JP4335921B2 - 低コストウェファボックスの改良 - Google Patents
低コストウェファボックスの改良 Download PDFInfo
- Publication number
- JP4335921B2 JP4335921B2 JP2006537959A JP2006537959A JP4335921B2 JP 4335921 B2 JP4335921 B2 JP 4335921B2 JP 2006537959 A JP2006537959 A JP 2006537959A JP 2006537959 A JP2006537959 A JP 2006537959A JP 4335921 B2 JP4335921 B2 JP 4335921B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- wall
- wafer container
- container according
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D21/00—Nestable, stackable or joinable containers; Containers of variable capacity
- B65D21/02—Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
Description
Claims (19)
- トレイ要素とカバー要素とを具備する、半導体ウェファ用容器であって、
前記トレイ要素が、平面基盤と、前記平面基盤から立ち上がる外側の壁と、前記外側の壁から近接して内側に形成され、その中にウェファ収納領域を形成する内側の壁と、前記内側の壁と前記外側の壁との間に形成される横方向の衝撃を吸収する手段とを含み、
前記カバー要素が、上部平面と、前記上部平面から延伸するカバー側壁とを含んでいて、前記カバー要素が前記トレイ要素と係合する時に、前記カバー側壁が、前記トレイ要素の前記外側の壁の外側から近接し、
前記外側の壁が第一半円形凹部を含み、前記カバー側壁が第二半円形凹部を含んでいて、前記カバー要素が前記トレイ要素と係合する時に、前記第一半円形凹部が前記第二半円形凹部と係合するようにした半導体ウェファ用容器。 - 前記第一と第二の、半円形凹部が、下向きに先細る、請求項1に記載の半導体ウェファ用容器。
- 前記横方向の衝撃を吸収する手段が、前記内側の壁及び前記外側の壁の、それぞれの間に形成される溝を包含する、請求項1に記載の半導体ウェファ用容器。
- 前記溝が、前記内側の壁及び前記外側の壁と、直交している壁によって形成される、請求項3に記載の半導体ウェファ用容器。
- 前記溝が半円形である、請求項4に記載の半導体ウェファ用容器。
- 前記平面基盤が、下部の衝撃を吸収する手段を形成する、突起部を含む、請求項1に記載の半導体ウェファ用容器。
- 前記突起部が隆起線の格子を形成する、請求項6に記載の半導体ウェファ用容器。
- 前記カバー側壁が縁部を終端とし、前記縁部が前記上部平面に平行な部分を含む、請求項1に記載の半導体ウェファ用容器。
- 前記カバー要素が前記トレイ要素と係合する時に、前記縁部が、前記外側の壁から外側の前記平面基盤の一部分と接触する、請求項8に記載の半導体ウェファ用容器。
- 前記縁部が第一へこみ領域を含んでいて、前記外側の壁から外側の前記平面基盤が第二へこみ領域を含む、請求項9に記載の半導体ウェファ用容器。
- 前記第一へこみ領域が、前記第二へこみ領域からオフセットされ、それによって、前記トレイ要素から前記カバー要素の分離を容易にする、連結されたオフセットフランジ配置を形成する、請求項10に記載の半導体ウェファ用容器。
- 前記外側の壁が第一移動止め要素を含み、前記カバー側壁が第二移動止め要素を含んでいて、前記カバー要素が前記トレイ要素と係合する時に、前記第一移動止め要素が前記第二移動止め要素と係合する、請求項1に記載の半導体ウェファ用容器。
- 前記第一移動止め要素と前記第二移動止め要素とが、くぼみである、請求項12に記載の半導体ウェファ用容器。
- 前記上部平面が、前記容器を上部の隣接する容器と段違いにするためのオフセット要素を含む、請求項1に記載の半導体ウェファ用容器。
- 前記オフセット要素が、前記カバー側壁の交差部の前記上部平面に形成される台座要素を含む、請求項14に記載の半導体ウェファ用容器。
- 前記オフセット要素が、前記カバー側壁の長手方向中央の前記上部平面上に形成される台座要素を含む、請求項14に記載の半導体ウェファ用容器。
- 前記上部平面の少なくとも一部分が半透明である、請求項1に記載の半導体ウェファ用容器。
- 前記カバー側壁が平面中央の標示領域を含む、請求項1に記載の半導体ウェファ用容器。
- 前記トレイ要素と前記カバー要素とが、熱成形されたプラスチックから形成される、請求項1に記載の半導体ウェファ用容器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US50517503P | 2003-09-23 | 2003-09-23 | |
US51586903P | 2003-10-29 | 2003-10-29 | |
PCT/US2004/015480 WO2005044695A1 (en) | 2003-09-23 | 2004-05-18 | Low cost wafer box improvements |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007505798A JP2007505798A (ja) | 2007-03-15 |
JP4335921B2 true JP4335921B2 (ja) | 2009-09-30 |
Family
ID=34572862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006537959A Expired - Fee Related JP4335921B2 (ja) | 2003-09-23 | 2004-05-18 | 低コストウェファボックスの改良 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1685038A4 (ja) |
JP (1) | JP4335921B2 (ja) |
KR (1) | KR101125775B1 (ja) |
CN (1) | CN1845860B (ja) |
WO (1) | WO2005044695A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005050156A1 (de) * | 2005-10-19 | 2007-04-26 | Manfred Jacob Kunststofftechnik Gmbh | Verpackung für elektronische Bauteile, insbesondere für Tape-N-Reel-Spulen |
JP5091321B2 (ja) | 2007-10-12 | 2012-12-05 | デウォン セミコンダクター パッケージング インダストリアル シーオー.,エルティーディー | 互い違いの壁構造を有するウェハ容器 |
CN101459099B (zh) * | 2007-12-13 | 2010-11-10 | 中芯国际集成电路制造(上海)有限公司 | 晶圆盒、半导体生产过程的监测系统和方法 |
CN101752281B (zh) * | 2008-12-02 | 2013-02-13 | 家登精密工业股份有限公司 | 晶片承载装置的承载盒 |
US8813964B2 (en) | 2009-08-26 | 2014-08-26 | Texchem Advanced Products Incorporated Sdn. Bhd. | Wafer container with recessed latch |
US8556079B2 (en) | 2009-08-26 | 2013-10-15 | Texchem Advanced Products Incorporated Sdn Bhd | Wafer container with adjustable inside diameter |
US8109390B2 (en) | 2009-08-26 | 2012-02-07 | Texchem Advanced Products Incorporated Sdn Bhd | Wafer container with overlapping wall structure |
DE102010018668B4 (de) | 2010-04-07 | 2012-11-15 | Curamik Electronics Gmbh | Verpackungseinheit für Metall-Keramik-Substrate |
TW201233602A (en) * | 2010-10-29 | 2012-08-16 | Entegris Inc | Substrate shipper |
JP6044635B2 (ja) * | 2011-07-29 | 2016-12-14 | ロジャース ジャーマニー ゲーエムベーハー | 基板用包装ならびにそのような包装を備える包装ユニット |
CN102717982A (zh) * | 2012-07-02 | 2012-10-10 | 深圳市华星光电技术有限公司 | 一种液晶玻璃的包装装置 |
KR102425700B1 (ko) * | 2019-06-10 | 2022-07-28 | 삼성에스디아이 주식회사 | 이차전지 포장용 트레이 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3256975A (en) * | 1963-11-29 | 1966-06-21 | Leaming Ind Inc | Container |
US3482682A (en) * | 1968-10-02 | 1969-12-09 | Monsanto Co | Retaining trays for semiconductor wafers and the like |
US3710975A (en) * | 1971-09-20 | 1973-01-16 | Pantasote Co Of New York Inc | Trays for photographic slides |
US4697701A (en) * | 1986-05-30 | 1987-10-06 | Inko Industrial Corporation | Dust free storage container for a membrane assembly such as a pellicle and its method of use |
US5441150A (en) * | 1992-09-03 | 1995-08-15 | Ma Laboratories, Inc. | Memory module container |
US5305878A (en) * | 1993-04-01 | 1994-04-26 | Yen Yung Tsai | Packaged optical pellicle |
JP3711778B2 (ja) * | 1998-09-18 | 2005-11-02 | セイコーエプソン株式会社 | 梱包方法及び梱包物 |
US6321911B1 (en) * | 2000-01-31 | 2001-11-27 | Display Pack, Inc. | Fragility package |
US7059475B2 (en) * | 2001-10-04 | 2006-06-13 | Entegris, Inc. | System for cushioning wafer in wafer carrier |
-
2004
- 2004-05-18 JP JP2006537959A patent/JP4335921B2/ja not_active Expired - Fee Related
- 2004-05-18 WO PCT/US2004/015480 patent/WO2005044695A1/en active Application Filing
- 2004-05-18 CN CN2004800252401A patent/CN1845860B/zh not_active Expired - Fee Related
- 2004-05-18 EP EP04752489A patent/EP1685038A4/en not_active Withdrawn
- 2004-05-18 KR KR1020067005008A patent/KR101125775B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2005044695A1 (en) | 2005-05-19 |
CN1845860A (zh) | 2006-10-11 |
KR101125775B1 (ko) | 2012-03-28 |
EP1685038A1 (en) | 2006-08-02 |
WO2005044695A8 (en) | 2006-06-01 |
EP1685038A4 (en) | 2008-11-26 |
JP2007505798A (ja) | 2007-03-15 |
KR20070006665A (ko) | 2007-01-11 |
CN1845860B (zh) | 2011-01-19 |
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