WO1999046784A1 - Module et procede de fabrication correspondant - Google Patents
Module et procede de fabrication correspondant Download PDFInfo
- Publication number
- WO1999046784A1 WO1999046784A1 PCT/JP1999/001179 JP9901179W WO9946784A1 WO 1999046784 A1 WO1999046784 A1 WO 1999046784A1 JP 9901179 W JP9901179 W JP 9901179W WO 9946784 A1 WO9946784 A1 WO 9946784A1
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- WO
- WIPO (PCT)
- Prior art keywords
- conductor
- forming
- capacitor
- layer
- composite
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims description 41
- 239000003990 capacitor Substances 0.000 claims abstract description 80
- 239000004020 conductor Substances 0.000 claims abstract description 77
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000002131 composite material Substances 0.000 claims description 124
- 239000000696 magnetic material Substances 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
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- 238000000605 extraction Methods 0.000 description 15
- 239000012212 insulator Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 11
- 239000011810 insulating material Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
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- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- 229910001252 Pd alloy Inorganic materials 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
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- 238000003475 lamination Methods 0.000 description 2
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- 238000000059 patterning Methods 0.000 description 2
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- 238000004544 sputter deposition Methods 0.000 description 2
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- 229920001187 thermosetting polymer Polymers 0.000 description 2
- IRPGOXJVTQTAAN-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropanal Chemical compound FC(F)(F)C(F)(F)C=O IRPGOXJVTQTAAN-UHFFFAOYSA-N 0.000 description 1
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 1
- 241000287828 Gallus gallus Species 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
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- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
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- 238000001182 laser chemical vapour deposition Methods 0.000 description 1
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- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
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- 238000004528 spin coating Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Definitions
- the present invention relates to a composite component used for various electronic devices and communication devices, and a method for manufacturing the same.
- a variety of composite components including a coil, a capacitor, a resistor, and the like are often used in various electronic devices and communication devices, and in recent years, there has been an increasing demand for small or thin composite components. Furthermore, with the increase in the frequency of circuits and the digitalization of various electronic devices, the noise reduction function of composite parts has become increasingly important.
- composite components for noise reduction have L, T, 7 ⁇ or other filter circuits that combine multiple coils and multiple capacitors.
- the structure of the conventional laminated LC composite component was such that only one type of the above-mentioned filter circuits could be configured.
- the LC composite component described in Japanese Patent Publication No. 62-28891 could only constitute a T-type filter circuit.
- these conventional composite parts have the problem of interference between the coils configured inside, At the time of lamination, there was a problem in the compatibility between the coil material and the capacitor material. In other words, the physical properties such as the coefficient of thermal expansion and the sintering characteristics are different between the magnetic material used for improving the performance of the coil and the dielectric material constituting the capacitor. For this reason, sintering during the production of laminated composite components often causes defects such as peeling and warping.
- the manufacturing method is to ⁇ . Disclosure of the invention
- the composite part according to the present invention is in close contact with the outer peripheral surface of a condenser composed of at least one insulating layer and at least two electrode layers, or the outer peripheral surface of a portion of the layer where no capacitor is formed, and forms a spiral. And a plurality of terminals are formed.
- the electrode layer and the helical continuous conductor form the plurality of ends. It is electrically connected to the child.
- a helical continuous conductor formed in close contact with a body or a magnetic body is insulated from a capacitor composed of at least one layer and at least two electrode layers.
- a spiral axis of the spiral continuous conductor is parallel to a surface of the electrode layer forming the capacitor, and at least the electrode layer and the spiral continuous conductor are stacked. It is electrically connected in one place.
- the method of manufacturing a composite part according to the present invention includes a step of forming a capacitor composed of at least one insulating layer and at least two electrode layers; and forming an insulating layer on the outer peripheral surfaces of the luster layer and the capacitor. And a step of forming a spiral continuous conductor portion and terminal portion on the outer periphery of the capacitor on which the layer is formed.
- Another method of manufacturing a composite component according to the present invention includes a step of forming a capacitor including at least one luer layer and at least two electrode layers provided in a part of the lower layer; And a step of forming an insulating layer on the outer peripheral surface of the capacitor; and a step of forming a spiral continuous conductor portion and terminal portion on the outer periphery of the insulating layer.
- Still another method of manufacturing a composite part according to the present invention includes a step of forming a capacitor composed of at least one luer layer and at least two electrode layers, and a step of forming a capacitor in close contact with an outer periphery of an insulator or a magnetic body.
- FIG. 1 is a schematic external perspective view showing a first embodiment of the present invention.
- FIG. 2 is a conceptual diagram showing the structure of the first embodiment of the present invention.
- FIG. 3 is a schematic external perspective view showing another external appearance of the first embodiment of the present invention.
- FIG. 4 is a diagram showing another electrode of the condenser according to the first embodiment of the present invention.
- FIG. 5 is a conceptual diagram showing still another electrode pattern of the capacitor according to the first embodiment of the present invention.
- FIG. 6 is a schematic external perspective view showing still another external appearance of the first embodiment of the present invention.
- FIG. 7 is a conceptual diagram showing the structure of the second embodiment of the present invention.
- FIG. 8 is a schematic external perspective view showing a second embodiment of the present invention.
- FIG. 9 is a conceptual diagram showing another structure of the second embodiment of the present invention.
- FIG. 10 is a conceptual diagram showing still another structure of the second embodiment of the present invention.
- FIG. 11 is a conceptual diagram showing the structure of the third embodiment of the present invention.
- FIG. 12 is a schematic external perspective view showing a third embodiment of the present invention.
- FIG. 13 is a conceptual diagram showing another structure of the third embodiment of the present invention.
- FIG. 14 is a conceptual diagram showing still another structure of the third embodiment of the present invention.
- FIG. 15 is a conceptual diagram showing another structure of the third embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION
- Embodiment 1 Embodiment 1
- FIG. 1 shows an example of a schematic appearance of a first embodiment of a composite part according to the present invention.
- FIG. 1 shows a composite part having a coil composed of a spiral conductor 2 closely adhered to the surface of the composite part 1.
- the biggest difference between the conventional composite component in which the coated copper wire is wound around the chip condenser and the composite component according to the present invention is that the spiral conductor 2 is used during the manufacturing process of the composite component. Therefore, it is in close contact with the substrate.
- the biggest difference between the conventional printed laminated type laminated coil and the composite component composed of the laminated capacitor is that the helical axis of the helical conductor 2 is parallel to the electrode surface of the condenser. . Due to this structure, the coil constituting the composite part of the present invention has excellent characteristics.
- a capacitor formed from at least two electrodes and at least one dielectric layer is included in the inside of the composite component, and if necessary, insulating layers are formed on both upper and lower surfaces of the capacitor.
- FIG. 1 shows a composite component having a filter circuit in which a coil and a capacitor are connected in parallel.
- FIG. 2 shows the internal structure of the composite part 1 shown in FIG.
- the composite component 1 has a laminated structure of a capacitor composed of a dielectric layer 4 and two electrode layers 5 and 5 ', and a layer 6 which is a base of a coil formed outside.
- Each of the electrode layers 5, 5 ' has an electrode portion exposed on two opposite side surfaces of the composite component.
- FIG. 2 shows a plurality of insulating layers 6, the plurality of insulating layers 6 are not necessarily required. In order to secure the gap between the electrode layer 5 and the conductor 2 constituting the coil, at least one insulating layer is required at least on the uppermost layer.
- a plurality of layers are provided for changing and improving the coil characteristics. It is effective to provide the insulating layer 6. That is, by using a magnetic material or a non-magnetic material for the material of the insulating layer 6, the characteristics of the coil 2 can be changed, such as improving the impedance of the coil.
- the dielectric layer 4 that composes the capacitor is made of composite materials from the It can be arbitrarily selected according to the function. If the material used for the dielectric layer 4 is used as the material for the edge layer 6, the main body of the composite component 1 is formed of the same material. For this reason, the composite component 1 can be easily manufactured without causing defects such as peeling and warpage in molding and firing the composite component 1.
- FIG. 3 shows a shape of the composite component shown in FIG. 1 in which portions other than the terminals 3 and 3 ′ are covered with an outer insulating material 7.
- the outer layer insulating material 7 is not always necessary depending on the use form of the composite component.
- the outer layer insulating material 7 is necessary when it is desired to sufficiently secure the edge of the coil 2 or to change the characteristics of the coil 2. For example, by mixing the magnetic material ⁇ f into the outer insulating material 7, the leakage magnetic flux of the coil 2 is reduced, and the mm characteristic of the coil 2 can be adjusted.
- the strength of the composite component is improved, and the destruction of the composite component and the occurrence of defects during mounting on a circuit board using an automatic mounting machine can be prevented.
- the composite part can be electrically shielded by once insulating the coil portion with an insulating material and then coating with a conductive outer layer material 7.
- FIG. 4 shows one of the typical patterns of the electrode layer formed on the dielectric layer 4.
- the electrode layer 5 shown in FIG. 3 is divided into two electrode layers 5, 5 "and connected to terminals 3, 3 ', respectively.
- a composite component having a 7 ⁇ filter circuit is manufactured.
- the extraction electrodes of the electrode layers 5 and 5 ′ are exposed on the end faces perpendicular to the terminals 3 and 3 ′ of the composite component, and the extraction of the electrode layer 5 in the middle of the coil 2.
- a T-type filter is formed by forming a terminal 3 "connected to the extraction electrode and the extraction electrode of the electrode layer 5 '.
- the method of manufacturing a composite component according to the present embodiment includes a first step of forming a capacitor, a second step of forming layers above and below the capacitor, a third step of covering the entire composite part with a conductor layer, And a fourth step of forming an external electrode and a coil from the conductor layer formed in the third step.
- a dielectric sheet and an insulator sheet for producing the dielectric layer 4 and the insulator layer 6 shown in FIG. 2 are produced.
- a dielectric sheet and an insulator sheet having predetermined dimensions are taken out from the dielectric sheet and the insulator sheet, and an electrode layer 55 'having a predetermined pattern is formed on the dielectric sheet and the insulator sheet.
- the body sheet Lux body sheet or dielectric sheet on which the turn-shaped electrode layer 5 'is formed.
- the dielectric sheet and the insulating sheet on which the turn-shaped electrode layers 5 are formed are laminated in this order to produce a capacitor element of a uniform shape.
- the conductor layer formed on the entire surface of the capacitor body is patterned to form terminals 3 and 3 'and a coil 2.
- the outer layer insulating material 7 is formed on portions other than the terminals 3 and 3 ', and the composite component of the present invention is manufactured.
- the material of the insulator layer 6 may be a non-magnetic material or a magnetic material.
- non-magnetic materials that can be used for the thigh layer 6 include epoxy resin, Z glass fiber composite material, and polyimide resin.
- the self-resonant frequency of Koizole 2 increases.
- Examples of a magnetic material that can be used for the insulator layer 6 include a known magnetic material having a large magnetic permeability such as NiZnFlight or NiZnCuferrite. By using these magnetic materials having a high magnetic permeability for the insulator layer 6, the inductance of the coil 1 can be increased.
- any force can be used as long as it is an electrically good conductor.
- One method is to form a base layer consisting of an edge on the entire surface of the composite component body in which the capacitor and insulating layer are laminated, then form a layer of conductive material such as copper, and pattern it. It is.
- As a patterning method there are a method of evaporating an unnecessary portion with a laser beam, a method of cutting, and a method of forming a resist in a necessary portion and performing etching.
- a method of forming a conductor on the entire surface there are various electroless plating methods, a method of dipping in a conductive resin, various CVD methods, and a vacuum plating method such as a sputtering method.
- the combination of the sputtering method and the electroplating method can form the conductive layer most efficiently.
- the other method of forming the conductor layer 2 and the terminals 3 and 3 * is a method of selectively forming a conductive layer only on the portion of the conductor layer 2 and the exposed portions of the electrodes 5 and 5 ′ of the composite component body.
- Examples of a forming method include a method of applying a conductive resin, and a method of forming a conductive layer only on the conductor layer 2 and the terminals 3 and 3 * by laser CVD or the like.
- the conductor can be formed on the surface of the composite component in the form of a square or a square.
- the material of the terminals 3 and 3 ′ is basically the same as that of the conductor 2. However, unlike the conductor 2, when used as a composite component terminal, it is preferable that the conductor is not made of the same material as the conductor 2 but is composed of a plurality of layers.
- the terminal of the composite component of the present invention is formed by forming an intermediate layer composed of a Nigger plating layer and an outermost layer composed of tin or an alloy thereof on an underlayer composed of copper, silver, a silver palladium alloy or the like. Is preferred. However, this configuration is merely an example, and another metal or organic material such as a conductive resin can be selected as one of the constituent materials of the terminals 3 and 3 '.
- terminals 3 and 3 ' are formed of conductive resin, it is necessary to laminate the metal layer as described above by electrical plating or the like on the terminals 3 and 3' to ensure solderability. is there.
- components may be mounted with a conductive resin or the like for lead-free measures.
- the metal plating is not necessary.
- the composite component of the present invention is mounted on a ceramic substrate such as aluminum fluoride in which a rooster pattern is formed in advance using a high-temperature firing paste. .
- a ceramic substrate such as aluminum fluoride in which a rooster pattern is formed in advance using a high-temperature firing paste.
- a conventionally known dielectric material made of an organic or inorganic material can be used for the dielectric layer 4. It is natural that the capacity of the capacitor can be increased by using a material having a large dielectric constant for the dielectric layer 4. Further, by changing the area of the electrode layers 5 and 5 ′ constituting the capacitor and the thickness of the dielectric layer 4, the capacitance of the condenser can be changed even when the same material is used.
- the structure shown in FIG. 2 shows a minimum required structure of the composite part according to the present invention. It was done. That is, the capacitance of the capacitor can be increased by repeatedly forming a laminated structure by repeating the combination of the dielectric layer 4 and the electrode layers 5 and 5 'constituting the capacitor. In this case, it is natural that the electrodes are alternately taken out from the electrode layers 5, 5 ', 5 ", 5"'... And connected to the terminals 3 and 3, respectively. Further, as described above, it is possible to improve the coil characteristics by improving the electric characteristics of the coil 2 by laminating the insulator layers 6 made of a magnetic material on the upper and lower surfaces of the capacitor. is there.
- the cut-off frequency of a filter is defined as the frequency at which a certain amount of attenuation is obtained, and is determined by the inductance of the coil and the capacitance of the capacitor.
- the composite component according to the present invention can easily change the inductance / condenser capacitance of the coil. Therefore, a filter having a cut-off frequency over a wide frequency range can be easily manufactured.
- the composite component of the present invention can easily form a plurality of capacitor elements in the same lamination plane as shown in FIG. For this reason, it is easy to produce, different from the conventional laminated type composite parts, and it has the characteristic that various types of LC filters can be created with slight changes such as changes in printing notation. are doing.
- the composite component having the shape of a surface mount component in which terminals are directly formed on the end face of the component has been described. It can also be a composite part.
- the insulator layer 6 and the dielectric layer 4 can be formed by a green sheet molding method, a printing method, a dive method, a powder molding method, a spin coating method, or the like.
- the paste or slurry for forming each layer is prepared by mixing powder having desired properties, a sintering aid or an inorganic binder, a binder resin, and, if necessary, a plasticizer and a dispersant in a solvent. , Manufactured in a dispersed manner.
- the firing temperature range of the capacitor is in the range of 800 to 1300C.
- the conductor material that can be used changes depending on the firing temperature. For example, when silver is used as the conductor material, the firing temperature of composite parts is limited to about 900 ° C. When silver-palladium alloy is used as the conductor material, the composite part can be fired at 950 ° C. If it is necessary to bake composite parts at higher temperatures, nickel, nickel, or copper may be used as the conductor material. Radium must be used.
- Example 1 Example 1
- the dielectric slurry was coated on a PET film using a blade core and dried to produce a dielectric green sheet having a thickness of 0.2 mm. Further, commercially available silver paste was screen-printed on the dielectric green sheet to form electrode layers 5 and 5.
- a dielectric green sheet 4 on which the above-mentioned electrode layers 5, 5 are formed, and a dielectric Darine sheet on which no electrode layer is formed instead of the insulating layer 6, are laminated as shown in FIG.
- the body was pressed by heating under the conditions of a temperature of 100 and a pressure of 50 OK g Z cm 2 .
- the above-mentioned dielectric green sheet was fired at 900 ° C. for 2 hours and cored.
- a capacitor element was manufactured. Copper plating was performed on the entire surface of the obtained capacitor element by the nm plating method and the barrel plating method to form a copper film on the entire surface of the capacitor element.
- the copper film formed on the entire surface of the capacitor element was irradiated with a laser to form a spiral conductor as shown in Fig. 1, and a coil integrated with the terminal was formed. By forming this coil, the composite part of the present invention was completed.
- the composite part obtained here was measured for various characteristics using an impedance analyzer and a network analyzer, and as a result, excellent characteristics were measured.
- Example 2
- Example 1 the electrode layer was formed, and the composite component was formed in the same process as in Example 1 except that the green sheet of dielectric was used as layer 6 instead of the dielectric green sheet. Was manufactured.
- the ferrite green sheet was manufactured by the following process.
- NiZnCu-based filler powder 100 g of NiZnCu-based filler powder, 8 g of butyral resin, 4 g of butyl benzyl phthalate, 24 g of methyl ethyl ketone and 24 g of butyl acetate were mixed and dispersed in a pot mill. Thus, a ferrite slurry was produced.
- the ferrite slurry was coated on a PET film using a blade coater to produce a 0.2-mm thick bright green sheet.
- Example 2 the shape of the electrode 5 formed on the dielectric layer 4 was changed to a two-part shape shown in FIG. 4A, and the shape of the electrode 5 ′ was taken out from the center of the component as shown in FIG. 4B. As a result, a composite component having a 7 ⁇ filter circuit was manufactured.
- Example 2 the shape of the electrode layer 5 formed on the dielectric layer 4 was changed to the shape shown in FIG. 5, and as shown in FIG. 6, a composite component having a terminal structure at the center of the composite component was manufactured.
- the conductor 2 of the coil was electrically connected to the lead-out portion of the electrode 5 in FIG. 5A, and the terminal 3 ′′ at the center was connected to the lead-out portion of the electrode layer 5 in FIG. 5B.
- a composite component having a T-type filter circuit was obtained.
- FIG. 7 is a conceptual diagram showing the structure of the composite component according to the second embodiment of the present invention.
- the composite part in FIG. 7 includes a coil 8 and a capacitor 9, and extraction electrodes 11 1, 1 ⁇ , and 11 ′′ to be connected to external terminals are formed at both ends and the middle of the composite part. As in the case of Embodiment 1, it is formed in close contact with the layer 10.
- the coil 8 has a portion other than the lead-out electrodes 1 ⁇ and 11 ′′ covered with an insulating material, as in the case of Embodiment 1. Is also good.
- the capacitor 9 is formed of the insulating layer 10 and the electrode layers 5, 5 'formed thereon.
- the surface of the electrode layers 5, 5 ' is also connected to the extraction electrode 1 as in the case of the coil. Parts other than 1, 1 mm may be covered with an insulating material.
- Both ends of the conductor 2 constituting the coil 8 are connected to lead electrodes 1, 11 ′′, and similarly, the electrode layers 5, 5 ′ of the capacitor 9 are connected to lead electrodes 11, 1 1.
- the method of manufacturing the conductor 2 constituting the coil and the terminals 3, 3 ', 3 "of the composite component is the same as in Embodiment 1.
- the internal capacitor and the lead electrode are manufactured, and then the entire element is manufactured. It can be manufactured by patterning after forming a conductor on the surface.
- the surface of terminal 3, 3 ', 3 " is further plated with nickel plating layer, intermediate layer and tin or its alloy.
- the drawer electrode 12 is pulled out from the electrode 5 as shown in FIG. 9 and connected to the middle point of the conductor 2 forming the coil 8 as shown in FIG.
- a type of filter circuit can be manufactured.
- the extraction electrode 12 is extracted from the electrode 5, connected to the extraction electrode 1 ⁇ ⁇ ⁇ ⁇ , and the extraction electrode 1 ⁇ 'is extracted from the electrode 5 ′, whereby a 7 ⁇ filter circuit can be manufactured. .
- FIG. 11 schematically shows a structure of a composite part according to a third embodiment of the present invention.
- the composite part according to the present embodiment has an insulating layer 6 composed of a plurality of layers, a coil 8 composed of a conductor 2 closely formed around the insulating layer 6, a dielectric layer 4, and electrode layers 5, 5 ' And a capacitor 9 composed of these components.
- Both ends of the conductor 2 forming the coil 8 are connected to the extraction electrodes 11 1, 1 ⁇ , and the electrode layers 5, 5 ′ constituting the capacitor are connected to the extraction electrodes 1 ⁇ ′, 1 ⁇ ⁇ ⁇ ⁇ , respectively.
- the extraction electrodes 11 1, 1, and 1 ⁇ ′ are connected to the terminals 3, 3 *, and 3 ′′ of the composite component according to the present embodiment, respectively, as shown in FIG. 12.
- the surface of the composite component other than the terminals 3, 3 'and 3' ' may be covered with the outer insulating layer 7.
- FIG. 11 shows the insulating layer 6 having a plurality of layers
- the insulating layer 6 may be a single layer as long as the insulating layer has a strength enough to withstand a process for manufacturing a coil. Good.
- the materials used in the present embodiment are the same as those in the first embodiment.
- the extraction electrodes 11 1, 11, and 11 ′′ are respectively connected to the terminals 3, 3 ′, and 3 ′′ of the composite component according to the present embodiment shown in FIG. In FIG. 8, portions other than the terminals 3, 3 ', and 3 "are covered with the exterior insulating material 7.
- Materials, processes, outer layers, and the like used in the present embodiment are the same as those in the first and second embodiments.
- the manufacturing method of the conductor 2 constituting the coil is the same as that of the embodiment 1.
- the insulating layer 6 made of a magnetic material or a non-magnetic material is laminated and implemented around the same.
- a coil is formed in the same manner as in Embodiment 1. Thereafter, a composite component can be manufactured by laminating it with a separately laminated capacitor 9.
- the biggest difference between this embodiment and the conventional laminated composite parts is that the same design rules The ability to manufacture many types of coils and capacitors, and the high Q of the coils. That is, the magnetic flux direction of the coil of the present embodiment is different from the magnetic flux direction of the conventional printing-type laminated coil by 90 degrees. For this reason, it is easy to make the cross-sectional area and length of the magnetic material used for the coil larger than that of the conventional printed-type laminated coil, so that a high Q can be obtained.
- Fig. 11 constitutes an L-type filter circuit
- Fig. 13 shows another L-type filter circuit.
- FIG. 14 by extracting the extraction electrode 12 from the electrode 5 and connecting it to the midpoint of the conductor 2 forming the coil 8, a T-type filter circuit can be manufactured.
- electrode 5 is divided into two parts,
- a composite part having various types of filter circuits and having excellent characteristics can be obtained efficiently and easily, and the present invention has extremely high industrial value.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coils Or Transformers For Communication (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69936827T DE69936827T2 (de) | 1998-03-13 | 1999-03-11 | Baugruppe und verfahren zur herstellung |
EP99909182A EP0982742B1 (en) | 1998-03-13 | 1999-03-11 | Module and method of manufacture |
US09/423,806 US6825748B1 (en) | 1998-03-13 | 1999-03-11 | Module and method of manufacture |
CNB99800278XA CN100378877C (zh) | 1998-03-13 | 1999-03-11 | 复合元件及其制造方法 |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6280498 | 1998-03-13 | ||
JP10/62804 | 1998-03-13 | ||
JP11030943A JPH11329852A (ja) | 1998-03-13 | 1999-02-09 | 複合部品およびその製造方法 |
JP11/30943 | 1999-02-09 | ||
JP3667899A JP2000235921A (ja) | 1999-02-16 | 1999-02-16 | 複合部品およびその製造方法 |
JP11/36679 | 1999-02-16 | ||
JP11/36678 | 1999-02-16 | ||
JP3667999A JP2000235936A (ja) | 1999-02-16 | 1999-02-16 | 複合部品およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999046784A1 true WO1999046784A1 (fr) | 1999-09-16 |
Family
ID=27459349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/001179 WO1999046784A1 (fr) | 1998-03-13 | 1999-03-11 | Module et procede de fabrication correspondant |
Country Status (5)
Country | Link |
---|---|
US (1) | US6825748B1 (ja) |
EP (1) | EP0982742B1 (ja) |
CN (1) | CN100378877C (ja) |
DE (1) | DE69936827T2 (ja) |
WO (1) | WO1999046784A1 (ja) |
Cited By (3)
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WO2006035623A1 (ja) * | 2004-09-28 | 2006-04-06 | Aisin Seiki Kabushiki Kaisha | アンテナ装置及びドアハンドル装置 |
KR20140060538A (ko) * | 2011-08-31 | 2014-05-20 | 렉스마크 인터내셔널, 인코포레이티드 | 인쇄 회로 기판용의 z-방향 부품을 제조하기 위한 스핀 코팅 공정 |
US11390005B2 (en) | 2011-10-28 | 2022-07-19 | Lexmark International, Inc. | Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board |
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JP4844045B2 (ja) * | 2005-08-18 | 2011-12-21 | Tdk株式会社 | 電子部品及びその製造方法 |
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US9767953B2 (en) * | 2014-12-16 | 2017-09-19 | Abc Taiwan Electronics Corp. | Common mode filter and core thereof |
JP6593209B2 (ja) * | 2016-02-05 | 2019-10-23 | 株式会社村田製作所 | 電子部品 |
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US10897068B2 (en) | 2017-09-19 | 2021-01-19 | D-Wave Systems Inc. | Systems and devices for filtering electrical signals |
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CN111145996A (zh) | 2018-11-02 | 2020-05-12 | 台达电子企业管理(上海)有限公司 | 磁性元件的制造方法及磁性元件 |
US11839164B2 (en) | 2019-08-19 | 2023-12-05 | D-Wave Systems Inc. | Systems and methods for addressing devices in a superconducting circuit |
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- 1999-03-11 CN CNB99800278XA patent/CN100378877C/zh not_active Expired - Fee Related
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006035623A1 (ja) * | 2004-09-28 | 2006-04-06 | Aisin Seiki Kabushiki Kaisha | アンテナ装置及びドアハンドル装置 |
US7679571B2 (en) | 2004-09-28 | 2010-03-16 | Aisin Seiki Kabushiki Kaisha | Antenna device and door handle device |
KR20140060538A (ko) * | 2011-08-31 | 2014-05-20 | 렉스마크 인터내셔널, 인코포레이티드 | 인쇄 회로 기판용의 z-방향 부품을 제조하기 위한 스핀 코팅 공정 |
KR101941960B1 (ko) | 2011-08-31 | 2019-01-24 | 렉스마크 인터내셔널, 인코포레이티드 | 인쇄 회로 기판용의 z-방향 부품을 제조하기 위한 스핀 코팅 공정 |
KR20190011812A (ko) * | 2011-08-31 | 2019-02-07 | 렉스마크 인터내셔널, 인코포레이티드 | 인쇄 회로 기판용의 z-방향 부품을 제조하기 위한 스핀 코팅 공정 |
KR102023312B1 (ko) | 2011-08-31 | 2019-09-19 | 렉스마크 인터내셔널, 인코포레이티드 | 인쇄 회로 기판용의 z-방향 부품을 제조하기 위한 스핀 코팅 공정 |
US11390005B2 (en) | 2011-10-28 | 2022-07-19 | Lexmark International, Inc. | Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
CN100378877C (zh) | 2008-04-02 |
EP0982742A1 (en) | 2000-03-01 |
DE69936827D1 (de) | 2007-09-27 |
DE69936827T2 (de) | 2007-12-06 |
EP0982742A4 (en) | 2002-03-20 |
US6825748B1 (en) | 2004-11-30 |
EP0982742B1 (en) | 2007-08-15 |
CN1258373A (zh) | 2000-06-28 |
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