CN1998092B - 光电转换元件阵列及其集成装置、安装结构和光处理装置 - Google Patents

光电转换元件阵列及其集成装置、安装结构和光处理装置 Download PDF

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Publication number
CN1998092B
CN1998092B CN200580023395.6A CN200580023395A CN1998092B CN 1998092 B CN1998092 B CN 1998092B CN 200580023395 A CN200580023395 A CN 200580023395A CN 1998092 B CN1998092 B CN 1998092B
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CN
China
Prior art keywords
photoelectric conversion
conversion element
array
element array
light
Prior art date
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Expired - Fee Related
Application number
CN200580023395.6A
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English (en)
Chinese (zh)
Other versions
CN1998092A (zh
Inventor
大鸟居英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
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Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN1998092A publication Critical patent/CN1998092A/zh
Application granted granted Critical
Publication of CN1998092B publication Critical patent/CN1998092B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Light Receiving Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Led Devices (AREA)
CN200580023395.6A 2004-05-28 2005-03-03 光电转换元件阵列及其集成装置、安装结构和光处理装置 Expired - Fee Related CN1998092B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004158496A JP2005340545A (ja) 2004-05-28 2004-05-28 光電変換素子アレイ、その集積装置及びこれらの実装構造、並びに光情報処理装置
JP158496/2004 2004-05-28
PCT/JP2005/004157 WO2005117146A1 (ja) 2004-05-28 2005-03-03 光電変換素子アレイ、その集積装置及びこれらの実装構造、並びに光情報処理装置

Publications (2)

Publication Number Publication Date
CN1998092A CN1998092A (zh) 2007-07-11
CN1998092B true CN1998092B (zh) 2010-06-16

Family

ID=35451165

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200580023395.6A Expired - Fee Related CN1998092B (zh) 2004-05-28 2005-03-03 光电转换元件阵列及其集成装置、安装结构和光处理装置

Country Status (5)

Country Link
US (1) US7622700B2 (enExample)
JP (1) JP2005340545A (enExample)
CN (1) CN1998092B (enExample)
TW (1) TW200608069A (enExample)
WO (1) WO2005117146A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7991248B2 (en) 2006-09-21 2011-08-02 Hitachi Chemical Co., Ltd. Optical waveguide substrate and substrate mounting photoelectric hybrid circuit
US20090065053A1 (en) * 2007-08-24 2009-03-12 Julian Gulbinski Photovoltaic device
JP2010191365A (ja) * 2009-02-20 2010-09-02 Hitachi Ltd 光インターコネクション実装回路
KR101256000B1 (ko) * 2011-04-13 2013-04-18 엘지이노텍 주식회사 광 모듈용 인터포저 및 이를 이용한 광모듈, 인터포저의 제조방법
WO2013115782A1 (en) 2012-01-31 2013-08-08 Hewlett-Packard Development Company, L.P. Monolithically integrated, self-aligning, optical-fiber ferrule
TWI561881B (en) * 2012-04-27 2016-12-11 Hon Hai Prec Ind Co Ltd Fiber optical transceiver
CN103376516B (zh) * 2012-04-27 2016-07-06 鸿富锦精密工业（深圳）有限公司 光纤传输模组
TW201610495A (zh) * 2014-09-09 2016-03-16 鴻海精密工業股份有限公司 光耦合模組、光電轉換裝置以及光通訊裝置
CN109115250A (zh) * 2018-08-08 2019-01-01 珠海格力电器股份有限公司 感光器件的阵列结构和光电编码器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4471387A (en) * 1981-01-14 1984-09-11 Morton Nadler Image scanning method and device
JPS6450557A (en) * 1987-08-21 1989-02-27 Fujitsu Ltd Infrared-ray detector array
JPS6450557U (enExample) 1987-09-25 1989-03-29
JPH06991A (ja) * 1992-06-22 1994-01-11 Fuji Xerox Co Ltd レーザビームプリンタ
JP3306130B2 (ja) * 1992-11-17 2002-07-24 三洋電機株式会社 発光ダイオードアレイ装置
JP3143053B2 (ja) * 1995-10-31 2001-03-07 キヤノン株式会社 リニアイメージセンサ
JP2000022215A (ja) * 1998-07-07 2000-01-21 Oki Electric Ind Co Ltd Ｌｅｄアレイ
JP3920540B2 (ja) 2000-07-04 2007-05-30 三洋電機株式会社 空気調和装置
JP2002189137A (ja) * 2000-12-20 2002-07-05 Nippon Telegr & Teleph Corp <Ntt> 光配線基板
JP4574006B2 (ja) * 2000-12-26 2010-11-04 キヤノン株式会社 画像形成装置
JP2002280655A (ja) * 2001-01-10 2002-09-27 Ricoh Opt Ind Co Ltd 光出力装置および光出力装置用レンズ素子
JP2003222746A (ja) * 2002-01-29 2003-08-08 Mitsubishi Electric Corp 光電気結合装置
JP4038586B2 (ja) 2002-04-26 2008-01-30 高砂香料工業株式会社 粉末ゴマおよびその製造方法
JP4711322B2 (ja) * 2002-11-29 2011-06-29 ルネサスエレクトロニクス株式会社 Ｃｃｄイメージセンサ
JP2004212847A (ja) * 2003-01-08 2004-07-29 Fujitsu Ltd 光結合器

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
JP特开2000-22215A 2002.01.21
JP特开2002-189137A 2002.07.05
JP特开2002-196571A 2002.07.12
JP特开2002-280655A 2002.09.27
JP特开2003-222746A 2003.08.08
JP特开平6-163980A 1994.06.10

Also Published As

Publication number Publication date
TWI316617B (enExample) 2009-11-01
WO2005117146A1 (ja) 2005-12-08
JP2005340545A (ja) 2005-12-08
CN1998092A (zh) 2007-07-11
US20070215790A1 (en) 2007-09-20
US7622700B2 (en) 2009-11-24
TW200608069A (en) 2006-03-01

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Granted publication date: 20100616