WO2004064469A1 - 基板素片とその基板素片を用いた複合配線板 - Google Patents
基板素片とその基板素片を用いた複合配線板 Download PDFInfo
- Publication number
- WO2004064469A1 WO2004064469A1 PCT/JP2004/000026 JP2004000026W WO2004064469A1 WO 2004064469 A1 WO2004064469 A1 WO 2004064469A1 JP 2004000026 W JP2004000026 W JP 2004000026W WO 2004064469 A1 WO2004064469 A1 WO 2004064469A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring board
- flexible wiring
- rigid
- flexible
- film
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 81
- 239000000758 substrate Substances 0.000 claims description 176
- 230000003014 reinforcing effect Effects 0.000 claims description 18
- 238000010030 laminating Methods 0.000 claims description 9
- 239000000470 constituent Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 165
- 239000013039 cover film Substances 0.000 description 33
- 239000010410 layer Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 244000309464 bull Species 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
Definitions
- the present invention relates to the technical field of wiring boards, and in particular, to a substrate piece composed of a rigid wiring board and a flexible wiring board, and a composite wiring board using the substrate piece.
- Reference numeral 201 in FIG. 28 denotes a composite wiring board according to the related art of the present invention.
- FIG. 30 is an exploded view showing the structure of the composite wiring board 201, and reference numerals 271A, 2772A, 2771B, 2772B indicate rigid laminates,
- Reference numeral 278 denotes a single-layer or laminated flexible wiring board.
- the rigid laminated boards 2771A, 2772A, 2771B, and 2772B are configured by laminating single-layer rigid wiring boards.
- the flexible wiring board 278 is made of resin and has a flexible base film 211 and a wiring film 211 arranged on the base film 211.
- Rigid laminated board 2 7 1 A, 2 7 2 A, 2 7 1 B, 2 7 2 B Wiring film 2 2 1 is connected to flexible wiring board 2 7 8 wiring film 2 1 2 and flexible wiring
- the plate 278 is fixed to the front and back surfaces at both ends.
- Rigid laminates 2 7 1 A, 2 7 2 A, 2 7 1 B, 2 7 2 B are shorter than flexible wiring board 2 7 8, and rigid laminate 2 7 1 A at one end
- the central portion of the flexible wiring board 278 is connected between the rigid laminated board 271 B and the rigid laminated board 271 B at the other end.
- the rigid laminated boards 271 A and 272 A located at one end of the composite wiring board 201 are placed in the housing on the keyboard side.
- the rigid laminates 27 1 B and 27 2 B located at the other end are placed in the housing on the liquid crystal display panel side, the keyboard and liquid crystal display are configured while the liquid crystal display panel is openable and closable.
- the panels can be connected by flexible wiring boards 2 7 8.
- Japanese Patent Application Laid-Open No. H05-243738 there is Japanese Patent Application Laid-Open No. H05-243738.
- the present invention has been made to solve the disadvantages of the related art described above, and has as its object to provide a low-cost composite wiring board that is easy to handle. Disclosure of the invention
- the present invention provides at least one flexible wiring board, a plurality of short rigid wiring boards that are shorter than the flexible wiring board and are stacked together, and the short rigid wiring board.
- a plurality of long rigid wiring boards that are longer than each other and are stacked on each other, wherein the stacked short rigid wiring boards are arranged on one surface of the flexible wiring board, and the stacked long rigid wiring boards are stacked.
- the rigid wiring board is disposed on the opposite surface, and the one surface of the flexible wiring board is an exposed substrate piece.
- the distal end portion of the flexible wiring board is a substrate piece that is not fixed to the long rigid wiring board.
- the wiring films of the adjacent rigid wiring boards are substrate pieces connected by conductive protrusions.
- the present invention has a flexible wiring board for connection and two or more substrate pieces, and each of the substrate pieces is laminated with at least one flexible wiring board and shorter than the flexible wiring board.
- the wiring board is arranged on one side of the flexible wiring board, the laminated long rigid wiring board is arranged on the opposite side, the one side of the flexible wiring board is exposed, and
- the exposed part of the flexible wiring board is a composite wiring board connected to an end of the flexible wiring board for connection.
- the present invention is a composite wiring board in which a reinforcing film is attached between the flexible wiring board for connection and the flexible wiring board of the substrate piece.
- the present invention has a first substrate element and a second substrate element, wherein the first substrate element is at least one flexible wiring board and shorter than the flexible wiring board.
- the rigid wiring board is disposed on one side of the flexible wiring board, the laminated long rigid wiring board is disposed on the opposite side, and the one side of the flexible wiring board is exposed and the second substrate is provided.
- the element is formed by laminating at least one flexible wiring board and a plurality of rigid wiring boards, and the flexible wiring board and the rigid wiring board are laminated.
- An end portion of the flexible wiring board protrudes from a portion where the flexible wiring board is overlapped, and both surfaces thereof are exposed, and an exposed portion of the flexible wiring board of the first substrate piece and the second substrate A composite wiring board in which the element is connected to an exposed portion of the flexible wiring board.
- a reinforcing film is attached between an exposed portion of the flexible wiring board of the first substrate piece and an exposed portion of the flexible wiring board of the second substrate piece. It is a composite wiring board.
- the present invention is a composite wiring board in which an electronic component is mounted on at least one of the substrate pieces.
- the substrate piece of the first invention is configured by disposing an adhesive film or the like on the surface of a rigid wiring board or a flexible wiring board, and laminating each other by heating and pressing. I have.
- one or two or more short rigid wiring boards shorter than the length of the flexible wiring board are laminated on one side of the flexible wiring board, and at least the shorter rigid wiring board is placed on the opposite side.
- One or more rigid long wiring boards are laminated.
- the substrate piece of the present invention can be obtained.
- the portion of the flexible wiring board close to the short rigid wiring board may or may not be fixed to the long rigid wiring board.
- the substrate piece of the present invention is configured as described above, and the portion of the long rigid wiring board and the flexible wiring board that protrudes from the short rigid wiring board becomes the stage section, It is a base for connecting other flexible wiring boards to the board.
- the flexible wiring board that forms the stage Since the leading end of the flexible wiring board that forms the stage is turned up from the rigid wiring board, the flexible wiring board that forms the stage is Since both of the other flexible wiring boards connected thereto are bent, the stress of the connection portion is relieved, and peeling becomes difficult.
- the present invention has a first and a second rigid portion having a rigid wiring board, and a flexible wiring board longer than the first and the second rigid portions.
- the second rigid portion is disposed on the front and back surfaces of the flexible wiring board in a relative positional relationship in which one protrudes from the other.
- the central portion of the flexible wiring board is the first and second rigid portions.
- the flexible wiring board and the first and second rigid parts are fixed to each other at the central portion of the flexible wiring board, and the flexible wiring board is more rigid than the central portion.
- the substrate piece protrudes from both the first rigid part and the second rigid part.
- the present invention provides a substrate, wherein at least one of the portions of the flexible wiring board protruding toward the first and second rigid portions is separated from the first or second rigid portion. It is a fragment.
- the flexible wiring board is a substrate piece having a flexible base film and a patterned wiring film disposed on both sides of the base film.
- the rigid wiring board constituting the first and second rigid portions has a hard board, and a wiring film disposed on at least one surface of the hard board and patterned, and The wiring film of the wiring board and the rigid wiring board adjacent to the flexible wiring board are board pieces electrically connected by conductive protrusions.
- the present invention at least one of the first and second rigid portions is formed by laminating two or more rigid wiring boards, and a patterned wiring of the laminated rigid wiring boards is provided.
- the films are substrate pieces connected by conductive protrusions.
- the present invention includes a dissimilar element having at least a rigid wiring board, a substrate element, and a flexible wiring board for connection, wherein the substrate element has at least one flexible wiring board, It has a plurality of short rigid wiring boards which are shorter than the wiring board and are stacked on each other, and a plurality of long rigid wiring boards which are longer than the short rigid wiring boards and are stacked on each other.
- the laminated short rigid wiring board is arranged on one side of the flexible wiring board, and the laminated long rigid wiring board is arranged on the opposite side.
- a tip portion of the flexible wiring board of the substrate piece is bonded to one end of the connection flexible wiring board, and another end of the connection flexible wiring board is bonded to the heterogeneous piece;
- the present invention is a composite wiring board having a reinforcing film attached between the flexible wiring board for connection and the flexible wiring board of the substrate piece.
- the present invention is a composite wiring board on which an electronic component is mounted on the substrate piece.
- the substrate piece of the second invention is configured as described above.
- the end of the flexible wiring board is not connected to the rigid wiring board that forms the rigid part, and the end of the flexible wiring board can be turned over. Therefore, when another flexible wiring board is connected to the end of the flexible wiring board, both flexible wiring boards are bent together, so that unnecessary stress is not generated at the connection portion between the flexible wiring boards. It has become.
- FIG. 1 is a cross-sectional view for explaining a state before assembling a substrate piece according to an example of the first invention.
- FIG. 2 is a sectional view of a substrate piece according to an example of the first invention.
- FIG. 3 is a cross-sectional view (1) for explaining a step of assembling the composite wiring board of one example of the first invention.
- FIG. 4 is a sectional view (2) for explaining a step of assembling the composite wiring board of one example of the first invention.
- FIG. 5 is a cross-sectional view (3) for explaining a step of assembling the composite wiring board of one example of the first invention.
- FIG. 6 is a sectional view (4) for explaining a step of assembling the composite wiring board of one example of the first invention.
- FIG. 7 is a sectional view (5) for explaining a step of assembling the composite wiring board according to one example of the first invention.
- FIG. 8 is a sectional view of a substrate piece according to a second example of the first invention.
- FIG. 9 is a cross-sectional view of a composite wiring board using the substrate piece.
- FIG. 10 is a sectional view of a substrate piece according to a third example of the first invention.
- FIG. 11 is a sectional view (1) for explaining a step of assembling a composite wiring board using the substrate piece.
- FIG. 12 is a cross-sectional view (2) for explaining a step of assembling a composite wiring board using the substrate piece.
- FIG. 13a is a plan view of a part of the substrate piece main body of the first invention and a stage portion
- FIG. 13b is a plan view of an end portion of a flexible wiring board for connection.
- FIG. 14 is a cross-sectional view for explaining a state before assembling a substrate piece according to an example of the second invention.
- FIG. 15 is a sectional view of a substrate piece according to an example of the second invention.
- FIG. 16 is a cross-sectional view for explaining a state before assembling of the different pieces.
- FIG. 17 is a cross-sectional view of an example of a heterogeneous element.
- FIG. 18 is a cross-sectional view (1) for explaining a step of assembling the composite wiring board of one example of the second invention.
- FIG. 19 is a cross-sectional view (2) for explaining a step of assembling the composite wiring board of one example of the second invention.
- FIG. 20 is a sectional view (3) for explaining a step of assembling the composite wiring board of one example of the second invention.
- FIG. 21 is a cross-sectional view (4) for explaining a step of assembling the composite wiring board of one example of the second invention.
- FIG. 22 is a sectional view (5) for explaining a step of assembling the composite wiring board according to one example of the second invention.
- FIG. 23 is a sectional view of another example of the substrate piece of the second invention.
- FIG. 24 is a cross-sectional view of an example of a composite wiring board using the substrate piece. Twenty-fifth is a cross-sectional view for explaining an assembling process of another example of the composite wiring board of the second invention.
- FIG. 26 is a sectional view (2) for explaining an assembling process of another example of the composite wiring board of the second invention.
- FIG. 27a is a plan view of a part of the substrate piece of the second invention and a stage portion
- FIG. 27b is a plan view of an end portion of a flexible wiring board for connection
- FIG. 28 is a cross-sectional view of a composite wiring board according to the related art.
- FIG. 29 is a cross-sectional view of the composite wiring board in a state where electronic components are mounted.
- FIG. 30 is a cross-sectional view for explaining the structure of the composite wiring board of the related art.
- reference numerals 2 to 4 indicate substrate pieces.
- Reference numeral 8 denotes a flexible wiring board for connection
- reference numeral 1 0, 4 0 represents the flexible Shipuru wiring board
- reference numeral 1 2 shows the wiring layer of the flexible wiring board
- reference numeral 2 0 ⁇ 2 0 3 is short indicates Riji' de wiring board
- - 3 2 3 represents the wiring film of Riji' de substrate
- conductive illustrates a protrusion
- numeral 3 0 ⁇ 3 0 3 indicates Riji' de wiring board elongated
- reference numeral 4 1, 4 5 represents a board piece body
- Reference numeral 49 denotes an electronic component.
- reference numerals 2 and 3 denote substrate pieces
- reference numerals 8A and 8B denote flexible wiring boards for connection
- reference numerals 10 and 40 1 1 0, 1 6 0 indicates a flexible wiring board
- reference numeral 2 0 ⁇ 2 0 3, 3 0, ⁇ 3 03, 1 2 0, - 1 2 0 3, 1 3 0, - 1 3 0 3 is shows the Riji' de wiring board
- reference numeral 2 1, ⁇ 2 1 3, 3 1 1 ⁇ 3 1 33 ⁇ 4 1 2 1, ⁇ 1 2 1 3, ⁇ ⁇ ⁇ , ⁇ 3 1 3 shows a base substrate
- reference numeral 2 2 ⁇ 2 2 3, 3 2, and 3 2 3, 1 2 2 ⁇ 1 2 2 3, 1 3 2 ⁇ 1 3 2 3 represents the wiring film
- reference numeral 2 4 ⁇ 2 4 3, 3 4 ⁇ 3 4 3, 1 2 4 ⁇ 1 2 4 3, 1 3 4, - 1 3 4 3 shows conductive protrusions
- reference numeral 4 1, 1 4 1 represents a board
- Reference numeral 2 in FIG. 2 shows an example of a substrate piece of the present invention
- FIG. 1 shows components of the substrate piece 2 before assembly.
- the substrate piece 2 includes one or more flexible wiring boards 10 and the flexible wiring board 10. Disposed on one side of the reluctance wiring board 1 0, more Riji' de wiring board 2 0 short length than the flexible wiring board 1 0, and ⁇ 2 0 3, is disposed on the opposite side, the short length Riji' de wire plate 2 0 ⁇ 2 0 more even long than 3 Riji' de wiring board 3
- the flexible wiring board 10 has a base film 11 made of a resin film, and a wiring film 12 routed on the front and back surfaces of the base film 11.
- the wiring film 12 is configured by patterning a metal thin film into a predetermined shape.
- the wiring films 12 located on the front side and the back side are connected by conductive plugs 14 arranged in the through holes.
- the conductive plug 14 can be made of metal or conductive resin.
- Each Riji' de wiring board 2 0, ⁇ 2 0 3, 3 0 ⁇ ⁇ 3 0 3 includes a base wafer
- Wiring film 2 2 ⁇ 2 2 3, 3 2, ⁇ 3 2 3, the base substrate 2 1 ⁇ 2 1 3 3 0, is disposed on one side of the ⁇ 3 0 3, in the state before lamination, the surface opposite ⁇ law, the wiring film 2 2 ⁇ 2 2 3, 3 21-3 2 3 is connected to the conductive protrusions 2 4 ⁇
- 3 4 it is possible to 3 4 3 which may be formed by curing the conductive resin (conductive resin paste Bok), is grown metal formed.
- Short Riji' de wiring board 2 0 ⁇ 2 0 3 is arranged on one side of the flexible wiring board 1 0, elongated Riji' de wiring board 3 0 ⁇ 3 0 3, the opposite surface Are located in
- the wiring films 230, 32 of the wiring board 230 and the wiring film 12 of the flexible wiring board 10 are electrically connected.
- the flexible wiring board 1 0 and Riji' de wiring board 2 0 ⁇ 2 0 2, 3 0, - 3 0 2 of the wiring layer 1 2, 2 2, and 2 2 3, 3 2, ⁇ 3 2 3, separated from each other Are divided into a plurality of pieces, and those at predetermined positions are connected to each other.
- the flexible wiring board 1 0 and the elongated Riji' de wiring board 3 0 ⁇ 3 0 3 is protruded laterally from Riji' de-wiring board 2 0! ⁇ 2 0 3 aspects of short length, protruding
- a stage section 42 is constituted by the portions.
- Riji' de board 3 0 long, 1-3 0 3 and the flexible wiring board 1 Stage 4 2 parts and short Riji' de wiring board 2 0 except for 0 ⁇ 2 0 3 by the connexion, board piece
- the main body is configured.
- Stage 4 2 to represent the length in a direction protruding from the board piece body 4 one code to ,, length in the same direction board piece body 4 1 by reference numeral L 2, to improve the workability Therefore, the length L, a stage section 4 2, has been that (shorter than the length L 2 of the board piece body 4 1, Gushi.
- the portion of the flexible wiring board 10 included in the substrate piece main body 41 is fixed to the rigid wiring boards 20, 30 adjacent thereto by an adhesive film or the like, and is included in the stage section 42.
- the part is not fixed to at least the tip part, the rigid wiring board 30, and can be freely turned.
- a cover film 16 is adhered to the surface of the portion included in the stage portion 42 of the flexible wiring board 10 except for a part.
- the cover film 16 is affixed except for the tip portion.
- the cover film 16 is not disposed at the end of the flexible wiring board 10, and the surfaces of the wiring film 12 and the base film 11 are exposed.
- FIG. 13a is a partial plan view of the substrate piece 2 having the above structure, in which a part of the substrate piece body 41 and the stage section 42 are shown.
- Reference numerals 2A and 2B in FIG. 3 denote board pieces having the same structure as the above-mentioned board piece 2, respectively.
- the flexible wiring board 10 of these two board pieces 2A and 2B is The wiring film 12 is exposed at the tip of the stage section 42.
- an anisotropic conductive film 17 is placed on the exposed surface of the wiring film 12 of each of the substrate pieces 2A and 2B. At least the base film 11 on the back surface of the exposed portion is not fixed to the rigid wiring board 30 adjacent to the back surface. '
- Reference numeral 8 in FIG. 4 denotes a flexible wiring board for connection, which is different from 10 of the flexible wiring board.
- a wiring film 52 is disposed on at least one surface of the base film 51, and a cover film 56 is formed on the surface of the wiring film 52 except for both end portions. Are located. Both ends of the wiring film 52 are exposed.
- FIG. 13b is a plan view of one end of the flexible wiring board 8 for connection.
- the wiring film 52 of the flexible wiring board 8 is patterned so as to be arranged in a shape and position corresponding to the pattern of the wiring film 12 on the stage section 42.
- the exposed portion of the wiring film 52 is pressed against the anisotropic conductive film 17 of the substrate pieces 2A and 2B and heated and pressed, as shown in FIG.
- the wiring film of the flexible wiring board 10 of 2 A and 2 B is electrically connected to the wiring film ⁇ 2, and the wiring film 1 2, 2 2 1 to 2 2 3, 3 2 of the substrate piece 2 A is electrically connected. , ⁇ 3 2
- the flexible wiring board 10 of the substrate pieces 2A and 2B and the flexible wiring board 8 for connection have flexibility.
- connections are maintained while maintaining the electrical connections between the wiring films 20, 30, and the wiring films 22, 32, and the flexible wiring films 8, 10, and the wiring films 12, 52.
- the flexible wiring board 8 for use can be bent.
- the distal end portion of the flexible wiring board 10 located on the stage section 42 and the flexible wiring board for connection are connected.
- the reinforcing film 18 is attached between the tip portions of the flexible wiring boards 8, the flexible wiring boards 8 and 10 are mechanically and firmly connected to each other by the reinforcing film 18.
- the components connected to the wiring film 52 of the flexible wiring board 8 for connection or the electronic components 49 are mutually connected by 3 , 34, to 343, and the like.
- each electronic component 49 is connected to the power supply and the like.
- the base films 11 and 51 of the flexible wiring boards 10 and 8 and the cover films 16 and 56 are polyimide films of tens to tens of Atm.
- the wiring films 12, 52, 22, to 22 3 , 32 to 32 3 are formed by patterning copper foil having a thickness of tens to several tens / im into a predetermined shape, It bends together with the base films 11 and 51 and the cover films 6 and 56 so that the flexibility of the flexible wiring boards 8 and 10 is not impaired.
- Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0 ⁇ 3 0 3 of the base substrate 2 1-2 1 3 3 0 ⁇ 3 0 3 is made of a glass epoxy resin or the like, thickness 5 It is a thin plate of about 0 to 500 Am and does not have flexibility. Therefore, once the mounted electronic components 4 9, and summer as stress is not applied between the terminals of the electronic component 4 9 and the wiring film 2 2 3, 3 2 3.
- Reference numeral 3 in FIG. 8 denotes a substrate piece according to the second example of the present invention, which is different from the substrate piece 2 according to the first example in that the cover film 46 of the flexible wiring board 40 is It is longer than the length.
- the tip of the cover film 46 is not adhered to the wiring film 12 or the base film 11, and the surface of the wiring film 12 is exposed at that portion.
- Reference numerals 3A and 3B in FIG. 9 denote two substrate pieces having such a configuration, and anisotropically conductive portions are provided on the exposed portions of the wiring films 12 of the substrate pieces 3A and 3B.
- the flexible film 17 is disposed, the flexible wiring board 8 for connection is affixed, and the peeled portion of the cover film 46 is further affixed to the flexible wiring board 8 for connection.
- the wiring board 72 is obtained.
- Reference numerals 3A and 3B in FIG. 9 denote two pieces of the substrate having the above configuration, respectively, and anisotropically guided to the exposed portion of the wiring film 12 of each of the pieces 3A and 3B.
- An electrically conductive film 17 is arranged, and a flexible wiring board 8 for connection is affixed.
- the tip portion of the cover film 46 is attached to the flexible wiring board 8 for connection, thereby forming the composite wiring board 72 of the second example of the present invention. Therefore, in the composite wiring board 72, the peeled portion of the cover film 46 from the base film 11 or the like is used as a reinforcing film. In this case, the peeled portion of the cover film 46 is attached to the base film 51 of the flexible wiring board 8 for connection.
- the end opposite to the peeled portion may end at the end of the substrate piece main body 41, or may extend to the inside of the substrate piece main body 41.
- the length of the stage portion 4 4 is shorter than the length L 2 of the substrate piece body 41.
- the present invention is not limited thereto.
- Reference numeral 4 in FIG. 10 indicates a substrate piece of the third example of the present invention.
- the substrate piece 4 has one or two or more rigid wiring boards 3 0 3 0 2 of the same length as the flexible wiring board 10 on the back surface of the flexible wiring board 10, and the bottom surface thereof. located in the surface of the Riji' de wiring board 3 0 2, short Riji' de wiring board 2 0 ⁇ 2 0 3 Riji' same length of one or more of de-wiring board 35, is 1-3 5 3 Are located.
- At least the distal end portion of the flexible wiring board 10 is not connected to the rigid wiring board 30, and is turned up.
- Reference numeral 5 in FIG. 11 denotes a substrate piece of a type different from the substrate pieces 2 to 4 of the first to third examples.
- one end of the flexible wiring board 60 is Rigid wiring boards 51 and 52 laminated on the front and back surfaces thereof are fixed, respectively, and the other ends protrude from rigid wiring boards 51 and 52.
- This flexible wiring board 60 is formed by laminating a base film 61, a wiring film 62, and a cover film 66, and the wiring film 62 is exposed at the tip of the protruding portion. ing.
- Reference numeral 2 denotes a substrate piece according to the first example of the present invention described above, and an anisotropic conductive film is affixed to the wiring film 12 located on the stage section 42.
- the flexible wiring board 6 of the dissimilar substrate piece 5 is pressed as shown in FIG.
- the tip of 0 is affixed to the flexible wiring board 10 on the stage section 42.
- the wiring films 12 and 62 of the flexible wiring boards 10 and 60 are electrically connected by an anisotropic conductive film 17 as shown in FIG.
- the wiring board 73 is obtained.
- the substrate piece of the present invention can be freely combined with a different type of substrate piece to form a composite wiring board.
- the substrate piece of the present invention is used As long as there is, the composite wiring board is included in the present invention.
- the electronic component 49 may be mounted after assembling the composite wiring board of the present invention from the substrate piece, or after mounting the electronic component on the substrate pieces 2 and 3, the connection flexible board may be mounted.
- a composite wiring board may be assembled by connecting wiring boards and other substrate pieces.
- the flexible wiring board 10 used for the connection and the flexible wiring boards 10 and 40 constituting the stage sections 42 and 44 have a single layer, a plurality of flexible wiring boards are laminated. Is also good.
- Reference numeral 2 in FIG. 15 shows an example of a substrate piece of the present invention
- FIG. 14 shows a state before assembly of the substrate piece 2 for each component
- Reference numeral 102 in FIG. 17 indicates a different kind of element having a structure different from that of the substrate piece 2 of the present invention.
- the heterogeneous element 102 and a heterogeneous element to be described later are used in combination with the substrate element 2 of the present invention to form a composite wiring board.
- FIG. 16 shows the state before assembly of the dissimilar element 102 for each component.
- the substrate piece 2 of the present invention and the heterogeneous piece 102 used together with the substrate piece 2 include one or more flexible wiring boards 10, 1 1 0, more Riji' de wiring board 2 0, which is disposed in the flexible wiring board 1 0, 1 1 0 surface, and ⁇ 2 0 3, 1 2 0, - 1 2 0 3, the opposite surface , Each having a plurality of rigid wiring boards 30 to 30 3 , 130 and 130 3 .
- Reference numerals 20 and 120 in FIGS. 15 and 17 indicate a first rigid portion in which rigid wiring boards ⁇ ⁇ ⁇ ⁇ ⁇ 20 ⁇ to 120 3 are laminated on the front side, respectively. and a, FIG numeral 3 0, 1 3 0, it and re jitter de wiring board 3 0 disposed on the opposite side, ⁇ 3 0 3, 1 3 0 were laminated respectively to 1 3 0 3 This is the second rigid part.
- each Riji' de wiring board 2 0, ⁇ 2 0 3, 3 0, ⁇ 3 0 3, 1 2 0, ⁇ 1 2 0 3, l SOISO s is, the base substrate 2, ⁇ ? "! ⁇ 3 1, ⁇ 3 1 3, IZI l ZI 1 3 1 1 - 1 3 1 3, wiring layer 2 2, to 2 2 3, 3 2, and 3 2 3, 1 2 2, to 1 2 2 3 , 1 3 2, and 1 to 3 2 3 respectively.
- Wiring film 2 2 ⁇ 2 2 3, SZSZ 1 2 2 ⁇ 1 2 2 3, 1 3 2 ⁇ 1 3 2 3, the base substrate 2 1 ⁇ 2 1 3 3 1 ⁇ 3 1 3, 1 2 1! ⁇ 1 2 1 3 , 1 3 1, ⁇ 1 3 1 3 are arranged on one side, and before the lamination, the bottom surface is each wiring film 2 2, ⁇ 2 2 3 , 3 2, ⁇ 3 2 3 , 1 2 2, 1 2 3 , 1 3 2 ⁇ ⁇ 1 ⁇ ⁇ Connected conductive protrusions? , ⁇ ?
- conductive resin paste Bok conductive resin paste Bok
- Each of the rigid wiring boards constituting the first and second rigid portions 20, 30, 120, 130. , ⁇ ? . 3 0 ⁇ 3 0 3, 1 2 0, is ⁇ 1 2 0 3, 1 3 0-1 3 0 3, Riji' de wiring board 2 0 adjacent to each other, to 2 0 3, 3 0 ⁇ 3 0 3 , 1 shed, ⁇ ] 2 0 3, 1 3 0, wiring film 2 2 to 1 3 0 3, to 2 2 3, 3 2, and 3 2 3, 1 2 2, - 1 2 2 3, "! ®?, ⁇ ⁇ ! ® 3 and the conductive protrusions 2 4, ⁇ 2 4 3, 3 4, ⁇ 3 4 3, 1 2 4 ⁇ ⁇ 1 2 4 3, 1 3 4, and the tip of ⁇ 1 3 4 3 And are electrically connected to each other.
- each rigid wiring board. , ⁇ ? . 3 0 ⁇ 3 0 3, 1 2 0, - 1 2 0 3, 1 3 0, - 1 3 0 3 is disposed adhesive between, Riji' de wiring board ZOZOSC ⁇ SO ⁇ 1 2 0,-1 2 0 3, 1 3 0, to 1 3 0 3 are adhered to each other by the adhesive and fixed to each other.
- the flexible wiring board 1 0 has board piece 2 of the present invention, the length of each Riji' de wiring board 2 0 ⁇ 2 0 3, 3 0, is formed longer than the length of ⁇ 3 0 3
- the first rigid part 20 on the front side is disposed at one end of the flexible wiring board 10, and the second rigid part 30 on the opposite side is disposed at the opposite end. ing. Therefore, the opposite surfaces of both ends of the flexible wiring board 10 are exposed.
- the first rigid portion 20 and the second rigid portion 30 overlap at the central portion of the flexible wiring board 10, and the central portions of the flexible wiring board 10 are the first and second rigid portions. It is sandwiched between rigid parts 20 and 30.
- Reference numeral 41 in FIG. 15 includes an overlapped portion of the laminates 20 and 30 and a portion of the flexible wiring board 10 sandwiched by the laminates 20 and 30. shows a board piece body, reference numeral 4 2 ,, 4 2 2 laminate 2 0, 3 0 and a stage unit comprising a portion protruding from the board piece body 4 one of the flexible wiring board 1 0 Is shown.
- the flexible wiring board 10 of the substrate piece 2 of the present invention and the flexible wiring board 110 of the different kind piece 102 used together with the substrate piece 2 are base films 11, 1 1 1 made of a resin film. And wiring films 12 and 12 disposed on the front and back surfaces of the base films 11 and 11, respectively.
- the wiring films 12 and 112 are formed by patterning a metal thin film such as a copper foil into a predetermined shape.
- Through holes are formed in the base films 1 1, 1 1 1, and are located on the front side and the back side of the base films 11 1, 11 1 of the wiring film 12, 12.
- the parts are electrically connected by conductive plugs 14 and 114 arranged in the through holes.
- the conductive plugs 14 and 1 14 can be made of metal or conductive resin.
- the conductive protrusions 24, 34 exposed on the surfaces of the first and second rigid portions 20 and 30 are the flexible wiring board 1 0 and are electrically connected to each other.
- an adhesive is disposed between the flexible wiring board 10 in the portion of the substrate piece 41 and the first and second rigid portions 20 and 30 to provide a flexible wiring board.
- the wire plate 10 and the first and second rigid portions 20 and 30 are adhered.
- the stage section 4 2 ,, 4 2 2 between the flexible wiring board 1 0 and the first.
- the second Riji' de section 2 0, 3 0 is bonded at least the flexible wiring board 1 0 of the distal
- a portion at a fixed distance from the tip of the flexible wiring board 10 can be turned up from the laminates 20 and 30.
- the turned part of the flexible wiring board 10 can be separated from the first and second rigid parts 20 and 30. '
- cover film 1 6 is attached to the wiring film 1 2 surfaces, the wiring layer 1 2, a portion thereof Except for the exposed part, it is covered by the cover film 16.
- the heterogeneous element 102 used together with the substrate element 2 of the present invention will be described.
- a rigid wiring board arranged on one surface of the flexible wiring board 110 is described. 1 2 0, to 1 2 0 3 are shorter than the length of the flexible wiring board 1 1 0, and the rigid wiring board 1 3 0, to 1 3 0 3 arranged on the surface on the opposite side Is as long as the length of the flexible wiring board 110.
- the first Riji' de unit 1 2 0 consisting of ⁇ 1 2 0 3 is disposed at the end portion of the flexible wiring board I 1 0. Therefore, the other end of the flexible wiring board 110 protrudes from the first rigid portion 120.
- FIG. 17 shows a substrate piece main body constituted by a rigid portion 120 and a portion sandwiched between first and second rigid portions 120 and 130 of the flexible wiring board 110.
- reference numeral 142 denotes a stage portion constituted by a portion of the long laminated body 130 and the flexible wiring board 110 protruding from the substrate piece main body 141.
- a portion of the wiring film 12 is exposed near the tip of the portion included in the stage 14 2 of the flexible wiring board 110, and a cover film 1 16 is disposed on the other portion, and the cover film is provided.
- the film is covered by 1 1 6.
- the flexible wiring board 1 ⁇ 0 and the first and second rigid portions 120, 130 are mechanically connected by an adhesive. .
- the leading end portion of the flexible wiring board 110 is not bonded to the second rigid portion 130, and The end of the wiring board 110 can be turned from the laminate 130. Therefore, the tip of the flexible wiring board 110 can be separated from the second rigid portion 130.
- the 2 7 a diagram is a plan view of the substrate piece 2 or stage of heterogeneous pieces 1 0 2 4 2 ,, 4 2 2, 1 4 2 of the tip of the structure, board piece body 4 1, Part of 14 1 is also shown.
- the tips of the cover films 16 and 116 are removed, and the tips of the wiring films 12 and 112 are exposed.
- Reference numeral 102A in FIG. 18 and reference numeral 102B described later indicate a heterogeneous element having the same structure as the above-described heterogeneous element ⁇ 02, and reference numeral 8A and a description will be given later.
- Reference numeral 8B indicates a flexible wiring board for independent connection, not a component part of the substrate piece 2 or the heterogeneous pieces 102A and 102B.
- the flexible wiring board 8A (and 8B) for connection is formed by laminating a base film 51, a patterned wiring film 52, and a cover film 56 to form a cover film 56.
- the wiring film 52 is exposed at both ends of the flexible wiring boards 8A and 8B for cycling.
- FIG. 27b is a plan view of an end portion of a flexible wiring board 8A for connection (and a flexible wiring board 8B described later).
- the end of the flexible wiring board 8A for connection is arranged on the stage section 42 of the substrate piece 2 and the stage section 142 of the heterogeneous piece 102A, and is a flexible wiring board for connection.
- the end of 8 A is superimposed on the end of the flexible wiring boards 10 and 110 which constitute a part of the stage sections 42 and 142.
- a plurality of exposed portions of the wiring film 52 included in the flexible wiring board 8A for connection include the substrate piece 2 and the wiring film 1 2 included in the flexible wiring boards 10 and 110 of the different piece 102A. , 1 12 are arranged at positions corresponding to the exposed portions.
- Positioning is performed so that the exposed portion of the wiring film 52 of the flexible wiring board 8A for connection and the exposed portions of the wiring films 12 and 11 included in the stage portions 42 and 142 are overlapped.
- the flexible wiring board 8A for connection is brought into close contact with the anisotropic conductive films 17 and 1 17 and the stage sections 42 and 142 are heated and pressed, as shown in Fig. 19 As shown, the substrate piece 2 and the foreign piece The wiring films 12 and 112 of 102 are electrically connected by the wiring film 52 of the flexible wiring board 8A for connection.
- the heterogeneous pieces 102 A and 102 B are electrically connected to each other by the connecting flexible wiring boards 8 A and 8 B and the board piece 2.
- the flexible wiring board 10 of the substrate piece 2 and the flexible wiring boards 8A and 8B for connection have flexibility and flexibility, and the electrical connection between the flexible wiring boards 10 and 8A and 8B.
- the flexible wiring boards 10, 8 A, and 8 B of the composite wiring board 71 can be bent while maintaining the electrical connection.
- the flexible wiring board 10 at both ends of the flexible wiring board 10 of the substrate piece 2 where at least the anisotropic conductive film 17 is placed is a first and second rigid body. It is not adhered to the parts 20 and 30 and the end of the flexible wiring board 10 is turned up.
- the portion included in the stage portion 142 is also included in the second rigid portion 130 located on the back surface. Is not fixed, it bends together with 8B to flexible wiring board 8 for connection, so that the stress generated at the connection portion of flexible wiring boards 8A, 8B, 110 is relieved .
- the reinforcing film 18 is attached between the end of the flexible wiring board 10 of No. 2 and the end of the flexible wiring boards 8A and 8B for connection.
- the reinforcing film 18 is similarly connected between the flexible wiring boards 110 of the different pieces 102 A and 102 B and the flexible wiring boards 8 A and 8 B for connection. Attach.
- the reinforcing film 18 was attached on the cover films 16, 116, and 56 of the flexible wiring boards 10, 110, 8 A, and 8 B.
- Reinforcement film 18 allows flexible connection between flexible wiring board 10 of substrate piece 2 and flexible wiring boards 8 A and 8 B for connection, and different types of flexible pieces 10 2 A and 102 B for connection
- the wiring boards 8 A and 8 B are mechanically and firmly connected.
- the electronic component 49 is arranged on the substrate piece 2 and the heterogeneous pieces 102A and 102B, and the terminals of the electronic component 49 are placed in the first and second positions.
- second Riji' de section 2 0, 3 0, 1 2 0, 1 3 Riji' de wiring board 2 0 3 constituting the outermost layer of 0, 3 0 3, 1 2 0 1 3 0 3 of the wiring film 2 2 3, 3 2 3, 1 2 2 3, 1 3 to connect to 2 3, the electronic component 4 9 is mounted to the composite wiring board 71.
- the electronic components 49 can be electrically connected to each other, and when the substrate piece 2 or the dissimilar pieces 102A and 102B are connected to an external circuit, the electronic components 49 are not connected. However, it can be connected to the external circuit.
- the base films 11, 11, and 51 and the cover films 16, 11, and 56 are tens to tens of At. It is a polyimide film of m.
- Wiring film 2 2, 2 2 3 , 3 2, 3 2 3 , 1 2 2, 1 2 3 3 , 1 3 2, ⁇ 3 2 3 is a copper foil having a thickness of ten to several tens m are configured by being patterned into a predetermined shape.
- the wiring films 12, 1 1, 2 and 5 of the flexible wiring boards 10, 11, 8 A, and 8 B are made of the base films 11, 11, 5 1 and the cover films 16, 1. It bends together with 16 and 56, and the flexibility of flexible wiring boards 10 and 110, 8A and 8B is not lost.
- Total Ichisu substrate 2 1, ⁇ 2 1 3 , 3 1, ⁇ 3 1 3 , 1 2 1 , ⁇ 1 2 1 3, 1 3 1, ⁇ 1 3 1 3, consists of a glass-epoxy resin or the like, a thickness of 5 0 ⁇ 5 0 0 m approximately plates, flexibility have Absent. Therefore, when the electronic component 49 is mounted on the substrate piece 2 or the dissimilar pieces 102A, 102B, the electronic component 49 is bent even when the flexible wiring boards 10, 8A, 8B are bent. No stress is applied between these terminals and the substrate element 2 or the dissimilar element 102.
- Reference numeral 3 in FIG. 23 indicates a substrate piece according to the second embodiment of the present invention.
- the tip of the cover film 46 of the flexible wiring board 40 which is a part of the substrate piece 3 is not bonded to the wiring film 12 or the base film 11, and the end of the cover film 46 is not bonded to the wiring film 12 or the base film 11. Then, the surface of the wiring film 12 is exposed so that another film can be inserted between the cover film 46 and the wiring film 12.
- the cover film 46 on one or both of the stage sections 4 2 4 2 2 is a flexible wiring board of the substrate piece 2 in FIG. 1 0 longer than the cover fill ⁇ 1 6 having the tip portion of the cover film 4 6 are protruded from the stage section 4 2 ,, 4 2 2.
- one of the stage section 4 2 out seen from, in the other of the stage 4 2 2, not sticking out.
- the other configuration of the substrate piece 3 is the same as the substrate piece 2 of the first example.
- FIG. 24 shows a state in which the substrate piece 3 and the heterogeneous piece 102 A are connected by a flexible wiring board 8 A for connection.
- the cover film 46 of the substrate piece 3 is rolled up, and the anisotropic conductive film 17 is arranged in the form of the wiring film 12, between the anisotropic conductive film 17 and the cover film 46.
- the end of the flexible wiring board 8 A for connection is inserted, and the wiring film 52 of the flexible wiring board 8 A for connection is electrically connected to the wiring film 12 of the flexible wiring board 10 by the anisotropic conductive film 17. It is connected to the.
- the portion of the cover film 46 protruding from the base film 41 is disposed on the flexible wiring board 8A for connection, and is adhered to the base film 51 of the flexible wiring board 8A for connection with an adhesive. Have been. Therefore, the flexible wiring board 10 of the substrate piece 3 and the flexible wiring board 8A for connection are mechanically connected by the cover film 46 instead of the reinforcing film.
- the end of the cover film 46 on the substrate piece main body 41 side may extend to the inside of the substrate piece main body 41, or may be a boundary between the stage section 42 and the substrate piece main end 4 ⁇ . May be terminated.
- stage section 42 2 on the opposite side to the stage section 42 2 , a connection is made to a dissimilar element (not shown) by a flexible wiring board 8 B for connection in the same procedure as in the first example.
- An example composite wiring board 72 is obtained.
- a second example electronic component to the composite wiring board 7 2 of the substrate piece 2 and heterogeneous piece 1 0 2 A, etc. are arranged, the terminals of the electronic component, the outermost layer of Riji' de wiring board 2 0 3, 3 0 3, 1 2 0 3, 1 3 0 3 of the wiring film 2 2 3, 3 2 3, 1 2 2 3, 1 3 to connect to 2 3, the electronic component is mounted on the composite wiring board 7 2.
- both or one of the cover films 46 can be set to a length protruding from the stage section 4 2 ′′ 4 2 2 .
- the heterogeneous element 102 has the flexible wiring board 110, but the composite wiring board of the present invention uses a heterogeneous element having no flexible wiring board, and uses the heterogeneous element.
- Flex circuit board for connecting the board and the substrate piece The connection may be made at 8 A (or 8 B).
- the present invention includes a composite wiring board in which a dissimilar element 102 having the flexible wiring board 110, a dissimilar element having no flexible wiring board, and the substrate element 2 of the present invention are combined. It is.
- the composite wiring board of the present invention can also be formed when the flexible wiring boards 8A and 8B for connection form a part of a dissimilar substrate piece.
- Reference numeral 103 in FIG. 25 is an example of a heterogeneous element used in that case, and the heterogeneous element 103 is a long flexible wiring board 160, a first and a second. It has the laminated bodies 15 1 and 15 2.
- the first and second laminated bodies 15 1 and 15 2 are each configured by laminating one or more rigid wiring boards shorter than the flexible wiring board 160, and The laminated bodies 15 1 and 15 2 are arranged on the front and back sides of the same end of the flexible wiring board 16 0, and the laminated bodies 15 1 and 15 2 and the flexible wiring board 16 0 Are fixed to each other by an adhesive.
- the flexible wiring board 160 Since the flexible wiring board 160 is longer than the laminates 151 and 152, the flexible wiring board 160 protrudes from between the laminates 151 and 152. Reference numeral 153 in the figure indicates the protruding portion.
- the flexible wiring board 160 includes a base film 161, a patterned wiring film 162, and a cover film 166, which are laminated. The cover film 166 is partially removed and the surface of the wiring film 162 is exposed.
- an anisotropic conductive film 17 is placed on the end of the flexible wiring board 10 on one of the stage portions 42 and the side of the substrate piece 2 of the present invention, and The tip of the flexible wiring board 160 of the element 103 is bonded to the anisotropic conductive film 17.
- the other stage section 4 2 2 is connected to the foreign element through the connecting film 8 B.
- the long flexible wiring board 160 of the dissimilar element 103 functions as a flexible wiring board for connection, and the composite wiring board 73 of the third example of the present invention is obtained.
- the flexible wiring board 160 uses two dissimilar pieces 103 protruding from between the laminated bodies 151 and 152, and two stages of the substrate piece 2 of the present invention. both parts 4 2 ,, 4 2 2, a portion 1 5 3 protrudes may be their respective connection to the substrate piece 2 of the present invention, in combination with other heterogeneous pieces present
- the composite wiring board of the invention can be constituted.
- the substrate element 2 of the present invention can be freely combined with a different element to form a composite wiring board.
- the composite wiring board is included in the present invention.
- the dissimilar element that can constitute the composite wiring board of the present invention may have a flexible wiring board, or may have only a rigid wiring board without a flexible wiring board.
- the electronic component 49 may be mounted after assembling the composite wiring board of the present invention from the substrate element, or may be mounted after mounting the electronic component on the substrate element 2 and then connected to the flexible wiring.
- a composite wiring board may be assembled by connecting the flexible wiring boards 110, 160 of the boards 8A, 8B and the different pieces 102, 103.
- connection above the flexible wiring board 8 A, 8 B used in the flexible wiring board 1 0 included in the stage 4 2 ,, 4 2 2 board piece is a single although it is a layer, a plurality of flexible wiring boards may be laminated.
- the flexible wiring boards 110, ⁇ 60 included in the heterogeneous pieces 102, 103 can also be configured by laminating a plurality of flexible wiring boards. ⁇ Industrial applicability
- the board piece of the present invention can be assembled and assembled from a board piece and a different kind piece at the time of use, so that it is easier to store and handle as compared to the composite wiring board.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN200480002023A CN100594764C (zh) | 2003-01-09 | 2004-01-07 | 线路板部件和使用该线路板部件的复合线路板 |
US11/176,756 US20050243528A1 (en) | 2003-01-09 | 2005-07-08 | Board pieces and composite wiring boards using the board pieces |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2003003438 | 2003-01-09 | ||
JP2003-003438 | 2003-01-09 | ||
JP2003-097771 | 2003-04-01 | ||
JP2003097771A JP2004266236A (ja) | 2003-01-09 | 2003-04-01 | 基板素片とその基板素片を用いた複合配線板 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/176,756 Continuation US20050243528A1 (en) | 2003-01-09 | 2005-07-08 | Board pieces and composite wiring boards using the board pieces |
Publications (1)
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WO2004064469A1 true WO2004064469A1 (ja) | 2004-07-29 |
Family
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PCT/JP2004/000026 WO2004064469A1 (ja) | 2003-01-09 | 2004-01-07 | 基板素片とその基板素片を用いた複合配線板 |
Country Status (5)
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US (1) | US20050243528A1 (ja) |
JP (1) | JP2004266236A (ja) |
CN (1) | CN100594764C (ja) |
TW (1) | TWI243396B (ja) |
WO (1) | WO2004064469A1 (ja) |
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JPH05243741A (ja) * | 1992-02-27 | 1993-09-21 | Sharp Corp | 多層フレキシブルプリント配線板 |
JPH06268348A (ja) * | 1993-03-12 | 1994-09-22 | Sony Chem Corp | 複合可撓性プリント基板 |
JPH06326424A (ja) * | 1993-05-17 | 1994-11-25 | Sharp Corp | 多層配線板 |
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JPH0837379A (ja) * | 1994-07-21 | 1996-02-06 | Hitachi Chem Co Ltd | 端子付多層配線板の製造法 |
JPH08288654A (ja) * | 1995-04-17 | 1996-11-01 | Toshiba Chem Corp | フレックスリジット多層配線板の製造方法 |
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KR940006185Y1 (ko) * | 1990-06-07 | 1994-09-10 | 가시오 게이상기 가부시끼가이샤 | Ic 모듈 |
US5206463A (en) * | 1990-07-24 | 1993-04-27 | Miraco, Inc. | Combined rigid and flexible printed circuits and method of manufacture |
US6350387B2 (en) * | 1997-02-14 | 2002-02-26 | Teledyne Industries, Inc. | Multilayer combined rigid/flex printed circuit board containing flexible soldermask |
US6274819B1 (en) * | 1999-09-01 | 2001-08-14 | Visteon Global Technologies, Inc. | Method and article for the connection and repair of flex and other circuits |
-
2003
- 2003-04-01 JP JP2003097771A patent/JP2004266236A/ja active Pending
- 2003-12-29 TW TW092137281A patent/TWI243396B/zh not_active IP Right Cessation
-
2004
- 2004-01-07 CN CN200480002023A patent/CN100594764C/zh not_active Expired - Lifetime
- 2004-01-07 WO PCT/JP2004/000026 patent/WO2004064469A1/ja active Application Filing
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2005
- 2005-07-08 US US11/176,756 patent/US20050243528A1/en not_active Abandoned
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JPH0575270A (ja) * | 1991-09-11 | 1993-03-26 | Sony Chem Corp | 複合多層配線板の製造方法 |
JPH05243741A (ja) * | 1992-02-27 | 1993-09-21 | Sharp Corp | 多層フレキシブルプリント配線板 |
JPH06268348A (ja) * | 1993-03-12 | 1994-09-22 | Sony Chem Corp | 複合可撓性プリント基板 |
JPH06326424A (ja) * | 1993-05-17 | 1994-11-25 | Sharp Corp | 多層配線板 |
EP0632683A2 (en) * | 1993-07-02 | 1995-01-04 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
JPH0837379A (ja) * | 1994-07-21 | 1996-02-06 | Hitachi Chem Co Ltd | 端子付多層配線板の製造法 |
JPH08288654A (ja) * | 1995-04-17 | 1996-11-01 | Toshiba Chem Corp | フレックスリジット多層配線板の製造方法 |
JPH11121882A (ja) * | 1997-10-14 | 1999-04-30 | Sumitomo Bakelite Co Ltd | フレキシブルプリント配線板とその製造方法 |
JP2001251053A (ja) * | 2000-03-06 | 2001-09-14 | Sony Corp | プリント配線基板及びプリント配線基板の製造方法 |
JP2002064271A (ja) * | 2000-06-09 | 2002-02-28 | Matsushita Electric Ind Co Ltd | 複合配線基板及びその製造方法 |
JP2002271022A (ja) * | 2001-03-13 | 2002-09-20 | Nippon Mektron Ltd | ケーブル部を有するプリント基板およびその製造方法 |
JP2002290028A (ja) * | 2001-03-23 | 2002-10-04 | Denso Corp | プリント配線基板の接続方法及び接続構造 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8354596B2 (en) | 2008-05-19 | 2013-01-15 | Ibiden Co., Ltd. | Multilayer wiring board and method for manufacturing the same |
US8536457B2 (en) | 2008-05-19 | 2013-09-17 | Ibiden Co., Ltd. | Multilayer wiring board and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
US20050243528A1 (en) | 2005-11-03 |
TW200419637A (en) | 2004-10-01 |
JP2004266236A (ja) | 2004-09-24 |
CN100594764C (zh) | 2010-03-17 |
CN1723747A (zh) | 2006-01-18 |
TWI243396B (en) | 2005-11-11 |
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