WO2003078494A1 - Resines durcissables et compositions de resines durcissables les contenant - Google Patents
Resines durcissables et compositions de resines durcissables les contenant Download PDFInfo
- Publication number
- WO2003078494A1 WO2003078494A1 PCT/JP2003/002930 JP0302930W WO03078494A1 WO 2003078494 A1 WO2003078494 A1 WO 2003078494A1 JP 0302930 W JP0302930 W JP 0302930W WO 03078494 A1 WO03078494 A1 WO 03078494A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- curable resin
- group
- compound
- parts
- acid
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/20—Polyesters having been prepared in the presence of compounds having one reactive group or more than two reactive groups
- C08G63/21—Polyesters having been prepared in the presence of compounds having one reactive group or more than two reactive groups in the presence of unsaturated monocarboxylic acids or unsaturated monohydric alcohols or reactive derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/66—Polyesters containing oxygen in the form of ether groups
- C08G63/668—Polyesters containing oxygen in the form of ether groups derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/676—Polyesters containing oxygen in the form of ether groups derived from polycarboxylic acids and polyhydroxy compounds in which at least one of the two components contains aliphatic unsaturation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
- C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
- C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
- C08G65/2612—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aromatic or arylaliphatic hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/331—Polymers modified by chemical after-treatment with organic compounds containing oxygen
- C08G65/332—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/331—Polymers modified by chemical after-treatment with organic compounds containing oxygen
- C08G65/332—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof
- C08G65/3322—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof acyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/06—Unsaturated polyesters
- C08L67/07—Unsaturated polyesters having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/16—Photopolymerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Definitions
- a poly-p-hydroxystyrene resin (manufactured by Maruzen Petrochemical Co., Ltd., trade name "Maliki Linker M", OH equivalent) was added to a auto crepe equipped with a thermometer, nitrogen introduction device, alkylene oxide introduction device and stirring device. : 120) 120 parts, 1.2 parts of a hydrating agent and 120 parts of toluene were charged, the system was replaced with nitrogen while stirring, and the temperature was raised by heating. Next, 63.8 parts of propylene oxide was gradually added dropwise, and the mixture was reacted at 125 to 132 ° C and 0 to 4.8 kg / cm 2 for 16 hours.
- Adhesion According to the test method of JISD0202, crosscuts were put on the test substrate in a grid pattern, and then the peeling performance after the peeling test with a cellophane adhesive tape was evaluated according to the following criteria.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Emergency Medicine (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Materials For Photolithography (AREA)
- Epoxy Resins (AREA)
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003221361A AU2003221361A1 (en) | 2002-03-15 | 2003-03-12 | Curable resins and curable resin compositions containing the same |
EP03710324A EP1486521A4 (en) | 2002-03-15 | 2003-03-12 | CURABLE RESINS AND CURABLE RESIN COMPOSITIONS CONTAINING SAME |
KR1020047014441A KR100950124B1 (ko) | 2002-03-15 | 2003-03-12 | 경화성 수지 및 이것을 함유하는 경화성 수지 조성물 |
JP2003576491A JP4213043B2 (ja) | 2002-03-15 | 2003-03-12 | 硬化性樹脂及びそれを含有する硬化性樹脂組成物 |
US10/939,887 US20050054756A1 (en) | 2002-03-15 | 2004-09-14 | Curable resins and curable resin compositions containing the same |
HK06106618A HK1086582A1 (en) | 2002-03-15 | 2006-06-09 | Curable resins and curable resin compositions containing the same |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-72751 | 2002-03-15 | ||
JP2002072751 | 2002-03-15 | ||
JP2002-74684 | 2002-03-18 | ||
JP2002-74580 | 2002-03-18 | ||
JP2002074580 | 2002-03-18 | ||
JP2002074684 | 2002-03-18 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/939,887 Continuation US20050054756A1 (en) | 2002-03-15 | 2004-09-14 | Curable resins and curable resin compositions containing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003078494A1 true WO2003078494A1 (fr) | 2003-09-25 |
Family
ID=28046085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/002930 WO2003078494A1 (fr) | 2002-03-15 | 2003-03-12 | Resines durcissables et compositions de resines durcissables les contenant |
Country Status (8)
Country | Link |
---|---|
US (1) | US20050054756A1 (ja) |
EP (1) | EP1486521A4 (ja) |
JP (1) | JP4213043B2 (ja) |
KR (1) | KR100950124B1 (ja) |
AU (1) | AU2003221361A1 (ja) |
HK (1) | HK1086582A1 (ja) |
TW (1) | TW200400211A (ja) |
WO (1) | WO2003078494A1 (ja) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003280190A (ja) * | 2002-03-22 | 2003-10-02 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物 |
JP2008038131A (ja) * | 2006-07-10 | 2008-02-21 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物、及びその硬化物 |
JP2008233744A (ja) * | 2007-03-23 | 2008-10-02 | Taiyo Ink Mfg Ltd | 硬化性組成物及びその硬化物 |
WO2010052811A1 (ja) * | 2008-11-07 | 2010-05-14 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
JP2010113244A (ja) * | 2008-11-07 | 2010-05-20 | Taiyo Ink Mfg Ltd | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
CN1946795B (zh) * | 2003-11-21 | 2010-06-23 | 洛德公司 | 晶片用双阶段底部填充胶 |
WO2010113478A1 (ja) * | 2009-03-31 | 2010-10-07 | 太陽インキ製造株式会社 | 硬化性樹脂組成物およびプリント配線板 |
JP2010237576A (ja) * | 2009-03-31 | 2010-10-21 | Taiyo Ink Mfg Ltd | 硬化性樹脂組成物 |
JP2010266745A (ja) * | 2009-05-15 | 2010-11-25 | Taiyo Ink Mfg Ltd | 硬化性樹脂組成物 |
JP2011241300A (ja) * | 2010-05-18 | 2011-12-01 | Tamura Seisakusho Co Ltd | 硬化性樹脂組成物 |
JP4990765B2 (ja) * | 2005-05-31 | 2012-08-01 | 太陽ホールディングス株式会社 | 接着剤パターン形成用組成物、それを用いて得られる積層構造物及びその製造方法 |
JP2017206695A (ja) * | 2016-05-20 | 2017-11-24 | キヤノン株式会社 | ナノインプリントリソグラフィー密着層 |
WO2023021813A1 (ja) * | 2021-08-18 | 2023-02-23 | 三菱瓦斯化学株式会社 | 樹脂、樹脂の製造方法、硬化性樹脂組成物および硬化物 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1801142B1 (en) * | 2005-12-16 | 2016-02-24 | Canon Kabushiki Kaisha | Resin composition,resin cured product, and liquid discharge head |
KR100883047B1 (ko) * | 2006-07-10 | 2009-02-11 | 다이요 잉키 세이조 가부시키가이샤 | 광 경화성ㆍ열 경화성 수지 조성물, 그의 경화물 및 인쇄배선판 |
US20090321119A1 (en) * | 2008-06-30 | 2009-12-31 | Yasuhiro Kohara | Device mounting board, semiconductor module, mobile device, and manufacturing method of device mounting board |
KR101505199B1 (ko) * | 2008-12-23 | 2015-03-23 | 삼성전기주식회사 | 열경화성 올리고머 또는 폴리머, 이를 포함한 열경화성 수지 조성물, 및 이를 이용한 인쇄회로기판 |
KR101037984B1 (ko) * | 2009-02-27 | 2011-05-31 | 주식회사 동양잉크 | 내열성 및 내산성이 우수한 광경화성 및 열경화성 수지 조성물의 제조방법 및 그 수지 조성물의 경화물 |
KR20130022801A (ko) * | 2011-08-26 | 2013-03-07 | 코오롱인더스트리 주식회사 | 감광성 수지 조성물 |
KR20140032292A (ko) * | 2012-09-06 | 2014-03-14 | 삼성전기주식회사 | 방열기판용 수지조성물 및 이를 포함하는 방열기판 |
CN103923436A (zh) * | 2013-01-11 | 2014-07-16 | 广达电脑股份有限公司 | 有机蒙脱土增强环氧树脂及其制备方法 |
KR20190137544A (ko) | 2018-06-01 | 2019-12-11 | 권대현 | 전등 교체용 손잡이 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5811521A (ja) * | 1981-07-10 | 1983-01-22 | Cosmo Co Ltd | 光硬化性組成物 |
JPS61243869A (ja) * | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
JPS63117053A (ja) * | 1986-11-04 | 1988-05-21 | Hitachi Ltd | 積層板 |
JPH026517A (ja) * | 1988-06-24 | 1990-01-10 | Toagosei Chem Ind Co Ltd | ポリエステル(メタ)アクリレートの製造方法 |
JPH11288091A (ja) * | 1997-12-19 | 1999-10-19 | Taiyo Ink Mfg Ltd | アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜 |
WO2002024774A1 (fr) * | 2000-09-20 | 2002-03-28 | Taiyo Ink Manufacturing Co., Ltd. | Resine photosensible carboxylee, composition photodurcissable/thermodurcissable pouvant etre developpee par une solution alcaline et contenant cette resine, et article durci produit a partir de ces elements |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3277810B2 (ja) * | 1996-05-20 | 2002-04-22 | 住金ケミカル株式会社 | 速硬化性と耐熱性に優れたフェノール系樹脂とその製造方法 |
-
2003
- 2003-03-12 JP JP2003576491A patent/JP4213043B2/ja not_active Expired - Lifetime
- 2003-03-12 KR KR1020047014441A patent/KR100950124B1/ko active IP Right Grant
- 2003-03-12 AU AU2003221361A patent/AU2003221361A1/en not_active Abandoned
- 2003-03-12 EP EP03710324A patent/EP1486521A4/en not_active Withdrawn
- 2003-03-12 WO PCT/JP2003/002930 patent/WO2003078494A1/ja not_active Application Discontinuation
- 2003-03-14 TW TW092105689A patent/TW200400211A/zh unknown
-
2004
- 2004-09-14 US US10/939,887 patent/US20050054756A1/en not_active Abandoned
-
2006
- 2006-06-09 HK HK06106618A patent/HK1086582A1/xx not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5811521A (ja) * | 1981-07-10 | 1983-01-22 | Cosmo Co Ltd | 光硬化性組成物 |
JPS61243869A (ja) * | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
JPS63117053A (ja) * | 1986-11-04 | 1988-05-21 | Hitachi Ltd | 積層板 |
JPH026517A (ja) * | 1988-06-24 | 1990-01-10 | Toagosei Chem Ind Co Ltd | ポリエステル(メタ)アクリレートの製造方法 |
JPH11288091A (ja) * | 1997-12-19 | 1999-10-19 | Taiyo Ink Mfg Ltd | アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜 |
WO2002024774A1 (fr) * | 2000-09-20 | 2002-03-28 | Taiyo Ink Manufacturing Co., Ltd. | Resine photosensible carboxylee, composition photodurcissable/thermodurcissable pouvant etre developpee par une solution alcaline et contenant cette resine, et article durci produit a partir de ces elements |
Non-Patent Citations (1)
Title |
---|
See also references of EP1486521A4 * |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003280190A (ja) * | 2002-03-22 | 2003-10-02 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物 |
CN1946795B (zh) * | 2003-11-21 | 2010-06-23 | 洛德公司 | 晶片用双阶段底部填充胶 |
JP4990765B2 (ja) * | 2005-05-31 | 2012-08-01 | 太陽ホールディングス株式会社 | 接着剤パターン形成用組成物、それを用いて得られる積層構造物及びその製造方法 |
JP2008038131A (ja) * | 2006-07-10 | 2008-02-21 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物、及びその硬化物 |
JP2008233744A (ja) * | 2007-03-23 | 2008-10-02 | Taiyo Ink Mfg Ltd | 硬化性組成物及びその硬化物 |
CN102272677A (zh) * | 2008-11-07 | 2011-12-07 | 太阳控股株式会社 | 光固化性树脂组合物、其干膜及固化物以及使用它们的印刷电路板 |
WO2010052811A1 (ja) * | 2008-11-07 | 2010-05-14 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
JP2010113241A (ja) * | 2008-11-07 | 2010-05-20 | Taiyo Ink Mfg Ltd | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
JP2010113244A (ja) * | 2008-11-07 | 2010-05-20 | Taiyo Ink Mfg Ltd | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
JP2010237576A (ja) * | 2009-03-31 | 2010-10-21 | Taiyo Ink Mfg Ltd | 硬化性樹脂組成物 |
KR20120000074A (ko) * | 2009-03-31 | 2012-01-03 | 다이요 홀딩스 가부시키가이샤 | 경화성 수지 조성물 및 인쇄 배선판 |
WO2010113478A1 (ja) * | 2009-03-31 | 2010-10-07 | 太陽インキ製造株式会社 | 硬化性樹脂組成物およびプリント配線板 |
KR101690811B1 (ko) | 2009-03-31 | 2016-12-28 | 다이요 홀딩스 가부시키가이샤 | 경화성 수지 조성물 및 인쇄 배선판 |
JP2010266745A (ja) * | 2009-05-15 | 2010-11-25 | Taiyo Ink Mfg Ltd | 硬化性樹脂組成物 |
JP2011241300A (ja) * | 2010-05-18 | 2011-12-01 | Tamura Seisakusho Co Ltd | 硬化性樹脂組成物 |
JP2017206695A (ja) * | 2016-05-20 | 2017-11-24 | キヤノン株式会社 | ナノインプリントリソグラフィー密着層 |
JP7166745B2 (ja) | 2016-05-20 | 2022-11-08 | キヤノン株式会社 | ナノインプリントリソグラフィー密着層 |
WO2023021813A1 (ja) * | 2021-08-18 | 2023-02-23 | 三菱瓦斯化学株式会社 | 樹脂、樹脂の製造方法、硬化性樹脂組成物および硬化物 |
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JP4213043B2 (ja) | 2009-01-21 |
AU2003221361A1 (en) | 2003-09-29 |
HK1086582A1 (en) | 2006-09-22 |
EP1486521A4 (en) | 2006-01-18 |
TW200400211A (en) | 2004-01-01 |
EP1486521A1 (en) | 2004-12-15 |
JPWO2003078494A1 (ja) | 2005-07-14 |
KR100950124B1 (ko) | 2010-03-30 |
KR20040089735A (ko) | 2004-10-21 |
US20050054756A1 (en) | 2005-03-10 |
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