TW200636846A - Method and apparatus for breaking workpiece, scribing and breaking method, and scribing apparatus with breaking function - Google Patents

Method and apparatus for breaking workpiece, scribing and breaking method, and scribing apparatus with breaking function

Info

Publication number
TW200636846A
TW200636846A TW095100127A TW95100127A TW200636846A TW 200636846 A TW200636846 A TW 200636846A TW 095100127 A TW095100127 A TW 095100127A TW 95100127 A TW95100127 A TW 95100127A TW 200636846 A TW200636846 A TW 200636846A
Authority
TW
Taiwan
Prior art keywords
workpiece
breaking
scribing
back side
sheet
Prior art date
Application number
TW095100127A
Other languages
Chinese (zh)
Other versions
TWI428971B (en
Inventor
Toji Nakazawa
Takayoshi Shimotsuchi
Takanobu Hoshino
Masanori Mito
Akio Hanyu
Takaya Kono
Yoshiaki Shishido
Original Assignee
Thk Co Ltd
Beldex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thk Co Ltd, Beldex Corp filed Critical Thk Co Ltd
Publication of TW200636846A publication Critical patent/TW200636846A/en
Application granted granted Critical
Publication of TWI428971B publication Critical patent/TWI428971B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

The present invention provides a method and an apparatus for breaking a workpiece capable of preventing the back side of the workpiece from chipping due to the scratching upon breaking the workpiece on which a scribing line is scribed. The method for breaking a workpiece 5 in accordance with the present invention comprises the steps of: attaching the back side of the workpiece 5 onto a stretchable sheet 9; stretching the sheet 9 to which the workpiece 5 has been attached; and breaking the workpiece 5 by scribing a scribing line 5c through the back side of the workpiece5 under the condition that the sheet 9 is stretched. The workpiece 5 is simultaneously broken and separated due to the stretching force of the sheet 9 so that the scratching between the broken workpieces 5 can be reduced and the chipping occurred on the back side can be avoided. Meanwhile, as the stretching force applied on the workpiece 5 becomes an assistant for breaking the workpiece, the workpiece 5 can be broken with a smaller force.
TW095100127A 2005-01-05 2006-01-03 Method and apparatus for breaking workpiece, scribing and breaking method, and scribing apparatus with breaking function TWI428971B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005000554 2005-01-05
JP2005146551 2005-05-19
JP2005373460 2005-12-26

Publications (2)

Publication Number Publication Date
TW200636846A true TW200636846A (en) 2006-10-16
TWI428971B TWI428971B (en) 2014-03-01

Family

ID=36647580

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095100127A TWI428971B (en) 2005-01-05 2006-01-03 Method and apparatus for breaking workpiece, scribing and breaking method, and scribing apparatus with breaking function

Country Status (4)

Country Link
JP (1) JP5037138B2 (en)
KR (1) KR101170587B1 (en)
TW (1) TWI428971B (en)
WO (1) WO2006073098A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114093979A (en) * 2020-08-25 2022-02-25 苏州阿特斯阳光电力科技有限公司 Photovoltaic cell splitting method and splitting equipment

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JP5286938B2 (en) * 2008-05-27 2013-09-11 東京エレクトロン株式会社 Needle mark inspection device, probe device, needle mark inspection method, and storage medium
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JP5310278B2 (en) * 2009-06-05 2013-10-09 三星ダイヤモンド工業株式会社 Break bar
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JP5182339B2 (en) * 2010-08-31 2013-04-17 三星ダイヤモンド工業株式会社 Substrate break device
JP5621932B2 (en) * 2011-07-27 2014-11-12 日産自動車株式会社 Field pole magnet body manufacturing apparatus and method
JP5831119B2 (en) * 2011-10-17 2015-12-09 日本電気硝子株式会社 Glass substrate cleaving apparatus, glass substrate cleaving method, and glass substrate manufacturing method
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US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
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US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
EP3169476A1 (en) 2014-07-14 2017-05-24 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
CN107073642B (en) 2014-07-14 2020-07-28 康宁股份有限公司 System and method for processing transparent materials using laser beam focal lines with adjustable length and diameter
EP3536440A1 (en) 2014-07-14 2019-09-11 Corning Incorporated Glass article with a defect pattern
JP6689023B2 (en) * 2014-08-28 2020-04-28 三星ダイヤモンド工業株式会社 Break device
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
JP2018507154A (en) 2015-01-12 2018-03-15 コーニング インコーポレイテッド Laser cutting of thermally enhanced substrates using multi-photon absorption method
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US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
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KR20220078719A (en) 2016-05-06 2022-06-10 코닝 인코포레이티드 Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
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JP2019532908A (en) 2016-08-30 2019-11-14 コーニング インコーポレイテッド Laser cutting of materials with an intensity mapping optical system
WO2018064409A1 (en) 2016-09-30 2018-04-05 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
WO2018081031A1 (en) 2016-10-24 2018-05-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
JP6776859B2 (en) * 2016-12-09 2020-10-28 日本電気硝子株式会社 Manufacturing method of wavelength conversion member, wavelength conversion member and light emitting device
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
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US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
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CN114093979A (en) * 2020-08-25 2022-02-25 苏州阿特斯阳光电力科技有限公司 Photovoltaic cell splitting method and splitting equipment

Also Published As

Publication number Publication date
TWI428971B (en) 2014-03-01
KR20070121640A (en) 2007-12-27
KR101170587B1 (en) 2012-08-01
WO2006073098A1 (en) 2006-07-13
JP5037138B2 (en) 2012-09-26
JPWO2006073098A1 (en) 2008-06-12

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