WO2008139612A1 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
WO2008139612A1
WO2008139612A1 PCT/JP2007/059888 JP2007059888W WO2008139612A1 WO 2008139612 A1 WO2008139612 A1 WO 2008139612A1 JP 2007059888 W JP2007059888 W JP 2007059888W WO 2008139612 A1 WO2008139612 A1 WO 2008139612A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
wiring board
manufacturing
same
wiring
Prior art date
Application number
PCT/JP2007/059888
Other languages
English (en)
French (fr)
Inventor
Michimasa Takahashi
Masakazu Aoyama
Original Assignee
Ibiden Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co., Ltd. filed Critical Ibiden Co., Ltd.
Priority to JP2009513945A priority Critical patent/JP5111499B2/ja
Priority to EP07743323A priority patent/EP2154939A4/en
Priority to PCT/JP2007/059888 priority patent/WO2008139612A1/ja
Priority to CN200780052979.5A priority patent/CN101675717B/zh
Priority to TW097125924A priority patent/TW201004497A/zh
Publication of WO2008139612A1 publication Critical patent/WO2008139612A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

　配線基板（１９）は、第１基板（１）と、第１基板（１）より実装面積が小さい第２基板（２）と、第１基板（１）と第２基板（２）との間に設けられているベース基板（３）と、を積層して構成される。配線基板（１９）は、第１基板（１）と第２基板（２）の少なくともいずれか一つに設けられたヴィア（４４）を有する。配線基板（１９）は、第１基板（１）と第２基板（２）との間に層間溝部（１１）を有し、層間溝部（１１）には、気体、液体及び固体の少なくともいずれか一つが充填されていることも可能である。
PCT/JP2007/059888 2007-05-14 2007-05-14 配線基板及びその製造方法 WO2008139612A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009513945A JP5111499B2 (ja) 2007-05-14 2007-05-14 配線基板
EP07743323A EP2154939A4 (en) 2007-05-14 2007-05-14 PCB AND METHOD FOR THE PRODUCTION THEREOF
PCT/JP2007/059888 WO2008139612A1 (ja) 2007-05-14 2007-05-14 配線基板及びその製造方法
CN200780052979.5A CN101675717B (zh) 2007-05-14 2007-05-14 布线基板及其制造方法
TW097125924A TW201004497A (en) 2007-05-14 2008-07-09 Wiring board and method of manufacturing wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/059888 WO2008139612A1 (ja) 2007-05-14 2007-05-14 配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
WO2008139612A1 true WO2008139612A1 (ja) 2008-11-20

Family

ID=40001842

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/059888 WO2008139612A1 (ja) 2007-05-14 2007-05-14 配線基板及びその製造方法

Country Status (5)

Country Link
EP (1) EP2154939A4 (ja)
JP (1) JP5111499B2 (ja)
CN (1) CN101675717B (ja)
TW (1) TW201004497A (ja)
WO (1) WO2008139612A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116235639A (zh) * 2020-09-28 2023-06-06 京瓷株式会社 布线基板

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152693A (ja) 1991-11-30 1993-06-18 Nitto Denko Corp 補強部付フレキシブルプリント基板およびその製法
JPH1174651A (ja) * 1997-03-13 1999-03-16 Ibiden Co Ltd プリント配線板及びその製造方法
JP2000013019A (ja) * 1998-06-23 2000-01-14 Sharp Corp ビルトアップ多層プリント配線板およびその製造方法
JP2002064271A (ja) * 2000-06-09 2002-02-28 Matsushita Electric Ind Co Ltd 複合配線基板及びその製造方法
JP2004349277A (ja) * 2003-04-28 2004-12-09 Nippon Carbide Ind Co Inc 多層配線基板及びその製造方法
JP2005079402A (ja) * 2003-09-01 2005-03-24 Fujikura Ltd 回路基板およびその製造方法
WO2005029934A1 (ja) 2003-09-19 2005-03-31 Fujitsu Limited プリント基板およびその製造方法
JP2005236205A (ja) * 2004-02-23 2005-09-02 Sharp Corp 多層プリント配線板の製造方法及び多層プリント配線板
JP2005268505A (ja) * 2004-03-18 2005-09-29 Fujikura Ltd 多層配線板およびその製造方法
JP2005336287A (ja) * 2004-05-26 2005-12-08 Matsushita Electric Works Ltd フレキシブルプリント配線板用熱硬化性接着シート、その製造方法及びそれを用いた多層フレキシブルプリント配線板並びにフレックスリジッドプリント配線板
JP2006114741A (ja) * 2004-10-15 2006-04-27 Ibiden Co Ltd 多層コア基板及びその製造方法
JP2006202891A (ja) * 2005-01-19 2006-08-03 Fujikura Ltd リジッドフレックスプリント配線板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0787225B2 (ja) * 1989-11-08 1995-09-20 富士通株式会社 半導体素子実装用基板
US6753483B2 (en) * 2000-06-14 2004-06-22 Matsushita Electric Industrial Co., Ltd. Printed circuit board and method of manufacturing the same
JP2004031682A (ja) * 2002-06-26 2004-01-29 Sony Corp プリント配線基板の製造方法
KR100467825B1 (ko) * 2002-12-12 2005-01-25 삼성전기주식회사 스택형 비아홀을 갖는 빌드업 인쇄회로기판 및 그 제조 방법
JP2004266236A (ja) * 2003-01-09 2004-09-24 Sony Chem Corp 基板素片とその基板素片を用いた複合配線板
JP2005045150A (ja) * 2003-07-25 2005-02-17 Matsushita Electric Ind Co Ltd 中間接続用配線基材および多層配線基板、ならびにこれらの製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152693A (ja) 1991-11-30 1993-06-18 Nitto Denko Corp 補強部付フレキシブルプリント基板およびその製法
JPH1174651A (ja) * 1997-03-13 1999-03-16 Ibiden Co Ltd プリント配線板及びその製造方法
JP2000013019A (ja) * 1998-06-23 2000-01-14 Sharp Corp ビルトアップ多層プリント配線板およびその製造方法
JP2002064271A (ja) * 2000-06-09 2002-02-28 Matsushita Electric Ind Co Ltd 複合配線基板及びその製造方法
JP2004349277A (ja) * 2003-04-28 2004-12-09 Nippon Carbide Ind Co Inc 多層配線基板及びその製造方法
JP2005079402A (ja) * 2003-09-01 2005-03-24 Fujikura Ltd 回路基板およびその製造方法
WO2005029934A1 (ja) 2003-09-19 2005-03-31 Fujitsu Limited プリント基板およびその製造方法
JP2005236205A (ja) * 2004-02-23 2005-09-02 Sharp Corp 多層プリント配線板の製造方法及び多層プリント配線板
JP2005268505A (ja) * 2004-03-18 2005-09-29 Fujikura Ltd 多層配線板およびその製造方法
JP2005336287A (ja) * 2004-05-26 2005-12-08 Matsushita Electric Works Ltd フレキシブルプリント配線板用熱硬化性接着シート、その製造方法及びそれを用いた多層フレキシブルプリント配線板並びにフレックスリジッドプリント配線板
JP2006114741A (ja) * 2004-10-15 2006-04-27 Ibiden Co Ltd 多層コア基板及びその製造方法
JP2006202891A (ja) * 2005-01-19 2006-08-03 Fujikura Ltd リジッドフレックスプリント配線板の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2154939A4 *

Also Published As

Publication number Publication date
CN101675717B (zh) 2012-12-19
EP2154939A1 (en) 2010-02-17
TW201004497A (en) 2010-01-16
JPWO2008139612A1 (ja) 2010-07-29
JP5111499B2 (ja) 2013-01-09
CN101675717A (zh) 2010-03-17
EP2154939A4 (en) 2013-02-20

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