WO2005033173A1 - 潜在性硬化剤 - Google Patents
潜在性硬化剤 Download PDFInfo
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- WO2005033173A1 WO2005033173A1 PCT/JP2004/012895 JP2004012895W WO2005033173A1 WO 2005033173 A1 WO2005033173 A1 WO 2005033173A1 JP 2004012895 W JP2004012895 W JP 2004012895W WO 2005033173 A1 WO2005033173 A1 WO 2005033173A1
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- curing agent
- latent curing
- chelating agent
- aluminum
- agent
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/70—Chelates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/0838—Manufacture of polymers in the presence of non-reactive compounds
- C08G18/0842—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents
- C08G18/0847—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents in the presence of solvents for the polymers
- C08G18/0852—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents in the presence of solvents for the polymers the solvents being organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Definitions
- the present invention relates to a latent curing agent capable of initiating curing of a thermosetting epoxy resin composition at a relatively low temperature, a method for producing the same, and a thermosetting type resin containing the same that has good storage stability.
- the present invention relates to an epoxy resin composition. Background technology
- Thermosetting epoxy resin compositions are widely used as adhesive materials, molding materials and the like, and a latent imidazole-based curing agent is used as one of the curing agents. Since this latent imidazole-based curing agent does not exhibit curability in a normal storage state, the thermosetting epoxy resin composition is converted into a one-pack type curing composition having good handleability and good storage stability. Widely used for.
- a typical example of such a latent imidazole curing agent is a microphone mouth capsule type in which imidazole compound particles having the ability to cure an epoxy resin are coated with a cured epoxy resin. I have.
- the surface of the microphone opening capsule wall is formed by colliding child particles with mother particles, so that the surface has irregularities and unevenness. Therefore, there is a problem that stable curing characteristics are not easily obtained, and it is difficult to control curing conditions.
- An object of the present invention is to solve the above-mentioned problems of the conventional technology, and it is an aluminum chelating agent system capable of curing a thermosetting epoxy resin at a relatively low temperature for a short time.
- the present inventors have found that a polymer obtained by interfacially polymerizing a polyfunctional isocyanate compound in the presence of an aluminum chelating agent by using an interfacial polymerization method can achieve the above-mentioned objects, and have achieved the present invention. Completed.
- the aluminum chelating agent is a polyfunctional isocyanate compound.
- a latent curing agent characterized by being held by a porous resin obtained by subjecting a product to interfacial polymerization.
- the present invention provides the method for producing a latent curing agent as described above, wherein the aluminum chelating agent and the polyfunctional isocyanate compound are dissolved in a volatile organic solvent, and the obtained solution is dispersed in an aqueous phase containing a dispersant. And a method for producing a polymer by interfacial polymerization by heating and stirring.
- thermosetting resin composition comprising the above-mentioned latent curing agent, a silane coupling agent, and a thermosetting resin.
- the latent curing agent of the present invention is held in a porous resin obtained by interfacially polymerizing a polyfunctional isocyanate compound with an aluminum chelating agent, a thermosetting epoxy resin can be used at a relatively low temperature for a short time. Can be cured. Further, according to the method for producing a latent curing agent of the present invention, an aluminum chelating agent and a polyfunctional isocyanate compound are dissolved in a volatile organic solvent, and the obtained solution is poured into an aqueous phase containing a dispersant. However, since the interface polymerization is performed by heating and stirring, the curing conditions of the latent curing agent can be controlled relatively easily.
- FIG. 1A is an electron micrograph of the latent hardener particles.
- FIG. 1B is an enlarged electron micrograph near the center of the latent hardener particles of FIG. 1A.
- FIG. 2 is a DSC measurement diagram of the thermosetting epoxy resin prepared in Example 8.
- FIG. 3 is a DSC measurement diagram of the thermosetting epoxy resin prepared in Example 9.
- FIG. 4 is a DSC measurement diagram of the thermosetting epoxy resin prepared in Example 10.
- FIG. 5A is a particle size distribution chart of the latent curing agent prepared in Experimental Example 11b of Example 11.
- FIG. 5B is a particle size distribution chart of the latent curing agent prepared in Experimental Example 11c of Example 11.
- FIG. 5C is a particle size distribution chart of the latent curing agent prepared in Experimental Example 11 d of Example 11.
- FIG. 5D is a particle size distribution chart of the latent curing agent prepared in Experimental Example 11e of Example 11.
- FIG. 6A is an electron micrograph of the latent curing agent of Experimental Example 11b of Example 11.
- FIG. 6B is an electron micrograph of the latent curing agent of Experimental Example 11e of Example 11;
- FIG. 7A is an electron micrograph of the latent curing agent of Experimental Example 12a.
- FIG. 7B is an electron micrograph of the latent curing agent of Experimental Example 12b.
- FIG. 7C is an electron micrograph of the latent curing agent of Experimental Example 12c.
- FIG. 7D is an electron micrograph of the latent curing agent of Experimental Example 12d.
- FIG. 7E is an electron micrograph of the latent curing agent of Experimental Example 12e.
- FIG. 7F is an electron micrograph of the latent curing agent of Experimental Example 12f.
- FIG. 8A is an electron micrograph of conventional latent hardener particles when partially saponified PVA was used.
- FIG. 8B is an electron micrograph of conventional latent hardener particles using fully saponified PVA. Explanation of reference numerals
- the latent curing agent of the present invention is one in which an aluminum chelating agent is retained in a porous resin obtained by interfacially polymerizing a polyfunctional isocyanate compound. Since this latent curing agent uses an aluminum chelating agent capable of realizing low-temperature rapid curing, it is necessary to impart good low-temperature rapid curing to a thermosetting resin composition containing the latent curing agent. Can be. Further, since the aluminum chelating agent is retained in the porous resin obtained by interfacial polymerization, even if this latent curing agent is blended with the thermosetting resin composition (even in a one-packed state), The storage stability of the composition can be greatly improved.
- an electron micrograph of the latent curing agent 1 (Fig. 1A), instead of a microstructured pressurizer with a simple structure in which the periphery of the aluminum chelating agent core is covered with a porous resin shell.
- the structure is such that the aluminum chelating agent is held in a large number of fine holes 3 existing in the porous resin matrix 2.
- the latent curing agent 1 of the present invention is produced by using an interfacial polymerization method, its shape is spherical, and its particle diameter is preferably 0 in terms of curability and dispersibility. 5 to 100 m, and the size of the pores 3 is preferably 5 to 150 nm from the viewpoint of curability and latency.
- the latent curing agent 1 tends to decrease its potential if the degree of crosslinking of the porous resin used is too small, and its thermal responsiveness tends to decrease if the degree of crosslinking is too large. It is preferable to use a porous resin with a controlled degree of crosslinking. Yes.
- the degree of crosslinking of the porous resin can be measured by a micro compression test.
- the latent curing agent 1 of the present invention preferably does not substantially contain an organic solvent used at the time of the interfacial polymerization, and specifically, it is preferably 1 ppm or less from the viewpoint of curing stability.
- the content of the porous resin and the aluminum chelating agent in the latent curing agent 1 of the present invention is such that if the content of the aluminum chelating agent is too small, the thermal responsiveness is reduced, and if the content is too large, the potential is reduced.
- the aluminum chelating agent is used in an amount of preferably 100 to 200 parts by mass, more preferably 10 to 150 parts by mass, based on 100 parts by mass of the porous resin.
- examples of the aluminum chelating agent include a complex compound represented by formula (1) in which three 3-ketoenolate anions are coordinated to aluminum.
- RR 2 and R 3 are each independently an alkyl group or an alkoxyl group.
- the alkyl group include a methyl group and an ethyl group.
- the alkoxyl group include a methoxy group, an ethoxy group and an oleyloxy group.
- the aluminum chelating agent represented by the formula (1) include aluminum tris (acetyl acetate) and aluminum tris (ethyl acetate).
- Acetate aluminum monoacetate acetate bis (ethyl acetate acetate), aluminum monoacetate acetate bisoleyl acetate acetate, ethyl acetate acetate aluminum acetate, aluminum acetate acetate aluminum acetate Sopro belate and the like.
- the polyfunctional isocyanate compound is preferably a compound having two or more isocyanate groups, preferably three isocyanate groups in one molecule.
- a more preferred example of such a trifunctional isocyanate compound is a self-condensation of 3 mol of a TMP adduct and a diisocyanate compound of the formula (2) in which 1 mol of trimethylolpropane is reacted with 3 mol of a diisocyanate compound.
- the substituent R is a portion of the diisocyanate compound except for the isosilicate group.
- diisocyanate compounds Specific examples are toluene 2,4-diisocyanate, toluene 2,6-diisocyanate, m-xylylene diisocyanate, hexamethylene diisocyanate, hexahi draw m-xylylene diisocyanate, isophorone diisocyanate, methylene diphenyl 4, 4'—Diisocyanate is listed.
- a part of the isocyanate group is hydrolyzed to form an amino group during the interfacial polymerization, and the amino group and the amino group are combined.
- It is a porous polyurea that reacts with succinate groups to form a urea bond to form a polymer.
- the latent curing agent of the present invention is obtained by dissolving an aluminum chelating agent and a polyfunctional isocyanate compound in a volatile organic solvent, adding the obtained solution to an aqueous phase containing a dispersant, and heating and stirring.
- an aluminum chelating agent and a polyfunctional isocyanate compound are dissolved in a volatile organic solvent to prepare a solution to be an oil phase in interfacial polymerization.
- the reasons for using volatile organic solvents are as follows. is there. That is, when a high-boiling solvent having a boiling point exceeding 300 ° C, as used in a normal interfacial polymerization method, is used, the organic solvent does not volatilize during interfacial polymerization, and the contact probability with isocyanoate-water is high. Is not increased, and the degree of progress of interfacial polymerization between them becomes insufficient.
- Such a volatile organic solvent is a good solvent (preferably having a solubility of at least 0.1 lg / ml (organic solvent) or more) of an aluminum chelating agent and a polyfunctional isocyanate compound, and is dissolved in water.
- a solubility of water is 0.5 g / ml or less (organic solvent) or less
- the boiling point at atmospheric pressure is 100 ° C or less
- volatile organic solvents include alcohols, acetates, ketones and the like. Among them, ethyl acetate is preferred because of its high polarity, low boiling point and poor water solubility.
- the amount of the volatile organic solvent used is 100 parts by mass of the total amount of the aluminum chelating agent and the polyfunctional silicate compound. If the amount is too small, the potential decreases, and if it is too large, the thermal responsiveness decreases. Therefore, it is preferably 100 to 500 parts by mass.
- the viscosity of the oil phase solution can be reduced by using a relatively large amount of the volatile organic solvent within the usage range of the volatile organic solvent. Oil droplets in the reaction system can be made finer and more uniform, and the particle size of the resulting latent hardener can be reduced to submicron to several micron. It is possible to monodisperse the particle size distribution while controlling the size.
- the viscosity of the oil phase solution is 1 to 2.5 m It is preferable to set P a ⁇ s.
- the hydroxyl group of the PVA reacts with the polyfunctional isocyanate compound.
- Fig. 8A When partially saponified PVA is used), and the particle shape itself is deformed
- Fig. 8B When completely saponified PVA is used.
- the amount of the aluminum chelate agent is preferably not more than 1/2, more preferably not more than 1 to 3 by weight of the polyfunctional isocyanate compound. This increases the probability of contact between the polyfunctional isocyanate compound and water, and facilitates the reaction between the polyfunctional isocyanate compound and water before the PVA contacts the oil phase droplet surface.
- the amount of the aluminum chelating agent in the oil phase may be increased.
- the compounding amount of the aluminum chelating agent is preferably at least equal to the weight of the polyfunctional isocyanate compound, more preferably 1.0 to 2.0 times.
- the concentration of isocyanate on the surface of the oil phase droplet decreases.
- the rate of the reaction (interfacial polymerization) of the polyfunctional isocyanate compound with the amine formed by hydrolysis is higher than that of the hydroxyl group, the reaction probability of the polyfunctional isocyanate compound with the PVA can be reduced.
- an aluminum chelating agent and a polyfunctional isocyanate are used.
- An oily phase solution in which a cyanate compound is dissolved in a volatile organic solvent is put into an aqueous phase containing a dispersant, and is heated and stirred to cause interfacial polymerization.
- the dispersant those used in a normal interfacial polymerization method such as polyvinyl alcohol, carboxymethyl cellulose, and gelatin can be used.
- the amount of the dispersant used is usually 0.1 to 10.0 mass of the aqueous phase. /. It is.
- the blending amount of the oil phase solution with respect to the aqueous phase is preferably 5 to 50 parts by mass with respect to 100 parts by mass of the aqueous phase. Parts by weight.
- the emulsification conditions in the interfacial polymerization are preferably such that the size of the oil phase is preferably 0.5 to ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ (a stirrer homogenizer; stirring speed of 800 rpm or more). Heating and stirring under atmospheric pressure, at a temperature of 30 to 80 ° C., for a stirring time of 2 to 12 hours, and the like.
- the polymer fine particles are separated by filtration and air-dried to obtain the latent curing agent of the present invention.
- the curing characteristics of the latent curing agent are controlled by changing the type and amount of the polyfunctional isocyanate compound, the type and amount of the aluminum chelating agent, and the interfacial polymerization conditions. You can talk. For example, lowering the polymerization temperature can lower the curing temperature, while increasing the polymerization temperature can raise the curing temperature.
- the latent curing agent of the present invention can be used for the same applications as conventional imidazole-based latent curing agents, and is preferably used at a low temperature by using a silane coupling agent and a thermosetting resin together.
- a fast-curing thermosetting resin composition can be provided.
- the content of the latent curing agent in the thermosetting resin composition is too small, it will not be sufficiently cured, and if it is too large, the resin properties (eg, flexibility) of the cured product of the composition will be reduced.
- the silane coupling agent is heat-cured in cooperation with the aluminum chelating agent as described in paragraphs 007 to 010 of JP-A-200-212530. It has the function of initiating cationic polymerization of a hydrophilic resin (for example, a thermosetting epoxy resin).
- a hydrophilic resin for example, a thermosetting epoxy resin.
- Such a silane coupling agent is one having one to three lower alkoxy groups in the molecule, and a group having a reactivity with a functional group of the thermosetting resin in the molecule, for example, , A butyl group, a styryl group, an acryloyloxy group, a methacryloyloxy group, an epoxy group, an amino group, a mercapto group and the like.
- the latent curing agent of the present invention is a cationic curing agent, when the amino group or the mercapto group does not substantially capture the generated cationic species. It can be used for
- silane coupling agent examples include Burtris ( ⁇ -methoxethoxy) silane, vinyl triethoxy silane, vinyl trimethoxy silane, ⁇ -styryl trimethoxy silane, and ⁇ -methacryloxy propyl Trimethoxysilane, ⁇ / —acryloxyprovir Trimethoxysilane, ⁇ —
- the content of the silane coupling agent in the thermosetting resin composition is too small, the curability becomes low, and if the content is too large, the resin properties (for example, storage stability) of the cured product of the composition decrease, so the latent 50 to 15 parts per 100 parts by mass of curing agent It is 0.00 parts by mass, preferably from 300 to 1200 parts by mass.
- thermosetting resin a thermosetting epoxy resin, a thermosetting urea resin, a thermosetting melamine resin, a thermosetting phenol resin, or the like can be used.
- a thermosetting epoxy resin can be preferably used in consideration of good adhesive strength after curing.
- thermosetting epoxy resin may be liquid or solid, and preferably has an epoxy equivalent of usually about 100 to 400, and has two or more epoxy groups in the molecule.
- a bisphenol A type epoxy compound, a phenol novolak type epoxy compound, a cresol novolak type epoxy compound, an ester type epoxy compound, an alicyclic type epoxy compound and the like can be preferably used.
- these compounds include monomers and oligomers.
- thermosetting resin composition of the present invention may contain a filler such as silica and My power, a pigment, an antistatic agent, and the like, if necessary.
- the thermosetting resin composition of the present invention includes conductive particles, metal particles, and resin cores having a particle size on the order of several / xm in which the surface of the resin core is covered with a metal plating layer. And the like further coated with 1 to 10 mass of the whole. It is preferable to mix at a mixing amount of / 0 . This makes it possible to use the thermosetting resin composition of the present invention as an anisotropic conductive adhesive paste or an anisotropic conductive film.
- thermosetting resin composition of the present invention is prepared by uniformly mixing and stirring a latent curing agent, a silane coupling agent, a thermosetting resin, and other additives that are added as necessary according to a conventional method. Can be manufactured.
- thermosetting resin composition of the present invention has excellent storage stability, despite being a one-part type, since the curing agent is latent.
- the latent curing agent cooperates with the silane coupling agent, so that the thermosetting resin can be cationically polymerized by low-temperature rapid curing.
- Lu 4,4'-G Sociate (3 mol) Trimethylolpropane (1 mol) adduct (D-109, Mitsui Takeda Chemical Co., Ltd.) The oil phase solution dissolved in parts by weight was added, and the mixture was emulsified and mixed with a homogenizer (110,000 rp / 10 minutes), followed by interfacial polymerization at 60 ° C.
- the polymerization reaction solution was allowed to cool to room temperature, and the interfacial polymerization particles were separated by filtration and naturally dried to obtain 20 parts by weight of a spherical latent curing agent having a particle diameter of about 10 ⁇ m. .
- Example 2 Methylenediphenyl-1,4'-diisocyanate (3 moles) instead of trimethylolpropane (1 mole) adduct, toluenediisocyanate (3 moles) and methylenediphenyl-1,4,4'-diene
- trimethylolpropane (1 mol) adduct of cyanate (3 mol) (D-103M-2, Mitsui Takeda Chemical Co., Ltd.) was used. 20 parts by weight of a spherical latent curing agent having a particle size of about 10 ⁇ m were obtained.
- thermosetting epoxy resin composition was prepared by uniformly mixing 8 parts by weight.
- thermosetting epoxy resin composition was subjected to thermal analysis using a differential thermal analyzer (DSC) (DSC200, Seiko Instruments Inc.).
- DSC differential thermal analyzer
- the results obtained are shown in Table 1 and FIG.
- the exothermic start temperature means the curing start temperature
- the exothermic peak temperature means the temperature at which curing is most active
- the exothermic end temperature means the curing.
- the end temperature means the peak temperature
- the peak area means the calorific value.
- Example 1 75 Measurement omitted 106 203- 478.425
- Example 2 103 Measurement omitted 131 214 -368.224
- Example 3 136 206 160 206 -251.807
- Example 4 124 122 148 232-100.666
- Example 5 101 147 131 239 -220. 929
- Example 6 131 203 158 228 -204.317
- Example 7 118 Measurement omitted 149 218 -2 11.21 As shown in Table 1 and FIG.
- Example 2 based on the results of the latent curing agents of Examples 1 to 6, the curing characteristics of the latent curing agent were controlled by changing the type of multifunctional compound. It turns out that it is possible.
- the curing start temperature of the latent curing agent was 100 ° C. or less.
- Example 9a to 9e The amount of the aluminum chelating agent aluminum monoacetate acetate bis (ethyl acetate acetate) in a 24% isopropanol solution (aluminum chelate 13, Kawaken Fine Chemical Co., Ltd.) is shown in the table.
- Latent curing agents were prepared according to the procedure of Example 1 except that the procedure was changed as shown in Example 2 (Examples 9a to 9e).
- Table 2 it can be seen that as the amount of the aluminum chelating agent increases, the polymer particles tend to agglomerate, and when the amount increases further, a particulate interfacial polymer tends not to be obtained. It can also be seen that the peak heating temperature tends to decrease accordingly (see Figure 3).
- Table 2 Aluminum chelating agent Particulate interface Heating peak
- thermosetting epoxy resin composition (Experimental examples 10a to 10h) was prepared by uniformly mixing 8 parts by weight of the agent.
- thermosetting epoxy resin composition was subjected to a thermal analysis using a differential thermal analyzer (DSC620, Seiko Instruments Inc.).
- Figure 4 shows the results obtained. From Fig. 4, it can be seen that the curing characteristics of the latent curing agent can be controlled by changing the type of the silane coupling agent. Table 3
- Example 11 In order to investigate the effect of the viscosity of the oil phase solution on the particle size distribution of the latent curing agent particles, the aluminum monoacetylacetonate bis (e) in Example 1 was examined. Ethylacetate) and methylene diphenyl 4,4'-diisocyanate (3 mol) adduct of trimethylolpronone (1 mol) in ethyl acetate.
- the latent curing agents of Experimental Examples 11a to 11e were obtained by repeating the same operation as in Example 1 except that the amount of addition was increased and the viscosity of the oil phase solution was changed to the value shown in Table 4.
- Experimental Example 11b is a repetition of Example 1.
- Trimethylolpropane (1 mol) adduct of aluminum monoacetyl acetate bis (ethyl acetate acetate), an aluminum chelating agent, and methylene diphenyl 4,4'-diisocyanate (3 mol), a polyfunctional isocyanate compound
- a polyfunctional isocyanate compound In the oil phase solution dissolved in the same amount of ethyl acetate as in Example 11 e, except that the addition amounts of the aluminum chelating agent and the polyfunctional isocyanate compound were changed to the amounts shown in Table 5 below, By repeating the same operation as in Example 1, latent curing agents of Experimental Examples 12a to 12f were obtained.
- FIGS. 7A to 7F show electron micrographs of the obtained latent curing agents of Experimental Examples 12a to 12f.
- the particle size of the resulting latent curing agent particles could be reduced to a maximum particle size of 5 ⁇ m or less because polymerization proceeds after the oil droplets were refined. From these results, it can be seen that when the blending amount of the aluminum chelating agent is 1/2 or less by weight of the polyfunctional isocyanate compound, no foreign matter adheres to the particles. Further, even when the blending amount of the aluminum chelating agent is equal to or greater than the weight of the polyfunctional isocyanate compound, it can be seen that there is no adhesion of foreign matter to the particles.
- the amount of the aluminum chelating agent should be not more than 1 to 2 by weight of the polyfunctional isocyanate compound. Or, it is understood that it is preferable to use the same amount or more.
- the aluminum chelating agent-based latent curing agent of the present invention can cure a thermosetting epoxy resin at a relatively low temperature for a short period of time, It is useful as a curing agent for an anisotropic conductive adhesive capable of anisotropically conductive connection between them.
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Abstract
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Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04772844.9A EP1666516B1 (en) | 2003-09-08 | 2004-08-30 | Latent hardener |
US10/569,277 US20070010636A1 (en) | 2003-09-08 | 2004-08-30 | Latent hardener |
CN2004800257034A CN1856521B (zh) | 2003-09-08 | 2004-08-30 | 潜在性固化剂 |
KR1020067004666A KR101162782B1 (ko) | 2003-09-08 | 2004-08-30 | 잠재성 경화제 |
HK07101958.1A HK1094808A1 (en) | 2003-09-08 | 2007-02-21 | Latent hardener |
US12/213,439 US8927626B2 (en) | 2003-09-08 | 2008-06-19 | Latent curing agent |
Applications Claiming Priority (6)
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EP (1) | EP1666516B1 (ja) |
JP (1) | JP4381255B2 (ja) |
KR (1) | KR101162782B1 (ja) |
CN (2) | CN1856521B (ja) |
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- 2004-08-30 CN CN2010101314934A patent/CN101792521B/zh active Active
- 2004-08-30 KR KR1020067004666A patent/KR101162782B1/ko active IP Right Grant
- 2004-08-30 US US10/569,277 patent/US20070010636A1/en not_active Abandoned
- 2004-08-30 WO PCT/JP2004/012895 patent/WO2005033173A1/ja active Application Filing
- 2004-08-30 EP EP04772844.9A patent/EP1666516B1/en active Active
- 2004-09-01 TW TW093126339A patent/TWI248966B/zh active
-
2007
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Also Published As
Publication number | Publication date |
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TW200517463A (en) | 2005-06-01 |
EP1666516B1 (en) | 2018-06-13 |
CN1856521A (zh) | 2006-11-01 |
KR20060085617A (ko) | 2006-07-27 |
KR101162782B1 (ko) | 2012-07-04 |
EP1666516A1 (en) | 2006-06-07 |
HK1142618A1 (en) | 2010-12-10 |
TWI248966B (en) | 2006-02-11 |
JP2006070051A (ja) | 2006-03-16 |
EP1666516A4 (en) | 2009-02-11 |
CN101792521A (zh) | 2010-08-04 |
US8927626B2 (en) | 2015-01-06 |
CN1856521B (zh) | 2010-05-26 |
US20070010636A1 (en) | 2007-01-11 |
CN101792521B (zh) | 2012-01-18 |
JP4381255B2 (ja) | 2009-12-09 |
US20080319110A1 (en) | 2008-12-25 |
HK1094808A1 (en) | 2007-04-13 |
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