WO2000055888A1 - Dispositif de traitement de substrats - Google Patents

Dispositif de traitement de substrats Download PDF

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Publication number
WO2000055888A1
WO2000055888A1 PCT/EP2000/001984 EP0001984W WO0055888A1 WO 2000055888 A1 WO2000055888 A1 WO 2000055888A1 EP 0001984 W EP0001984 W EP 0001984W WO 0055888 A1 WO0055888 A1 WO 0055888A1
Authority
WO
WIPO (PCT)
Prior art keywords
opening
process container
substrate
vacuum
container
Prior art date
Application number
PCT/EP2000/001984
Other languages
German (de)
English (en)
Inventor
Wolfgang Kroeber
Original Assignee
Steag Microtech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Microtech Gmbh filed Critical Steag Microtech Gmbh
Priority to KR1020017011532A priority Critical patent/KR20010103049A/ko
Priority to JP2000606035A priority patent/JP2002539334A/ja
Priority to EP00918768A priority patent/EP1161765A1/fr
Publication of WO2000055888A1 publication Critical patent/WO2000055888A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning

Abstract

Cette invention concerne un dispositif de traitement de substrats, en particulier de plaquettes de semi-conducteur, qui comprend un récipient de traitement présentant au moins une ouverture pouvant, durant le traitement, être fermée de l'extérieur par le substrat. Avec ledit dispositif, on réalise un traitement simple et homogène d'une surface à traiter du substrat et on obtient une réduction du danger d'endommagement entre des phases successives de traitement, grâce à la présence d'un second récipient de traitement au voisinage du premier récipient de traitement, l'une des parois dudit second récipient étant au moins partiellement la paroi du premier récipient comprenant l'ouverture et l'ouverture pouvant être fermée du côté du premier récipient de traitement.
PCT/EP2000/001984 1999-03-12 2000-03-08 Dispositif de traitement de substrats WO2000055888A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020017011532A KR20010103049A (ko) 1999-03-12 2000-03-08 기판 처리 장치
JP2000606035A JP2002539334A (ja) 1999-03-12 2000-03-08 基板を処理するための装置
EP00918768A EP1161765A1 (fr) 1999-03-12 2000-03-08 Dispositif de traitement de substrats

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19911084A DE19911084C2 (de) 1999-03-12 1999-03-12 Vorrichtung zum Behandeln von Substraten
DE19911084.0 1999-03-12

Publications (1)

Publication Number Publication Date
WO2000055888A1 true WO2000055888A1 (fr) 2000-09-21

Family

ID=7900762

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2000/001984 WO2000055888A1 (fr) 1999-03-12 2000-03-08 Dispositif de traitement de substrats

Country Status (6)

Country Link
EP (1) EP1161765A1 (fr)
JP (1) JP2002539334A (fr)
KR (1) KR20010103049A (fr)
DE (1) DE19911084C2 (fr)
TW (1) TW472316B (fr)
WO (1) WO2000055888A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10162191A1 (de) * 2001-12-17 2003-06-18 Wolfgang Coenen Automatisches Vielkanalätzsystem
JP2005126814A (ja) * 2003-09-30 2005-05-19 Seiko Epson Corp 表面処理方法
DE102005020850B4 (de) * 2005-05-02 2009-04-23 Wolff, Thomas, Dipl.-Phys. Dichtring für eine elektrochemische Zelle
US9958782B2 (en) 2016-06-29 2018-05-01 Applied Materials, Inc. Apparatus for post exposure bake

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783249A (en) * 1987-06-26 1988-11-08 Napco, Inc. Electroplating apparatus with self-contained rinse water treatment
JPH03190134A (ja) * 1989-12-19 1991-08-20 Fujitsu Ltd 電解めっきによる金属素子の形成方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2734269B2 (ja) * 1991-12-26 1998-03-30 日本電気株式会社 半導体製造装置
JP3377849B2 (ja) * 1994-02-02 2003-02-17 日本エレクトロプレイテイング・エンジニヤース株式会社 ウエーハ用メッキ装置
DE19934298A1 (de) * 1998-12-22 2000-07-06 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
DE19859466C2 (de) * 1998-12-22 2002-04-25 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
DE19859469C2 (de) * 1998-12-22 2002-02-14 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783249A (en) * 1987-06-26 1988-11-08 Napco, Inc. Electroplating apparatus with self-contained rinse water treatment
JPH03190134A (ja) * 1989-12-19 1991-08-20 Fujitsu Ltd 電解めっきによる金属素子の形成方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 448 (E - 1133) 14 November 1991 (1991-11-14) *

Also Published As

Publication number Publication date
JP2002539334A (ja) 2002-11-19
DE19911084C2 (de) 2002-01-31
KR20010103049A (ko) 2001-11-17
EP1161765A1 (fr) 2001-12-12
DE19911084A1 (de) 2000-09-21
TW472316B (en) 2002-01-11

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