WO2005073333A1 - 粘着剤組成物 - Google Patents
粘着剤組成物 Download PDFInfo
- Publication number
- WO2005073333A1 WO2005073333A1 PCT/JP2005/001025 JP2005001025W WO2005073333A1 WO 2005073333 A1 WO2005073333 A1 WO 2005073333A1 JP 2005001025 W JP2005001025 W JP 2005001025W WO 2005073333 A1 WO2005073333 A1 WO 2005073333A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- polymer
- sensitive adhesive
- adhesive composition
- hydrolyzable silyl
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 36
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 34
- 229920000642 polymer Polymers 0.000 claims abstract description 60
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims abstract description 25
- 125000005702 oxyalkylene group Chemical group 0.000 claims abstract description 22
- 239000003054 catalyst Substances 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 229920000620 organic polymer Polymers 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 3
- 125000000962 organic group Chemical group 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 abstract description 4
- -1 polyoxypropylene Polymers 0.000 description 26
- 238000000034 method Methods 0.000 description 17
- 229920001451 polypropylene glycol Polymers 0.000 description 16
- 239000002390 adhesive tape Substances 0.000 description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 150000001336 alkenes Chemical group 0.000 description 9
- 238000005227 gel permeation chromatography Methods 0.000 description 9
- 239000000123 paper Substances 0.000 description 9
- 239000006087 Silane Coupling Agent Substances 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 8
- 239000003999 initiator Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000379 polymerizing effect Effects 0.000 description 6
- 150000004756 silanes Chemical class 0.000 description 6
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 5
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920002223 polystyrene Polymers 0.000 description 5
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 5
- 150000003377 silicon compounds Chemical class 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- VYVFQBFOMKEKBG-UHFFFAOYSA-L 3,3-dibutyl-2,4,3-benzodioxastannepine-1,5-dione Chemical compound O=C1O[Sn](CCCC)(CCCC)OC(=O)C2=CC=CC=C21 VYVFQBFOMKEKBG-UHFFFAOYSA-L 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002440 hydroxy compounds Chemical class 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000001846 repelling effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 1
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 1
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- WGRZHLPEQDVPET-UHFFFAOYSA-N 2-methoxyethoxysilane Chemical compound COCCO[SiH3] WGRZHLPEQDVPET-UHFFFAOYSA-N 0.000 description 1
- ULRCHFVDUCOKTE-UHFFFAOYSA-N 3-[3-aminopropyl(diethoxy)silyl]oxybutan-1-amine Chemical compound NCCC[Si](OCC)(OCC)OC(C)CCN ULRCHFVDUCOKTE-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- OSSMYOQKNHMTIP-UHFFFAOYSA-N 5-[dimethoxy(methyl)silyl]pentane-1,3-diamine Chemical compound CO[Si](C)(OC)CCC(N)CCN OSSMYOQKNHMTIP-UHFFFAOYSA-N 0.000 description 1
- KHLRJDNGHBXOSV-UHFFFAOYSA-N 5-trimethoxysilylpentane-1,3-diamine Chemical compound CO[Si](OC)(OC)CCC(N)CCN KHLRJDNGHBXOSV-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KWADETUNAHTOCO-UHFFFAOYSA-N C(C=C/C(=O)OCC1=CC=CC=C1)(=O)OCC1=CC=CC=C1.C(CCC)[Sn]CCCC Chemical compound C(C=C/C(=O)OCC1=CC=CC=C1)(=O)OCC1=CC=CC=C1.C(CCC)[Sn]CCCC KWADETUNAHTOCO-UHFFFAOYSA-N 0.000 description 1
- XDCNZKPPIZVEGT-UHFFFAOYSA-N C(C=C/C(=O)OCCCCCCCC)(=O)OCCCCCCCC.C(CCCCCCC)[Sn]CCCCCCCC Chemical compound C(C=C/C(=O)OCCCCCCCC)(=O)OCCCCCCCC.C(CCCCCCC)[Sn]CCCCCCCC XDCNZKPPIZVEGT-UHFFFAOYSA-N 0.000 description 1
- XNJTULRQWJJYDH-UHFFFAOYSA-N CCC[SiH](C)OC.N=C=O Chemical compound CCC[SiH](C)OC.N=C=O XNJTULRQWJJYDH-UHFFFAOYSA-N 0.000 description 1
- 101100433727 Caenorhabditis elegans got-1.2 gene Proteins 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- JGVDUAWRPJUPLC-UHFFFAOYSA-N N=C=O.CCC[Si](C)(OC)OC Chemical compound N=C=O.CCC[Si](C)(OC)OC JGVDUAWRPJUPLC-UHFFFAOYSA-N 0.000 description 1
- BWTYQPXEVPKXCV-UHFFFAOYSA-N NCC[Si](OCC)(C)CCCN Chemical compound NCC[Si](OCC)(C)CCCN BWTYQPXEVPKXCV-UHFFFAOYSA-N 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- INNSZZHSFSFSGS-UHFFFAOYSA-N acetic acid;titanium Chemical compound [Ti].CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O INNSZZHSFSFSGS-UHFFFAOYSA-N 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- YBCVMFKXIKNREZ-UHFFFAOYSA-N acoh acetic acid Chemical compound CC(O)=O.CC(O)=O YBCVMFKXIKNREZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000003302 alkenyloxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- XGZGKDQVCBHSGI-UHFFFAOYSA-N butyl(triethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)OCC XGZGKDQVCBHSGI-UHFFFAOYSA-N 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- DYHSMQWCZLNWGO-UHFFFAOYSA-N di(propan-2-yloxy)alumane Chemical compound CC(C)O[AlH]OC(C)C DYHSMQWCZLNWGO-UHFFFAOYSA-N 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- WRZAGCUJZBBAAW-SWJSCKDZSA-N dibutyltin;dioctyl (z)-but-2-enedioate Chemical compound CCCC[Sn]CCCC.CCCCCCCCOC(=O)\C=C/C(=O)OCCCCCCCC WRZAGCUJZBBAAW-SWJSCKDZSA-N 0.000 description 1
- MMFHQUJCZSYDEK-SWLCOABPSA-N dibutyltin;ditridecyl (z)-but-2-enedioate Chemical compound CCCC[Sn]CCCC.CCCCCCCCCCCCCOC(=O)\C=C/C(=O)OCCCCCCCCCCCCC MMFHQUJCZSYDEK-SWLCOABPSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FJKCDSVHCNEOOS-UHFFFAOYSA-N ethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[SiH](OCC)C1=CC=CC=C1 FJKCDSVHCNEOOS-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000004678 hydrides Chemical group 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- AZQGFVRDZTUHBU-UHFFFAOYSA-N isocyanic acid;triethoxy(propyl)silane Chemical compound N=C=O.CCC[Si](OCC)(OCC)OCC AZQGFVRDZTUHBU-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- BKXVGDZNDSIUAI-UHFFFAOYSA-N methoxy(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(OC)C1=CC=CC=C1 BKXVGDZNDSIUAI-UHFFFAOYSA-N 0.000 description 1
- REQXNMOSXYEQLM-UHFFFAOYSA-N methoxy-dimethyl-phenylsilane Chemical compound CO[Si](C)(C)C1=CC=CC=C1 REQXNMOSXYEQLM-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- ZBXCFZNCZCACTH-UHFFFAOYSA-L titanium(2+);diacetate Chemical compound [Ti+2].CC([O-])=O.CC([O-])=O ZBXCFZNCZCACTH-UHFFFAOYSA-L 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09J201/10—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2471/00—Presence of polyether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
Definitions
- the present invention relates to a pressure-sensitive adhesive composition. More specifically, (A) an oxyalkylene-based polymer having a hydrolyzable silanol group in a molecule of 0.3 to 0.7 equivalent and a number average molecular weight of 15,000 to 100,000 (hereinafter referred to as a hydrolyzable silyl group-containing polymer). A polymer), (B) a tackifier resin, and (C) a curing catalyst.
- pressure-sensitive adhesive compositions comprising a curable polymer mixed with a tackifier resin have been well known.
- a pressure-sensitive adhesive composition comprising an oxyalkylene-based polymer containing a hydrolyzable silyl group and a tackifier resin contains no or almost no organic solvent. Since it can be applied without using it, it has been proposed as a pressure-sensitive adhesive composition that does not adversely affect the environment (for example, see Patent Document 1).
- an oxyalkylene polymer having a hydrolyzable silyl group the properties of the polymer such as affinity to various adherends, hydrophilicity, and chemical stability derived from the chemical structure of the polymer are particularly high. The application to various applications including re-peeling is being studied.
- the pressure-sensitive adhesive composition had insufficient properties required for the pressure-sensitive adhesive in terms of adhesive force, retention when sticking to a curved surface, and the like. Also, if a large amount of tackifying resin is used to increase the adhesive strength, the properties of the oxalkylene-based polymer such as affinity to various adherends, hydrophilicity, and chemical stability are impaired. became.
- Patent Document 1 JP-A-59-71377
- the present invention uses no or almost no organic solvent which does not impair the good affinity, hydrophilicity, chemical stability and other properties of the oxyalkylene polymer for various adherends.
- Adhesive set that can be applied without using and has excellent adhesive properties The purpose is to provide a product.
- A An oxyalkylene polymer having a number average molecular weight of 15,000 to 100,000 containing 0.3 to 0.7 equivalents of a hydrolyzable silyl group per molecule (hereinafter referred to as a polymer containing a hydrolyzable silyl group) ),
- a pressure-sensitive adhesive composition containing the compound can be applied with little or no solvent, and exhibits excellent adhesive strength after curing, leading to the completion of the present invention.
- the pressure-sensitive adhesive composition of the present invention can be applied without using or at all using an organic solvent, and has excellent pressure-sensitive adhesive properties.
- the main chain skeleton of the (A) oxyalkylene polymer having a hydrolyzable silyl group in one molecule in an amount of 0.3 to 0.7 equivalent and having a number average molecular weight of 15,000 to 100,000 is And those having a repeating unit represented by the general formula (1).
- R 1 is a divalent alkylene group
- R 1 in the general formula (1) is preferably a linear or branched alkylene group having 1 to 14 carbon atoms, more preferably 4 carbon atoms.
- Specific examples of the repeating unit represented by the general formula (1) include: f, -CH ⁇ , -CH CH ⁇ _, -CH CH (CH) ⁇ _, -CH CH (CH) ⁇ _, -CH
- the main chain skeleton of the oxyalkylene polymer may be composed of only one type of repeating unit, or may be composed of two or more types of repeating units.
- -CH CH (CH) ⁇ _ A polymer having a main repeating unit is preferred.
- the main chain of the polymer may contain a repeating unit other than an oxyalkylene group.
- the total amount of oxyalkylene units in the polymer is preferably at least 80% by weight, particularly preferably at least 90% by weight.
- the polymer of the component (A) may be a linear polymer, a branched polymer, or a mixture thereof. However, in order to obtain good peeling properties, it is preferable that 50% by weight or more of the component (A) in the polymer is a linear polymer.
- the molecular weight of the polymer of component (A) is preferably 15,000 to 100,000 force S, more preferably 20,000 to 50,000 force S, in terms of number average molecular weight.
- the number average molecular weight is less than 15,000, the resulting pressure-sensitive adhesive composition becomes hard, and good pressure-sensitive adhesive properties cannot be obtained. Conversely, if the number average molecular weight exceeds 100,000, the viscosity becomes too high, and the workability is remarkably reduced.
- the number average molecular weight can be measured by various methods, it is generally measured by conversion from terminal group analysis of an oxyalkylene polymer or by gel permeation chromatography (GPC).
- the term “molecular weight” refers to a molecular weight determined by gel permeation chromatography (GPC).
- the molecular weight distribution (Mw / Mn) of the polymer of the component (A) is preferably 1.6 or less, more preferably 1.4 or less, because the viscosity of the polymer is low.
- the hydrolyzable silyl group-containing organic polymer of the present invention can be obtained by introducing a hydrolyzable silyl group into an oxyalkylene-based polymer known as a polyol or polyol having a hydroxyl group at a terminal by an appropriate method. can get.
- Such a method for producing a polymer has been proposed, for example, in JP-A-3-72527, JP-A-3-47825, and JP-A-3-79627.
- the oxyalkylene polymer used in the present invention may be an initiator such as a hydroxy compound having at least one hydroxyl group in the presence of a catalyst such as a metal porphyrin catalyst, a double metal cyanide complex catalyst, and a phosphazene catalyst.
- a catalyst such as a metal porphyrin catalyst, a double metal cyanide complex catalyst, and a phosphazene catalyst.
- a particularly preferable production method is a method using a double metal cyanide complex catalyst or a phosphazene catalyst. This is because the oxyalkylene polymers obtained by these particularly preferred methods have a low molecular weight distribution and a low viscosity and have no problem with hue.
- the number of functional groups of the hydroxy compound used in the initiator is preferably 2 or more.
- PPG polyoxypropylene triol
- polyether used as the initiator include polyoxyethylene, polyoxypropylene, polyoxybutylene, polyoxyhexylene, polyoxytetramethylene, and copolymers thereof.
- Particularly preferred polyethers are polyoxypropylene diol and polyoxypropylene triol, aryl-terminated polyoxypropylene, methallyl-terminated polyoxypropylene, and the like.
- the hydrolyzable silyl group is a silicon-containing functional group which can be crosslinked by forming a siloxane bond.
- silyl group represented by the following general formula (I) is a representative hydrolyzable silyl group.
- the hydrolyzable silyl group referred to in the present invention is not limited to this.
- R 2 is a substituted or unsubstituted monovalent organic group having 112 to 120 carbon atoms, preferably an alkyl group having 8 or less carbon atoms, a phenyl group or a fluoroalkyl group. Particularly preferred are a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, a cyclohexyl group and a phenyl group.
- X is a hydrolyzable group, such as a halogen atom, an alkoxy group, an alkenyloxy group, an acyloxy group, an amide group, an amino group, an aminooxy group, a ketoxime group, an acid amide group, and a hydride group.
- the number of carbon atoms of the hydrolyzable group having a carbon atom is preferably 6 or less, and particularly preferably 4 or less.
- Preferred hydrolyzable groups include lower alkoxy groups having 4 or less carbon atoms, especially methoxy, ethoxy, propoxy, propenyloxy and the like.
- a is 1, 2 or 3, and particularly preferably 2 or 3.
- the method of introducing the silicon group represented by the general formula (I) into the oxyalkylene polymer is not particularly limited, but for example, it can be introduced by the following method.
- a method for introducing an olefin group a compound having both an unsaturated group and a functional group capable of reacting with a hydroxyl group is reacted with a hydroxyl group of an oxyalkylene polymer to form an ether bond, an ester bond, a urethane bond, or a carbonate.
- a method of introducing an olefin group by adding an olefin group-containing epoxy conjugate, such as arylglycidyl ether, and polymerizing the alkylene oxide.
- R 2 , X and a are the same as above.
- R 3 is a divalent hydrocarbon group having 117 carbon atoms.
- a oxyalkylene polymer having a functional group capable of reacting with the isocyanate conjugate is reacted with a polyisocyanate conjugate such as tolylene diisocyanate to introduce an isocyanate group.
- W is an active hydrogen-containing group selected from a hydroxyl group, a carboxyl group, a mercapto group and an amino group (primary or secondary).
- An olefin group is introduced into an oxyalkylene polymer having a functional group into which an olefin group can be introduced, and the olefin group is combined with a W-force S mercapto group represented by the general formula (4).
- a method of reacting an elemental compound is provided.
- the polymer having a hydrolyzable silyl group which is the component (II) of the present invention, preferably contains 0.30.7 equivalents of a hydrolyzable silyl group in one molecule. If the amount of the hydrolyzable silyl group in one molecule of the component (ii) is less than 0.3 equivalent, a sufficient pressure-sensitive adhesive cured product cannot be obtained. Conversely, if the equivalent is more than 0.7 equivalent, the flexibility of the cured adhesive is impaired and good adhesive properties cannot be obtained. [0025]
- the definition of the unit "equivalent" used above is as follows.
- tackifying resin examples include terpene resins, terpene phenol resins, petroleum resins, rosin esters, and the like. They can be used alone or, if necessary, in combination of two or more.
- the preferred blending amount of the component (II) of the present invention is 5 to 150 parts by weight based on 100 parts by weight of the component (II). More preferably, the amount is 10 to 120 parts by weight. The most preferred range is 20-100 parts by weight. If the amount is less than 5 parts by weight, the composition may have poor tackiness.If the amount exceeds 150 parts by weight, the polymer ( ⁇ ) has good affinity to various adherends, hydrophilicity, and chemical stability. And other characteristics may be impaired.
- silanol condensation catalysts As the curing catalyst that is the component (C) of the present invention, those conventionally known as silanol condensation catalysts can be widely used. Specific examples thereof include titanium compounds such as titanium tetrabutoxide, tetrapropyl titanate, titanium tetraacetyl acetate and titanium acetate; dibutyltin dilaurate, dibutyltin maleate, dibutyltin phthalate, dibutyltin phthalate, Tate, dibutinoresuzuge / lehexanolate, dibutinoresuzuji methinole maleate, dibutinoresuzugechinoremaleate, dibutinoresuzuge dinole maleate, dibutyltin dioctyl maleate, dibutyltin ditridecyl maleate Ethate, dibutyltin dibenzyl maleate, dibutyl tin diacetate, dioctyl tin get
- the amount of these curing catalysts used is based on 100 parts by weight of the total amount of the organic polymer ( ⁇ ) and the tackifier resin (().
- the resin ( ⁇ ) does not participate in the silanol condensation reaction at all) (about 100 parts by weight of the organic polymer ( ⁇ ))
- about 0.1 to 20 parts by weight is preferable. If the amount of the curing catalyst used is too small, the curing speed may be reduced and the curing reaction may not proceed sufficiently. On the other hand, if the amount of the curing catalyst used is too large, local heat generation or foaming may occur during curing, and a good cured product may not be obtained.
- the method for preparing the pressure-sensitive adhesive composition of the present invention is not particularly limited.
- the above-mentioned components are mixed, kneaded at room temperature or under heat using a mixer, roll, kneader, or the like, or a suitable solvent is added.
- Conventional methods such as dissolving and mixing the components using a small amount can be used.
- the pressure-sensitive adhesive composition of the present invention may contain various known fillers and various additives.
- R 2 Si (OR 2 ) (Where a is the same as above. ) May be added.
- a silicon compound include, but are not limited to, phenyltrimethoxysilane, phenylmethyldimethoxysilane, phenyldimethylmethoxysilane, diphenyldimethoxysilane, diphenylethoxysilane, triphenylmethoxysilane, and the like.
- At least one force of R directly bonded to a Si atom in the general formula of S is an aryl group having 620 carbon atoms, which is preferable because of a large effect of accelerating the curing reaction of the composition.
- difluorodimethoxysilane difluoroethoxysilane is particularly preferable because it is inexpensive and easily available.
- this silicon compound When this silicon compound is used, its compounding amount is based on 100 parts by weight of the total amount of the polymer (A) and the tackifier resin (B). For example, in the case where the tackifying resin (B) does not participate in the silanol condensation reaction at all, (in such a case) 100 parts by weight of the organic polymer (A)), about 0.01 20 parts by weight is preferable. 0.1 10 parts by weight is more preferred. If the amount of the silicon compound falls below this range, the effect of accelerating the curing reaction may be reduced. On the other hand, if the amount of the silicon compound exceeds this range, the hardness and tensile strength of the cured product may decrease.
- a silane coupling agent, a reactant of the silane coupling agent, or a compound other than the silane coupling agent can be added to the composition of the present invention as an adhesion-imparting agent.
- the silane coupling agent include isocyanates such as ⁇ -isocyanate propyl trimethoxy silane, ⁇ isocyanate propyl triethoxy silane, ⁇ isocyanate propyl methyl methoxy silane, and ⁇ isocyanate propyl methyl dimethoxy silane.
- silanes ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -aminopropylmethyldimethoxysilane, ⁇ -aminopropylmethyljetoxysilane, ⁇ - (2-aminoethyl) aminopropyl Trimethoxysilane, ⁇ - (2-aminoethyl) aminopropylmethyldimethoxysilane, ⁇ _ (2-aminoethyl) aminopropyltriethoxysilane, ⁇ _ (2-aminoethyl) aminopropylmethylethoxysilane, ⁇ -ureido Amino group-containing silanes such as lopinole trimethoxysilane, ⁇ -phenyl ⁇ -aminopropyltrimethoxysilane, ⁇ ⁇ ⁇ ⁇ -benzyl- ⁇ -aminopropyltrime
- Bull type unsaturated group-containing silanes ⁇ Halogen-containing silanes such as -propyl methoxytrimethoxysilane; and isocyanurate silanes such as tris (trimethoxysilyl) isocyanurate.
- modified derivatives thereof such as amino-modified silyl polymers, silyl amide amino polymers, unsaturated aminosilane complexes, phenylamino long-chain alkylsilanes, aminosilylated silicones, silylated polyesters, etc., can also be used as the silane coupling agent. .
- the amount of the polymer ( ⁇ ) and the tackifier resin ( ⁇ ) is usually 100 parts by weight based on the total amount of the polymer ( ⁇ ) and the tackifier resin ( ⁇ ).
- the silane coupling agent is used in the range of 0.1 to 20 parts by weight (based on 100 parts by weight of (ii)). In particular, the range of 0.5 to 10 parts by weight is preferable.
- the basic production method is a method in which the pressure-sensitive adhesive composition is applied to a support and thermosetted, and is not limited to the following examples.
- the pressure-sensitive adhesive composition of the present invention is applied on a support with a coater, and is cured by heating to obtain a pressure-sensitive adhesive product.
- a support films, papers, all kinds of cloths, metal foils and the like made of synthetic resin or denatured natural product can be used.
- Specific examples of the support include polyethylene, polypropylene, polyimide, polycarbonate, polyvinyl chloride, polyester, polyurethane, cellophane, impregnated paper, coated paper, woodfree paper, kraft paper, cloth, acetate cloth, nonwoven cloth, glass cloth, Metal foil, but is not limited to these. Each of these may be used alone, or at least two or more thereof may be used in a laminated form.
- a method of directly applying to a support or a method of applying to a release paper, curing and transferring to a substrate can be applied.
- a release paper coated with a release agent of a silicone type, an olefin type, a fluorine type, or the like can be used. From the viewpoints of cost and securing the releasability, it is particularly preferable to use an olefin-based or solvent-free silicone-based release agent.
- the method of thermosetting is not particularly limited.
- the temperature varies depending on the type of the polymer to be used, the compound to be added, and the like, but is usually preferably in the range of 50 ° C to 180 ° C.
- the curing time varies depending on the polymer used, the compound to be added, the reaction temperature, etc., but is usually within a range of 0.1 minute to 24 hours, preferably 1 minute to 10 hours, and more preferably 1 minute to 1 hour. is there.
- the pressure-sensitive adhesive composition of the present invention can be used for various types of pressure-sensitive adhesive products for general office use, paper wrapping, PP film bonding, re-peeling, general packaging, electricity, and fixing.
- An adhesive product using the adhesive composition of the present invention includes an adhesive tape for packaging, an office adhesive tape, a coating masking tape, an electrical insulating adhesive tape, a binding adhesive tape, a protective adhesive tape, and an identification tape.
- a drug in making the above adhesive product, a drug, an electromagnetic wave absorbing material, a light absorbing agent, a foaming component, and the like can be added according to these uses.
- composition of the present invention will be specifically described with reference to examples. It is not limited to examples only.
- GPC measurement (polystyrene) was carried out by polymerizing propylene oxide using a zinc hexacyanocobaltate glyme complex as the initiator, which is Pact-23 (polyoxypropylene glycol, manufactured by Mitsui Takeda Co., Ltd.).
- Pact-23 polyoxypropylene glycol, manufactured by Mitsui Takeda Co., Ltd.
- Conversion A polyoxypropylene glycol having a number average molecular weight of 31,000 and Mw / Mn of 1.2 was produced, and the terminal hydroxyl group was metaloxylated.
- GPC measurement (polystyrene) was carried out by polymerizing propylene oxide using a zinc hexacyanocobaltate glyme complex as the initiator, which is Pact-23 (polyoxypropylene glycol, manufactured by Mitsui Takeda Co., Ltd.).
- Pact-23 polyoxypropylene glycol, manufactured by Mitsui Takeda Co., Ltd.
- Conversion A polyoxypropylene glycol having a number average molecular weight of 31,000 and Mw / Mn of 1.2 was produced, and the terminal hydroxyl group was metaloxylated.
- GPC measurement (polystyrene) was carried out by polymerizing propylene oxide using a zinc hexacyanocobaltate glyme complex as the initiator, which is Pact-23 (polyoxypropylene glycol, manufactured by Mitsui Takeda Co., Ltd.).
- Pact-23 polyoxypropylene glycol, manufactured by Mitsui Takeda Co., Ltd.
- (Conversion) Polyoxypropylene glycol having a number average molecular weight of 26000 and Mw / Mn of 1.4 was produced, and then ⁇ -isocyanate propionoletrimethoxysilane (Y-5187 manufactured by Nippon Tunicer) was added to all the terminal hydroxyl groups.
- GPC measurement (polystyrene) was carried out by polymerizing propylene oxide using a zinc hexacyanocobaltate glyme complex as the initiator, which is Pact-23 (polyoxypropylene glycol, manufactured by Mitsui Takeda Co., Ltd.).
- Pact-23 polyoxypropylene glycol, manufactured by Mitsui Takeda Co., Ltd.
- Conversion A polyoxypropylene glycol having a number average molecular weight of 31,000 and Mw / Mn of 1.2 was produced, and the terminal hydroxyl group was metaloxylated.
- YS Polyester S-145 Tepenphenol resin manufactured by Yasuhara Chemical Co., Ltd. 100 parts by weight of a polymer obtained by adding ORGATICS TC-100 (Titanium acetate acetate manufactured by Matsumoto Trading Co., Ltd.) 4 parts by weight with respect to The mixture was stirred to obtain a pressure-sensitive adhesive composition.
- This pressure-sensitive adhesive composition is applied to a 38- ⁇ m-thick polyester film so as to have a width of 8 cm and a thickness of 100 zm, and is cured by heating at 130 ° C for 3 minutes to form a pressure-sensitive adhesive film. Obtained.
- the obtained adhesive film was cut into strips with a width of 25 mm, and the surface was polished with a No. 280 sandpaper.
- a stainless steel plate with a width of 25 mm was adhered to a SUS304 adherend. After leaving for 60 minutes, the force required for peeling was measured. .
- the peeling temperature and speed at that time were 300 mmZmin at 23 ° C, and the peeling angle was 180 degrees. Table 2 shows the results.
- Example 1 and Comparative Examples 1-2 are applied on an aluminum plate having a thickness of 2 mm so that the pressure-sensitive adhesive has a thickness of 100 xm, and heated at 130 ° C for 3 minutes. Cured.
- the obtained aluminum plate with an adhesive was wound around a stainless steel cylinder having a diameter of 5.5 cm, pressed for 20 seconds and allowed to stand, thereby confirming the adhesiveness when the adhesive was stuck on a curved surface.
- Table 3 shows the results.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/586,859 US7671144B2 (en) | 2004-01-30 | 2005-01-26 | Pressure sensitive adhesive composition |
CN2005800029649A CN1910250B (zh) | 2004-01-30 | 2005-01-26 | 粘合剂组合物 |
JP2005517465A JP4750559B2 (ja) | 2004-01-30 | 2005-01-26 | 粘着剤組成物 |
CA002554743A CA2554743A1 (en) | 2004-01-30 | 2005-01-26 | Pressure sensitive adhesive composition |
EP05709365.0A EP1715015B1 (en) | 2004-01-30 | 2005-01-26 | Pressure sensitive adhesive composition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-024172 | 2004-01-30 | ||
JP2004024172 | 2004-01-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005073333A1 true WO2005073333A1 (ja) | 2005-08-11 |
Family
ID=34823918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/001025 WO2005073333A1 (ja) | 2004-01-30 | 2005-01-26 | 粘着剤組成物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7671144B2 (ja) |
EP (1) | EP1715015B1 (ja) |
JP (1) | JP4750559B2 (ja) |
CN (1) | CN1910250B (ja) |
CA (1) | CA2554743A1 (ja) |
WO (1) | WO2005073333A1 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007142067A1 (ja) * | 2006-06-02 | 2007-12-13 | Kaneka Corporation | 硬化性組成物 |
WO2008123552A1 (ja) | 2007-04-03 | 2008-10-16 | Asahi Glass Company, Limited | 粘着体、粘着シートおよびその用途 |
WO2010013653A1 (ja) | 2008-07-28 | 2010-02-04 | 旭硝子株式会社 | 粘着体、粘着シートおよびその用途 |
WO2010026995A1 (ja) | 2008-09-05 | 2010-03-11 | 旭硝子株式会社 | 粘着体、粘着シートおよびその用途 |
WO2010038715A1 (ja) * | 2008-09-30 | 2010-04-08 | コニシ株式会社 | 粘着テープ又はシートの製造方法 |
WO2010041667A1 (ja) * | 2008-10-08 | 2010-04-15 | 旭硝子株式会社 | 粘着積層体 |
JP2011506737A (ja) * | 2007-12-21 | 2011-03-03 | ボスティク エス.アー. | 温度安定性に優れた接着力を有する感圧接着剤 |
WO2011132749A1 (ja) | 2010-04-23 | 2011-10-27 | 旭硝子株式会社 | 粘着積層体および表面保護シート |
JP2013032450A (ja) * | 2011-08-02 | 2013-02-14 | Kaneka Corp | 粘着剤組成物 |
JP2014509329A (ja) * | 2010-12-28 | 2014-04-17 | ボスティク エス.アー. | 架橋方法およびその関連装置 |
WO2015079902A1 (ja) * | 2013-11-26 | 2015-06-04 | リンテック株式会社 | 両面粘着シートおよび両面粘着シートの製造方法 |
WO2015079904A1 (ja) * | 2013-11-26 | 2015-06-04 | リンテック株式会社 | 電子部品の仮固定用粘着シートおよび電子部品の仮固定用粘着シートの使用方法 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101752517B1 (ko) | 2009-09-15 | 2017-06-29 | 바스프 에스이 | 광-잠재성 티타늄-킬레이트 촉매 |
RU2556979C2 (ru) | 2009-09-15 | 2015-07-20 | Басф Се | Фотолатентные титановые катализаторы |
US8883281B2 (en) | 2010-12-17 | 2014-11-11 | Saint-Gobain Performance Plastics Corporation | Multilayer film having pressure sensitive adhesive layer |
EP2694211A1 (en) | 2011-04-05 | 2014-02-12 | Basf Se | Photo-latent titanium-oxo-chelate catalysts |
DE102011088170A1 (de) | 2011-12-09 | 2013-06-13 | Bayer Materialscience Aktiengesellschaft | Reaktive Haftklebstoffe |
US10898389B2 (en) | 2012-03-12 | 2021-01-26 | Bostik Sa | Breathable self-adhesive articles |
EP2682444A1 (en) * | 2012-07-06 | 2014-01-08 | Bostik SA | Use of an adhesive composition to provide a bonding in a wet environment |
US11686094B2 (en) | 2013-03-15 | 2023-06-27 | Holcim Technology Ltd | Bonding adhesive and adhered roofing systems prepared using the same |
JP6517489B2 (ja) * | 2013-12-16 | 2019-05-22 | シャープ化学工業株式会社 | 吸盤の固定方法 |
WO2017223173A1 (en) | 2016-06-21 | 2017-12-28 | Bridgestone Americas Tire Operations, Llc | Methods for treating inner liner surface, inner liners resulting therefrom and tires containing such inner liners |
BR112018077027B1 (pt) | 2016-06-30 | 2023-03-14 | Bridgestone Americas Tire Operations, Llc | Método para tratamento de um forro interno curado para um pneu; método para produzir um pneu e pneu curado |
US11697306B2 (en) | 2016-12-15 | 2023-07-11 | Bridgestone Americas Tire Operations, Llc | Sealant-containing tire and related processes |
JP6848062B2 (ja) | 2016-12-15 | 2021-03-24 | ブリヂストン アメリカズ タイヤ オペレーションズ、 エルエルシー | 硬化したインナーライナー上にポリマー含有コーティングを生成する方法、かかるインナーライナーを含むタイヤを製造する方法、及びかかるインナーライナーを含むタイヤ |
JP6961697B2 (ja) | 2016-12-15 | 2021-11-05 | ブリヂストン アメリカズ タイヤ オペレーションズ、 エルエルシー | バリアを有するシーラント層、それを含有するタイヤ、及び関連するプロセス |
EP4012001A1 (en) | 2020-12-10 | 2022-06-15 | Bostik SA | Methods for using adhesives which are thermally-reversible and temperature-sensitive |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5971377A (ja) * | 1982-10-15 | 1984-04-23 | Kanegafuchi Chem Ind Co Ltd | 粘着剤組成物 |
JPS6035069A (ja) * | 1984-04-26 | 1985-02-22 | Kanegafuchi Chem Ind Co Ltd | 粘着剤組成物 |
JPS61116327A (ja) * | 1984-11-12 | 1986-06-03 | Sekisui Fine Chem Kk | 液晶素子の製造方法 |
JPH02132174A (ja) * | 1988-11-11 | 1990-05-21 | Kanegafuchi Chem Ind Co Ltd | 粘着製品の製法 |
JP2003105303A (ja) * | 2001-09-28 | 2003-04-09 | Diabond Industry Co Ltd | 湿気硬化形ホットメルト接着剤およびその製造方法 |
JP2004115780A (ja) * | 2002-09-06 | 2004-04-15 | Cemedine Co Ltd | 硬化性組成物 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU559667B2 (en) * | 1982-12-03 | 1987-03-19 | Kanegafuchi Kagaku Kogyo K.K. | Curable polyoxyalkylene polymer composition |
JPS6160771A (ja) * | 1984-08-31 | 1986-03-28 | Kanegafuchi Chem Ind Co Ltd | 粘着剤組成物 |
JPH0623370B2 (ja) * | 1986-03-25 | 1994-03-30 | 日本石油株式会社 | 粘着剤組成物 |
JPH0742376B2 (ja) * | 1986-10-29 | 1995-05-10 | 鐘淵化学工業株式会社 | 硬化性組成物 |
JP2609256B2 (ja) * | 1987-07-21 | 1997-05-14 | 鐘淵化学工業株式会社 | 硬化性組成物 |
EP0326862B1 (en) * | 1988-01-21 | 1994-04-06 | Kanegafuchi Chemical Industry Co., Ltd. | Curable polymer composition |
AU615730B2 (en) * | 1988-04-07 | 1991-10-10 | Kanegafuchi Chemical Industry Co. Ltd. | Pressure-sensitive adhesive material |
JP2610305B2 (ja) * | 1988-06-10 | 1997-05-14 | 鐘淵化学工業株式会社 | 硬化性組成物 |
US6369187B1 (en) * | 1990-04-09 | 2002-04-09 | Kanegafuchi Chemical Industry Co., Ltd. | Reactive silicon group-containing oxypropylene polymer and method of producing same |
JP2995309B2 (ja) * | 1991-09-09 | 1999-12-27 | 鐘淵化学工業株式会社 | 硬化性組成物 |
JP3002925B2 (ja) * | 1992-04-08 | 2000-01-24 | 鐘淵化学工業株式会社 | 硬化性組成物 |
JP3250690B2 (ja) * | 1993-04-12 | 2002-01-28 | 鐘淵化学工業株式会社 | 硬化性組成物 |
JPH07242737A (ja) * | 1994-03-07 | 1995-09-19 | Kanegafuchi Chem Ind Co Ltd | 硬化性樹脂組成物 |
US5976669A (en) * | 1996-12-20 | 1999-11-02 | 3M Innovative Properties Company | Retroreflective article having launderably durable bead-bond |
EP1396513B1 (en) * | 1997-04-21 | 2005-09-07 | Asahi Glass Company, Limited | Room temperature-setting composition |
US6274688B1 (en) * | 1997-07-28 | 2001-08-14 | Kaneka Corporation | Functional groups-terminated vinyl polymers |
DE60037357T2 (de) * | 1999-03-18 | 2008-12-04 | Kaneka Corp. | Härtbare Zusammensetzung |
WO2001090224A1 (fr) * | 2000-05-24 | 2001-11-29 | Kaneka Corporation | Compositions durcissables et agent de compatibilite |
DE60203973T2 (de) * | 2001-08-14 | 2006-02-23 | Kaneka Corp. | Härtbares Harz |
DE60222293T2 (de) * | 2001-10-23 | 2008-06-19 | Kaneka Corp. | Härtbare harzzusammensetzung |
-
2005
- 2005-01-26 CA CA002554743A patent/CA2554743A1/en not_active Abandoned
- 2005-01-26 US US10/586,859 patent/US7671144B2/en active Active
- 2005-01-26 JP JP2005517465A patent/JP4750559B2/ja active Active
- 2005-01-26 WO PCT/JP2005/001025 patent/WO2005073333A1/ja active Application Filing
- 2005-01-26 CN CN2005800029649A patent/CN1910250B/zh not_active Expired - Fee Related
- 2005-01-26 EP EP05709365.0A patent/EP1715015B1/en not_active Not-in-force
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5971377A (ja) * | 1982-10-15 | 1984-04-23 | Kanegafuchi Chem Ind Co Ltd | 粘着剤組成物 |
JPS6035069A (ja) * | 1984-04-26 | 1985-02-22 | Kanegafuchi Chem Ind Co Ltd | 粘着剤組成物 |
JPS61116327A (ja) * | 1984-11-12 | 1986-06-03 | Sekisui Fine Chem Kk | 液晶素子の製造方法 |
JPH02132174A (ja) * | 1988-11-11 | 1990-05-21 | Kanegafuchi Chem Ind Co Ltd | 粘着製品の製法 |
JP2003105303A (ja) * | 2001-09-28 | 2003-04-09 | Diabond Industry Co Ltd | 湿気硬化形ホットメルト接着剤およびその製造方法 |
JP2004115780A (ja) * | 2002-09-06 | 2004-04-15 | Cemedine Co Ltd | 硬化性組成物 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1715015A4 * |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2025715A4 (en) * | 2006-06-02 | 2012-01-18 | Kaneka Corp | HARDENING COMPOSITION |
EP2025715A1 (en) * | 2006-06-02 | 2009-02-18 | Kaneka Corporation | Curable composition |
WO2007142067A1 (ja) * | 2006-06-02 | 2007-12-13 | Kaneka Corporation | 硬化性組成物 |
WO2008123552A1 (ja) | 2007-04-03 | 2008-10-16 | Asahi Glass Company, Limited | 粘着体、粘着シートおよびその用途 |
JP5040995B2 (ja) * | 2007-04-03 | 2012-10-03 | 旭硝子株式会社 | 粘着体、粘着シートおよびその用途 |
JP2011506737A (ja) * | 2007-12-21 | 2011-03-03 | ボスティク エス.アー. | 温度安定性に優れた接着力を有する感圧接着剤 |
WO2010013653A1 (ja) | 2008-07-28 | 2010-02-04 | 旭硝子株式会社 | 粘着体、粘着シートおよびその用途 |
WO2010026995A1 (ja) | 2008-09-05 | 2010-03-11 | 旭硝子株式会社 | 粘着体、粘着シートおよびその用途 |
US8648162B2 (en) | 2008-09-05 | 2014-02-11 | Asahi Glass Company, Limited | Adherence substance, pressure sensitive adhesive sheet and its use |
WO2010038715A1 (ja) * | 2008-09-30 | 2010-04-08 | コニシ株式会社 | 粘着テープ又はシートの製造方法 |
US8197896B2 (en) | 2008-09-30 | 2012-06-12 | Konishi Co., Ltd. | Method for producing a pressure-sensitive adhesive tape or sheet |
JPWO2010038715A1 (ja) * | 2008-09-30 | 2012-03-01 | コニシ株式会社 | 粘着テープ又はシートの製造方法 |
JP5284362B2 (ja) * | 2008-09-30 | 2013-09-11 | コニシ株式会社 | 粘着テープ又はシートの製造方法 |
JP5594142B2 (ja) * | 2008-10-08 | 2014-09-24 | 旭硝子株式会社 | 粘着積層体 |
WO2010041667A1 (ja) * | 2008-10-08 | 2010-04-15 | 旭硝子株式会社 | 粘着積層体 |
WO2011132749A1 (ja) | 2010-04-23 | 2011-10-27 | 旭硝子株式会社 | 粘着積層体および表面保護シート |
JP2014509329A (ja) * | 2010-12-28 | 2014-04-17 | ボスティク エス.アー. | 架橋方法およびその関連装置 |
JP2013032450A (ja) * | 2011-08-02 | 2013-02-14 | Kaneka Corp | 粘着剤組成物 |
WO2015079902A1 (ja) * | 2013-11-26 | 2015-06-04 | リンテック株式会社 | 両面粘着シートおよび両面粘着シートの製造方法 |
WO2015079904A1 (ja) * | 2013-11-26 | 2015-06-04 | リンテック株式会社 | 電子部品の仮固定用粘着シートおよび電子部品の仮固定用粘着シートの使用方法 |
JP5901044B2 (ja) * | 2013-11-26 | 2016-04-06 | リンテック株式会社 | 両面粘着シートおよび両面粘着シートの製造方法 |
JPWO2015079902A1 (ja) * | 2013-11-26 | 2017-03-16 | リンテック株式会社 | 両面粘着シートおよび両面粘着シートの製造方法 |
JPWO2015079904A1 (ja) * | 2013-11-26 | 2017-03-16 | リンテック株式会社 | 電子部品の仮固定用粘着シートおよび電子部品の仮固定用粘着シートの使用方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1715015B1 (en) | 2016-10-26 |
US7671144B2 (en) | 2010-03-02 |
EP1715015A1 (en) | 2006-10-25 |
CN1910250B (zh) | 2010-05-05 |
CN1910250A (zh) | 2007-02-07 |
US20070167584A1 (en) | 2007-07-19 |
CA2554743A1 (en) | 2005-08-11 |
JPWO2005073333A1 (ja) | 2007-10-11 |
JP4750559B2 (ja) | 2011-08-17 |
EP1715015A4 (en) | 2008-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2005073333A1 (ja) | 粘着剤組成物 | |
JP4745828B2 (ja) | 粘着剤組成物 | |
JP5561166B2 (ja) | 粘着体、粘着シートおよびその用途 | |
JP5594142B2 (ja) | 粘着積層体 | |
JP5040995B2 (ja) | 粘着体、粘着シートおよびその用途 | |
JP5700040B2 (ja) | 粘着積層体および表面保護シート | |
JP2010100835A (ja) | 粘着体および粘着シート | |
JP2010111862A (ja) | 粘着積層体 | |
JP5238131B2 (ja) | 粘着剤組成物および粘着剤 | |
JP2013032450A (ja) | 粘着剤組成物 | |
JP5447284B2 (ja) | 硬化性組成物、粘着体、粘着積層体および粘着体の製造方法 | |
JP5544990B2 (ja) | 粘着積層体 | |
JP5144898B2 (ja) | 剥離基材付き粘着製品 | |
JPH02132174A (ja) | 粘着製品の製法 | |
JPH02127490A (ja) | 粘着剤組成物 | |
JP4712988B2 (ja) | 被着体の接着方法 | |
JP2010100836A (ja) | 粘着体および粘着シート | |
JP2010111861A (ja) | 耐熱粘着積層体 | |
JPS6155178A (ja) | 剥離処理剤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2005517465 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200580002964.9 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2554743 Country of ref document: CA |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2005709365 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2005709365 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 2005709365 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007167584 Country of ref document: US Ref document number: 10586859 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 10586859 Country of ref document: US |