TW200608069A - Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing device - Google Patents
Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing deviceInfo
- Publication number
- TW200608069A TW200608069A TW094116496A TW94116496A TW200608069A TW 200608069 A TW200608069 A TW 200608069A TW 094116496 A TW094116496 A TW 094116496A TW 94116496 A TW94116496 A TW 94116496A TW 200608069 A TW200608069 A TW 200608069A
- Authority
- TW
- Taiwan
- Prior art keywords
- photoelectric transducer
- transducer array
- array
- information processing
- photoelectric
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
- Light Receiving Elements (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004158496A JP2005340545A (ja) | 2004-05-28 | 2004-05-28 | 光電変換素子アレイ、その集積装置及びこれらの実装構造、並びに光情報処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200608069A true TW200608069A (en) | 2006-03-01 |
| TWI316617B TWI316617B (enExample) | 2009-11-01 |
Family
ID=35451165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094116496A TW200608069A (en) | 2004-05-28 | 2005-05-20 | Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7622700B2 (enExample) |
| JP (1) | JP2005340545A (enExample) |
| CN (1) | CN1998092B (enExample) |
| TW (1) | TW200608069A (enExample) |
| WO (1) | WO2005117146A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7991248B2 (en) | 2006-09-21 | 2011-08-02 | Hitachi Chemical Co., Ltd. | Optical waveguide substrate and substrate mounting photoelectric hybrid circuit |
| US20090065053A1 (en) * | 2007-08-24 | 2009-03-12 | Julian Gulbinski | Photovoltaic device |
| JP2010191365A (ja) * | 2009-02-20 | 2010-09-02 | Hitachi Ltd | 光インターコネクション実装回路 |
| KR101256000B1 (ko) * | 2011-04-13 | 2013-04-18 | 엘지이노텍 주식회사 | 광 모듈용 인터포저 및 이를 이용한 광모듈, 인터포저의 제조방법 |
| WO2013115782A1 (en) | 2012-01-31 | 2013-08-08 | Hewlett-Packard Development Company, L.P. | Monolithically integrated, self-aligning, optical-fiber ferrule |
| TWI561881B (en) * | 2012-04-27 | 2016-12-11 | Hon Hai Prec Ind Co Ltd | Fiber optical transceiver |
| CN103376516B (zh) * | 2012-04-27 | 2016-07-06 | 鸿富锦精密工业(深圳)有限公司 | 光纤传输模组 |
| TW201610495A (zh) * | 2014-09-09 | 2016-03-16 | 鴻海精密工業股份有限公司 | 光耦合模組、光電轉換裝置以及光通訊裝置 |
| CN109115250A (zh) * | 2018-08-08 | 2019-01-01 | 珠海格力电器股份有限公司 | 感光器件的阵列结构和光电编码器 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4471387A (en) * | 1981-01-14 | 1984-09-11 | Morton Nadler | Image scanning method and device |
| JPS6450557A (en) * | 1987-08-21 | 1989-02-27 | Fujitsu Ltd | Infrared-ray detector array |
| JPS6450557U (enExample) | 1987-09-25 | 1989-03-29 | ||
| JPH06991A (ja) * | 1992-06-22 | 1994-01-11 | Fuji Xerox Co Ltd | レーザビームプリンタ |
| JP3306130B2 (ja) * | 1992-11-17 | 2002-07-24 | 三洋電機株式会社 | 発光ダイオードアレイ装置 |
| JP3143053B2 (ja) * | 1995-10-31 | 2001-03-07 | キヤノン株式会社 | リニアイメージセンサ |
| JP2000022215A (ja) * | 1998-07-07 | 2000-01-21 | Oki Electric Ind Co Ltd | Ledアレイ |
| JP3920540B2 (ja) | 2000-07-04 | 2007-05-30 | 三洋電機株式会社 | 空気調和装置 |
| JP2002189137A (ja) * | 2000-12-20 | 2002-07-05 | Nippon Telegr & Teleph Corp <Ntt> | 光配線基板 |
| JP4574006B2 (ja) * | 2000-12-26 | 2010-11-04 | キヤノン株式会社 | 画像形成装置 |
| JP2002280655A (ja) * | 2001-01-10 | 2002-09-27 | Ricoh Opt Ind Co Ltd | 光出力装置および光出力装置用レンズ素子 |
| JP2003222746A (ja) * | 2002-01-29 | 2003-08-08 | Mitsubishi Electric Corp | 光電気結合装置 |
| JP4038586B2 (ja) | 2002-04-26 | 2008-01-30 | 高砂香料工業株式会社 | 粉末ゴマおよびその製造方法 |
| JP4711322B2 (ja) * | 2002-11-29 | 2011-06-29 | ルネサスエレクトロニクス株式会社 | Ccdイメージセンサ |
| JP2004212847A (ja) * | 2003-01-08 | 2004-07-29 | Fujitsu Ltd | 光結合器 |
-
2004
- 2004-05-28 JP JP2004158496A patent/JP2005340545A/ja active Pending
-
2005
- 2005-03-03 WO PCT/JP2005/004157 patent/WO2005117146A1/ja not_active Ceased
- 2005-03-03 CN CN200580023395.6A patent/CN1998092B/zh not_active Expired - Fee Related
- 2005-03-03 US US11/569,616 patent/US7622700B2/en not_active Expired - Lifetime
- 2005-05-20 TW TW094116496A patent/TW200608069A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI316617B (enExample) | 2009-11-01 |
| WO2005117146A1 (ja) | 2005-12-08 |
| JP2005340545A (ja) | 2005-12-08 |
| CN1998092A (zh) | 2007-07-11 |
| US20070215790A1 (en) | 2007-09-20 |
| US7622700B2 (en) | 2009-11-24 |
| CN1998092B (zh) | 2010-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2510404B1 (en) | Acoustic transducer assembly | |
| US6661943B2 (en) | Fiber-free optical interconnect system for chip-to-chip signaling | |
| JP3833132B2 (ja) | 光導波装置の製造方法 | |
| US7470069B1 (en) | Optoelectronic MCM package | |
| US5663739A (en) | Method and arrangement for establishing networks of electro-optical display-field modules | |
| JP2003279771A5 (enExample) | ||
| US8285087B2 (en) | Optical interconnection system using optical printed circuit board having one-unit optical waveguide integrated therein | |
| TW200746789A (en) | Surface-emission laser array, optical scanning apparatus and image forming apparatus | |
| WO2007008829A3 (en) | Drug delivery system | |
| TWI456306B (zh) | 折疊式光源模組及背光模組 | |
| TW200608069A (en) | Photoelectric transducer array, its accumulation apparatus and mounting structure, and optical information processing device | |
| CN102081205A (zh) | 光电复合配线模块及其制造方法 | |
| EP1150358A4 (en) | OPTICAL MODULE | |
| US20130182394A1 (en) | Electronic module packages and assemblies for electrical systems | |
| JP2003279770A5 (enExample) | ||
| JP2004069797A5 (enExample) | ||
| WO2003085738A3 (de) | Leistungsmodul mit zwei substraten und verfahren zu seiner herstellung | |
| AU7820900A (en) | Connection of an add/drop node | |
| JP2004061799A5 (enExample) | ||
| WO2007050429A3 (en) | Array interconnect for improved directivity | |
| US8200096B2 (en) | Optical transceiver | |
| JP2000101103A (ja) | 光インタコネクション装置 | |
| SE9804383L (sv) | Optisk mottagar- och sändarmodul | |
| KR20080049881A (ko) | 평판 디스플레이용 연성 광 접속 모듈 및 그 제조 방법 | |
| JP3075218B2 (ja) | 光インタコネクション用光導波路と光バック・ワイヤリング・ボード |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |