TW200608069A - Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing device - Google Patents

Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing device

Info

Publication number
TW200608069A
TW200608069A TW094116496A TW94116496A TW200608069A TW 200608069 A TW200608069 A TW 200608069A TW 094116496 A TW094116496 A TW 094116496A TW 94116496 A TW94116496 A TW 94116496A TW 200608069 A TW200608069 A TW 200608069A
Authority
TW
Taiwan
Prior art keywords
photoelectric transducer
transducer array
array
information processing
photoelectric
Prior art date
Application number
TW094116496A
Other languages
English (en)
Other versions
TWI316617B (zh
Inventor
Hiizu Ohtorii
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200608069A publication Critical patent/TW200608069A/zh
Application granted granted Critical
Publication of TWI316617B publication Critical patent/TWI316617B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Led Devices (AREA)
  • Light Receiving Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
TW094116496A 2004-05-28 2005-05-20 Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing device TW200608069A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004158496A JP2005340545A (ja) 2004-05-28 2004-05-28 光電変換素子アレイ、その集積装置及びこれらの実装構造、並びに光情報処理装置

Publications (2)

Publication Number Publication Date
TW200608069A true TW200608069A (en) 2006-03-01
TWI316617B TWI316617B (zh) 2009-11-01

Family

ID=35451165

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116496A TW200608069A (en) 2004-05-28 2005-05-20 Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing device

Country Status (5)

Country Link
US (1) US7622700B2 (zh)
JP (1) JP2005340545A (zh)
CN (1) CN1998092B (zh)
TW (1) TW200608069A (zh)
WO (1) WO2005117146A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101057565B1 (ko) 2006-09-21 2011-08-17 히다치 가세고교 가부시끼가이샤 광 도파로 기판 및 그것을 이용한 광전기 하이브리드 회로 실장 기판
US20090065053A1 (en) * 2007-08-24 2009-03-12 Julian Gulbinski Photovoltaic device
JP2010191365A (ja) * 2009-02-20 2010-09-02 Hitachi Ltd 光インターコネクション実装回路
KR101256000B1 (ko) * 2011-04-13 2013-04-18 엘지이노텍 주식회사 광 모듈용 인터포저 및 이를 이용한 광모듈, 인터포저의 제조방법
US9354410B2 (en) 2012-01-31 2016-05-31 Hewlett Packard Enterprise Development Lp Monolithically integrated, self-aligning, optical-fiber ferrule
TWI561881B (en) * 2012-04-27 2016-12-11 Hon Hai Prec Ind Co Ltd Fiber optical transceiver
CN103376516B (zh) * 2012-04-27 2016-07-06 鸿富锦精密工业（深圳）有限公司 光纤传输模组
TW201610495A (zh) * 2014-09-09 2016-03-16 鴻海精密工業股份有限公司 光耦合模組、光電轉換裝置以及光通訊裝置
CN109115250A (zh) * 2018-08-08 2019-01-01 珠海格力电器股份有限公司 感光器件的阵列结构和光电编码器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE10410T1 (de) * 1981-01-14 1984-12-15 Morton Nadler Verfahren und vorrichtung fuer die bildabtastung.
JPS6450557A (en) * 1987-08-21 1989-02-27 Fujitsu Ltd Infrared-ray detector array
JPS6450557U (zh) 1987-09-25 1989-03-29
JPH06991A (ja) * 1992-06-22 1994-01-11 Fuji Xerox Co Ltd レーザビームプリンタ
JP3306130B2 (ja) * 1992-11-17 2002-07-24 三洋電機株式会社 発光ダイオードアレイ装置
JP3143053B2 (ja) * 1995-10-31 2001-03-07 キヤノン株式会社 リニアイメージセンサ
JP2000022215A (ja) * 1998-07-07 2000-01-21 Oki Electric Ind Co Ltd Ｌｅｄアレイ
JP3920540B2 (ja) 2000-07-04 2007-05-30 三洋電機株式会社 空気調和装置
JP2002189137A (ja) * 2000-12-20 2002-07-05 Nippon Telegr & Teleph Corp <Ntt> 光配線基板
JP4574006B2 (ja) * 2000-12-26 2010-11-04 キヤノン株式会社 画像形成装置
JP2002280655A (ja) * 2001-01-10 2002-09-27 Ricoh Opt Ind Co Ltd 光出力装置および光出力装置用レンズ素子
JP2003222746A (ja) * 2002-01-29 2003-08-08 Mitsubishi Electric Corp 光電気結合装置
JP4038586B2 (ja) 2002-04-26 2008-01-30 高砂香料工業株式会社 粉末ゴマおよびその製造方法
JP4711322B2 (ja) * 2002-11-29 2011-06-29 ルネサスエレクトロニクス株式会社 Ｃｃｄイメージセンサ
JP2004212847A (ja) * 2003-01-08 2004-07-29 Fujitsu Ltd 光結合器

Also Published As

Publication number Publication date
WO2005117146A1 (ja) 2005-12-08
TWI316617B (zh) 2009-11-01
JP2005340545A (ja) 2005-12-08
US20070215790A1 (en) 2007-09-20
CN1998092A (zh) 2007-07-11
US7622700B2 (en) 2009-11-24
CN1998092B (zh) 2010-06-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees