FR2785257B1 - Caisse pour plaquettes semiconductrices - Google Patents

Caisse pour plaquettes semiconductrices

Info

Publication number
FR2785257B1
FR2785257B1 FR9813711A FR9813711A FR2785257B1 FR 2785257 B1 FR2785257 B1 FR 2785257B1 FR 9813711 A FR9813711 A FR 9813711A FR 9813711 A FR9813711 A FR 9813711A FR 2785257 B1 FR2785257 B1 FR 2785257B1
Authority
FR
France
Prior art keywords
semiconductor wafer
wafer box
box
semiconductor
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9813711A
Other languages
English (en)
Other versions
FR2785257A1 (fr
Inventor
Jean Luc Cubaud
Annabelle Bourguignon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR9813711A priority Critical patent/FR2785257B1/fr
Priority to PCT/FR1999/002641 priority patent/WO2000025348A1/fr
Publication of FR2785257A1 publication Critical patent/FR2785257A1/fr
Application granted granted Critical
Publication of FR2785257B1 publication Critical patent/FR2785257B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67366Closed carriers characterised by materials, roughness, coatings or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67369Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67386Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Buffer Packaging (AREA)
FR9813711A 1998-10-28 1998-10-28 Caisse pour plaquettes semiconductrices Expired - Fee Related FR2785257B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9813711A FR2785257B1 (fr) 1998-10-28 1998-10-28 Caisse pour plaquettes semiconductrices
PCT/FR1999/002641 WO2000025348A1 (fr) 1998-10-28 1999-10-28 Caisse pour plaquettes semiconductrices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9813711A FR2785257B1 (fr) 1998-10-28 1998-10-28 Caisse pour plaquettes semiconductrices

Publications (2)

Publication Number Publication Date
FR2785257A1 FR2785257A1 (fr) 2000-05-05
FR2785257B1 true FR2785257B1 (fr) 2001-01-19

Family

ID=9532242

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9813711A Expired - Fee Related FR2785257B1 (fr) 1998-10-28 1998-10-28 Caisse pour plaquettes semiconductrices

Country Status (2)

Country Link
FR (1) FR2785257B1 (fr)
WO (1) WO2000025348A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004063912B4 (de) * 2004-04-22 2007-09-20 Siltronic Ag Verfahren zum versandfertigen Verpacken von Halbleiterscheiben
DE102010005202B4 (de) * 2010-01-21 2020-04-09 Q-Cells Se Magazin für einen photovoltaischen Wafer- und/oder Zellstapel mit einem Magazineinsatz zur Aufnahme desselben

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754880A (en) * 1987-10-01 1988-07-05 Ncr Corporation Surface mount electronic device package
FR2663003B1 (fr) 1990-06-12 1992-09-11 Sgs Thomson Microelectronics Conteneur pour plaquette semiconductrice.
JP2552625B2 (ja) * 1993-11-09 1996-11-13 淀川化成株式会社 ガラス基板搬送用ボックス
JPH09129719A (ja) * 1995-08-30 1997-05-16 Achilles Corp 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法

Also Published As

Publication number Publication date
FR2785257A1 (fr) 2000-05-05
WO2000025348A1 (fr) 2000-05-04

Similar Documents

Publication Publication Date Title
DE69942361D1 (de) Rutil-Dielektrikum für Halbleiter-Bauelement
DE69943120D1 (de) Integrierte Halbleiterschaltung
DE69927658D1 (de) Integrierte Halbleiterschaltung
DE69940029D1 (de) Halbleiterbauelement
NO20012196D0 (no) Offshore senkekasse
DE69932472D1 (de) Halbleiter-Schmelzsicherung
DE69838566D1 (de) III-V-Verbindungshalbleiter-Scheibe
DE69909280D1 (de) Halbleiterspeicher
DE69904265D1 (de) Halbleiterlaser
IT1313979B1 (it) Cassetta di trasporto di wafer di semiconduttore
DE69918338D1 (de) Mikroelektronischer chip
DE69927476T2 (de) Halbleiteranordnung
DE69922427D1 (de) Halbleiterlaser
DE69905197D1 (de) Halbleiterlaser
DE69941898D1 (de) Halbleiter-relais
DE69941921D1 (de) Halbleitervorrichtung
DE19732625B4 (de) Halbleiter-Kleinpackung
DE69922575D1 (de) Halbleiterlaservorrichtung
DE69934504D1 (de) Halbleiterlaser
FR2785257B1 (fr) Caisse pour plaquettes semiconductrices
DE59912917D1 (de) Integrierter Halbleiterspeicher
DE59914101D1 (de) Halbleiter-schaltungsanordnung
KR970052858U (ko) 웨이퍼 캐리어 박스
KR970050329U (ko) 반도체 웨이퍼박스 포장구조
KR970056088U (ko) 반도체 패키지

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20070629