WO2003088355A1 - Dispositif a semi-conducteur et son procede d'assemblage - Google Patents
Dispositif a semi-conducteur et son procede d'assemblage Download PDFInfo
- Publication number
- WO2003088355A1 WO2003088355A1 PCT/JP2003/004693 JP0304693W WO03088355A1 WO 2003088355 A1 WO2003088355 A1 WO 2003088355A1 JP 0304693 W JP0304693 W JP 0304693W WO 03088355 A1 WO03088355 A1 WO 03088355A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor element
- resin
- plate
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 246
- 238000000034 method Methods 0.000 title claims description 27
- 229920005989 resin Polymers 0.000 claims abstract description 92
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- 238000010008 shearing Methods 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 abstract description 11
- 239000000758 substrate Substances 0.000 description 29
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 238000005192 partition Methods 0.000 description 7
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- 238000005452 bending Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
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- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
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- 238000001312 dry etching Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
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- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/061—Disposition
- H01L2224/0612—Layout
- H01L2224/0613—Square or rectangular array
- H01L2224/06134—Square or rectangular array covering only portions of the surface to be connected
- H01L2224/06135—Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2924/01023—Vanadium [V]
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01039—Yttrium [Y]
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- H01L2924/01075—Rhenium [Re]
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- H01L2924/01082—Lead [Pb]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/959—Mechanical polishing of wafer
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03746477A EP1487014A4 (en) | 2002-04-17 | 2003-04-14 | SEMICONDUCTOR DEVICE AND ITS ASSEMBLY METHOD |
AU2003236251A AU2003236251A1 (en) | 2002-04-17 | 2003-04-14 | Semiconductor device and method for assembling the same |
US10/509,025 US7446423B2 (en) | 2002-04-17 | 2003-04-14 | Semiconductor device and method for assembling the same |
KR1020047016582A KR100593407B1 (ko) | 2002-04-17 | 2003-04-14 | 반도체 장치 및 반도체 장치의 조립 방법 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002114538A JP2003309216A (ja) | 2002-04-17 | 2002-04-17 | 半導体装置 |
JP2002-114538 | 2002-04-17 | ||
JP2002-114539 | 2002-04-17 | ||
JP2002114539A JP3826831B2 (ja) | 2002-04-17 | 2002-04-17 | 半導体装置の組立方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003088355A1 true WO2003088355A1 (fr) | 2003-10-23 |
Family
ID=29253571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/004693 WO2003088355A1 (fr) | 2002-04-17 | 2003-04-14 | Dispositif a semi-conducteur et son procede d'assemblage |
Country Status (7)
Country | Link |
---|---|
US (1) | US7446423B2 (ja) |
EP (1) | EP1487014A4 (ja) |
KR (1) | KR100593407B1 (ja) |
CN (1) | CN100409430C (ja) |
AU (1) | AU2003236251A1 (ja) |
TW (1) | TWI229396B (ja) |
WO (1) | WO2003088355A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009099838A (ja) * | 2007-10-18 | 2009-05-07 | Nec Electronics Corp | 半導体装置およびその製造方法 |
KR101287582B1 (ko) * | 2008-07-07 | 2013-07-19 | 삼성테크윈 주식회사 | 칩 마운터 및 칩 마운터의 bga 패키지 인식 방법 |
US8022538B2 (en) * | 2008-11-17 | 2011-09-20 | Stats Chippac Ltd. | Base package system for integrated circuit package stacking and method of manufacture thereof |
JP5152099B2 (ja) * | 2009-05-18 | 2013-02-27 | 富士通株式会社 | 基板構造 |
US8455991B2 (en) * | 2010-09-24 | 2013-06-04 | Stats Chippac Ltd. | Integrated circuit packaging system with warpage control and method of manufacture thereof |
US8746310B2 (en) * | 2011-05-31 | 2014-06-10 | The United States of America, as represented by the Secretary of Commerce, The National Instutute of Standards and Technology | System and method for probe-based high precision spatial orientation control and assembly of parts for microassembly using computer vision |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11126856A (ja) * | 1997-10-21 | 1999-05-11 | Nec Corp | 半導体装置の製造方法 |
JPH11251360A (ja) * | 1998-03-04 | 1999-09-17 | Toshiba Corp | 半導体装置およびその製造方法 |
US6064114A (en) * | 1997-12-01 | 2000-05-16 | Motorola, Inc. | Semiconductor device having a sub-chip-scale package structure and method for forming same |
JP2001203298A (ja) * | 2000-01-19 | 2001-07-27 | Hitachi Ltd | 半導体装置およびその製造方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5521128A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame used for semiconductor device and its assembling |
JPH02192195A (ja) | 1989-01-19 | 1990-07-27 | Sharp Corp | 複数の回路基板の接続構造 |
JPH0737768A (ja) * | 1992-11-26 | 1995-02-07 | Sumitomo Electric Ind Ltd | 半導体ウェハの補強方法及び補強された半導体ウェハ |
AU695669B2 (en) * | 1994-05-19 | 1998-08-20 | Canon Kabushiki Kaisha | Photovoltaic element, electrode structure thereof, and process for producing the same |
JPH0831872A (ja) | 1994-07-13 | 1996-02-02 | Hitachi Ltd | 半導体装置 |
US5844309A (en) * | 1995-03-20 | 1998-12-01 | Fujitsu Limited | Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition |
JP2828021B2 (ja) * | 1996-04-22 | 1998-11-25 | 日本電気株式会社 | ベアチップ実装構造及び製造方法 |
JPH10135386A (ja) | 1996-10-29 | 1998-05-22 | Taiyo Yuden Co Ltd | 半導体ベアチップの製造方法 |
JPH10242333A (ja) * | 1997-03-01 | 1998-09-11 | Nitto Denko Corp | 半導体装置及び半導体装置の製造方法 |
JPH10284634A (ja) | 1997-04-03 | 1998-10-23 | Matsushita Electron Corp | 半導体装置およびその製造方法 |
JP3889856B2 (ja) * | 1997-06-30 | 2007-03-07 | 松下電器産業株式会社 | 突起電極付きプリント配線基板の製造方法 |
JP3205536B2 (ja) * | 1998-03-19 | 2001-09-04 | 松下電器産業株式会社 | 液晶表示素子およびその製造方法 |
EP0990942A4 (en) * | 1998-03-19 | 2005-07-20 | Matsushita Electric Ind Co Ltd | Liquid crystal display and method for the production thereof |
US6175075B1 (en) * | 1998-04-21 | 2001-01-16 | Canon Kabushiki Kaisha | Solar cell module excelling in reliability |
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- 2003-04-14 US US10/509,025 patent/US7446423B2/en active Active
- 2003-04-14 CN CNB038084864A patent/CN100409430C/zh not_active Expired - Fee Related
- 2003-04-14 WO PCT/JP2003/004693 patent/WO2003088355A1/ja active IP Right Grant
- 2003-04-14 KR KR1020047016582A patent/KR100593407B1/ko not_active IP Right Cessation
- 2003-04-14 AU AU2003236251A patent/AU2003236251A1/en not_active Abandoned
- 2003-04-14 EP EP03746477A patent/EP1487014A4/en not_active Withdrawn
- 2003-04-15 TW TW092108718A patent/TWI229396B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
AU2003236251A1 (en) | 2003-10-27 |
CN1647266A (zh) | 2005-07-27 |
CN100409430C (zh) | 2008-08-06 |
US7446423B2 (en) | 2008-11-04 |
KR100593407B1 (ko) | 2006-06-28 |
TWI229396B (en) | 2005-03-11 |
US20050116323A1 (en) | 2005-06-02 |
EP1487014A1 (en) | 2004-12-15 |
TW200406854A (en) | 2004-05-01 |
EP1487014A4 (en) | 2009-12-16 |
KR20040105879A (ko) | 2004-12-16 |
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