WO1997008746A1 - Recipient contenant des galettes de semiconducteur, structure contenant des galettes de semiconducteur et procede d'introduction et d'extraction de galettes de semiconducteur - Google Patents
Recipient contenant des galettes de semiconducteur, structure contenant des galettes de semiconducteur et procede d'introduction et d'extraction de galettes de semiconducteur Download PDFInfo
- Publication number
- WO1997008746A1 WO1997008746A1 PCT/JP1996/002441 JP9602441W WO9708746A1 WO 1997008746 A1 WO1997008746 A1 WO 1997008746A1 JP 9602441 W JP9602441 W JP 9602441W WO 9708746 A1 WO9708746 A1 WO 9708746A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor wafers
- container
- wafer
- spacer sheet
- storage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
Definitions
- the present invention relates to a disk-shaped semiconductor wafer storage container, a storage structure, and a semiconductor wafer storage/removal method, and in particular, prevents damage to semiconductor wafers due to impact during transportation and prevents static electricity from being generated due to friction. It relates to a storage container, storage structure, and storage/removal method.
- a semiconductor wafer (hereafter simply referred to as a "wafer”) is generally a silicon single crystal ingot cut into a thin disc, with a diameter of about 2 to 8 inches, for example.
- a large number of circuits such as LSIs are formed on the surface of this wafer, this wafer is cut into chips, and then these chips are packaged to manufacture semiconductor devices such as LSIs.
- Containers are commonly used to transport wafers from one process site to another process site.
- electrostatic breakdown on the surface of a wafer on which circuits are formed often leads to a decrease in yield, special consideration is given to storing the wafer in the storage container.
- Another object of the present invention is to solve the above-mentioned various problems, and to provide a wafer storage structure that takes measures to prevent physical and electrical damage to wafers due to impacts during transportation. It is to be.
- Still another object of the present invention is to remove the wafer and the spacer sheet in order from the storage container as a result of the wafers and the spacer sheets coming into close contact (that is, tight) in the storage container. when both are one To provide a wafer storage structure capable of preventing the inconvenience of becoming distorted.
- Still another object of the present invention is to provide a method for loading and unloading wafers into and out of a dedicated storage container that is compatible with an automatic control mechanism.
- a container for storing wafers is characterized by comprising a container body having a cylindrical portion in which a large number of wafers are stacked and stored via a spacer sheet, and a lid covering the container body. do.
- the cylindrical portion can have at least one slit into which the pick-up arm can enter to facilitate storage and/or removal of the wafer.
- the container main body includes a base having a square shape in a plan view, and the cylindrical portion is erected on the base, and the lid has a plan view substantially the same as the plan view shape of the base of the container main body.
- the lid body and the container body have a square shape, and the lid body and the container body engage with each other by relative rotation so that the shapes of both of them when viewed in a plan view match each other.
- the surface resistance of the storage container is 10 ⁇ ⁇ ⁇ or less.
- the storage container can typically be manufactured by integral molding using conductive plastics to which a conductive filler is added or conductive plastics treated with polymer alloy.
- the wafer storage structure of the present invention is characterized in that a large number of wafers are stacked and stored in a container body via spacer sheets. Here, in order to protect the wafers from impact, end cushion materials can be arranged at the upper and lower ends of the wafers stacked and stored.
- the container body in the wafer storage structure of the present invention it is preferable to use the container body of the wafer storage container described above.
- the spacer sheet is usually made of paper, synthetic paper, synthetic resin film, synthetic resin foam sheet, or the like.
- the spacer sheet may or may not be electrically conductive.
- its surface resistance is preferably 1060 ° or less.
- a conductive spacer sheet a fiber compounded with a conductive polymer such as polypyrrole or polyaniline, a polyolefin synthetic paper in which conductive fibers such as carbon fiber or metal-coated fiber are dispersed, or Films and foam sheets of polyethylene, polypropylene, polyethylene terephthalate, etc., to which the above conductive fillers and antistatic agents are added can be used.
- the spacer sheet may have a single-layer structure such as the above-mentioned synthetic paper, or may have a laminated structure such as the above-mentioned synthetic paper. etc., it is preferable.
- Synthetic paper using polypyrrole-composite fibers is preferable in terms of ease of conductivity control, durability, and the like.
- the spacer sheet has an air permeability (J!s P8117) force of 1800 seconds Z 100 cc or less, smoothness (JISP 8119) of 10 seconds or less, dust generation (Japan CIC Co., Ltd. method) is preferably 200 particles of 0.5 ⁇ m or more, 100 mm x 100 mm or less.
- the storage container is sometimes vacuum-packaged from the standpoint of dust prevention. Since the wafer has an extremely smooth surface, the spacer sheet and the wafer may be in intimate (ie, tight) contact with substantially no air between the two.
- the spacer sheet can be made to have a structure that does not originally cause a state of close contact with the wafer, and even if a state of close contact with the wafer occurs, It is possible to provide a structure in which this close contact state can be easily released.
- the spacer sheet is arranged so as to have a plurality of concave portions and convex portions on at least one surface thereof, or the spacer sheet is cut inwardly from the periphery of the spacer. It can be formed to have a straight cutline.
- the formation of the concave portion or the convex portion can typically be formed by embossing.
- the cut line can typically be formed by cutting with a cutter or by punching the cut line with a width.
- Soft polyurethane foam polyethylene foam, polypropylene foam, polystyrene foam and the like can be used as the material for the end cushion material.
- closed-cell foam is used to prevent dust from entering.
- Soft polyurethane is preferred in terms of cushioning properties.
- the end cushion material can also be made conductive, and its surface resistance is preferably 1011 ⁇ /mouth or less. If the end cushion material is not conductive, it is preferable to provide a conductive spacer sheet between the uppermost wafer and the lowermost wafer. In the storage structure of the present invention, end cushion materials are provided at the upper and lower ends of the spacer sheets and wafers stacked alternately as described above to hold them.
- the end cushioning material it is preferable to adopt a material having a compressive stress (10%) of about 0.01 to 0.6 kg/cm.
- a material having a compressive stress (10%) of about 0.01 to 0.6 kg/cm.
- the wafers and the spacer sheets are alternately stacked and stored in the wafer storage container, and end cushion materials are provided at the upper and lower ends thereof. be provided. Therefore, impacts applied to the wafer storage container due to vibrations during transportation are absorbed by the end cushion material, and the wafers are protected from the impacts.
- a conductive spacer sheet is used, vibrations during transportation may cause friction between the wafer and the spacer sheet or between the wafer and the edge cushion material. Even if static electricity is generated, static electricity will not be generated, and even if it is generated, it will not remain inside the storage container. Therefore, there is no problem that the circuits formed on the wafer are damaged by static electricity. Furthermore, the stacked spacer sheets and wafers are placed in the storage container. By holding the wafers from above and below, the wafers are stably held in the storage container without causing mutual displacement. Therefore, damage due to contact of the wafers with the inner surface of the storage container and generation of static electricity due to friction between the wafers can be more efficiently suppressed.
- the wafer storage and extraction method of the present invention uses one or two pickup arms to move a container body (for example, a wafer storage device of the present invention) having a cylindrical portion having at least one slit.
- a method for storing and unloading wafers in which a wafer and a spacer sheet are stored in the cylindrical portion of a container (container body) or taken out from the cylindrical portion, and is applied to an automatic control mechanism. .
- the pick-up arm When one pick-up arm is used, the pick-up arm enters the at least one slit, and alternately stores the wafer and the spacer sheet in the cylindrical portion, or Remove from inside.
- the two pickup arms when two pickup arms are used, one of these pickup arms enters the slit. The other of the two pickup arms enters the same slit as the slit into which the one pickup arm enters or a different slit. Then, the two pickup arms alternately store the wafer and the spacer sheet in the cylindrical portion or take them out from the cylindrical portion.
- FIG. 1 is a partially broken perspective view showing an example of a container for storing wafers according to the present invention.
- FIG. 2 is a side view showing a half section of the wafer storage container of FIG. 1.
- FIG. 3 is a perspective view showing an example of the storage structure of the present invention.
- FIG. 4 is a schematic side cross-sectional view of the storage container in the wafer storage state in FIG. 3.
- FIG. 4 is a schematic side cross-sectional view of the storage container in the wafer storage state in FIG. 3.
- FIG. 5 is a partially enlarged sectional view showing a holding state of a wafer in the housing structure of the present invention.
- FIG. 6(A) is a diagram illustrating a spacer sheet having a structure that does not originally cause a state of contact with the wafer, or a structure that easily releases the state of contact with the wafer even if the state of contact with the wafer occurs. , shows a spacer sheet with an embossed surface.
- FIG. 6(B) is a diagram illustrating a spacer sheet having a structure that does not originally cause the contact state with the wafer, or a structure that easily releases the contact state even if the contact state with the wafer occurs. , shows a spacer sheet in which multiple cut lines are cut from the periphery to the inside.
- FIG. 7 is a perspective view showing a schematic configuration of a transfer system to which the wafer storage/removal method of the present invention is applied.
- FIG. 8 is a schematic diagram showing a state before wafers are stored in a container by the transfer system of FIG.
- FIG. 9 is a schematic diagram showing a state in the middle of housing a wafer in a container by the transfer system of FIG.
- FIG. 10 is a schematic diagram showing a state after wafers are accommodated in a container by the transfer system of FIG. Preferred embodiment
- FIG. 1 is a perspective view showing an example of a wafer storage container (hereinafter referred to as "wafer storage container”) with a part broken away
- FIG. 2 is a side view showing the wafer storage container in half section.
- the wafer storage container 1 is composed of a cylindrical container body 2 with a bottom that can accommodate a large number of disk-shaped wafers stacked, and a lid 3 that covers the container body 2.
- the container body 2 has a cylindrical portion 2b projecting from a square-shaped base portion 2a, and a large number of wafers are stacked and stored in a storage space 2e formed by the cylindrical portion 2b. be done.
- the inner diameter of the cylindrical portion 2b is formed to be several millimeters larger than the diameter of the wafer to be accommodated.
- the cylindrical portion 2b is formed with four slits 2c to 2c4 in the circumferential direction from the distal end to the proximal end. These slits 2C1 to 2C4 have a width dimension that allows a pick-up arm of a transfer opening bot in a storage/removal system to be described later to enter.
- the position of the slit is preferably at the center of one side of the base part, because the stroke of the pickup arm is shortened. Of course, depending on the system, it may be located diagonally to the base.
- inclined stepped portions 2d constituting partial threads are formed at approximately equal intervals on the outer peripheral surface of the upper end of the cylindrical portion 2b. It is aligned with the inclined groove 3e formed on the inside of the container at a twisted position, and the two are brought into an engaged state by slight rotation of the container body 2 or the lid body 3.
- the upper surface of the base portion 2a of the container body 2 (inner surface on the container side) has an uneven shape in which a plurality of concentric reinforcing ribs protrude. It is located on the surface so that the wafer can be placed horizontally.
- the lid body 3 has a regular quadrangular prism shape as a whole, and is composed of a cylindrical portion 3a and a rectangular cylindrical portion 3b circumscribing the cylindrical portion 3a.
- the cylindrical portion 3a covers the cylindrical portion 2b of the container body 2, and the lower end thereof covers the base portion 2a of the container body 2, leaving a part thereof.
- the cylindrical portion 3a serves as a guide means or the like when the lid 3 and the container body 2 are attached and detached.
- a circumferential groove 3d for receiving the upper end of the cylindrical portion 2b of the container body 2 is formed on the ceiling surface of the lid 3, and a concentric circle is formed at a position corresponding to the storage space 2e of the container body 2.
- a plurality of ribs and projections (hereinafter simply ribs 3c) are formed in a downward protruding manner. With the lid 3 attached to the container body 2, these ribs 3c, as shown in FIG. However, in constructing the present invention, it is sufficient that the upper portion of the stack of wafers is pressed downward by the inner surface side of the lid 3, and the rib 3c is provided and this is accommodated. Getting into space 2e is not an essential requirement.
- the lid 3 is detachably attached to the container body 2 by engaging the inclined stepped portion 2d of the cylindrical portion 2b and the inclined groove 3e in the circumferential groove 3d. That is, the lid body 3 is placed on the cylindrical portion 2b at a twisted position with respect to the container body 2, and rotated by a predetermined angle (15. to 45°) to tilt. While progressing toward the container body 2 by the angle of inclination of the oblique groove 3e, it is gradually tightened and fixed.
- the lower surface of the container body 2 is recessed inward so as to receive the upper portion of the lid 3, so that a large number of wafer storage containers 1 can be stacked vertically.
- a conductive polypropylene resin having a volume resistance of 200 Q ⁇ cm and a surface resistance of 100 ⁇ or less is used as the material for the wafer storage container 1 .
- FIG. 3 is a perspective view showing a state in which wafers are stored in the container body 2
- FIG. 4 is a longitudinal sectional view of the container body 2 in the state in which the wafers are stored
- FIG. 3 is a partially enlarged sectional view of FIG. 2;
- a large number of wafers 4 are stacked and stored in the storage space 2e of the container body 2, and a spacer sheet (single-layer conductive sheet in FIG. 3) 5 is placed between the wafers 4. is intervened.
- Wafers are generally 2 inches (approximately 50 mm) to 8 inches (approximately 200 mm) in diameter and 350, 500, 750 ⁇ m thick, etc., for various purposes. There are various sizes, but in the example, an 8-inch size with a thickness of 350 ⁇ was adopted.
- the wafer storage container 1 shown in the embodiment is designed according to this wafer size and can store 25 wafers.
- the spacer sheet 5 prevents the wafers 4 from coming into direct contact with each other when the wafers 4 are stacked, thereby preventing scratches due to friction between the wafers and preventing static electricity from being generated between the wafers 4. acts as an inhibitor. Therefore, the spacer sheet 5 is made of a soft material with a surface resistance of 100 ⁇ or less. preferably. In this embodiment, the spacer sheet 5 is made of polyolefin synthetic paper having a stiffness of 80 mm or less, and is formed to have a thickness of 230 ⁇ m and a diameter of 200 mm.
- the spacer sheet 5 since the wafer must be kept clean, the spacer sheet 5 must be less dusty.
- the end cushion materials 6A, 6B are arranged at the top and bottom of the storage space 2e of the container body 2. As shown in FIG. That is, the end cushion materials 6A and 6B are arranged by alternately stacking the wafers 4 and the spacer sheets 5 described above and sandwiching the stack between both ends.
- the end cushion materials 6A, 6B prevent the stacked wafers 4 from directly contacting the base 2a of the container body 2 and the rib 3c on the top surface of the lid 3.
- the end cushioning materials 6A, 6B have a moderate impact absorbing power, and even if the wafer storage container 1 receives an impact, it absorbs the impact, and the wafer 4 side has a It works without telling.
- the end cushion materials 6A and 6B have a surface resistance of 8 ⁇ 1011 ⁇ /mouth or less, a static voltage decay time (50%) of 1.4 seconds or less, and a density of (JISK 6401) 27 kgZm3 , hardness (JISK 6401) 6.5 kgf, impact resilience (JISK 6402) 40%.
- the one processed to have a diameter of 200 mm and a thickness of 15 mm was used.
- the resilience of an iron polyurethane foam sheet used as an end cushion material is preferably about 20 to 60%.
- 25 wafers 4 are stacked with spacer sheets 5 interposed as described above.
- the end cushion members 6A and 6B placed on the upper and lower ends of the stack, they are housed in the storage space 2e of the container body 2 as shown in FIG.
- the container body 2 is covered with the lid 3, and the wafer 4 is accommodated so as to be transportable and storable.
- the rib 3c formed on the top surface of the lid body 3 gives a pressing force to the end cushion material 6A.
- the lid 3 when the lid 3 is placed on the container body 2 in a twisted position, the ribs 3c come into contact with the end cushion material 6A at this position, and the lid 3 is rotated. , the inclined stepped portion 2d on the container body 2 side deeply engages with the inclined groove 3e on the lid body 3 side. As the cover body 3 progresses in the stacking direction, the rib 3c gradually presses the end cushion members 6A and 6B downward (see white arrows in FIG. 5). When the lid 3 is completely attached to the container body 2, the upper and lower end cushion members 6A and 6B shrink in thickness by about 10%, and the stress generated by this shrinks. As a result, the wafer 4, the spacer sheet 5 and the end cushion members 6A, 6B are stably held in the wafer storage container 1. As shown in FIG.
- the spacer sheet 5 has a structure that originally does not cause a state of close contact with the wafer 4 as shown in FIGS. It is possible to use a structure that allows the close contact to be easily released.
- FIG. 6(A) shows the space having the above configuration with embossed 51 formed on the surface.
- a seat 5 is shown.
- the embossing 51 is not limited to being formed on the spacer sheet 5 having the above configuration, and can also be formed on a non-conductive spacer sheet.
- the pattern of the embossing 51 does not originally cause a state of close contact with the wafer 4, or even if a state of close contact with the wafer occurs, it is possible to easily release the state of close contact. It may be a pattern (for example, a dotted pattern shown in FIG. 6(A), or a radial, striped, or grid pattern extending from the center of the sheet to the periphery).
- the apparent thickness of the sheet after embossing is about 1.1 to 3 times the thickness of the sheet material before embossing. is preferably In the case of using an embossed spacer sheet, it is possible to increase the cushioning effect of the spacer sheet on the wafer.
- the entire container 1 is vacuum-packaged, and then unwrapped and removed from the storage container 1.
- a test of taking out the wafer 4 was performed, but the wafer 4 and the spacer sheet 5 were not brought into close contact with each other, and there was no problem in taking out the wafer.
- the same test as above was performed using a spacer, but the wafer 4 and this spacer were not brought into close contact with each other.
- FIG. 6(B) shows the spacer sheet 5 having the above configuration in which a plurality of cut lines 52 are cut from the periphery to the inside.
- this cutout line 52 like the embossed case of FIG. It is not limited to forming the base sheet 5 .
- the pattern of the cut line 52 does not originally cause a state of close contact with the wafer 4, or even if a state of close contact with the wafer occurs, if the state of close contact with the wafer can be easily released, there is no problem. It may be a pattern (for example, a pattern from the periphery to the center shown in FIG. 6(B), or a pattern from the periphery to the inside in a spiral shape).
- the number of cut lines 52 is 2 to 36.
- FIG. 7 is a perspective view showing the schematic configuration of a wafer storage and extraction system
- FIGS. 8 to 10 are schematic diagrams showing the procedure for sequentially storing wafers in a wafer storage container by the system.
- a large number of wafers 4 are conveyed on a conveyor 7 and successively reach the step of storing them in containers.
- the container body 2 for storing the wafers 4 also reaches the storage step by another conveyor 8, and waits for the wafers 4 to be stored one by one.
- the transfer port bot 9 is installed between the conveyors 7 and 8 in the storage process, and has a vacuum suction part 9b at the tip of its pickup arm 9a.
- the wafer 4 conveyed on the conveyor 7 is vacuum-sucked by the vacuum-sucking part 9 b and housed in the container body 2 .
- the transport robot 10 has the same configuration as the transport robot 9, and can accommodate the spacer sheet 5 and the end cushion materials 6A, 6B which are transported on a conveyor (not shown). It is transported into the container body 2 and stored.
- the empty container body 2 transported on the conveyor 8 is first filled with end cushioning material by the transport robot 10 or manually. 6 B is stored.
- Spacer sheet 5 is sucked by the vacuum suction part 10b of the transfer robot 10 and stored in the storage space 2e of the container body 2 from above.
- the arm 10a can insert the adsorbed spacer sheet 5 to the bottom of the storage space 2e by means of a slit formed in the container body 2 (indicated by reference numeral 2c1 in FIG. 7). becomes.
- the pick-up arm 1 Oa of the transfer robot 10 releases the suction state of the vacuum suction part 10b, releases the spacer sheet 5, and lifts it onto the end cushion material 6B. After placing it, it returns to the initial position.
- the transfer robot 9 operates to pick up the wafer 4 on the conveyor 7 (see the pick-up arm 9a indicated by the dashed line in FIG. 8), and after moving it above the container body 2 (the solid line in FIG. 8). (see the pickup arm 9a shown), the tip of the pickup arm 9a is lowered into the storage space 2e, and is positioned close to the stored spacer sheet 5 (or brought into surface contact with the spacer sheet 5). position), release the adsorption of the wafer 4 (see FIG. 9).
- the pick-up arm 9a of the transfer robot 9 can be lowered by a slit (indicated by 2c3 in FIG. 7) different from the slit 2c] of the container body 2. becomes.
- the lowering control of the pickup arm 9a in the storage space 2e is performed by measuring the distance from the spacer sheet 5 using a distance sensor (optical sensor, etc.) provided in the vacuum suction unit 9b, and moving the pickup arm 9a to the set position. can be controlled to stop the tip of the pickup arm 9a.
- a torque sensor may be provided at the joint of the pickup arm 9a to detect the torque when the wafer 4 contacts the spacer sheet 5, and to control the stop of the pickup arm 9a.
- the spacer sheet 5 is placed on the wafer 4 in the container body 2 by the transfer robot 10 in a similar manner. layered on.
- end cushion material 6A is finally placed by transfer robot 10 or manually. It is stored and the storage work is completed.
- the container body 2 is conveyed by the conveyor 8, and the lid 3 is attached in the next process to complete the wafer storage.
- the mounting of the lid body 3 can be automated together with the wafer storage process, or can be done manually by a worker. Also, the wafer 4 and the spacer sheet 5 can be individually moved by the same robot, or they can be stored manually.
- the step of unloading the wafers 4 stored in the wafer storage container is achieved by performing the storage step in reverse.
- the pickup arms 9a, 10a are controlled by measuring the distance to the uppermost wafer 4 or the spacer sheet 5 in the stack, using a distance sensor, and controlling the pickup arms 9a, 10a. Although the tip of a is stopped at the position of the uppermost wafer 4 or spacer sheet 5 of the stack, the following control can also be performed.
- the container main body 2 is placed on a table of a mechanism that moves downward or upward by the thickness of the wafer 4 or spacer 5 .
- the position of the uppermost wafer 4 or spacer sheet 4 in the stack is always held at a constant height.
- the pickup arms 9a and 10a are always at the same height, and the wafer 4 and the spacer sheet 5 can be stored and taken out.
- the container body 2, the wafers 4, and the like are accurately position-controlled and transported by the respective conveyors and the transport robot. Accidents such as contact with b and damage due to this will not occur.
- the wafer By forming a slit in the cylindrical portion of the storage container so that the pick-up arm of the automatic control mechanism can enter, the wafer can be easily stored in the cylindrical portion of the container, or the wafer can be easily removed from the cylindrical portion. be able to.
- the wafers are stored in the storage container by hand in the past, accidents such as the wafers coming into contact with the container and being damaged can be eliminated, and the work efficiency can be dramatically improved.
- the spacer sheets interposed between the wafers are electrically conductive, static electricity will not be generated even if friction occurs between the wafers and the spacer sheets due to vibration during transportation. Even if it does, it will not stay in the container). Therefore, the circuits formed on the wafer are not damaged by static electricity.
- the spacer sheet has a structure that does not originally cause a state of close contact with the wafer, or a structure that easily releases the state of close contact with the wafer even if a state of close contact with the wafer occurs, it is possible to remove the wafer from the container. When the wafer is taken out, the wafer and the spacer sheet do not remain integrated, so that the wafer can be taken out smoothly.
- the stacked wafers are stored in the container while being sandwiched between the elastic members, and impacts applied to the container due to dropping or vibration during transportation are absorbed by the elastic members and transmitted to the wafers. blocked and its physical destruction loss is prevented. Furthermore, by holding the laminated body composed of the elastic member, the spacer sheet, and the wafer in the container from above and below, the wafers are stably held in the container without mutual positional deviation, Therefore, damage due to contact of the wafer with the inner surface of the container and generation of static electricity due to friction can be further suppressed.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging For Recording Disks (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69637489T DE69637489T2 (de) | 1995-08-30 | 1996-08-30 | Halbleiterscheibenbehälter, struktur zur aufbewahrung von halbleiterscheiben und methode zum be- und entladen der halbleiterscheiben |
EP96928707A EP0789393B1 (en) | 1995-08-30 | 1996-08-30 | Container for housing semiconductor wafers, structure for housing semiconductor wafers, and method of putting in and taking out semiconductor wafers |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7/245277 | 1995-08-30 | ||
JP24527795 | 1995-08-30 | ||
JP20426196A JPH09129719A (ja) | 1995-08-30 | 1996-07-15 | 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法 |
JP8/204261 | 1996-07-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997008746A1 true WO1997008746A1 (fr) | 1997-03-06 |
Family
ID=26514373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1996/002441 WO1997008746A1 (fr) | 1995-08-30 | 1996-08-30 | Recipient contenant des galettes de semiconducteur, structure contenant des galettes de semiconducteur et procede d'introduction et d'extraction de galettes de semiconducteur |
Country Status (7)
Country | Link |
---|---|
US (1) | US6533123B1 (ja) |
EP (1) | EP0789393B1 (ja) |
JP (1) | JPH09129719A (ja) |
KR (1) | KR100446842B1 (ja) |
AT (1) | ATE392009T1 (ja) |
DE (1) | DE69637489T2 (ja) |
WO (1) | WO1997008746A1 (ja) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2785257B1 (fr) * | 1998-10-28 | 2001-01-19 | St Microelectronics Sa | Caisse pour plaquettes semiconductrices |
US6193090B1 (en) | 1999-04-06 | 2001-02-27 | 3M Innovative Properties Company | Reusable container |
US6848579B2 (en) * | 1999-10-25 | 2005-02-01 | Brian Cleaver | Shock absorbing apparatus and method |
US6662950B1 (en) | 1999-10-25 | 2003-12-16 | Brian R. Cleaver | Wafer shipping and storage container |
JP4330761B2 (ja) | 2000-04-17 | 2009-09-16 | 信越ポリマー株式会社 | ウェーハ輸送容器のサポート具 |
FR2819794B1 (fr) * | 2001-01-22 | 2003-09-05 | Excel Services Emballages Sa | Boite a fermeture controlee pour le conditionnement de plaquettes distinees a la fabrication de circuits integres |
JP2002324835A (ja) * | 2001-04-26 | 2002-11-08 | Fuji Electric Co Ltd | 薄板搬送治具 |
US20030056471A1 (en) * | 2001-07-12 | 2003-03-27 | Linker Frank V. | Wafer jar loader method, system and apparatus |
US7059475B2 (en) * | 2001-10-04 | 2006-06-13 | Entegris, Inc. | System for cushioning wafer in wafer carrier |
JP3751246B2 (ja) | 2001-11-13 | 2006-03-01 | 大日本スクリーン製造株式会社 | 薄膜形成装置および搬送方法 |
US7425362B2 (en) | 2002-09-06 | 2008-09-16 | E.Pak International, Inc. | Plastic packaging cushion |
JP2006507994A (ja) * | 2002-10-09 | 2006-03-09 | エンテグリス・インコーポレーテッド | デバイス処理システム用の高温高強度の着色可能な材料 |
US6886696B2 (en) * | 2003-01-15 | 2005-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd | Wafer container with removable sidewalls |
US6926150B2 (en) * | 2003-02-05 | 2005-08-09 | Texas Instruments Incorporated | Protective interleaf for stacked wafer shipping |
JPWO2004089784A1 (ja) * | 2003-04-10 | 2006-07-06 | アキレス株式会社 | ウエハ保護シート |
CN1845857A (zh) * | 2003-09-11 | 2006-10-11 | 日本瑞翁株式会社 | 隔板及使用该隔板的板状物的输送方法 |
US20050072121A1 (en) * | 2003-10-06 | 2005-04-07 | Texas Instruments Incorporated | Method and system for shipping semiconductor wafers |
US20050098473A1 (en) * | 2003-11-10 | 2005-05-12 | 3M Innovative Properties Company | Container for containing semiconductor wafers |
US20060000747A1 (en) * | 2004-06-30 | 2006-01-05 | 3M Innovative Properties Company | Shipping container for integrated circuit wafers |
US6933033B1 (en) * | 2004-07-13 | 2005-08-23 | Illinois Tool Works Inc. | Scribed interleaf separator wafer packaging |
US20060105498A1 (en) * | 2004-08-13 | 2006-05-18 | Cheng-Chung Huang | Wafer stack separator |
US7299927B2 (en) * | 2005-02-07 | 2007-11-27 | Peak Plastic & Metal Products (International) Limited | Stackable wafer container with raised handle and ribs |
JP5091321B2 (ja) * | 2007-10-12 | 2012-12-05 | デウォン セミコンダクター パッケージング インダストリアル シーオー.,エルティーディー | 互い違いの壁構造を有するウェハ容器 |
JP4838818B2 (ja) * | 2008-01-18 | 2011-12-14 | ミライアル株式会社 | クッションシート付ウエハ収納容器 |
US8556079B2 (en) * | 2009-08-26 | 2013-10-15 | Texchem Advanced Products Incorporated Sdn Bhd | Wafer container with adjustable inside diameter |
US8813964B2 (en) * | 2009-08-26 | 2014-08-26 | Texchem Advanced Products Incorporated Sdn. Bhd. | Wafer container with recessed latch |
US8109390B2 (en) | 2009-08-26 | 2012-02-07 | Texchem Advanced Products Incorporated Sdn Bhd | Wafer container with overlapping wall structure |
WO2012029217A1 (ja) * | 2010-08-30 | 2012-03-08 | シャープ株式会社 | 包装セット |
WO2012058676A2 (en) * | 2010-10-29 | 2012-05-03 | Entegris, Inc. | Substrate shipper |
CN103796933B (zh) | 2010-11-30 | 2016-12-14 | 康宁股份有限公司 | 玻璃板的包装和包装玻璃板的方法 |
JP5976307B2 (ja) * | 2011-12-06 | 2016-08-23 | アキレス株式会社 | ウェーハ保護クッション材の製造方法 |
US9543175B2 (en) | 2013-09-25 | 2017-01-10 | International Business Machines Corporation | Package assembly for thin wafer shipping and method of use |
JP6391324B2 (ja) * | 2014-06-30 | 2018-09-19 | アキレス株式会社 | ウエハ保護フィルム |
JP6514603B2 (ja) * | 2015-08-07 | 2019-05-15 | アキレス株式会社 | 基板収納容器 |
JP6545601B2 (ja) | 2015-10-23 | 2019-07-17 | アキレス株式会社 | セパレータ |
KR102229694B1 (ko) | 2017-02-06 | 2021-03-18 | 아키레스 가부시키가이샤 | 기판 수납 용기 |
US10870207B2 (en) * | 2017-12-14 | 2020-12-22 | Stmicroelectronics (Malta) Ltd | Barrel cap attach trays |
CN109524359B (zh) * | 2018-11-13 | 2020-06-19 | 常州信息职业技术学院 | 一种翻转夹持式芯片封装机构 |
WO2021159227A1 (zh) * | 2020-02-10 | 2021-08-19 | 东莞百瑞立塑胶五金有限公司 | 可旋转变换分隔空间的保存盒 |
KR102595526B1 (ko) | 2021-09-07 | 2023-10-30 | 주식회사 삼에스코리아 | 웨이퍼 이송 박스 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669328A (ja) * | 1992-08-15 | 1994-03-11 | Achilles Corp | 半導体ウェーハ収納容器 |
JPH06204315A (ja) * | 1992-12-25 | 1994-07-22 | Mitsubishi Materials Corp | 半導体ウェーハおよびその保管方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1427772A1 (de) * | 1965-11-23 | 1968-12-12 | Telefunken Patent | Verfahren zum Zerlegen einer Halbleiterscheibe in einzelne Halbleiterplaettchen |
US3392824A (en) * | 1966-04-27 | 1968-07-16 | Stanley F. Flynn | Packaging and cushioning device |
US4203127A (en) * | 1977-07-18 | 1980-05-13 | Motorola, Inc. | Package and method of packaging semiconductor wafers |
IT209910Z2 (it) * | 1987-02-06 | 1988-11-04 | Sgs Microelettronica Spa | Contenitore porta-wafer o fretta di slicio, utilizzato perl'immagazzinamento e/o spedizione sotto vuoto degli stessi. |
US4787508A (en) * | 1987-10-06 | 1988-11-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit wafer container |
US5270901A (en) * | 1991-11-08 | 1993-12-14 | Presstek, Incorporated | Charge-dissipating packaging system |
US5366079A (en) * | 1993-08-19 | 1994-11-22 | Taiwan Semiconductor Manufacturing Company | Integrated circuit wafer and retainer element combination |
US5553711A (en) * | 1995-07-03 | 1996-09-10 | Taiwan Semiconductor Manufacturing Company | Storage container for integrated circuit semiconductor wafers |
KR100432975B1 (ko) * | 1995-07-27 | 2004-10-22 | 닛토덴코 가부시키가이샤 | 반도체웨이퍼의수납·인출장치및이것에이용되는반도체웨이퍼의운반용기 |
US5551571A (en) * | 1995-09-18 | 1996-09-03 | Vanguard International Semiconductor Corp. | Semiconductor wafer container |
-
1996
- 1996-07-15 JP JP20426196A patent/JPH09129719A/ja active Pending
- 1996-08-30 AT AT96928707T patent/ATE392009T1/de not_active IP Right Cessation
- 1996-08-30 KR KR1019970702784A patent/KR100446842B1/ko active IP Right Grant
- 1996-08-30 WO PCT/JP1996/002441 patent/WO1997008746A1/ja active IP Right Grant
- 1996-08-30 EP EP96928707A patent/EP0789393B1/en not_active Expired - Lifetime
- 1996-08-30 DE DE69637489T patent/DE69637489T2/de not_active Expired - Lifetime
-
1997
- 1997-04-30 US US08/846,256 patent/US6533123B1/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669328A (ja) * | 1992-08-15 | 1994-03-11 | Achilles Corp | 半導体ウェーハ収納容器 |
JPH06204315A (ja) * | 1992-12-25 | 1994-07-22 | Mitsubishi Materials Corp | 半導体ウェーハおよびその保管方法 |
Also Published As
Publication number | Publication date |
---|---|
EP0789393A4 (en) | 2006-07-19 |
DE69637489D1 (de) | 2008-05-21 |
KR970707579A (ko) | 1997-12-01 |
EP0789393B1 (en) | 2008-04-09 |
EP0789393A1 (en) | 1997-08-13 |
JPH09129719A (ja) | 1997-05-16 |
US6533123B1 (en) | 2003-03-18 |
DE69637489T2 (de) | 2009-06-04 |
ATE392009T1 (de) | 2008-04-15 |
KR100446842B1 (ko) | 2004-12-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO1997008746A1 (fr) | Recipient contenant des galettes de semiconducteur, structure contenant des galettes de semiconducteur et procede d'introduction et d'extraction de galettes de semiconducteur | |
KR100432975B1 (ko) | 반도체웨이퍼의수납·인출장치및이것에이용되는반도체웨이퍼의운반용기 | |
CN107665844B (zh) | 晶片盒、将晶片布置在晶片盒中的方法、晶片保护板和保护晶片的方法 | |
JP4827500B2 (ja) | 梱包体 | |
US5553711A (en) | Storage container for integrated circuit semiconductor wafers | |
JP2910684B2 (ja) | ウエハー容器 | |
JP6427674B2 (ja) | 基板格納用の一体型コーナースプリングを備える水平基板コンテナ | |
US9382022B2 (en) | Packing insert for disc-shaped objects | |
KR20040019063A (ko) | 보호 적재용기 | |
US20110049006A1 (en) | Wafer container with recessed latch | |
EP1638864B1 (en) | Wafer box with radially pivoting latch elements | |
JP4329536B2 (ja) | 半導体ウェハーの収納具 | |
JP4335921B2 (ja) | 低コストウェファボックスの改良 | |
WO2017069205A1 (ja) | セパレータ | |
JP5721576B2 (ja) | 梱包体及び緩衝体 | |
JP4480296B2 (ja) | 電子部材用収納容器 | |
JP2004311779A (ja) | 半導体ウェーハ収納容器及び半導体ウェーハの搬送方法 | |
JP2009190735A (ja) | 半導体ウエハの収納容器 | |
JP4547712B2 (ja) | 半導体ウェハ包装部材 | |
JP7032086B2 (ja) | 板状物搬送容器 | |
CN112644847B (zh) | 干燥块结构以及存储装置 | |
JP2011077249A (ja) | ウエハー収納方法 | |
CN211088229U (zh) | 多片水平放置晶圆盒及隔离环 | |
KR200157451Y1 (ko) | 반도체 칩 저장용 트레이 | |
JP2017143217A (ja) | 基板収納容器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): KR SG US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1996928707 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1019970702784 Country of ref document: KR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWP | Wipo information: published in national office |
Ref document number: 1996928707 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1019970702784 Country of ref document: KR |
|
WWG | Wipo information: grant in national office |
Ref document number: 1019970702784 Country of ref document: KR |
|
WWG | Wipo information: grant in national office |
Ref document number: 1996928707 Country of ref document: EP |