DE19911084C2 - Vorrichtung zum Behandeln von Substraten - Google Patents

Vorrichtung zum Behandeln von Substraten

Info

Publication number
DE19911084C2
DE19911084C2 DE19911084A DE19911084A DE19911084C2 DE 19911084 C2 DE19911084 C2 DE 19911084C2 DE 19911084 A DE19911084 A DE 19911084A DE 19911084 A DE19911084 A DE 19911084A DE 19911084 C2 DE19911084 C2 DE 19911084C2
Authority
DE
Germany
Prior art keywords
opening
process container
substrate
vacuum
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19911084A
Other languages
German (de)
English (en)
Other versions
DE19911084A1 (de
Inventor
Wolfgang Kroeber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SCP Germany GmbH
Original Assignee
Steag Microtech GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Microtech GmbH filed Critical Steag Microtech GmbH
Priority to DE19911084A priority Critical patent/DE19911084C2/de
Priority to JP2000606035A priority patent/JP2002539334A/ja
Priority to KR1020017011532A priority patent/KR20010103049A/ko
Priority to PCT/EP2000/001984 priority patent/WO2000055888A1/fr
Priority to EP00918768A priority patent/EP1161765A1/fr
Priority to TW089104247A priority patent/TW472316B/zh
Publication of DE19911084A1 publication Critical patent/DE19911084A1/de
Application granted granted Critical
Publication of DE19911084C2 publication Critical patent/DE19911084C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroplating Methods And Accessories (AREA)
DE19911084A 1999-03-12 1999-03-12 Vorrichtung zum Behandeln von Substraten Expired - Fee Related DE19911084C2 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE19911084A DE19911084C2 (de) 1999-03-12 1999-03-12 Vorrichtung zum Behandeln von Substraten
JP2000606035A JP2002539334A (ja) 1999-03-12 2000-03-08 基板を処理するための装置
KR1020017011532A KR20010103049A (ko) 1999-03-12 2000-03-08 기판 처리 장치
PCT/EP2000/001984 WO2000055888A1 (fr) 1999-03-12 2000-03-08 Dispositif de traitement de substrats
EP00918768A EP1161765A1 (fr) 1999-03-12 2000-03-08 Dispositif de traitement de substrats
TW089104247A TW472316B (en) 1999-03-12 2000-03-09 Substrate processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19911084A DE19911084C2 (de) 1999-03-12 1999-03-12 Vorrichtung zum Behandeln von Substraten

Publications (2)

Publication Number Publication Date
DE19911084A1 DE19911084A1 (de) 2000-09-21
DE19911084C2 true DE19911084C2 (de) 2002-01-31

Family

ID=7900762

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19911084A Expired - Fee Related DE19911084C2 (de) 1999-03-12 1999-03-12 Vorrichtung zum Behandeln von Substraten

Country Status (6)

Country Link
EP (1) EP1161765A1 (fr)
JP (1) JP2002539334A (fr)
KR (1) KR20010103049A (fr)
DE (1) DE19911084C2 (fr)
TW (1) TW472316B (fr)
WO (1) WO2000055888A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10162191A1 (de) * 2001-12-17 2003-06-18 Wolfgang Coenen Automatisches Vielkanalätzsystem
JP2005126814A (ja) * 2003-09-30 2005-05-19 Seiko Epson Corp 表面処理方法
DE102005020850B4 (de) * 2005-05-02 2009-04-23 Wolff, Thomas, Dipl.-Phys. Dichtring für eine elektrochemische Zelle
US9958782B2 (en) * 2016-06-29 2018-05-01 Applied Materials, Inc. Apparatus for post exposure bake

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5437777A (en) * 1991-12-26 1995-08-01 Nec Corporation Apparatus for forming a metal wiring pattern of semiconductor devices
US5447615A (en) * 1994-02-02 1995-09-05 Electroplating Engineers Of Japan Limited Plating device for wafer
DE19859466A1 (de) * 1998-12-22 2000-07-06 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
DE19859469A1 (de) * 1998-12-22 2000-07-06 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
DE19934298A1 (de) * 1998-12-22 2000-07-06 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783249A (en) * 1987-06-26 1988-11-08 Napco, Inc. Electroplating apparatus with self-contained rinse water treatment
JP2882416B2 (ja) * 1989-12-19 1999-04-12 富士通株式会社 電解めっきによる金属素子の形成方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5437777A (en) * 1991-12-26 1995-08-01 Nec Corporation Apparatus for forming a metal wiring pattern of semiconductor devices
US5447615A (en) * 1994-02-02 1995-09-05 Electroplating Engineers Of Japan Limited Plating device for wafer
DE19859466A1 (de) * 1998-12-22 2000-07-06 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
DE19859469A1 (de) * 1998-12-22 2000-07-06 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten
DE19934298A1 (de) * 1998-12-22 2000-07-06 Steag Micro Tech Gmbh Vorrichtung und Verfahren zum Behandeln von Substraten

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP 3-277795 A. In: Patent Abstracts of Japan *
JP 6-45282 A. In: Patent Abstracts of Japan *

Also Published As

Publication number Publication date
TW472316B (en) 2002-01-11
KR20010103049A (ko) 2001-11-17
WO2000055888A1 (fr) 2000-09-21
DE19911084A1 (de) 2000-09-21
EP1161765A1 (fr) 2001-12-12
JP2002539334A (ja) 2002-11-19

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SCP GERMANY GMBH, 72124 PLIEZHAUSEN, DE

8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee