WO2005017859A1 - 表示装置及びその駆動方法 - Google Patents
表示装置及びその駆動方法 Download PDFInfo
- Publication number
- WO2005017859A1 WO2005017859A1 PCT/JP2004/011603 JP2004011603W WO2005017859A1 WO 2005017859 A1 WO2005017859 A1 WO 2005017859A1 JP 2004011603 W JP2004011603 W JP 2004011603W WO 2005017859 A1 WO2005017859 A1 WO 2005017859A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- capacitor
- light emitting
- row
- display device
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 114
- 239000003990 capacitor Substances 0.000 claims abstract description 179
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000011159 matrix material Substances 0.000 claims abstract description 51
- 238000005192 partition Methods 0.000 claims description 45
- 239000010409 thin film Substances 0.000 claims description 39
- 230000008021 deposition Effects 0.000 claims description 32
- 239000010419 fine particle Substances 0.000 claims description 16
- 238000007599 discharging Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229910052454 barium strontium titanate Inorganic materials 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 10
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 claims description 7
- 239000010408 film Substances 0.000 description 65
- 238000005401 electroluminescence Methods 0.000 description 64
- 229910052782 aluminium Inorganic materials 0.000 description 43
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical class [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 42
- 238000000151 deposition Methods 0.000 description 30
- 238000010586 diagram Methods 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 230000008569 process Effects 0.000 description 19
- -1 polyphenylene vinylene Polymers 0.000 description 17
- 239000000463 material Substances 0.000 description 15
- 239000010949 copper Substances 0.000 description 10
- 238000001704 evaporation Methods 0.000 description 10
- 230000008020 evaporation Effects 0.000 description 10
- 230000007423 decrease Effects 0.000 description 9
- 229920003023 plastic Polymers 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 238000001755 magnetron sputter deposition Methods 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- APLQAVQJYBLXDR-UHFFFAOYSA-N aluminum quinoline Chemical compound [Al+3].N1=CC=CC2=CC=CC=C12.N1=CC=CC2=CC=CC=C12.N1=CC=CC2=CC=CC=C12 APLQAVQJYBLXDR-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 7
- 239000011368 organic material Substances 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 7
- 238000007738 vacuum evaporation Methods 0.000 description 7
- 238000007740 vapor deposition Methods 0.000 description 7
- 238000010549 co-Evaporation Methods 0.000 description 6
- 239000012776 electronic material Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- QRZMXADUXZADTF-UHFFFAOYSA-N 4-aminoimidazole Chemical compound NC1=CNC=N1 QRZMXADUXZADTF-UHFFFAOYSA-N 0.000 description 5
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 5
- 229910052791 calcium Inorganic materials 0.000 description 5
- 239000011575 calcium Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- WFVBQIFDYSMSCI-UHFFFAOYSA-N cyanic acid 1H-imidazol-2-amine Chemical compound OC#N.OC#N.NC1=NC=CN1 WFVBQIFDYSMSCI-UHFFFAOYSA-N 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000001771 vacuum deposition Methods 0.000 description 5
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 4
- 230000008033 biological extinction Effects 0.000 description 4
- 229940125904 compound 1 Drugs 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 4
- 230000015654 memory Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 4
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 229940125782 compound 2 Drugs 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920002457 flexible plastic Polymers 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 3
- AXFFGMPNSZVEDX-UHFFFAOYSA-N 1,1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,13,13,14,14,15,15,16,16,17,17,18,18,19,19,20,20,21,21,22,22,23,23,24,24,24-pentacontafluorotetracosane Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F AXFFGMPNSZVEDX-UHFFFAOYSA-N 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910003472 fullerene Inorganic materials 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- LSYUYOITVKAFRA-UHFFFAOYSA-N carboxy hydrogen carbonate;1h-imidazol-2-amine Chemical compound NC1=NC=CN1.OC(=O)OC(O)=O LSYUYOITVKAFRA-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229940126214 compound 3 Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
- G09G2300/088—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements using a non-linear two-terminal element
- G09G2300/0885—Pixel comprising a non-linear two-terminal element alone in series with each display pixel element
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2310/00—Command of the display device
- G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2310/00—Command of the display device
- G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
- G09G2310/0243—Details of the generation of driving signals
- G09G2310/0251—Precharge or discharge of pixel before applying new pixel voltage
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2310/00—Command of the display device
- G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
- G09G2310/0243—Details of the generation of driving signals
- G09G2310/0254—Control of polarity reversal in general, other than for liquid crystal displays
- G09G2310/0256—Control of polarity reversal in general, other than for liquid crystal displays with the purpose of reversing the voltage across a light emitting or modulating element within a pixel
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2310/00—Command of the display device
- G09G2310/06—Details of flat display driving waveforms
- G09G2310/061—Details of flat display driving waveforms for resetting or blanking
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2320/00—Control of display operating conditions
- G09G2320/04—Maintaining the quality of display appearance
- G09G2320/043—Preventing or counteracting the effects of ageing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Definitions
- the present invention relates to a self-luminous display device of an organic electroluminescence (EL) display panel and a method of driving the display device. More specifically, the present invention relates to a display device that drives, by a switching element, pixels that emit light in a matrix configuration including a plurality of rows and a plurality of columns, a method of manufacturing the same, and a method of driving the display device. .
- EL organic electroluminescence
- the driving method of the organic EL display panel can be roughly classified into two types.
- the first driving method is called a passive matrix type (or a duty driving method or a simple matrix method).
- a passive matrix type or a duty driving method or a simple matrix method.
- a plurality of stripe electrodes are combined in rows and columns in a matrix, and a pixel located at each intersection of a row electrode and a column electrode is caused to emit light by a drive signal applied to the row and column electrodes.
- a signal for light emission control is usually scanned in a row direction in a time-series manner for each row, and is simultaneously applied to each column of the same row.
- This passive matrix type driving method is a method in which an active element is not usually provided in each pixel, and light emission is controlled only during a duty period of each row in a row scanning cycle.
- the second driving method is called an active matrix type in which each pixel has a switching element and can emit light within a row scanning cycle.
- the current flowing through the organic EL element may be increased.
- the efficiency of organic EL light emission decreases as the current increases. Due to this decrease in efficiency, when the active-matrix driving method and the passive-matrix driving method are compared at the same display luminance, the passive-matrix driving method consumes relatively large power.
- the current flowing through the organic EL element is increased, there is a disadvantage that the material is deteriorated due to heat generation or the like and the life of the display device is shortened immediately.
- the maximum current is limited from the viewpoints of efficiency and life, it is necessary to lengthen the light emission period to obtain the same display luminance.
- a thin film transistor (TFT) using polysilicon is used as a pixel switching element.
- the process temperature for forming a TFT using polysilicon is a high temperature of at least 250 ° C., and there is a problem that it is difficult to use a flexible plastic substrate.
- a display device using an active matrix driving method has a problem that manufacturing cost is increased. For example, the cost of manufacturing an active matrix substrate is 50 times the cost of the entire display panel. occupies more than / o.
- Patent Document 1 discloses a new type of organic thin film EL device. ing.
- Patent Document 1 states, "Unlike conventional organic thin film EL elements, the light emitting / non-light emitting state is excessive.
- a new type of organic thin-film EL device that has a memory property according to the way of applying the previous applied voltage, and as a result, can control the light emitting / non-light emitting state by applying an ON / OFF signal, and its driving method.
- ⁇ a thin film of a substance that transfers from an insulator to a conductor by applying a voltage of a predetermined value or more between the organic thin film and one or both surfaces of the electrode.
- a predetermined voltage is applied to the electrodes to transfer the current switching layer from the insulator to the conductor, thereby causing the organic thin-film elector luminescence element to emit light, and furthermore, the current switching layer insulates the voltage from the conductor.
- the organic thin-film electroluminescent element is driven so as to exhibit a non-light emitting state by reducing it until it is transferred to the body.
- a state where a constant voltage is applied to the organic thin-film electroluminescent element is maintained. By superimposing positive and negative pulse voltages on this constant voltage, the light emitting state and the non-light emitting state are switched. Driving force can be achieved.
- Patent Document WO 01/15233 discloses that pixel driving control is performed by an organic thin-film transistor. According to this, since the driving element is made of an organic material, a manufacturing process at a low temperature is possible, and therefore, a flexible plastic substrate can be used. In addition, since inexpensive materials and processes can be selected, costs can be reduced.
- Non-Patent Document 1 a paper by L. P. Ma et al.
- Non-Patent Document 2 discloses an organic EL using a switching element using aminoimidazole dicarbonate (AIDCN). It shows that the device can be applied to memories by driving the device in binary. Each of these elements has a binary resistance value for a certain voltage, and the switching is performed by applying an appropriate pulse. This resistance Since the time required for value switching is about lOnsec, sufficient responsiveness can be ensured for normal display driving.
- the specific method for driving a matrix-structured (dot matrix display) display device is as follows. H, V, are also disclosed in the misaligned literature.
- a display element having a matrix configuration is driven as follows. First, the case of a single pixel will be described.
- the switching element exemplified here has two voltage-current characteristics of a high-resistance characteristic 114A (off state) and a low-resistance characteristic 114B (on state) (see FIG. 11).
- the applied voltage is Vth2 or more, it changes from off to on, and when the applied voltage becomes Vthl or less, it changes from on to off. Therefore, the resistance value can be switched by applying a pulse of Vth2 or more for the transition from off to on and applying a pulse of Vthl or less for the transition from on to off.
- each row is sequentially selected to perform a running display, and each row is in the selected period.
- An operation of writing data to a row is performed.
- the following description is made on the assumption that a dot matrix display in which a plurality of pixels are arranged in a matrix by defining columns and rows in a display device configured as a dot matrix in this way.
- a row electrode 104, a light emitting unit 110, a pixel electrode 112, a switching element 114, and a column electrode 116 are formed on one surface of a glass substrate 120.
- the above control is performed on the pixels in a certain row, and the bias is maintained in the range from Vthl to Vth2 until the next scanning cycle, so that the duty cycle is reduced.
- the switching element that is not limited to the period can be maintained in either the on / off state.
- the following problems arise when such control is performed. In other words, it is necessary to maintain the voltage application to the switching elements during the scanning cycle (during the frame period) using the switching elements (see FIG. 9) as described above. It is necessary to keep the circuits in the rows other than the selected row connected. As a result, the switching signal of one row is applied to all the other rows. As a result, when the switching element 114 as shown in Fig. 9 is used, it is difficult to perform onZoff control of pixels on the entire matrix using the conventional passive matrix driving method as it is. It is.
- Patent Document 1 JP 2001-160492 A
- Patent Document 2 WO 01/15233 pamphlet
- Non-Patent Document 1 Takato Koyamada, "Formation of Cu: TCNQ Complex Thin Film and Switching Device by Vacuum Evaporation Method” , Third Volume, 27a-M-5)
- Japanese Patent Application No. 2002-255763 Japanese Patent Application No. 2002-255763 by a part of the inventor of the present application discloses a method of driving a display element having a matrix configuration, in which one row is arranged in a row direction.
- a predetermined voltage is applied to a row to be duty-driven, and the other rows are applied during the window ⁇ . Only a method of applying a voltage obtained by offsetting the predetermined voltage by a predetermined offset value is described.
- a display element having a matrix configuration can be realized.
- the light emission state obtained by each pixel is a binary value of ON / OFF, and in order to obtain gradation, the duty driving frequency of the screen is increased, the power to change the light emission level in each cycle, and the difference in pixel area.
- these methods have not been able to provide sufficient gradation levels due to limitations such as high responsiveness of the driving elements or influence on image resolution. For example, by controlling the duty drive frequency from normal 60Hz to 480Hz, it is possible to control eight gradations.
- an object of the present invention is to provide a display device such as an organic EL display panel which can realize multi-tone display at low cost and can be manufactured on a flexible substrate, and a display device therefor.
- a driving method is provided.
- another object of the present invention is to provide a thin film light emitting element in which a capacitor is connected in parallel with the organic EL element.
- Another object of the present invention is to provide a display device capable of obtaining sufficient display characteristics by sufficiently securing the area of a light emitting element and a capacitor, and a method of manufacturing the same.
- the electric resistance of the organic EL is generally extremely high at a low voltage, so that the discharge of the capacitor charge becomes extremely slow to decay when the voltage reaches a certain voltage. Therefore, as shown in FIG. 15, the charge of the capacitor remains until the next duty period, which affects the light emission amount in the next frame period. In order to prevent this, it is necessary to temporarily erase the residual charge of the capacitor to suppress the influence of the previous history. In particular, if light remains in a frame that does not emit light, the ON / OFF ratio will decrease.
- 2001-350431 discloses a method in which a capacitor and a light emitting section are connected to different wirings, and a non-light emitting method is used to erase a residual charge by applying a reverse bias voltage to the capacitor section.
- a non-light emitting method is used to erase a residual charge by applying a reverse bias voltage to the capacitor section.
- Japanese Patent Application Laid-Open No. 2003-228326 discloses a similar method. These measures make it possible to erase the history.
- the power discharged at this time does not contribute to light emission, so it becomes invalid power, and causes an increase in power consumption of the display panel.
- the fact that not all of the accumulated charges contribute to light emission causes a problem of causing variation in light emission amount.
- it is necessary to increase the number of wirings to the pixels there is a problem that the manufacturing cost is also increased.
- Means for solving the problem In the present invention, a first set of stripe electrodes formed in parallel with each other and a second set of stripe electrodes formed in parallel with each other in a direction intersecting with the first set of stripe electrodes. And a plurality of pixels at points where the electrodes of the first set of stripe electrodes and the electrodes of the second set of stripe electrodes intersect three-dimensionally on the substrate.
- Each of the elements includes a switching element formed of a non-linear two-terminal element electrically connected to one of the first set of stripe electrodes, and a switching element electrically connected to the switching element, and A light emitting portion electrically connected to one of the stripe electrodes; and an organic dielectric as a dielectric layer, the switching element and the second set of stripe electrodes being electrically parallel to the light emitting portion.
- a capacitor electrically connected to the electrode A display device provided with a part of a densa is provided.
- a hold-type display is performed by the action of the switching element. Display not only during the duty period but also during the non-duty period). At this time, a part of the capacitor is used to accumulate the electric charge necessary for light emitting display during the non-duty period. By using a part of this capacitor, a hold-type display can be realized even with a two-terminal element.
- this dielectric layer of an organic dielectric by forming this dielectric layer of an organic dielectric, it is possible to cope with a deformation of the substrate that does not require a high film forming temperature.
- a ceramic material other than an organic dielectric can be used as a dielectric layer. That is, the switching element and the capacitor of the second set of stripe electrodes electrically connected to the switching element and the electrode of the second set of stripe electrodes so as to include the barium strontium titanate oxide as a dielectric layer and to be electrically parallel to the light emitting portion.
- a display device having a section is also provided.
- the dielectric layer when an organic dielectric is used for the dielectric layer, it is preferable that the dielectric layer further includes a large number of conductive fine particles dispersed therein.
- the switching element is a bistable element or a diode element.
- the effective relative dielectric constant is 50, depending on the deposition conditions. A value of 150 is obtained.
- the organic dielectric when an organic dielectric is used, the organic dielectric preferably has a relative dielectric constant of 50 or more, more preferably 100 or more.
- a relative dielectric constant of about 250 to 800 is obtained. Also, with barium strontium titanate, a value of about 50 MV / m, which has a high electric breakdown voltage, can be obtained, and a value as high as 150 MV / m can be obtained.
- a ceramic-based material when a ceramic-based material is used, a material having a relative dielectric constant of preferably 250 or more can be used. In the present invention, when a ceramics-based material is used, the material preferably has an electric breakdown voltage of 50 MV / m.
- the switching element has a laminated structure of an aluminum / diciano compound Z-aluminum, a switching element having a laminated film of a polyethylene dioxythiophene film and a polyphenylene vinylene film, an aluminum thin film / Those having a laminated structure of fullerene thin film / copper thin film and those having a laminated structure of aluminum electrode / butadiene compound / gold electrode are preferable.
- the diode has either C60 or pentacene.
- the effective dielectric constant of the dielectric layer is increased, so that a capacitor having a small area and a sufficient capacitance can be formed.
- the area of the light emitting section can be increased, the current density of the light emitting section can be reduced, and the light emitting efficiency and the life of the light emitting section can be improved.
- display with a higher display capacity (number of display lines) and luminous efficiency cooperate with a part of a capacitor that maintains light emission during a non-duty period. And life can be compatible.
- the diode having C60 or pentacene the voltage drop when applying a voltage is lower than that of other organic materials. That is, power loss is suppressed, which is extremely advantageous in terms of power consumption.
- the light emitting section and the capacitor part are arranged on the same plane. It is preferable that the device further includes an insulating portion for electrically separating the light emitting portion and the dielectric layer of a part of the capacitor.
- the display device of the present invention can be manufactured with a simple structure.
- the substrate is a flexible substrate.
- a display device can be manufactured without using a process with a high processing temperature; therefore, a flexible substrate can be used.
- a display device which is lightweight, has high resilience, and has high impact resistance as compared with a case where a glass substrate is used is realized.
- the light emitting unit, the capacitor part, and the switching element are formed on a substrate, are formed of a thin film, and each have an electrode layer on both surfaces.
- the part and the switching element are sequentially laminated on the substrate together with their respective electrode layers in the order or in the reverse order, and the electrode on the capacitor side of the light emitting section and the capacitor side of the switching element.
- the electrical connection with the electrodes of the capacitor is provided in a part of the capacitor and is made via a first via, and the electrode on the light emitting part side of the part of the capacitor and the electrode of the second set of stripe electrodes are provided.
- the electrical connection to the light emitting unit is provided through the second via, and is further provided with an insulating unit that insulates the light emitting unit from a part of the capacitor.
- Display device is also Ru suitable der.
- the via is also called a through hole, and is well known to those skilled in the art as a means for making electrical connection between layers.
- a large area can be used for the light emitting unit and the capacitor part, and both the efficiency and the life of the light emitting unit and the capacitance of the capacitor part can be compatible. .
- the first via is provided along a side of a region of the capacitor part so as to pass through a side surface of the capacitor part, and is lined with an insulator.
- the second via is provided along a side of a region of the light emitting unit, passing through a side surface of the light emitting unit, and is lined with an insulator, and the insulator is continuous with the insulating unit. It is preferable to use
- a simple structure is provided by arranging a via for securing an electrical connection via a side surface of the part of the capacitor and a side surface of the light emitting part. Can be used to configure the via.
- This via may be lined with an insulator that is continuous with the insulation. This makes the structure of the display device simpler.
- an electrode layer provided on the substrate is provided as the first set or the second set of striped electrodes, and a plurality of striped electrodes are provided so as to intersect the direction of the striped electrodes of the electrode layer.
- the device further includes an electrically insulating partition wall that partitions adjacent pixels in the direction of the stripe electrodes of the electrode layer and has an overhang portion protruding in a direction parallel to the substrate at an upper portion.
- the present invention also provides a method for manufacturing a display device. That is, the step of forming the light emitting portion including the electrode layer by oblique deposition using the partition wall as a mask, the step of forming the insulating portion by oblique deposition using the partition wall as a mask, The display described above, comprising: forming a part of the capacitor by oblique deposition using the partition as a mask; and forming the switching element including an electrode layer by oblique deposition using the partition as a mask.
- a method for manufacturing a device is provided.
- a display device which can be manufactured without using an expensive photo process is provided.
- a display device it is possible to manufacture a display device with good display by arranging a mask deposition process, which is a film forming process through a mask, as much as possible.
- the display device includes a duty drive in which each pixel is addressed by a row electrode and a column electrode in which the first set and the second set of stripe electrodes are combined.
- a dot matrix display of a first type in which a signal for making the switching element conductive is applied by the row electrode or the column electrode or both in a duty period of a selected row.
- a method for driving any of the display devices is provided.
- a driving method in which each pixel is specified by a row and a column (or X and Y), and a dot matrix driving for obtaining a display image by the pixel is performed.
- the signal for bringing the nonlinear two-terminal element into a conductive state is generated when the nonlinear two-terminal element is an element that does not exhibit hysteresis characteristics, or is an element that exhibits hysteresis characteristics (eg, a bistable element).
- the electric charge for causing the light emitting section to emit light is an electric charge for realizing a required light emission luminance, so that gradation display can be performed in accordance with the amount of the electric charge.
- the signal is such that a leak current leaking through the switching element can be suppressed to a practically non-conductive state.
- a signal is generated by the row electrode and the column electrode, the switching element and the force S applied to a part of the light emitting unit and the capacitor connected in series with the switching element and connected in parallel to each other, and the switching operation of the switching element.
- the signal to be in a non-conductive state is particularly effective when a bistable element is used.
- the first step and the second step can be performed in a predetermined first window period and a predetermined second window period, respectively.
- the first and second window periods are time intervals determined in this order in a duty period determined for each selected row.
- a voltage offset signal having the same polarity as a voltage signal applied to the column electrode is applied to a row electrode of a row other than the selected row. It is suitable. It is also preferable that in the first step, a voltage offset signal having a polarity opposite to a voltage signal applied to the column electrode is applied to a row electrode of the selected row. It is also preferable that in the third step, a voltage offset signal having the same polarity as a voltage signal applied to the column electrode is applied to a row electrode of a row other than the selected row in the third step.
- a voltage offset signal having the same polarity as the voltage signal applied to the column electrode is applied to a row electrode of a row other than the selected row.
- a voltage signal (voltage) applied to the row electrode of an unselected row is applied to the column electrode.
- the characteristics of the switching element and the voltage sharing ratio of the element that is connected in series and to which the voltage is distributed are considered. Then, a voltage signal exceeding the threshold value for turning on the switching element or lowering the threshold value for turning off the switching element is applied by the row and column electrodes of the selected row. . Also, the offset voltage applied to the row electrodes of the rows that are not selected is set so as not to exceed (or to fall below) these thresholds.
- a method of driving the display device includes a row electrode in which the first set and the second set of stripe electrodes are combined.
- a dot matrix display of a duty driving method in which each pixel is addressed by a column electrode and a column electrode. In a duty period of a selected row, the switching element is set to a conductive state, and further, the light emitting unit is turned on.
- a display having a step of causing the light-emitting portion to emit light by discharging the electric charge accumulated in a part of the capacitor through the light-emitting portion.
- the driving method of location are also provided.
- each pixel is addressed by a row electrode and a column electrode in which the first set and the second set of stripe electrodes are combined.
- a dot matrix display of a system is performed, and in a duty period of a selected row during a certain frame period, a reverse bias is applied to the switching element.
- the switching element is a diode element having a low resistance at a high voltage and having a high resistance at a low voltage
- the capacitor can be charged via the diode element.
- the voltage drops, the charged charge does not leak through the diode element, thereby enabling matrix driving.
- the light emitting section is made conductive by the row electrode and / or the column electrode, and a fourth step of discharging a charge remaining in the capacitor section is provided.
- a fifth step is to apply a signal to make the light emitting section non-conductive by the row electrode or the column electrode or both.
- this charge can be a charge for realizing a required light emission luminance, and a gray scale display can be performed according to the charge amount.
- a signal that can suppress a leakage current to a degree that can be regarded as a practically non-conductive state when the non-conductive state is set.
- the fourth and fifth steps can be performed in a predetermined first window period 706, and the first and second steps can be performed in a predetermined second window period 705.
- the first and second window periods are time intervals determined in this order during one duty period determined for each selected row.
- the fourth and fifth steps are for erasing the previous history by discharging the residual charges, and the first and second steps correspond to the writing of the next signal. Therefore, it is preferable to perform the steps in the above order.
- the rectifying element When the rectifying element has a low resistance at a high voltage and has a high resistance at a low voltage, when a high voltage force S is applied to the rectifying element, the capacitor can be charged through the rectifying element, and when the voltage decreases, the charging is performed.
- the matrix drive can be performed without the leaked charge leaking through the rectifying element.
- a display device comprising: a light emitting unit electrically connected; and a capacitor unit electrically connected to the rectifying element and the second set of electrodes so as to be electrically parallel to the light emitting unit.
- a driving method wherein during a duty period, a voltage offset signal is applied to both or both of the first electrode and the second electrode, and electric charges remaining in the capacitor unit are discharged via a light emitting unit.
- a first step and then a charge for causing the light emitting section to emit light.
- a driving method is provided.
- the first electrode is one of a first set of stripe electrodes formed in parallel with each other
- the second electrode is the first set of stripe electrodes.
- a plurality of pixels at a point of intersection with the substrate, the rectifier element is electrically connected to one of the first set of stripe electrodes, and is provided at each of the plurality of pixels.
- a light emitting section electrically connected to the rectifying element and one of the second set of striped electrodes, and a light emitting section provided in each of the plurality of pixels;
- the rectifying element so that the part is in parallel with the light emitting part.
- a capacitor portion electrically connected to the electrodes of the second set of stripe electrodes and provided in each of the plurality of pixels, wherein the display device is configured of the first set and the second set. It is preferable to perform a dot matrix display of a duty-one drive method in which each pixel is addressed by a row electrode and a column electrode in which a strip electrode is combined. Thus, dot matrix display can be performed using a large number of stripe electrodes.
- all of the switching element, the light emitting element, and the capacitor can be made of an organic electronic material thin film having a thickness of about 100 nm and a metal electrode thin film.
- an organic dielectric layer containing a large number of dispersed conductive fine particles which is a material having a high relative dielectric constant, may be used for a part of the dielectric layer of the capacitor, or barium strontium titanate oxide having a high relative dielectric constant may be used.
- a large amount of electric charge can be stored in a small area with a high dielectric constant, and the area of the light-emitting portion is increased when the light-emitting portion and a part of the capacitor are physically juxtaposed. High luminous efficiency can be obtained by reducing the density
- FIG. 1 is an explanatory diagram showing a configuration example of a display element in the present invention.
- FIG. 2 is an explanatory diagram illustrating an equivalent circuit of a display element when a bistable element is used as a switching element.
- FIG. 3 is an explanatory diagram showing an example of a voltage applied to a display element and an emission state when a bistable element is used as a switching element.
- FIG. 4 is an explanatory diagram showing voltage distribution when a voltage is applied to an organic EL element and a bistable element connected in series.
- FIG. 5 is an explanatory diagram showing an example of a method of applying a voltage to each display element during a duty period and a non-duty period.
- FIG. 6 is an explanatory diagram showing an equivalent circuit when a rectifying element is used as a switching element.
- FIG. 7 is an explanatory diagram showing an example of force, applied voltage, and light emission state of a display element when a rectifying element is used as a switching element.
- FIG. 8 is an explanatory diagram showing a structure and a manufacturing method of a display device according to an embodiment of the present invention.
- FIG. 9 is a cross-sectional view showing a conventional configuration example in which an organic EL element and a switching element are connected in series (laminated).
- FIG. 10 is an explanatory view illustrating a matrix configuration for a display device.
- FIG. 1 l A graph showing the voltage-current characteristics of the switching element when the Off signal voltage is positive.
- FIG. 8 is an explanatory diagram showing another example of FIG. 7 in an optical state.
- FIG. 13 is a diagram showing an example of voltage-current characteristics of a diode element using C60 as an organic electronic material.
- FIG. 14 is a diagram showing an example of voltage-current characteristics of a diode element using pentacene as an organic electronic material.
- FIG. 15 is a diagram showing a time change of a current flowing through the organic EL element in the embodiment of the present invention.
- FIG. 16 is a diagram showing an example of voltage-current characteristics of a diode element using a polyethylene dioxythiophene film and a polyphenylene vinylene film as organic electronic materials.
- FIG. 17 is a diagram showing an example of voltage-current characteristics of the organic EL element in Example 2.
- FIG. 18 is a characteristic diagram showing a voltage waveform applied to each electrode, a voltage waveform applied to each electrode and an element, and a temporal change in light emission intensity according to the embodiment of the present invention.
- FIG. 19 is a characteristic diagram in which a part of a time change of a voltage waveform and light emission intensity is enlarged.
- FIG. 20 is an explanatory diagram showing an example of electrical characteristics of the light emitting device of the present invention.
- FIG. 21 is a cross-sectional view showing a structure of a pixel of the display device according to the embodiment of the present invention.
- the charge corresponding to the amount of light emission is accumulated in the capacitor connected in parallel to the pixels of the row to be duty-driven in the matrix, and during the time outside the duty period, the capacitor is not charged.
- the light emission is continued by the discharge from.
- the disadvantage of the conventional capacitor is eliminated by forming the dielectric layer by an organic dielectric in which conductive fine particles are dispersed.
- the switching element according to the present embodiment has a conductive state after the applied voltage has become larger than the first threshold, and has a non-conductive state after the applied voltage has become smaller than the second threshold.
- a bistable element can change the electric resistance by several orders of magnitude by applying a noise-like electric field, and is simple in terms of controllability and matching with a light emitting element, and Since the current effective area is large, a large current can be obtained and the transition speed can be increased quickly.
- each pixel is electrically isolated from a signal line (eg, a column electrode) by a switching element, and continues to emit light by electric charges stored in a capacitor. Since the amount of accumulated charge can be adjusted according to the required light emission intensity, a gray scale display can be easily obtained.
- a signal line eg, a column electrode
- a ceramic oxide-based capacitor can be used as the capacitor.
- a good capacitor can be obtained by depositing barium strontium titanate, a typical ferroelectric, with a thickness of several 100 nm by RF magnetron sputtering and subjecting it to thermal treatment at about 650 ° C. Can be done.
- barium titanate can be obtained. It has been known that even when mustrontium is formed at a low temperature, a high dielectric constant, for example, a dielectric constant exceeding 40 can be obtained.
- FIG. 1 is a cross-sectional view showing a cross-sectional structure of one pixel of the display device 10 according to the present embodiment.
- a row electrode 104 is formed on one surface of the plastic substrate 102 using a transparent electrode material made of ITO (indium tin oxide).
- the row electrode 104 may be called a timing signal line, an X electrode, or the like (for example, FIG. 2).
- the row electrodes 104 are patterned into a plurality of striped electrodes parallel to each other. In the figure, since the one pixel is enlarged, the entire pattern jungle is not shown.
- a light emitting section 110 made of an organic EL element and a capacitor part 106 are juxtaposed so as to be separated by a partition wall 108.
- a pixel electrode 112 made of a metal (for example, aluminum) is formed, and a switching element 114 is formed.
- the pixel element 112 is made of a metal and has a stripe shape parallel to each other so as to cross the row electrode 104.
- Column electrodes 116 patterned on a plurality of electrodes are formed.
- the column electrode 116 is sometimes called a data signal line, a Y electrode, or the like (for example, FIG. 2).
- Each electrode, organic EL element, switching element, part of the capacitor, etc. are formed by a thin film, and the current of the organic EL element or the switching element flows perpendicular to the film surface.
- FIG. 2 is an equivalent circuit diagram for a certain pixel of the display device 10 in this case
- FIG. 3 is a diagram showing a voltage waveform (FIG. 3a) applied to a column electrode (data signal line or Y electrode) 116 for a certain pixel. ), The voltage waveform applied to the row electrode (timing signal line or X electrode) 104 (FIG. 3b), and the voltage waveform calculated from them and applied to the light emitting unit 110 and the switching element 114 (FIG. 3c).
- FIG. The light emitting state 314 of the light emitting unit 110 is also shown in FIG. 3c.
- the bistable element 202 of each pixel first sets the difference between the voltage of the ON signal 306 of the column electrode 116 and the voltage of the row electrode 104 during the duty period 302 (within the selection period) of the row to which the pixel belongs.
- the conductive state is established by the voltage distributed to the bistable element 202.
- the current from the column electrode (data signal line) 116 at the charging voltage 310 It flows and accumulates.
- the bistable element 202 detects the difference between the voltage of the off signal 308 of the column electrode 116 and the offset voltage 312 for canceling the signal of the row electrode 104.
- the pixel electrode 112 is disconnected from the column electrode 116 by the non-conductive state due to the voltage distributed to the stable element 202. After this disconnection, the light emitting state 314 is continued by discharging the capacitor 106.
- FIG. 4 shows a relationship between voltages distributed to the light emitting unit 110 and the bistable element 202 during the duty period 302 and the non-duty period 304.
- the capacitor 402a in FIG. 4 shows a case where the bistable element 202 is in a non-conductive state (off state), and the resistor 402b shows an equivalent circuit element showing a case where the bistable element 202 is in a conductive state (on state). It is.
- the potential difference between the row electrode and the column electrode is all distributed to the bistable element 202 in the non-conducting state, but in the conducting state, the ratio of only H (0 ⁇ minus 1) is Distributed to
- the operation of the bistable element 202 is substantially the same as that shown in the operation characteristic diagram of the conventional bistable element in FIG.
- FIG. 5a shows the voltage waveform of the selected row during the duty period of the selected row
- FIG. 5b shows the voltage waveform of the non-selected row at the same time as in FIG. 5a.
- What is being compared is the waveforms of two pixels: one pixel belonging to the selected row and another pixel belonging to a non-selected row in the same column as the pixel.
- the column electrode 116 is common to both of these pixels, and a voltage waveform 516 is applied.
- the selected row no bias voltage is applied to the voltage waveform 508 of the timing signal line 104.
- the offset voltage Vc and one Vd are applied to the voltage waveform 510 of the timing signal line 104 in accordance with the ON signal 502 and the OFF signal 506.
- the voltage applied to the bistable element 202 is a multiple of the voltage waveform 516, while in the non-selected row, the voltage obtained by subtracting Vc from the voltage waveform Vd (the period of the ON signal 502) is applied to the non-selected row. ) Or a voltage obtained by adding Vc to the voltage waveform Vd (the period of the off signal 506).
- the offset voltage applied in the non-selected row is for avoiding the influence of the conduction / non-conduction switching signal from the data signal line 116 in the non-selected row. Contrary to this method, by applying an appropriate bias to the timing signal line during the duty period, a conduction / non-conduction switching signal is given and the non-duty During the period, no bias is applied, and a method is naturally possible.
- a bias voltage Vb is applied to this switching element, and the switching signal (Von) to on is applied at the beginning of the duty period when the power is initially off, and the current rises, and the switching element is turned on during the duty period. The state is maintained. At the end of the duty period, the current falls due to the switching signal (one Voff) to off.
- Von and Voff are set so that Vb + Von> Vth2, Vb-Voff-Vthl with respect to the switching thresholds Vthl and Vth2.
- the bias in each window is offset by —Vc, Vd to prevent switching from occurring in the rows other than the row.
- FIG. 6 is an equivalent circuit when the rectifying element 602 is used as a switching element.
- FIG. 7 is a diagram showing a voltage waveform applied to a column electrode (data signal line or Y electrode) 116 for a certain pixel. Fig. 7a), the voltage waveform applied to the row electrode (timing signal line or X electrode) 104 (Fig. 7b), and the voltage waveforms calculated from them and applied to the light emitting unit 110 and the switching element 114
- FIG. 7C is a diagram schematically showing (FIG. 7C). The light emitting state 710 of the light emitting unit 110 is also shown in FIG. 7c.
- FIG. 4 is an explanatory diagram showing an example of a voltage and a light emitting state in that case.
- the rectifier has nonlinearity in which the resistance decreases in the high voltage region.
- a negative bias of 1 Vb is applied to the timing signal line (row electrode) 104 to reduce the resistance of the rectifying element to obtain a conductive state.
- Von is applied to the data signal line
- the voltage applied to the rectifier is Von + Vb.
- no bias is applied, and driving at a low voltage results in a substantially non-conductive state.
- a non-emission (quenching) signal voltage of voltage VLoff is applied during the period, and a voltage of VAon and a voltage of VAoff are applied to each row electrode during each period of the selection period (duty period).
- the period during which the light emission signal voltage is applied is the latter half of the duty period, and the period during which the extinction voltage signal is applied is the first half of the duty period.
- the voltage waveform applied to each row electrode is a bias voltage having a polarity opposite to that of the light emitting signal and the non-light emitting signal.
- the light emitting section 110 emits light in the latter half of the duty period, and in a non-duty period, the light emission continues due to the action of the capacitor, and light emission occurs in the first half of the duty period of the next frame.
- Light emission of the unit 110 stops (light emission intensity change 150).
- the reverse bias current of the diode element 602 using C60 as the organic electronic material increases with the reverse bias voltage, so that by applying a sufficient reverse bias voltage, the charge remaining in the capacitor 106 is increased. Can be discharged.
- the start of the frame period is shown in FIG. 13 as coincident with the start of the duty period, generally, the start timing of this period does not always coincide.
- Insulating barrier ribs were formed by a photo process on a polyethylene terephthalate substrate with ITO, and a light emitting element was formed on one of them and a capacitor was formed on one of the two divided areas. Each area was the same. Furthermore, a switching element was formed to cover both of these two elements. ITO is pre-patterned to form 15 rows of stripe electrodes with a pitch of 1.0 mm and a width of 0.7 mm.
- a polyethylenedioxythiophene film and a polyphenylenevinylene film were sequentially formed as a light emitting element by an ink-jet method, and then a calcium film was formed by vacuum evaporation to form an organic EL layer.
- the thickness of each layer was 100 nm, 100 nm, and 100 nm, respectively.
- the capacitor element was formed by a vacuum evaporation method using aminoimidazole dicyanate (compound 1) as an insulating organic material and aluminum as conductive fine particles to form a dielectric layer by a co-evaporation method.
- Aluminum was sequentially and continuously formed into a thin film as an electrode layer to form a capacitor.
- the electrode layer, the dielectric layer, and the electrode layer were formed to have a thickness of 130 nm, 40 nm, and 130 nm, respectively.
- the vapor deposition apparatus with a diffusion pump exhaust was performed at a vacuum degree of 4 X 10- 4 Pa (3 X 10- 6 torr).
- Aluminum was deposited by a resistance heating method at a deposition rate of 30 nm / sec.
- Aminoimidazole dicinate containing aluminum as conductive fine particles was prepared by a co-evaporation method. The evaporation is performed by a resistance heating method, and the deposition rate is 20 nmZsec for aminoimidazoledisocyanate and lOnmZsec for aluminum.
- the vapor deposition of each layer was performed continuously using the same vapor deposition device, and the conditions were such that the sample did not come into contact with air during the vapor deposition.
- the switching element has a Vthl force of 0 V, a Vth2 of 5.0 V, a bias of 4.0 V, an on state current density of 40 mA / cm 2 , and an off state current density of 0.1 mA / cm 2. It was.
- the voltage drop of the organic EL element in the on state was 3.5 V, the emission intensity was 30 Cd / m 2 , and no voltage drop and no light emission were observed in the off state. If the scanning frequency of the entire panel is 240 Hz, that is, the scanning cycle is about 4.2 msec, the duty period for each row is 0.42 msec.
- the amount of charge stored in the capacitor was about 12 ⁇ QZcm 2 at maximum, and the maximum current density of the bistable element was about 40 mAZcm 2 .
- the effective area of the switching element was about twice as large as that of a capacitor or light-emitting element, so it was possible to operate at a lower value. In addition, this gave 25 CdZm 2 as the average luminance of the panel.
- the total amount of charge during the duty period can be easily controlled by changing the current time, thereby obtaining a gradation of light emission luminance.
- Example 2 An example will be described in which conductive fine particles are dispersed in a capacitor to increase the dielectric constant.
- a sample was prepared in the same manner as in Example 1 except that gold was used as the conductive fine particles, and the thicknesses of the electrode layer, the dielectric layer, and the electrode layer were 110 nm, 80 nm, and 110 nm, respectively. The same test was performed. Under similar conditions, the panel operated satisfactorily. The maximum amount of charge stored in the capacitor was about 15 ⁇ Q / cm 2 , and the maximum current density of the bistable element was about 40 mA / cm 2 . This gave an average luminance of 30 Cd / m 2 for the panel. The gradation of the emission luminance could be easily obtained as in Example 1.
- a polyethylene dioxythiophene film and a polyphenylene vinylene film were sequentially formed by an ink-jet method, and thereafter, calcium was added.
- the film was formed by vacuum evaporation to form a rectifying element.
- the thickness of each layer was 200 nm, 40 nm and 120 nm respectively.
- a copper phthalocyanine (CuPC) / naphthylphenyldiamine (NPB) / aluminum quinoline (Alq3) / calcium electrode was formed as an organic EL layer in a half area of the partition wall by vacuum evaporation.
- each layer was 100 nm, 50 nm, 50 nm, and 100 nm, respectively.
- a part of the capacitor was formed in the other half area in the same manner as in Example 1.
- Organic EL Selection of the deposition area of the part and the capacitor part was based on the metal mask. After the evaporation of a part of the organic EL part, an aluminum film was evaporated as a common electrode covering both elements. This aluminum film was subjected to pattern jungling perpendicular to the ITO electrodes so as to form 10 rows of strip electrodes with a pitch of 1 mm and a width of 0.7 mm. This forms a matrix of 15 systems IJ, 10 rows.
- FIGS. 16 and 17 show the current-voltage characteristics of the rectifier and the organic EL element in the forward direction.
- the voltage drop for obtaining a current density of 40 mAZcm 2 was about 3.5 V in the rectifier element, and was 6.2 V in the organic EL element part. That is, in this example, it was possible to charge the capacitor with 6.2 V by applying a total of 9.7 V. At this time, about 19 ⁇ Q / cm 2 was obtained as the maximum charge accumulation amount. In this example, 50 CdZm 2 was obtained as the average luminance of the panel.
- the charge amount during the duty period can be easily controlled by changing the current time or the voltage value, thereby obtaining the gradation of light emission luminance.
- a sample was prepared in the same manner as in Example 3 except that gold was used as the conductive fine particles used in the capacitor, and the thicknesses of the electrode layer, the dielectric layer, and the electrode layer were 110 nm, 80 nm, and 110 nm, respectively. Then, the same test as in Example 3 was performed except that the applied voltage was 15 V. Under the same conditions, the panel operated smoothly, the maximum amount of charge stored in the capacitor was about 30 ⁇ QZcm 2 , and the maximum current density of the bistable element was about 60 mAZcm 2 . In addition, an average luminance of 50 Cd / m 2 was obtained for the panel. The gradation of the light emission luminance was easily obtained as in Example 3.
- CuPC copper phthalocyanine
- NPB Naphthylphenyldiamine
- Alq3 aluminum quinoline
- Organic EL and Con Selection of the evaporation region of a part of the densers was performed using a metal mask. After deposition of the EL part and part of the capacitor, an aluminum film was deposited as a rectifying element so as to cover both elements, and then fullerene (C60) and copper were deposited successively. The thickness of each layer was 100 nm, 100 nm, and 100 ⁇ m. The last copper film was subjected to 10 rows of pattern jungling at a pitch of 1 mm and a width of 0.7 mm perpendicular to the ITO electrodes. Thus, a pixel matrix of 15 columns and 10 rows is formed.
- the voltage drop of the rectifying element and the organic EL element was measured, for example, the voltage drop for setting the current density to 4 OmA / cm 2 was about 0.5 V for the rectifying element, It was 6.2V at the EL device part. That is, in this embodiment, more application of total 6. 7V, it was possible to charge the capacitor at 6. 2V. At this time, about 19 ⁇ Q / cm 2 was obtained as the maximum charge accumulation amount. As a result, 50 Cd / m 2 was obtained as the average luminance of the panel.
- the charge amount in the duty period can be easily controlled by changing the charging time or the voltage value, thereby obtaining a gradation of light emission luminance.
- Example 6 Sample A sample of Example 6 was obtained in the same manner as in Example 5, except that the pitch between the ITO electrode and the copper electrode was 0.5 mm and the width was 0.3 mm, and that 100 columns and 100 rows were formed, respectively. . As a result, the same electrical and luminescent characteristics as those of Example 5 were obtained. Using the sample thus obtained, driving was performed under the conditions of a voltage of 8 V and a frame frequency of 120 Hz.
- the voltage drop was measured using the sample driven as described above. As a result, the voltage drop was about 0.7 V in the rectifier element, and 7.3 V in the organic EL element part. That is, in the present example, it was possible to charge the capacitor at 7.3 V by applying a total of 8 V. At this time, the maximum charge accumulation was about 21 ⁇ QZcm 2 . In this example, an average luminance of the panel of 70 Cd / m 2 was obtained.
- Fig. 15 shows the time change of the current flowing through the organic EL element at this time.
- the selection of the organic EL section and the deposition area of a part of the capacitor depended on the metal mask. After evaporation of the EL part and part of the capacitor, as a rectifying element, the organic EL part and part of the capacitor are covered and a mask film is deposited so as to form an island-shaped electrode for each pixel, and a gold film is deposited. A pentacene film and an aluminum film were successively deposited on top. The thickness of each layer was 100 nm, 100 nm, and 100 nm, respectively. The last aluminum film was subjected to 10 rows of pattern jungling with a pitch of 1 mm and a width of 0.7 mm perpendicular to the IT ⁇ electrode. As a result, a pixel matrix of 15 columns and 10 rows is formed.
- the voltage drop for setting the current density to 40 mAZ cm 2 was about 2.
- 6.2 V in the organic EL element section that is, in the present example, it was possible to charge the capacitor with 6.2 V by applying a total of 8.2 V. At this time, about 19 / Q / cm 2 was obtained as the maximum charge accumulation amount.
- 54 Cd / m 2 was obtained as the average luminance of the panel.
- the charge amount in the duty period can be easily controlled by changing the charging time or by changing the voltage value, thereby obtaining the gradation of the light emission luminance.
- Example 5 The reason why a higher average luminance was obtained than in Example 5 is that the electric characteristics of the rectifying element used in this example (FIG. 14) are the same as those of Example 5 (FIG. 13). This is presumed to be due to the fact that the current efficiency flowing through the organic EL, which has a smaller leakage current at the reverse bias than that of the OLED, has increased.
- An IT ⁇ film with a thickness of lOOnm was formed on a glass substrate by RF magnetron sputtering, and then, using a normal photolithography method, 1. Omm pitch, 0.7mm width, and 15 rows of stripes were formed.
- An electrode array was formed. Further, a platinum film was formed on the ITO electrode at a pitch of 1. Omm and a width of 0.3 mm to a thickness of 50 nm, and a base electrode for forming barium strontium titanate oxide was formed in an island shape on the ITO electrode. Further, a barium strontium titanate oxide was deposited on the platinum film by RF magnetron sputtering and ordinary photolithography.
- the capacitor was formed with a thickness of 100 nm and then heat-treated in an oxygen atmosphere for 1 hour. Thereafter, a partition was formed in contact with the capacitor, and a light emitting device was formed in the same manner as in Example 5. Thereafter, a sample of Example 8 was obtained in the same manner as in Example 5.
- Example 6 A sample of Example 6 was produced in the same manner as in Example 5, except that the number of columns and rows of ITO electrodes and copper films was set to 50 matrices and 50 rows.
- the drive voltage waveform was as shown in FIG.
- the frame frequency was set to 600 Hz (frame period: about 1.7 ms).
- VLon and VAon By setting both VLon and VAon to 3.35V, a charge of about 19 ⁇ QZcm 2 is accumulated in the capacitor in the second half of the duty period, as in the fifth embodiment.
- the charge stored in the capacitor is discharged through the light emitting unit 110 of the organic EL during a non-duty period.
- the discharge characteristics of the organic EL light emitting unit 110 are non-linear, the discharge characteristics cannot be expressed by a simple formula, but the residual potential (potential difference between the light emitting unit 110 and the capacitor 106) after 1.7 ms, which is the frame period, is approximately 2. It was 8V. In the first half of the duty period of the next frame, an erase signal was applied with both VLoff and VAoff set to 4V. At this time, the potential difference between the light emitting unit 110 and the capacitor 106 rises by the application of VL off and by VLoff, and the potential of the Y electrode with respect to the X (timing signal line) electrode, that is, the diode 602 The reverse bias voltage applied to is about 10V. As illustrated in FIG.
- a current density of 100 mA / cm 2 or more can be obtained with a reverse bias of 8 V, so that the charge remaining in the capacitor 106 is discharged through the diode 602.
- the light emitting state of each frame is changed to the pixel to emit light. In this case, it was confirmed that when light emission was properly performed and the same pixel was quenched, the light could be appropriately quenched and the control could be performed well.
- the voltage drop when applying a voltage is lower than that of other organic materials. That is, power loss in the rectifying element is suppressed, which is extremely advantageous in terms of power consumption. This is due to the higher charge mobility of these materials compared to other materials.
- all the elements are made of organic thin films by connecting a capacitor made of an organic dielectric in parallel with the organic EL light emitting element and connecting a switching element in series with the organic EL light emitting element.
- the light emitting unit and the capacitor connected in parallel to the light emitting unit share a limited pixel area.
- the area of light emitting section 110 and the area of capacitor portion 106 are arranged in a plane. For this reason, there is a force S when there is a restriction that a large area cannot be obtained.
- Embodiment 2 in which the current load applied to the light emitting element can be reduced and the area of the capacitor can be increased by removing the limitation of the area will be described below.
- the light emitting device (light emitting portion), the capacitor portion, and the switching device, which are the components of the display device, are formed on the substrate so as to have an area almost equal to the pixel area, and the wiring between the elements is formed.
- the side surface of the element By using the side surface of the element, a wider area is secured for the light emitting portion and a part of the capacitor than in the first embodiment, and the performance is improved.
- the wiring is connected via a via whose side is covered with an insulator, so that a failure such as a short circuit is unlikely to occur.
- Such a display device is realized by using a partition having an overhang portion and using the partition as a mask by an oblique vapor deposition method.
- a display device having the structure shown in FIG. 8H is realized, and the same electrical connection relationship as the circuit having the configuration shown in FIG.
- the capacitor part 106 is stacked.
- a wider light emitting area and a condenser area are realized.
- Each element is formed as a thin film, and current flows through each element perpendicular to the film surface.
- an electrode film 804 made of a transparent conductive material is formed on a surface of a plastic substrate 802 to a thickness of, for example, 0.2 zm.
- the electrode film 804 is further patterned by photolithography and etching to form, for example, a 0.3 mm-pitch, 0.28-mm-wide strip shape. Are formed on the stripe electrodes. In FIG. 8, the direction in which such a stripe electrode extends is the horizontal direction in the drawing.
- a partition 806 is formed as shown in FIG. 8B.
- the base part of the partition
- a non-photosensitive polyimide is formed as a material of 808 on a transparent electrode to a thickness of 4 am by a spin coating method, and further, SiO is formed as a material of an overhang portion 810 on the upper part of the partition wall.
- a film is formed to a thickness of 0.5 zm on the polyimide film by, for example, a sputtering method. Then Si ⁇ film
- Such a T-shaped partition wall 810 is initially O
- Reactive ion etching (anisotropic etching) is performed using the gas of step 2 and the polyimide film 70 is dry-etched vertically without any undercut (arrow 812 in the figure), and then wet with an alkaline solution for about 30 seconds. It can be formed by etching and isotropically etching the side surface 816 of the polyimide film (arrow 814 in the figure).
- a thin-film organic EL element is vapor-deposited as the light emitting section 110 from an oblique direction that forms a certain angle ⁇ ⁇ ⁇ ⁇ with respect to the normal direction of the plastic substrate 802.
- the light emitting section 110 includes an EL light emitting layer 818 including an electron transport layer, a recombination layer, and a hole transport layer, and a metal electrode layer 820.
- an organic insulating film 822 is deposited on the plastic substrate 802 in the vertical direction.
- the insulating film 822 is not deposited on the portion along the partition wall because the shadow of the overhang portion 810 of the partition wall 806 is formed.
- the capacitor was formed by oblique evaporation inclined in the direction opposite to that of Fig. 8c. Part 106 is deposited.
- One electrode of the capacitor is formed by a metal electrode 824 to connect to the electrode film 804 on the plastic substrate via a via 830 (FIG. 8d) lined with an insulating film 822, after which the capacitor is A dielectric layer 826 to be formed is formed. Further, a metal electrode 828 is formed.
- the electrode film 804 made of a transparent electrode material is formed into a plurality of stripe-shaped parallel row electrodes extending in the horizontal direction in the plane of the paper of FIG.
- the metal electrode 824 and the metal electrode 828 must also be divided into islands in the direction perpendicular to the paper surface in accordance with the electrode film 804. For this reason, when the electrode film 804 has a stripe shape, a vapor deposition having an appropriate opening so that the metal electrode 824 and the metal electrode 828 are patterned according to the pattern of the transparent electrode in the vapor deposition of FIG. It is deposited through a metal mask (not shown) as a mask.
- the capacitor part 106 and the light emitting part 110 are formed separated by the organic insulating film 822.
- the film thickness from the EL light-emitting layer 818 formed up to FIG. 8d to the metal electrode 828 is about 300 nm in total, and the via 830 (see FIG. 8) exposing the electrode film 804 made of the transparent electrode material is exposed. 8d) is sufficiently smaller than the width in the horizontal direction (approximately 2 ⁇ m) in the drawing, so that its effect as a mask can be almost neglected, thus affecting the deposition of the metal electrode 824 in FIG. 8e. None to do.
- an organic insulating film 822a is vertically deposited on a glass substrate in the same manner as in FIG. 8d, and is formed so as to be continuous with the organic insulating film 822.
- a via 832 connectable to the metal electrode 820 of the light emitting section 110 is lined with the insulating film 822a.
- a metal electrode 828a is vapor-deposited from both sides of the partition so as to be connected to the metal electrode 822 via the via 832.
- metal electrodes 828 and 828a act as pixel electrode 112 in FIG.
- the switching element 114 and the electrode layer 834 are vapor-deposited from both sides of the partition walls to the entire surface between the partition walls.
- the thin-film light-emitting element and the thin-film capacitor are connected in parallel to each other, and the thin-film switching element is connected to both of them in series.
- the display device 80 having a partially enlarged area can be manufactured.
- a film was formed by a thickness of 5 zm by sputtering. Thereafter, etching was performed in the same manner as described above to obtain 10 rows of partition walls at a pitch of 1.0 mm in a direction perpendicular to the ITO electrodes.
- the width of the septum was 300 ⁇ m, the height was 4.5 / im, and the overhang was 2 ⁇ m.
- Li / aluminum quinoline (Alq3) compound 2) / naphthylphenyldiamine (NPB) (compound 2) / copper phthalocyanine (CuPC) was sequentially formed by vacuum evaporation from the direction shown in FIG. 8c. did.
- the thickness of each layer was 5 nm, 50 nm, 50 nm, and 100 nm, respectively.
- These evaporation sources were placed at a distance of 200 mm vertically from the substrate and at a distance of 100 mm to the left of the paper from the center of the substrate.
- a crucible with an opening diameter of 5 mm was used.
- perfluorotetracosane n-C24F50 was applied as an insulating layer at 100 nm in the direction shown in Fig. 8d.
- the capacitor element was formed by co-evaporation of aluminum as an electrode, aluminum imidazole dicyanate as a dielectric layer and aluminum as conductive fine particles from the direction shown in FIG. Were sequentially and obliquely vapor-deposited.
- a metal mask was used to prevent the deposition of aluminum in a location corresponding to the space of the IT ⁇ electrode pattern.
- the thickness of each layer was 100 nm, 40 nm, and 100 nm.
- the evaporation source was placed at a distance of 200 mm vertically from the substrate, at a distance of 100 mm to the right of the paper from the center of the substrate, and used a crucible with an opening diameter of 5 mm.
- perfluorotetracosane (n—C24F50) was deposited as an insulating layer to a thickness of 100 nm from the direction shown in FIG. 8F.
- the deposition apparatus was subjected to vacuum deposition of more than diffusion pumping was performed at a vacuum degree of 4 X 10- 4 Pa (3 X 10- 6 tor r).
- aluminum deposition is performed at a deposition rate of 3 by a resistance heating method.
- Amino imidazole dicyanate containing aluminum as conductive fine particles was prepared at Onm / sec by a co-evaporation method.
- the deposition is performed by a resistance heating method, and the deposition rate is 20 nm / sec for aminoimidazole disinate and 10 nm / sec for aluminum.
- the deposition of each layer is performed continuously by the same deposition equipment, and the sample is in contact with the air during deposition.
- a gold electrode / butadiene compound (compound 4) / aluminum electrode was formed to have a film thickness of lOOnm, 80nm, and lOOnm, and then the film was formed by oblique deposition as shown in Fig. 8c.
- the capacitor of Example 1 was formed, and an organic insulating film was formed as shown in FIG. 8D.
- the light emitting element only copper phthalocyanine (CuPC) / naphthylphenyldiamine (NPB) / aluminum quinoline (Alq3) were deposited at 100 nm, 50 nm, and 50 nm, respectively, and Li was deposited at 5 nm, as shown in FIG.
- an IT film was formed thereon by sputtering.
- the display device of Example 11 was obtained.
- the brightness of the light emitting surface the area of the same light emitting element of Example 1 is about half requires 100 Cd / m 2, Niryou collector to be accumulated in the capacitor is the Approximately 21 ⁇ Q / cm 2 was required.
- An IT ⁇ film having a thickness of lOOnm was formed on a glass substrate by RF magnetron sputtering, and then 15 rows of stripes with a pitch of 0.7 mm and a width of 0.7 mm were formed using ordinary photolithography. Column electrodes were formed. Furthermore, using RF magnetron sputtering and ordinary photolithography, a capacitor region of 10 rows of barium strontium titanate oxide is formed with a thickness of lOOnm so as to form a stripe shape with a pitch of 1. Omm and a width of 0.6 mm. did.
- the An electrode of ITO having a thickness of 100 nm was formed so as to have a shape. Furthermore, a heat treatment was performed for 1 hour in an oxygen atmosphere to produce a capacitor. The conductor is substantially transparent, and the light of the light emitting unit 110 formed thereafter is emitted to the outside through the condenser. Next, a negative photoresist LAX-1 manufactured by Zeon Corporation was formed to a thickness of 4 zm by spin coating, and a SiO film was formed to a thickness of 0.5 xm by sputtering. After that,
- partition walls By etching in the same manner, 10 rows of partition walls were obtained at 1. Omm pitch in a direction perpendicular to the ITO electrodes.
- the width of the partition wall was 300 x m, the height was 4.5 ⁇ m, and the overhang was 2 ⁇ m.
- the capacitor is disposed between these partitions.
- CuPC copper phthalocyanine
- NPB naphthyl phenyldiamine
- Alq3 aluminum quinoline
- a copper electrode ZC60 / aluminum electrode was formed at a thickness of 100 nm and a thickness of 80 nm.
- the brightness of the light emitting surface the area of the same light emitting element of Example 1 is about half requires 140 cd / m 2, Niryou collector to be accumulated in the capacitor is the Approximately 30 ⁇ Q / cm 2 was required.
- the luminance of the light emitting element required to obtain the same average luminance is 1Z2 in Example 1 as compared with the configuration of Embodiment 1 in FIG. 1, and the element life may be approximately doubled.
- FIG. 18 relates to a certain pixel and is applied to a column electrode (data signal line or Y electrode) 116 in one frame period.
- FIG. 19c shows the voltage waveforms (FIG. 19c) and their potential differences (FIGS. 18b and 18d).
- FIG. 18E also shows the light emitting state of the light emitting unit 110.
- Fig. 19a shows changes in the duty periods of Figs. 18a to 18f in detail by enlarging the time.
- the rectifier 602 (FIG. 6) has a non-linearity in which the resistance decreases in a high voltage region.
- a negative bias of one VXon is applied to the timing signal line X (row electrode) 104 (FIG. 19e), and the resistance of the rectifying element is reduced to be in a conductive state.
- the voltage applied to the data signal line 116 is VY on (FIG. 19a)
- the potential difference between X and Y (not shown in the figure) is VXon + VYon.
- the electrical junction of the rectifying element 602, the light emitting element 110, and the capacitor 106 is referred to as part A (FIG. 6). If the forward resistance of the rectifying element is made sufficiently smaller than the forward resistance of the light emitting element, the The potential of the data signal line Y116 is substantially equal to the potential of the portion A. As a result, the potential of the portion A becomes VAon close to the potential of Y, and the potential difference between A and X becomes (VXon + VAon). During the non-duty period 704, the voltage of the timing signal line X104 is changed from VXon to 0V. At this time, the portion A is in an insulated state (that is, a reverse bias relationship with the rectifying element). The exchange of charges is eliminated. As a result, the voltage of the part A decreases by VXon and becomes (VX on + VAon).
- the rectifying element 602 is made substantially non-conductive by driving at a low voltage without applying a bias to the timing signal line X104 and the data signal line Y116. At this time, the light emission intensity of each pixel can be controlled by the magnitude of VYon for each pixel.
- the end of the frame period At the end of the period, electric charges remain in the capacitor, which may affect the light emitting state or non-light emitting state in the next frame period.
- the next frame period is in a non-light emitting state, it is necessary to erase the history of the previous light emitting state by an appropriate extinction signal. Therefore, for example, as shown in FIG. 7, the duty period of each row is divided into the first half 706 and the second half 705, and the residual charge is discharged during the first half 706.
- the signal of the next frame period can be added to the latter half 705 of the duty period to make the display of the next frame desired.
- a bias voltage of 1 VXe and 1 VYe is applied to both or one of the timing signal line X (row electrode) 104 and the data signal line Y (column electrode) 116. ( Figure 19a and Figure 19c).
- the bias voltage VXe and the bias voltage V By applying one and one VYe, respectively, the potential difference between A and X becomes VAr + VXe, and the potential difference between Y and A becomes one VAr-VYe.
- the potential of A can be further stabilized, but after a certain value, the Y force also causes a current to flow to X, and the light-emitting unit 106 continues to emit light, and the contrast ratio (onZoff ratio) decreases. there is a possibility.
- VXe> V Ye (FIG. 19d) the injection of charges from Y is suppressed, so that only the residual charges contribute to light emission, making it easier to control the contrast ratio.
- VYe is added via the data signal line Y (column electrode) 116, it is possible to reflect the history of each pixel and select the optimal value for the required image quality Can do things.
- the rectifying element is, for example, an aluminum thin film Z fuller
- a material having a laminated structure of an aluminum thin film / a copper thin film and a material having a laminated structure of an aluminum electrode / a pentacene compound / a gold electrode are suitable, but not limited thereto, and many organic electronic materials can be applied.
- the capacitor various metal oxides, for example, oxides such as silicon, anoremi, tantalum, titanium, strontium, and norium, or mixed oxides thereof can be used.
- oxides such as silicon, anoremi, tantalum, titanium, strontium, and norium
- mixed oxides thereof can be used.
- the conductive fine particles are dispersed in an organic material, so that a capacitor portion having a small area and sufficient capacity can be formed. is there.
- the latter case can be formed by a low-temperature process, and is preferable when a plastic substrate is used.
- the charge corresponding to the light emission amount is accumulated via the first rectifying element in the capacitor in the pixel of the row driven by the duty of the matrix through the first rectifying element, During the time, the current flowing to the light emitting unit is held by the potential held by the capacitor, and light emission is continued.
- a rectifying element that can operate at high speed is used.
- a heat-resistant glass or the like is used as the substrate
- a ceramic oxide-based material can be used as the capacitor.
- a good capacitor can be obtained by depositing barium strontium titanate, a typical strong dielectric, with a thickness of several hundred ⁇ m by RF magnetron sputtering and heat-treating it at about 650 ° C. Power S can.
- the dielectric layer can be constituted by an organic dielectric in which conductive fine particles are dispersed as a capacitor.
- each pixel is electrically isolated from the signal line (eg, a column electrode) by the rectifying element, and continues to emit light by the electric charge stored in the capacitor. Since the amount of stored charge can be adjusted according to the required light emission intensity, a gray scale display can be easily obtained.
- FIG. 21 is a cross-sectional view showing an example of the structure of one pixel of the display device according to the present embodiment.
- a row electrode 104 is formed on one surface of the transparent substrate 102 using a transparent electrode material of ITO (indium tin oxide).
- the row electrodes 104 are mutually flat. It is patterned into a plurality of striped electrodes.
- a partition 108 is formed on the row electrode 104 thus formed and on the periphery thereof by using a photoresist or the like.
- a light-emitting portion 110 of an organic EL element or the like and a capacitor portion 106 are formed in a portion of the row electrode 104 partitioned by the partition wall.
- an isolated island-shaped electrode surface (pixel electrode) 112 and a thin-film rectifying element 602 are formed in pixel units.
- a column electrode 116 is formed on the rectifying element 602 by using a metal patterned on a plurality of stripe-shaped electrodes parallel to each other so as to intersect the row electrodes 104.
- Each electrode, organic EL element, thin-film rectifier, capacitor part, etc. are formed of thin films, and the current of the organic EL element or thin-film rectifier flows perpendicular to the film surface.
- a polyethylene terephthalate substrate 100 sets of stripe electrodes composed of ITO (indium tin oxide) transparent electrodes were formed as row electrodes by a normal photo process and sputtering.
- the pitch of 100 pairs of electrodes was 500 ⁇ m, and the width of each electrode was 450 ⁇ m.
- the thickness of each electrode was 100 nm.
- 100 sets of insulating partitions were formed in the longitudinal direction of the electrodes by a photo process.
- the pattern pitch is 500 / im, and each set is divided into two areas by partition walls. As a result, 100 ⁇ 100 pixels were formed.
- a pair of two divided regions was formed as one set, and a light emitting element was formed on one of them and a capacitor was formed on one of them.
- Each area was the same at 220 ⁇ m ⁇ 450 ⁇ m.
- An organic EL layer was used as a light emitting element, and copper phthalocyanine (CuPC) (manufactured by Aldotitsch) / naphthyl phenyldiamine (NPB) (manufactured by Aldotitsch) Z aluminum quinoline (Alq3) (manufactured by Anorettitsch) Z calcium electrode was used. Films were sequentially formed by vacuum evaporation. The thickness of each layer was 100, 50, 50, and 100 nm, respectively.
- CuPC copper phthalocyanine
- NPB naphthyl phenyldiamine
- Alq3 aluminum quinoline
- Alq3 aluminum quinoline
- the capacitor element was formed by a vacuum evaporation method using aminoimidazole dicyanate (compound 1) as an insulating organic material and aluminum as conductive fine particles to form a dielectric layer by a co-evaporation method. Specifically, a thin film was formed by sequentially successively forming an aluminum layer, an aminoimidazole dicinate layer, a co-evaporated layer of aminoimidazole dicinate and aluminum, an aminoimidazole dicyanate layer, and an aluminum layer. The thickness of each layer was 60, 40, 30, 40, and 60, respectively.
- the rectifying element was produced by forming a film of C60 (manufactured by Alditchi) (120 nm thick) and a Cu electrode (60 nm thick) on an electrode made of aluminum. Thereafter, the column electrodes 116 were formed by aluminum evaporation.
- the deposition apparatus used for the above-described film formation by diffusion pumping, evaporation was carried out at a vacuum degree of 4 X 10- 4 Pa (3 X 10- 6 torr).
- aluminum was deposited by a resistance heating method at a deposition rate of 30 nm Zsec, and aminoimidazole dicyanate containing aluminum as conductive fine particles was prepared by a co-evaporation method. The deposition is performed by the resistance heating method, and the deposition rate is 20 nm / sec for aminoimidazole disinate and lOnm, sec for aluminum.
- Example 14 The sample of Example 14 was obtained in the same manner as in Example 13 except that an aluminum film (100 nm), a pentacene film (50 nm), and a gold film (100 nm) were continuously deposited as a rectifying element.
- an aluminum film 100 nm
- a pentacene film 50 nm
- a gold film 100 nm
- Example 15 Glass was used as a substrate, and 50 sets of stripe electrodes composed of ITO (indium tin oxide) transparent electrodes were alternately formed as row electrodes on the substrate. Then, a platinum film having a thickness of 50 nm was formed on the ITO electrode. Strontium titanate barium oxide is formed on the platinum film to a thickness of 100 nm using RF magnetron sputtering and ordinary photolithography, and then heat-treated in an oxygen atmosphere for 1 hour. It was a capacitor. Otherwise in the same manner as in Example 13, a sample of Example 15 was obtained.
- ITO indium tin oxide
- Example 1 3 500 ⁇ 0.5 nF 0.25 us
- Example 1 4 20 00 ⁇ 0.5 nF 1.0 s
- Example 1 5 500 ⁇ 5 nF 20 s
- the time constant of the discharging process in the non-duty period is as shown in Table 2.
- the element resistance value of the organic EL uses a value obtained by linearly approximating the voltage up to around 8V.
- the time constant of the discharge process is sufficiently smaller than the frame period of 17 ms.
- the time constant of each frame period increases. During this period, the discharge from the capacitor did not end.
- the following table shows the residual voltage in each example, the voltage application conditions according to the method of the present invention, and the characteristics without using the method of the present invention (Comparative Examples 1, 2, and 3, respectively). It can be seen that by using the driving method of the present invention, the influence of the residual voltage is suppressed, and a high ON / OFF ratio can be obtained.
- Table 3 the influence of the residual potential was able to be suppressed by the driving method of the present invention.
- the polarities of the rectifying element and the organic EL element are opposite to those in the example of FIG. 2, and accordingly, the voltage value also has the opposite polarity to that of FIGS. 1 and 7. , To facilitate understanding Therefore, the above table shows the values according to the polarities shown in Figs.
- the light emission amount is stable at low cost, and particularly, the contrast ratio (ON / OFF ratio) is high and the power consumption is low.
- a small driving method can be provided.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005513176A JP4107328B2 (ja) | 2003-08-19 | 2004-08-12 | 表示装置及びその駆動方法 |
EP04771578A EP1667089A4 (en) | 2003-08-19 | 2004-08-12 | DISPLAY AND METHOD OF ATTACK |
US10/569,257 US20070001936A1 (en) | 2003-08-19 | 2004-08-12 | Display device and method of forming and driving the same |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-294919 | 2003-08-19 | ||
JP2003294919 | 2003-08-19 | ||
JP2004031541 | 2004-02-09 | ||
JP2004-031541 | 2004-02-09 | ||
JP2004-123650 | 2004-04-20 | ||
JP2004123650 | 2004-04-20 | ||
JP2004-151202 | 2004-05-21 | ||
JP2004151202 | 2004-05-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005017859A1 true WO2005017859A1 (ja) | 2005-02-24 |
Family
ID=34199150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/011603 WO2005017859A1 (ja) | 2003-08-19 | 2004-08-12 | 表示装置及びその駆動方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20070001936A1 (ja) |
EP (1) | EP1667089A4 (ja) |
JP (1) | JP4107328B2 (ja) |
WO (1) | WO2005017859A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006267545A (ja) * | 2005-03-24 | 2006-10-05 | Sanyo Epson Imaging Devices Corp | 電気光学装置および電子機器 |
JP2007529906A (ja) * | 2004-03-15 | 2007-10-25 | 富士電機ホールディングス株式会社 | 有機双安定電気デバイス及び有機ledディスプレーのための駆動器並びにそれらのための駆動方法 |
JP2008210780A (ja) * | 2007-01-31 | 2008-09-11 | Kansai Paint Co Ltd | 分散型el素子及びその製造方法 |
JP2009140624A (ja) * | 2007-12-04 | 2009-06-25 | Kansai Paint Co Ltd | 発光層用組成物及び分散型el素子 |
JP2016099921A (ja) * | 2014-11-26 | 2016-05-30 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンスモジュール、並びにこれを備えたスマートデバイス及び照明装置 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101410465B1 (ko) * | 2007-02-22 | 2014-06-23 | 삼성디스플레이 주식회사 | 백라이트 장치 및 이를 갖는 액정표시장치 |
US20090179833A1 (en) * | 2008-01-15 | 2009-07-16 | Semiconductor Energy Laboratory Co., Ltd. | Display device and electronic appliance |
US9570004B1 (en) * | 2008-03-16 | 2017-02-14 | Nongqiang Fan | Method of driving pixel element in active matrix display |
US8704737B1 (en) * | 2008-03-16 | 2014-04-22 | Nongqiang Fan | Method of driving pixel element in active matrix display |
US8198619B2 (en) | 2009-07-15 | 2012-06-12 | Macronix International Co., Ltd. | Phase change memory cell structure |
EP2333644B1 (en) * | 2009-11-16 | 2014-12-10 | Samsung Display Co., Ltd. | Energy-efficient display apparatus with object-sensing capability |
KR101588001B1 (ko) * | 2009-11-16 | 2016-01-26 | 삼성디스플레이 주식회사 | 표시장치 |
US9595230B2 (en) * | 2012-07-24 | 2017-03-14 | Sharp Kabushiki Kaisha | Display device equipped with power generation function |
CN104103674B (zh) * | 2014-08-04 | 2017-04-12 | 石益坚 | 一种电容驱动电致发光显示器及其制造方法 |
CN112768499B (zh) * | 2021-01-13 | 2023-01-24 | 重庆京东方显示技术有限公司 | 有机发光二极管显示基板及制备方法、显示面板 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5326996A (en) * | 1976-08-26 | 1978-03-13 | Tokyo Keiki Kk | Compound dielectric body |
JPS58168788U (ja) * | 1982-05-07 | 1983-11-10 | 株式会社日立製作所 | バス方式表示ドライバ− |
JPS62172395A (ja) * | 1986-01-24 | 1987-07-29 | 日本電気株式会社 | 薄膜el駆動回路及びその駆動方法 |
JPH0629514A (ja) * | 1992-01-13 | 1994-02-04 | Kawamura Inst Of Chem Res | 半導体素子 |
JPH08330070A (ja) * | 1995-05-29 | 1996-12-13 | Pioneer Electron Corp | 発光素子の駆動法 |
JPH09114398A (ja) * | 1995-10-24 | 1997-05-02 | Idemitsu Kosan Co Ltd | 有機elディスプレイ |
JPH10268798A (ja) * | 1997-03-27 | 1998-10-09 | Sanyo Electric Co Ltd | 表示装置 |
JP2001160492A (ja) * | 1999-12-06 | 2001-06-12 | Japan Science & Technology Corp | 有機薄膜エレクトロルミネッセンス素子およびその駆動方法 |
JP2002328651A (ja) * | 2001-04-27 | 2002-11-15 | Pioneer Electronic Corp | 発光パネルの駆動方法及び駆動装置 |
JP2003077677A (ja) * | 2001-08-30 | 2003-03-14 | Sharp Corp | 薄膜el素子及びその製造方法 |
JP2004093960A (ja) * | 2002-08-30 | 2004-03-25 | Fuji Electric Holdings Co Ltd | 表示装置の駆動方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03284813A (ja) * | 1990-03-14 | 1991-12-16 | Fujikin Sofuto Kk | コンデンサ |
JP3202219B2 (ja) * | 1990-09-18 | 2001-08-27 | 株式会社東芝 | El表示装置 |
JPH07106181A (ja) * | 1993-10-04 | 1995-04-21 | Towa Electron Kk | 導体、誘電体混合型コンデンサ |
JP3281848B2 (ja) * | 1996-11-29 | 2002-05-13 | 三洋電機株式会社 | 表示装置 |
US5879821A (en) * | 1997-11-13 | 1999-03-09 | Xerox Corporation | Electroluminescent polymer compositions and processes thereof |
US6380922B1 (en) * | 1999-04-16 | 2002-04-30 | The Gillette Company | Electronic display |
JP2001250680A (ja) * | 2000-03-07 | 2001-09-14 | Pioneer Electronic Corp | 発光素子およびその製造方法 |
JP4432207B2 (ja) * | 2000-05-25 | 2010-03-17 | パナソニック株式会社 | コンデンサ |
-
2004
- 2004-08-12 US US10/569,257 patent/US20070001936A1/en not_active Abandoned
- 2004-08-12 EP EP04771578A patent/EP1667089A4/en not_active Withdrawn
- 2004-08-12 JP JP2005513176A patent/JP4107328B2/ja not_active Expired - Lifetime
- 2004-08-12 WO PCT/JP2004/011603 patent/WO2005017859A1/ja active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5326996A (en) * | 1976-08-26 | 1978-03-13 | Tokyo Keiki Kk | Compound dielectric body |
JPS58168788U (ja) * | 1982-05-07 | 1983-11-10 | 株式会社日立製作所 | バス方式表示ドライバ− |
JPS62172395A (ja) * | 1986-01-24 | 1987-07-29 | 日本電気株式会社 | 薄膜el駆動回路及びその駆動方法 |
JPH0629514A (ja) * | 1992-01-13 | 1994-02-04 | Kawamura Inst Of Chem Res | 半導体素子 |
JPH08330070A (ja) * | 1995-05-29 | 1996-12-13 | Pioneer Electron Corp | 発光素子の駆動法 |
JPH09114398A (ja) * | 1995-10-24 | 1997-05-02 | Idemitsu Kosan Co Ltd | 有機elディスプレイ |
JPH10268798A (ja) * | 1997-03-27 | 1998-10-09 | Sanyo Electric Co Ltd | 表示装置 |
JP2001160492A (ja) * | 1999-12-06 | 2001-06-12 | Japan Science & Technology Corp | 有機薄膜エレクトロルミネッセンス素子およびその駆動方法 |
JP2002328651A (ja) * | 2001-04-27 | 2002-11-15 | Pioneer Electronic Corp | 発光パネルの駆動方法及び駆動装置 |
JP2003077677A (ja) * | 2001-08-30 | 2003-03-14 | Sharp Corp | 薄膜el素子及びその製造方法 |
JP2004093960A (ja) * | 2002-08-30 | 2004-03-25 | Fuji Electric Holdings Co Ltd | 表示装置の駆動方法 |
Non-Patent Citations (2)
Title |
---|
KARU R.F. ET AL.: "C60 no kagaku", NIKKEI SCIENCE, vol. 21, no. 12, 1 December 1991 (1991-12-01), pages 36 - 48, XP002985398 * |
See also references of EP1667089A4 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007529906A (ja) * | 2004-03-15 | 2007-10-25 | 富士電機ホールディングス株式会社 | 有機双安定電気デバイス及び有機ledディスプレーのための駆動器並びにそれらのための駆動方法 |
JP2006267545A (ja) * | 2005-03-24 | 2006-10-05 | Sanyo Epson Imaging Devices Corp | 電気光学装置および電子機器 |
JP2008210780A (ja) * | 2007-01-31 | 2008-09-11 | Kansai Paint Co Ltd | 分散型el素子及びその製造方法 |
JP2009140624A (ja) * | 2007-12-04 | 2009-06-25 | Kansai Paint Co Ltd | 発光層用組成物及び分散型el素子 |
JP2016099921A (ja) * | 2014-11-26 | 2016-05-30 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンスモジュール、並びにこれを備えたスマートデバイス及び照明装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4107328B2 (ja) | 2008-06-25 |
US20070001936A1 (en) | 2007-01-04 |
EP1667089A4 (en) | 2009-04-08 |
EP1667089A1 (en) | 2006-06-07 |
JPWO2005017859A1 (ja) | 2007-10-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100620976B1 (ko) | 디스플레이 패널 및 디스플레이 패널 구동방법 | |
CN100525564C (zh) | 发光元件以及利用此发光元件的发光器件 | |
US6882105B2 (en) | Organic light-emitting display device | |
US7042163B2 (en) | Organic electroluminescence display and method of fabricating the same | |
US7760165B2 (en) | Control circuit for stacked OLED device | |
CN100531501C (zh) | 平板显示装置 | |
CN1731904B (zh) | 薄膜晶体管及包含该薄膜晶体管的平板显示装置 | |
JP4107328B2 (ja) | 表示装置及びその駆動方法 | |
US6593689B2 (en) | Organic light-emitting device | |
US20090140955A1 (en) | Light-emitting element and display device | |
JP2004145244A (ja) | 表示装置 | |
JP4406951B2 (ja) | 薄膜発光素子の駆動方法および駆動回路 | |
KR100476741B1 (ko) | 유기전자디바이스 및 비선형소자 | |
KR20010062484A (ko) | 화상표시장치 및 박막표시소자의 구동방법 | |
JP2004227944A (ja) | 表示装置の製造方法 | |
JP4085636B2 (ja) | 記憶駆動式表示装置の駆動方法及び記憶駆動式表示装置 | |
WO2004032577A1 (ja) | 有機el積層型有機スイッチング素子及び有機elディスプレイ | |
JP3656608B2 (ja) | 有機薄膜el素子およびその駆動方法 | |
CN102110715A (zh) | 晶体管、显示装置、电子设备和晶体管的制造方法 | |
JPWO2005111975A1 (ja) | 表示装置 | |
JP2011060787A (ja) | 有機発光トランジスタアレイおよびその駆動方法、ならびに有機エレクトロルミネッセンス表示装置 | |
JP2001100653A (ja) | シフトレジスタおよび画像表示装置 | |
JP4792634B2 (ja) | 光機能素子、有機el素子および有機el表示装置 | |
JP2000164358A (ja) | 有機薄膜el素子およびその駆動方法 | |
JP2005331787A (ja) | 表示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2005513176 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2004771578 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2007001936 Country of ref document: US Ref document number: 10569257 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 2004771578 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 10569257 Country of ref document: US |