and the short indenter are above the platform; and the cutting of the anisotropic conductive material is pressed by moving the short indenter toward the platform. 29. The method of claim 15, wherein the long head and the short head have a cushioning material between the long head or the short head and the substrate when an external force is applied. 30. The method of claim 15, wherein the long head and the short head control temperature and pressure. 19
TW95138633A 2006-10-19 2006-10-19 Attaching apparatus and attaching method thereof TWI306368B (en)

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Application Number Priority Date Filing Date Title
TW95138633A TWI306368B (en) 2006-10-19 2006-10-19 Attaching apparatus and attaching method thereof

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TWI306368B true TWI306368B (en) 2009-02-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI622487B (en) * 2014-11-14 2018-05-01 深圳市豫鑫達科技有限公司 A fpc automatic tape laminating machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI622487B (en) * 2014-11-14 2018-05-01 深圳市豫鑫達科技有限公司 A fpc automatic tape laminating machine

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