WO2005116775A1 - パターン形成方法及びカラーフィルタの製造方法、並びにカラーフィルタ及び液晶表示装置 - Google Patents
パターン形成方法及びカラーフィルタの製造方法、並びにカラーフィルタ及び液晶表示装置 Download PDFInfo
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- WO2005116775A1 WO2005116775A1 PCT/JP2005/009967 JP2005009967W WO2005116775A1 WO 2005116775 A1 WO2005116775 A1 WO 2005116775A1 JP 2005009967 W JP2005009967 W JP 2005009967W WO 2005116775 A1 WO2005116775 A1 WO 2005116775A1
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- Prior art keywords
- light
- photosensitive layer
- pattern forming
- pigment
- pattern
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
Definitions
- the present invention relates to a pattern forming method in which light modulated by a light modulating means such as a spatial light modulating element is imaged on a pattern forming material and the pattern forming material is exposed, and a color filter manufacturing method.
- a color filter and a color filter suitable for a liquid crystal display device such as a portable terminal, a portable game machine, a notebook computer, and a television monitor, a PALC (plasma address liquid crystal), a plasma display, and the like.
- the present invention relates to a liquid crystal display device using a filter.
- a light modulating unit having n picture elements that receive and emit light from a light irradiating unit using a laser beam as a light source.
- a spatial light modulator that modulates according to a signal, an enlarged imaging optical system for enlarging an image formed by the light modulated by the spatial light modulator, and a space arranged on an image plane formed by the enlarged optical system.
- a microlens array having microlenses in an array corresponding to each of the picture element portions of the light modulation element, and an imaging optical system for imaging light passing through the microlens array on a pattern forming material or a screen.
- a laser beam such as a semiconductor laser or a gas laser without using a photomask is directly scanned on the photosensitive composition based on digital data such as a pixel pattern.
- Exposure apparatuses using a laser direct imaging system (hereinafter, sometimes referred to as “LDI”) for performing puttering have been studied (for example, see Non-Patent Document 1).
- Patent Document 2 Japanese Patent Application Laid-Open No. 2001-305663
- Patent Document 4 U.S. Pat.No. 2,850,445
- Non-Patent Document 1 Akihito Ishikawa, "Reduction of Development and Application to Mass Production by Maskless Exposure”, “Electro-Tox Packaging Technology”, Technical Research Group Inc., Vol.18, No.6, 2002, p.74- 79
- a pattern forming method capable of forming a predetermined pattern on the photosensitive composition with high resolution, and by simultaneously irradiating a plurality of beams without using a photomask For liquid crystal display (LCD) such as portable terminals, portable game machines, notebook computers, TV monitors, etc., which can reduce unevenness (edge roughness) with respect to lines, can be formed with high definition, is low cost, and has excellent display characteristics. It is an object of the present invention to provide a color filter suitably used for a plasma addressed liquid crystal (PALC), a plasma display, and the like, and a liquid crystal display device using the color filter.
- PLC plasma addressed liquid crystal
- ⁇ 1> at least a photosensitive layer forming step of forming a photosensitive layer on the surface of a substrate using a photosensitive composition containing at least a binder, a polymerizable compound, and a photopolymerization initiator;
- light modulating means having n picture elements for receiving and emitting light (where n is a natural number of 2 or more)
- n is a natural number of 2 or more
- a developing step of developing the photosensitive layer exposed in the exposing step is a developing step of developing the photosensitive layer exposed in the exposing step.
- n is a natural number of 2 or more
- a developing step of developing the photosensitive layer exposed in the exposing step is a developing step of developing the photosensitive layer exposed in the exposing step.
- the oxygen-poor atmosphere is the pattern forming method according to any one of ⁇ 1> to ⁇ 2>, wherein the oxygen concentration is 1% or less.
- ⁇ 5> The method according to any one of ⁇ 1> to ⁇ 2>, wherein the oxygen-deficient atmosphere is formed by forming an oxygen blocking layer on the surface of the photosensitive layer such that the photosensitive layer is on the substrate side. This is the pattern formation method.
- oxygen barrier layer the oxygen permeability of a patterning method according to 50 C m 3 / (m 2 'day pressure) or less is the ⁇ 5>.
- Oxygen blocking layer strength The pattern forming method according to any one of ⁇ 5> to ⁇ 6>, including polyvinyl alcohol and polyvinylpyrrolidone.
- ⁇ 8> The pattern forming method according to any one of ⁇ 5> to ⁇ 7>, wherein the oxygen barrier layer is soluble in an aqueous solution.
- ⁇ 9> The pattern formation method according to any one of ⁇ 2> to ⁇ 8>, wherein the microlens force has an aspheric surface capable of correcting aberration due to distortion of an emission surface in the pixel portion.
- ⁇ 11> The pattern forming method according to any one of ⁇ 2> to ⁇ 10>, wherein the lens opening shape is circular.
- ⁇ 12> The pattern forming method according to any one of ⁇ 2> to ⁇ 11>, which is defined by providing a light-shielding portion on the lens surface.
- ⁇ 14> The pattern forming method according to any one of ⁇ 1> to ⁇ 13>, wherein the light modulating means is a spatial light modulating element.
- ⁇ 15> The pattern forming method according to ⁇ 14>, wherein the spatial light modulator is a digital 'micromirror' device (DMD).
- DMD digital 'micromirror' device
- ⁇ 16> The method according to ⁇ 1>, wherein the exposure is performed through an aperture array. It is a pattern forming method described in any of them.
- ⁇ 17> The pattern forming method according to any one of ⁇ 1> to ⁇ 16>, wherein the exposure is performed while relatively moving the exposure light and the photosensitive layer.
- ⁇ 18> The pattern forming method according to any one of ⁇ 1> to ⁇ 17>, wherein the light irradiation unit is capable of combining and irradiating two or more lights.
- the light irradiating means includes a plurality of lasers, a multi-mode optical fiber, and a collective optical system for condensing each of the plurality of laser beams irradiated and coupling the laser beam to the multi-mode optical fiber.
- the pattern forming method according to any one of ⁇ 1> to ⁇ 18> above.
- ⁇ 21> The pattern formation method according to any one of ⁇ 1> to ⁇ 20>, wherein the photosensitive layer is formed by applying the photosensitive composition to the surface of a substrate and drying the photosensitive composition.
- the photosensitive layer is formed by laminating a photosensitive film obtained by laminating a photosensitive composition on a support, and laminating the substrate so that the photosensitive layer and the substrate are in contact with each other. ⁇ 1> to ⁇ 21>!
- a photosensitive film in which a photosensitive composition is laminated on a support is laminated on the substrate so that the photosensitive layer and the substrate are in contact with each other, and then the support is peeled off. 22>.
- ⁇ 25> The pattern forming method according to ⁇ 24>, wherein the curing treatment is at least one of a whole-surface exposure treatment and a whole-surface heat treatment performed at 120 to 200 ° C.
- the light from the light irradiating unit is received by the light modulating unit having n picture elements for receiving and emitting the light (where n is a natural number of 2 or more).
- ⁇ 31> The method for producing a color filter according to any one of ⁇ 29> to ⁇ 30>, wherein the oxygen-deficient atmosphere is an inert gas atmosphere.
- ⁇ 32> The method for producing a color filter according to ⁇ 29>, wherein the oxygen-deficient atmosphere is formed by forming an oxygen barrier layer on the surface of the photosensitive layer such that the photosensitive layer is on the substrate side.
- the oxygen permeability of the oxygen barrier layer is a 50 C m 3 / (m 2 'day pressure) or less is the method for producing a color filter according to the rather 32>.
- ⁇ 34> The method for producing a color filter described in ⁇ 32>, wherein the oxygen barrier layer contains polyvinyl alcohol and polyvinylpyrrolidone.
- ⁇ 35> The method for producing a color filter according to any one of ⁇ 32> to ⁇ 34>, wherein the oxygen barrier layer is soluble in an aqueous solution.
- ⁇ 36> The method for producing a color filter according to any one of ⁇ 29> to ⁇ 35>, wherein the photosensitive layer has a thickness of 0.4 to 10111.
- ⁇ 37> The method for producing a color filter according to any one of ⁇ 29> to ⁇ 36>, wherein the photosensitive composition is colored at least black (K).
- ⁇ 38> At least, using a light-sensitive composition colored in the three primary colors of red (R), green (G), and blue (B), in a predetermined arrangement on the surface of the substrate, R, G and For each color of B, The method for producing a color filter according to any one of ⁇ 29> to ⁇ 37>, wherein a color filter is formed by repeating a photosensitive layer forming step, an exposing step, and a developing step.
- ⁇ 39> At least one of CI Pigment Red 254 and CI Pigment Green 36 and CI Pigment Yellow 139, respectively, for red (R) coloring and green (G) coloring, and 38.
- ⁇ 42> A liquid crystal display device using the color filter according to ⁇ 41>.
- the pattern forming method of the present invention includes at least a photosensitive layer forming step, an exposing step, and a developing step.
- the photosensitive layer forming step is a step of forming at least a photosensitive layer on the surface of a substrate using a photosensitive composition containing a binder, a polymerizable compound, and a photopolymerization initiator.
- the light irradiating means modulates the light by the light modulating means having n picture elements (where n is a natural number of 2 or more) for receiving and emitting light from the light irradiating means.
- the developing step is a step of developing the photosensitive layer exposed in the exposing step.
- the method for producing a color filter of the present invention includes at least a photosensitive layer forming step, an exposing step, and a developing step.
- the photosensitive layer forming step is a step of forming at least a photosensitive layer on the surface of a substrate using a photosensitive composition containing at least a binder, a polymerizable compound, a colorant, and a photopolymerization initiator.
- the exposing step the light from the light irradiating unit is modulated by a light modulating unit having n pixel portions (where n is a natural number of 2 or more) that receives and emits light from the light irradiating unit. This is a step of exposing the photosensitive layer to light under an oxygen-deficient atmosphere.
- the developing step is a step of developing the photosensitive layer exposed in the exposing step.
- LCD liquid crystal displays
- PALC plasma address liquid crystal
- a conventional problem can be solved, and a fine pattern can be formed with high definition by suppressing distortion of an image formed on a pattern forming material.
- productivity in pattern formation can be improved, and a predetermined pattern can be formed on the photosensitive composition at high resolution.
- By simultaneously irradiating a plurality of beams without using a photomask it is possible to reduce unevenness (edge roughness) with respect to the center line, and to develop a color filter that can be formed with high definition.
- Manufacturing method low cost, excellent display characteristics, for liquid crystal display (LCD) such as portable terminals, portable game machines, notebook computers, TV monitors, etc.
- a color filter suitably used for a plasma display, and a liquid crystal display device using the color filter.
- FIG. 1 is an example of a partially enlarged view showing a configuration of a digital micromirror device (DMD).
- FIG. 2A is an example of an explanatory diagram for explaining the operation of a DMD.
- FIG. 3A is an example of a plan view showing a comparison of the arrangement of exposure beams and scanning lines when a DMD is not arranged in an inclined manner and when a DMD is arranged in an inclined manner.
- FIG. 3B is an example of a plan view showing a comparison between the arrangement of exposure beams and scanning lines in the case where the same DMD as in FIG.
- FIG. 4A is an example of a diagram showing an example of a DMD use area.
- FIG. 6A is an example of a plan view for explaining an exposure method for exposing a pattern forming material by a plurality of scans by a scanner.
- FIG. 6B is an example of a plan view for explaining an exposure method for exposing the pattern forming material by a plurality of scans by the same scanner as in FIG. 6A.
- FIG. 7 is an example of a schematic perspective view showing an appearance of an example of a pattern forming apparatus.
- FIG. 8 is an example of a schematic perspective view showing a configuration of a scanner of the pattern forming apparatus.
- FIG. 9A is an example of a plan view showing an exposed area formed on a pattern forming material.
- FIG. 9B is an example of a diagram showing an arrangement of exposure areas by each exposure head.
- FIG. 10 is an example of a perspective view showing a schematic configuration of an exposure head including a light modulation unit.
- FIG. 11 is an example of a cross-sectional view in the sub-scanning direction along the optical axis showing the configuration of the exposure head shown in FIG.
- FIG. 12 is an example of a controller that controls DMD based on pattern information.
- FIG. 13A is an example of a cross-sectional view along an optical axis showing a configuration of another exposure head having a different coupling optical system.
- FIG. 13B is an example of a plan view showing a light image projected on a surface to be exposed when a microlens array or the like is not used.
- FIG. 13C is an example of a plan view showing a light image projected on a surface to be exposed when a microlens array or the like is used.
- FIG. 14 is an example of a diagram showing, by contour lines, distortion of a reflecting surface of a micro mirror constituting a DMD.
- FIG. 15A is an example of a graph showing distortion of a reflecting surface of the micromirror in two diagonal directions of the mirror.
- FIG. 15B is an example of a graph showing the same distortion of the reflecting surface of the micro mirror as in FIG. 15A in two diagonal directions of the mirror.
- FIG. 16A is an example of a front view of a microlens array used in a pattern forming apparatus.
- FIG. 16B is an example of a side view of the microlens array used in the pattern forming apparatus.
- FIG. 17A is an example of a front view of microlenses constituting a microlens array.
- FIG. 17B is an example of a side view of a micro lens constituting a micro lens array.
- FIG. 18A is an example of a schematic diagram showing a light condensing state by a microlens in one section.
- FIG. 18B is an example of a schematic diagram showing a light condensing state by a microlens in one section.
- FIG. 19A is an example of a diagram showing a result of simulating a beam diameter near a condensing position of a microlens of the present invention.
- FIG. 19B is an example of a diagram showing the same simulation result as FIG. 19B at another position.
- FIG. 19C is an example of a diagram showing a simulation result similar to FIG. 19A at another position.
- FIG. 19D is an example of a diagram showing the same simulation result as FIG. 19A at another position.
- FIG. 20A is an example of a diagram showing a result of simulating a beam diameter near a condensing position of a microlens in a conventional pattern forming method.
- FIG. 20B is an example of a view showing the same simulation result as FIG. 20A at another position.
- FIG. 20C is an example of a view showing the same simulation result as FIG. 20A at another position.
- FIG. 20D is an example of a diagram showing the same simulation result as FIG. 20A at another position.
- FIG. 21 is an example of a plan view showing another configuration of the multiplexed laser light source.
- FIG. 22A is an example of a front view of microlenses constituting a microlens array.
- FIG. 22B is an example of a side view of a micro lens constituting a micro lens array.
- FIG. 23A is an example of a schematic diagram showing the state of light condensing by the microlenses of FIGS. 22A and 22B in one cross section.
- FIG. 23B is an example of a schematic diagram showing an example of a cross section different from the example of FIG. 23A.
- FIG. 24A is an example of an explanatory diagram showing the concept of correction by a light amount distribution correction optical system.
- FIG. 24B is an example of an explanatory diagram showing the concept of correction by the light amount distribution correction optical system.
- FIG. 24C is an example of an explanatory diagram illustrating the concept of correction by the light amount distribution correction optical system.
- FIG. 25 is an example of a graph showing a light quantity distribution when the light irradiation means has a Gaussian distribution and does not correct the light quantity distribution.
- FIG. 26 is an example of a graph showing a light quantity distribution after correction by a light quantity distribution correction optical system.
- FIG. 27A is a perspective view showing a configuration of a fiber array light source.
- FIG. 27A (B) is an example of a partially enlarged view of FIG. 27 (A), and
- FIG. 27A (C) and FIG. () Is an example of a plan view showing an arrangement of light emitting points in the laser emitting section.
- FIG. 27B is an example of a front view showing an arrangement of light emitting points in a laser emitting section of the fiber array light source.
- FIG. 28 is an example of a diagram showing a configuration of a multimode optical fiber.
- FIG. 29 is an example of a plan view showing a configuration of a multiplexed laser light source.
- FIG. 30 is an example of a plan view showing a configuration of a laser module.
- FIG. 31 is an example of a side view showing a configuration of the laser module shown in FIG. 30.
- FIG. 32 is a partial side view showing the configuration of the laser module shown in FIG. 30.
- FIG. 33 is an example of a perspective view showing a configuration of a laser array.
- FIG. 34A is an example of a perspective view showing a configuration of a multi-cavity laser.
- FIG. 34B is an example of a perspective view of a multi-cavity laser ray in which the multi-cavity lasers shown in FIG. 34A are arranged in an array.
- FIG. 35 is an example of a plan view showing another configuration of the multiplexed laser light source.
- FIG. 36A is an example of a plan view showing another configuration of the multiplexed laser light source.
- FIG. 36B is an example of a cross-sectional view along the optical axis of FIG. 36A.
- FIG. 37A shows the depth of focus of a conventional exposure apparatus and the pattern forming method of the present invention.
- FIG. 4 is an example of a cross-sectional view along an optical axis showing a difference from a depth of focus by a (pattern forming apparatus).
- FIG. 37B is an example of a cross-sectional view along the optical axis showing a difference between the depth of focus of the conventional exposure apparatus and the depth of focus of the pattern forming method (pattern forming apparatus) of the present invention.
- FIG. 38A is a front view showing another example of the microlenses forming the macroarray.
- FIG. 38B is a side view showing another example of the microlenses forming the macroarray.
- FIG. 39A is an example of a front view of a micro lens constituting a macro array.
- FIG. 39B is an example of a side view of a micro lens forming a macro array.
- FIG. 40 is a graph showing an example of a spherical lens shape.
- FIG. 41 is a graph showing another example of the lens surface shape.
- FIG. 42 is a perspective view showing another example of the microlens array.
- FIG. 43 is a plan view showing another example of the microlens array.
- FIG. 44 is a plan view showing another example of the microlens array.
- FIG. 45A is a longitudinal sectional view showing another example of the microlens array.
- FIG. 45B is a longitudinal sectional view showing another example of the microlens array.
- FIG. 45C is a longitudinal sectional view showing another example of the microlens array. BEST MODE FOR CARRYING OUT THE INVENTION
- the pattern forming method of the present invention includes at least a photosensitive layer forming step, an exposing step, and a developing step, and further includes other steps appropriately selected.
- the pattern forming method of the present invention includes at least the above-described steps and is not particularly limited in its use and the like as long as it is a pattern forming method for forming a predetermined pattern. It is preferable to form a permanent pattern after the development step.
- the second form of the pattern formation method at least a photosensitive layer is formed on the surface of the base material so that the surface of the base material can be used as a photoresist layer for circuit formation used as a mask pattern when patterning a wiring pattern.
- the pattern forming method of the present invention includes a pattern of the solder resist and the wiring pattern formed on the substrate, a pattern of pixels of the color filter formed by the color resist layer, and the like.
- the permanent pattern formed after the development step is a method of forming at least one of a protective film and an interlayer insulating film.
- the photosensitive layer forming step at least a photosensitive layer is formed on the surface of the substrate using a photosensitive composition containing a binder, a polymerizable compound, and a photopolymerization initiator, and further, other appropriately selected layers are formed. This is the step of forming.
- the method for forming the photosensitive layer and other layers can be appropriately selected depending on the purpose without particular limitation.
- a method of forming by laminating by performing at least one of heating, a combination thereof, and the like can be given.
- a photosensitive layer forming step according to a first embodiment and a photosensitive layer forming step according to a second embodiment described below are preferably exemplified.
- the photosensitive composition is applied to the surface of a substrate.
- Drying at least forming a photosensitive layer on the surface of the base material, and further forming another layer appropriately selected.
- a photosensitive film (sometimes referred to as a "dry film resist") obtained by forming the photosensitive composition into a film is heated on the surface of a substrate, and By laminating under at least one of pressures, a step of forming at least a photosensitive layer on the surface of the base material and further forming other layers appropriately selected may be mentioned.
- the method of coating and drying can be appropriately selected depending on the purpose without particular limitation.
- the photosensitive composition is prepared by dissolving, emulsifying, or dispersing the photosensitive composition in water or a solvent to prepare a photosensitive composition solution, directly applying the solution, and then drying to laminate.
- the solvent of the photosensitive composition solution is not particularly limited and may be appropriately selected depending on the purpose. can do.
- the drying conditions vary depending on each component, the type of solvent, the proportion used, and the like, but are usually at a temperature of 60 to 110 ° C. for about 30 seconds to 15 minutes.
- the thickness of the photosensitive layer can be appropriately selected depending on the particular purpose.
- the thickness of the photosensitive layer as the photo solder resist layer is 1 to 15 O / zm. Power preferred, 5 ⁇ : more preferred than LOO / zm power, 10 ⁇ 80m power ⁇ especially preferred! / ⁇ .
- the thickness of the photosensitive layer as the photoresist layer for forming a circuit is preferably from 0.5 to: LOO / zm, more preferably from 1 to 50111, and particularly preferably from 2 to LO / zm.
- the other layers formed in the photosensitive layer forming step of the first embodiment can be appropriately selected depending on the purpose without particular limitation. Examples thereof include a cushion layer, an oxygen barrier layer, a release layer, and an adhesive layer. Layer, light absorbing layer, surface protective layer and the like.
- the method for forming the other layers can be appropriately selected depending on the purpose without particular limitation. For example, a method of coating on the photosensitive layer, a method of laminating other layers formed in a sheet shape, and the like. And the like.
- a method for forming a photosensitive layer on a surface of a substrate and other layers appropriately selected as necessary includes a method of forming a support on a surface of the substrate. And a photosensitive film having a photosensitive composition obtained by laminating a photosensitive composition on the support, and other layers appropriately selected as necessary, while laminating at least one of heating and pressing.
- a light-sensitive film formed by laminating a photosensitive composition on a support is laminated such that the photosensitive composition is on the surface side of the substrate, and then the support is photosensitive.
- a method of peeling off from the composition is preferably exemplified.
- the protective film may be used. It is preferable that the film is peeled off and laminated so that the photosensitive layer overlaps the substrate.
- the heating temperature is not particularly limited and can be appropriately selected depending on the intended purpose. For example, 70 to 130 ° C is preferred, and 80 to 110 ° C is more preferred.
- the pressure for the pressurization is not particularly limited, and can be appropriately selected according to the purpose.
- ⁇ Sequence; t is preferably 0.01 to: L OMPa force, and 0.05 to: L OMPa force ⁇ More preferred! / ⁇ .
- the apparatus for performing at least one of the heating and the pressurization can be appropriately selected depending on the intended purpose without limitation.
- a heat press for example, Taisei Laminator Co., Ltd.
- VP-II manufactured by Hitachi Industries, Ltd., Lamicll type
- a vacuum laminator eg, MVLP500, manufactured by Meiki Seisakusho.
- the support is not particularly limited and may be appropriately selected depending on the intended purpose. However, it is preferable that the photosensitive layer can be peeled off and the light transmittance is favorable. More preferably, the smoothness of the surface is good.
- the thickness of the support is not particularly limited and may be appropriately selected depending on the purpose.
- the f row; t is a force of 4 to 300 ⁇ m; 10 ⁇ : LOO ⁇ m force S Ushidera preferred.
- the shape of the support is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably long.
- the length of the long support is not particularly limited. For example, a length of 10 m to 20,000 m is exemplified.
- the support is preferably made of a synthetic resin and is transparent.
- a synthetic resin for example, polyethylene terephthalate, polyethylene naphthalate, polypropylene, polyethylene, cellulose triacetate, cellulose diacetate, poly (meth) acryl Acid alkyl ester, poly (meth) acrylate ester copolymer, polychlorinated vinyl, polybutyl alcohol, polycarbonate, polystyrene, cellophane, polychlorinated bilidene copolymer, polyamide, polyimide, chlorinated vinyl and
- plastic films such as a vinyl acetate copolymer, polytetrafluoroethylene, polytrifluoroethylene, a cellulose-based film, and a nylon film are exemplified.
- polyethylene terephthalate is particularly preferred. These may be used alone or in combination of two or more.
- the support for example, the supports described in JP-A-4-208940, JP-A-5-80503, JP-A-5-173320, JP-A-5-72724, and the like are used. I can do it.
- the formation of the photosensitive layer in the photosensitive film can be performed by the same method as the method of applying and drying the solution of the photosensitive composition on the substrate (the method of forming the photosensitive layer in the first embodiment).
- Examples thereof include a method of applying the photosensitive composition solution using a spin coater, a slit spin coater, a roll coater, a die coater, a curtain coater, or the like.
- the protective film is a film having a function of preventing and protecting the photosensitive layer from being stained or damaged.
- the thickness of the protective film is not particularly limited and can be appropriately selected depending on the purpose. For example, 5 to: LOO ⁇ m force S is preferable, and 8 to 50 ⁇ m force S is more preferable. Particularly preferred is 10 to 40 ⁇ m.
- the location of the protective film provided in the photosensitive film is not particularly limited and may be appropriately selected depending on the intended purpose. Usually, the location is provided on the photosensitive layer.
- the relationship between the adhesive strength A between the photosensitive layer and the support and the adhesive strength B between the photosensitive layer and the protective film is such that adhesive strength A> adhesive strength B. It is suitable.
- the coefficient of static friction between the support and the protective film is preferably from 0.3 to 1.4, more preferably from 0.5 to 1.2 force! / ⁇ .
- the coefficient of static friction is less than 0.3, slippage may occur when formed into a roll due to excessive slipping. If the coefficient of static friction is more than 1.4, it is difficult to wind a good roll. Sometimes.
- the protective film can be appropriately selected in accordance with the purpose to which there is no particular limitation.
- those used for the support silicone paper, polyethylene, polypropylene laminated paper, polyolefin or And polytetrafluoroethylene sheets.
- polyethylene films and polypropylene films are particularly preferred. It is mentioned as good.
- Examples of the combination of the support and the protective film include polyethylene terephthalate z polypropylene, polyethylene terephthalate z polyethylene, polychlorinated vinyl z cellophane, polyimide z polypropylene, polyethylene terephthalate z polyethylene terephthalate And the like.
- the protective film is preferably subjected to a surface treatment in order to adjust the adhesiveness between the protective film and the photosensitive layer in order to satisfy the above-described relationship of the adhesive force.
- the surface treatment method of the support can be appropriately selected depending on the purpose to which there is no particular limitation. For example, application of an undercoat layer, corona discharge treatment, flame treatment, ultraviolet irradiation treatment, high-frequency irradiation treatment, Glow discharge irradiation treatment, active plasma irradiation treatment, laser beam irradiation treatment, and the like.
- the other layer can be appropriately selected depending on the purpose, for which there is no particular limitation.
- examples thereof include a cushion layer, a release layer, an adhesive layer, a light absorption layer, and a surface protection layer.
- the cushion layer is a layer that softens and flows when laminated under at least one of vacuum and heating conditions where tackiness is not present at normal temperature.
- the structure of the photosensitive film can be appropriately selected depending on the particular purpose, for example, and includes, for example, the photosensitive layer and the protective film on the support in this order. And a form in which the cushion layer, the photosensitive layer, and the protective film are provided on the support in this order.
- the photosensitive layer may be a single layer or a plurality of layers.
- the photosensitive film be wound around a cylindrical core and wound into a long roll, for example, and stored.
- the length of the long photosensitive film is not particularly limited. For example, a force in a range of 10 m to 20, OOO m can be appropriately selected.
- a slit may be formed to make it easy for the user to use, and a long body in the range of 100m to l, OOOm may be rolled.
- the support is wound so that the support is located on the outermost side.
- the roll-shaped photosensitive film may be slit into a sheet. From the viewpoint of protection of the end face and prevention of edge fusion during storage, it is preferable to install a separator (particularly, a moisture-proof one and a desiccant-containing one) on the end face. It is preferable to use.
- the photosensitive film has a uniform thickness, lamination on the base material is performed more finely when a permanent pattern is formed.
- binder having a carboxyl group examples include a vinyl copolymer having a carboxyl group, a polyurethane resin, a polyamide acid resin, a modified epoxy resin, and the like.
- solubility in a coating solvent Perspectives such as solubility in an alkali developer, suitability for synthesis, and ease of preparation of film properties, etc.
- a vinyl copolymer having a carboxyl group is preferred.
- the vinyl copolymer having a carboxyl group can be obtained by copolymerizing at least (1) a vinyl monomer having a carboxyl group, and (2) a monomer copolymerizable therewith.
- maleic anhydride In addition, maleic anhydride, itaconic anhydride, citraconic anhydride A monomer having an anhydride such as an acid may be used.
- the other copolymerizable monomer is a force that can be appropriately selected depending on the purpose to which there is no particular limitation.
- Examples of the (meth) acrylates include methyl (meth) acrylate and ethyl.
- crotonates examples include butyl crotonate and hexyl crotonate.
- maleic acid diesters examples include dimethyl maleate, diethyl methyl maleate, dibutyl maleate and the like.
- Examples of the method for synthesizing the vinyl monomer having a functional group include an addition reaction between an isocyanate group and a hydroxyl group or an amino group. Specifically, a monomer having an isocyanate group and a hydroxyl group Addition reaction with a compound having one or one compound having one primary or secondary amino group, addition reaction between a monomer having a hydroxyl group or a monomer having a primary or secondary amino group and a monoisocyanate Is mentioned.
- Examples of the monomer having an isocyanate group include compounds represented by the following structural formulas (1) to (3).
- R 1 represents a hydrogen atom or a methyl group.
- Examples of the monoisocyanate include cyclohexynoleisocyanate, n-butynoleisocyanate, tolyl isocyanate, benzyl isocyanate, and phenyl isocyanate.
- Examples of the monomer having a hydroxyl group include compounds represented by the following structural formulas (4) to (12).
- R represents a hydrogen atom or a methyl group
- n represents an integer of 1 or more.
- Examples of the compound having one hydroxyl group include alcohols (for example, methanol, ethanol, n -propanol, i-propanol, n-butanol, sec-butanol, t-butanol, and n-hexanol).
- alcohols for example, methanol, ethanol, n -propanol, i-propanol, n-butanol, sec-butanol, t-butanol, and n-hexanol).
- Examples of the monomer having a primary or secondary amino group include vinylbenzylamine and the like.
- Examples of the compound containing one primary or secondary amino group include, for example, alkylamines (methylamine, ethylamine, n-propylamine, i-propylamine, n-butylamine, sec-butylamine, t-butylamine, hexylamine, 2 —Ethylhexylamine, decylamine, dodecylamine, octadecylamine, dimethylamine, getylamine, dibutylamine, dioctylamine, cyclic alkylamine (cyclopentylamine, cyclohexylamine, etc.), aralkylamine (benzylamine, phenethylamine, etc.), arylamine A-lin, tolylamine, xylylamine, naphthylamine, etc.) Combinations (eg, N-methyl-N benzylamine), and amines having a substituent (eg, trifluoro
- Examples of the other copolymerizable monomers other than the above include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, and benzyl (meth) acrylate. And 2-ethylhexyl (meth) acrylate, styrene, chlorostyrene, bromostyrene, and hydroxystyrene.
- the other copolymerizable monomers may be used alone or in combination of two or more.
- the vinyl copolymer can be prepared by copolymerizing the corresponding monomers by a known method according to a conventional method. For example, it can be prepared by dissolving the monomer in an appropriate solvent, adding a radical polymerization initiator thereto and polymerizing in a solution (solution polymerization method). Further, it can be prepared by utilizing polymerization by so-called emulsion polymerization or the like in a state where the monomers are dispersed in an aqueous medium.
- a suitable solvent used in the solution polymerization method can be appropriately selected depending on, for example, a monomer to be used without limitation, and solubility of a copolymer to be produced.
- the solvent include methanol and ethanol.
- Propanol, isopropanol, 1-methoxy 2-propanol, acetone, methylethyl ketone, methyl isobutyl ketone, methoxypropyl acetate, ethyl lactate, ethyl acetate, acetonitrile, tetrahydrofuran, dimethylformamide, methylformate, Toluene and the like can be mentioned.
- These solvents may be used alone or in combination of two or more.
- the radical polymerization initiator is not particularly limited.
- 2,2'-azobis isobuty-tolyl) (AIBN)
- Peracids such as benzoyl peroxide
- persulfates such as potassium persulfate and ammonium persulfate.
- the content of the polymerizable compound having a carboxyl group in the vinyl copolymer is not particularly limited and may be appropriately selected depending on the purpose. Mole 0/0 preferably fixture 10 to 40 mole 0/0, more preferably tool 15-35 mole 0/0 are particularly preferred. When the content is less than 5 mol%, developability in alkaline water may be insufficient.
- the developer resistance of the cured portion (image portion) may be insufficient.
- the molecular weight of the binder having a carboxyl group is not particularly limited, and can be appropriately selected depending on the purpose.
- the weight average molecular weight is 2,000 to
- the weight-average molecular weight is less than 2,000, the strength of the film may be insufficient and stable production may be difficult immediately.If it exceeds 300,000, the developability may be reduced. You.
- the above-mentioned carboxyl group-containing binder may be used alone or in combination of two or more.
- two or more binders are used in combination, for example, two or more binders having different copolymer component strengths, two or more binders having different weight average molecular weights, two or more binders having different dispersities, etc. Combinations.
- the binder having a carboxyl group may be partially or entirely neutralized with a basic substance.
- resins having different structures such as polyester resin, polyamide resin, polyurethane resin, epoxy resin, polyvinyl alcohol, and gelatin may be used in combination.
- a resin soluble in an aqueous alkaline solution described in Japanese Patent No. 2873889 or the like can be used.
- the content of the binder in the photosensitive layer is not particularly limited, and can be appropriately selected depending on the purpose. For example, 5 to 80% by mass is preferable, and 10 to 70% by mass is preferable. Masu 15 to 50% by mass is particularly preferred.
- the alkali developability and the printed wiring board forming substrate
- the adhesiveness may be reduced, and if it exceeds 80% by mass, the stability with respect to the development time and the strength of the cured film (tent film) may be reduced.
- the content may be the total content of the binder and the polymer binder used in combination as necessary.
- the acid value of the binder is not particularly limited and may be appropriately selected depending on the purpose.
- Force for example can preferably 70 ⁇ 250mgKOHZg force s, preferably Ri by 90 ⁇ 200mgKOHZg force s, 100 ⁇ 180mgKOH / g is particularly preferred.
- the acid value is less than 70 mgKOHZg, developability may be insufficient or resolution may be poor, and a permanent pattern such as a wiring pattern may not be obtained with high definition.
- it exceeds 25 OmgKOHZg at least the developer resistance and the adhesion of the pattern may be poorly displaced, and a permanent pattern such as a wiring pattern may not be obtained with high definition.
- the above-mentioned binder can be appropriately selected depending on the purpose to which there is no particular limitation.
- JP-A-51-131706, JP-A-52-94388, JP-A-64H5 Epoxy phthalate toys having an acidic group described in JP-A-2-97513, JP-A-3-289656, JP-A-61-243869, JP-A-2002-296776, and the like.
- the molecular weight of the epoxy conjugate is preferably from 1,000 to 200,000, and more preferably from 2,000 to 100,000. If the molecular weight is less than 1,000, the tackiness of the surface of the photosensitive layer may be increased, and the film quality may become brittle or the surface hardness may deteriorate after the photosensitive layer is cured as described below. Yes, if it exceeds 200,000, developability may be degraded.
- an acrylic resin having at least one polymerizable group such as an acidic group and a double bond described in JP-A-6-295060 can also be used.
- at least one polymerizable double bond in the molecule for example, an acrylic group such as a (meth) acrylate ester or a (meth) atalylamido group, a carboxylic ester, a butyl ester, a butyl ether, or an aryl ester.
- various polymerizable double bonds for example, an acrylic group such as a (meth) acrylate ester or a (meth) atalylamido group, a carboxylic ester, a butyl ester, a butyl ether, or an aryl ester.
- acrylic acid containing a carboxyl group as an acidic group may be added to glycidyl esters of unsaturated fatty acids such as glycidyl atalylate, glycidyl methacrylate, cinnamic acid, or epoxy such as cyclohexenoxide in the same molecule.
- unsaturated fatty acids such as glycidyl atalylate, glycidyl methacrylate, cinnamic acid, or epoxy such as cyclohexenoxide in the same molecule.
- Such as compounds having a group and a (meth) atalyloyl group examples include compounds obtained by adding a group-containing polymerizable compound.
- reaction product of hydroxyalkyl acrylate or hydroxyalkyl methacrylate described in JP-A-50-59315 with any of polycarboxylic anhydride and epihalohydrin can be used.
- a compound obtained by adding an acid anhydride to an epoxy atalylate having a fluorene skeleton described in JP-A-5-70528 and a polyamide (imide) compound described in JP-A-11-288087 can be used.
- Fatty acid, amide or styrene derivative containing amide group and acid anhydride copolymer described in JP-A-2-097502 and JP-A-2003-20310, polyimide precursor described in JP-A-11-282155 Etc. can be used. These may be used singly or as a mixture of two or more.
- the molecular weight of the binder such as the acrylic resin, the epoxy acrylate having a fluorene skeleton, the polyamide (imide), the styrene-Z-anhydride copolymer having an amide group, or the polyimide precursor, 000 ⁇ 500,000 force S preferred ⁇ , 5,000 ⁇ 100,000 force S preferred.
- the molecular weight is less than 3,000, the tackiness of the photosensitive layer surface may be increased, and after curing of the photosensitive layer described later, the film quality may become brittle, or the surface hardness may be deteriorated, If it exceeds 500,000, developability may deteriorate.
- the solid content of the binder in the photosensitive composition solid content is preferably 5 to 80% by mass, more preferably 10 to 70% by mass. If the solid content is less than 5% by mass, the film strength of the photosensitive layer may be weakened or the tackiness of the surface of the photosensitive layer may be deteriorated immediately. Exposure sensitivity may decrease.
- the polymerizable compound included in the photosensitive layer of the first embodiment can be appropriately selected depending on the intended purpose without particular limitation, and includes at least one addition-polymerizable group in the molecule.
- Compounds having a boiling point of 100 ° C. or higher at normal pressure are preferred.
- at least one selected from monomers having a (meth) ataryl group is preferred.
- the monomer having a (meth) acrylic group can be appropriately selected depending on the purpose, without particular limitation. Examples thereof include polyethylene glycol mono (meth) acrylate, and polypropylene glycol mono (meth) acrylate. Monofunctional acrylates and monofunctional methacrylates such as phenoxyshethyl (meth) acrylate and phenoxyshetyl (meth) acrylate , Trimethylolpropane diatalylate, neopentyl glycol di (meth) atalylate, pentaerythritol tetra (meth) atalylate, pentaerythritol tri (meth) atalylate, dipentaerythritol hexane (Meth) acrylate, dipentaerythritol penta (meth) acrylate, hexanediol di (meth) acrylate, trimethylolpropane tri (atalylo
- trimethylolpropane tri (meth) acrylate pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and dipentaerythritol penta (meth) acrylate are particularly preferred.
- the solid content of the polymerizable compound in the solid content of the photosensitive composition is preferably 2 to 50% by mass, more preferably 4 to 40% by mass, and particularly preferably 5 to 30% by mass. preferable. If the solid content is less than 2% by mass, problems such as deterioration in developability and decrease in exposure sensitivity are caused. If it exceeds 50% by mass, the adhesiveness of the photosensitive layer may be too strong
- the photopolymerization initiator contained in the photosensitive layer of the first embodiment is not particularly limited as long as it has the ability to initiate polymerization of the polymerizable compound.
- an activator that is sensitive to light in the ultraviolet region to visible light may have an action with a preferred photoexcited sensitizer to produce an active radical.
- An initiator that initiates cationic polymerization depending on the type of monomer to be used may be used.
- the photopolymerization initiator contains at least one component having a molecular extinction coefficient of at least about 50 in the range of about 300 to 800 nm (more preferably, 330 to 500 nm).
- Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (for example, those having a triazine skeleton and those having an oxadiazole skeleton), phosphine oxide, hexarylbiimidazole, oxime derivatives, and organic compounds. Examples include peroxides, thio compounds, ketone compounds, aromatic potassium salts, ketoxime ethers and the like.
- Examples of the halogenated hydrocarbon compound having a triazine skeleton include, for example, those described in Wakabayashi et al., Bull. Chem. Soc. Japan, 42, 2924 (1969), British Patent No. 1388 492.
- Examples of the compounds described in Wakabayashi et al., Bull. Chem. Soc. Japan, 42, 2924 (1969) include, for example, 2-phenyl-4,6-bis (trichloromethyl) -1,3 , 5-Triazine, 2 — (4-chlorophenyl) — 4, 6-bis (trichloromethyl) -1,3,5-triazine, 2- (4-tolyl) — 4, 6-bis (trichloromethyl) —1, 3, 5-triazine, 2- (4-methoxyphenyl) -1,4,6-bis (trichloromethyl) -1,3,5-triazine, 2- (2,4-dichloro) Phenol) -4,6 bis (trichloromethyl) -1,3,5 triazine, 2,4,6 tris (trichloromethyl) -1,3,5 triazine, 2-methyl-4,6 bis (trichloromethyl) ) -1,3,5 triazine, 2-n-nor
- Examples of the compound described in the above-mentioned British Patent No. 1388492 include 2-styryl
- the compounds described in JP-A-53-133428 include, for example, 2- (4-methoxy-naphth-1-yl) -4,6-bis (trichloromethyl) -1,3,5 triazine, 2- (4ethoxy-naphth-1-yl) -4,6bis (trichloromethyl) -1,3,5triazine, 2- [4- (2ethoxyhexyl) -naphtho-1-yl] -4, 6 Bis (trichloromethyl) -1,3,5 triazine, 2— (4,7 dimethoxy-1-naphth-1-yl) 4,6 bis (trichloromethyl) -1,3,5 triazine, and 2— (acenaft — 5-yl) —4, 6 bis (trichloromethyl) 1, 3, 5 triazine.
- Examples of the compound described in the German Patent 3337024 include 2- (4-styrylphenyl) -4, 6-bis (trichloromethyl) -1,3,5 triazine, 2- ( 4- (4-Methoxystyryl) phenyl) -1,4,6 bis (trichloromethyl) 1,3,5 triazine, 2— (1 Naphthylbi-lenfyl) -1,4,6 bis (trichloromethyl) 1,3 , 5 triazine, 2 chlorostyrylphenyl-1,6 bis (trichloromethyl) 1,3,5 triazine, 2— (4 thiophene 1-2 bi-phenylene) 4,6 bis (trichloromethyl) 1 , 3,5-triazine, 2- (4-thiophene-l-bi-lenphenyl) -l, 6-bis (trichloromethyl) 1,3,5 triazine, 2- (4-furan-l-biphenyl- 1,4-bis (trichloromethyl)
- Examples of the compounds described in the above-mentioned JP-A-62-58241 include 2- (4 phenol-phenyl) -4,6 bis (trichloromethyl) -1,3,5 triazine and 2- (4 naphthyl 1-etulhueru-ru 4,6 bis (trichloromethyl) 1,3,5 triazine, 2— (4- (4 triluetur) furer) -4,6 bis (trichloromethyl) -1,3, 5 Triazine, 2- (4- (4-methoxyphenyl) ethurfur)-4,6 Bis (trichloromethyl) 1,3,5 Triazine, 2- (4- (4-isopropylphenyl-etul)) 2,4-bis (trichloromethyl) -1,3,5 triazine, 2- (4- (4- (4-ethyl) ethyl) phenyl) -4,6 bis (trichloromethyl) -1,3 5 triazine, and the like.
- Examples of the compound described in the above-mentioned Japanese Patent Application Laid-Open No. 5-281728 include 2- (4-trifluoromethylphenyl) -4,6bis (trichloromethyl) -1,3,5 triazine, 2- (2 , 6 difluorophenyl) -4,6 bis (trichloromethyl) -1,3,5 triazine, 2- (2,6 dichlorophenyl) -4,6 bis (trichloromethyl) -1,3,5 triazine And 2- (2,6 dibromophenyl) -1,4,6 bis (trichloromethyl) 1,3,5 triazine.
- Examples of the compound described in JP-A-5-34920 include 2,4-bis (tricoctoromethyl) -6- [4-((N, N-diethoxycarbolmethylamino) -3-bromo- 1,3,5 triazine, trihalomethyl-s triazine compound described in US Pat. No. 4,239,850, and 2,4,6 tris (trichloromethyl) -s triazine, 2- (4-chloro Mouthpiece) 4, 6-bis (tribromomethyl) s triazine.
- Examples of the compound described in the above-mentioned US Patent No. 4212976 include a compound having an oxadiazole skeleton (for example, 2-trichloromethyl-5-phenyl-1,3,4 —Oxadiazole, 2 trichloromethyl-1-5— (4-chlorophenol) 1-1,3,4-oxadiazole, 2 trichloromethyl—5— (1-naphthyl) —1,3,4—oxadiazol, 2 Trichloromethyl-5- (2-naphthyl) -1,3,4-oxadiazole, 2 Tribromomethyl-5 phenyl 1,3,4 oxadizazole, 2 Trimethyl methyl-5- (2naphthyl) 1,3,4-oxadiazole 2 trichloromethyl-5-styryl-1,3,4-oxadiazole, 2 trichloromethyl-1-5- (4 chlorstyryl) -1,1,3,4-oxadiazole,
- Examples of the oxime derivative include, for example, 3 benzoyloxy iminobutane 2 on, 3 acetateoxy iminobutane 2 on, 3 propionyloxy iminobutane 2 on, 2-acetoximino pentane 3 on, 2 -Acetoxyimino 1 phenylpropane — 1-one, 2 benzoyloxyimino 1 -1-phenylpropane 1-one, 3- (4-toluenesulfo-loxy) iminobutan 2-one, and 2-ethoxycarboxy-loxy And imino-1-1-propane-1-one.
- Ataridine derivatives for example, 9-phenylacridine, 1,7-bis (9,9, -atalyzyl) heptane, etc.
- N-phenylglycine etc.
- Halogen compounds for example, carbon tetrabromide, methyl trisulfone, methyl chlorosulfonate, chloromethyl methyl ketone, etc.
- coumarins for example, 3- (2-benzofuroyl) -7-ethylaminocoumarin, 3- (2 Benzofuroyl)-7-(1-pyrrolidyl) coumarin, 3 benzoyl 7 getylaminocoumarin, 3-(2-methoxybenzoyl) 7 getylaminocoumarin, 3-(4-dimethylaminobenzoyl) 1-7-ge Cylaminocoumarin, 3,3,1-Carboxylbis (5,7-di-n-propoxycoumarin), 3,3, -Carboxylbis (7-diethylaminocoumarin), 3-benzoyl 7 —Methoxycoumarin, 3— (2-furoyl) 7-Jetylaminocoumarin, 3— (4-Jetylaminocinnamoyl) 7—
- Silphosphine oxides for example, bis (2,4,6 trimethylbenzoyl) -phenylphosphine oxide, bis (2,6 dimethoxybenzoyl) -2,4,4 trimethyl-pentylphenolphosphine oxide, LucirinTPO, etc.
- meta-clasps for example, bis (7-5-2,4 cyclopenta 1 1-yl) 1-bis (2,6 difluoro 3- (1H-pyrrole 1-yl) 1-phenyl
- titanium 5 cyclopentagel-1 6-cm iron (1+) Xafluorophosphate (1)
- JP-A-53-133428 JP-B-57-1819, JP-B-57-6096
- ketone compound examples include benzophenone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 4-methoxybenzophenone, 2-chlorobenzophenone, 4-chlorobenzophenone, and 4-bromobenzophenone.
- the content of the photopolymerization initiator is preferably from 0.1 to 30% by mass, more preferably from 0.5 to 20% by mass, based on all components in the photosensitive composition. 5-15% by weight is particularly preferred.
- a sensitizer can be added for the purpose of adjusting the exposure sensitivity and the photosensitive wavelength in the exposure of the photosensitive layer described below.
- the sensitizer can be appropriately selected according to a visible light, an ultraviolet light, a visible light laser, or the like as a light irradiation means described later.
- the sensitizer is excited by an active energy ray and interacts with another substance (eg, a radical generator, an acid generator, etc.) (eg, energy transfer, electron transfer, etc.) to generate radicals or radicals. It is possible to generate useful groups such as acids.
- a radical generator e.g., a radical generator, an acid generator, etc.
- an acid generator e.g., energy transfer, electron transfer, etc.
- the sensitizer can be appropriately selected from known sensitizers, which are not particularly limited. Examples thereof include known polynuclear aromatics (for example, pyrene, perylene, and triphenylene).
- Xanthenes eg, fluorescein, eosin, erythricular synth, rhodamine B, rose bengal
- cyanines eg, indocarbocyanine, thiacarbocyanine, oxacarbocyanine
- merocyanines eg, merocyanine, carbomerocyanine
- Cheer Gins eg, thionine, methylene blue, toluidine blue
- athalidines eg, atalizine orange, chloroflavin, acriflavin
- anthraquinones eg, anthraquinone
- squariums eg, squarium
- ataridones eg, Ataridone, chloro
- Examples of the combination of the photopolymerization initiator and the sensitizer include an electron transfer initiation system described in JP-A-2001-305734 [(1) an electron donor initiator and a sensitizing dye And (2) an electron-accepting initiator and a sensitizing dye, (3) an electron-donating initiator, a sensitizing dye and an electron-accepting initiator (ternary initiation system), and the like.
- the content of the sensitizer is preferably 0.05 to 30% by mass, more preferably 0.1 to 20% by mass, based on all the components in the photosensitive composition. Particularly preferred is 2 to 10% by mass. If the content is less than 0.05% by mass, the sensitivity to active energy rays will decrease, the exposure process will take time, and productivity may decrease. In some cases, the sensitizer may precipitate from the photosensitive layer.
- the photopolymerization initiators may be used alone or in combination of two or more.
- the photopolymerization initiator include the phosphine oxides, the ⁇ -aminoalkyl ketones, and the halogenated hydrocarbon having the triazine skeleton, which can correspond to a laser beam having a wavelength of 405 nm in exposure described below.
- Compound and later Examples thereof include a composite photoinitiator in combination with an amine conjugate as a sensitizer, a hexaarylbiimidazole compound, or titanocene.
- the content of the photopolymerization initiator in the photosensitive composition is preferably from 0.1 to 30% by mass, more preferably from 0.5 to 20% by mass, and from 0.5 to 15% by mass. Is particularly preferred.
- the thermal cross-linking agent contained in the photosensitive layer of the first embodiment can be appropriately selected depending on the purpose without particular limitation, and is preferably obtained after curing of the photosensitive layer formed using the photosensitive composition.
- an epoxy resin compound having at least two oxolane groups in one molecule and at least two oxetanyl groups in one molecule within a range that does not adversely affect developability and the like. Oxetanei conjugates, melamine derivatives, etc. can be used.
- Examples of the epoxy resin compound include a bixylenol type or biphenol type epoxy resin (# 4000; manufactured by Japan Epoxy Resin Co., Ltd.) or a mixture thereof, and a heterocyclic epoxy resin having an isocyanurate skeleton or the like ( "TEPIC; manufactured by Nissan Chemical Industry Co., Ltd.”, "Araldite PT810; manufactured by Ciba Suzunoreti Chemika Norezu", etc.), bisphenol A type epoxy resin, novolak type epoxy resin, bisphenol F type epoxy resin, hydrogenated Bisphenol A epoxy resin, glycidinoleamine epoxy resin, hydantoin epoxy resin, alicyclic epoxy resin, trihydroxyphenylmethane epoxy resin, bisphenol S epoxy resin, bis Phenol A novolak type epoxy resin, tetrafluoro-rollethane type epoxy resin Glycidyl phthalate resin, tetraglycidyl xylenolethane resin, naphthalene group
- Examples of the oxetanei conjugate include bis [(3-methyl-3-oxetanylmethoxy) methyl] ether, bis [(3-ethyl-3-oxeta-lmethoxy) methyl] ether, 1,2 4-bis [(3-methyl-3-oxeta-lmethoxy) methyl] benzene, 1,4-bis [(3-ethyl-3-oxeta-lmethoxy) methyl] benzene, (3-methyl-3-oxeta-l) methylatarylate , (3 Echiru 3 Okiseta -) methyl Atari rate, (3-methyl 3-Okiseta -) methyl meth Tari rate, (3 Echiru 3 Okiseta - Le) methylate Rume Tatari rate or oligomers thereof or copolymers Oxetane group, novol
- Examples of the melamine derivative include alkylated methylol melamine and hexamethyldimethylol melamine.
- the solid content of the epoxy resin compound or oxetane conjugate in the solid content of the photosensitive composition is preferably 1 to 50% by mass, more preferably 3 to 30% by mass. If the solid content is less than 1% by mass, the cured film may have an increased hygroscopicity, resulting in deterioration of insulation properties, or reduced solder heat resistance, electroless plating resistance, and the like. If it exceeds 50% by mass, developability may be deteriorated and exposure sensitivity may be lowered.
- dicyandiamide benzyldimethylamine, 4- (dimethylamino) N, N-dimethylbenzylamine, 4-methoxyN Amine compounds such as N, N-dimethylbenzylamine, 4-methyl-N, N-dimethylbenzylamine; quaternary ammonium salts such as triethylbenzylammonium-dimethyl chloride; block isocyanate compounds such as dimethylamine Imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2 phenylimidazole, 1- (2-cyanoethyl) 2ethyl-4 -Methyl imidazole derivatives such as imidazole Bicyclic
- thermosetting any compound capable of accelerating the thermosetting other than the above, which is not particularly limited, as long as it can promote the reaction of these with the carboxyl group. You can use it.
- the solid content of the epoxy resin, the oxetane conjugate, and the compound capable of promoting thermal curing of the epoxy resin and the carboxylic acid with the carboxylic acid in the solid content of the photosensitive composition is usually 0.01 to 15% by mass. Puru.
- a polyisocyanate conjugate described in JP-A-5-9407 can be used, and the polyisocyanate conjugate is composed of at least two isocyanates. It may be derived from an aliphatic, cycloaliphatic or aromatic group-substituted aliphatic compound containing one group.
- Bifunctional isocyanates such as bis (4 isocyanate phenyl) methane, bis (4 isocyanate cyclohexyl) methane, isophorone diisocyanate, hexamethylene diisocyanate, and trimethylhexamethylene diisocyanate;
- Cyclic trimers such as xamethylene 1,6 diisocyanate or derivatives thereof; It is.
- a blocking agent is reacted with the isocyanate group of the polyisocyanate and its derivative. May be used.
- isocyanate group blocking agent examples include isopropanol, tert.-butanol and the like. Alcohols such as: ⁇ - coprolatatam and other ratatams, phenol, cresol, p-ter t.
- aldehyde condensation products resin precursors, and the like can be used.
- methylol compounds instead of these methylol compounds, the corresponding ethyl or butyl ether, or an ester of acetic acid or propionic acid may be used.
- Hexamethoxymethyl melamine composed of a formaldehyde condensation product of melamine and urea, and butyl ether of a melamine-formaldehyde condensation product may also be used.
- the solid content of the thermal crosslinking agent in the solid content of the photosensitive composition is preferably 1 to 40% by mass, more preferably 3 to 30% by mass, and particularly preferably 5 to 25% by mass. . If the solid content is less than 1% by mass, no improvement in the film strength of the cured film is observed, and if it exceeds 40% by mass, developability and exposure sensitivity may decrease.
- Examples of the other components contained in the photosensitive layer of the first embodiment include, for example, a sensitizer, a thermal polymerization inhibitor, a plasticizer, a colorant (colored pigment or dye), an extender, and the like.
- Adhesion promoters and other auxiliaries that promote adhesion to the substrate surface e.g., conductive particles, fillers, defoamers, flame retardants, leveling agents, release accelerators, antioxidants, fragrances, Surface tension adjusters, chain transfer agents, etc.
- thermosetting accelerators and the like By appropriately adding these components, properties such as stability, photographic properties, and film properties of a desired photosensitive composition or a photosensitive film described later can be adjusted.
- the thermal polymerization inhibitor may be added to prevent thermal polymerization or polymerization with time of the polymerizable compound.
- thermal polymerization inhibitor examples include 4-methoxyphenol, hydroquinone, alkyl- or aryl-substituted hydroquinone, t-butylcatechol, pyrogallol, 2-hydroxybenzophenone, 4-methoxy-12-hydroxybenzophenone, Cuprous chloride, phenothiazine, chloranil, naphthylamine, 13 naphthol, 2,6-di-t-butyl-4 cresol, 2,2-methylenebis (4-methyl-6-t-butylphenol), pyridine, nitrobenzene, dinitrobenzene, picric acid, 4 — Toluidine, methylene blue, reactant of copper and organic chelating agent, methyl salicylate, phenothiazine, nitrosoy conjugate, chelate of nitroso compound and A1, and the like.
- the content of the thermal polymerization inhibitor is preferably from 0.001 to 5% by mass, more preferably from 0.005 to 2% by mass, based on the polymerizable compound. % By weight is particularly preferred. If the content is less than 0.001% by mass, the stability during storage may decrease, and if it exceeds 5% by mass, the sensitivity to active energy rays may decrease.
- the plasticizer may be added to control the physical properties (flexibility) of the photosensitive layer.
- plasticizer examples include dimethyl phthalate, dibutyl phthalate, diisobutyl phthalate, diheptyl phthalate, dioctyl phthalate, dicyclohexyl phthalate, ditridecyl phthalate, butyl benzyl phthalate, diisodecyl phthalate, diphenyl phthalate, and diphenyl phthalate.
- Phthalates such as ryl phthalate, octyl capryl phthalate, etc .; triethylene glycol diacetate, tetraethylene glycol diacetate, dimethyldaricose phthalate, ethynolephthalinoleetinoleglycolate, methylphthalyleletyldalicolate, butyrate Nolephthalinolebutinore glycolate, triethylene glycol di Glycol esters such as cabrylic acid esters; phosphoric acid esters such as tricresyl phosphate and trifluorophosphate; 4 toluenesulfonamide, benzenesulfonamide, N-n-butylbenzenesulfonamide, N-n-butyla Amides such as cetamide; aliphatic dibasic esters such as diisobutyl adipate, dioctyl adipate, dimethyl sebacate, dibutyl sepate, diocty
- the content of the plasticizer is preferably from 0.1 to 50% by mass, more preferably from 0.5 to 40% by mass, particularly preferably from 1 to 30% by mass, based on all components of the photosensitive layer. preferable.
- the color pigment may be appropriately selected depending on the intended purpose without particular limitation. Examples thereof include Victor-Pure Blue BO (CI 42595), Auramine (CI 41000), and Fat Black HB (CI 26150). ), Monolight 'Yellow GT (CI Pigment' Yellow 1 2 '), Permanent' Yellow GR (CI Pigment 'Yellow 17'), Permanent 'Yellow I HR (CI Pigment' Yellow 83 '), Permanent' Carmin FBB (CI Pigment 'Red') 146), Hoster Balm Red ESB (CI Pigment 'Violet 19), Permanent' Ruby FBH (CI Pigment 'Red 11') Huaster 'Pink B Supra (CI Pigment' Red 81 ') Monastral' First 'Blue (CI Pigment' Blue 15), Monolight 'First' Black B (CI Pigment 'Black 1'), Carbon, CI Pigment 'Lead 97, CI Pigment CI Red 122, CI Pigment Red 149, CI Pigment Red
- Green 36 CI Pigment Blue 15: 1, CI Pigment Blue 15: 4, CI Pigment 'Blue 15: 6, CI Pigment Blue 22, CI Pigment Blue 60, CI Pigment Blue 64 .
- These may be used alone or in combination of two or more. If necessary, use a dye appropriately selected from known dyes. can do.
- the solid content of the color pigment in the solid content of the photosensitive composition can be determined in consideration of the exposure sensitivity, resolution, and the like of the photosensitive layer when a permanent pattern is formed. Force that varies depending on the type of pigment Generally, 0.05 to 10% by mass is preferred 0.075 to 8% by mass is more preferred 0.1 to 5% by mass is particularly preferred.
- the inorganic pigment may be appropriately selected from known inorganic pigments, and is not particularly limited. Examples thereof include kaolin, barium sulfate, barium titanate, silicon oxide powder, finely powdered silicon oxide, and fumed silica. , Amorphous silica, crystalline silica, fused silica, spherical silica, talc, clay, magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, and myric acid.
- the average particle size of the inorganic pigment is preferably less than 10 m, more preferably 3 m or less. When the average particle diameter is 10 m or more, the resolution may be deteriorated due to light scattering.
- the organic fine particles can be appropriately selected depending on the purpose without particular limitation. Examples thereof include melamine resin, benzoguanamine resin, and cross-linked polystyrene resin. Spherical porous fine particles made of silica or crosslinked resin having an average particle size of 1 to 5 / ⁇ and an oil absorption of about 100 to 200 m 2 Zg can be used.
- the amount of the extender added is preferably 5 to 60% by mass, more preferably 10 to 50% by mass, and particularly preferably 15 to 45% by mass. If the amount is less than 5% by mass, the linear expansion coefficient may not be sufficiently reduced. If the amount exceeds 60% by mass, the cured film may be formed on the surface of the photosensitive layer. When the wiring is formed using a permanent pattern, the function of the wiring as a protective film may be impaired.
- adhesion promoter for example, adhesion promoters described in JP-A-5-11439, JP-A-5-341532, JP-A-6-43638 and the like are preferably mentioned.
- the content of the adhesion promoter is preferably from 0.001% by mass to 20% by mass, more preferably from 0.01% to 10% by mass, based on all components in the photosensitive composition. 0.1 mass% to 5 mass% is particularly preferred.
- the photosensitive composition for forming a photosensitive layer constituting the photo solder resist layer can be prepared using a solvent.
- the solvent is not particularly limited and may be appropriately selected depending on the purpose. Examples thereof include esters, ethers, ketones, aromatic hydrocarbons, aliphatic hydrocarbons, and petroleum solvents. Among these, those which have good compatibility with the above-mentioned binder and do not dissolve the above-mentioned thermal crosslinking agent are preferred.
- esters examples include ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butylate, butyl butyrate, alkyl esters, methyl lactate, Ethyl lactate, Methyl oxyacetate, Ethyl oxyacetate, Butyl oxyacetate, Methyl methoxyacetate, Ethyl methoxyacetate, Butyl methoxyacetate, Methyl ethoxyacetate, Ethyl ethoxyacetate, Methyl 3-oxypropionate, 3-Oxypropion Alkyl esters of 3-ethoxypropionate such as ethyl acid, methyl 3-methoxypropionate, methyl 3-methoxypropionate, methyl 3-ethoxypropionate, eth
- ethers examples include diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycolone monomethinole ether, ethylene glycolone monoethylenol ether, methyl acetate solvent acetate, ethyl ethyl solvent solvent acetate, and diethylene glycol monomethyl ethanol solution.
- Diethylene glycolone monoethylenoate ethere, diethylene glycolone monobutynoate ethereole, ethyl carbitol acetate, butyl carbitol acetate, propylene glycolone monomethinoleate enoleate acetate, propylene glycolonoethyl ether Acetate, propylene glycol propyl ether acetate and the like can be mentioned.
- ketones examples include methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone, and the like.
- Examples of the aromatic hydrocarbons include toluene, xylene, and the like.
- Examples of the aliphatic hydrocarbons include octane and decane.
- Examples of the petroleum-based solvents include petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha.
- the amount of the solvent to be added during the preparation of the photosensitive composition is not particularly limited and may be appropriately selected depending on the purpose.
- the total solid content of the photosensitive composition is preferably 10 to 95% by mass. It is more preferable to be added so as to be 20 to 92.5% by mass, and it is particularly preferable to be added so as to be 30 to 90% by mass.
- Photosensitive layer constituting photoresist layer for circuit formation
- a photosensitive composition forming a photosensitive layer constituting the circuit-forming photoresist layer can be appropriately selected from known pattern forming materials which are not particularly limited, and includes, for example, a binder, a polymerizable compound, and a photopolymerization initiator, and includes other components appropriately selected. Things like,.
- the number of the photosensitive layers to be laminated can be appropriately selected depending on the purpose without particular limitation.
- the number of the photosensitive layers may be one or two or more.
- the binder can be appropriately selected according to the purpose of the present invention without any particular limitation.
- the same binder as that exemplified as the binder contained in the photosensitive layer constituting the photo solder resist layer is used. It is possible.
- the solid content of the binder in the solid content of the photosensitive composition is preferably from 10 to 90% by mass, more preferably from 20 to 80% by mass, and particularly preferably from 40 to 80% by mass.
- the film strength of the photosensitive layer may be weakened or the tackiness of the surface of the photosensitive layer may be deteriorated immediately. Exposure sensitivity may decrease.
- the acid value of the binder is not particularly limited and may be appropriately selected depending on the Nag purpose, for example, preferably 70 ⁇ 250mgKOHZg force s, preferably Ri by 90 ⁇ 200mgKOHZg force s, 100 ⁇ 180mgKOH / g is particularly preferred .
- the developability may be insufficient, or the resolution may be poor, and a pattern such as a wiring pattern may not be obtained with high definition.
- the developer property and the adhesiveness is degraded, and a pattern such as a wiring pattern cannot be obtained with high definition.
- the polymerizable compound can be appropriately selected depending on the purpose without particular limitation.For example, the same as those exemplified as the polymerizable compound contained in the photosensitive layer constituting the photo solder resist layer can be used. It is possible to use one.
- the polymerizable compound may be used together with a polymerizable compound (monofunctional monomer) having one polymerizable group in the molecule, if necessary.
- Examples of the monofunctional monomer include, for example, i And monofunctional monomers such as monobasic ((meth) atalyloyloxyalkyl esters) and mono (hydroxyhydroxyalkyl esters) described in JP-A-6-236031 (for example, ⁇ -chloro-j8-hydroxy Propyl j8'-methacryloyloxyshethyl o-phthalate), compounds described in Japanese Patent No. 2744643, WO00Z52529 pamphlet, Japanese Patent No. 2548016, and the like.
- monobasic ((meth) atalyloyloxyalkyl esters) and mono (hydroxyhydroxyalkyl esters) described in JP-A-6-236031 for example, ⁇ -chloro-j8-hydroxy Propyl j8'-methacryloyloxyshethyl o-phthalate
- JP-A-6-236031 for example, ⁇ -chloro-j8-hydroxy Propyl j8'
- the content of the polymerizable compound in the photosensitive layer is, for example, preferably 5 to 90% by mass, more preferably 15 to 60% by mass, and particularly preferably 20 to 50% by mass.
- the strength of the tent film may decrease. If the content exceeds 90% by mass, the edge fusion during storage (the failure of the roll edge force exudation) may worsen. is there.
- the content of the polyfunctional monomer having two or more polymerizable groups in the polymerizable compound is preferably 5 to: LOO mass% is preferred 20 to: LOO mass% is more preferred 40 to: L00 Mass% is particularly preferred.
- the photopolymerization initiator can be appropriately selected depending on the purpose without particular limitation.
- the photopolymerization initiator may be selected from those exemplified as the photopolymerization initiator contained in the photosensitive layer constituting the photo solder resist layer. Similar ones can be used.
- the photopolymerization initiator may be used alone or in combination of two or more.
- a combination of two or more for example, a hexamer described in U.S. Pat.
- the content of the photopolymerization initiator in the photosensitive layer is preferably 0.1 to 30% by mass, more preferably 0.5 to 20% by mass, and particularly preferably 0.5 to 15% by mass.
- Examples of the other components include a sensitizer, a thermal polymerization inhibitor, a plasticizer, a coloring agent, a coloring agent, a halogen compound, and the like, and further, an adhesion promoter to the substrate surface and other auxiliaries (for example, pigments, conductive particles, fillers, defoamers, flame retardants, leveling agents, exfoliation accelerators, antioxidants, fragrances, thermal crosslinking agents, surface tension adjusters, chain transfer agents, etc.) May be.
- auxiliaries For example, pigments, conductive particles, fillers, defoamers, flame retardants, leveling agents, exfoliation accelerators, antioxidants, fragrances, thermal crosslinking agents, surface tension adjusters, chain transfer agents, etc.
- properties such as stability, photographic properties, print-out properties, and film properties of the target pattern forming material can be adjusted.
- the sensitizer can be appropriately selected using visible light, ultraviolet light, visible light laser, or the like as a light irradiation means described later.
- the sensitizer is excited by an active energy ray and interacts with another substance (eg, a radical generator, an acid generator, etc.) (eg, energy transfer, electron transfer, etc.) to generate radicals or radicals. It is possible to generate useful groups such as acids.
- a radical generator e.g., a radical generator, an acid generator, etc.
- an acid generator e.g., energy transfer, electron transfer, etc.
- the sensitizer can be appropriately selected depending on the particular purpose without limitation. For example, those exemplified as the sensitizer contained in the photosensitive layer constituting the photo solder resist layer are exemplified. It is possible to use a similar one.
- the content of the sensitizer is preferably from 0.05 to 30% by mass, and more preferably from 0.1 to 20% by mass, based on all components of the photosensitive composition. 10% by weight is particularly preferred. If the content is less than 0.05% by mass, the sensitivity to active energy rays decreases, the exposure process takes time, and productivity may decrease. If the content exceeds 30% by mass, the photosensitive layer May precipitate during storage. [0166]
- the thermal polymerization inhibitor can be added to prevent thermal polymerization or temporal polymerization of the polymerizable compound in the photosensitive layer.
- the thermal polymerization inhibitor can be appropriately selected depending on the purpose without particular limitation.For example, the same as those exemplified as the thermal polymerization inhibitor contained in the photosensitive layer constituting the photo solder resist layer Can be used.
- the content of the thermal polymerization inhibitor is preferably 0.001 to 5% by mass, more preferably 0.005 to 2% by mass, and 0.01 to 1% by mass based on all components of the photosensitive composition. % Is particularly preferred.
- the plasticizer can be appropriately selected depending on the purpose without particular limitation.
- the same as the plasticizer included in the photosensitive layer constituting the photo solder resist layer may be used. Can be used.
- the content of the plasticizer is preferably from 0.1 to 50% by mass, more preferably from 0.5 to 40% by mass, and particularly preferably from 1 to 30% by mass, based on all components of the photosensitive composition. .
- the color former may be added to give a visible image to the photosensitive layer after exposure (print-out function).
- coloring agent examples include tris (4-dimethylaminophenol) methane (leucocristal violet), tris (4-dimethylaminophenol) methane, and tris (4-dimethylamino-2-methylphenol).
- Methane tris (4-dimethylaminomethyl) methane, bis (4-dibutylaminophenol)-[4-1 (2-cyanoethyl) methylaminophenyl] methane, bis (4-dimethylaminophenol) 2 aminotriarylmethanes such as quinolylmethane and tris (4-dipropylaminophenol) methane; 3,6-bis (dimethylamino) 9-phen-xanthine, 3 -amino6 dimethylamino-1-methyl9- (2 Aminoxanthine such as xanthine; 3,6 bis (getylamino) 9 (2ethoxycarbyl) thioxanthen; 3,6-bis Aminothi
- halogen compound examples include halogenated hydrocarbons (e.g., carbon tetrabromide, eodoform, brominated ethylene, brominated methylene, amidobromide, amidoisoamyl, amidoamyl, isobutylene bromide, iodine).
- halogenated hydrocarbons e.g., carbon tetrabromide, eodoform, brominated ethylene, brominated methylene, amidobromide, amidoisoamyl, amidoamyl, isobutylene bromide, iodine.
- a dye can be used for the purpose of coloring the photosensitive composition for improving the handleability or imparting storage stability.
- the dye examples include brilliant green (for example, a sulfate thereof), eosin, etilba. Violet, Ellis mouth B, methyl green, crystal violet, basic fuchsin, phenol phthalein, 1,3 diphenyl triazine, alizarin red S, thymol phthalein, methyl violet 2B, quinaldine red, rose bengal, meta-ruiello , Thymol sulfophthalein, xylenol blue, methyl orange, orange IV, diphenyltyrocarbazone, 2,7 diclofluorescein, paramethyl red, Congo red, benzopurpurine 4B, a naphthyl red, nile blue A , Phenacetaline, methyl violet, malachite green, parafuchsin, oil blue # 603 (manufactured by Orient Chemical Industries), rhodamine B, rhodamine 6G, Victoria Pure Blue BOH, and the like.
- Cationic dyes e.g., Malachite Green possess acid salt, malachite green sulfates
- the counter ion of the cationic dye may be any residue of an organic acid or an inorganic acid, such as bromic acid, iodic acid, sulfuric acid, phosphoric acid, oxalic acid, methanesulfonic acid, and toluenesulfonic acid. Residue (a-on)
- the content of the dye is preferably from 0.001 to 10% by mass, more preferably from 0.01 to 5% by mass, and more preferably from 0.1 to 2% by mass, based on all components of the photosensitive layer. Is particularly preferred.
- the photosensitive layer may be, for example, an organic sulfur-containing compound, a peroxide, a redox compound, an azo or a diazo as described in Chapter 5 of “Light Sensitive Systems” by J. Kousa. It may contain a compound, a photoreducing dye, an organic halogenated compound, or the like.
- peroxide examples include tert-butyl peroxide, benzoyl peroxide, and methylethylketone peroxide.
- the redox compound also provides a combination power between the peroxidic acid and the reducing agent, and examples thereof include ferrous ion and a persulfate ion, and ferric ion and a peroxidic acid. .
- azo and diazo conjugates examples include diazoniums such as ⁇ , ⁇ ′-azobisiributy-mouth-tolyl, 2azobis-1-methylbutymouth-tolyl, and 4-aminodiphenylamine.
- Examples of the photoreducing dye include rose bengal, erythrocycin, eosin, acriflavine, riboflavin, and thionine.
- the surfactant can be appropriately selected from, for example, anionic surfactants, cationic surfactants, non-ionic surfactants, amphoteric surfactants, and fluorine-containing surfactants.
- a fluorine-based surfactant containing 40% by mass or more of fluorine atoms in a carbon chain of 3 to 20 and having a small number counted from the non-bonded terminal
- a polymer surfactant having, as a copolymerization component, an atalylate or a metharylate having a fluoroaliphatic group in which a hydrogen atom bonded to at least three carbon atoms is substituted by fluorine is also preferably mentioned.
- the incorporation of the surfactant makes it possible to improve the surface unevenness of the photosensitive layer.
- the solvent is not particularly limited and can be appropriately selected depending on the purpose.
- As the photosensitive composition for forming the photosensitive layer constituting the photo solder resist it is possible to use the same solvents as those exemplified above.
- the amount of the solvent to be added during the preparation of the photosensitive composition can be appropriately selected depending on the intended purpose without particular limitation, and the total solid content of the photosensitive composition is 5 to 80 mass%. %, More preferably 10% to 60% by mass, and particularly preferably 15% to 50% by mass.
- the substrate can be used by forming a laminate in which the photosensitive layer of the pattern forming material is laminated on the substrate so as to overlap. That is, by exposing the photosensitive layer of the pattern forming material in the laminate to the exposed region, the exposed region is cured, and a pattern can be formed by a development process described later.
- the pattern forming material can be widely used for forming printed wiring boards, display members such as color filters and pillars, ribs, spacers, partition walls, etc., and patterns such as holograms, micromachines, and proofs. .
- the light from the light irradiating unit is modulated by a light modulating unit having at least n pixel units that receive and emit light of at least the power of the light irradiating unit.
- a light modulating unit having at least n pixel units that receive and emit light of at least the power of the light irradiating unit.
- Light passing through a microlens array having a microlens having an aspheric surface capable of correcting aberration due to distortion or light from a peripheral portion of the picture element portion is not incident.
- the light passing through the microlens array in which the lenses are arranged is used to form the photosensitive layer under the oxygen-deficient atmosphere in the photosensitive layer forming step. This is a step of exposing the formed photosensitive layer.
- oxygen-deficient atmosphere for example, (1) a mode in which exposure is performed in an oxygen-poor atmosphere, and (2) an oxygen-blocking layer on the surface of the photosensitive layer so that the photosensitive layer is on the substrate side.
- An embodiment in which the formation is performed is given.
- the oxygen-deficient atmosphere in the above (1) can be appropriately selected depending on the purpose without limitation as long as the polymerization reaction of the photosensitive layer can be prevented from being inhibited by the influence of oxygen. Less than% is preferred 0.5% or less is more preferred 0% is most preferred. If the oxygen concentration exceeds 1%, the sensitivity may be greatly reduced.
- the oxygen-deficient atmosphere is not particularly limited as long as the oxygen concentration is 1% or less, and includes an inert gas atmosphere, and particularly an inert gas atmosphere.
- the inert gas can be appropriately selected depending on the purpose without any particular limitation, and examples thereof include nitrogen, helium, and argon.
- the method of exposing the photosensitive layer formed in the photosensitive layer forming step under an oxygen-deficient atmosphere can be appropriately selected depending on the purpose without particular limitation.
- a method of exposing the oxygen-deficient atmosphere to the surface of the photosensitive layer can be used.
- a photosensitive layer to be exposed is formed in the exposure space on the sample stage where one side of the frame is opened and the inlet for the inert gas or oxygen-deficient gas is formed on at least the other side.
- a method in which the sample placed is placed on the photosensitive layer and exposed to oxygen while introducing an oxygen-deficient gas through the introduction hole, and the surface of the photosensitive layer is covered with an oxygen-deficient atmosphere.
- the exposure space as a sealed space and introduce an oxygen-deficient atmosphere into the sealed space under reduced pressure.
- the oxygen blocking layer of the above (2) as long as the sensitivity of the photosensitive composition can be kept high without inhibiting the polymerization reaction of the photosensitive layer due to the influence of oxygen at the time of exposure, the material and shape of the composition can be improved.
- the structure, structure, etc. can be appropriately selected depending on the purpose, but it is preferable that the oxygen permeability is low and the transmission of light used for exposure is not substantially inhibited.
- the oxygen permeability can be measured, for example, according to the method described in ASTM standards D-1434-82 (1986).
- the oxygen permeability can be measured, for example, as follows.
- As an oxygen electrode model 3600 manufactured by Orbis Fair Laboratories Japan Ink was used.
- As the electrode diaphragm polyfluoroalkoxy (PFA) 2956A having the fastest response speed and the highest sensitivity was used.
- a thin layer of silicone grease SH111, manufactured by Toray Dow Co., Ltd. was applied thinly to the electrode diaphragm, and the thin film material to be measured was attached thereon, and the oxygen concentration value was measured. It has been confirmed that the coating film of silicone grease does not affect the oxygen transmission rate.
- the oxygen permeation rate (ccZ m ⁇ day atm) of the thin film material to be measured was converted from the oxygen concentration value indicated by the electrode.
- the oxygen barrier layer is more strongly adhered or adhered to the photosensitive layer than to the support.
- the material for forming the oxygen barrier layer is not particularly limited and may be appropriately selected depending on the intended purpose.However, the material is preferably soluble in a weak alkaline aqueous solution which is preferably a soluble developer. U, more preferred.
- soluble in the aqueous solution include, for example, polyvinyl alcohol, polyvinyl diinopyrrolidone, etinoresenolerose, hydroxyethinoresenorelose, hydroxypropinoresorelorose, hydroxypropinolemethinoresenolerose, Cellulose such as water-soluble salt of canoleboxy shetino reseno reloose, canole boxy propino reseno reloise, canole boxy shetino reseno reloose, canole boxy cyanole reseno reose, cellulose, acidic celluloses, carboxy Water-soluble salts of alkyl starch, polyacrylamides, water-soluble polyamides, water-soluble salts of polyacrylic acid, polyvinyl ether Z maleic anhydride polymer, ethylene oxide polymer, styrene Z male Examples include copolymers of formic acid,
- the oxygen barrier layer may be used alone or in combination of two or more of them.
- the polyvinyl alcohol preferably has a weight-average molecular weight of 300 to 2400, and more preferably 71 to: LOO mol% hydrolyzed.
- the content of the polyvinyl alcohol in the oxygen barrier layer forming material is not particularly limited and can be appropriately selected depending on the purpose.
- the content is preferably 50 to 99% by mass, more preferably 55 to 90% by mass. Is more preferably 60 to 80% by mass.
- the content of the polyvinyl pyrrolidone in the material for forming an oxygen barrier layer is not particularly limited and can be appropriately selected depending on the purpose.
- the content is preferably 1 to 50% by mass, and more preferably 10 to 45% by mass. Is more preferably 20 to 40% by mass.
- an amphoteric surfactant such as an alkyl propyloxytaine and a perfluoroalkylbetaine described in JP-A-61-285444 can be used.
- water-miscible solvent examples include methanol, ethanol, ethylene glycol monomethyl ether, and propylene glycol monomethyl ether.
- the mixing ratio of the water and the solvent is not particularly limited, and can be appropriately selected depending on the purpose.
- the ratio of water: solvent is preferably 100: 0 to 80:20. More preferably, it is particularly preferably 60:40.
- the light modulating means having at least n (where n is a natural number of 2 or more) picture elements for receiving and emitting light of the light irradiating means power is used.
- Light that has passed through a microlens array in which microlenses having an aspheric surface capable of correcting aberration due to distortion of the emission surface in the picture element portion after modulating A step of exposing the photosensitive layer formed in the photosensitive layer forming step to light that has passed through a microlens array in which microlenses having a lens opening shape that does not allow light of a peripheral portion to enter.
- the light irradiated from the light irradiation means can be appropriately selected depending on the purpose without particular limitation.
- a light polymerization initiator or a sensitizer is activated.
- Suitable examples include electromagnetic waves, ultraviolet to visible light, electron beams, X-rays, and laser beams. Of these, laser beams that can perform on / off control of light in a short time and easily control light interference are preferable.
- any method may be used as long as it is a method of modulating light by n light-modulating means having n picture elements for receiving and emitting light from the light irradiating means.
- the restriction can be appropriately selected depending on the purpose to be relaxed.However, a method of controlling any of less than n successively arranged picture elements out of n picture elements according to the pattern information is used. It is preferably listed.
- the number (n) of the picture element portions can be appropriately selected depending on the particular purpose, but is preferably 2 or more.
- the method of modulating the light can be appropriately selected depending on the particular purpose, but a method using a spatial light modulating element as the light modulating means is preferably exemplified as the spatial light modulating element.
- a method using a spatial light modulating element as the light modulating means is preferably exemplified as the spatial light modulating element.
- DMD digital “Micro Mirror Device”
- MEMS Micro Electro Mechanical Systems
- SLM Micro Electro Mechanical Systems
- PZT element An optical element that modulates transmitted light by an electro-optic effect
- FLC liquid crystal optical shutter
- the light modulated by the modulating means is a microlens array in which microlenses having an aspheric surface capable of correcting aberration due to distortion of an emission surface in the picture element portion, or A lens that does not allow light from the peripheral portion of the picture element portion to enter is allowed to pass through a microlens array in which microlenses having an opening shape are arranged.
- the microlenses arranged in the microlens array are not particularly limited.For example, those having an aspherical surface are preferred, and the aspherical surface is more preferably a microlens having a toric surface! / ,.
- the light modulated by the modulating means is passed through an aperture array, a coupling optical system, another optical system appropriately selected, or the like.
- a method of exposing the photosensitive layer can be appropriately selected depending on the purpose without particular limitation. For example, digital exposure, digital exposure, and analog exposure are preferable. is there.
- the method of the digital exposure can be appropriately selected depending on the purpose without particular limitation. For example, using a laser beam modulated according to a control signal generated based on predetermined pattern information. Preferably, it is performed.
- the method of exposing the photosensitive layer is not particularly limited and may be appropriately selected depending on the intended purpose. It is particularly preferable to use together with the digital micromirror device (DMD), which is preferably performed while relatively moving the photosensitive layer and the photosensitive layer.
- DMD digital micromirror device
- the method of exposing the photosensitive layer formed in the photosensitive layer forming step in an inert gas atmosphere is appropriately selected depending on the purpose without particular limitation. For example, a method in which an inert gas is directly sprayed onto the surface of the photosensitive layer, an exposure space in a sample stage in which one side of a frame is opened, and a hole for introducing an inert gas is formed in at least one other side. Then, the sample on which the photosensitive layer to be exposed is formed is placed, and an inert gas is introduced through the inert gas introduction hole, and the surface of the photosensitive layer is covered with the inert gas. And the like.
- FIG. 7 is a schematic perspective view showing the appearance of a pattern forming apparatus suitably used in the pattern forming method of the present invention.
- the pattern forming apparatus including the light modulating means adsorbs a sheet-like pattern forming material 150 on the upper surface of a thick plate-like mounting table 156 supported by four legs 154.
- the stage 152 is provided with a flat plate-shaped stage 152 for holding the stage.
- FIG. 8 is a schematic perspective view showing the configuration of the scanner.
- FIG. 9A is a plan view showing an exposed area formed on the photosensitive layer
- FIG. 9B is a view showing an arrangement of exposure areas by an exposure head.
- Area is to be exposed by the exposure area 168 on the second row and the exposure area 168 on the third row.
- DMD Digital micromirror device 50 manufactured by Instrumentmen Co., Ltd. and a light emitting side (light emitting point) of an optical fiber arranged on the light incident side of DMD50.
- Exposure area 168 Fiber array light source 66 as light irradiating means 66 with laser emitting unit 68 arranged in a line along the direction corresponding to the long side direction of laser and laser light emitted from fiber array light source 66
- a lens system 67 that focuses the laser beam on the DMD, a mirror 69 that reflects the laser beam transmitted through the lens system 67 toward the DMD 50, and an image of the laser beam B reflected by the DMD 50 on the pattern forming material 150.
- an imaging optical system 51 In FIG. 10, the lens system 67 is schematically illustrated.
- CMOS SRAM cell 60 manufactured on a normal semiconductor memory manufacturing line is disposed via a support including a hinge and a yoke, and the entire structure is monolithically configured. ing.
- FIG. 1 shows an example of a state in which the micromirror 62 is controlled to + ⁇ degrees or ⁇ degrees.
- the ON / OFF control of each micromirror 62 is performed by the controller 302 connected to the DMD 50.
- a light absorber (not shown) is arranged in the direction in which the laser beam reflected by the off-state micromirror 62 travels.
- the scanning width w is almost the same.
- FIGS. 4A and 4B are diagrams showing areas where the DMD is used.
- modulation can be performed twice as fast per line as compared to the case where all 768 sets are used.
- modulation can be performed three times faster per line than when all 768 sets are used.
- FIG. 11 is a cross-sectional view in the multiple scanning direction along the optical axis, showing details of the configuration of the exposure head in FIG.
- the lens system 67 is a condenser lens 71 that collects laser light B as illumination light emitted from the fiber array light source 66, and is inserted into the optical path of the light passing through the condenser lens 71.
- a rod-shaped optical integrator (hereinafter, referred to as a rod integrator) 72 and an imaging lens 74 arranged in front of the rod integrator 72, that is, on the mirror 69 side are provided.
- the arrangement pitch of the microlenses 55a is 41 ⁇ m in both the vertical and horizontal directions.
- the focal length of the micro lens 55a is 0.19 mm, and the NA (numerical aperture) is 0.11.
- the first imaging optical system magnifies the image by the DMD 50 three times and forms an image on the microlens array 55.
- the second imaging optical system magnifies the image passing through the microlens array 55 by 1.6 times to form an image on the pattern forming material 150 and project it.
- FIG. 14 the same height position of the reflection surface is connected by a contour line, and the pitch of the contour line is 5 nm.
- the X direction and the y direction are two diagonal directions of the micromirror 62, and the micromirror 62 rotates about the rotation axis extending in the y direction as described above.
- FIGS. 15A and 15B show the height position displacement of the reflecting surface of the micromirror 62 along the X direction and the y direction in FIG. 14, respectively.
- the microlens array 55 is configured by arranging 1024 rows of microlenses 55a horizontally and 256 rows of vertical microlenses 55a corresponding to the micromirrors 62 of the DMD 50.
- the dimension of the long side is 50mm, and the dimension of the short side is 20mm.
- FIGS. 17A and 17B are diagrams showing a front shape and a side shape of the microlenses constituting the microlens array. Note that FIG. 17A also shows contour lines of the microlenses 55a.
- the aspherical microlens 55a is a toric lens having a radius of curvature Rx in the X direction of -0.125 mm and a radius of curvature Ry in the y direction of -0.1 mm.
- a toric lens having an aspherical end surface on the light emission side is used, so that the laser light in a cross section parallel to the X direction and the y direction is used.
- the radius of curvature of the microlens 55a is smaller in the latter cross section, and the focal length is longer. Be shorter.
- the surface shape of the micro lens 55a used in the simulation is calculated by the following formula.
- the aperture array 59 is arranged near the converging position of the microlens array 55.
- Each of the apertures 59a provided in the aperture array 59 receives only the light that has passed through the corresponding microlens 55a. Therefore, the light from the adjacent microlens 55a that does not correspond to the one aperture 59a corresponding to the one microlens 55a is prevented from entering, and the extinction ratio can be increased.
- the imaging optical system includes lenses 480 and 482, and the light that has passed through the aperture 59 is imaged on the exposure surface 56 by the imaging optical system.
- the pattern forming apparatus since the pattern forming apparatus includes the microlens array 472 and the aperture array 476, the laser light reflected by the DMD 50 is reflected by each microlens of the microlens array 472 to correspond to each pixel of the DMD 50. It is collected. As a result, as shown in FIG. 13C, even when the exposure area is enlarged, the spot size of each beam spot BS can be reduced to a desired size (for example, lO ⁇ mXlO ⁇ m). High-definition exposure can be performed while preventing a decrease in MTF characteristics.
- each microlens has a refractive index distribution for correcting aberration caused by distortion of the reflection surface of the micromirror 62.
- the outer shape of the other microlens 155a is a parallel plate. The x and y directions in the figure are as described above.
- the microlens 55a shown in FIGS. 17 and 18 the refractive index distribution is given together, and the aberration due to the distortion of the reflecting surface of the micromirror 62 is corrected by both the surface shape and the refractive index distribution. Is also possible.
- the microlens array of this example does not allow light from the periphery of the picture element portion to enter. ⁇ ⁇ ⁇ ⁇ Micro lenses having a lens opening shape are arranged.
- a known optical system may be used in combination with another appropriately selected optical system.
- a light amount distribution correcting optical system including a pair of combined lenses may be used. No.
- the light amount distribution correction optical system increases the light beam width h0, hi on the incident side, the light beam width hlO in the central portion on the output side becomes larger than that on the peripheral portion, Conversely, the luminous flux width hi 1 at the periphery is made smaller than that at the center.
- the reduction rate of the luminous flux the reduction rate for the incident light flux in the central portion is made smaller than that in the peripheral portion, and the reduction rate for the incident light flux in the peripheral portion is made larger than that in the central portion.
- Table 1 below shows the basic lens data.
- Table 2 below shows the aspherical surface data of the first and fourth surfaces.
- the combined laser light source is housed together with other optical elements in a box-shaped package 40 having an open top.
- Package 40 has its opening It is equipped with a package lid 41 that is created so as to be closed.
- the sealing gas is introduced after the degassing process, and the opening of the package 40 is closed with the package lid 41 to form the package 40 and the package lid 41.
- the combined laser light source is hermetically sealed in a closed space (sealed space).
- the multi-cavity laser 110 and a plurality of multi-cavity lasers 110 on the heat block 100 correspond to the arrangement direction of the light emitting points 11 Oa of each chip.
- Multi-cavity laser rays arranged in the same direction can be used as a laser light source.
- a plurality of light emitting points 110a of the multi-cavity laser 110 are juxtaposed within a width substantially equal to the core diameter of the multi-mode optical fiber 130, and the condensing lens 120 is used as the condensing lens 120 of the multi-mode optical fiber 130.
- each of the laser beams B emitted from each of the plurality of light emitting points 110a of the plurality of multicavity lasers 110 is condensed in a predetermined direction by the rod lens 113, and then the lens array 114 Are collimated by the respective microlenses.
- the collimated laser beam L is condensed by the condenser lens 120 and enters the core 130a of the multimode optical fiber 130.
- the laser light incident on the core 130a propagates in the optical fiber, is multiplexed into one light, and is emitted.
- a heat block 182 having a cross section in the optical axis direction on a substantially rectangular heat block 180 is provided.
- a storage space is formed between the heat blocks.
- a plurality (for example, two) of multi-cavity lasers 110 in which a plurality of light-emitting points (for example, five) are arranged in an array are provided. Are arranged at equal intervals in the same direction as the arrangement direction and are fixed.
- the length direction of each collimating lens and the divergence angle of the laser beam are large and the direction (fast axis direction) coincides, and the width direction of each collimating lens has a small divergence angle and the direction (slow axis). Direction).
- the space utilization efficiency of the laser light is improved, the output of the multiplexed laser light source is increased, and the number of components is reduced and the cost is reduced. Can be.
- each laser module when the coupling efficiency of the laser beams B1 to B7 to the multi-mode optical fiber 30 is 0.85 and each output of the GaN-based semiconductor lasers LD1 to LD7 is 30 mW, an array is formed.
- the developing step includes a step of exposing the photosensitive layer in the exposing step, and developing by removing unexposed portions.
- the method of removing the uncured region can be appropriately selected depending on the purpose without particular limitation, and examples thereof include a method of removing the uncured region using a developer.
- the temperature of the developer can be appropriately selected according to the developability of the photosensitive layer, but is preferably, for example, about 25 ° C to 40 ° C.
- the plating step can be performed by a method appropriately selected from known plating processes.
- the metal wiring pattern can be formed on the surface of the base by removing the pattern after the plating process in the plating process and by removing unnecessary portions by a resist stripping process or the like as necessary. .
- the pattern forming method of the present invention is a pattern forming method for forming a printed wiring pattern
- the pattern can be formed at a high speed, so that it can be widely used for forming various patterns.
- a printed wiring board having a hole portion such as a through hole or a via hole.
- the roll pressure of the pressure roll is not particularly limited, and is preferably, for example, 0.1 to 1 MPa.
- the substrate for forming a printed wiring board may be preheated, or may be laminated under reduced pressure.
- the photosensitive layer is cured by irradiating light from the opposite side of the laminate from the substrate in an inert atmosphere.
- exposure is performed after the support is peeled off (support peeling step).
- the uncured area of the photosensitive layer on the substrate for forming a printed wiring board is dissolved and removed with an appropriate developing solution, and a cured layer for forming a wiring pattern and a cured layer for protecting a metal layer of a through hole are formed.
- a layer pattern is formed, and a metal layer is exposed on the surface of the printed wiring board forming substrate (developing step).
- the photosensitive composition for forming the photosensitive layer constituting the color resist layer includes a binder, a polymerizable compound, and a photopolymerization initiator.
- Specific examples of the photosensitive layer include a (meth) acrylic acid-containing polymer as a binder, a polymerizable compound, a photopolymerization initiator, and a coloring agent, and further include other components appropriately selected. Preferred are those comprising
- the binder is appropriately selected from those having an acid value in the range of 50 to 300 mg KOHZlg and a weight average molecular weight in the range of 1000 to 3000 000.
- the weight average molecular weight of the binder is preferably from 1,000 to 300,000, more preferably from 10,000 to 250,000. [0350] If the weight average molecular weight is less than 1,000, a target structure may not be obtained, while if it exceeds 300,000, developability may be extremely reduced.
- the weight average molecular weight is an average molecular weight in terms of polystyrene measured by GPC (gel permeation chromatography).
- the content of the binder is preferably from 10 to 60% by mass of the total solid content of the photosensitive composition, more preferably from 12.5 to 55% by mass, and particularly preferably from 15 to 40% by mass. .
- Examples of the colorant include a yellow pigment, an orange pigment, a red pigment, a violet pigment, a blue pigment, a green pigment, a brown pigment, and a black pigment.
- a color filter When a color filter is formed, the three primary colors are used. Since a plurality of photosensitive transfer materials colored (B, G, R) and black (K) are used, blue pigments, green pigments, red pigments, and black pigments are preferably used.
- black pigment examples include Monolight "First” Black B (C.I. Pigment “Black 1"), C.I. Pigment Black 7, Fat “Black HB (C.I. 26150), and the like.
- the content of CI Pigment Red 254 in the above (I) is 0.6 to 1.lg / m when the photosensitive composition is applied at a dry thickness of 1 to 3 / ⁇ . it is rather preferably is 2, from 0.80 to 0. more preferably it force S is 96g / m 2, 0. 82 ⁇ 0. it forces S particularly preferably 94 g / m 2.
- the photosensitive composition may contain, as other components, components such as a thermal crosslinking agent, a plasticizer, a surfactant, and a thermal polymerization inhibitor.
- alkyl group examples include methyl, ethyl, propyl, butyl, heptyl, hexyl, octyl, nonyl, decyl, dodecyl, tridecyl, tetradecyl, hexadecyl, Examples thereof include a otadecyl group, an eicosanyl group, a docosanyl group, a 2-chloroethyl group, a 2-bromoethyl group, a 2-cyanoethyl group, a 2-methoxycarbonylylethyl group, a 2-methoxyethyl group, and a 3-bromopropyl group.
- perfluoro group examples include perfluorononel, perfluoromethyl, perfluoropropylene, perfluorono-nel, perfluorobenzoic acid, perfluoropropylene, propyl perfluoronore, propyl perfluoronore (9-methinoleoctyl), Fluoromethyloctyl, perfluorobutyl, perfluoro-3-methylbutyl, perfluoro-hexanol, norphnole-cutinole, norphnoleo-mouth 7-otachinoreetinole, phnoleo-outlet butyl, perfluorodecyl, par Fluorobutyl and the like.
- the content of the surfactant is preferably 0.001 to 10% by mass based on the solid content of the photosensitive composition. If the content is less than 0.001% by mass, the effect of improving the surface properties may not be obtained, and if it exceeds 10% by mass, the adhesion may be reduced.
- the amount of the solvent to be added during the preparation of the photosensitive composition is not particularly limited and may be appropriately selected depending on the purpose.
- the total solid content of the photosensitive composition is 5 to 80% by mass. It is preferred to be added as 10 to 60% by mass. More preferably, it is particularly preferably added so as to be 15 to 50% by mass.
- each pixel can be appropriately selected depending on the purpose of the present invention, and is preferably, for example, 40 to 200 / ⁇ . If it is striped, a width of 40 to 20 is usually used.
- the color filter of the present invention is manufactured by the method for manufacturing a color filter of the present invention.
- the color filter of the present invention is intended for a filter formed on a counter substrate of a liquid crystal display device (a substrate on which there is no active element such as a TFT), a COA method formed on a TFT substrate, and a black filter on a TFT substrate.
- a liquid crystal display device a substrate on which there is no active element such as a TFT
- COA method formed on a TFT substrate
- a black filter on a TFT substrate a black filter on a TFT substrate.
- the BOA method which forms only a TFT
- the HA method which has a high-aperture structure on a TFT substrate, can also be targeted.
- the radius of curvature Ry —0.1 mm in the direction corresponding to the y direction.
- the amount of light energy required to cure the photosensitive layer was 50 mjZcm 2 .
- the exposure speed was 24 mmZsec.
- the obtained photosensitive composition was coated on a copper-clad laminate (copper thickness 12 m) by a spin coater. Then, the resultant was dried in an oven at 120 ° C. for 2 minutes to form a 5 m-thick circuit pattern photoresist layer.
- a wiring pattern (first wiring pattern) having a width of 100 m and a gap of 120 ⁇ m was formed on a double-sided copper-clad laminate having a copper layer with a thickness of 18 m on both sides by a known subtractive method, and a known method was used. To perform a blackening treatment on the copper surface. On this wiring, the photosensitive composition (solution) of Example A-2 was successively applied to both sides and dried to a thickness of 35 ⁇ m (thickness from the resin portion of the substrate; 17 m) was formed.
- Tetrahydrophthalic acid a reaction product of cresol novolac type epoxy resin and acrylic acid 100 parts by weight of an anhydride adduct, 20 parts by weight of dipentaerythritol hexatalylate, 3,3 ', 5,5,1-tetramethyl-1,4,4,1-diglycidyloxybiphenyl (trade name: YX4000 50 parts by mass, barium sulfate (trade name: ⁇ -30, manufactured by Sakai Chemical) 90 parts by mass, getylthioxanthone (trade name: DETX-S, manufactured by Nippon Kayaku) 1 3 parts by mass consisting of 15 parts by mass, 15 parts by mass of dimethylmorpholinomethyl-p-methylthiophenol-ketone (trade name: Irgacure 907, manufactured by Ciba Specialty Chemicals), 0.3 part by mass of dicyandiamide, and 1 part by mass of phthalocyanine green And kneaded with a roll mill to prepare
- the obtained photosensitive composition was applied on a copper-clad laminate (copper foil thickness 18 mZ ⁇ fat thickness 1.4 mm) by a screen printing method so as to have a dry thickness of 35 m. Drying was performed for 30 minutes in a hot air circulating drying oven at ° C to form a 35 m-thick photoresist layer.
- the photo solder resist of Example B-1 was applied on a 20 ⁇ m-thick polyethylene terephthalate film (trade name: G2, manufactured by Teijin Limited) as a support by a screen printing method to a dry thickness of 35 m. , And dried in a hot air circulation type drying oven at 80 ° C. for 30 minutes to form a 35 m-thick circuit pattern photoresist photosensitive layer.
- a 20 ⁇ m-thick polyethylene terephthalate film (trade name: G2, manufactured by Teijin Limited) as a support by a screen printing method to a dry thickness of 35 m.
- a hot air circulation type drying oven at 80 ° C. for 30 minutes to form a 35 m-thick circuit pattern photoresist photosensitive layer.
Abstract
Description
Claims
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JP2004-162203 | 2004-05-31 | ||
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JP2004171445 | 2004-06-09 | ||
JP2005-128749 | 2005-04-26 | ||
JP2005128749A JP2006018228A (ja) | 2004-05-31 | 2005-04-26 | パターン形成方法 |
JP2005-133324 | 2005-04-28 | ||
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JP2007171656A (ja) * | 2005-12-22 | 2007-07-05 | Fujifilm Corp | カラーフィルタ及びその製造方法並びに液晶表示装置 |
WO2007074694A1 (ja) * | 2005-12-28 | 2007-07-05 | Fujifilm Corporation | カラーフィルタ及びその製造方法、並びに液晶表示装置 |
US20110053799A1 (en) * | 2009-08-31 | 2011-03-03 | Jsr Corporation | Method of producing microarray substrate, radiation-sensitive composition, partition of microarray substrate, method of producing biochip, and biochip |
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US10312315B2 (en) | 2013-12-02 | 2019-06-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
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CN107748405A (zh) * | 2017-11-29 | 2018-03-02 | 深圳市华星光电技术有限公司 | 彩色滤光片与背光模组 |
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