WO2005073692A1 - 基板検査装置と基板検査方法と回収治具 - Google Patents
基板検査装置と基板検査方法と回収治具 Download PDFInfo
- Publication number
- WO2005073692A1 WO2005073692A1 PCT/JP2005/001562 JP2005001562W WO2005073692A1 WO 2005073692 A1 WO2005073692 A1 WO 2005073692A1 JP 2005001562 W JP2005001562 W JP 2005001562W WO 2005073692 A1 WO2005073692 A1 WO 2005073692A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- base
- lifter
- internal space
- jig
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 355
- 238000011084 recovery Methods 0.000 title claims abstract description 99
- 238000007689 inspection Methods 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000007788 liquid Substances 0.000 claims abstract description 31
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 51
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 51
- 235000012431 wafers Nutrition 0.000 description 30
- 239000012535 impurity Substances 0.000 description 28
- 239000007864 aqueous solution Substances 0.000 description 23
- 239000010408 film Substances 0.000 description 19
- 239000000243 solution Substances 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000003947 neutron activation analysis Methods 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000003260 vortexing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N2001/028—Sampling from a surface, swabbing, vaporising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/38—Diluting, dispersing or mixing samples
- G01N2001/383—Diluting, dispersing or mixing samples collecting and diluting in a flow of liquid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Definitions
- the substrate rotating device holds the horizontal lower surface of the substrate on the holding surface from below and rotates it around a vertical rotation center axis
- the base has a basic structure
- the disk main body of the disk is The disk is supported on the base so as to be rotatable in the horizontal direction about the rotation center axis, and three lift cams of the disk are fixed to three places on the upper circumference of the disk body, respectively, and the lift cams are centered on the rotation center axis.
- the lifter body of the lifter has a support surface on which a substrate can be placed, and a lifter body of the lifter is guided movably in the vertical direction by the base.
- the periphery of the edge of the first through hole at the lower end of the cylindrical portion is an annular horizontal surface, the liquid droplet that has come out from the first through hole is pulled by the adhesive force of the horizontal surface, and the liquid droplet is It is possible to prevent the recovery jig from leaking downward through the through hole.
- FIG. 11 is a sectional view of a third type of recovery jig according to the embodiment of the present invention.
- the disk plate-shaped member 61 is a plate-shaped member, and is supported on the upper surface of the base plate-shaped member at three locations on the circumference around the lower rotation center axis 0 so as to be movable in the horizontal direction.
- the circumferential guide 62 is fixed to the disk plate-shaped member 61 and is formed on the outer peripheral surface of the base cylindrical portion 52. 2005/001562
- the wafer holders 72 are members that are respectively disposed at three positions on the circumference of the support surface N of the lifter plate member 71 and are detachably fixed. The edges of the substrate placed on the support surface are brought into contact with the three wafer holders 72 from the periphery, and the substrate 1 is positioned on the lifter 170.
- the wafer holder 72 fits into a hole provided in the lifter plate member 71. By selecting the hole into which the wafer holder 72 fits, it can handle wafers of various diameters. it can.
- Fig. 8 (A) shows the structure of the first type collection jig 30a fitted to the collection jig folder 24.
- the substrate previously exposed to the atmosphere of the aqueous solution of HF (hydrogen fluoride) is placed on the support surface N of the lifter 170.
- a droplet of HF (hydrogen fluoride) aqueous solution is attached to the surface of the substrate 1.
- the operator integrally removes the container 41 and the collection jig 30a from the board inspection apparatus.
- the collection jig folder 24 corresponds to the second type of collection jig 30b.
- the substrate is a silicon wafer.
- the silicon oxide film on the surface of the silicon wafer has a hydrophilic property with respect to an aqueous solution of HF (hydrogen fluoride).
- the disc 60 is guided by the base 50 and rotates around the rotation center axis.
- Lifter The lower end of the follower 74 moves from the horizontal plane L to the inclined plane K along the cam surface of the lift cam 63.
- the frictional force at the contact point rotates the ribter 70 around the center axis of rotation, and moves the backlash between the base vertical guide 53 and the lifter-vertical guide 73 to one side.
- FIG. 9B shows a recovery jig 30 b driven by the driving device 20.
- the drive mechanism 20 moves the collection jig 30 b above the collection jig setting device 40.
- the operator integrally removes the container 41 and the recovery jig 30b from the board inspection device.
- the droplet 4 is transferred to the container 41, and the amount of impurities contained in the droplet is measured. Next, a case where a third type of recovery jig 30c is used will be described.
- the collection jig folder 24 corresponds to the third type of collection jig 30c.
- the lifter 70 is positioned above.
- the lower end of the lifter-follower 74 is supported on the horizontal surface of the rib cam.
- the disc 60 is guided by the base 50 and rotates around the rotation center axis.
- the lower end of the lifter follower 74 moves from the horizontal plane L to the inclined plane K along the cam surface of the lift cam 63.
- the frictional force at the contact point rotates the ribter 70 around the center axis of rotation, and moves the backlash between the base vertical guide 53 and the lifter-vertical guide 73 to one side.
- Droplets 4 are stored in the internal space H. Part of the droplet 4 protrudes into the first through hole 32c. (Substrate scanning process)
- the operator integrally removes the container 41 and the recovery jig 30 c from the board inspection apparatus.
- a step is provided below the flange of the recovery jig so that the upper end of the container fits, so that the container and the recovery jig can be used as a single unit.
- a horizontally extending groove was provided in the cylindrical part of the first type of recovery jig, and the groove communicated with the internal space and atmosphere, so the drive mechanism stored in the internal space protruding from the groove. Since the edge of the substrate is brought into contact with a part of the formed droplet, the droplet can be attached to the edge of the substrate and moved along the edge.
- the lifter is constrained by the base and guided movably in the vertical direction while being supported by the inclined surfaces of the cam lifts arranged at three places in the circumferential direction of the disk, when the disk is rotated, Since the lifter moves up and down, the board is placed on the support surface of the lifter at the upper position, and when the lifter is lowered, the board can be transferred to the holding surface of the board rotating device, and the friction force moves the lifter to Since the push is performed in one rotation direction as the center, the guide play between the disc and the lifter is moved toward the negative side, and the positioning accuracy of the substrate is improved.
- a cylindrical member was provided on the base, and a bale positioning mechanism made of a push screw for the cylindrical member was provided, so that the gap between the cylindrical member and the base of the substrate rotating device could be adjusted.
- the base can be positioned with high accuracy by a simple structure.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/584,822 US7685895B2 (en) | 2004-01-29 | 2005-01-27 | Substrate inspection device, substrate inspection method, and recovery tool |
EP05704377A EP1710555A4 (en) | 2004-01-29 | 2005-01-27 | SUBSTRATE INSPECTION DEVICE, SUBSTRAIN SPECIFICATION METHOD AND TOOL FOR OBTAINING |
JP2005517572A JP4664818B2 (ja) | 2004-01-29 | 2005-01-27 | 基板検査装置と基板検査方法と回収治具 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004022267 | 2004-01-29 | ||
JP2004-022267 | 2004-01-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005073692A1 true WO2005073692A1 (ja) | 2005-08-11 |
Family
ID=34823824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/001562 WO2005073692A1 (ja) | 2004-01-29 | 2005-01-27 | 基板検査装置と基板検査方法と回収治具 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7685895B2 (ja) |
EP (1) | EP1710555A4 (ja) |
JP (1) | JP4664818B2 (ja) |
KR (1) | KR100906916B1 (ja) |
CN (2) | CN1879014A (ja) |
HK (1) | HK1136090A1 (ja) |
WO (1) | WO2005073692A1 (ja) |
Cited By (4)
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JP2011128033A (ja) * | 2009-12-18 | 2011-06-30 | Ias Inc | 基板分析用ノズル及び基板分析方法 |
JP2017083334A (ja) * | 2015-10-29 | 2017-05-18 | 信越半導体株式会社 | 不純物の回収方法及び不純物の分析方法並びに液滴回収装置 |
CN108962813A (zh) * | 2018-09-06 | 2018-12-07 | 重庆科技学院 | 一种可调式芯片卡具 |
CN114029775A (zh) * | 2021-12-09 | 2022-02-11 | 济南昊中自动化有限公司 | 一种具有翻转功能的四工位回转台 |
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US20100307108A1 (en) * | 2007-01-17 | 2010-12-09 | John Richard Sink | Devices for Capping Vials Useful in System and Method for Dispensing Prescriptions |
JP5133573B2 (ja) | 2007-02-02 | 2013-01-30 | 東京エレクトロン株式会社 | 載置装置 |
US8444130B2 (en) * | 2008-09-30 | 2013-05-21 | Parata Systems, Llc | Devices for capping vials useful in system and method for dispensing prescriptions |
JP5563318B2 (ja) * | 2009-03-02 | 2014-07-30 | キヤノンアネルバ株式会社 | 基板支持装置、基板処理装置、基板支持方法、基板支持装置の制御プログラム及び記録媒体 |
DE102009026186A1 (de) * | 2009-07-16 | 2011-01-27 | Hseb Dresden Gmbh | Vorrichtung und Verfahren zur Kanten- und Oberflächeninspektion |
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DE102012100825A1 (de) * | 2011-12-01 | 2013-06-06 | solar-semi GmbH | Vorrichtung zum Bearbeiten eines Substrats und Verfahren hierzu |
WO2015179387A1 (en) * | 2014-05-21 | 2015-11-26 | Brewer Science Inc. | Multi-size adaptable spin chuck system |
CN107567652A (zh) * | 2015-03-12 | 2018-01-09 | 非视觉污染分析科学技术有限公司 | 基板污染物分析装置及基板污染物分析方法 |
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-
2005
- 2005-01-27 WO PCT/JP2005/001562 patent/WO2005073692A1/ja not_active Application Discontinuation
- 2005-01-27 JP JP2005517572A patent/JP4664818B2/ja active Active
- 2005-01-27 CN CNA2005800012192A patent/CN1879014A/zh active Pending
- 2005-01-27 EP EP05704377A patent/EP1710555A4/en not_active Withdrawn
- 2005-01-27 CN CN200910137844XA patent/CN101540278B/zh active Active
- 2005-01-27 KR KR1020067012957A patent/KR100906916B1/ko active IP Right Grant
- 2005-01-27 US US10/584,822 patent/US7685895B2/en active Active
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2010
- 2010-03-16 HK HK10102700.5A patent/HK1136090A1/xx unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05283498A (ja) * | 1991-11-12 | 1993-10-29 | Matsushita Electric Ind Co Ltd | 半導体基板表面不純物回収装置およびその使用方法 |
JPH05256749A (ja) * | 1992-03-12 | 1993-10-05 | Piyuaretsukusu:Kk | 分析前処理器具及び該器具を用いた前処理方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011128033A (ja) * | 2009-12-18 | 2011-06-30 | Ias Inc | 基板分析用ノズル及び基板分析方法 |
JP2017083334A (ja) * | 2015-10-29 | 2017-05-18 | 信越半導体株式会社 | 不純物の回収方法及び不純物の分析方法並びに液滴回収装置 |
CN108962813A (zh) * | 2018-09-06 | 2018-12-07 | 重庆科技学院 | 一种可调式芯片卡具 |
CN108962813B (zh) * | 2018-09-06 | 2023-07-18 | 重庆科技学院 | 一种可调式芯片卡具 |
CN114029775A (zh) * | 2021-12-09 | 2022-02-11 | 济南昊中自动化有限公司 | 一种具有翻转功能的四工位回转台 |
Also Published As
Publication number | Publication date |
---|---|
JP4664818B2 (ja) | 2011-04-06 |
KR100906916B1 (ko) | 2009-07-08 |
KR20070005930A (ko) | 2007-01-10 |
CN1879014A (zh) | 2006-12-13 |
CN101540278B (zh) | 2011-06-15 |
US7685895B2 (en) | 2010-03-30 |
EP1710555A4 (en) | 2010-09-29 |
HK1136090A1 (en) | 2010-06-18 |
CN101540278A (zh) | 2009-09-23 |
US20090151480A1 (en) | 2009-06-18 |
JPWO2005073692A1 (ja) | 2007-09-13 |
EP1710555A1 (en) | 2006-10-11 |
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