CN108962813A - 一种可调式芯片卡具 - Google Patents
一种可调式芯片卡具 Download PDFInfo
- Publication number
- CN108962813A CN108962813A CN201811039625.3A CN201811039625A CN108962813A CN 108962813 A CN108962813 A CN 108962813A CN 201811039625 A CN201811039625 A CN 201811039625A CN 108962813 A CN108962813 A CN 108962813A
- Authority
- CN
- China
- Prior art keywords
- plate
- fixed
- bottom rail
- intermediate plate
- movable plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Jigs For Machine Tools (AREA)
- Clamps And Clips (AREA)
Abstract
本发明提供了一种可调式芯片卡具,由底轨、控制台、加工台、载物夹片,四部分组成。底轨是一个上表面呈矩形,在顶表面上加工有滑动轨道的条形的长方体底座。控制台的底面加工嵌入安装有与底轨的水平方向十字垂直的横轨,控制台通过上下两端头分别安装在横轨和底轨的滑块与底轨连接成一体。控制台内部中心位置安装有升降柱,升降柱的顶端头与加工台牢固连接。加工台通过台面前后两边的2个夹片固定条安装或拆卸载物夹片。发明的有益效果是不仅能对不同芯片进行固定,还方便移动,能减少操作时间,提高效率;更加容易精确找准与准确读数,确保了加工精密度。
Description
技术领域
本发明涉及一种芯片卡具,具体是一种用于在光刻机光刻芯片时,用于固定芯片的可调式芯片卡具。
技术背景
目前,由于很多光刻机没有固定的卡具,在光刻芯片时,没有卡具的固定,在操作的过程中可能不小心碰到芯片基板,这样就会使光刻的位置发生改变,甚至导致光刻失败而重新操作,影响加工时间、效率、质量。其次,芯片的形状和尺寸大小多样,目前的卡具难于适应各种形状和大小尺寸的芯片的固定。再有,某些芯片需要多次光刻,没有卡具的固定将很难将精确的把芯片放回原来位置。
因此,需要一种新型的卡具来解决这些问题,它既可以固定芯片,又可以使芯片进行移动。
发明内容
本发明卡具,目的在于设计一种新型的卡具,该卡具不仅能对不同芯片进行固定,还方便移动,能减少操作时间,提高效率。
本发明的技术方案为:一种可调式芯片卡具,由底轨、控制台、加工台、载物夹片,四部分组成。其特征在于:所述底轨是一个上表面呈矩形,在顶表面上加工有滑动轨道的条形的长方体底座。控制台的底面加工嵌入安装有与底轨的水平方向十字垂直的横轨,控制台通过上下两端头分别安装在横轨和底轨的滑块与底轨连接成一体。控制台内部中心位置安装有升降柱,升降柱的顶端头与加工台牢固连接。加工台通过台面前后两边的2个夹片固定条安装或拆卸载物夹片。发明能够保证卡具前后、左右、上下灵活调整三维坐标位置。所述载物夹片是尺寸略小于加工台台面的一个矩形薄片,矩形的两个长边能够与2个夹片固定条配合固定或拆卸掉载物夹片。发明能够方便更换载物夹片。一种常规的载物夹片,在矩形薄片的两个长边和两个短边上,加工有一对夹片纵移动板和一对夹片横移动板,本发明适用于这种常规的载物夹片,并能够方便安装。一种适用多规格芯片的载物夹片,在矩形薄片的一个长边,从长边一端开始的一段长度上,加工有一段横固定板,横固定板只加工了一段的长度,没有整个边都是,目的是为了与弧形移动板配合。横固定板的傍边加工有一个水平方向相互垂直的纵固定板,在纵固定板上安装有一个弧形开口对着横固定板的弧形移动板。加工的一段横固定板的长度与弧形移动板的长度相等,保证了弧形移动板和横固定板的充分配合。弧形移动板的形状像镰刀有直柄和弧形开口,弧形开口的是以中间一个凹型的小矩形为中心,依次以小矩形的大小,两边对称呈阶梯状、平行递增小矩形形成的弧形台阶齿的形状。该发明设计能够适用矩形或圆形的不同尺寸大小的芯片。横固定板与弧形移动板中间的凹型小矩形对应,在对着弧形移动板的一边的中心位置处加工有中间凹边,中间凹边的设计便于圆形芯片的固定。并且横固定板在对着弧形移动板的一边上,与边平齐安装有水平放置、竖直端对着弧形移动板的L形固定条。L形固定条能够沿着横固定板左右移动和固定。L形固定条发明是便于夹持固定小尺寸的矩形或圆形的芯片,L形固定条的竖直段能够深入弧形移动板的弧形开口内部。
上述技术方案中,所述弧形移动板的直柄上加工有移动卡槽;所述纵固定板,加工有配合移动卡槽的、沿着纵固定板前后纵向移动或横向移动的装置。发明保证了通过移动卡槽与纵固定板配合,弧形移动板能够在载物夹片的矩形薄片上前后或左右移动或固定。所述纵固定板到傍边的横固定板的距离,大于等于弧形移动板直柄的长度尺寸。所述横固定板的纵向前后宽度大于等于弧形移动板直柄的宽度度尺寸。尺寸发明保证了弧形移动板在夹持小尺寸芯片时,其直柄能够进入横固定板端头与纵固定板的空隙处。所述L形固定条是通过横固定板对着弧形移动板的一边上加工的L形固定条卡槽移动和固定的。所述L形固定条数量是1个或2个。发明保证了灵活夹持小尺寸的不同形状的芯片。
上述技术方案中,所述夹片固定条通过2个夹片固定条上的插槽或上紧螺丝,安装或拆卸载物夹片。载物夹片安装和拆卸的方式不限于这两种方式。
上述技术方案中,所述横轨的表面与控制台底面的下表面平齐,有利于滑块和控制台的连接以及运行的稳定。所述底轨、横轨和升降柱都有标尺刻度,保证了卡具加工台的三维坐标的建立。所述控制台上安装有纵坐标显示器、高度显示器、横坐标显示器、底轨固定按钮、升降柱固定按钮、横轨固定按钮。所述滑块内部安装有锁紧底轨和横轨的机械装置,并能够通过底轨固定按钮和横轨固定按钮触发。所述控制台内部安装有锁紧升降柱的机械装置,并能够通过升降柱固定按钮触发。触发的形式有多种,比如机械传动方式触发,电动方式触发。发明保证了卡具加工台的三维坐标位置的灵活调整和固定。
与现有技术相比,本发明具有下列有益效果:该卡具结构灵活,操作简便即可对加工工件实现固定与平面内的移动。不仅缩短了操作时间,提高了效率,而且精确找准与准确读数也更加容易,确保了加工精密度。
附图说明
图1为本发明的主视结构示意图。
图2为本发明的右视结构示意图。
图3为本发明的控制台的底部仰视示意图。
图4为本发明的没安装载物夹片的俯视示意图。
图5为本发明的一种常规载物夹片的俯视示意图。
图6为本发明的加工台安装一种常规载物夹片的俯视示意图。
图7为本发明的一种多规格载物夹片夹持方形芯片的俯视示意图。
图8为本发明的一种多规格载物夹片夹持圆形芯片的俯视示意图。
图9为本发明的一种多规格载物夹片夹持小圆形芯片的俯视示意图。
图10为本发明的安装一种多规格载物夹片的俯视示意图。
图11为本发明的立体结构示意图。
图中:1.底轨;2.控制台;3.纵坐标显示器;4.加工台;5.载物夹片;6.升降柱;7.高度显示器;8.横坐标显示器;9.滑块;10.底轨固定按钮;11.升降柱固定按钮;12.横轨固定按钮;13.横轨;14.夹片固定条;15.夹片横移动板;16.夹片纵移动板;17.纵固定板;18.弧形移动板;19.横固定板;20.移动卡槽;21.小矩形;22. L形固定条卡槽;23.中间凹边;24.L形固定条;25.直柄;26.芯片。
具体实施例
参照图1至图11的形状结构。一种可调式芯片卡具,由底轨1、控制台2、加工台4、载物夹片5,四部分组成。其特征在于:所述底轨1是一个上表面呈矩形,在顶表面上加工有滑动轨道的条形的长方体底座。控制台2的底面加工嵌入安装有与底轨1的水平方向十字垂直的横轨13,控制台2通过上下两端头分别安装在横轨13和底轨1的滑块9与底轨1连接成一体。控制台2内部中心位置安装有升降柱6,升降柱6的顶端头与加工台4牢固连接。加工台4通过台面前后两边的2个夹片固定条14安装或拆卸载物夹片5。所述载物夹片5是尺寸略小于加工台4台面的一个矩形薄片,矩形的两个长边能够与2个夹片固定条14配合固定或拆卸掉载物夹片5。
一种常规的载物夹片5,在矩形薄片的两个长边和两个短边上,加工有一对夹片纵移动板16和一对夹片横移动板15。一种适用多规格芯片的载物夹片5,在矩形薄片的一个长边上,从长边一端开始的一段长度上,加工有横固定板19,横固定板19的傍边加工有一个水平方向相互垂直的纵固定板17,在纵固定板17上安装有一个弧形开口对着横固定板19的弧形移动板18。加工的一段横固定板19的长度与弧形移动板18的长度相等。弧形移动板18的形状像镰刀有直柄25和弧形开口,弧形开口的是以中间一个凹型的小矩形21为中心,依次以小矩形21的大小,两边对称呈阶梯状、平行递增小矩形21形成的弧形台阶齿的形状。横固定板19与弧形移动板18中间的凹型小矩形21对应,在对着弧形移动板18的一边的中心位置处加工有中间凹边23,并且横固定板19在对着弧形移动板18的一边上,与边平齐安装有水平放置、竖直端对着弧形移动板18的L形固定条24。L形固定条24能够沿着横固定板19左右移动和固定。
进一步的,所述弧形移动板18的直柄25上加工有移动卡槽20。所述纵固定板17,加工有配合移动卡槽20沿着纵固定板17前后纵向移动,或者横向移动的装置。弧形移动板18通过移动卡槽20与纵固定板17配合,能够在载物夹片5的矩形薄片上前后或左右移动或固定。所述纵固定板17到傍边的横固定板19的距离,大于等于弧形移动板18直柄25的长度尺寸。所述横固定板19的纵向前后宽度大于等于弧形移动板18直柄25的宽度尺寸。所述L形固定条24是通过横固定板19对着弧形移动板18的一边上加工的L形固定条卡槽22移动和固定的。所述L形固定条24数量是1个或2个。
进一步的,所述夹片固定条14通过2个夹片固定条14上的插槽或上紧螺丝,安装或拆卸载物夹片5。
进一步的,所述横轨13的表面与控制台2底面的下表面平齐;所述底轨1、横轨13和升降柱6都有标尺刻度;所述控制台2上安装有纵坐标显示器3、高度显示器7、横坐标显示器8、底轨固定按钮10、升降柱固定按钮11、横轨固定按钮12;所述滑块9内部安装有锁紧底轨1和横轨13的机械装置,并能够通过底轨固定按钮10和横轨固定按钮12触发;所述控制台2内部安装有锁紧升降柱6的机械装置,并能够通过升降柱固定按钮11触发。
最后说明的是,以上实施例仅用以说明本发明的技术方案而非限制,尽管参照较佳实施例对本发明进行了详细说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的宗旨和范围,其均应涵盖在本发明的权利要求范围当中。
Claims (4)
1.一种可调式芯片卡具,由底轨(1)、控制台(2)、加工台(4)、载物夹片(5)四部分组成;其特征在于:所述底轨(1)是一个上表面呈矩形,在顶表面上加工有滑动轨道的条形的长方体底座;控制台(2)的底面加工嵌入安装有与底轨(1)的水平方向十字垂直的横轨(13),控制台(2)通过上下两端头分别安装在横轨(13)和底轨(1)的滑块(9)与底轨(1)连接成一体;控制台(2)内部中心位置安装有升降柱(6),升降柱(6)的顶端头与加工台(4)牢固连接;加工台(4)通过台面前后两边的2个夹片固定条(14)安装或拆卸载物夹片(5);所述载物夹片(5)是尺寸略小于加工台(4)台面的一个矩形薄片,矩形的两个长边能够与2个夹片固定条(14)配合固定或拆卸掉载物夹片(5);一种常规的载物夹片(5),在矩形薄片的两个长边和两个短边上,加工有一对夹片纵移动板(16)和一对夹片横移动板(15);一种适用多规格芯片的载物夹片(5),在矩形薄片的一个长边,从长边一端开始的一段长度上,加工有一段横固定板(19);横固定板(19)的傍边加工有一个水平方向相互垂直的纵固定板(17),在纵固定板(17)上安装有一个弧形开口对着横固定板(19)的弧形移动板(18);加工的一段横固定板(19)的长度与弧形移动板(18)的长度相等;弧形移动板(18)的形状像镰刀有直柄(25)和弧形开口,弧形开口的是以中间一个凹型的小矩形(21)为中心,依次以小矩形(21)的大小,两边对称呈阶梯状、平行递增小矩形(21)形成的弧形台阶齿的形状;横固定板(19)与弧形移动板(18)中间的凹型小矩形(21)对应,在对着弧形移动板(18)的一边的中心位置处,加工有中间凹边(23),并且横固定板(19)在对着弧形移动板(18)的一边上,与边平齐安装有水平放置、竖直端对着弧形移动板(18)的L形固定条(24);L形固定条(24)能够沿着横固定板(19)左右移动和固定。
2.根据权利要求1所述的一种可调式芯片卡具,其特征在于:所述弧形移动板(18)的直柄(25)上加工有移动卡槽(20);所述纵固定板(17)加工有配合移动卡槽(20)沿着纵固定板(17)前后纵向移动、或者横向移动的装置;通过移动卡槽(20)与纵固定板(17)配合,弧形移动板(18)能够在载物夹片(5)的矩形薄片上前后或左右移动或固定;所述纵固定板(17)到傍边的横固定板(19)的距离,大于等于弧形移动板(18)直柄(25)的长度尺寸;所述横固定板(19)的纵向前后宽度大于等于弧形移动板(18)直柄(25)的宽度尺寸;所述L形固定条(24)是通过横固定板(19)对着弧形移动板(18)的一边上加工的L形固定条卡槽(22)移动和固定的;所述L形固定条(24)数量是1个或2个。
3.根据权利要求1所述的一种可调式芯片卡具,其特征在于:所述夹片固定条(14)通过2个夹片固定条(14)上的插槽或上紧螺丝,安装或拆卸载物夹片(5)。
4.根据权利要求1所述的一种可调式芯片卡具,其特征在于:所述横轨(13)的表面与控制台(2)底面的下表面平齐;所述底轨(1)、横轨(13)和升降柱(6)都有标尺刻度;所述控制台(2)上安装有纵坐标显示器(3)、高度显示器(7)、横坐标显示器(8)、底轨固定按钮(10)、升降柱固定按钮(11)、横轨固定按钮(12);所述滑块(9)内部安装有锁紧底轨(1)和横轨(13)的机械装置,并能够通过底轨固定按钮(10)和横轨固定按钮(12)触发;所述控制台(2)内部安装有锁紧升降柱(6)的机械装置,并能够通过升降柱固定按钮(11)触发。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811039625.3A CN108962813B (zh) | 2018-09-06 | 2018-09-06 | 一种可调式芯片卡具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811039625.3A CN108962813B (zh) | 2018-09-06 | 2018-09-06 | 一种可调式芯片卡具 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108962813A true CN108962813A (zh) | 2018-12-07 |
CN108962813B CN108962813B (zh) | 2023-07-18 |
Family
ID=64476122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811039625.3A Active CN108962813B (zh) | 2018-09-06 | 2018-09-06 | 一种可调式芯片卡具 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108962813B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114387838A (zh) * | 2022-01-13 | 2022-04-22 | 郑州市电子信息工程学校 | 一种组合式计算机教学实训台 |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE729755A (zh) * | 1968-04-15 | 1969-08-18 | ||
US20020005166A1 (en) * | 2000-07-11 | 2002-01-17 | Takashi Kisaichi | Semiconductor manufactring apparatus, and positioning jig used for same |
WO2005073692A1 (ja) * | 2004-01-29 | 2005-08-11 | Nas Giken Inc. | 基板検査装置と基板検査方法と回収治具 |
WO2009150962A1 (ja) * | 2008-06-12 | 2009-12-17 | 株式会社アドウェルズ | 実装装置 |
US20100071172A1 (en) * | 2008-09-19 | 2010-03-25 | Foxsemicon Integrated Technology, Inc. | Clamping apparatus with positioning function |
CN102637624A (zh) * | 2012-04-23 | 2012-08-15 | 中国电子科技集团公司第四十五研究所 | 用于夹持平板式基板的可调式夹具 |
CN102785100A (zh) * | 2012-07-04 | 2012-11-21 | 李社远 | 一种滑块式钻孔/攻牙夹具架 |
WO2013050805A1 (de) * | 2011-10-06 | 2013-04-11 | Roth & Rau Ag | Substratwendeeinrichtung |
CN203636677U (zh) * | 2013-11-13 | 2014-06-11 | 山东泰吉星电子科技有限公司 | 可调式集成电路测试夹具 |
US20140239569A1 (en) * | 2013-02-26 | 2014-08-28 | International Business Machines Corporation | Universal clamping fixture to maintain laminate flatness during chip join |
CN204230219U (zh) * | 2014-09-30 | 2015-03-25 | 苏州速腾电子科技有限公司 | 一种芯片专用夹具 |
CN205508791U (zh) * | 2015-12-18 | 2016-08-24 | 天津胜富辉嘉科技有限公司 | 一种新型可调式芯片固定盒 |
CN106885793A (zh) * | 2017-02-09 | 2017-06-23 | 重庆科技学院 | 一种全内反射检测工作平台的使用方法 |
CN207181461U (zh) * | 2017-09-14 | 2018-04-03 | 成都容瓷电子科技有限公司 | 片式电容参数测试夹具 |
CN107999871A (zh) * | 2017-12-04 | 2018-05-08 | 金世杰 | 一种便于固定夹紧的钢管切割设备 |
CN207572716U (zh) * | 2017-11-13 | 2018-07-03 | 石家庄麦特达电子科技有限公司 | 半导体激光器单芯片烧结装置 |
-
2018
- 2018-09-06 CN CN201811039625.3A patent/CN108962813B/zh active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE729755A (zh) * | 1968-04-15 | 1969-08-18 | ||
US20020005166A1 (en) * | 2000-07-11 | 2002-01-17 | Takashi Kisaichi | Semiconductor manufactring apparatus, and positioning jig used for same |
WO2005073692A1 (ja) * | 2004-01-29 | 2005-08-11 | Nas Giken Inc. | 基板検査装置と基板検査方法と回収治具 |
WO2009150962A1 (ja) * | 2008-06-12 | 2009-12-17 | 株式会社アドウェルズ | 実装装置 |
US20100071172A1 (en) * | 2008-09-19 | 2010-03-25 | Foxsemicon Integrated Technology, Inc. | Clamping apparatus with positioning function |
WO2013050805A1 (de) * | 2011-10-06 | 2013-04-11 | Roth & Rau Ag | Substratwendeeinrichtung |
CN102637624A (zh) * | 2012-04-23 | 2012-08-15 | 中国电子科技集团公司第四十五研究所 | 用于夹持平板式基板的可调式夹具 |
CN102785100A (zh) * | 2012-07-04 | 2012-11-21 | 李社远 | 一种滑块式钻孔/攻牙夹具架 |
US20140239569A1 (en) * | 2013-02-26 | 2014-08-28 | International Business Machines Corporation | Universal clamping fixture to maintain laminate flatness during chip join |
CN203636677U (zh) * | 2013-11-13 | 2014-06-11 | 山东泰吉星电子科技有限公司 | 可调式集成电路测试夹具 |
CN204230219U (zh) * | 2014-09-30 | 2015-03-25 | 苏州速腾电子科技有限公司 | 一种芯片专用夹具 |
CN205508791U (zh) * | 2015-12-18 | 2016-08-24 | 天津胜富辉嘉科技有限公司 | 一种新型可调式芯片固定盒 |
CN106885793A (zh) * | 2017-02-09 | 2017-06-23 | 重庆科技学院 | 一种全内反射检测工作平台的使用方法 |
CN207181461U (zh) * | 2017-09-14 | 2018-04-03 | 成都容瓷电子科技有限公司 | 片式电容参数测试夹具 |
CN207572716U (zh) * | 2017-11-13 | 2018-07-03 | 石家庄麦特达电子科技有限公司 | 半导体激光器单芯片烧结装置 |
CN107999871A (zh) * | 2017-12-04 | 2018-05-08 | 金世杰 | 一种便于固定夹紧的钢管切割设备 |
Non-Patent Citations (1)
Title |
---|
戴敬;樊晓峰;方瑾;徐章润;: "微流控芯片系统中测温及控温装置的研制", 光谱学与光谱分析, no. 01 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114387838A (zh) * | 2022-01-13 | 2022-04-22 | 郑州市电子信息工程学校 | 一种组合式计算机教学实训台 |
CN114387838B (zh) * | 2022-01-13 | 2024-02-09 | 郑州市电子信息工程学校 | 一种组合式计算机教学实训台 |
Also Published As
Publication number | Publication date |
---|---|
CN108962813B (zh) | 2023-07-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9902019B2 (en) | Minimal contact modular laser cutting table system | |
CN108962813A (zh) | 一种可调式芯片卡具 | |
CN210451525U (zh) | 一种钢板激光切割用定位支撑台 | |
CN105729329B (zh) | 一种钳体 | |
CN210937914U (zh) | 一种板材焊接用固定架 | |
CN107953129A (zh) | 一种夹具 | |
CN207696129U (zh) | 一种夹具 | |
CN107414210B (zh) | 一种用于螺母加工的攻丝夹具 | |
CN211332320U (zh) | 一种内撑型加工夹持装置 | |
CN109143793A (zh) | 一种可调式芯片卡具的使用方法 | |
CN215201546U (zh) | 一种简易快速异型工件夹紧固定装置 | |
CN105881253B (zh) | 一种零部件固定装置 | |
CN209642512U (zh) | 音圈电机的磁铁安装装置 | |
CN209009621U (zh) | 一种便于水锯下料尺寸定位的定位夹具 | |
CN209158147U (zh) | 一种带有锁紧机构的治具 | |
CN216398858U (zh) | 气动夹具 | |
CN207239691U (zh) | 一种提高机床加工过程中的精度保持性与稳定性的结构 | |
CN209363782U (zh) | 一种线割长条形零件的定位夹具 | |
CN110695892B (zh) | 一种适用于装夹不规则电池的夹具 | |
CN215919794U (zh) | 一种多向可调分体式工装 | |
CN215588894U (zh) | 一种定位载具 | |
CN215036667U (zh) | 一种多向夹具 | |
CN210254843U (zh) | 一种焊接用工装夹具 | |
CN209532821U (zh) | 一种精确定位的气动夹具 | |
CN104551781A (zh) | 一种工装夹具的锁紧装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |