WO2005086225A1 - 非接触保持装置および非接触保持搬送装置 - Google Patents
非接触保持装置および非接触保持搬送装置 Download PDFInfo
- Publication number
- WO2005086225A1 WO2005086225A1 PCT/JP2005/002915 JP2005002915W WO2005086225A1 WO 2005086225 A1 WO2005086225 A1 WO 2005086225A1 JP 2005002915 W JP2005002915 W JP 2005002915W WO 2005086225 A1 WO2005086225 A1 WO 2005086225A1
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- WIPO (PCT)
- Prior art keywords
- contact holding
- holding device
- fluid
- ejection
- work
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Definitions
- Non-contact holding device and non-contact holding transfer device are non-contact holding transfer device
- the present invention sprays a fluid such as air on a holding object including a peak, such as a semiconductor wafer or a glass plate for a PDP (plasma display panel), and holds the holding object in a non-contact manner.
- the present invention relates to a non-contact holding device and a non-contact holding and conveying device capable of conveying an object to be held in a non-contact holding state.
- this type of non-contact holding device has been used to transfer a work such as a silicon wafer or a semiconductor wafer to a next process in a manufacturing stage or to transfer dust or a work to the work in the same process.
- Mechanical and direct holding has become extremely difficult to prevent damage or as workpieces become larger or thinner.
- Patent Document 1 a non-contact holding device has been proposed in which a predetermined pressure of air or nitrogen gas is blown onto a work to hold the work in a non-contact manner by balancing positive pressure and negative pressure (eg, for example).
- Patent Document 1 Japanese Patent Application Laid-Open No. 2002-64130
- a jet flow of a fluid such as air blown from a jet port to a work
- a swirling flow one non-contact holding device is required.
- the workpiece rotates little by little with the swirling air flow and cannot be held stationary.
- the direction of the swirling flow is, for example, clockwise (CW) and counterclockwise (CCW) as in the panel-type non-contact holding device A shown in FIG. It was necessary to arrange at least two non-contact holding devices CW and CCW different from each other on panel B so as to be adjacent to each other.
- the present invention has been made in view of such circumstances, and has as its object to provide a low-noise, inexpensive non-contact holding device and a non-contact holding device that can hold a workpiece in a non-contact state while preventing rotation of the work.
- An object of the present invention is to provide a contact holding and conveying device.
- the invention according to claim 1 provides a main body having an ejection port for ejecting a fluid, an ejection recess having a side surface gradually expanding toward the ejection port, and a position of the body facing the side face of the ejection recess.
- the supply path is integrally connected to the outer edge of the ejection port of the main body, opposes the opposing surface of the holding object facing the ejection port, and directs the flow of the fluid to the outside of the opposing surface of the holding object. And a flat end surface for guiding.
- the side surface of the ejection recess is provided with a radial ventilation guide for guiding a flow of fluid ejected from the ejection port radially outward from a center of an inner bottom surface of the ejection recess in a centrifugal direction.
- the invention according to claim 3 is characterized in that the fluid supply path includes an axial ventilation guide that guides the flow of the fluid discharged from the discharge port to the side surface of the ejection recess in the axial direction of the side surface of the ejection recess.
- the invention according to claim 4 is the non-contact method according to any one of claims 13 to 13, wherein the fluid supply path has a fluid reservoir for storing a required amount of fluid in the middle thereof. Holding device It is.
- the invention according to claim 5 is characterized in that the fluid supply passage has a plurality of fluid supply passages, and the fluid supply passages respectively communicate with a plurality of fluid supply ports formed in a radially outer peripheral surface of the main body.
- Item 1 The non-contact holding device according to item 1, wherein the force is any one of item 4.
- the discharge port is disposed in a plurality of positions symmetrically around the center of the inner bottom surface of the ejection recess, and the radial ventilation guide is formed from each of the ejection ports to the ejection port. 6.
- the invention according to claim 7 is the invention according to claim 26, wherein the radial ventilation guide and the axial ventilation guide are formed by grooves or projections. It is a non-contact holding device.
- the radial ventilation guide is configured such that the width gradually increases from each of the discharge ports toward the ejection port, while the depth gradually decreases so as to be close to the ejection port or the vicinity thereof.
- the non-contact holding device is a divergent groove that is flush with a side surface of the periphery.
- the invention according to claim 9 is the non-contact holding device according to any one of claims 118, wherein the main body is formed of quartz glass.
- the invention according to claim 10 is the non-contact device according to any one of claims 11 to 19, wherein the object to be held is any one of a glass plate, a sheet, a semiconductor wafer, and a display panel. It is a contact holding device.
- the resin includes a resin substrate, a resin sheet, and a resin film.
- the invention according to claim 11 is a fluid storage tank that is disposed in the middle of an external fluid supply path connecting the fluid supply path of the main body to a fluid supply source and stores a required amount of fluid, 11.A non-contact holding device according to claim 1, further comprising: a fluid temperature control device for controlling the temperature of the fluid stored in the storage tank. is there
- the invention according to claim 12 is characterized in that the gripper is provided on the main body and is capable of being gripped, and the stopper is provided on the main body and regulates the outward displacement of the workpiece to the outer peripheral surface. With A non-contact holding device.
- the invention according to claim 13 is the non-contact holding device according to claim 12, wherein the gripper is configured to be detachable from a movable movable body.
- the invention according to claim 14 provides a panel on which a plurality of the non-contact holding devices according to any one of claims 11 to 11 are arranged, and the panel can be reversibly moved in the horizontal direction.
- a non-contact holding / transporting device characterized by comprising a moving portion for supporting and a transportable transport device having the moving portion.
- the fluid sprayed on the holding object such as the work is not a swirling flow but a radiant flow, even a single non-contact holding device holds the work in a non-contact state in a stationary state without rotating the work. can do. Therefore, it is possible to save the number of non-contact holding devices themselves and reduce stress and vibration of the holding object.
- FIG. 1 is a cross-sectional view of a cut portion taken along line I-I of FIG. 2.
- FIG. 2 is an external overhead view of the non-contact holding device according to the first embodiment of the present invention.
- FIG. 3 is an external elevation view of the non-contact holding device shown in FIG. 2.
- FIG. 4 is a cross-sectional view of a section taken along line IV—IV in FIG. 1.
- FIG. 5 is a bottom view of the non-contact holding device shown in FIG. 1, FIG. 2, etc.
- FIG. 6 is a bottom view of another example of the radial ventilation guide according to the first embodiment of the present invention.
- FIG. 7 is a longitudinal sectional view of a first modification of the first embodiment of the present invention.
- FIG. 8 is a longitudinal sectional view of a second modification of the first embodiment of the present invention.
- FIG. 9 is a longitudinal sectional view of a third modified example of the first embodiment of the present invention.
- FIG. 10 is a longitudinal sectional view of a fourth modification of the first embodiment of the present invention.
- FIG. 11 is a longitudinal sectional view of a fifth modification of the first embodiment of the present invention.
- FIG. 12 is a perspective view of a hand-type non-contact holding device according to a second embodiment of the present invention.
- FIG. 13 is a plan view of the hand-type non-contact holding device shown in FIG.
- FIG. 14 is a plan view of a modification of the hand-type non-contact holding device shown in FIG.
- FIG. 15 is a front view of a non-contact tweezer according to a third embodiment of the present invention.
- FIG. 16 is a side view of a non-contact holding device according to a fourth embodiment of the present invention.
- FIG. 17 is a plan view of the panel-type non-contact holding / transporting device shown in FIG.
- FIG. 18 is a plan view of a conventional panel-type non-contact holding device.
- FIG. 1 is a longitudinal sectional view of a cut portion along the line I-I of FIG. 2
- FIG. 2 is an overhead view of the non-contact holding device according to the first embodiment of the present invention
- the non-contact holding device 1 is made of hard glass such as quartz glass, metal such as aluminum and stainless steel (SUS), ceramics such as alumina, synthetic resin, and the like.
- an ejection recess 3 having a required depth, for example, a truncated cone (or truncated polygonal pyramid) is formed.
- the ejection concave portion 3 is opened at one end side facing the inner bottom surface 3a as, for example, a circular ejection port 3b, and the side peripheral surface (side surface) of the ejection concave portion 3 is moved from the inner bottom surface 3a to the ejection port 3b.
- a tapered surface 3c that gradually expands is formed by a curved surface slightly bulging outward.
- the tapered surface 3c may be formed on a curved surface of the inner surface of a hanging bell, a cup, or the like, or may be formed on a linear tapered surface.
- the main body 2 has its outer peripheral edge on the side of the jet port 3b integrally connected to the flat end face 4.
- the flat end surface 4 faces an opposing surface that faces a workpiece 5 such as a silicon wafer or a semiconductor wafer, which is an example of an object to be held, in a non-contact state with a required gap.
- a workpiece 5 such as a silicon wafer or a semiconductor wafer, which is an example of an object to be held, in a non-contact state with a required gap.
- the holding object includes a glass plate (quartz plate) for LCD (liquid crystal) or PDP (plasma display 'panel). ), Including precision parts such as automobile parts, medical containers, etc., for which direct contact by hand is restricted.
- PDP (Rasma.Teisufray) PDP is a lath substrate, resin substrate et
- VDF Fluorescent display tube LED (Emission diode FED (Field emission ⁇ spray DLPCDigital Light
- the body 2 has, for example, a pair of left and right fluid supply ports 6, 6 formed in the lower outer surface thereof, and has two fluid supply paths 7, 7 communicating with the fluid supply ports 6, 6. 2 is formed inside.
- the fluid supply paths 7, 7 are concentrically and axially formed in the central axis of the main body 2 in an annular flow path 7a (see FIG. 4), and an upper end of the annular flow path 7a in FIG.
- the upper and lower oblique passages 7b and 7b communicating with the pair of left and right fluid supply ports 6 and 6, respectively, and the lower annular passage 7c communicating with the lower end of the annular passage 7a are integrally connected to each other. It is configured.
- These fluid supply paths 7 and 7 are formed integrally with the fluid supply ports 6 and 6 via a connector (not shown) so as to have a diameter smaller than the diameter of the air supply hose H forming an external fluid supply path.
- the pressure of the fluid such as air or nitrogen gas supplied from the air supply hose H to the fluid supply ports 6 and 6 can be increased by the fluid supply paths 7 and 7.
- An air compressor device as an example of a fluid supply source is connected to the air supply hose H via an air tank as an example of a fluid storage tank (not shown).
- a predetermined amount of air is stored in the air tank from the air compressor device and supplied to the fluid supply ports 6 and 6 of the non-contact holding device 1 while storing the air in a predetermined amount.
- the air tank is provided with a temperature control device for controlling the temperature of the air stored in the air tank, and the air supplied to the non-contact holding device 1 is stored in the air tank.
- the temperature of the air can be appropriately controlled to a required temperature by the temperature control device.
- a temperature control device for example, a heat pump type refrigeration cycle device may be used.
- the temperature of the air blown from the non-contact holding device 1 to the work 5 can be controlled to a temperature at which damage such as condensation or spots on the work 5 can be prevented.
- the annular flow path 7a is defined by a pair of upper and lower partition walls 8, 8 in the figure as left and right semicircular flow paths in the figure. These partition walls 8, 8 are formed over the entire length of the annular flow path 7a and the lower annular flow path 7c in the axial direction, and the air supplied to the annular flow path 7a from the pair of left and right fluid supply ports 6, 6, respectively is provided. This is defined to prevent a fluid such as nitrogen gas from joining together in the annular flow path 7a to generate a swirling flow.
- the annular flow path 7a is formed with a plurality of axial ventilation guide grooves 9, 9, 9, ..., which are axial ventilation guides, for example, on its inner peripheral surface at circumferentially symmetric positions. ing. These axial ventilation guide grooves 9, 9, ... are formed over the entire axial length of a shaft portion that connects the annular flow path 7a and the lower annular flow path 7c in the axial direction.
- the axial ventilation guide grooves 9, 9,... May have a rectangular cross section in the axial direction of the annular flow path 7a and the lower annular flow path 7c, and may have a triangular, V-shaped, polygonal, or arc shape. Further, a convex portion such as a ridge projecting inward of these flow paths 7a and 7c may be used.
- the cross-sectional shape of this projection may be triangular, V-shaped, polygonal, or arc-shaped.
- the ejection recess 3 is formed by, for example, forming a plurality of circular ejection ports 10, 10,... ing.
- Each discharge port 10 discharges a fluid such as air in the axial direction toward the tapered surface 3c at a position facing the tapered surface 3c on the inner bottom surface 3a of the ejection concave portion 3, and It is formed so as to blow air in the axial direction along the surface 3c.
- each of the discharge ports 10 communicates integrally with the lower annular flow path 7c, and the lower annular flow path 7c
- the upper end in FIG. 1 communicates integrally with the lower end of the annular flow path 7a.
- the ejection recess 3 communicates with each of the outlets 10 on its tapered surface 3c, and has a radial ventilation guide groove having a width substantially equal to the diameter of each of the outlets 10 and having a required depth. 11 are formed respectively. These radial ventilation guide grooves 11 are formed radially outward from the center of the inner bottom surface 3a in the centrifugal direction, and the air discharged from each discharge port 10 adheres to the tapered surface 3c of the ejection recess 3 so as to extend in the axial direction. The air is ventilated radially.
- these radial ventilation guide grooves 11 may be replaced with divergent grooves 12 that gradually expand in a divergent shape from the discharge ports 10 to the ejection ports 3b, as shown in FIG.
- the number of the discharge ports 10 is not limited to eight as shown in FIGS. 5 and 6, but may be 2, 3, 4, 5, 6, 7, 9, 10 or may be 11 or more.
- the discharge port 10 may have an annular shape in which the plurality of discharge ports 10 are integrally connected in the circumferential direction of the inner bottom surface 3a.
- Each divergent groove 12 gradually decreases its groove depth from the discharge port 10 side to the ejection port 3b side, and has a depth of zero at the ejection port 3b or in the vicinity thereof, that is, the adjacent divergent groove 12
- the divergent grooves 12 are formed so as to be substantially flush with the tapered surface 3c of the gap between the divergent grooves 12.
- These divergent grooves 12 are also provided radially from the center of the inner bottom surface 3a of the ejection recess 3 toward the centrifugal direction.
- the non-contact holding device 1 is configured as described above, when a fluid such as air of a predetermined pressure is supplied to the pair of left and right fluid supply ports 6, 6, the pressure is increased through the respective upper oblique paths 7b. While flowing into the upper end of the annular flow path 7a, these two airs are regulated by the partition walls 8 and 8 so as not to join. Further, the air is guided by the axial ventilation guide grooves 9 of each semicircular annular flow path 7a and flows down in the annular flow path 7a in the axial direction. Is discharged in the axial direction of the main body 2 toward the tapered surface 3c of the ejection concave portion 3.
- the radial ventilation guide groove 11 is formed in the tapered surface 3c, the air discharged toward the tapered surface 3c adheres to the tapered surface 3c due to the viscosity thereof, and the air is discharged radially. The air is guided by the ventilation guide groove 11 and is blown in the axial direction toward the ejection port 3b.
- the air of a predetermined pressure in the ejection concave portion 3 flows in the axial direction while being attached to the tapered surface 3c due to its viscosity, and emits a radial flow from the ejection port 3b to the outside as indicated by an arrow.
- the non-contact holding device 1 when the work 5 is mechanically held by a chuck or the like or when the work 5 is directly sucked and held by the suction pad, indentation or mechanical damage generated on the work 5 is prevented. can do.
- the work 5 can be held in a non-contact state in a stationary state without rotating the work 5 since the work 5 is blown with a radiant flow of air and not a swirling flow. . For this reason, it is necessary to improve the positioning accuracy when the work 5 is transported to another place while being held in a non-contact manner by the non-contact holding device 1 and is placed at a predetermined position, as compared with the case where the work 5 rotates. Power S can.
- the work 5 can be held in a non-contact state in a stationary state by one non-contact holding device 1. It is not necessary to stop the rotation of the work 5 by arranging at least two units side by side. As a result, the number of non-contact holding devices 1 to be installed can be reduced, and noise such as wind noise due to airflow collisions and cancellation when two swirling flow type non-contact holding devices are installed side by side. In addition to this, it is possible to reduce the supply flow rate or pressure of the air, and to reduce the power cost of an air compressor device (not shown) that supplies air via the air supply hose 11.
- the work 5 is held by one non-contact holding device 1. Since it can be held in a non-contact state in a stationary state, it is possible to reduce the stress and vibration generated in the work 5 by spraying two or more swirling flows having different swirling directions on the work 5 as in the above-described conventional example. Thereby, the soundness of the work 5 can be improved and the noise can be further reduced.
- the annular channels 7a are divided into semicircles by the partition walls 8, 8, so that the air supplied from the pair of left and right fluid supply ports 6, 6 can be separated from each other. It is possible to prevent the swirling flow from being merged in the annular flow path 7a and to prevent the air flowing through each semicircular annular flow path 7a from flowing along the axial ventilation guide, which is an axial ventilation guide.
- the groove 9 guides the air to flow in the axial direction, and forcibly regulates the air so that no swirling flow occurs.
- the outer peripheral edge of the ejection port 3b is formed on the flat end face 4, it is possible to improve the escape (ventilation) of the radiation flow ejected from the ejection port 3b to the work 5 side and ventilating outward. In addition to reducing the waste of air, even if the work 5 collides with the flat end face 4 for some reason, the damage can be reduced.
- the non-contact holding device 1 since the plurality of discharge ports 10 are arranged at symmetrical positions around the central axis of the main body 2, the radiation flow rate of the air blown from the ejection port 3b to the workpiece 5 or The pressure can be distributed almost uniformly in the circumferential direction of the ejection port 3b.
- the positive and negative pressure regions P , M is larger than the area on the opposite side, so that the work 5 tilts and moves so as to coincide with the center of the jet port 3b by the movement moment due to the tilt.
- the main body 2 is formed of quartz glass, no contaminant gas is emitted from the quartz glass or a very small amount thereof, so that contamination of semiconductor wafers, silicon wafers and the like cannot be prevented. Can be reduced.
- the air hose H is connected to an air supply source such as an air compressor through an air tank (not shown), the work 5 is temporarily held by the non-contact holding device 1 in a non-contact manner. Even if the operation of the air compressor stops for some reason during this time, the air stored in the air tank can be continuously supplied to the non-contact holding device 1 for a predetermined time, during which time the work 5 is mounted on the predetermined mounting table, etc. By placing it, it is possible to cope with an unexpected situation such as the work 5 being suddenly dropped and damaged.
- the fluid supply ports 6, 6 are not formed at the top end, which is one end in the axial direction of the main body 2, they are formed in the radial side peripheral surface of the main body 2, that is, in the lateral direction.
- the air supply hoses H, H are connected to the fluid supply ports 6, 6, the rising portions of the air supply hoses H, H that rise upward from the top end of the main body 2 are formed. It can be made thinner by making it lower than the overall height, including the height. For this reason, the non-contact holding device 1 can be inserted into the gap between the works 5 in the multi-stage arrangement. Alternatively, the gap between the workpieces 5 in the multi-stage arrangement can be narrowed to increase the number of stages in which the workpieces 5 are arranged.
- the axial ventilation guide grooves 9,... are formed on the inner peripheral surface side of the annular flow path 7a.
- it may be formed on the outer peripheral surface side of the annular flow path 7a, or may be formed on both the inner and outer peripheral surfaces.
- the radial ventilation guide 11 is not formed over the entire length from the discharge port 10 to the discharge port 3b, but is formed only around the discharge port 10 or only around the discharge port 3b. May be formed.
- both the axial ventilation guide groove 9 and the radial ventilation guide 11 are formed.
- the present invention can be implemented by providing only one of them.
- these two guides 9 and 11 need not be provided. That is, even when neither the axial ventilation guide groove 9 nor the radial ventilation guide 11 is provided, the discharge port 10 of the ejection recess 3 discharges air in the axial direction to the tapered surface 3c. Due to the viscosity, the tapered surface 3c can be ventilated in the axial direction.
- FIGS. 7 to 12 are longitudinal sectional views of a non-contact holding device 1A according to a first modification of the non-contact holding device 1 and a non-contact holding device 1E according to a fifth modification.
- the non-contact holding device 1A according to the first modification is the same as the non-contact holding device 1 shown in FIG. It is characterized in that one of a pair of left and right oblique flow paths 7b, 7b connected to the ports 6, 6, respectively, and a pair of partition walls 8, 8 of the annular flow path 7b shown in FIG. 4 are omitted.
- the other configuration is the same as that of the non-contact holding device 1 shown in FIG.
- the non-contact holding device 1A it is possible to obtain almost the same operation and effects as those of the non-contact holding device 1 shown in FIG. Since the passages 7b, 7b and one of the pair of partition walls 8, 8 are omitted, the configuration can be simplified, and the ease of processing can be improved accordingly.
- the pair of partition walls 8 and 8 of the annular flow path 7a is omitted, there is a possibility that a swirl flow of air is generated in the annular flow path 7a, but the swirl flow is not affected by the axial ventilation.
- the radial ventilation guide groove 11 of the tapered surface 3c can further prevent or reduce the swirling flow of air.
- the non-contact holding device 1B according to the second modification shown in FIG. 8 is different from the non-contact holding device 1 shown in FIG. 1 in that one fluid supply port 6 is formed in the center of the upper end portion of the main body 2 in the drawing. Then, the air from one fluid supply port 6 is divided into a plurality of axial flow paths 7d, 7d,..., And a plurality of discharge ports 10, 10,. It is characterized in that it is configured to discharge from the tapered surface 3c.
- the non-contact holding device 1 C according to the third modification shown in FIG. 9 is different from the second modification shown in FIG.
- the non-contact holding device IB is characterized in that a plurality of fluid supply ports 6 are juxtaposed in the top view of the main body 2.
- the non-contact holding device 1D according to the fourth modified example shown in FIG. 10 is characterized mainly in that an air reservoir 13 having, for example, an elliptical spherical shape is provided in the main body 2.
- the air reservoir 13 is interposed in the middle of an air supply channel 7 that communicates one fluid supply port 6 with a plurality of discharge ports 10, 10,.
- the air reservoir 13 communicates with the tip of the lateral flow path 7e communicating with one fluid supply port 6, while communicating with the merging flow path 7g of the multi-branch branch flow paths 7f, 7f.
- the ends (lower ends in FIG. 10) of the flow paths 7f, 7f communicate with the discharge ports 10, 10,.
- the non-contact holding device 1 D since the air reservoir 13 is provided, the pulsation of the air supplied from the fluid supply port 6 to the air supply passage 7 is prevented or reduced. As a result, the static pressure can be recovered, and when the operation of the air compressor device is stopped, air can be continuously supplied from the air reservoir 13 to the discharge port 10 for a predetermined time. Thus, simultaneously with the stoppage of the operation of the air compressor device, the holding of the work 5 which has been held until now can be prevented from being stopped and dropped.
- the non-contact holding device 1E according to the fifth modification shown in FIG. 11 is different from the non-contact holding device 1D according to the fourth modification shown in FIG.
- the feature is that the mouth 6 is provided as a pair of left and right in FIG.
- this non-contact holding device 1E also includes the air reservoir 13, it is possible to obtain substantially the same operation and effect as the non-contact holding device 1D shown in Fig. 10.
- the number of the fluid supply path 7 of the non-contact holding device 1B-1E and the number of the discharge ports 10 communicating therewith may be two or more.
- Each discharge port 10 is located at the center of the inner bottom surface 3a of the ejection concave portion 3. It should be provided in a symmetrical position.
- FIG. 12 is a perspective view showing a use state of the hand-type non-contact holding device 21 according to the second embodiment of the present invention.
- the hand-type non-contact holding device 21 includes a plurality of ones of the non-contact holding devices 1, 1A and 1E, for example, one of them, disposed on one surface of a substrate 22 made of a substantially U-shaped thin plate, for example. ⁇
- the work 5 such as a semiconductor wafer or a silicon wafer housed in the c-cassette 23 is held out of contact and taken out or inserted outside.
- the substrate 22 includes a base end portion 22a and a holding portion formed in a substantially U-shape by integrally linking the branch portions 22b and 22c branched from the base end portion 22a into two branches. ing. On one flat surface (upper surface in FIG. 12) of these branch portions 22b, 22c, a plurality of the above-mentioned non-contact holding devices 1 are provided, and their ejection ports 3b are provided at symmetrical positions toward the upper surface in FIG. It is formed to a thickness that can be removed from the gap between the adjacent works 5 stacked in the wafer cassette 23.
- the substrate 22 has, for example, four convex stoppers 24, 24, 24, 24 projecting from corners on a holding surface (upper surface in FIG. 12) for holding the work 5. .
- each stopper 24 is disposed so as to surround and support the outer peripheral surface of the work piece 5 with a slight play at, for example, four places at equal circumferential positions thereof.
- a grip portion 25 is integrally or integrally formed as a grip portion on the outer surface of the base end portion 22a of the substrate 22. As shown in FIG. 13, the grip portion 25 has air inlets 26, 26 for connecting two air supply hoses H, H, respectively, on the side surface of the base.
- Each of the air introduction ports 26, 26 is connected to the fluid supply port 6 of each non-contact holding device 1 via two air supply paths 27, 27 formed inside the U-shaped substrate 22, respectively. Has been done.
- the grip portion 25 is formed in a size and a shape that can be gripped by an operator's hand.
- the grip section 25 may be configured to be detachable from a movable arm of a movable robot, which is an example of a moving body (not shown).
- the grip section 25 includes an operation section (not shown) for operating a control valve for controlling the amount of air supplied to each non-contact holding device 1.
- the wafer cassette 23 has one side surface of a rectangular cylindrical casing 23a for accommodating wafers made of silicon or the like opened as a wafer outlet, while the wafer can be detached from the inner surface of the cassette casing 23a.
- a plurality of accommodating grooves 23b for accommodating are formed at a required pitch in the axial direction.
- the required work 5 can be manually removed from the wafer cassette 23 by the hand-type non-contact holding device 21 and inserted. Also, by attaching the grip portion 25 of the hand-type non-contact holding device 21 to the arm of the robot, the work 5 can be transferred by the robot while the work 5 is held in a non-contact manner by the hand-type non-contact holding device 21. I can do it.
- Each of the non-contact holding devices 1 provided in the hand-type non-contact holding device 21 has a radiant flow in which the air jetted from the jet port 3b is not a swirling flow as described above. Since it is not necessary to take care that the air swirling flows of the non-contact holding devices 1 arranged adjacent to each other on 22 are opposite to each other, the hand-type non-contact holding device 21 is easy to manufacture. The same operational effects as those of the non-contact holding device 1, such as improvement and reduction of the vibration and noise of the work 5, can be obtained.
- the hand-type non-contact holding device 21 is, as shown in the hand-type non-contact holding device 21A shown in FIG. 14, a cross plate for integrally connecting the longitudinal middle portions of the pair of left and right branch portions 22b and 22c.
- the non-contact holding device 1 may be provided at the center of the cross plate 22d.
- the non-contact holding device 1 can be provided in a portion corresponding to a substantially central portion of the work 5, so that the non-contact holding of the work 5 can be stabilized. Both reliability and reliability can be improved. Further, the substrate 22 may be formed in a simple rectangular or circular shape.
- FIG. 15 is a front view of the non-contact tweezers 28 according to the third embodiment of the present invention.
- This non-contact tweezers 28 is configured such that one end of a small rod-shaped main body 29 is formed as a grip portion 29a which can be gripped by a finger of an operator's hand or the like, and the non-contact holding device 1, 1 A — 1E of any force ⁇ For example, 1 is arranged. Further, on one surface of the main body 29, a plurality of stop pins 30, 30,... Which diametrically hold the side surfaces at both ends in the diameter direction of the work 5 are arranged.
- an air supply hose H connected to an air inlet (not shown) is connected, and the air inlet is connected to a fluid supply port of the non-contact holding device 1 (not shown).
- the flow path is formed inside the main body 29. Further, the main body 29 is provided with an operation unit (not shown) for operating a control valve for controlling the amount of air supplied from the air supply hose H to the non-contact holding device 1.
- a holding target such as a small work 5 such as a small-diameter silicon wafer, a semiconductor wafer, or a small precision component can be non-contact-held and conveyed.
- the size and shape of the object to be held in a non-contact manner can be variously adjusted. That can be S.
- the main body 29 of the non-contact tweezers 28 may be formed in a pencil shape by substantially forming the same shape and dimensions as a writing instrument such as a pencil or a mechanical pencil. The portion may be bent by a required angle, and the non-contact holding device 1 may be provided on the tip surface.
- FIG. 16 is a side view of a non-contact holding and conveying device 31 according to a fourth embodiment of the present invention.
- the non-contact holding and conveying device 31 can move reciprocally on a moving table 33 as a moving unit that supports the panel-type non-contact holding device 32 shown in FIG. 17 so as to be movable in a horizontal direction, and on a conveying path 34 such as a belt conveyor.
- a conveying path 34 such as a belt conveyor.
- Shuttle transported to the airport or this transport path
- a transfer device 35 such as a self-propelled device that runs.
- the panel-type non-contact holding device 32 includes, for example, a plurality of one of the non-contact holding devices 1, 1A-1E on one surface of a rectangular panel substrate 32a. For example, they are arranged in three rows and three columns, and are configured to hold the work 5 in a non-contact manner.
- the moving table 33 has a panel-type non-contact holding device 32 detachably mounted thereon, and is mounted on a transfer device 35 so as to be movable in a horizontal direction.
- the panel-type non-contact holding device 32 is moved to the position, the panel-type non-contact holding device 32 is moved horizontally by sliding or the like to move the panel-type non-contact holding device 32 in the horizontal direction. 5 is transferred to the next process such as the next processing step and inspection step.
- the work 5 can be conveyed to the next process delivery place by the conveying device 35, and the panel type non-contact holding device 32 is horizontally moved by the moving table 33. By moving in the direction, the work 5 can be delivered to the next process.
- the moving table 33 is returned to the original position of the transport device 35, and then the transport device 35 is transported on the transport path to return to the original position, and the panel is returned to the original position.
- the workpiece 5 is held in a non-contact manner by the shape non-contact holding device 32, and is again moved to the delivery place of the next process by the transfer device 35.
- the plurality of works 5 can be transported to a required place such as the next process in a state where they are held in a non-contact state.
- the non-contact holding device 1, 1A-1E according to the present invention is used as the non-contact holding device for non-contact holding the workpiece 5. Therefore, almost the same operation and effects as those of the non-contact holding devices 1, 1A-1E can be obtained.
- the transfer path 34 may be a monorail, for example, installed on a ceiling or the like in a factory.
- the transfer device 35 is configured as a gondola reciprocating on the monorail.
- the work 5 is held downward in a non-contact manner by the panel-type non-contact holding device 32, but the panel-type non-contact holding device 32 holds the work 5 in a non-contact manner without dropping the work 5 downward.
- the workpiece 5 can be held in a non-contact manner even when it is vertical.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05719423A EP1722410A4 (en) | 2004-03-03 | 2005-02-23 | CONTACTLESS GRIPPING DEVICE AND GRIPPING DEVICE AND CONTACTLESS TRANSPORT |
US10/551,453 US7510226B2 (en) | 2004-03-03 | 2005-02-23 | Non-contact holder device and non-contact holding and conveying device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-059660 | 2004-03-03 | ||
JP2004059660A JP4437415B2 (ja) | 2004-03-03 | 2004-03-03 | 非接触保持装置および非接触保持搬送装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005086225A1 true WO2005086225A1 (ja) | 2005-09-15 |
Family
ID=34917983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/002915 WO2005086225A1 (ja) | 2004-03-03 | 2005-02-23 | 非接触保持装置および非接触保持搬送装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7510226B2 (ja) |
EP (1) | EP1722410A4 (ja) |
JP (1) | JP4437415B2 (ja) |
KR (1) | KR100728646B1 (ja) |
CN (1) | CN100433288C (ja) |
TW (1) | TW200538373A (ja) |
WO (1) | WO2005086225A1 (ja) |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100916673B1 (ko) * | 2006-10-02 | 2009-09-08 | 에스엠씨 가부시키 가이샤 | 비접촉 반송장치 |
US7690869B2 (en) | 2006-10-02 | 2010-04-06 | Smc Kabushiki Kaisha | Non-contact transport apparatus |
JP2009099357A (ja) * | 2007-10-16 | 2009-05-07 | Honda Motor Co Ltd | 燃料電池セル積層方法および燃料電池セル積層装置 |
WO2009139540A3 (ko) * | 2008-05-13 | 2010-01-07 | 한국뉴매틱 주식회사 | 비접촉식 진공패드 |
Also Published As
Publication number | Publication date |
---|---|
TWI300758B (ja) | 2008-09-11 |
EP1722410A4 (en) | 2007-11-21 |
US20060290151A1 (en) | 2006-12-28 |
EP1722410A1 (en) | 2006-11-15 |
KR100728646B1 (ko) | 2007-06-15 |
TW200538373A (en) | 2005-12-01 |
US7510226B2 (en) | 2009-03-31 |
KR20060038359A (ko) | 2006-05-03 |
JP2005251948A (ja) | 2005-09-15 |
JP4437415B2 (ja) | 2010-03-24 |
CN1765013A (zh) | 2006-04-26 |
CN100433288C (zh) | 2008-11-12 |
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