JP2017206695A - ナノインプリントリソグラフィー密着層 - Google Patents
ナノインプリントリソグラフィー密着層 Download PDFInfo
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- JP2017206695A JP2017206695A JP2017098183A JP2017098183A JP2017206695A JP 2017206695 A JP2017206695 A JP 2017206695A JP 2017098183 A JP2017098183 A JP 2017098183A JP 2017098183 A JP2017098183 A JP 2017098183A JP 2017206695 A JP2017206695 A JP 2017206695A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/02—Esters of acyclic saturated monocarboxylic acids having the carboxyl group bound to an acyclic carbon atom or to hydrogen
- C07C69/12—Acetic acid esters
- C07C69/14—Acetic acid esters of monohydroxylic compounds
- C07C69/145—Acetic acid esters of monohydroxylic compounds of unsaturated alcohols
- C07C69/157—Acetic acid esters of monohydroxylic compounds of unsaturated alcohols containing six-membered aromatic rings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/20—Making multilayered or multicoloured articles
- B29C43/203—Making multilayered articles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
- C08G8/36—Chemically modified polycondensates by etherifying
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
- B29L2009/005—Layered products coated
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Medicinal Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
第1の一般的態様の実施態様には下記特徴の1つ又は複数が含まれ得る。
場合によっては、nを1〜20の整数とする。或る特定の場合には、nを5〜15の整数とする。Rは置換又は非置換のものであってもよい。
第2の一般的態様の実施態様には下記特徴の1つ又は複数が含まれ得る。
インプリントリソグラフィー積層体は、密着層に密着する高分子層を更に含むことができる。場合によっては、密着層の厚さが2nm〜10nmの範囲にある。或る特定の場合には、基板の表面自由エネルギーが、密着層の表面自由エネルギーを超える。
場合によっては、nを1〜20の整数とする。或る特定の場合には、nを5〜15の整数とする。Rは置換又は非置換のものであってもよい。
例示的な開始剤である2−ヒドロキシ−2−メチル−1−フェニル−プロパン−1−オンは、DAROCUR(商標)1173という商標名でCiba Specialty Chemicals(Tarrytown, New York)から入手可能であり、下記構造:
様々な実施形態をより十分に説明するために以下の実施例を提示する。
本明細書中に記載される密着組成物を基板の表面上にスピンオンして、硬化することで、基板とインプリントレジストとの間の密着性を高める密着層を形成することができる。好適な基板は、Si、SiOx、SOG、SOC、並びに、適切な疎水性及びOwens−Wendtの方法によって求められる適切な表面自由エネルギーを有する他の表面を含む。表1に、水及びジヨードメタンを用いて評価される、無処理のシリコン、SOG及びSOC基板に関する水接触角、並びに無処理のシリコン、SOG及びSOC基板に関するOwens−Wendt表面自由エネルギーを挙げる。
およそ11gのEPON Resin 164と、100mLのジメチルエーテル(DME)とを室温で混合し、−20℃まで冷却した。50mLのDME中に溶解させた50mmolのEtMgBrを添加した後、6時間撹拌し、その後、5mLの水を添加することによって反応を停止させた。水を除去した後、アクリル酸クロライド(450mg、5mmol)及びトリメチルアミン(10mmol)を添加し、反応混合物を2時間撹拌した。固形物を濾過により除去した後、真空乾燥させた。生成物を200mlのジエチルエーテルに再溶解させ、炭酸カリウム固体(10g)を添加して、残る酸を吸収させた。4時間撹拌した後、固形物を濾過により取り除いた。濾液を真空乾燥させることによって化合物A−1(R=エチル)が得られた。場合によっては、アクリル酸クロライドをアクリル酸に置き換えてもよい。他の事例では、樹脂をPGMEAに溶解してもよい。
15wt%PGMEA溶液として実施例2で調製した40gの化合物A−1と、50wt%PGMEA溶液として3.52gのCYMEL 303 ULFと、0.0098gのK−PURE TAG 2678とを合わせるとともに、3957gのPGMEAを投入することによって、式A−1の化合物と、CYMEL 303 ULFと、K−PURE TAG 2678と、PGMEAとを含む密着組成物を調製することで、該密着組成物を得た。
実施例3で調製した密着組成物を、1500rpmの回転及び3000rpm/秒のランプ速度でSOG基板上にスピンコーティングし、160℃で80秒間焼成すると、約5nmの厚さを有する密着層が得られた。表2に、市販の密着組成物(TRANSPIN I)及び実施例3に記載したように調製した密着組成物により形成した密着層を有するSOG基板上における水接触角を挙げる。図3に、得られた密着層のAFM画像を示す。
Claims (20)
- 式A−1の化合物:
- n=1〜20である、請求項1に記載の化合物。
- n=5〜15である、請求項2に記載の化合物。
- 式A−1の化合物を含む組成物:
- 架橋剤を更に含む、請求項4に記載の組成物。
- 前記架橋剤がアルキル化メラミンを含む、請求項5に記載の組成物。
- 1wt%〜50wt%の前記架橋剤を含む、請求項5に記載の組成物。
- 触媒を更に含む、請求項4に記載の組成物。
- 前記触媒がベンゼンスルホン酸系触媒を含む、請求項8に記載の組成物。
- 最大10wt%の前記触媒を含む、請求項8に記載の組成物。
- 溶剤を更に含む、請求項4に記載の組成物。
- 前記溶剤が2−(1−メトキシ)プロピルアセテートを含む、請求項11に記載の組成物。
- 30wt%〜90wt%又は60wt%〜90wt%の前記溶剤を含む、請求項11に記載の組成物。
- 基板と、
前記基板に密着する、式A−1:
を備える、インプリントリソグラフィー積層体。 - n=1〜20である、請求項14に記載のインプリントリソグラフィー積層体。
- 前記密着層に密着する高分子層を更に備える、請求項14に記載のインプリントリソグラフィー積層体。
- 前記密着層の厚さが2nm〜10nmの範囲にある、請求項14に記載のインプリントリソグラフィー積層体。
- 前記基板の表面自由エネルギーが、前記密着層の表面自由エネルギーを超える、請求項14に記載のインプリントリソグラフィー積層体。
- インプリントリソグラフィー基板上に密着層を形成する方法であって、
前記インプリントリソグラフィー基板上に、式A−1:
前記密着組成物を重合させて、前記基板上に前記密着層を得る工程と、
を含む、方法。 - n=1〜20である、請求項19に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/160,870 | 2016-05-20 | ||
US15/160,870 US10189188B2 (en) | 2016-05-20 | 2016-05-20 | Nanoimprint lithography adhesion layer |
Publications (2)
Publication Number | Publication Date |
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JP2017206695A true JP2017206695A (ja) | 2017-11-24 |
JP7166745B2 JP7166745B2 (ja) | 2022-11-08 |
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Application Number | Title | Priority Date | Filing Date |
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JP2017098183A Active JP7166745B2 (ja) | 2016-05-20 | 2017-05-17 | ナノインプリントリソグラフィー密着層 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10189188B2 (ja) |
JP (1) | JP7166745B2 (ja) |
KR (1) | KR102114217B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210133262A (ko) | 2019-03-29 | 2021-11-05 | 후지필름 가부시키가이샤 | 임프린트법에 있어서의 하층막 형성용 조성물, 키트, 패턴 제조 방법, 적층체 및 반도체 소자의 제조 방법 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10780682B2 (en) * | 2018-12-20 | 2020-09-22 | Canon Kabushiki Kaisha | Liquid adhesion composition, multi-layer structure and method of making said structure |
CN113204169A (zh) * | 2021-04-12 | 2021-08-03 | 新沂崚峻光电科技有限公司 | 一种新型压印膜的制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5990189A (en) * | 1995-04-06 | 1999-11-23 | Coates Brothers Plc | Coating compositions |
WO2003078494A1 (fr) * | 2002-03-15 | 2003-09-25 | Taiyo Ink Manufacturing Co., Ltd. | Resines durcissables et compositions de resines durcissables les contenant |
JP2007233395A (ja) * | 2007-03-16 | 2007-09-13 | Taiyo Ink Mfg Ltd | プリント配線板のレジストパターン製造方法 |
JP2013015856A (ja) * | 2008-12-26 | 2013-01-24 | Hitachi Chem Co Ltd | ポジ型感光性樹脂組成物、レジストパターンの製造方法、半導体装置及び電子デバイス |
JP2014125506A (ja) * | 2012-12-25 | 2014-07-07 | Adeka Corp | 光硬化性組成物 |
CN105131703A (zh) * | 2015-09-18 | 2015-12-09 | 江门市阪桥电子材料有限公司 | 一种液态感光静电喷涂阻焊材料、制备方法及喷涂方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3301743A (en) * | 1963-06-12 | 1967-01-31 | Robertson Co H H | Polyhydroxy polyacrylate esters of epoxidized phenol-formaldehyde novolac resins and laminates therefrom |
US3882003A (en) * | 1971-05-13 | 1975-05-06 | Dow Chemical Co | Vinyl ester resin and process for curing same with ionizing radiation in the presence of amines |
US3919349A (en) * | 1974-09-20 | 1975-11-11 | Desoto Inc | Removal of unreacted acid from polythylenic polyesters |
IT1063907B (it) * | 1976-04-30 | 1985-02-18 | Sir Soc Italiana Resine Spa | Perfezionamenti nelle composizioni che comprendono un epossiestere insaturo ed un monomero etilenicamente insaturo |
US5015701A (en) * | 1981-07-01 | 1991-05-14 | Union Carbide Chemicals And Plastics Company Inc. | Composition of vinyl ester resin, hydroxyalkyl (meth)acrylate and a styrene |
JPS60250023A (ja) * | 1984-05-28 | 1985-12-10 | Dainippon Ink & Chem Inc | 活性エネルギ−線硬化性樹脂組成物 |
US4769437A (en) * | 1986-12-22 | 1988-09-06 | Blount David H | Process for the production of phenolic resins |
US6873087B1 (en) | 1999-10-29 | 2005-03-29 | Board Of Regents, The University Of Texas System | High precision orientation alignment and gap control stages for imprint lithography processes |
US6932934B2 (en) | 2002-07-11 | 2005-08-23 | Molecular Imprints, Inc. | Formation of discontinuous films during an imprint lithography process |
US7077992B2 (en) | 2002-07-11 | 2006-07-18 | Molecular Imprints, Inc. | Step and repeat imprint lithography processes |
US6936194B2 (en) | 2002-09-05 | 2005-08-30 | Molecular Imprints, Inc. | Functional patterning material for imprint lithography processes |
US8349241B2 (en) | 2002-10-04 | 2013-01-08 | Molecular Imprints, Inc. | Method to arrange features on a substrate to replicate features having minimal dimensional variability |
US20040065252A1 (en) | 2002-10-04 | 2004-04-08 | Sreenivasan Sidlgata V. | Method of forming a layer on a substrate to facilitate fabrication of metrology standards |
US7396475B2 (en) | 2003-04-25 | 2008-07-08 | Molecular Imprints, Inc. | Method of forming stepped structures employing imprint lithography |
US7197396B2 (en) | 2004-03-31 | 2007-03-27 | Ford Global Technologies, Llc | Collision mitigation system |
US8557351B2 (en) | 2005-07-22 | 2013-10-15 | Molecular Imprints, Inc. | Method for adhering materials together |
US20080110557A1 (en) | 2006-11-15 | 2008-05-15 | Molecular Imprints, Inc. | Methods and Compositions for Providing Preferential Adhesion and Release of Adjacent Surfaces |
US8389456B2 (en) * | 2008-06-09 | 2013-03-05 | Soane Energy, Llc | Low interfacial tension surfactants for petroleum applications |
TWI490199B (zh) * | 2009-03-11 | 2015-07-01 | Sumitomo Chemical Co | 化合物及化學放大型正光阻組成物 |
-
2016
- 2016-05-20 US US15/160,870 patent/US10189188B2/en active Active
-
2017
- 2017-05-12 KR KR1020170059342A patent/KR102114217B1/ko active IP Right Grant
- 2017-05-17 JP JP2017098183A patent/JP7166745B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5990189A (en) * | 1995-04-06 | 1999-11-23 | Coates Brothers Plc | Coating compositions |
WO2003078494A1 (fr) * | 2002-03-15 | 2003-09-25 | Taiyo Ink Manufacturing Co., Ltd. | Resines durcissables et compositions de resines durcissables les contenant |
JP2007233395A (ja) * | 2007-03-16 | 2007-09-13 | Taiyo Ink Mfg Ltd | プリント配線板のレジストパターン製造方法 |
JP2013015856A (ja) * | 2008-12-26 | 2013-01-24 | Hitachi Chem Co Ltd | ポジ型感光性樹脂組成物、レジストパターンの製造方法、半導体装置及び電子デバイス |
JP2014125506A (ja) * | 2012-12-25 | 2014-07-07 | Adeka Corp | 光硬化性組成物 |
CN105131703A (zh) * | 2015-09-18 | 2015-12-09 | 江门市阪桥电子材料有限公司 | 一种液态感光静电喷涂阻焊材料、制备方法及喷涂方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210133262A (ko) | 2019-03-29 | 2021-11-05 | 후지필름 가부시키가이샤 | 임프린트법에 있어서의 하층막 형성용 조성물, 키트, 패턴 제조 방법, 적층체 및 반도체 소자의 제조 방법 |
Also Published As
Publication number | Publication date |
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US10189188B2 (en) | 2019-01-29 |
KR20170131226A (ko) | 2017-11-29 |
KR102114217B1 (ko) | 2020-05-25 |
US20170335150A1 (en) | 2017-11-23 |
JP7166745B2 (ja) | 2022-11-08 |
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