WO2005043247A1 - 厚膜および超厚膜対応化学増幅型感光性樹脂組成物 - Google Patents
厚膜および超厚膜対応化学増幅型感光性樹脂組成物 Download PDFInfo
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- WO2005043247A1 WO2005043247A1 PCT/JP2004/013354 JP2004013354W WO2005043247A1 WO 2005043247 A1 WO2005043247 A1 WO 2005043247A1 JP 2004013354 W JP2004013354 W JP 2004013354W WO 2005043247 A1 WO2005043247 A1 WO 2005043247A1
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- resin composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
Definitions
- the present invention relates to a photosensitive resin composition, and more particularly, to the manufacture of semiconductor devices, flat panel displays (FPDs), circuit boards, magnetic heads, etc., and particularly to the formation of magnetic poles for magnetic heads and large-scale integrated circuits.
- the present invention relates to a chemically amplified photosensitive resin composition suitable for a thick film and an ultra-thick film, which is suitably used for forming a bump electrode called a bump used as a connection terminal of an (LSI).
- LSI connection terminal of an
- Patent Document 1 Japanese Patent Publication No. 54-23570 (1 page)
- Patent Document 2 Japanese Patent Publication No. 56-30850 (1 page)
- Patent Document 3 JP-A-55-73045 (pages 1-4)
- Patent Document 4 JP-A-61-205933 (pages 1, 3-5)
- a photosensitive resin composition of a dry film system capable of forming a thick resist pattern a novolak resin, which has an acetal portion repeatedly in the main chain, and an alcohol component of the acetal portion, Acetalyl conjugates in which each carbon atom is aliphatic, a photosensitive resin composition containing an acid generator (see Patent Document 5), an alkali-soluble resin such as novolak resin, an acetal compound, and an acid generator And a photosensitive resin composition comprising an alkali-soluble resin such as novolak resin, an acetal compound, and an acid generator (Patent Document 7). See).
- a photosensitive resin composition containing an acetal oil conjugate and an acid generator a photosensitive resin composition containing a novolak resin containing three different phenols, an acetal compound, and an acid generator.
- a photosensitive resin composition containing a novolak resin having an acetal bond in the molecule a photosensitive composition containing an acid generator (see Patent Document 9), a novolak resin, and an acetal compound (chlorbenzaldehyde diphenol)
- a photoresist see Patent Document 10 containing an acid generator (2-alkoxyphenyl 4,6 bis (trichloromethyl) -s-triazine).
- a photosensitive resin composition for thick or ultra-thick resists of 10 m or more suitable for forming bumps contains a polymer having an acid-dissociable functional group, polyvinyl lower alkyl ether, and an acid generator.
- a photosensitive resin composition see Patent Document 11
- a photosensitive resin composition for a thick film resist of 3 m or more suitable for manufacturing a magnetic head a part of hydrogen atoms of all phenolic hydroxyl groups is 1, 1
- a photosensitive resin composition containing an alkali-soluble novolak resin substituted with a 2-naphthoquinonediazidosulfonyl group and an acid generator has also been proposed.
- Patent Document 5 JP-A-53-133429 (pages 11 to 17)
- Patent Document 6 JP-A-57-37349 (pages 1 to 6)
- Patent Document 7 JP-A-58-114031 (pages 11 to 15)
- Patent Document 8 Japanese Patent Laid-Open No. 62-124556 (pages 114)
- Patent Document 9 JP-A-62-215947 (pages 1, 3-5)
- Patent Document 10 JP-A-4-182650 (pages 1, 3-5)
- Patent Document 11 Japanese Patent Application Laid-Open No. 2001-281863 (pages 2, 4-9)
- Patent Document 12 Japanese Patent Application Laid-Open No. 2001-312060 (pages 2-7)
- the present invention provides a chemically amplified photosensitive resin composition corresponding to a thick film and an ultra-thick film process, which has high sensitivity and high residual film properties, and further has excellent coatability
- An object of the present invention is to provide a chemically amplified photosensitive resin composition capable of forming a good pattern with high resolution and excellent in heat resistance of the obtained pattern.
- the inventors of the present invention have conducted intensive studies and studies, and as a result, have found that, for example, a chemically amplified type used for a thick film process exceeding 10 ⁇ m thickness or an ultra-thick film process exceeding 20 m thickness.
- a photosensitive resin composition an alkali-soluble novolak resin, a resin or a compound which is insoluble or hardly soluble in an alkali but is soluble by the action of an acid, or a compound which generates an acid by irradiation with radiation
- the present invention provides
- Chemically amplified photosensitive resin composition characterized by containing, furthermore, if necessary, this chemically amplified photosensitive resin composition
- the present invention relates to a chemically amplified photosensitive resin composition
- a chemically amplified photosensitive resin composition comprising:
- alkali-soluble novolak resin (A) used in the chemically amplified photosensitive resin composition of the present invention a photosensitive resin containing a conventionally known alkali-soluble resin and a photosensitizer containing a quinonediazide group is used. Any alkali-soluble novolac resin used in the resin composition may be used without any particular limitation.
- the novolak resin which can be preferably used in the present invention can be obtained by polycondensation of various phenols alone or a mixture of plural kinds thereof with aldehydes such as formalin.
- Examples of the phenols constituting the novolak resin include phenol, p-cresol, m-cresol, o-cresol, 2,3-dimethylphenol, 2,4-dimethylphenol, and 2,5-dimethylphenol.
- aldehydes include, in addition to formalin, paraformaldehyde, acetoaldehyde, benzaldehyde, hydroxybenzaldehyde, chloroacetaldehyde and the like, and these can be used alone or as a mixture of a plurality of them.
- the weight-average molecular weight of the alkali-soluble novolak resin used in the chemically amplified photosensitive resin composition of the present invention is preferably 5,000 to 100,000 in terms of polystyrene, and ⁇ is in terms of positive styrene. 5,000—50,000.
- the resin or compound (B) used in the chemically amplified photosensitive resin composition of the present invention which itself becomes insoluble or hardly soluble in alkali and becomes soluble in alkali by the action of an acid.
- acetal resins or compounds for example, acetal resins or compounds.
- the acetal resin or compound used in the present invention is not particularly limited as long as it is an acetal resin or compound including the acetal oil conjugate described in Patent Document 5-10 cited as a prior art document.
- an acetal resin or a compound having a structural unit represented by the following general formula (I) in a molecule is preferred.
- the acetal resin or compound having a structural unit represented by the general formula (I) in a molecule is a polymer having a weight average weight of 100 to 10,000 in terms of polystyrene equivalent force. — A power of 5,000, which is preferred over S.
- R is an alkyl group having 112 to 20 carbon atoms, preferably a saturated alkyl group having 3 to 10 carbon atoms.
- Specific examples of more preferred alkyl groups include an isopropyl group, a tert-butyl group, a 1-methylpropyl group, and a 1-ethylpropyl group.
- n is 1-10, preferably 2-4.
- acetal resin or compound represented by the general formula (I) examples include, for example, aldehyde: R CHO, dialcohol: RCH (OH), or acetal: RCH (OR 1 ) (wherein R is as defined above.
- R 1 represents an alkyl group.
- n represents the one defined above.
- a typical example is a polycondensation product having a repeating unit represented by the general formula (I) obtained by reacting ethylene glycol or polyethylene glycol represented by the formula at 50 ° C under reduced pressure with an acid catalyst. It is mentioned as a typical thing.
- the resin or compound (B) used in the chemically amplified photosensitive resin composition of the present invention which itself becomes soluble in alkali by the action of an acid which is insoluble or hardly soluble in alkali.
- a resin having a protective group which can be cleaved by the action of an acid and which becomes soluble in alkali after being cleaved by the action of an acid.
- the base resin which becomes soluble in alkali before being protected by the protecting group includes, as alkali-soluble groups, those having a phenolic hydroxyl group and a Z or carboxyl group, specifically, vinyl phenol resin; Isopropyl phenol resin; bulfenol, (meth) acrylic acid or a derivative thereof, copolymer with acrylonitrile and styrene or a derivative thereof, isopropenyl phenol, methacrylic acid or a derivative thereof, acrylonitrile and styrene or a derivative thereof Copolymer of styrene or a derivative thereof with acrylic acid ester, methacrylic acid ester, acrylic acid, methacrylic acid, maleic acid, maleic anhydride, etc .; copolymer of (meth) acrylic acid derivative having a carboxyl group Merge or (meta A) a copolymer in which the above (meth) acrylic acid derivative is used as one monomer such as acrylic acid; and
- the base resin in which at least a part of the hydrogen atom of the hydroxyl group or the carboxyl group in the base resin is modified with a protecting group that can be cleaved by the action of an acid is used in the present invention.
- the protecting group include those having a hydroxyl group or a carboxyl group and an acetal structure, an ether structure or an ester structure.
- Preferred protecting groups include 1-ethoxyethyl group, tert-butoxycarbol group, and tert-butoxyester group.
- the resin or compound (B) which is itself insoluble or hardly soluble in an alkali but becomes soluble in an alkali by the action of an acid is an alkali-soluble novolak resin (A) It is usually used in an amount of 115 parts by weight, preferably 110 parts by weight, per 100 parts by weight.
- the acid generator (C) which is used in the chemically amplified photosensitive resin composition of the present invention and which generates an acid upon irradiation with a radiation is a compound which generates an acid upon irradiation with a radiation Anything can be used.
- Typical examples of such an acid generator include those which have been conventionally used as an acid generator in a chemically amplified resist.
- Such acid generators include, but are not limited to, odonum salts, such as eodonium salts, sulfo-pam salts, diazo-pam salts, ammo-pam salts, and pyridi-pam salts. in a haloalkyl group-containing hydrocarbon compounds, haloalkyl group-containing heterocyclic I spoon compound such as (halomethyl triazine derivatives, etc.), the Jiazoketoni ⁇ thereof, 1, 3 Jiketo 2
- —Diazo compounds, diazobenzoquinone compounds, diazonaphthoquinone compounds, etc. are sulfonate compounds such as j8-ketosulfone and j8-sulfonylsulfone. Acid esters, iminosulfonates and the like. These can be used alone or in combination of two or more.
- the acid generator (C) is used in an amount of usually 0.02-10 parts by weight, preferably 0.5-3.0 parts by weight, based on 100 parts by weight of the alkali-soluble novolak resin. Can be
- the acid generator used in the present invention are triazines represented by 2- [2- (5-methylfuran-2-yl) ether] 4,6-bis- (trichloromethyl) -s triazine It is a cyano-based acid generator typified by 5-methylsulfo-roxyimino-5H-thiophene 2-ylidene-2-methyl-phenylacetonitrile.
- the photosensitive agent (D) containing a quinonediazide group used in the chemically amplified photosensitive resin composition of the present invention may be any photosensitive agent having a quinonediazide group.
- the functional group capable of condensing with the acid hydroxide include a hydroxyl group and an amino group, and a hydroxyl group is particularly preferable.
- the photosensitive agent containing a quinonediazide group is used in an amount of 100 parts by weight of the alkali-soluble resin component in the chemically amplified photosensitive resin composition. Usually, it is used in an amount of 1 to 30 parts by weight, preferably 3 to 15 parts by weight.
- the sensitizer containing a quinonediazide group may be used alone or in combination of two or more.
- the alkali-soluble acrylic resin (E) used in the present invention includes (E-1) an alkali-soluble polyacrylate, (E_2) an alkali-soluble polymethacrylate, and (E-1) 3) An alkali-soluble poly (acrylic ester) containing at least one acrylic ester and at least one methacrylic ester as constituent units
- acrylic resins can be used alone or in combination of two or more.
- the alkali-soluble atalylic resin (E) is used as needed, and the alkali-soluble novolak resin (A) is used in an amount of 0 to 200 parts by weight, usually 2 to 200 parts by weight based on 100 parts by weight. , Preferably in an amount of 10-50 parts by weight.
- an alkali-soluble acrylic resin when used, when the heat resistance of the resist film is improved, an effect can be obtained.
- These acrylic resins include an organic acid monomer as a monomer component and an acrylate ester having a hydroxy group in a side chain, or a methacrylate ester in order to make the resin alkali-soluble.
- the components that are preferably used as components include these organic acid monomers, which are copolymer components that impart lipophilicity to the resin!
- ⁇ is an acrylate or methacrylic acid having a hydroxy group in the side chain. It is not limited to esters.
- the monomer components constituting the alkali-soluble polyacrylic acid ester, polymethacrylic acid ester, or poly (acrylic acid ester'methacrylic acid ester) include acrylic acid ester, methacrylic acid ester, and organic acid. Examples include monomers and other copolymerizable monomers. Preferred examples of the acrylic acid ester, methacrylic acid ester, and organic acid monomer among the monomer components constituting the polymer include the following.
- Monocarboxylic acids such as acrylic acid, methacrylic acid and crotonic acid, dicarboxylic acids such as itaconic acid, maleic acid, fumaric acid, citraconic acid and mesaconic acid, and anhydrides of these dicarboxylic acids, 2-atalyloyl hydrogen phthalate, 2- Atariloyloxypropyl hydroxy phthalate etc.
- copolymerizable monomers include maleic acid diester, fumaric acid ester, styrene and styrene derivatives, for example, 4-fluorostyrene, 2,5-difluorostyrene, 2,4-difluorostyrene.
- Styrene p-isopropylstyrene, o-chlorostyrene, 4-acetylstyrene, 4-benzoylstyrene, 4-bromostyrene, 4-butoxycanolevo ninolestyrene, 4-butoxymethylstyrene, 4-butylstyrene, 4-ethylstyrene, 4-hexylstyrene, 4 4-methoxystyrene, 4-methylstyrene, 2,4-dimethylstyrene 2,5-dimethylstyrene, 2,4,5-trimethylstyrene, 4-phenylstyrene, 4-propoxystyrene, etc., acrylonitrile, (meth) acrylamide, butyl acetate, butyl chloride, Shiyidani Biyuriden etc.
- copolymerizable monomers styrene and styrene derivatives are preferred. These other copolymerizable monomers may be used, if necessary, in an amount within a range that allows the acrylic resin to achieve the object of the present invention.
- alkali-soluble acrylic resin used in the chemically amplified photosensitive resin composition of the present invention are a structural unit derived from (meth) acrylic acid and Z or hydroxy.
- the preferred polystyrene equivalent weight average molecular weight range of the acrylic resin of the present invention is from 2,000 to 200,000, more preferably from 20,000 to 100,000.
- a crosslinking agent is used as necessary for improving the film quality.
- the use of a cross-linking agent improves the surface roughness and thickness reduction of the resist film.
- a crosslinking agent for improving the film quality a compound containing at least two vinyloxyalkyl ester groups is preferable.
- the compound containing at least two vinyloxyalkyl ester groups for example, tris [4- (vinyloxy) butyl] trimellitate and bis [4 (bi-oxyxbutyl) butyl] isophthalate are preferred. No.
- the compound containing a vinyloxyalkyl ester group is usually used in an amount of 0 to 30 parts by weight, based on 100 parts by weight of the alkali-soluble resin component in the chemically amplified photosensitive resin composition. Preferably it is 110 parts by weight.
- the chemically amplified photosensitive resin composition of the present invention may contain the above-mentioned compound containing a vinyloxyalkyl ester group singly or may contain two or more kinds thereof. ⁇ .
- crosslinking agents for improving the film quality include melamine, benzoquanamine and urea, as well as alkoxyalkylated melamine resin and alkoxyalkylated urea resin, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, and tetrahydrofuran. Tetracarboxylic acid anhydrides.
- the photosensitive resin composition of the present invention may optionally contain a dye, an adhesion aid, a surfactant, and the like.
- dyes include methyl violet, crystal violet, and malachite green.
- adhesion aids include alkyl imidazoline, butyric acid, alkyl acid, polyhydroxystyrene, polyvinyl methyl ether, and t-butyl novolak.
- surfactants such as oxysilanes, epoxy polymers, and silanes include nonionic surfactants such as polydalicols and their derivatives, i.e., polypropylene glycol, or polyoxyethylene lauryl ether, fluorine-containing surfactants, e.g.
- Lard (trade name, manufactured by Sumitomo 3LM), Megafac (trade name, manufactured by Dainippon Ink and Chemicals, Inc.), Sulfuron (trade name, manufactured by Asahi Glass Co., Ltd.), or an organic siloxane surfactant such as KP341 (trade name) And Shin-Etsu Chemical Co., Ltd.).
- the alkali-soluble novolak resin of the present invention which itself is insoluble or hardly soluble in alkali but becomes soluble by the action of an acid, an acid generator, a sensitizer containing a quinonediazide group, an alkali
- the soluble acrylic resin, a crosslinking agent for improving the film quality, and other additives are dissolved in a solvent to form a photosensitive resin composition.
- Solvents for dissolving the constituent materials of these photosensitive resin compositions include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether, ethylene glycol monomethyl ether enoate acetate, and ethylene glycol monoethyl ether.
- Propylene glycol monoalkyl ethers such as ethylene glycol monoalkyl ether acetates, such as propylene glycol monoalkyl ether acetate, propylene glycol monomethyl ether ether, propylene glycol monomethyl ether; Propylene glycol monoalkyl ether acetates such as teracetate and propylene glycol monoethyl ether acetate; lactic acid such as methyl lactate and ethyl lactate Ester such as toluene, aromatic hydrocarbons such as xylene, methyl E chill ketone, 2-heptene Thanong, ketones cyclohexanone like cyclohexane, N, N-dimethyl ⁇ Seto amide, N-methylpyrrolidone amides such as down, Y Ratatons such as petit-mouth rataton can be given. These solvents can be used alone or in combination of two or more.
- the bonding method in the semiconductor mounting technology includes a wire bonding method in which a chip is connected to an external circuit using a wire, and a TAB (Tape) in which a chip and an external circuit are connected using a bump (metal projection). Automated Bonding) and FC (Flip Chip) methods.
- the bump formation technology is used for both the TAB method and the FC method, and the bump formation is performed on either the chip side electrode or the substrate side electrode. The formation of the bump is usually performed by the following method.
- silicon wafers with processed LSI elements silicon wafers with processed LSI elements
- a noble metal serving as a conductive layer is laminated thereon, and a photosensitive resin composition, a so-called resist, is applied to form a photoresist film.
- a pattern is formed by exposing through a mask and developing it so that a portion for forming a bump is opened.
- an electrode material such as gold or copper is deposited by electrolytic plating.
- the nori metal is removed by etching.
- the wafer power chips are cut into squares, and the process moves to packaging such as TAB and mounting processes for flip chips.
- a resist is formed in a pattern by the photosensitive resin composition.
- the chemically amplified photosensitive resin composition of the present invention is not limited to these bump production processes.
- it is suitably used as a resist in a cyan or non-cyan electrolytic gold plating process in a gold bump manufacturing process.
- FPDs such as LCDs (Liquid Crystal Display Devices), circuit boards, etc.
- LCDs Liquid Crystal Display Devices
- the chemically amplified photosensitive resin composition of the present invention is preferably used as a resist in a step of forming a plating with such copper, nickel, solder, or the like in a plating step when forming bumps or a plating step when forming wiring. Can be used.
- the chemically amplified photosensitive resin composition of the present invention is preferably used as a resist in a plating step performed continuously in the electrolytic gold plating step and a copper, nickel or solder plating step, that is, a multilayer plating step.
- the order of performing the gold plating step or the copper, nickel, and solder plating steps in the multilayer plating may be arbitrary!
- the chemically amplified photosensitive resin composition of the present invention can be suitably used also as a mask resist for forming a magnetic head or the like.
- the chemically amplified positive photosensitive resin composition of the present invention may be used, if necessary, in a conductive material such as aluminum, copper, silver, gold, palladium, or an alloy of two or more of these. Is applied on a substrate such as a substrate on which a conductive layer is formed, and is pre-betaed. Is a very thick photoresist layer.
- pattern exposure is performed through a mask, and further development processing is performed using an alkali developer, followed by rinsing processing and post-exposure beta (PEB) as necessary.
- PEB post-exposure beta
- a thick or ultra-thick positive resist pattern having a high resolution and a good shape is formed, and is particularly used as a thick or ultra-thick film resist for forming magnetic poles and bumps of a magnetic head. It is preferably used. In addition, it is used for other applications, such as circuit board resists and other conventional positive photosensitive resin compositions! It goes without saying that the chemically amplified positive photosensitive resin composition of the present invention can be suitably used. In addition, the positive photosensitive resin composition of the present invention has high sensitivity, a high residual film ratio after development, no scum, and excellent characteristics.
- a coating film may be formed by a method such as screen printing.
- the radiation used for exposure include ultraviolet rays such as g-rays and i-rays, far ultraviolet rays such as KrF excimer laser light or ArF excimer laser light, X-rays, and electron beams.
- a developing method a method conventionally used in developing a photoresist, such as a paddle developing method, an immersion developing method, and a swing immersion developing method, may be used.
- Examples of the developer include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, and the like, and organic amines such as ammonia, ethylamine, propylamine, getylamine, getylaminoethanol, and triethylamine. And quaternary amines such as tetramethylammonium-dimethyl hydroxide (TMAH).
- inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, and the like
- organic amines such as ammonia, ethylamine, propylamine, getylamine, getylaminoethanol, and triethylamine.
- quaternary amines such as tetramethylammonium-dimethyl hydroxide (TMAH).
- the chemically amplified photosensitive resin composition of the present invention has different optimum processing conditions including exposure conditions depending on the thickness of the photoresist, the exposure light source, the developer used, and the like.
- HBO1000WZD mercury lamp manufactured by Mitsubishi Osram used in Examples
- the exposure amount is usually about 100 to 1000 mjZcm 2 ' sec
- the development time is limited to the organic or inorganic
- the time is about 60 to 900 seconds.
- the chemically amplified photosensitive resin composition of the present invention is first applied on a releasable plastic film, which is not directly applied on a substrate to be treated, and then subjected to beta treatment to form a temporary support. It is also possible to use a so-called dry film in which a photoresist film is formed on a plastic film to be used, and this photoresist film is adhered to a substrate to be processed such as a substrate.
- the plating solution, plating method, and the like used in the plating step may be any conventionally known method or method.
- the present invention it is practically possible to achieve both high resolution and high sensitivity at a film thickness of, for example, 10 m or more, and further, applicability, line width uniformity of a resist pattern, and heat resistance.
- a chemically amplified photosensitive resin composition having excellent pattern formation and capable of forming a good pattern.
- the weight average molecular weight means a value in terms of styrene.
- novolak resin having a weight average molecular weight of 7,000 (m talesol 40%, p talesol 60%), and a weight average molecular weight obtained by condensation polymerization of triethylene glycol and 2-ethylbutane 1,1-diol of 1, 000 polymer, 30 parts by weight, 2— [2- (5-Methylfuran-2-yl) ether] 4,6 bis— (trichloromethyl) —s-triazine as acid generator 0.6 part by weight, and 1,4,4,1- [1- [4- [1- (4-hydroxyphenyl) -1- (1-methylethyl) phenyl] ethylidene] bisphenol 1,2 naphthoquinone (2) -diazido 4-sulfonic acid ester compound 4 weight was dissolved in 200 parts by weight of propylene glycol monomethyl ether acetate, and the mixture was stirred and filtered through a 1.2 / zm filter to give a photosensitive composition of
- a fat composition was prepared. This composition was spin-coated on a 6-inch silicon wafer and beta-heated on a hot plate at 115 ° C for 7 minutes to obtain a resist film having a thickness of 65 m.
- the hole diameter and wall width of this resist film were measured using SUSS 'Microtec exposure machine (MA-200 / ML) using an HBO1000WZD mercury lamp (illuminance at 405 nm, 25 mjZcm 2 ' sec) manufactured by Mitsubishi Osram. 30- 120 m: 30- 120 ⁇ various line test pattern width is One abacus became m 40 sec (lOOOiujZcm 2) exposed, 3.
- the film surface condition was determined based on the following criteria.
- Example 15 parts by weight of a terpolymer of methacrylic acid, methyl methacrylate, and n-butyl acrylate having a weight average molecular weight of 30,000 in addition to the photosensitive resin composition of Example 1 (molar ratio: 20Z50Z30) was performed in the same manner as in Example 1 except for using, and the results in Table 1 were obtained.
- Example 1 The procedure of Example 1 was repeated, except that 1 part by weight of tris [4- (vinyloxy) butyl] trimellitate was used in addition to the photosensitive resin composition of Example 1, and the results shown in Table 1 were obtained.
- Example 1 Instead of developing with a 3.0% by weight aqueous solution of TMAH for 480 seconds at 23 ° C, AZ303N (4.8% by weight aqueous solution of KOH) manufactured by Clariant (Japan) was diluted 7 times with distilled water. The procedure of Example 1 was repeated, except that the developed solution was developed at 23 ° C. for 200 seconds, and the results shown in Table 1 were obtained.
- Example 1 3 0 6 5 Good ⁇ Rectangular Example 2 3 0 6 5 Good ⁇ Rectangular Example 3 3 0 6 5 Good ⁇ Rectangular Example 4 3 0 6 5 Good ⁇ Rectangular Comparative Example 1 3 0 6 5 ⁇ Comparative Example 2 3 0 6 5 Poor X Comparative Example 3 3 0 6 5 No resolution ⁇ No scum was observed in any of the resist patterns obtained in the above Examples of the present invention. Was also good in shape. From Table 1 above, it can be seen that the chemically amplified photosensitive resin compositions of the present invention are all excellent in pattern shape, sensitivity and pattern surface condition.
- a quinonediazide-containing photosensitizer (PAC) and PAG and, if necessary, a cross-linking agent for improving the film quality enables the use of an inorganic developer even for an organic developer. It is possible to obtain the same performance as when used, and Table 1 shows that two components, PAC and PAG, and a cross-linking agent for improving the film quality can be used. It can be seen from the above that a good resist pattern on the film surface can be obtained.
- PAC quinonediazide-containing photosensitizer
- the heat resistance of the resist pattern obtained by using the chemically amplified photosensitive resin composition of the present invention was further evaluated.
- the resist pattern obtained in Example 2 was heat-treated at 90 ° C for 1 minute on a hot plate, and the force of comparing the resist pattern shapes before and after the heat treatment was not particularly changed. Met.
- Example 1 The photosensitive resin composition described in Example 1 was prepared, and a resist pattern was obtained in the same manner as in Example 1.
- the residual film ratio was 98% or more, and the pattern shape was rectangular and good.
- the thus obtained resist pattern was subjected to a heat treatment in the same manner as in Example 5, slight sagging of the pattern was observed.
- the chemically amplified photosensitive resin composition of the present invention provides a thick film having high sensitivity, high resolution, heat resistance, and plating resistance, and a photosensitive resin composition compatible with an ultra-thick film. It is preferably used as a resist when forming a magnetic pole of a magnetic head or a bump used as a connection terminal of an LSI.
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- Spectroscopy & Molecular Physics (AREA)
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- Compositions Of Macromolecular Compounds (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2004800319435A CN1875323B (zh) | 2003-10-31 | 2004-09-14 | 厚膜或超厚膜响应的化学放大型光敏树脂组合物 |
US10/575,338 US20070072109A1 (en) | 2003-10-31 | 2004-09-14 | Thick film or ultrathick film responsive chemical amplification type photosensitive resin composition |
AT04773036T ATE489657T1 (de) | 2003-10-31 | 2004-09-14 | Chemisch verstärkte lichtempfindliche harzzusammensetzung zur herstellung eines dickfilms oder ultradickfilms |
EP04773036A EP1688793B1 (en) | 2003-10-31 | 2004-09-14 | Chemically amplified photosensitive resin composition for forming a thick film or ultrathick film |
DE602004030276T DE602004030276D1 (de) | 2003-10-31 | 2004-09-14 | Chemisch verstärkte lichtempfindliche harzzusammensetzung zur herstellung eines dickfilms oder ultradickfilms |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003-373069 | 2003-10-31 | ||
JP2003373069A JP4440600B2 (ja) | 2003-10-31 | 2003-10-31 | 厚膜および超厚膜対応化学増幅型感光性樹脂組成物 |
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WO2005043247A1 true WO2005043247A1 (ja) | 2005-05-12 |
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PCT/JP2004/013354 WO2005043247A1 (ja) | 2003-10-31 | 2004-09-14 | 厚膜および超厚膜対応化学増幅型感光性樹脂組成物 |
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US (1) | US20070072109A1 (ja) |
EP (1) | EP1688793B1 (ja) |
JP (1) | JP4440600B2 (ja) |
CN (1) | CN1875323B (ja) |
AT (1) | ATE489657T1 (ja) |
DE (1) | DE602004030276D1 (ja) |
MY (1) | MY146544A (ja) |
TW (1) | TWI307825B (ja) |
WO (1) | WO2005043247A1 (ja) |
Cited By (1)
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CN101218541B (zh) * | 2005-07-12 | 2012-05-23 | Az电子材料美国公司 | 用于厚膜成像的光致抗蚀剂组合物 |
Families Citing this family (7)
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KR100993516B1 (ko) | 2005-06-13 | 2010-11-10 | 가부시끼가이샤 도꾸야마 | 포토레지스트 현상액, 및 그 현상액을 사용한 기판의 제조방법 |
WO2011074433A1 (ja) * | 2009-12-16 | 2011-06-23 | 日産化学工業株式会社 | 感光性レジスト下層膜形成組成物 |
KR20110129692A (ko) * | 2010-05-26 | 2011-12-02 | 삼성전자주식회사 | 포토레지스트 조성물 및 이를 이용한 포토레지스트 패턴의 형성 방법 |
KR20120107653A (ko) | 2011-03-22 | 2012-10-04 | 삼성디스플레이 주식회사 | 감광성 수지 조성물 및 이를 이용한 패턴의 형성 방법 |
JP2019137612A (ja) * | 2018-02-06 | 2019-08-22 | 公立大学法人大阪市立大学 | 化合物、感光性樹脂組成物およびレジスト膜の形成方法 |
US20210382390A1 (en) * | 2018-05-24 | 2021-12-09 | Merck Patent Gmbh | Novolak/dnq based, chemically amplified photoresist |
KR101977886B1 (ko) * | 2018-06-18 | 2019-05-13 | 영창케미칼 주식회사 | 패턴 프로파일 개선용 화학증폭형 포지티브 포토레지스트 조성물 |
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- 2004-09-14 DE DE602004030276T patent/DE602004030276D1/de not_active Expired - Lifetime
- 2004-09-14 AT AT04773036T patent/ATE489657T1/de not_active IP Right Cessation
- 2004-09-14 WO PCT/JP2004/013354 patent/WO2005043247A1/ja active Application Filing
- 2004-09-14 EP EP04773036A patent/EP1688793B1/en not_active Expired - Lifetime
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CN101218541B (zh) * | 2005-07-12 | 2012-05-23 | Az电子材料美国公司 | 用于厚膜成像的光致抗蚀剂组合物 |
Also Published As
Publication number | Publication date |
---|---|
TW200517782A (en) | 2005-06-01 |
EP1688793B1 (en) | 2010-11-24 |
CN1875323A (zh) | 2006-12-06 |
JP2005134800A (ja) | 2005-05-26 |
US20070072109A1 (en) | 2007-03-29 |
CN1875323B (zh) | 2010-06-16 |
TWI307825B (en) | 2009-03-21 |
DE602004030276D1 (de) | 2011-01-05 |
EP1688793A1 (en) | 2006-08-09 |
EP1688793A4 (en) | 2007-02-21 |
MY146544A (en) | 2012-08-15 |
ATE489657T1 (de) | 2010-12-15 |
JP4440600B2 (ja) | 2010-03-24 |
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