Classifications

• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
  • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
  • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
  • G02B6/4206—Optical features
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
  • G02B6/24—Coupling light guides
  • G02B6/42—Coupling light guides with opto-electronic elements
  • G02B6/4201—Packages, e.g. shape, construction, internal or external details
  • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
  • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
  • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
  • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

• Photoelectric conversion element array integrated device thereof, mounting structure thereof, and optical information processing device
• the present invention relates to a photoelectric conversion element array, an integrated device thereof, a mounting structure thereof, and an optical information processing device.
• High performance chip mounted on precision mounting substrate such as ceramic silicon It realizes fine wiring coupling that cannot be formed on a mother board (multilayer printed circuit board). This makes it possible to reduce the pitch of the wiring, and by increasing the bus width, the amount of data exchange increases dramatically.
• Through-hole electrodes are provided on various semiconductor chips, and they are laminated to form a laminated structure. As a result, the connection between different types of semiconductor chips is physically shortened, and as a result, problems such as signal delay are avoided. However, on the other hand, problems such as increased heat generation due to lamination and thermal stress between semiconductor chips arise.
• optical transmission coupling technology using optical wiring has been developed in order to realize high-speed transmission and reception of signals and large capacity (for example, see “Electronics”, “Encountering with Optical Wiring” below).
• Optical wiring can be applied to various places, such as between electronic devices, between pods in electronic devices, or between chips in pods.
• an optical waveguide 51 is formed on a printed wiring board 50, and light (for example, light modulated by a light emitting element (for example, a surface emitting laser) 52) Laser light) is incident on the optical waveguide 51, and the incident light is guided through the optical waveguide 51, and the light emitted from the optical waveguide 51 is received by the light receiving element (for example, a photodiode) 53.
• the optical waveguide 51 is used as a transmission path for a signal-modulated laser beam or the like. Transmission ⁇
• a communication system can be constructed.
• the optical waveguide 51 is composed of clad layers 60 and 61 and a core layer 57 sandwiched between them, and a lens member 58 at a position on the clad layer 60 corresponding to the light input / output section. Is provided. Also, as shown in FIG. 10B, a plurality of core layers 57 are arranged in parallel. In FIG. 10B, the cladding layer 61 is not shown.
• the light-emitting element 52 and the light-receiving element 53 are disposed on the bases 56a and 56b, respectively, corresponding to the light input / output sections of the plurality of core layers 57, and the light-emitting element arrays 62 and The light receiving element array 63 is constituted.
• an optical component 59 is disposed in each of the light emitting element 52 and the light receiving element 53, whereby light is effectively emitted and incident.
• the light emitting element array 62 and the light receiving element 53 are mounted on a mounting board (for example, an interposer) 54 having a drive circuit element 55 and the like.
• external connection terminals 64 are connected to the light emitting element 52, and these are connected to the bases 56a corresponding to the respective light input / output sections of the plurality of core layers 57.
• the light emitting element arrays 62 are arranged in parallel on the upper side. This is the same for the light receiving element array 63. Disclosure of the invention
• the optical waveguide 51 according to the conventional example as described above, it is technically difficult to form the core layer 57 in a high-density array (for example, 100 / xm pitch or less). The reason will be described below.
• the optical waveguide 51 As shown in FIG. 10A, the optical waveguide 51 according to the conventional example has a light input / output section.
• the light input / output part of 7 is a linear array perpendicular to the waveguide (propagation) direction of light. It becomes.
• a method of selectively forming a part of the mirror by isotropic etching is also being studied, but the accuracy and stability are insufficient, and it is considered that mass production is impossible at present.
• the light emitting element 52 and the light receiving element 53 are arranged corresponding to the light input / output section of the core layer 57, their arrangement is also a linear arrangement.
• the light-emitting element 52 and the light-receiving element 53 cause optical interference with an adjacent element (light interferes with an adjacent path because the light travels while having a spread of about 10 °), and crosstalk due to element heat generation ( Due to the heat generated by light emission, the characteristics of adjacent elements will change.)
• the core layer 57 also requires a certain amount of pitch, making it impossible to form a high-density array.
• the optical wiring must be densely integrated at a pitch of 100 m or less. It is difficult. This is also the reason why the optical transmission channel remains at the level of several tens of ch.
• the present invention has been made to solve the above-described problems, and an object of the present invention is to enable high-density integration of optical wiring and reduce optical interference and crosstalk caused by photoelectric conversion elements.
• An object of the present invention is to provide a photoelectric conversion element array capable of performing efficient light propagation, an integrated device thereof, a mounting structure thereof, and an optical information processing device.
• the present invention comprises a plurality of photoelectric conversion elements arranged in an array, and these photoelectric conversion elements are alternately arranged at different positions so as to be located on the same straight line every other in the array direction.
• the present invention relates to a photoelectric conversion element array.
• the present invention relates to a photoelectric conversion element array integrated device.
• the light emitting element array and the light receiving element array are disposed so as to face the interposer substrate, and these arrays are provided on the interposer substrate.
• the present invention relates to a mounting structure of a photoelectric conversion element array or a photoelectric conversion element array integrated device mounted via an external connection terminal.
• the present invention relates to an optical information processing apparatus including the photoelectric conversion element array or the photoelectric conversion element array integrated device of the present invention, and an optical waveguide facing each element of the photoelectric conversion element array.
• an optical waveguide in which a plurality of core layers are arranged in parallel, and the position of the light input / output unit is shifted between the adjacent core layers in the light waveguide direction.
• the photoelectric conversion elements the issuing element and the light receiving element arranged corresponding to the light input / output section of the core layer can also be arranged shifted in the waveguide direction.
• the distance between light-emitting elements (or light-receiving elements) adjacent to each other can be increased as compared with the above-described conventional example, so that optical interference between adjacent photoelectric conversion elements can be improved.
• adverse effects such as crosstalk due to element heat generation can be reduced as compared with the structure of the conventional example.
• the inventor of the present invention has conducted intensive studies in order to realize further improvement of the characteristics. It was found that the distance between the light-receiving elements was not sufficient, and that optical interference and crosstalk could occur.
• the photoelectric conversion element array according to the present invention includes the plurality of photoelectric conversion elements (light-emitting elements or light-receiving elements) arranged in an array, and these photoelectric conversion elements are arranged alternately in the array direction. Since they are arranged alternately at different positions so as to be on a straight line, the distance between the adjacent photoelectric conversion elements can be sufficiently large even if the integration density is increased. Therefore, the difficulty in mounting can be reduced, optical and electrical interference of the photoelectric conversion element, crosstalk, and the like can be effectively prevented, and higher transmission capacity and lower cost of the system can be further achieved. Can be pursued. Brief Description of Drawings
• FIGS. 1A to 1C are schematic diagrams of an optical information processing device and a photoelectric conversion element array (or a photoelectric conversion element array integrated device) based on the present invention, according to the first embodiment of the present invention.
• FIG. 2A and FIG. 2B are schematic diagrams comparing and disposing examples of a photoelectric conversion element array integrated device based on the present invention.
• FIG. 3 is a schematic diagram showing another arrangement example of the photoelectric conversion element array integrated device according to the second embodiment of the present invention.
• FIGS. 4A and 4B are schematic perspective views of a socket according to the third embodiment of the present invention.
• 5A and 5B are schematic perspective views of an optical information processing device using a socket according to the present invention.
• FIG. 6A and FIG. 6B are schematic perspective views of the same ink jet printer substrate.
• 7A to 7E are schematic sectional views showing an example of a method of manufacturing an optical information processing device based on the present invention using a socket in the order of steps.
• 8A to 8C are schematic plan views showing a part of a manufacturing process of an optical information processing device according to the present invention using a socket.
• FIGS. 9A and 9B are schematic diagrams of an example of the optical information processing device based on the present invention using a socket.
• 10A to 10C are schematic diagrams of a system using an optical waveguide according to a conventional example.
• an external connection terminal is connected to each of the plurality of photoelectric conversion elements, and a set of the photoelectric conversion element and the external connection terminal is formed in a pattern inverted in the array direction. Further, it is desirable that the adjacent sets are alternately shifted in a direction orthogonal to the array direction. Accordingly, the distance between the adjacent photoelectric conversion elements and the distance between the external connection terminals can be further increased, so that the integration density of the photoelectric conversion elements can be further improved without generating optical interference, crosstalk, and the like. As a result, adjacent external connection terminals can be easily arranged, and as a result, it is possible to easily and surely increase the integration density of the core layer of the optical waveguide described later.
• the photoelectric conversion element array of the present invention is preferably configured as a light-emitting element array or a light-receiving element array, and the light-emitting element array or the light-receiving element array is an interposer provided with a drive circuit element. Preferably, it is mounted on the substrate via the external connection terminal.
• the optical information processing apparatus 1 includes an optical waveguide 3 formed on a printed wiring board 2, and light (eg, laser light) modulated by a light emitting element (eg, a surface emitting laser) 4 as the photoelectric conversion element. ) Is incident on the optical waveguide 3, the incident light is guided through the optical waveguide 3, and the light emitted from the optical waveguide 3 is received by the light receiving element (for example, photodiode) 5 as the photoelectric conversion element. You. In this manner, an optical transmission and communication system in which the optical waveguide 3 is a transmission path for signal-modulated laser light or the like can be constructed.
• a light emitting element eg, a surface emitting laser
• the photoelectric conversion element array integrated device 6 includes a plurality of light emitting elements 4 (or light receiving elements 5) arranged in an array.
• a plurality of photoelectric conversion element arrays which are arranged alternately at different positions so that every other photoelectric conversion element 4 (or 5) is located on the same straight line in the array direction, are juxtaposed on the base 8.
• the photoelectric conversion elements 4 (or 5) are arranged at different positions in the array direction between adjacent photoelectric conversion element arrays.
• An external connection terminal (anode electrode) 7 is connected to each of the plurality of photoelectric conversion elements 4 (or 5), and a set of the photoelectric conversion element 4 (or 5) and the external connection terminal 7 is arranged in the array direction. Preferably, it is formed in an inverted pattern. Further, it is preferable that the adjacent sets are alternately shifted in a direction orthogonal to the array direction. As a result, the distance between the adjacent photoelectric conversion elements 4 (or 5) can be increased, and the integration density of the photoelectric conversion elements 4 (or 5) can be reduced without causing optical interference or crosstalk. As a result, the integration density of the core layer of the optical waveguide described later can be easily and reliably increased.
• a ground electrode (force source electrode) 12 is formed corresponding to the photoelectric conversion element 4 (or 5).
• the photoelectric conversion element array according to the present invention includes the light emitting element array Alternatively, it is configured as a light receiving element array.
• the light emitting element array and the light receiving element array are arranged to face the ink poser substrate 9, and these arrays are connected to the ink poser substrate 9 via the external connection terminals 7 and the solder bumps 10.
• the interposer substrate 9 is provided with wiring (not shown) connected to the photoelectric conversion element 4 (or 5) and the drive circuit element 11.
• a lens member 13 is arranged corresponding to the light emitting element 4 and the light receiving element 5. This allows more efficient light incidence or light emission.
• the lens member 13 is not shown.
• the optical waveguide 3 is composed of the cladding layers 14 and 15 and the core layer 16 sandwiched between them, and the light on the cladding layer 14 is A lens member 17 is provided at a position corresponding to the entrance / exit portion. Further, a plurality of core layers 16 are arranged in parallel, and the light incident portion and the light emitting portion are formed over a 45 ° mirror.
• the light incident portion and the light emitting portion of the core layer adjacent to each other are formed at positions shifted in the light guiding (propagating) direction corresponding to the light emitting element 4 and the light receiving element 5.
• the cladding layer 14 is not shown.
• An optical waveguide having such a structure can be realized by using, for example, a synchrotron radiation lithography process.
• light (for example, laser light) signal-modulated by the light emitting element 4 is collimated by the lens member 13. This signal light is further condensed by a lens member 17 formed at the light incident portion of the optical waveguide 3 and is effectively incident on the core layer 16 of the optical waveguide 3.
• optical waveguide 3 Optical transmission and communication systems can be constructed as transmission paths for signal-modulated laser light and the like.
• the photoelectric conversion element array according to the present invention includes a plurality of photoelectric conversion elements 4 and 5 arranged in an array, and these photoelectric conversion elements 4 and 5 are arranged in the array direction. Since every other layer is alternately arranged at the same straight line, even if the integration density of the core layer 16 is increased, the distance between the adjacent photoelectric conversion elements 4 and 5 is sufficient. It can take a lot. Therefore, the level of difficulty in mounting can be reduced, optical and electrical interference of the photoelectric conversion elements 4 and 5 ⁇ ⁇ ⁇ crosstalk can be effectively prevented, and a higher transmission capacity and lower cost of the system can be achieved. Can be pursued further.
• the occupation area of the lens member 13 can be increased, the coupling efficiency can be improved, and as a result, the reliability of the system can be improved, and power consumption can be suppressed.
• the distance between adjacent external connection terminals 7 (and solder bumps 10) can be increased, so that reliability and mass productivity can be improved.
• FIG. 2A is a schematic diagram illustrating an arrangement example according to the prior application
• FIG. 2B is a schematic diagram illustrating an arrangement example according to the present embodiment.
• the spacing between adjacent elements is about 100 / m. ing.
• the distance between adjacent elements can be formed to be 200 m.
• the element interval A between the photoelectric conversion element arrays can be set to 256 m, and the same photoelectric conversion element Element in array
• the element spacing B can be set to 2 23 ⁇ m, and can be formed larger than the arrangement example according to the prior application.
• the size of the solder bumps 10 has been miniaturized, it is preferable that the size be ⁇ 50 x m or more in consideration of reliability and mass productivity.
• the bump pitch is preferably 100 m or more, which is about twice the size. If it is less than that, the adjacent solder bumps 10 may be combined at the time of melting, resulting in a short circuit failure.
• the interval between adjacent solder bumps 10 can be formed to be 200 m.
• the interval between the solder bumps 10 can be set to 2 23 ⁇ m. Can be formed larger.
• the lens diameter of the lens member 13 arranged corresponding to the elements 4 and 5 is smaller than the distance between adjacent elements.
• the light flux of the light passing through the lens member 13 is a value obtained by subtracting a mounting tolerance in consideration of a deviation due to mounting (this is because an optical signal leaks to an adjacent signal system). .
• the light flux needs to be as large as possible in order to increase the coupling efficiency between the lens members 13.
• the maximum diameter of the lens member can be formed to be ⁇ 200 im.
• the maximum diameter of the lens member 13 can be ⁇ , which is larger than the arrangement example according to the prior invention. Can be formed.
• the distance between the plurality of photoelectric conversion elements 4 and 5 and the solder bumps 10 respectively connected to the plurality of photoelectric conversion elements 4 and 5 is generally, for example, about 100 ⁇ m.
• the light The photoelectric conversion element array is composed of a plurality of photoelectric conversion elements 4, 5 arranged in an array, and these photoelectric conversion elements 4, 5 are alternately different so that every other photoelectric conversion element 4, 5 is located on the same straight line in the array direction. Since they are arranged at positions, even if the integration density of the core layer 16 is increased, the distance between the adjacent photoelectric conversion elements 4 and 5 and the distance between the external connection terminals 7 can be made sufficiently large. Therefore, the level of difficulty in mounting can be reduced, optical and electrical interference of the photoelectric conversion elements 4 and 5, crosstalk, and the like can be effectively prevented, and a higher transmission capacity and lower cost of the system can be achieved. Can be further pursued.
• the occupation area of the lens member 13 can be increased, the coupling efficiency can be improved, and as a result, the reliability of the system can be improved, and power consumption can be suppressed.
• the distance between adjacent external connection terminals 7 (and solder bumps 10) can be increased, so that reliability and mass productivity can be improved.
• every other photoelectric conversion element in the array direction has a light guide of the core layer. It may be shifted in the wave direction (for example, 26/2 m).
• the element interval A (and the distance between the adjacent solder bumps 10) between the photoelectric conversion element arrays can be set to 236/2 m, and the elements in the same photoelectric conversion element array can be formed.
• the interval B can be set to 236 / m, and can be formed larger than the arrangement example according to the first embodiment as shown in FIG. 2B.
• the maximum diameter of the lens member 13 can be ⁇ 236; m, which can be made larger than the arrangement example according to the first embodiment as shown in FIG. 2B. Thereby, the light coupling efficiency can be further improved.
• the optical information processing device includes the photoelectric conversion element array according to the present invention and the optical waveguide facing the photoelectric conversion element array, and the structure thereof does not depart from the content of the present invention. As long as it can be appropriately selected, it can be suitably used, for example, in a structure having a socket and an optical waveguide installed in the socket.
• FIG. 4A and 4B are schematic perspective views of the socket.
• FIG. 4A is a schematic perspective view of the socket as viewed from the surface on which the optical waveguide is installed
• FIG. 4B is a schematic perspective view of the socket as viewed from the side opposite to FIG. 4A.
• the socket 20 is provided with a positioning means having an uneven structure for positioning and fixing the optical waveguide.
• the concavo-convex structure has a concave portion 21 for fitting the optical waveguide and positioning the optical waveguide in the width direction, and a projection 22 for positioning the optical waveguide in the longitudinal direction. are doing. Further, the depth of the concave portion 21 is larger than the thickness of the optical waveguide.
• a conductive means for connecting the front and back surfaces of the socket 20 with each other, for example, a terminal pin 24 is provided. Then, as will be described later, the photoelectric conversion element array or the photoelectric conversion element array integrated device according to the present invention is fixed on the convex surface 23 of the concavo-convex structure.
• any conventionally known material can be used as long as it is an insulating resin, and examples thereof include PES (polyethylene sulfide) resin containing glass, PET (polyethylene terephthalate) resin containing glass, and the like.
• PES polyethylene sulfide
• PET polyethylene terephthalate
• socket 20 materials already have a lot of data on their types, insulation properties, reliability, etc., and they handle a wide variety of manufacturers. Therefore, it is a structure that is easy to accept in terms of function, cost, reliability, etc. Yes, it is easy to integrate with existing printed wiring board mounting processes.
• the method of manufacturing the socket 20 is not particularly limited, but, for example, can be easily manufactured by molding using a mold having the above-mentioned uneven structure.
• FIGS. 5A and 5B are schematic cross-sectional views of an optical information processing device 1 according to the present invention using the socket 20 described above.
• the optical information processing device ⁇ based on the present invention using the socket 20 is provided with a pair of sockets 20 and the socket 20.
• An optical waveguide 3 is provided, and the optical waveguide 3 is bridged between the pair of sockets 20.
• the optical waveguide 3 includes a plurality of core layers arranged in parallel therein. At this time, since the optical waveguide 3 is not in contact with a printed wiring board to be described later, it is possible to effectively prevent the optical waveguide 3 from being destroyed by heat generated during use. .
• an inverter substrate 9 having a photoelectric conversion element array (or a photoelectric conversion element array integrated device) according to the present invention is fixed.
• a photoelectric conversion element array (or a photoelectric conversion element arraying device) 6 according to the present invention is mounted on one surface side of the inverter turbo substrate 9, and the drive circuit elements 11 a and lib are mounted on the other surface side.
• the interposer-substrate 9 has the drive circuit elements 11 a and 1 lb mounted on one side and the present invention on the other side.
• a light emitting element array 6a and a light receiving element array 6b as a photoelectric conversion element array based thereon (or in a photoelectric conversion element array integrated device) are mounted.
• other signal wiring electrodes 27 are provided on the periphery of the inner poser substrate 9.
• a pair of sockets 20 in which the optical waveguide 3 is installed in the recess 21 are provided.
• the surface of the interposer substrate 9 on which the photoelectric conversion element arrays 6 a and 6 b are mounted is configured to be in contact with the convex surface 23 of the socket 20.
• the terminal pins 24 of the socket 20 and other signal wiring electrodes (not shown) of the interposer substrate 9 are fixed so as to be electrically connected.
• FIG. 5B a space 25 can be formed between the one surface 26 of the optical waveguide 3 and the interposer-substrate 9.
• the drive circuit elements 11 a and 11 b are mounted on the socket 20 via the in-poser substrate 9, and one side 26 side of the optical waveguide 3 and the By forming a space 25 between the optical information processing apparatus 1 and the drive circuit elements 11a and 11b, the optical waveguide 3 generates heat even when the optical information processing apparatus 1 is used. It can be effectively prevented from being destroyed.
• the mechanism of this operation is as follows. An electric signal transmitted from one drive circuit element 11a is converted into an optical signal and emitted from the light emitting element as an optical signal by laser light. The emitted optical signal enters the corresponding light incident portion of one core layer of the optical waveguide 3, is guided in the waveguide direction in which the optical waveguide extends, and is emitted from the light emitting portion of the other core layer. Then, the optical signal emitted from the optical waveguide is received by the corresponding light receiving element, converted into an electric signal, and transmitted to the other drive circuit element 11b as an electric signal.
• the optical information processing device 1 of the present embodiment can configure an optical wiring system in which the optical waveguide 3 is used as an optical wiring. That is, the optical information processing device 1 is fixed while being electrically connected to the printed wiring board.
• the photoelectric conversion element array according to the present invention includes the plurality of photoelectric conversion elements arranged in an array, and these photoelectric conversion elements are arranged in the array direction every other one in the array direction. Since they are arranged alternately at different positions so as to be located on the line, even if the integration density of the core layer is increased, the distance between the adjacent photoelectric conversion elements can be made sufficiently large. Therefore, it is possible to reduce the difficulty in mounting, effectively prevent optical and electrical interference of the photoelectric conversion element, crosstalk, and the like, and further pursue higher transmission capacity and lower cost of the system. can do.
• the occupation area of the lens member can be increased, the coupling efficiency can be improved, and as a result, the reliability of the system can be improved and the power consumption can be suppressed.
• the signal lines between the drive circuit elements 11a and 11b and the photoelectric conversion elements can be made short and equal in length. Therefore, measures against noise and crosstalk of electric signals are facilitated, and the light modulation speed can be improved.
• the existing mounting structure of the printed wiring board can be used as it is. It is. Therefore, if an area where the socket 20 can be installed is provided on the printed wiring board, other general electric wiring can be formed by a conventional process.
• the optical waveguide 3 is inserted into the recess 21 of the socket 20. Since the optical waveguide 3 can be installed, the optical waveguide 3 can be mounted without suffering damage due to high temperature.
• the socket 20 can be made of a resin having higher rigidity than the printed wiring board, and optical coupling between the light emitting element or the light receiving element and the optical waveguide 3 is performed on the socket 20. Therefore, the mounting accuracy required for optical coupling can be easily secured. For example, with the current molding technology, assembly accuracy on the order of several / m can be secured. Therefore, the density of the optical bus can be increased.
• the optical waveguide is provided directly on the printed wiring board, so that the driving circuit elements 11a, 11b are provided with the enhancement of the driving circuit elements 11a, 11b.
• the degree of freedom in designing printed wiring boards is impeded by optical waveguides. This made it difficult to increase the functionality of the printed wiring board, and as a result, relied on the use of SOC (sys- tem on chip), which integrates all functions on a single chip.
• the optical waveguide 3 can be electrically connected to the printed wiring board in a state where the optical waveguide 3 is installed in the concave portion 21 of the socket 20.
• the optical wiring system can be deployed on the printed wiring board at a low cost and with a high degree of freedom while securing the high-density wiring of the printed wiring board and the degree of freedom in its design.
• High-speed distributed processing, higher functionality in electronic equipment tools, and shorter TAT (turn around time) in development can be expected.
• a pair of sockets 20 is mounted on the printed wiring board 2.
• the electrodes (not shown) on the printed wiring board 2 are aligned with the terminal pins 24 of the socket 20 so that the electrodes and the socket 20 are electrically connected.
• mounting of other electronic components and the like and electric wiring are formed on the printed wiring board 2 in advance.
• the optical waveguide 3 is set in the concave portion 21 of the socket 20, and the optical waveguide 3 is bridged between the pair of sockets 20.
• positioning in the longitudinal direction of the optical waveguide 3 can be easily performed by the projections 22 serving as the uneven structure provided in the socket 20, and the optical waveguide 3 can be positioned by the recess 21.
• Positioning in the width direction can be easily performed. Since the optical waveguide 3 is provided in the recess 21 of the socket 20, the optical waveguide 3 and the printed wiring board 2 are in a non-contact state.
• the means for bonding and fixing the optical waveguide 3 to the socket 20 is not particularly limited.
• it can be performed using an adhesive resin.
• a groove 28 is formed in an arbitrary shape on the bottom surface of the concave portion 21 of the socket 20.
• the groove 28 is formed such that the end of the groove 28 is located as far as the periphery of the protrusion 22 of the socket 20.
• an optical waveguide 3 in which a plurality of core layers 16 are arranged side by side is installed in a concave portion 21 of the socket 20.
• the positioning in the length direction and the width direction of the optical waveguide 3 can be easily performed by the protrusions 22 and the recesses 21 provided in the socket 20.
• the groove 28 is formed so as to be located up to the peripheral portion of the protrusion 22, a part of the groove 28 is not covered with the optical waveguide 3.
• Adhesive resin is injected using a dispenser 29 or the like from a part of the groove 28 not covered by the optical waveguide 3 and solidified, thereby bonding and fixing the optical waveguide 3 to the concave portion 21 of the socket 20. can do.
• the interposer substrate 9 is fixed on the convex surface 23 of the socket 20.
• an MPU (micro processor unit) 11 a or DRAM (dynamic random access memory) 11 b as the drive circuit element is mounted on one surface side of the interposer substrate 9, and the other surface side
• the photoelectric conversion element arrays 6a and 6b are mounted on the optical element.
• the surface of the interposer substrate 9 on which the photoelectric conversion element arrays 6a and 6b are mounted is configured to be in contact with the convex surface 23 of the socket 20, and the convex surface 23 of the socket 20 is
• the exposed terminal pins (not shown) are fixed to the other signal wiring electrodes 27 of the interposer substrate 9 so as to be electrically connected.
• aluminum fins 30 are provided on the MPU lla and the DRAM llb, respectively.
• an optical interconnection system in which the optical waveguide 3 is used as an optical interconnection can be configured using the optical information processing device 1 according to the present invention.
• FIGS. 9A and 9B are schematic diagrams illustrating an example in which the optical information processing device 1 according to the present invention is developed on a printed wiring board 2.
• FIG. For example, by standardizing an optical waveguide module, it can be freely deployed in four directions.
• the photoelectric conversion element array according to the present invention includes the plurality of photoelectric conversion elements arranged in an array, and these photoelectric conversion elements are arranged in the array direction every other one in the array direction. Since they are alternately arranged at different positions so as to be located on the line, the integration density of the core layer is increased. Also, the distance between adjacent photoelectric conversion elements can be made sufficiently large. Accordingly, the difficulty in mounting can be reduced, optical and electrical interference of the photoelectric conversion element, crosstalk, and the like can be effectively prevented, and higher transmission capacity and lower cost of the system are further pursued. can do.
• the occupation area of the lens member can be increased, the coupling efficiency can be improved, and as a result, the reliability of the system can be improved and the power consumption can be suppressed.
• the signal line between the drive circuit elements 11a and lib and the photoelectric conversion element can be made short and equal in length. Therefore, measures against noise and crosstalk of electric signals are facilitated, and the light modulation speed can be improved.
• the optical waveguide 3 can be electrically connected to the printed wiring board 2 in a state where the optical waveguide 3 is set in the concave portion 21 of the socket 20, the mounting structure of the existing printed wiring board 2 can be used as it is. can do. Therefore, if a region where the socket 20 can be provided is provided on the printed wiring board 2, other general electric wiring can be formed by a conventional process. Further, even if the optical waveguide 3 is vulnerable to a high-temperature process, as described above, the socket 20 is fixed to the printed wiring board 2 and further includes a high-temperature process such as solder reflow and underfill resin encapsulation.
• a high-temperature process such as solder reflow and underfill resin encapsulation.
• the optical waveguide 3 is installed in the concave portion 21 of the socket 20, so that the optical waveguide can be mounted without being damaged by high temperature.
• the socket 20 can be made of a resin having higher rigidity than the printed wiring board 2, and the light-emitting element or the light-receiving element and the optical coupling between the optical waveguide 3 can be performed on the socket 20. Therefore, the mounting accuracy required for optical coupling can be easily secured. For example, with the current molding technology, assembly accuracy of several orders can be secured. Therefore, the density of the optical bus can be increased.
• the optical waveguide 3 can be electrically connected to the printed wiring board 2 while being installed in the recess 21 of the socket 20, high-density wiring of the printed wiring board 2 and freedom of its design can be achieved. It is possible to develop the optical wiring system on the printed wiring board at a low cost and with a high degree of freedom while securing the degree of freedom, high-speed dispersion processing on the printed wiring board, enhancement of the functions of the entire electronic device, and Shorter TAT (turn around time) of development can be expected.
• the drive circuit elements lla and 11b are mounted on the socket 20 via the interposer substrate 9 and the one side 26 side of the optical waveguide 3 is connected to the inkjet turbo substrate 9.
• the space 25 therebetween even if the drive circuit elements 11a and lib generate heat when the optical information processing apparatus 1 is used, the heat can effectively prevent the optical waveguide 3 from being destroyed. be able to.
• the embodiments of the present invention have been described. However, the above examples can be variously modified based on the technical idea of the present invention.
• the present invention is suitable for the above-described optical wiring system in which a signal is put on a laser beam, but is also applicable to a display or the like by selecting a light source or the like.
• a light beam is condensed into a predetermined light beam which is efficiently emitted by an optical waveguide, and the light beam is emitted.
• an optical information processing device such as an optical wiring that is configured so that the signal light emitted after efficiently entering the optical waveguide is incident on the light receiving element (optical wiring, photodetector, etc.) of the next stage circuit. Can be.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Optical Couplings Of Light Guides (AREA)
• Optical Integrated Circuits (AREA)
• Light Receiving Elements (AREA)
• Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
• Led Devices (AREA)

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• 2004
  • 2004-05-28 JP JP2004158496A patent/JP2005340545A/ja active Pending
• 2005
  • 2005-03-03 WO PCT/JP2005/004157 patent/WO2005117146A1/ja not_active Ceased
  • 2005-03-03 CN CN200580023395.6A patent/CN1998092B/zh not_active Expired - Fee Related
  • 2005-03-03 US US11/569,616 patent/US7622700B2/en not_active Expired - Lifetime
  • 2005-05-20 TW TW094116496A patent/TW200608069A/zh not_active IP Right Cessation

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