TW200419637A - Elemental pieces and complex wiring board using the same - Google Patents

Elemental pieces and complex wiring board using the same Download PDF

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Publication number
TW200419637A
TW200419637A TW092137281A TW92137281A TW200419637A TW 200419637 A TW200419637 A TW 200419637A TW 092137281 A TW092137281 A TW 092137281A TW 92137281 A TW92137281 A TW 92137281A TW 200419637 A TW200419637 A TW 200419637A
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Taiwan
Prior art keywords
wiring board
flexible wiring
rigid
substrate sheet
flexible
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Application number
TW092137281A
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Chinese (zh)
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TWI243396B (en
Inventor
Takashi Murayama
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Sony Chemicals Corp
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Publication of TW200419637A publication Critical patent/TW200419637A/en
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Publication of TWI243396B publication Critical patent/TWI243396B/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

At both ends of the invented elemental piece 2, the soft wiring board provided in the elemental piece 2 is exposed; and the heterogeneous elemental pieces 102A and 102B are connected by connecting the flexible substrates 8A, 8B so as to form the complex wiring board 71. Since each constitution component can be individually reserved and processed, it is more convenient than the condition of reserving the complex wiring board 71.

Description

200419637 玖、發明說明： 【發明所屬之技術領域】 本發明，係有關配線板之技術領域，尤其關於硬性配 線板及軟性配線板所構成之基板片、以及使用該基板片之 複合配線板。 【先前技術】 第28圖之符號201，係習知技術之複合配線板。 第30圖係表示該複合配線板201之構造的分解圖，符 號271A、272A、271B、272B，係表示硬質積層板，符號 2 7 8係表示單層或積層構造之軟性配線板。 硬質積層板271A、272A、271B、272B，係將單層之硬 性配線板積層而構成。 軟性配線板 278，具有樹脂製之軟性底膜（base film)211、及配置於底膜211上之配線膜212。 硬質積層板271A、272A、271B、272B之配線膜221， 連接於軟性配線板278之配線膜212，並固定於軟性配線 板278之兩端之表面與背面。 硬質積層板271A、272A、271B、272B，係比軟性配線 板278短形，一端之硬質積層板271A、272A與另一端之硬 質積層板271B、272B間，藉由軟性配線板278之中央部分 來連接。 並且，如第29圖所示，若將電子零件245裝載於硬質 積層板271A、272A、271B、272B，電子零件245則藉由配 200419637 線膜212、221互相連接。 將如上述之複合配線板201例如使用於攜帶型電腦時 ，若將位於複合配線板201之一端的硬質積層板271八、 272A配置於鍵盤側之框體内，將位於另一端之硬質積層板 271B、272B配置於液晶顯示面板側之框體内，則能使液晶 顯不面板開閉自如，並藉由軟性配線板278連接鍵盤與液 晶顯不面板。本發明之先行技術文獻有日本特開平 05-243738 號。 【發明内容】 然而，若軟性配線板278長，上述習知技術之複合配 線板201則處理不便，電子零件245之裝載作業之作業性 差。又’即便硬質積層板271A、272A、271B、272B中之任 一個係不良品，也必須將複合配線板2 〇 1全部報廢。 本發明係為了解決上述習知技術之問題而開發者，其 目的在於提供一種處理容易且低成本之複合配線板。 揭示 為了解決上述問題，本發明係一種基板片，其具有至 &gt; 一片軟性配線板、比軟性配線板短且互相積層而成之複 數片短形硬性配線板、及比短形硬性配線板長且互相積層 而成之複數片長形硬性配線板；且積層狀之該短形硬性配 線板’係配置於軟性配線板之一面，積層狀之該長形硬性 配線板’係配置於相反側之面，而使該軟性配線板之該一 面露出。 200419637 本發明中，該軟性配線板之前端部分，並未固定於該 長形硬性配線板。 本發明中，相鄰接之該硬性配線板之配線膜係藉由導 電性突起來連接。 本發明，係一種複合配線板，其具有連接用軟性配線 板、及2個以上之基板片，該各基板片，分別具有至少一 片軟性配線板、比該軟性配線板短且互相積層之複數個短 形硬性配線板、及比該短形硬性配線板長且互相積層之複 數個長形硬性配線板；且積層狀之該短形硬性配線板係配 置於該軟性配線板之一面，積層狀之該長形硬性配線板係 配置於相反側之面，而使該軟性配線板之該一面露出，該 各基板片之軟性配線板之露出部，係連接於連接用軟性配 線板之端部。 本發明之複合配線板，係於該連接用軟性配線板與該 基板片之軟性配線板之間貼有補強薄膜。 本發明，係一種複合配線板，具有第1基板片與第2 基板片’該第1基板片，係具有至少一片軟性配線板、比 該軟性配線板短且互相積層之複數片短形硬性配線板、及 比該短形硬性配線板長且互相積層之複數片長形硬性配線 板；且積層狀之該短形硬性配線板係配置於軟性配線板之 一面’積層狀之該長形硬性配線板係配置於相反側之面， 而使該軟性配線板之該一面露出；該第2基板片中，使至 少一片軟性配線板及複數片硬性配線板積層，該軟性配線 板之纟而部’超出軟性配線板與硬性配線板疊合之部分，而 200419637 使兩面露出，將該第1基板片之軟性配線板之露出部分、 與該第2基板片之軟性配線板之露出部分相連而構成複合 配線板。 本發明之複合配線板中，於該第1基板片之軟性配線 板之路出部分、與該第2基板片之軟性配線板之露出部分 之間貼有補強薄膜。 本發明之複合配線板中，在該基板片之至少1片上裝 載有電子零件。 本發明中，第1發明之基板片，係於硬性配線板或軟 性配線板之表面配置黏著薄膜等，並藉由加熱及加壓來互 相積層而構成。 積層時，於軟性配線板之一面積層比軟性配線板之長 度更短之1片或2片以上之短形硬性配線板積層，於相反 側之面，積層至少比短形硬性配線板更長之1片或2片以 上之長形硬性配線板。 並且，將軟性配線板之至少前端部分不預先固定於長 形硬性配線板，便獲得本發明之基板片。軟性配線板之靠 近短形硬性配線板的部分，可固定或不固定於長形硬性配 線板。 本發明之基板片係構成如上述，長形硬性配線板與軟 性配線板中，突出短形硬性配線板之部分形成為載台 (stage)部，當作於軟性配線板連接其他軟性配線板時之台 座0 構成載台部之軟性配線板之前端部分，能從硬性配線 200419637 板掀起’故構成載台部之軟性配線板、與連接於此之其他 軟f生配線板的兩者均彎曲，而緩和連接部分之應力 剝離。 勿 …本务明，係一種基板片，其具有具硬性配線板之第j 第2硬性部、及比第1、帛2硬性部更長之軟性配線板 ;該第1硬性部與該第2硬性部，係以雙方彼此超出之相 對位置關係來配置於軟性配線板之表面與背面；藉由該第 1第2硬f生邛夾住軟性配線板之中央部分，該軟性配線板 與該第卜S 2硬性部，係在軟性配線板之中央部分互相 固定，該軟性配線板，係超出第丨硬性部與第2硬性部。 本^明之基板片，該軟性配線板之超出第1、第2硬 性部側之部分中，至少一方係遠離第丨或第2硬性部。 本發明之基板片中，該軟性配線板，係具有可撓性之 底膜、及配置於底膜之兩面之圖案化配線膜。 本發明之基板片中，構成該第i、第2硬性部之硬性 配線板，係具有硬質板、及配置於硬質板之至少一面的圖 案化配線膜；該軟性配線板之配線膜、及與該軟性配線板 鄰接之硬性配線板，係藉由導電性突起作電氣連接。 本發明之基板片中，該第1、第2硬性部之至少一方 ，係將2片以上之硬性配線板積層而構成，積層狀之該硬 性配線板所具有之圖案化配線膜彼此，係藉由導電性突起 來連接。 本發明，係一種複合配線板，其具有至少具硬性配線 板之異種片、基板片、及連接用軟性配線板；該基板片， 200419637 係具有至少一片軟性配線板、比該軟性配線板短且互相積 層之複數片短形硬性配線板、及比短形硬性配線板長且互 相積層之複數片長形硬性配線板；且積層狀之該短形硬性 配線板係配置於軟性配線板之一面，積層狀之該長形硬性 配線板係配置於相反側之面，而使該軟性配線板之該一面 露出；該基板片之軟性配線板之前端部分，係黏著於該連 接用軟性配線板之一端，該連接用軟性配線板之另一端黏 著於異種片，該基板片之軟性配線板之配線膜、與該異種 片所具有之配線膜之間，係藉由連接用軟性配線板所具有 B 之配線膜作電氣連接。 本發明之複合配線板，係該連接用軟性配線板與該基 板片之軟性配線板之間貼有補強薄膜。 本發明之複合配線板中，在該基板片上裝載有電子零 件。 本I明中，第2發明之基板片係構成如上述，該基板 片中权性配線板之端部，並未連接於構成硬性部之硬性 配線板，形成為能掀起軟性配線板之端部。因此，若在該馨 2配，板之端部連接其他軟性配線板，則兩軟性配線板 Γ I專曲故在軟性配線板彼此之連接部分不會產生不 必要之應力。 曰 【實施方式】 (1)第1發明 10 200419637 用圖式說明本發明中第1發明之複合配線板及作為其 零件之基板片。 第2圖之符號2，係表示本發明之基板片之一例，第i 圖，係表示基板片2之組裝前狀態的構成零件。 基板片2，具有1至複數片軟性配線板1 〇、配置於該 軟性配線板10之一面且比軟性配線板1 〇短之複數片硬性 配線板20^203、及配置於相反側之面且比短形硬性配線板 20^203長之複數片硬性配線板30^303。 在此，短形硬性配線板20^203彼此係相同形狀，相 同長度’長形硬性配線板30^303彼此亦係互相相同形狀 ，相同長度。 說明軟性配線板10與硬性配線板20^203、30广303之 構成如下，軟性配線板10，係具有樹脂薄膜製成之底膜^ 、及設置於底膜11之表面與背面的配線膜12。配線膜i 2 係將金屬薄膜圖案化成既定形狀而構成。 位於表面側與背面側之配線膜12，係藉由配置於通孔 内之導電性插塞14來連接。導電性插塞14，能由金屬或 導電性樹脂構成。 又’各硬性配線板20^203、30^303，分別具有底基板 21ι〜213、31〗〜313與配線膜22r 223、32丨〜323。 配線膜22l〜223、32r323配置於底基板21r213、 31! 313之一面，在積層前之狀態，在相反側之面，有連接 於配線膜22r223、32丨〜323之導電性突起24^243、34丨〜343 之如J而犬出。導電性突起24丨〜243、34丨〜343能將導電性樹 200419637 脂（導電性樹脂糊）硬化形成，或能使金屬成長來形成。 短形硬性配線板20^2()3係配置於軟性配線板10之一 面，長形硬性配線板30^303，係配置於相反側之面。 各硬性配線板20^203、30^303之導電性突起24^243 、34丨〜343之前端側係以朝向軟性配線板1 〇側之狀態積層 ，導電性突起24^243、34】〜343之前端抵接於配線膜12、 22丨、222、32丨〜322’藉此’將硬性配線板20^20^ 30^303 之配線膜22^223 '32^323彼此、及硬性配線板20^3(^ 之配線膜22!、321與軟性配線板1〇之配線膜12之間作電 氣連接。 軟性配線板10與硬性配線板20^2(^、30^3()2之配線 膜12、22丨〜223、32i〜323，係分成互相分離之複數條，且該 等既定位置上之條狀膜彼此連接著。 又’在硬性配線板20^203、30^303彼此之間、及硬 性配線板20!、30!與軟性配線板1 〇之間配置有黏著薄膜 ，硬性配線板20^203、30^303與軟性配線板10之互相之 間，藉由該黏著薄膜，至少有一部分或全部互相作機械性 連接。 軟性配線板10與長形硬性配線板3()ι〜3〇3，係從短形 硬性配線板20^203之側面沿橫方向突出，藉由突出之部 分構成載台部42。 並且，長形硬性配線板30^303、軟性配線板1〇之載 台部42以外的部分、及短形硬性配線板20^203，構成基 板片本體。 12 200419637 若將載台部42之從基板片本體4i突出 ^ 〈方向的長度 以付號h表示，將其相同方向之基板片本體 ^的長度以 付唬L2表示，為了提高作業性，將載台部 —、 &lt;長度L!設 疋成比基板片本體41的長度l2為短（L丨&lt;L2)。 軟性配線板10在基板片本體41之部分，藉由黏著薄 膜等固定於與該部分鄰接之硬性配線板2〇 &quot; 4 L 1 川1，軟性配 、水板10在載台部42之部分，至少前端部分，則未固定於 硬性配線板3(^，能自由地掀起。 、200419637 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to the technical field of wiring boards, and particularly to a substrate sheet composed of a rigid wiring board and a flexible wiring board, and a composite wiring board using the same. [Prior art] Symbol 201 in FIG. 28 is a composite wiring board of the conventional technology. Fig. 30 is an exploded view showing the structure of the composite wiring board 201. Symbols 271A, 272A, 271B, and 272B represent hard laminated boards, and symbols 2 7 and 8 represent single-layer or laminated flexible wiring boards. The hard laminated boards 271A, 272A, 271B, and 272B are formed by laminating a single-layer hard wiring board. The flexible wiring board 278 includes a resin-based flexible base film 211 and a wiring film 212 disposed on the base film 211. The wiring film 221 of the hard laminated board 271A, 272A, 271B, 272B is connected to the wiring film 212 of the flexible wiring board 278, and is fixed to the surface and the back of both ends of the flexible wiring board 278. The hard laminated boards 271A, 272A, 271B, and 272B are shorter than the flexible wiring board 278. Between the hard laminated boards 271A and 272A at one end and the hard laminated boards 271B and 272B at the other end, the central portion of the flexible wiring board 278 is used. connection. In addition, as shown in FIG. 29, when the electronic components 245 are mounted on the hard laminated boards 271A, 272A, 271B, and 272B, the electronic components 245 are connected to each other by the 200419637 wire films 212 and 221. When the composite wiring board 201 as described above is used in a portable computer, for example, if a hard laminated board 271 and 272A located at one end of the composite wiring board 201 is disposed in a frame on the keyboard side, a hard laminated board located at the other end will be used. The 271B and 272B are arranged in the frame of the liquid crystal display panel side, so that the liquid crystal display panel can be opened and closed freely, and the keyboard and the liquid crystal display panel are connected through a flexible wiring board 278. The prior art document of the present invention is Japanese Patent Application Laid-Open No. 05-243738. [Summary of the Invention] However, if the flexible wiring board 278 is long, the composite wiring board 201 of the above-mentioned conventional technique is inconvenient to handle, and the workability of loading the electronic parts 245 is poor. Furthermore, even if any one of the hard laminated boards 271A, 272A, 271B, and 272B is a defective product, all the composite wiring boards 201 must be scrapped. The present invention has been developed to solve the problems of the conventional techniques described above, and an object thereof is to provide a composite wiring board which is easy to handle and low in cost. In order to solve the above-mentioned problems, it is disclosed that the present invention is a substrate sheet having: a flexible wiring board, a plurality of short rigid wiring boards shorter than the flexible wiring board and laminated on each other, and longer than the short rigid wiring board And a plurality of long rigid wiring boards which are laminated on each other; and the short rigid wiring boards which are laminated are arranged on one side of the flexible wiring board, and the long rigid wiring boards which are laminated are arranged on the opposite side , So that one side of the flexible wiring board is exposed. 200419637 In the present invention, the front end portion of the flexible wiring board is not fixed to the long rigid wiring board. In the present invention, the wiring films of the rigid wiring boards adjacent to each other are connected by conductive protrusions. The present invention relates to a composite wiring board having a flexible wiring board for connection and two or more substrate sheets. Each of the substrate sheets has at least one flexible wiring board, a plurality of layers shorter than the flexible wiring board, and stacked on each other. A short rigid wiring board and a plurality of long rigid wiring boards which are longer than the short rigid wiring board and are stacked on each other; and the short rigid wiring board in a laminated shape is arranged on one side of the flexible wiring board and is laminated. The elongated rigid wiring board is disposed on the opposite side, and the one side of the flexible wiring board is exposed. The exposed portion of the flexible wiring board of each substrate sheet is connected to the end of the flexible wiring board for connection. The composite wiring board of the present invention has a reinforcing film affixed between the flexible wiring board for connection and the flexible wiring board of the substrate sheet. The present invention relates to a composite wiring board having a first substrate sheet and a second substrate sheet. The first substrate sheet is a plurality of short rigid wirings having at least one flexible wiring board, which is shorter than the flexible wiring board and is laminated on each other. Board and a plurality of long rigid wiring boards which are longer than the short rigid wiring board and are laminated on each other; and the short rigid wiring board which is laminated is arranged on one side of the flexible wiring board and is a long rigid wiring board which is laminated. The flexible wiring board is arranged on the opposite side so that the flexible wiring board is exposed. In the second substrate sheet, at least one flexible wiring board and a plurality of rigid wiring boards are laminated. The portion where the flexible wiring board and the rigid wiring board overlap, and 200419637 exposes both sides, and the exposed portion of the flexible wiring board of the first substrate sheet and the exposed portion of the flexible wiring board of the second substrate sheet are connected to form a composite wiring. board. In the composite wiring board of the present invention, a reinforcing film is pasted between a path portion of the flexible wiring board of the first substrate sheet and an exposed portion of the flexible wiring board of the second substrate sheet. In the composite wiring board of the present invention, electronic parts are mounted on at least one of the substrate sheets. In the present invention, the substrate sheet of the first invention is configured by disposing an adhesive film or the like on the surface of a rigid wiring board or a flexible wiring board, and laminating them by heating and pressing. When laminating, laminate one or more short rigid wiring boards with an area shorter than the length of the flexible wiring board on one area of the flexible wiring board. On the opposite side, the stacking layer is at least longer than the short rigid wiring board. One or more long rigid wiring boards. In addition, at least the front end portion of the flexible wiring board is not fixed to the long rigid wiring board in advance, and the substrate sheet of the present invention is obtained. The portion of the flexible wiring board near the short rigid wiring board may be fixed or not fixed to the long rigid wiring board. The substrate sheet of the present invention is structured as described above. Among the long rigid wiring board and the flexible wiring board, a portion protruding from the short rigid wiring board is formed as a stage portion, and is used when the flexible wiring board is connected to other flexible wiring boards. The pedestal 0 constitutes the front end portion of the flexible wiring board constituting the stage portion, and can be lifted from the hard wiring 200419637 board. Therefore, both the flexible wiring board constituting the stage portion and other flexible wiring boards connected thereto are bent. And the stress peeling of the connection part is alleviated. Don't ... This matter is a substrate sheet, which has a j-th second rigid portion with a rigid wiring board, and a flexible wiring board longer than the first and second rigid portions; the first rigid portion and the second The rigid portion is disposed on the front and back of the flexible wiring board in a relative positional relationship where both sides exceed each other; the central portion of the flexible wiring board is sandwiched by the first and second hard fenders, and the flexible wiring board and the first Bu S 2 The rigid portions are fixed to each other at the central portion of the flexible wiring board, and the flexible wiring boards extend beyond the first rigid portion and the second rigid portion. In the substrate sheet of the present invention, at least one of the portions of the flexible wiring board beyond the first and second rigid portions is far from the second or second rigid portions. In the substrate sheet of the present invention, the flexible wiring board is a flexible base film and patterned wiring films arranged on both sides of the base film. In the substrate sheet of the present invention, the rigid wiring board constituting the i and second rigid portions is a patterned wiring film having a rigid board and at least one side of the rigid board; the wiring film of the flexible wiring board, and The rigid wiring board adjacent to the flexible wiring board is electrically connected by a conductive protrusion. In the substrate sheet of the present invention, at least one of the first and second rigid portions is formed by laminating two or more rigid wiring boards, and the patterned wiring films included in the laminated rigid wiring board are borrowed from each other. They are connected by conductive bumps. The present invention relates to a composite wiring board having a dissimilar sheet having at least a rigid wiring board, a substrate sheet, and a flexible wiring board for connection; the substrate sheet, 200419637, has at least one flexible wiring board, shorter than the flexible wiring board and A plurality of short rigid wiring boards laminated on each other and a plurality of long rigid wiring boards longer than the short rigid wiring boards and stacked on each other; and the short rigid wiring boards laminated are arranged on one side of the flexible wiring board and are laminated. The elongated rigid wiring board is arranged on the opposite side, so that the side of the flexible wiring board is exposed; the front end portion of the flexible wiring board of the substrate sheet is adhered to one end of the flexible wiring board for connection, The other end of the flexible wiring board for connection is adhered to a heterogeneous sheet, and the wiring film of the flexible wiring board of the substrate sheet and the wiring film of the heterogeneous sheet are connected by the wiring of B having the flexible wiring board for connection. Membrane for electrical connection. The composite wiring board of the present invention has a reinforcing film affixed between the flexible wiring board for connection and the flexible wiring board of the base sheet. In the composite wiring board of the present invention, electronic components are mounted on the substrate sheet. In the present invention, the substrate sheet of the second invention is configured as described above. The end portion of the weighted wiring board in the substrate sheet is not connected to the rigid wiring board constituting the rigid portion, and is formed to lift the end portion of the flexible wiring board . Therefore, if other flexible wiring boards are connected to the end of the board, the two flexible wiring boards Γ I will not cause unnecessary stress on the connecting portions of the flexible wiring boards. [Embodiments] (1) First invention 10 200419637 The composite wiring board of the first invention of the present invention and a substrate sheet as a part thereof will be described with drawings. Reference numeral 2 in FIG. 2 shows an example of a substrate sheet according to the present invention, and FIG. I shows a component part showing a state before the assembly of the substrate sheet 2. The substrate sheet 2 includes 1 to a plurality of flexible wiring boards 10, a plurality of rigid wiring boards 20 ^ 203 arranged on one side of the flexible wiring board 10 and shorter than the flexible wiring board 10, and a surface arranged on the opposite side and A plurality of rigid wiring boards 30 ^ 303 longer than the short rigid wiring board 20 ^ 203. Here, the short rigid wiring boards 20 ^ 203 have the same shape with each other, and the long rigid wiring boards 30 ^ 303 with the same length have the same shape and the same length with each other. The structure of the flexible wiring board 10 and the rigid wiring boards 20 ^ 203 and 30-303 is described below. The flexible wiring board 10 has a base film made of a resin film ^, and a wiring film 12 provided on the front and back surfaces of the base film 11. . The wiring film i 2 is formed by patterning a metal thin film into a predetermined shape. The wiring film 12 on the front side and the back side is connected by a conductive plug 14 disposed in the through hole. The conductive plug 14 can be made of a metal or a conductive resin. Each of the rigid wiring boards 20 ^ 203 and 30 ^ 303 has a base substrate 21 to 213 and 31 to 313 and a wiring film 22r to 223 and 32 to 323, respectively. The wiring films 22l ~ 223, 32r323 are arranged on one side of the base substrates 21r213, 31! 313. Before the lamination, there are conductive protrusions 24 ^ 243, connected to the wiring films 22r223, 32 丨 ~ 323 on the opposite side. 34 丨 ~ 343 are like J and dogs are out. The conductive protrusions 24 丨 ~ 243, 34 丨 ~ 343 can harden the conductive tree 200419637 grease (conductive resin paste), or can grow the metal to form. The short rigid wiring board 20 ^ 2 () 3 is arranged on one side of the flexible wiring board 10, and the long rigid wiring board 30 ^ 303 is arranged on the opposite side. The conductive protrusions 24 ^ 243, 34 ^ ~ 34 of each rigid wiring board 20 ^ 203, 30 ^ 303 are laminated in a state facing the flexible wiring board 10 side, and the conductive protrusions 24 ^ 243, 34] ~ 343 The front ends are in contact with the wiring films 12, 22 丨, 222, 32 丨 ~ 322 ', thereby' connecting the hard wiring boards 20 ^ 20 ^ 30 ^ 303 with the wiring films 22 ^ 223 '32 ^ 323 to each other, and the hard wiring board 20 ^ 3 (^ wiring films 22 !, 321 and electrical wiring film 12 of flexible wiring board 10 are electrically connected. Flexible wiring board 10 and rigid wiring board 20 ^ 2 (^, 30 ^ 3 () 2 wiring film 12, 22 丨 ~ 223, 32i ~ 323, which are divided into a plurality of strips separated from each other, and the strip-shaped films at these predetermined positions are connected to each other. And 'between the rigid wiring boards 20 ^ 203, 30 ^ 303, An adhesive film is arranged between the rigid wiring boards 20 !, 30! And the flexible wiring board 10, and the rigid wiring boards 20 ^ 203, 30 ^ 303, and the flexible wiring board 10 are mutually connected, and at least the adhesive film has at least Some or all of them are mechanically connected to each other. The flexible wiring board 10 and the long rigid wiring board 3 () to 3〇3 are transversely from the side of the short rigid wiring board 20 ^ 203. The protruding portion constitutes the stage portion 42 by the protruding portion. In addition, portions other than the stage portion 42 of the long rigid wiring board 30 ^ 303, the flexible wiring board 10, and the short rigid wiring board 20 ^ 203 constitute a substrate. 12 200419637 If the stage portion 42 is protruded from the substrate sheet body 4i ^ <the length in the direction is indicated by a sign h, and the length of the substrate sheet body ^ in the same direction is indicated by a bluff L2, in order to improve workability Set the stage part—, &lt; length L! To be shorter than the length l2 of the substrate sheet body 41 (L 丨 &lt; L2). The flexible wiring board 10 is located on the substrate sheet body 41 by an adhesive film, etc. It is fixed to the rigid wiring board 20 adjacent to this part. 4 &quot; L1, Chuan 1. The part of the flexible distribution and water board 10 on the stage portion 42, at least the front end, is not fixed to the rigid wiring board 3 (^, can Set freely.

在軟性配線板1 〇在載台部4 2的部分之夺面 部分以外，貼有保護膜16。在此，係除了前端部二了卜τ 貼有保護膜16。 軟性配線板10之前端部分，未配置保護膜Μ，故露 出配線膜1 2、底膜11表面。 路 -第13a圖，係上述構造之基板片2之局部俯視圖，表 示基板片本體41之一部分、及載台部42。 其次，說明以基板片2為構成零件的複合配線板之製 程。 第3圖之符號2A與符號2B，分別係與上述基板片2 相同構造之基板片，此等2個基板片2Α、2β之軟性配線板 1 0，係在載台部42之前端位置露出配線膜丨2。 首先，在各基板片2A、2B之配線膜12的露出部分之 表面載置異方導電性薄膜17。至少該露出部分之背面位置 之底膜11，係未固定於與背面鄰接之硬性配線板3〇ι。 第4圖之符號8，係獨立於上述軟性配線板丨〇外之連 13 200419637 接用軟性配線板。該連接用軟性配線板8 1 牡低膜51之 至少一面配置有配線膜52，又，除兩端部 1刀 在配線膜52 之表面配置有保護膜56。配線膜52之兩端部分則露出。 第13b圖，係連接用軟性配線板8之_端部的俯視圖 ，該連接用軟性配線板8之配線膜52,圖案化成具有與載 台部42上之配線膜12之圖案對應的形狀及位置。 將該配線膜52之露出部分，抵在基板片、2β之異 方導電性薄膜17上並加熱、緊壓，如第5圖所示，基板片 2Α、2Β與連接用軟性配線板8便作電氣及機械性連接，而 獲得複合配線板71。 藉此’將連接用軟性配線板8之配線膜5 2與基板片 2Α、2Β之軟性配線板1 〇之配線膜1 2之間作電氣連接，將 一方之基板片2Α之配線膜12、22i〜223、32l〜323與另一方 之基板片2Β之配線膜12、22^22^32^323,透過連接用 軟性配線板8之配線膜52互相連接。 當要將連接用軟性配線板8緊壓於載台部42上時，使 位於載台部4 2之表面之軟性配線板1 〇，密合於硬性配線 板.3(^，並將該軟性配線板1 〇緊壓於積層之硬性配線板 30ι〜3〇3。藉此，緊壓時，位於載台部42之軟性配線板1〇 則不動，使連接可撓配線膜12、52間時不會產生錯誤。 在該複合配線板71 ’基板片2 A、2 B之軟性配線板1 〇 與連接用軟性配線板8具有可撓性，故能邊維持基板片2A 、2B之軟性配線板10之配線膜12與硬性配線板20!、30i 之配線膜22丨、32丨間之連接、及軟性配線板8、1 〇之配線 14 200419637 膜12、52間的電氣連接，邊彎曲連接用軟性配線板8。 當連接用軟性配線板8彎曲時，各基板片2A、2B之軟 性配線板10之載台部42上之前端部分亦一起彎曲，故能 使軟性配線板10、8間、軟性配線板丨〇與硬性配線板2 〇 1 、3 0〗間所產生之應力緩和。 其次，將配線膜12、52彼此作電氣連接後，如圖6所 不，於位於載台部42之軟性配線板丨〇之前端部分、與連 接用軟性配線板8之前端部分之間貼上補強薄膜丨8，軟性 配線板8、10彼此便藉由補強薄膜18牢固地作機械性連接 其結果，即使大大地彎曲連接用軟性配線板 干人Ί王 配線板8、1 0間也不會分離 於連接用軟性配線板8之背面、與長形硬性配線板 3(^303之間不貼上補強薄膜，使軟性配線板1()在載台部 42之部分的至少前端部分遠離硬性配線板。 藉此，軟性配線板1 0 $ #立 之知σ卩亦、考曲，使軟性配線板8 、10間更不易剝離。 其次，如第7圖所示，yjt , 在各基板片2A、2B上配置電子 零件49，將電子零件49夕山 之^子連接於最外層之硬性配線 板203、303之配線膜22?、32，+工帝从^ 3心3，电子零件49則裝載於基板 片 2Α 、 2Β 〇 在該狀態，電子零彳丰4 Q ^ 卞，件49,係藉由基板片2Α、2Β之配 線膜12、22广223、32 斗、耸 丨犯3或導電性突起24广243、34丨〜343 寺，連接於連接用軟性配綠此〇 配線板8之配線膜52，或使電子零 15 200419637 件4 9彼此互相連接。 又’若藉由連接用軟性配線板8所連接的基板片 之-方連接於電源或其他電子迴路等，各電子零件仏 則連接於電源等其他電子迴路。 又，上述軟性配線板〗〇、8之麵U、5I或保護膜 56，係1〇〜數十之聚醯亞胺薄臈。 、A protective film 16 is affixed to the flexible wiring board 10 except for the surface-covered portion of the stage portion 42. Here, a protective film 16 is attached to the front end except the front end. The front end portion of the flexible wiring board 10 is not provided with the protective film M, so the surface of the wiring film 1 2 and the bottom film 11 is exposed. Road-FIG. 13a is a partial plan view of the substrate sheet 2 having the above structure, and shows a part of the substrate sheet body 41 and the stage part 42. Next, a process of a composite wiring board using the substrate sheet 2 as a component will be described. Symbols 2A and 2B in FIG. 3 are substrate pieces having the same structure as the substrate piece 2 described above, and the flexible wiring boards 10 of the two substrate pieces 2A and 2β are exposed at the front end of the stage portion 42.膜 丨 2. First, an anisotropic conductive film 17 is placed on the surface of the exposed portion of the wiring film 12 of each of the substrate sheets 2A and 2B. The base film 11 at least on the rear surface position of the exposed portion is not fixed to the rigid wiring board 300m adjacent to the rear surface. Symbol 8 in FIG. 4 is a connection independent of the above flexible wiring board. 13 200419637 The flexible wiring board is used. A wiring film 52 is arranged on at least one side of the flexible wiring board 8 1 for the connection film 51, and a protective film 56 is arranged on the surface of the wiring film 52 except for both ends. Both ends of the wiring film 52 are exposed. FIG. 13b is a plan view of the _end portion of the flexible wiring board 8 for connection. The wiring film 52 of the flexible wiring board 8 for connection is patterned to have a shape and position corresponding to the pattern of the wiring film 12 on the stage portion 42. . The exposed portion of the wiring film 52 is pressed against the substrate sheet and the 2β anisotropic conductive film 17 and heated and pressed. As shown in FIG. 5, the substrate sheets 2A, 2B and the flexible wiring board 8 for connection are used. Electrically and mechanically, a composite wiring board 71 is obtained. Thereby, the wiring film 52 of the flexible wiring board 8 for connection and the wiring film 12 of the flexible wiring board 10 of the substrate sheets 2A and 2B are electrically connected, and the wiring films 12 and 22i of one of the substrate sheets 2A are electrically connected. 223, 321, 323 and the wiring films 12, 22 ^ 22 ^ 32 ^ 323 of the other substrate sheet 2B are connected to each other through the wiring film 52 of the flexible wiring board 8 for connection. When the flexible wiring board 8 for connection is to be pressed tightly on the stage portion 42, the flexible wiring board 1 〇 located on the surface of the stage portion 42 is closely adhered to the rigid wiring board .3 (^, and the softness The wiring board 10 is pressed tightly against the laminated rigid wiring board 30m ~ 303. Thus, when pressed, the flexible wiring board 10 located on the stage portion 42 is not moved, and when the flexible wiring films 12 and 52 are connected, No error occurs. The flexible wiring board 1 ′ of the composite wiring board 71 ′, the substrate sheets 2 A, 2 B and the flexible wiring board 8 for connection are flexible, so that the flexible wiring boards of the substrate sheets 2A, 2B can be maintained. Wiring film 12 of 10 and rigid wiring board 20 !, 30i wiring film 22 丨, 32 丨 and flexible wiring board 8, 10 wiring 14 200419637 Electrical connection between film 12, 52, for bending connection Flexible wiring board 8. When the flexible wiring board 8 for connection is bent, the front end portion of the stage portion 42 of the flexible wiring board 10 of each substrate sheet 2A, 2B is also bent together, so that the flexible wiring boards 10, 8 and The stress generated between the flexible wiring board 丨 〇 and the rigid wiring board 〇1, 30 is reduced. After the films 12 and 52 are electrically connected to each other, as shown in FIG. 6, a reinforcing film is pasted between the front end portion of the flexible wiring board at the stage portion 42 and the front end portion of the flexible wiring board 8 for connection. 8 As a result, the flexible wiring boards 8 and 10 are mechanically connected to each other by the reinforcing film 18, and even if the flexible wiring board for connection is greatly bent, the wiring board 8, 10 will not be separated from the connection. The back of the flexible wiring board 8 and the long rigid wiring board 3 (^ 303 are not covered with a reinforcing film, so that at least the front end portion of the flexible wiring board 1 () on the stage portion 42 is kept away from the rigid wiring board. The flexible wiring board 1 0 $ # 立 之 知 σ 卩 也 ， 考 曲 makes the flexible wiring boards 8 and 10 more difficult to peel off. Secondly, as shown in FIG. 7, yjt is arranged on each substrate piece 2A, 2B. Electronic parts 49, the electronic parts 49 are connected to the outermost rigid wiring boards 203, 303 and the wiring films 22 ?, 32, + Gongdi from 3 to 3, and the electronic parts 49 are mounted on the substrate 2A ， 2Β 〇 In this state, the electronic zero 彳 彳 4 Q ^ 卞, 49, is through the substrate sheet 2 Wiring films 12, 22, 223, 32, and 3 or conductive protrusions 24, 243, 34, and 343 of Α and 2B are connected to the flexible wiring green 52 for connection. Wiring film 52 of wiring board 8, Or electronic zero 15 200419637 pieces 4 9 are connected to each other. Also, if one side of the substrate sheet connected by the flexible wiring board 8 for connection is connected to a power source or other electronic circuit, etc., each electronic part is connected to a power source, etc. Other electronic circuits. The surfaces U and 5I of the flexible wiring board 8 and the protective film 56 are polyimide thin films of 10 to dozens. ,

“又’配如2、52、22〜叫，3,係將厚度〜 數？爪之銅箱圖案化成既定之形狀而構成，能與底膜H 保如6、56 一起彎曲’不會使軟性配線板"Also, such as 2, 52, 22 ~ called, 3, is the thickness ~ number? The copper box of the claw is patterned into a predetermined shape and can be bent with the base film H, such as 6, 56 ', without softness. Wiring board

之柔軟性受損。 U 21 = 一方面，硬性配線板2m3〇3之底基板 1 3、3V3l3，係玻璃環氧樹脂等組成、 :::薄板，並不具可換性。藉此，-旦裝载電子零件 :不對電子轉49之端子與配線膜223、323之間施加應 發明㈣之其他例。第8圖之符號3,係本 • 2例之基板片’與第1例之基板片2不同之處在於 :軟性配線板4。之保護膜46，係比載台部“之長度更長 二且，保護膜46之前端部分，不黏著於配線膜12、 -、’在该部分露出配線膜12之表面。 第9圖之符號3Α與符號3Β，係如上述構成之2個基 方二各基板片3Α、3Β之配線膜12露出之部分配置異 、$㈣Π ’貼上連接用軟性配線板8。再者，將保護 16 200419637 膜46之剝離部分貼於連接用軟性配線板8，而獲得本發明 第2例之複合配線板72。 第9圖之符號3A與符號3B，分別係如上述構成之2 個基板片’在各基板片3 A、3B之配線膜12露出之部分配 置異方導電薄膜17，貼上連接用軟性配線板8。 並且’將保護膜4 6之前端部分貼於連接用軟性配線板 8 ’而構成本發明第2例之複合配線板72。 因此，在該複合配線板72，保護膜46之自底膜丨丨等 剝離的剝離部分是當作補強薄膜使用。又，在此，保護膜 46之剥離部分貼於連接用軟性配線板8之底膜5丨。剝離部 分相反側之端部，可在基板片本體41之端部結束，亦可延 伸至基板片本體41之内部。 又’在讀基板片3 ’載台部4 4之長度L丨，也比基板片 本體41之長度更短。 又，在上述基板片2、3，長形硬性配線板3〇1〜3%之 長度’係與軟性配線板1 〇之長度相等，或比它長，但是本 發明並不限定於此。 第1 0圖之符號4，係表示本發明第三例之基板片。該 基板片4，在軟性配線板1 〇背面配置與軟性配線板丨〇相 同長度之1或2以上之硬性配線板3 〇丨、3 〇 2，在位於此等 中之底面之硬性配線板3〇2之表面，配置與短形硬性配線 板20〗2〇3，相同長度之1或2以上之硬性配線板35广353 〇 10與長形 付號4 6 ’係表示載台部’是由軟性配線板 17 200419637 硬性配線板3 0〗、3 02中超出短形硬性配線板2 q 1〜2 〇 3、及配 置於底面之硬性配線板35^353之部分所構成，符號45， 係表示基板片本體，由硬性配線板20^2(^、3()ι、302、 35广353及軟性配線板10中載台部46以外之部分所構成。 在該基板片4，軟性配線板1〇之至少前端部分也未連 接於硬性配線板3 0!，能掀起。 第11圖之符號5，係與上述第卜第3例之基板片2〜4 不同種類之基板片，在該異種基板片5，軟性配線板6〇之 一端係分別固定於積層在其表面與背面之硬性配線板5丨、% 5 2，另一端，係突出硬性配線板51、5 2。 讜軟性配線板60，係將底膜61、配線膜、與保護 膜66積層而構成，在突出部分之前端露出配線膜62。 該圖符號2，係上述之本發明第丨例之基板片，在位 於載台部42之配線膜12貼有異方導電性薄膜。將異種基 板片5之配線膜62之露出部分緊壓於異方導電性薄膜^ 7 ，並加熱、緊壓，如第12圖所示，異種基板片5之軟性配 線板60之前端便貼於載台部42之軟性配線板1〇。軟性配讎 線板10、60之配線膜12、62間，係藉由異方導電性薄膜 17作電氣連接’如第12圖所示，而能獲得本發明第3例 之複合配線板7 3。 在該複合配線板73，若於位於載台部42之軟性配線 板10之前端部分、與連接用軟性配線板6〇之前端部分之 間貼上補強薄膜18，軟性配線板8、6〇彼此便也藉由補強 薄膜18牢固地作機械性連接。 18 200419637 如上述，本發明之基板片，亦能與異種基板片自由組 合，來構成複合配線板。只要使用本發明之基板片，該複 合配線板則包含於本發明内。 又，上述電子零件49，可在從基板片組裝成本發明之 複合配線板後裝載，亦可將電子零件裝載於基板片2、3後 ，將連接用軟性配線板及其他基板片等連接，來組裝複合 配線板。 又’構成用於連接之上述軟性配線板8、及載台部42 、44之軟性配線板1 〇、係單層，但亦可將複數片軟性 配線板積層來構成。 (2)第2發明 使用圖式說明本發明中第2發明之複合配線板、及作 為其零件之基板片。 苐15圖之符號2，係表示本發明之基板片之一例，第 14圖’係將該基板片2之組裝前之狀態依構成零件別表示 〇 又，第1 7圖之符號1 〇2，係表示與本發明之基板片2 不同構造的異種片。該異種片i 〇2及後述之異種片係與本 發明之基板片組合使用，來構成複合配線板。第16圖，係 將該異種片102之組裝前之狀態依構成零件別表示。 參照弟14圖〜弟17圖’本發明之基板片2、及與該基 板片2 —起使用之異種片！ 〇2，係分別具有1至複數片軟 性配線板1 〇、11 〇、，配置於該軟性配線板1 〇、i丨0表面 之複數片硬性配線板20^203、120^ 1203、及配置於相反側 19 200419637 之面的複數片硬性配線板30^303、130^13(^。 配置於軟性配線板1 〇、1 1 0之表面側之硬性配線板 2〇ι〜2〇3、120^12()35分別形成互相相同之形狀、相同之長 度，又，配置於相反側之面之硬性配線板 3 〇丨〜3 0 3、 130^ 1 303 ’亦分別形成互相相同之形狀、相同之長度。 表面側之硬性配線板20^20^ 120^ 1 203彼此、及相 反側之面之硬性配線板30^303、130^ 1 303彼此，分別以 互相不超出之方式，使兩端排齊而積層。 第15圖、第17圖之符號20、120，係將表面側之石更 性配線板20^203、120^1 203分別積層而成之第1硬性部 ’該圖符號3 0、13 0，係將配置於相反側之面之硬性配線 板30^30^ 130〗〜1303分別積層而成之第2硬性部。 說明硬性配線板 20^2(^、30^3(^、120^12(^、 130^ 1 303之構成，各硬性配線板20^203、30^303、 120^ 1 203、130^ 1 303，係具有底基板 21,〜213、31 r313、 121^1213、131,〜1313、與配線膜 22^223、32^323、 122^122^132432^ 配線膜 22!〜223、32r323、122r 1 223、132^ 1 323，係 配置於底基板21丨〜213、31丨〜313、121丨〜1213、131r1313之 一面，在積層前之狀態，底面連接於各配線膜2 2丨〜2 2 3、 32广323、122^ 1 223、132!〜1 323 的導電性突起 24!〜243、 34丨〜343、124〗〜1 243、134^ 1 343之前端，係分別貫穿底基板 21丨〜213、31^313、121丨〜1213、131^1313，而向相反側之面 突出。 20 200419637 導電性突起 24r243、34r343、124r 1 243、134〗〜134, i 〇 係能將導電性樹脂（導電性樹脂糊）硬化形成，或使金屬成 長來形成。 構成第1、第2硬性部20、30、120、130之各硬性配 線板 20^203、30^30^ 120^ 1203、130^1303 中，互相鄰 接之硬性配線板 20^203、30^303、120^ 1 203、130^130 之配線膜22丨〜223、32广323、122^1223、132丨〜1323、與導 電性犬起24丨〜243、34丨〜343、124广1243、134丨〜1343之前端 抵接，互相作電氣連接著。 g 又，在各硬性配線板20^203、30^303、120^ 1 203、 130^ 1 303之間配置有黏著劑，藉由該黏著劑黏著硬性配線 板 20^203、30广303、120^ 1 203、130^ 1 303 彼此，使其互 相固定。 其次，本發明之基板片2所具有之軟性配線板1〇，其 長度比各硬性配線板2〇1〜2〇3、3〇广3〇3之長度更長，表面 側之第1硬性部20，則配置於軟性配線板1〇之一端部， 相反側之面之第2硬性部3〇係配置於相反側之端部。藉此讎 ’軟性配線板10之兩端’分別露出相反側之面。 又，若將構成第1硬性部20之硬性配線板2〇广2〇31 片之長度、與構成相反側之面之第2硬性部Μ之硬性配線 板叫〜3031片之長度相加，則比軟性配線板^。之長度還 長。 藉此’第i硬性部2。與第2硬性部3〇,在軟性配線 反之中央部分疊合’軟性配線板10之中央部分被第1 21 200419637 、第2硬性部20、30夾住。 第圖之符號41，係表示基板片本體，是由積層體 20、30中之疊合部分、與軟性配線板丨〇中被積層體2〇、 30夾住之部分所構成，符號42丨、422，係表示載台部，是 由積層體20、30及軟性配線板1〇之超出基板片本體41之 部分所構成。 本發明基板片2之軟性配線板1 〇、及與基板片2 一起 使用之異種片102之軟性配線板11〇，分別具有樹脂薄膜 所組成之底膜11、U1、及配置於底膜11、111之表面及 ® 背面的配線膜12、112。配線膜12、112,係將銅猪等之金 屬薄膜圖案化成既定形狀而構成。 該圖案化，例如可將軟性配線板10、110之配線膜12 、112、以及各硬性配線板2〇1〜2〇3、3〇1~3〇3、12心〜、 130^ 1 303 之配線膜 22广223、32^323、122丨〜1 223、 1 3 2丨〜1 3 2 3分成複數條。 在底膜11、111形成有通孔，配線膜丨2、丨丨2之位於 底膜11、111表側之部分與位於背面側之部分，係藉由配讎 置於通孔内之導電性插I 14、i 14作電氣連接。導電性插 塞14、114，能以金屬或導電性樹脂構成。 在位於基板片本體41内之部分，露出於第丨、第2硬 性部2G、30表面之導電性突起24丨、％，抵接於軟性配線 板1 0之配線膜12，互相作電氣連接。 又，於基板片本體41之部分之軟性配線板丨〇與第】 、第2硬性部20、30之間配置黏著劑，來黏著軟性配線板 22 200419637 與第1、第2硬性部20、30。 另一方面，在載台部42〗、422，在軟性配線板1 〇與第 1、第2硬性部20、30之間，至少在軟性配線板1 〇之前端 側係未黏著，距軟性配線板1 〇之前端一定距離之部分，係 能從積層體20、30掀起。 因此，可將撓配線板10之能掀起的部分從第1、第2 硬性部20、30拉開。 至少，軟性配線板10在載台部42i、422的部分，黏貼 保護膜1 6於配線膜12之表面，配線膜12，除其局部的露 出部分外’其餘被保護膜16覆蓋。 其次’說明與本發明之基板片2 —起使用之異種片 1〇2，異種片1〇2中，配置於軟性配線板11〇 一面之硬性配 線板120^1 203 ’係比軟性配線板11〇之長度短形，配置於 其相反側之面之硬性配線板13〇1〜13〇3，係與軟性配線板 11 〇之長度相同程度之長形。 由短形硬性配線板1201〜1 203所構成之第丨硬性部120 係配置於軟性配線板i i 0之端部。藉此，軟性配線板⑴ 之另一端側，從其第i硬性部12〇突出。 硬性部130 由長形硬性配線板1301〜1 303所構成之第 ’其兩端係對齊軟性配線板丨丨0之兩端。 第17圖之符號141，係表示基板片本體，由長形硬性 配線板130中與短形硬性配線板12〇疊合之部分、短形硬 性配線板120、及軟性配線板n&quot;以第】、第2硬性部 12〇、130夹住之部分所構成。又，符號142，係表示載台 23 200419637 部’由長形積層體130、與軟性配線板丨丨〇中從基板片本 體141突出之部分所構成。 軟性配線板110在載台部142的部分之前端附近，配 線膜112之一部分露出，其他部分則配置有保護膜丨丨6， 並被該保護膜116所覆蓋。 在基板片本體141内之部分，軟性配線板丨丨〇與第^ 、第2硬性部12 0、13 0之間，係藉由黏著劑作機械性連接 〇 相對於此，軟性配線板110在載台部丨42的部分，至 少未將軟性配線板11 0之前端部分黏著於第2硬性部1 3〇 ，而能將軟性配線板11 0之前端從積層體i 3〇掀起。因此 ，能將軟性配線板110之前端，從第2硬性部13〇拉開。 第27a圖，係上述構造之基板片2或異種片1〇2之載 口部42!、42s、142之前端的俯視圖，亦表示基板片本體 41、141之一部分。在此，去除保護膜16、116之前端部 分，使複數個配線膜12、112之前端露出著。 其次，說明使用基板片2與異種片102之本發明之複 合配線板之一例的製程。 第18圖之符號l〇2A、及後述之符號1〇2B，係表示與 上述異種片1 0 2相同構造之異種片，符號8 a、及後述之符 號8B，係表示獨立之連接用軟性配線板，而不是基板片2 或異種片102A、102B之構成零件。 連接用軟性配線板8A(及8B)，係將底膜51、圖案化 配線膜52、及保護膜56積層而構成，藉由保護膜56之圖 24 200419637 ” 在連接用軟性配線板8A、8B之兩端部分露出配線膜 52 〇 第27b圖，係連接用軟性配線板8a(及後述之軟性配 線板8B)之端部的俯視圖。 /連接用車人性配線板8 A之端部，配置於基板片£之載 台部42l或異種片1〇以之載台部142上，並使連接用軟性 配線板8A之端部、與構成載台部％、142之一部分的軟 性配線板1 〇、11 〇之端部疊合。 連接用軟性配線板8A.所具有之配線膜52之複數個露 § 出部分，配置於與基板片2或異種片職之軟性配線板 ίο、11〇所具有之配㈣12、112的露出部分相對應的位 置。 首先，於基板片2在載台部42!、422的配線膜12之露 出部分之表面上、與異種片1〇2在載台部142的配線膜 112之露出部分之表面上，分別載置異方導電性薄膜17、 117。 ' 將連接用軟性配線板8Α之配線膜52露出部分、與在 ® 載台部42l、142之配線膜12、112之露出部分以疊合^式 定位，使連接用軟性配線板8Α密合於異方導電性薄膜丄7 、117上，並以載台部42l、142為台座進行加熱、緊壓， 則如第19 ^斤示’能將基板# 2與異種# 1〇2之配線膜 12、112,藉由連接用軟性配線板8Α&lt;配線膜52作電氣連 接。 其次，如第20圖所示’以與上述相同之步驟，將本發 25 200419637 明基板片2之剩餘的載台部42z、與其他異種片ι〇2β，藉 由其他連接用軟性配線板8B來連接，則能獲得本發明第j 例之複合配線板71。 該複合配線板71中，異種片1〇2A、1〇2B間，係藉由 連接用軟性配線板8A、8B與基板片2互相作電氣連接。 當要將連接用軟性配線板8Α、8β之端部緊壓於載台部 42】、422上時，在各載台部42ι、422上，使連接用軟性配 線板8A、8B之端部密合於載台部42ι、422上，並緊壓在其 上。因此，軟性配線板8A、8B之緊壓部分則不動，不會產 生錯誤連接。 基板片2之軟性配線板10、與連接用軟性配線板8A、 8B具有可撓性、彎曲性，故能邊維持軟性配線板1 〇、8A、 8B間之電氣連接，邊彎曲複合配線板71之軟性配線板 、8A、8B之部分。 此外，基板片2之軟性配線板1 〇之兩端部分、且至少 載置有異方導電性薄膜17之部分的軟性配線板1 〇，係未 黏著於第1、第2硬性部20、30，故能將軟性配線板1 〇之 夂而部掀起。 藉此，當連接用軟性配線板8A、8B彎曲時，作為基板 片2 —部分的軟性配線板1 〇之前端部分便能離開硬性配線 板2(^、30!，一起彎曲。因此，將連接用軟性配線板8A、 8B與軟性配線板1 〇連接之部分所產生的應力加以緩和。 在此，異種片102A、102B之軟性配線板11 〇在載台部 14 2之部分，亦未固定於位在背面之第2硬性部13 0，故能 26 200419637 與連接用軟性配線板8A、8B —起彎曲，將產生於軟性配線 板8A、8B、110之連接部分的應力緩和。 將基板片2與異種片102A、102B間藉由連接用軟性配 線板8A、8B作電氣連接後，如第21圖所示，於基板片2 之軟性配線板1 〇之前端部分、與連接用軟性配線板8A、 8B之前端部分之間黏著補強薄膜18。 同樣地，於異種片102A、102B之軟性配線板no、與 連接用軟性配線板8A、8B之間同樣黏著補強薄膜1 8。 在此，在軟性配線板1 〇、11 〇、8A、8B之保護膜1 6、 116、56上黏著補強薄膜18。 藉由補強薄膜18，將基板片2之軟性配線板1 〇與連 接用軟性配線板8A、8B之間、及異種片ι〇2Α、102B與連 接用軟性配線板8A、8B之間牢固地作機械性連接。 並且，軟性配線板10、11 〇、8A、8B間藉由補強薄膜 18連接之結果，即使是將連接用軟性配線板、8B大大 地彎曲之情形，基板片2或異種片1 〇2之軟性配線板1 〇、 11 0與連接用軟性配線板8A、8B之間仍不會剝離。 又，在連接用軟性配線板8A、8B與第1、第2硬性部 2〇、30、120、130之間不黏貼補強薄膜，以維持基板片2 或異種片1 0 2之軟性配線板1 〇、11 〇之前端部分能掀起之 狀態。 其次’如第22圖所示’若在基板片2或異種片1〇2A 、102B上配置電子零件49，將電子零件49之端子，連接 於構成第1、第2硬性部20、30、120、130之最外層的硬 200419637 性配線板之 2〇3、3〇3、12〇3、13〇3 之配線膜 223、323、122 、1 323，電子零件49便裝載於複合配線板71。 在此狀態’電子零件49能互相作電氣連接，而且當矣 板片2或異種片102A、102B連接於外部電路時，電子裳件 49亦能連接於該外部電路。 又，在上述軟性配線板1 〇、丨丨〇、8A、8B，底膜丨j、 111、 51與保護膜16、116、56，係10〜數十# m之聚醯亞 胺薄膜。 軟性配線板1 〇、11 〇、8A、8B之配線膜1 2、112、52、 及硬性配線板 20^20^ 30^30^ 120^120^ 130广 1303 之 配線膜 22^223、32丨〜323、122]〜1 223、132^ 1 323，係將厚 度10〜數十//m之銅箔圖案化成既定形狀而構成。 因此’軟性配線板1 〇、Η 〇、8A、8B之配線膜12、 112、 52，便與底膜11、111、51、保護膜16、116、56一 起幫曲，不破壞軟性配線板1 〇、u 〇、Μ、8Β之柔軟性。 另一方面，硬性配線板2〇ι〜2〇3、3〇ι〜3〇3、12〇1〜12〇3、 130^ 1 303 之底基板 21丨〜213、31r313、121广1213、 131!〜1313，係由玻璃環氧樹脂等構成、厚度約5〇〜5〇〇 # m 之板，不具可撓性。 因此’若將電子零件49裝載於基板片2或異種片 1 02A、1 02B上，即便是軟性配線板1 〇、μ、8B彎曲時也 不會對電子零件49之端子與基板片2或異種片102之間施 加應力。 其次’說明本發明基板片之其他例。第23圖之符號3 28 200419637 ’係本發明第2你丨之美；y .. 例I板片。作為該基板片3 —部分之軟 性配線板40所具有之保護膜4 乂 在矣針— 、 叉狀4b之則端，係未黏著於配線 膜12或底膜U ’若掀起保護膜46之端部則露出配線膜^ 之表面’且其他薄膜能插入保護膜46與配線膜Μ之間。Impaired softness. U 21 = On the one hand, the rigid wiring board 2m3 03 base substrate 1 3, 3V3l3, is made of glass epoxy resin, etc. ::: thin plate, is not interchangeable. As a result, once the electronic parts are loaded, another example of the invention should not be applied between the terminals of the electronic switch 49 and the wiring films 223 and 323. The symbol 3 in FIG. 8 is the substrate sheet 2 of this example. The difference from the substrate sheet 2 of the first example is that it is a flexible wiring board 4. The protective film 46 is longer than the length of the stage portion, and the front end portion of the protective film 46 is not adhered to the wiring film 12,-, 'the surface of the wiring film 12 is exposed at this portion. The symbol in FIG. 9 The 3A and the symbol 3B are arranged as described above, and the exposed portions of the wiring film 12 of the two base substrates 3A and 3B are arranged differently. Attach the flexible wiring board 8 for connection. Furthermore, it will protect 16 200419637 The peeled part of the film 46 is attached to the flexible wiring board 8 for connection, and a composite wiring board 72 according to the second example of the present invention is obtained. Symbols 3A and 3B in FIG. 9 are respectively two substrate pieces configured as described above. The exposed portions of the wiring films 12 of the substrate sheets 3 A and 3B are provided with an anisotropic conductive film 17 and attached to the flexible wiring board 8 for connection. Furthermore, the protective film 4 6 is affixed to the flexible wiring board 8 for connection. The composite wiring board 72 according to the second example of the present invention. Therefore, in the composite wiring board 72, the peeling part of the protective film 46 that is peeled off from the bottom film and the like is used as a reinforcing film. Here, the protective film 46 The peeled part is attached to the base film 5 of the flexible wiring board 8 for connection 丨The end portion on the opposite side of the peeling portion may end at the end portion of the substrate sheet body 41, or may extend to the inside of the substrate sheet body 41. Also, the length L of the stage portion 4 in the reading of the substrate sheet 3 is smaller than that of the substrate. The length of the sheet body 41 is shorter. In the above-mentioned substrate sheets 2, 3, the length of the long rigid wiring board 30.1 to 3% is equal to or longer than the length of the flexible wiring board 10, but The invention is not limited to this. The symbol 4 in FIG. 10 indicates the substrate sheet of the third example of the present invention. The substrate sheet 4 is arranged on the rear side of the flexible wiring board 1 〇 1 or the same length as the flexible wiring board 丨 0. 2 or more rigid wiring boards 3 〇, 3 〇2, on the surface of the rigid wiring board 302 located on the bottom of these, the same as the short rigid wiring board 20 〖203, the same length of 1 or 2 The above rigid wiring board 35 to 353 〇10 and the long sub-number 4 6 'Denotes the stage part' is made of flexible wiring board 17 200419637 Hard wiring board 3 0〗, 3 02 exceeds the short rigid wiring board 2 q 1 ～ 2 〇3, and the part of the rigid wiring board 35 ^ 353 arranged on the bottom surface, symbol 45, is The substrate sheet body is composed of a portion of the rigid wiring board 20 ^ 2 (^, 3 (), 302, 35, 353, and the flexible wiring board 10 other than the stage portion 46. In this substrate sheet 4, a flexible wiring board At least the front end portion of 10 is not connected to the rigid wiring board 3 0 !, and can be lifted. The symbol 5 in FIG. 11 is a different type of substrate sheet from the substrate sheets 2 to 4 of the third example described above. One end of the substrate sheet 5 and the flexible wiring board 60 are respectively fixed to the rigid wiring boards 5 1 and 5 2 laminated on the surface and the back thereof, and the other end thereof protrudes from the rigid wiring boards 51 and 52. The flexible wiring board 60 is formed by laminating a base film 61, a wiring film, and a protective film 66, and the wiring film 62 is exposed at the front end of the protruding portion. The reference numeral 2 in the figure is a substrate sheet according to the first example of the present invention described above, and an anisotropic conductive film is pasted on the wiring film 12 located on the stage portion 42. The exposed part of the wiring film 62 of the dissimilar substrate sheet 5 is pressed against the anisotropic conductive film ^ 7, and heated and pressed. As shown in FIG. 12, the front end of the flexible wiring board 60 of the dissimilar substrate sheet 5 is attached to The flexible wiring board 10 of the stage portion 42. Between the wiring films 12, 62 of the flexible wiring board 10, 60, the anisotropic conductive film 17 is used for electrical connection. As shown in FIG. 12, a composite wiring board 7 according to the third example of the present invention can be obtained. . On this composite wiring board 73, if a reinforcing film 18 is pasted between the front end portion of the flexible wiring board 10 located on the stage portion 42 and the front end portion of the flexible wiring board 60 for connection, the flexible wiring boards 8, 60 are mutually It is also firmly connected mechanically by the reinforcing film 18. 18 200419637 As mentioned above, the substrate sheet of the present invention can also be freely combined with different substrate sheets to form a composite wiring board. As long as the substrate sheet of the present invention is used, the composite wiring board is included in the present invention. In addition, the electronic component 49 may be mounted after assembling the composite wiring board of the present invention from the substrate sheet, or after mounting the electronic component on the substrate sheets 2 and 3, and connecting the flexible wiring board for connection and other substrate sheets to Assemble the composite wiring board. Furthermore, the flexible wiring board 8 for connection and the flexible wiring boards 10 of the stage sections 42 and 44 are configured as a single layer, but a plurality of flexible wiring boards may be laminated. (2) Second invention A composite wiring board according to a second invention of the present invention and a substrate sheet as a part thereof will be described using drawings.符号 Symbol 2 in FIG. 15 shows an example of the substrate sheet of the present invention, and FIG. 14 ′ shows the state before assembly of the substrate sheet 2 according to the component parts. Also, the symbol 1 in FIG. 17 is 〇2, This is a heterogeneous sheet having a structure different from that of the substrate sheet 2 of the present invention. The heterogeneous sheet i 02 and the heterogeneous sheet described later are used in combination with the substrate sheet of the present invention to constitute a composite wiring board. FIG. 16 shows the state before assembling the heterogeneous sheet 102 in terms of component parts. Refer to FIG. 14 to FIG. 17 for reference. The substrate sheet 2 of the present invention and a heterogeneous sheet used together with the substrate sheet 2! 〇2, each having 1 to a plurality of flexible wiring boards 1 〇, 11 〇, a plurality of rigid wiring boards 20 ^ 203, 120 ^ 1203 arranged on the surface of the flexible wiring board 1 〇, i 丨 0, and The plurality of rigid wiring boards 30 ^ 303, 130 ^ 13 (^ on the opposite side 19 200419637). The rigid wiring boards 2〇2 ~ 203, 120 ^ arranged on the surface side of the flexible wiring boards 1 0, 1 10. 12 () 35 are respectively formed with the same shape and the same length, and the rigid wiring boards 3 are arranged on the opposite sides 3 〇 丨 ~ 3 0 3, 130 ^ 1 303 ′ are also formed with the same shape and the same Length. The rigid wiring boards 20 ^ 20 ^ 120 ^ 1 203 on the front side and the rigid wiring boards 30 ^ 303 and 130 ^ 1 303 on the opposite side are aligned with each other so as not to exceed each other. The symbols 20 and 120 in Fig. 15 and Fig. 17 are the first rigid portions formed by laminating the stone-type flexible wiring boards 20 ^ 203 and 120 ^ 1 203 on the surface side, respectively. 13 0 is a second rigid portion formed by stacking rigid wiring boards 30 ^ 30 ^ 130 to 1303 on the opposite side. 20 ^ 2 (^, 30 ^ 3 (^, 120 ^ 12 (^, 130 ^ 1 303), each rigid wiring board 20 ^ 203, 30 ^ 303, 120 ^ 1 203, 130 ^ 1 303, It has a base substrate 21, ~ 213, 31 r313, 121 ^ 1213, 131, ~ 1313, and wiring film 22 ^ 223, 32 ^ 323, 122 ^ 122 ^ 132432 ^ wiring film 22! ~ 223, 32r323, 122r 1 223 , 132 ^ 1 323, are arranged on one side of the base substrate 21 丨 ~ 213, 31 丨 ~ 313, 121 丨 ~ 1213, 131r1313. Before the lamination, the bottom surface is connected to each wiring film 2 2 丨 ~ 2 2 3. 32 广 323, 122 ^ 1 223, 132! ~ 1 323 conductive protrusions 24! ~ 243, 34 丨 ~ 343, 124〗 ~ 1 243, 134 ^ 1 343 The front ends are respectively penetrated through the base substrate 21 丨 ~ 213 , 31 ^ 313, 121 丨 ~ 1213, 131 ^ 1313, and protrude to the opposite side. 20 200419637 Conductive protrusions 24r243, 34r343, 124r 1 243, 134〗 ～ 134, i 〇 system can conduct conductive resin (conductive Resin paste) is formed by hardening, or metal is grown. Each of the rigid wiring boards 20 ^ 203, 30 ^ 30 ^ 120 ^ 1203, 130 ^ 1303 constituting the first and second rigid portions 20, 30, 120, 130 , A rigid match next to each other 20 ^ 203, 30 ^ 303, 120 ^ 1 203, 130 ^ 130 wiring film 22 丨 ~ 223, 32, 323, 122 ^ 1223, 132 丨 ~ 1323, and 24 ~~ 243, 34 from conductive dogs The front ends of ~ 343, 124, 1243, and 134 丨 ~ 1343 are in contact with each other and are electrically connected to each other. g. An adhesive is disposed between each of the rigid wiring boards 20 ^ 203, 30 ^ 303, 120 ^ 1 203, and 130 ^ 1 303, and the rigid wiring boards 20 ^ 203, 30, 303, and 120 are adhered by the adhesive. ^ 1 203, 130 ^ 1 303 are fixed to each other. Next, the length of the flexible wiring board 10 included in the substrate sheet 2 of the present invention is longer than the length of each of the rigid wiring boards 201 to 203, 300 to 300, and the first rigid portion on the surface side. 20, it is arranged at one end portion of the flexible wiring board 10, and the second hard portion 30 at the opposite side surface is arranged at the opposite end portion. As a result, the two opposite ends of the flexible wiring board 10 are exposed. In addition, if the length of the rigid wiring board 20 to 2031 pieces constituting the first rigid portion 20 and the rigid wiring board of the second rigid portion M forming the opposite side are called to have a length of ~ 3031 pieces, Than flexible wiring board ^. Its length is still long. Thereby, the ith hard portion 2 is formed. It is overlapped with the second rigid portion 30 and the central portion of the flexible wiring is opposite. The central portion of the flexible wiring board 10 is sandwiched by the first rigid portions 20 and 30. The symbol 41 in the figure indicates the substrate sheet body, which is composed of the superimposed portion of the laminates 20 and 30 and the portion sandwiched by the laminates 20 and 30 of the flexible wiring board 丨 0, and the symbols 42 丨, Reference numeral 422 denotes a stage portion, which is composed of the laminated body 20, 30 and the portion of the flexible wiring board 10 beyond the substrate sheet body 41. The flexible wiring board 10 of the substrate sheet 2 of the present invention, and the flexible wiring board 11 of a different kind of sheet 102 used together with the substrate sheet 2 each have a base film 11, U1 composed of a resin film, and a base film 11, Wiring films 12, 112 on the surface of 111 and ® on the back. The wiring films 12, 112 are formed by patterning a metal thin film such as a copper pig into a predetermined shape. For this patterning, for example, the wiring films 12 and 112 of the flexible wiring boards 10 and 110 and each of the rigid wiring boards 2101 to 2303, 3101 to 3303, 12 cores, and 130 ^ 1 303 can be used. The wiring films 22, 223, 32, 323, 122, and 1 223, 1 3 2 and 1 to 3 2 3 are divided into a plurality of pieces. Through holes are formed in the base films 11, 111. The portions of the wiring films 丨 2, 丨 2 that are located on the front side of the base films 11, 111 and the portions that are located on the back side are made of conductive plugs placed in the through holes. I 14, i 14 are for electrical connection. The conductive plugs 14, 114 can be made of a metal or a conductive resin. In the portion inside the substrate sheet body 41, the conductive protrusions 24,% exposed on the surfaces of the second and second rigid portions 2G, 30 abut against the wiring film 12 of the flexible wiring board 10, and are electrically connected to each other. In addition, an adhesive is disposed between the flexible wiring board of the substrate sheet body 41 and the first and second rigid sections 20 and 30 to adhere the flexible wiring board 22 200419637 to the first and second rigid sections 20 and 30. . On the other hand, at the stage portions 42 and 422, between the flexible wiring board 10 and the first and second rigid sections 20 and 30, at least the front side of the flexible wiring board 10 is not adhered, and it is away from the flexible wiring. The part of the board 10 with a certain distance from the front end can be lifted from the laminated body 20, 30. Therefore, the liftable portions of the flexible wiring board 10 can be pulled away from the first and second rigid portions 20 and 30. At least the portions of the flexible wiring board 10 on the stage portions 42i and 422 are adhered with the protective film 16 on the surface of the wiring film 12, and the wiring film 12 is covered by the protective film 16 except for a part of the exposed portion '. Next, 'the heterogeneous sheet 102 which is used together with the substrate sheet 2 of the present invention will be described. Among the heterogeneous sheet 102, the rigid wiring board 120 ^ 1 203 arranged on the side of the flexible wiring board 110 will be compared with the flexible wiring board. The length of 110 is short, and the rigid wiring boards 1301 to 1303 arranged on the opposite side are long and the same length as the length of the flexible wiring board 110. The first rigid portion 120 composed of the short rigid wiring boards 1201 to 1 203 is arranged at the end of the flexible wiring board i i 0. Thereby, the other end side of the flexible wiring board ⑴ protrudes from the i-th rigid portion 120. The rigid portion 130 is composed of long rigid wiring boards 1301 to 1 303, and both ends thereof are aligned with both ends of the flexible wiring board 丨 丨 0. Reference numeral 141 in FIG. 17 indicates a substrate sheet body, which is composed of a portion of the long rigid wiring board 130 overlapping with the short rigid wiring board 120, the short rigid wiring board 120, and the flexible wiring board. The second rigid portion 12 and 130 sandwich the portion. Reference numeral 142 indicates that the stage 23 200419637 is composed of a long laminated body 130 and a portion protruding from the substrate sheet body 141 of the flexible wiring board 丨 丨 〇. The flexible wiring board 110 is near the front end of the portion of the stage portion 142, and one portion of the wiring film 112 is exposed, and the other portion is provided with a protective film 6 and is covered by the protective film 116. In the portion of the substrate sheet body 141, the flexible wiring board 丨 丨 〇 and the second and second rigid sections 120 and 130 are mechanically connected by an adhesive. In contrast, the flexible wiring board 110 is located at The portion of the stage portion 42 does not adhere at least the front end portion of the flexible wiring board 110 to the second rigid portion 130, but can lift the front end of the flexible wiring board 110 from the laminated body i30. Therefore, the front end of the flexible wiring board 110 can be pulled away from the second rigid portion 130. Fig. 27a is a plan view of the front ends of the port portions 42 !, 42s, and 142 of the substrate sheet 2 or the heterogeneous sheet 102 having the above structure, and also shows a part of the substrate sheet bodies 41 and 141. Here, the front end portions of the protective films 16, 116 are removed, and the front ends of the plurality of wiring films 12, 112 are exposed. Next, an example of the manufacturing process of the composite wiring board of the present invention using the substrate sheet 2 and the heterogeneous sheet 102 will be described. The symbol 102A in FIG. 18 and the symbol 102b described later refer to a heterogeneous chip having the same structure as the above-mentioned different chip 102, and the symbol 8a and the symbol 8B described later refer to independent flexible wiring for connection. It is not a component of the substrate sheet 2 or the heterogeneous sheets 102A, 102B. The flexible wiring board 8A (and 8B) for connection is formed by laminating the base film 51, the patterned wiring film 52, and the protective film 56. Figure 24 of the protective film 56 200419637 "is applied to the flexible wiring board 8A, 8B for connection Both ends of the wiring film 52 are exposed. Figure 27b is a plan view of an end portion of the flexible wiring board 8a for connection (and a flexible wiring board 8B described later). / The end portion of the human wiring board 8A for the connection is arranged at On the stage portion 142 of the substrate chip or the stage portion 142 of the heterogeneous chip 10, the end portion of the flexible wiring board 8A for connection and the flexible wiring board 1 constituting one of the stage portions 142, The ends of 11 〇 are overlapped. The flexible wiring board 8A for connection is provided with a plurality of exposed portions of the wiring film 52. The exposed portions are arranged on the flexible wiring board 2 with a substrate sheet 2 or a heterogeneous sheet. Positions corresponding to the exposed portions of the distribution plates 12, 112. First, on the surface of the exposed portion of the wiring film 12 of the substrate sheet 2 on the stage portions 42! And 422, and the wiring of the heterogeneous chip 102 on the stage portion 142 On the surface of the exposed portion of the film 112, anisotropic conductive films 17, 117 are placed, respectively. '' Position the exposed portion of the wiring film 52 of the connection flexible wiring board 8A and the exposed portions of the wiring films 12 and 112 on the ® stage portions 42l and 142 in a superimposed position, so that the connection flexible wiring board 8A is in close contact with The anisotropic conductive films 丄 7 and 117 are heated and pressed with the carrier parts 42l and 142 as the base. As shown in the 19th example, the wiring film 12 of the substrate # 2 and the heterogeneous # 1〇2 can be used. And 112, the electrical connection is made by the connection flexible wiring board 8A &lt; wiring film 52. Next, as shown in FIG. 20, the present stage 25 200419637 shows the remaining stage portion of the substrate sheet 2 in the same procedure as described above. 42z, and other heterogeneous chips ι〇2β, connected by other connection flexible wiring board 8B, the composite wiring board 71 of the jth example of the present invention can be obtained. In this composite wiring board 71, the heterogeneous wafers 102A, 1 〇2B is electrically connected to each other through the flexible wiring boards 8A, 8B for connection and the substrate sheet 2. When the ends of the flexible wiring boards 8A, 8β for connection are pressed against the stage parts 42] and 422, The end portions of the flexible wiring boards 8A and 8B for connection are closely adhered to the stage portions 42 on the stage portions 42m and 422. ι, 422, and pressed thereon. Therefore, the pressing portions of the flexible wiring boards 8A, 8B are not moved, and no erroneous connection will occur. The flexible wiring board 10 of the substrate sheet 2, and the flexible wiring board 8A for connection, 8B has flexibility and bendability, so it can bend the flexible wiring boards 71, 8A, and 8B of the composite wiring board 71 while maintaining the electrical connection between the flexible wiring boards 10, 8A, and 8B. In addition, the substrate sheet 2 Both ends of the flexible wiring board 1 〇 and the flexible wiring board 1 〇 at least the portion where the anisotropic conductive film 17 is placed are not adhered to the first and second rigid portions 20 and 30, so the flexible wiring can be made. The board 1 〇 夂 and the part lifted. Thereby, when the flexible wiring boards 8A and 8B for connection are bent, the front end portion of the flexible wiring board 10 which is a part of the substrate sheet 2 can be separated from the rigid wiring board 2 (^, 30!), And thus bent together. The stress generated at the portions where the flexible wiring boards 8A and 8B are connected to the flexible wiring board 10 is alleviated. Here, the flexible wiring board 11 of the heterogeneous chip 102A, 102B is not fixed to the stage portion 14 2. The second rigid portion 13 0 on the back side can be bent together with the flexible wiring boards 8A, 8B for connection 26 200419637 to reduce the stress generated at the connecting portions of the flexible wiring boards 8A, 8B, 110. Substrate sheet 2 After making electrical connection with the different kinds of sheets 102A and 102B through the flexible wiring boards 8A and 8B for connection, as shown in FIG. 21, the flexible wiring board 10 of the substrate sheet 2 and the flexible wiring board 8A for connection The reinforcing film 18 is adhered between the front ends of 8 and 8B. Similarly, the reinforcing film 18 is also adhered between the flexible wiring boards no of the different types of sheets 102A and 102B and the flexible wiring boards 8A and 8B for connection. Wiring board 1 〇, 11 〇, 8A, The protective film 1 of 6, 8, 116, and 56 is provided with a reinforcing film 18. The reinforcing film 18 is used to connect the flexible wiring board 10 of the substrate sheet 2 and the flexible wiring boards 8A and 8B for connection, and a heterogeneous sheet ι〇2Α. , 102B and the flexible wiring boards 8A, 8B are firmly mechanically connected. Furthermore, the flexible wiring boards 10, 110, 8A, and 8B are connected by the reinforcing film 18, even if the flexible wiring for connection is connected When the plates and 8B are greatly bent, the flexible wiring boards 10 and 110 of the substrate sheet 2 or the heterogeneous sheet 1 02 and the flexible wiring boards 8A and 8B for connection will not be peeled off. Also, the flexible wiring for connection Reinforcing films are not adhered between the boards 8A, 8B and the first and second rigid portions 20, 30, 120, and 130 to maintain the flexible wiring boards 1 0, 11 〇 at the front end of the substrate sheet 2 or the heterogeneous sheet 102. It can be lifted. Secondly, as shown in FIG. 22, if the electronic component 49 is arranged on the substrate sheet 2 or the heterogeneous sheets 102A and 102B, the terminals of the electronic component 49 are connected to the first and second rigid parts. 20, 30, 120, 130 outermost hard 200419637 nature of wiring board 203, 303, 12 3. For the wiring films 223, 323, 122, and 1 323 of 13〇3, the electronic parts 49 are mounted on the composite wiring board 71. In this state, the 'electronic parts 49 can be electrically connected to each other, and when the board 2 or a heterogeneous sheet When 102A and 102B are connected to an external circuit, the electronic clothing 49 can also be connected to the external circuit. In addition, in the flexible wiring board 1 0, 丨 丨 0, 8A, 8B, the base film 丨 j, 111, 51 and the protective film 16, 116, and 56 are polyimide films of 10 to several tens of meters. Flexible wiring board 1 〇, 11 〇, 8A, 8B wiring film 1 2, 112, 52, and rigid wiring board 20 ^ 20 ^ 30 ^ 30 ^ 120 ^ 120 ^ 130 wide 1303 wiring film 22 ^ 223, 32 丨~ 323, 122] ~ 1 223, 132 ^ 1 323, which are formed by patterning a copper foil having a thickness of 10 to several tens of meters per predetermined shape. Therefore, the wiring films 12, 112, 52 of the 'flexible wiring board 1 〇, 〇 〇, 8A, 8B will help with the base films 11, 111, 51, and the protective films 16, 116, 56 without damaging the flexible wiring board 1. 〇, u 〇, M, 8B softness. On the other hand, the rigid wiring boards 2 ～ 2 ～ 3, 3 ～ 3 ～ 3, 3, 121 ～ 12, 3, 130 ^ 1 303 are the base substrates 21 丨 ~ 213, 31r313, 121, 1213, 131 ! ~ 1313, which is a plate made of glass epoxy resin, etc., with a thickness of about 50 ～ 500 # m. It is not flexible. Therefore, if the electronic component 49 is mounted on the substrate sheet 2 or the heterogeneous sheet 1 02A, 1 02B, even if the flexible wiring board 10, μ, 8B is bent, the terminals of the electronic component 49 and the substrate sheet 2 or the heterogeneous sheet will not be bent. Stress is applied between the sheets 102. Next, another example of the substrate sheet of the present invention will be described. The symbol 3 28 200419637 in FIG. 23 is the beauty of the second aspect of the present invention; y .. Example I plate. The protective film 4 of the flexible wiring board 40 which is a part of the substrate sheet 3 is attached to the ends of the pin-shaped, fork-shaped 4b, and is not adhered to the wiring film 12 or the base film U. If the end of the protective film 46 is lifted The surface of the wiring film ^ is exposed and other thin films can be inserted between the protective film 46 and the wiring film M.

又，邊軟性配線板40所具有之保護膜46中，一方或 雙方之載台部42l、422上之保護膜46，係比第15圖之基 板片2之軟性配線板10戶斤具有之保護膜16更長，保護膜 46之前端部分從載台部42ι、42z突出。在此，係從一載台 部42!突出，而從另一載台部42〗未突出。 該基板片3之其他構成係與第i例之基板片2相同。 第24圖，係表示藉由連接用軟性配線板8A連接該基 板片3與異種片102A之狀態。連接時，將基板片3之保護 膜46掀起，將異方導電性薄膜17配置成配線膜12狀，在 異方導電性薄膜17與保護膜46之間插入連接用軟性配線 板8 A之端部，藉由異方導電性薄膜丨7，將連接用軟性配In addition, among the protective films 46 included in the side flexible wiring board 40, the protective films 46 on the stage portions 42l and 422 of one or both sides are more protective than that of the flexible wiring board 10 of the substrate sheet 2 shown in FIG. 15 The film 16 is longer, and the front end portion of the protective film 46 protrudes from the stage portions 42m and 42z. Here, the part protrudes from one stage part 42! And does not protrude from the other stage part 42. The other components of the substrate sheet 3 are the same as those of the substrate sheet 2 of the i-th example. Fig. 24 shows a state in which the substrate sheet 3 and the heterogeneous sheet 102A are connected by a flexible wiring board 8A for connection. When connecting, lift up the protective film 46 of the substrate sheet 3, arrange the anisotropic conductive film 17 into the shape of the wiring film 12, and insert the end of the flexible wiring board 8A for connection between the anisotropic conductive film 17 and the protective film 46. Part, with an anisotropic conductive film, 7

線板8A之配線膜52作電氣連接於軟性配線板丨〇之配線膜 12。 保遵膜4 6之從底膜11突出之部分，配置於連接用軟 性配線板8A上’藉由黏著劑黏著於連接用軟性配線板8A 之底膜51。藉此，不是藉由補強薄膜而是藉由保護膜46， 來將基板片3之軟性配線板1 〇與連接用軟性配線板8a作 機械性連接。 又’保遵膜4 6之基板片本體41側之端部，可伸展至 基板片本體41之内部，亦可在載台部42}與基板片本體41 29 200419637 之父界處終止。 在載台部42〗相反側之載台部422，以與上述第i例相 同之γ驟藉由連接用軟性配線板連接於未圖示之異種片 ’而獲得本發明第2例之複合配線板72。 亚且，若將電子零件配置於第2例之複合配線板72之 基板片2或異種片102Α等，將電子零件之端子連接於最外 層之硬性配線板2〇3、3〇3、12〇3、13〇3之配線膜223、323、 122s、132s，電子零件便裝載於複合配線板72。 若以該狀態將基板片2或異種片ι〇2Α連接於外部電路 · ’所裝載之電子零件便連接於外部電路。 又，上述複合配線板72中，雖僅有一載台部42ι之保 濩膜4 6係從配線膜12與底膜11分離之構造，但是如上述 之保護膜46，亦可配置於雙方之載台部42ι、42?。在該情 形，能將保護膜46之雙方或一方形成為從載台部42ι、422 突出之長度。 在上述各實施例，異種片102雖具有軟性配線板11 〇 ，但本發明之複合配線板亦可使用未具有軟性配線板之異 響 種片，將該異種片與基板片以連接用軟性配線板Μ(或8B) 連接。 又’將具有上述軟性配線板11 〇之異種片1 02與未具 有車人性配線板之異種片、及本發明之基板片2加以組合而 成的複合配線板亦包含在本發明内。 再者，在連接用軟性配線板8A、8B構成異種基板片之 一部分之情形亦能構成本發明之複合配線板。 30 200419637 第25圖之符號103，係使用於該情形之異種片之例， 该異種片103具有長形軟性配線板160、與第1、第2積層 體 151 、 152 。 第1、第2積層體151、152，係將比軟性配線板1 6〇 短之硬性配線板積層1個或2個以上而構成，第1、第2 積層體151、152，配置於軟性配線板160之相同側之端部 之表側與裏側，積層體151、152與軟性配線板160係藉由 黏著劑互相固定。 因軟性配線板1比積層體151、152長，故軟性配線 板160從積層體151、152之間突出。該圖之符號153，係 表示該突出之部分。 軟性配線板160，係將底膜161、圖案化配線膜162、 及保護膜166積層而構成，在超出部分153之前端，保護 月吴1 66係有一部分被除去，而露出配線膜162之表面。 並且’如第26圖所示，將異方導電性薄膜I?載置於 本發明基板片2之一載台部42〗側之軟性配線板1 〇之前端 ，並將上述異種片103之軟性配線板16〇之前端黏著於異 方導電性薄膜17。 若在另一載台部42g透過連接用薄膜8B連接異種片 1 02B等，異種片1〇3之長形軟性配線板16〇便當作連接用 軟性配線板產生作用，而獲得本發明第3例之複合配線板 73 〇 於異種片10 3之軟性配線板16 〇之前端之底膜1 61與 基板片2之軟性配線板1〇之保護膜16之間亦可黏貼補強 31 200419637 薄膜1 8。 又，亦可使用2個軟性配線板1 6 〇 —部分從積層體 151、152之間超出的異種片1〇3,並於本發明基板片2之 2處載台部42i、422之雙方分別連接超出部分153，而能將 本發明之基板片2與其他異種片一起組合來構成本發明之 複合配線板。 又，a亥複合配線板73，亦能於各基板片2或異種片 103上裝載電子零件。 如以上所說明，本發明之基板片2，能與異種片自由藝 組合來構成複合配線板。只要是使用本發明之基板片，該 複合配線板便包含於本發明内。能構成本發明之複合配線 板的”種彳具有軟性配線板，，亦可不具有軟性配線板 亦可不具軟性配線板而僅以硬性配線板構成。 又，上述電子零件49，可在從基板片組裝本發明之複 合配線板後才裝載，亦可將電子零件裝載於基板片2後， 與連接用軟性配線板8A、8B或異種片1〇2、1〇3之軟性配 線板110、160連接，來組裝複合配線板。 · 又，使用於上述連接之上述軟性配線板8Α、8β、或基 板片在載台部42!、42z之軟性配線板丨〇，雖係單層，但亦 可將複數片軟性配線板積層來構成。異種片1 〇 2、1 〇 3内之 軟性配線板110、160，亦同樣可將複數片軟性配線板積層 而構成。 直之利用可能柹 本發明之基板片，在使用時能從基板片或異種片組裝 32 200419637 成複合配線板，故比複合配線板更容易保存、處理。 【圖式簡單說明】 (一）圖式部分 第1圖係用以說明第1發明一例的基板片組裝前之狀 態的圖。 第2圖係第1發明一例的基板片。The wiring film 52 of the wire plate 8A is electrically connected to the wiring film 12 of the flexible wiring board. The portion of the compliance film 46 protruding from the base film 11 is disposed on the connection flexible wiring board 8A 'and is adhered to the bottom film 51 of the connection flexible wiring board 8A by an adhesive. Thereby, the flexible wiring board 10 of the substrate sheet 3 and the flexible wiring board 8a for connection are mechanically connected not by the reinforcing film but by the protective film 46. Also, the end portion of the substrate sheet body 41 side of the "Bao Zun film 46" can be extended to the inside of the substrate sheet body 41, and can also be terminated at the parent section of the stage portion 42} and the substrate sheet body 41 29 200419637. The stage portion 422 on the opposite side of the stage portion 42 is connected to a non-illustrated heterogeneous piece through a flexible wiring board for connection at the same gamma step as the i-th example above to obtain the composite wiring of the second example of the present invention.板 72。 Board 72. In addition, if the electronic components are arranged on the substrate sheet 2 or the heterogeneous sheet 102A of the composite wiring board 72 of the second example, the terminals of the electronic components are connected to the outermost rigid wiring boards 203, 303, and 12. 3. For the wiring films 223, 323, 122s, and 132s of 13〇3, the electronic components are mounted on the composite wiring board 72. When the substrate sheet 2 or the heterogeneous sheet ι〇2A is connected to an external circuit in this state, the electronic components mounted thereon are connected to the external circuit. In addition, in the composite wiring board 72, although the protective film 4 6 having only one stage portion 42 is separated from the wiring film 12 and the base film 11, the protective film 46 may be disposed on both sides as described above. Taiwan Department 42ι, 42 ?. In this case, both or one of the protective films 46 can be formed so as to protrude from the stage portions 42m and 422. In each of the above embodiments, although the heterogeneous sheet 102 has a flexible wiring board 110, the composite wiring board of the present invention may also use an abnormal seed sheet that does not have a flexible wiring board, and the heterogeneous sheet and the substrate sheet may be connected for flexible wiring. Board M (or 8B) connection. Further, a composite wiring board in which a dissimilar sheet 102 having the above-mentioned flexible wiring board 110 and a dissimilar sheet having no human-made wiring board and the substrate sheet 2 of the present invention are combined is also included in the present invention. Furthermore, the composite wiring board of the present invention can also be constituted when the flexible wiring boards for connection 8A and 8B constitute a part of a different type of substrate sheet. 30 200419637 Symbol 103 in FIG. 25 is an example of a heterogeneous sheet used in this case. The heterogeneous sheet 103 includes an elongated flexible wiring board 160 and first and second laminated bodies 151 and 152. The first and second laminated bodies 151 and 152 are formed by laminating one or two or more rigid wiring boards shorter than the flexible wiring board 160. The first and second laminated bodies 151 and 152 are disposed on the flexible wiring. On the front and back sides of the ends of the same side of the board 160, the laminated bodies 151, 152 and the flexible wiring board 160 are fixed to each other by an adhesive. Since the flexible wiring board 1 is longer than the laminated bodies 151 and 152, the flexible wiring board 160 protrudes from between the laminated bodies 151 and 152. Reference numeral 153 in the figure indicates the protruding portion. The flexible wiring board 160 is formed by laminating a base film 161, a patterned wiring film 162, and a protective film 166. At the front end of the excess portion 153, a part of the protective Yue Wu 1 66 is removed to expose the surface of the wiring film 162. . Further, as shown in FIG. 26, an anisotropic conductive film I? Is placed on the front end of the flexible wiring board 10 on one side of the stage portion 42 of the substrate sheet 2 of the present invention, and the softness of the above-mentioned heterogeneous sheet 103 is The front end of the wiring board 160 is adhered to the anisotropic conductive film 17. If 42 g of different types of wafers, such as 102B, are connected to the other stage portion through the connection film 8B, the long flexible wiring board 160 of the heterogeneous chip 103 will function as a flexible wiring board for connection, and a third example of the present invention will be obtained. The composite wiring board 73 〇 on the flexible wiring board 16 of the heterogeneous sheet 10 3 〇 The reinforcing film 31 200419637 film 18 can also be adhered between the base film 1 61 on the front end and the protective film 16 of the flexible wiring board 10 of the substrate sheet 2. It is also possible to use two flexible wiring boards 160-part of the heterogeneous sheet 103 protruding from between the laminates 151 and 152, and separate the stage parts 42i and 422 at two places of the substrate sheet 2 of the present invention. The connecting excess portion 153 enables the substrate sheet 2 of the present invention to be combined with other heterogeneous sheets to form a composite wiring board of the present invention. In addition, the ahai composite wiring board 73 can also mount electronic components on each of the substrate pieces 2 or different kinds of pieces 103. As described above, the substrate sheet 2 of the present invention can be combined with a heterogeneous sheet to form a composite wiring board. As long as the substrate sheet of the present invention is used, the composite wiring board is included in the present invention. The "type" capable of constituting the composite wiring board of the present invention may have a flexible wiring board, or may be composed of a rigid wiring board without a flexible wiring board or without a flexible wiring board. In addition, the electronic component 49 described above may be used in a slave substrate sheet. The composite wiring board of the present invention is assembled and loaded, and after the electronic components are mounted on the substrate sheet 2, it can be connected to the flexible wiring boards 8A, 8B for connection or the flexible wiring boards 110, 160 of the heterogeneous chips 10, 103. Assemble the composite wiring board. · Also, the flexible wiring boards 8A, 8β, or the flexible wiring boards with substrates at the stage sections 42! And 42z used for the above connection are single layers, but they can also be used. A plurality of flexible wiring boards are constructed by laminating. The flexible wiring boards 110 and 160 in the different kinds of wafers 10 and 10 can also be constructed by laminating a plurality of flexible wiring boards. Straight use may make the substrate sheet of the present invention, When in use, it can be assembled from a substrate sheet or a heterogeneous sheet to form a composite wiring board, which is easier to store and handle than a composite wiring board. [Simplified illustration of the drawing] (1) The first part of the drawing is used to explain the first hair A diagram showing a state of an example of a substrate sheet before assembly. Fig. 2 is a substrate sheet of an example of the first invention.

第3圖係用以說明第1發明一例的複合配線板之組裝 步驟的圖（1)。 第4圖係用以說明第1發明一例的複合配線板之組裝 步驟的圖（2)。 第5圖係用以說明第1發明一例的複合配線板之組裝 步驟的圖（3)。 第6圖係用以說明第1發明一例的複合配線板之組裝 步驟的圖（4)。Fig. 3 is a diagram (1) for explaining the assembling steps of the composite wiring board as an example of the first invention. Fig. 4 is a diagram (2) for explaining the assembling steps of the composite wiring board as an example of the first invention. Fig. 5 is a diagram (3) for explaining an assembly procedure of the composite wiring board according to an example of the first invention. Fig. 6 is a diagram (4) for explaining an assembly procedure of the composite wiring board as an example of the first invention.

第7圖係用以說明第1發明一例的複合配線板之組裝 步驟的圖（5)。 第8圖係第1發明第2例的基板片。 第9圖係使用該基板片的複合配線板。 第10圖係第1發明第3例的基板片。 第11圖係用以說明使用該基板片的複合配線板之組裝 步驟的圖（1)。 第12圖係用以說明使用該基板片的複合配線板之組裝 步驟的圖（2)。 33 200419637 第1 3a圖係第1發明之基板片本體之一部分與載台部 的俯視圖。 第13b圖係連接用軟性配線板之端部的俯視圖。 第14圖係用以說明第2發明一例的基板片之組裝前之 狀態的圖。 第15圖係第2發明一例的基板片。 第16圖係用以說明將異種片組裝前之狀態的圖。 第1 7圖係異種片之一例。Fig. 7 is a diagram (5) for explaining the assembling steps of the composite wiring board as an example of the first invention. Fig. 8 is a substrate sheet according to a second example of the first invention. Fig. 9 is a composite wiring board using this substrate sheet. Fig. 10 is a substrate sheet according to a third example of the first invention. Fig. 11 is a diagram (1) for explaining an assembling procedure of a composite wiring board using the substrate sheet. Fig. 12 is a diagram (2) for explaining an assembly procedure of a composite wiring board using the substrate sheet. 33 200419637 Figure 1 3a is a plan view of a portion of the substrate body and the stage portion of the first invention. Fig. 13b is a plan view of an end portion of the flexible wiring board for connection. Fig. 14 is a diagram for explaining a state before assembling a substrate sheet according to an example of the second invention. Fig. 15 is a substrate sheet as an example of the second invention. Fig. 16 is a diagram for explaining a state before assembling different kinds of sheets. Figure 17 is an example of a heterogeneous film.

第18圖係用以說明第2發明一例的複合配線板之組裝 步驟的圖（1)。 第1 9圖係用以說明第2發明一例的複合配線板之組裝 步驟的圖（2)。 第20圖係用以說明第2發明一例的複合配線板之組裝 步驟的圖（3 )。 第21圖係用以說明第2發明一例的複合配線板之組裝 步驟的圖（4)。Fig. 18 is a diagram (1) for explaining an assembly procedure of a composite wiring board as an example of the second invention. Fig. 19 is a diagram (2) for explaining the assembly steps of the composite wiring board according to an example of the second invention. Fig. 20 is a diagram (3) for explaining an assembly procedure of the composite wiring board according to an example of the second invention. Fig. 21 is a diagram (4) for explaining an assembly procedure of a composite wiring board as an example of the second invention.

第22圖係用以說明第2發明一例的複合配線板之組裝 步驟的圖（5 )。 第23圖係第2發明之其他例。 第24圖係使用該基板片之複合配線板之例。 第25圖係用以說明第2發明的複合配線板之其他例之 組裝步驟的圖（丨）。 第26圖係用以說明第2發明的複合配線板之其他例之 組裝步驟的圖（2)。 34 200419637 第27a圖係第2發明之基板片本體之一部分與載台部 的俯視圖。 第27b圖係連接用軟性配線板之端部的俯視圖。 第28圖係習知技術之複合配線板。 第29圖係裝載有電子零件之狀態的複合配線板。 第30圖係用以說明習知技術之複合配線板之構造的圖 〇 (二）元件代表符號 s 第1發明（第1圖〜第 13圖） 2〜4 基板片 8 連接用軟性配線板 10、40 軟性配線板 12 軟性配線板之配線膜 20r203 短形硬性配線板 22ι〜223、32广323 硬質基板之配線膜 24ι〜243、34广343 導電性突起 30r303 長形硬性配線板 41、45 基板片本體 42 、 44 、 46 載台部 49 電子零件 第2發明（第14圖〜第 27 圖）： 2 ^ 3 基板片 8A、8B 連接用軟性配線板 35 200419637 10、40、110、160 軟性配線板 20r203 ^ 30r303 ^ 120r 1 203 ^ 130r 1 303 硬性配線板 21r213 ' 31r313 ^ 121r1213 ^ 131r1313 底基板 22r223 ^ 32r32s ^ 122r 1 223 ^ 132r 1 323 配線膜 24r243 ' 34r34s ' 124r 1 243 ^ 134r 1 343 導電性突起 基板片本體 載台部 電子零件 異種片 41 ^ 141 42! 、 422 、 142 49 102A 、 102B 、 103Fig. 22 is a diagram (5) for explaining an assembly procedure of a composite wiring board according to an example of the second invention. Fig. 23 is another example of the second invention. Fig. 24 is an example of a composite wiring board using the substrate sheet. Fig. 25 is a diagram (丨) for explaining an assembly procedure of another example of the composite wiring board of the second invention. Fig. 26 is a diagram (2) for explaining an assembling procedure of another example of the composite wiring board of the second invention. 34 200419637 Figure 27a is a plan view of a portion of a substrate body and a stage portion of the second invention. Fig. 27b is a plan view of an end portion of a flexible wiring board for connection. Fig. 28 is a composite wiring board of the conventional technology. Fig. 29 is a composite wiring board in a state in which electronic components are mounted. Fig. 30 is a diagram for explaining the structure of a conventional composite wiring board. (2) The symbol s of the element. First invention (Fig. 1 to Fig. 13) 2 to 4 Substrate sheet 8 Flexible wiring board for connection 10 , 40 Flexible wiring board 12 Wiring film for flexible wiring board 20r203 Short rigid wiring board 22ι ~ 223, 32wide 323 Hard wiring film for hard substrate 24ι ~ 243, 34 wide 343 Conductive protrusion 30r303 Long rigid wiring board 41, 45 substrate Sheet body 42, 44 and 46 Stage part 49 Electronic component 2nd invention (Figures 14 to 27): 2 ^ 3 substrate sheet 8A, 8B flexible wiring board for connection 35 200419637 10, 40, 110, 160 flexible wiring Board 20r203 ^ 30r303 ^ 120r 1 203 ^ 130r 1 303 rigid wiring board 21r213 '31r313 ^ 121r1213 ^ 131r1313 base substrate 22r223 ^ 32r32s ^ 122r 1 223 ^ 132r 1 323 wiring film 24r243' 34r34s' 124r 1 243 ^ 134r Protruded substrate sheet body stage part electronic part heterogeneous sheet 41 ^ 141 42 !, 422, 142 49 102A, 102B, 103

3636

Claims (1)

200419637 拾、申請專利範圍： 1 · 一種基板片，係具有至少一片軟性配線板、比軟性 配線板短且互相積層而成之複數片短形硬性配線板、及比 短形硬性配線板長且互相積層而成之複數片長形硬性配線 板；且 積層狀之該短形硬性配線板，係配置於軟性配線板之 一面，積層狀之該長形硬性配線板，係配置於相反側之面 ，而使該軟性配線板之該一面露出。 2·如申請專利範圍第1項之基板片，其中，該軟性配 · 線板之前端部分，並未固定於該長形硬性配線板。 3 ·如申請專利範圍第1項之基板片，其中，相鄰接之 該硬性配線板之配線膜係藉由導電性突起來連接。 4 · 一種複合配線板，係具有連接用軟性配線板、及申 請專利範圍第1項之基板片2個以上；且 該各基板片之軟性配線板之露出部，係連接於連接用 軟性配線板之端部。 5.如申請專利範圍第4項之複合配線板，其中，該連 · 接用軟性配線板與該基板片之軟性配線板，兩者之間係貼 有補強薄膜。 6· —種複合配線板，係具有申請專利範圍第1項之第 1基板片、及第2基板片； 該第2基板片，係將至少一片軟性配線板、及複數片 硬性配線板積層而成之基板片；且軟性配線板之端部，超 出軟性配線板與硬性配線板疊合之部分，而使其兩面露出 37 200419637 將該第1基板片之軟性配線板之露出部分、與該第2 基板片之軟性配線板之露出部分相連而構成複合配線板。 7.如申請專利範圍第6項之複合配線板，其中，於該 第1基板片之軟性配線板之露出部分、與該第2基板片之 軟性配線板之露出部分之間，貼有補強薄膜。 8·如申請專利範圍第6項之複合配線板，其中，於該 基板片之至少1片上裝載有電子零件。 9· 一種基板片，係具有具硬性配線板之第J、第2硬 · 性部、及比第1、第2硬性部更長之軟性配線板； 該第1硬性部與該第2硬性部，係以雙方彼此超出之 相對位置關係來配置於軟性配線板之表面與背面； 藉由該第1、第2硬性部夹住軟性配線板之中央部分 ，該軟性配線板與該第丨、第2硬性部，係在軟性配線板 之中央部分互相固定； 該軟性配線板，係超出第1硬性部與第2硬性部。 10.如申請專利範圍第9項之基板片，其中，該軟性酉己響 線板之超出第1、第2硬性部側之部分中，至少一方係遠 離第1或第2硬性部。 ’' U·如申請專利範圍第9項之基板片，其中，該軟性配 線板，係具有可撓性之底膜、及配置於底膜之兩面之圖案 化配線膜。 以 12.如申請專利範圍第9項之基板片，其中，構成該第 1、第2硬性部之硬性配線板，係具有硬質板、及配置於硬 38 200419637 質板之至少一面的圖案化配線膜；該軟性配線板之配線膜 、及與該軟性配線板鄰接之硬性配線板，係藉由導電性突 起作電氣連接。 13·如申請專利範圍第9項之基板片，其中，該第玉、 第2硬性部之至少一方，係將2片以上之硬性配線板積層 而構成，積層狀之該硬性配線板所具有之圖案化配線膜彼 此，係藉由導電性突起來連接。 14. 一種複合配線板，係具有至少具硬性配線板之異種 片、申請專利範圍帛9項之基板片、及連接用軟性配線板 該基板片之軟性配線板之前端部分係黏著於連接用軟 生配線板之编，該連接用軟性配線板之另一端係黏著於 異種片； X基板片之車人性配線板之配線膜、與該異種片所具有 之配線膜之間，係藉由連接用軟性配線板所具有之配線膜 作電氣連接。 Λ 15 ·如申睛專利範圍第14項之複合配線板，其中，該 連接用軟性配線板與該基板片之軟性配線板之間，係貼有 補強薄膜。 16 ·如申睛專利範圍第14項之複合配線板，其中，在 該基板片上裝载電子零件。 拾壹、圖式： 如次頁 39200419637 Scope of patent application: 1 · A substrate sheet having at least one flexible wiring board, a plurality of short rigid wiring boards which are shorter than the flexible wiring board and laminated to each other, and longer than each other and shorter than the short rigid wiring board A plurality of long rigid wiring boards formed by lamination; and the short rigid wiring boards laminated are arranged on one side of the flexible wiring board, and the long rigid wiring boards laminated are arranged on the opposite side, and This side of the flexible wiring board is exposed. 2. The substrate sheet according to item 1 of the patent application scope, wherein the front end portion of the flexible wiring board is not fixed to the long rigid wiring board. 3. The substrate sheet according to item 1 of the scope of patent application, wherein the wiring films of the rigid wiring boards adjacent to each other are connected by conductive protrusions. 4 · A composite wiring board is provided with two or more flexible wiring boards for connection, and the substrate sheet of the first patent application scope; and the exposed part of the flexible wiring board of each substrate sheet is connected to the flexible wiring board for connection Of the end. 5. The composite wiring board according to item 4 of the scope of patent application, wherein the flexible wiring board for connection and the flexible wiring board of the substrate sheet are provided with a reinforcing film therebetween. 6. · A composite wiring board comprising a first substrate sheet and a second substrate sheet in the first scope of the patent application; the second substrate sheet is formed by laminating at least one flexible wiring board and a plurality of rigid wiring boards. And the end of the flexible wiring board exceeds the portion where the flexible wiring board and the rigid wiring board are overlapped, so that both sides thereof are exposed 37 200419637 the exposed portion of the flexible wiring board of the first substrate sheet and the first 2 The exposed portions of the flexible wiring boards of the substrate sheet are connected to form a composite wiring board. 7. The composite wiring board according to item 6 of the patent application scope, wherein a reinforcing film is pasted between the exposed portion of the flexible wiring board of the first substrate sheet and the exposed portion of the flexible wiring board of the second substrate sheet. . 8. The composite wiring board according to item 6 of the scope of patent application, wherein electronic components are mounted on at least one of the substrate sheets. 9. A substrate sheet comprising a J-th, a second hard-flexible portion having a rigid wiring board, and a flexible wiring board longer than the first and second hard-flexible portions; the first rigid portion and the second rigid portion Is arranged on the surface and the back of the flexible wiring board in a relative position relationship between the two sides beyond each other; the central part of the flexible wiring board is sandwiched by the first and second rigid parts, and the flexible wiring board and the first and second 2 The rigid portions are fixed to each other at the central portion of the flexible wiring board; the flexible wiring plates extend beyond the first rigid portion and the second rigid portion. 10. The substrate sheet according to item 9 of the scope of patent application, wherein at least one of the portions of the flexible self-adhesive wiring board beyond the side of the first and second rigid portions is far from the first or second rigid portion. 'U. The substrate sheet according to item 9 of the scope of patent application, wherein the flexible wiring board is a flexible base film and patterned wiring films arranged on both sides of the base film. 12. The substrate sheet according to item 9 of the scope of patent application, wherein the rigid wiring board constituting the first and second rigid sections is a patterned wiring having a rigid board and at least one side of a hard 38 200419637 hard board. Film; the wiring film of the flexible wiring board and the rigid wiring board adjacent to the flexible wiring board are electrically connected by conductive protrusions. 13. The substrate sheet according to item 9 of the scope of patent application, wherein at least one of the second jade and the second rigid portion is formed by laminating two or more rigid wiring boards, and the laminated wiring board has The patterned wiring films are connected by conductive bumps. 14. A composite wiring board comprising a heterogeneous sheet with at least a rigid wiring board, a substrate sheet with a scope of 9 patent applications, and a flexible wiring board for connection. The front end portion of the flexible wiring board of the substrate sheet is adhered to the connecting soft sheet. The other end of the flexible wiring board for connection is adhered to a different kind of sheet; the wiring film of the humanized wiring board of the X substrate sheet and the wiring film possessed by the different kind of sheet are used for connection The wiring film of the flexible wiring board is electrically connected. Λ 15 · The composite wiring board according to item 14 of the patent application, wherein a reinforcing film is pasted between the flexible wiring board for connection and the flexible wiring board of the substrate sheet. 16 · The composite wiring board according to item 14 of the patent application, wherein electronic components are mounted on the substrate sheet. Pick up, schema: as next page 39
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JP2004266236A (en) 2004-09-24
US20050243528A1 (en) 2005-11-03
CN1723747A (en) 2006-01-18
CN100594764C (en) 2010-03-17
TWI243396B (en) 2005-11-11
WO2004064469A1 (en) 2004-07-29

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