WO1994012686A1 - Electroless gold plating bath - Google Patents

Electroless gold plating bath Download PDF

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Publication number
WO1994012686A1
WO1994012686A1 PCT/JP1992/001538 JP9201538W WO9412686A1 WO 1994012686 A1 WO1994012686 A1 WO 1994012686A1 JP 9201538 W JP9201538 W JP 9201538W WO 9412686 A1 WO9412686 A1 WO 9412686A1
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WO
WIPO (PCT)
Prior art keywords
plating
gold
bath
sodium
salt
Prior art date
Application number
PCT/JP1992/001538
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Masaru Kato
Yutaka Yazama
Shigetaka Hoshino
Original Assignee
Kanto Kagaku Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Kagaku Kabushiki Kaisha filed Critical Kanto Kagaku Kabushiki Kaisha
Priority to DE69224914T priority Critical patent/DE69224914T2/de
Priority to US08/256,369 priority patent/US5470381A/en
Priority to PCT/JP1992/001538 priority patent/WO1994012686A1/ja
Priority to DE0630991T priority patent/DE630991T1/de
Priority to EP92924008A priority patent/EP0630991B1/en
Publication of WO1994012686A1 publication Critical patent/WO1994012686A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Definitions

  • the present invention relates to an electroless gold plating solution using a gold (I) complex salt of chloroauric (II1) acid or sulfurous acid or thiosulfuric acid as a gold source.
  • a gold (I) complex salt of chloroauric (II1) acid or sulfurous acid or thiosulfuric acid as a gold source.
  • the electroless gold plating method is widely used in the electronics industry where it is necessary to mount on complicated microcircuits and isolated parts that are difficult to read due to its excellent functional characteristics. It has been.
  • a solution containing a highly toxic cyanide compound as a complex of gold (I) ion has been used. It was customary to use this under high-temperature, high-alkaline conditions.
  • the resist used for masking the circuit is peeled off or the ceramic substrate is eroded by alkali.
  • electroless plating baths containing cyanide compounds are extremely toxic, have problems in handling, storage and management, as well as in the safety of the working environment and wastewater. Disposal Economic issues existed.
  • a typical gold plating solution that does not use a cyanide compound is a gold plating solution in which chloroauric (III) acid is supplied as a gold source (for example, , United States Patent 4 1 4 2902, United Kingdom (See Patent 21 14 159).
  • This gold plating solution containing ffl of chloroaurate (III) is considered to form a gold complex salt of chloroaurate (1II) with the constituents of sulfuric acid or thiosulfate ⁇ # ⁇ It has been converted to ffl by using cyanide as a river-drip solution.
  • the present inventors have previously made an improvement on an electroless gold plating solution using chloroauric (I 1 I) acid as a gold source by using ascorbic acid as a reducing component.
  • the used plating solution was provided (see JP-A-1-191782).
  • the electroless gold plating solution contains chloroauric (III) acid or a salt thereof, an alkali metal salt or an ammonium salt of sulfurous acid or thiosulfuric acid, or ascorbic acid or a salt thereof.
  • practical plating speed can be obtained under low temperature and near neutral pll conditions, and the masked resist can be peeled off without attacking the ceramic plate.
  • the equilibrium in the solution changes due to the natural oxidation and the decrease in the concentration of oxidizing components such as ion sulphite and thiosulphate during storage ⁇ or plating, and the gold complex becomes unstable and the gold activity increases. As a result, it becomes easier to decompose the bath, and contamination by trace amounts of metal ions that increase the oxidizing activity of ascorbic acid causes the generation of fine gold particles with these as nuclei, which causes decomposition. It would be to promote.
  • An object of the present invention is to provide an electroless plating solution having excellent stability.
  • the object of the present invention is to be able to perform plating at a high speed under the ⁇ II condition near neutrality and a gentle operation condition at a relatively low temperature, and to further improve stability.
  • An object of the present invention is to provide an electroless plating solution that is also excellent in point.
  • the present inventors aimed at improving the stability of the electroless plating solution.
  • gold complex salt of chloroauric acid (III) or its salt or sulfurous acid or thiosulfuric acid as a gold source
  • sulfurous acid or thiosulfuric acid An aqueous solution containing sulfuric acid as an alkali metal salt or an ammonium salt, (c) ascorbic acid or a salt thereof, and (d) a pll buffer as components.
  • 2 Melcaptobenzonitzol, 6—ethoxy 2 and Menolecaptobenzimidazole, for electrolytic plating solution
  • 2 Incorporation of a compound selected from menolecabutobenzoxazole and their salts, so that the plating solution can be stored and dipped. It can significantly improve the stability of the plating solution for long-term use and long-term storage. That it can improve the qualitative and Heading.
  • the present inventors have conducted intensive studies with the aim of improving the plating speed while ensuring the stability of the electroless plating solution.
  • an electroless plating solution containing an aqueous solution containing a PH buffer as a component a
  • the present invention relates to (a) a gold (1) complex salt of chloroauric (III) acid or a salt thereof or sulfuric acid or thiosulfuric acid (b) (sulfuric acid or thiosulfuric acid as a gold source; Umbrella salt or ammonium salt, (c) ascorbic acid or a salt thereof, (d) pll buffer and (e) 2-Menolecaptobenzothiazole, 6-ethoxy Sea 2 — Menolecabutobenzothiazole, 2 — Menolecaptobenzimidazole, 2 — Menolecaptobenzoxazole, and unmelted metal containing compounds selected from their salts It provides a liquid solution.
  • the present invention relates to (a) a gold (I) complex salt of chloroauric acid (III) or a salt or sulfurous acid or thiosulfuric acid as a gold source, and (b) a sulfuric acid or thiosulfuric acid.
  • Electroless metal consisting of an aqueous solution containing, as components, (c) ascorbic acid or a salt thereof and (d) pll buffering agent as an alkaline metal salt or an ammonium salt.
  • Preferred embodiments of the electroless plating solution according to the present invention are described as follows. 0.001-0. L OmolZ lit., sodium sulfite 0.01 to 1. Omol / lit., sodium thiosulfate 0.01 to 1. OmolZ lit. Sodium phosphate 0.01 to 1. Oraol liter, ascorbic acid or its sodium salt 0.001 to 1. Omol / Little and 2 — Menolecap Benzothiazol, 6—Ethokin-1 2—Menolecapto Benzothiazol, 2—Menolecaptobenzimidazole or 2—Menolecaptobenzobenzoxazole to 6 10 - 7 ⁇ 3 x l0 -. 3 raol / l, alkylamine Mi emissions reduction stage was from 0.0001 to 0 containing 05molZ Li tool preparative Le.
  • Specific compounds of the above alkylamine compounds and salts thereof include ethylenediamine, ethylenediamine hydrochloride, ethylenediamine sulfate, and diethylamine.
  • the present inventors have made various studies on the relationship between the composition of the electroless plating solution according to the present invention and the obtained plating rate and plating solution stability, and found the following findings. Obtained.
  • the amount of gold (1) complex salt of chloroauric acid (III) or a salt thereof or sulfurous acid or thiosulfuric acid used as a gold source is 0.001 to 0.1 m01.
  • Z liters are preferred, but particularly preferred are 0.005 to 0.05 raol / litre.
  • 0.Practical plating speed cannot be obtained below OOlmol Z liter. Above 0. lmol / liter, gold precipitation tends to occur, which is economically disadvantageous.
  • sulfites for example, sodium salt, 0.01 to 1.
  • Omol liter capacity preferably, but particularly preferably 0.04 to 0.5 m 01 / liter capacity It is. Below 0.01 r o 1 Z litmel, the liquid is unstable and easily decomposed, and above l. OmolZ liter, the plating speed is significantly reduced, which is actually ffl-like. Not good o
  • sodium salt is preferably 0.01 to 1. OmolZ litre, particularly preferably 0.04 to 0.5 m 01 / litre. It is. Below 0.01 mol 1 Z liter, the plating solution lacks stability and easily decomposes, and above 1. Oraol liter, there is no particular effect on the plating reaction.
  • a buffer prepared with sodium hydrogen phosphate is suitable, and its content is from 0.01 to: I. OmolZ liter Is preferred, but particularly preferred is 0.05 to 0.5 m0iZ lit. Below 0.01 m 01 / litre, roughening of the plating surface is likely to occur. No special effect is expected with l. OraolZ liters or more.
  • Ascorbic acid for example, as a sodium salt, 0.001 to 1.0 m 01 Z liter is preferred, and particularly preferably 0.01 to 0. ⁇ . It is a liter. 0. Below OOlmolZ liter, the plating speed is slow, and 1. At Orao 1 liter or more, the plating solution becomes unstable and easily decomposes. Become.
  • Preferred pH ranges are between 5 and 9, especially between 6 and 8.
  • the operating temperature of the plating solution can be selected in the range of 50 to 80 ° C, preferably 50 to 70 ° C, and more preferably 55 to 65 ° C. .
  • the ability to mount at such low temperatures is particularly advantageous when the object to be coated is an object that has no resistance to temperature, which is even more so. It offers significant advantages over conventional electroless gold plating solutions in terms of energy savings and worker safety.
  • each solution containing various concentrations of 2-mercaptobenzothiazole shown in Table 2 was used.
  • a rolled nickel plate with a size of 2 cm x 2 cro and a thickness of 0.1 mm was coated with a nickel coating of thickness 3 / im and then with a thickness of 3 (A 1 m gold film was electroplated, and the bath load was 0.8 dm 2 L, the temperature was 60 ° C, and the stirring was performed (5 hours of plating.
  • Table 2 The results are shown in Table 2). Is shown in
  • the electroless plating solution according to the present invention does not decrease the deposition rate at an appropriate concentration, and has a remarkable effect on improving the stability of the bath. This is allowed.
  • An electroless plating solution (B) with the following composition and a plating bath containing 1 ppm of 2-mercaptobenzothiazole in this plating solution (B) were prepared. Repeat the plating for 6 hours under the same plating specimens and plating conditions as in 2, and after leaving at room temperature overnight, repeat the plating on the next day under the same conditions. Return operation was performed P times for 3 days.
  • a plating bath was prepared by mixing the electroless plating solution ( ⁇ ) and the plating solution (A) shown in Example 1 with 1 ppm of 2-menolecaptobenzothiazole. The baths were stored unused at room temperature for each of the storage periods shown in Table 3.
  • the plating condition of the bath containing 1 ppm of 2-Menolecap to Benzothia sonole is a light yellow, matte or semi-gloss, uniform sedimentation film. was gotten.
  • 6-ethoxy-2—mercaptobenzoylazolone was 0.5 ppm, 1. Oppm, 2.5 ppm, and 5.0 ppra in each addition bath (Example). Even with the addition of 5 ppm, the content of 6 was 1. In the baths of O ppm and 2.5 PP m, the content was 15 in the bath, and in the bath of 5.0 ppm, no gold precipitate was formed in each period of 30 days. The stability was greatly improved compared to the case, and it was possible to store at room temperature for a long time. It was also found that the higher the added concentration of 6-ethoxy-2-merbutobenzothiazol, the better the stability.
  • Method 6 Metal 2—Menolecaptobenzothiazole at a concentration of 0.5 ppm N lppra, 2 ppm and 2.5 ppm, respectively.
  • Bath load 1.2 dm 2 / L, temperature 60 ° C, stirring Table 6 shows the results of the 6 o'clock Pe plating under the conditions.
  • An electroless plating solution (E) having the following composition was prepared, and a solution containing 2-menolecaptobenzoxazole at 50 ppm, 100 ppm, 250 ⁇ , and 500 ppm, respectively, was added to ffl.
  • the same processing as in Example 3 was used as the plating specimen, and plating was performed for 6 hours under the conditions of a bath load of 0.8 dm 2 ZL, a temperature of 60 ° C, and stirring. The results are shown in Table 7 below.
  • the appearance of the precipitate was good in that the comparative example without addition was reddish yellow and matte, while that of the example was light yellow and semi-glossy.
  • An electroless plating solution (II) having the following composition was prepared, and each solution containing ethylenediamine at various concentrations shown in Table 9 was used as a plating specimen.
  • Rolled nickel plate with a size of 2 cm x 2 cm and a thickness of 0.1 mm was coated with a 3 ⁇ m thick nickel film and then a 3 / im gold film
  • the sample applied by electroplating was ffled, and the sample was plated for 6 hours under a bath load of 0.8 dm 2 / L, a temperature of 60 ° C, and stirring.
  • As a control (1) when no ethylenediamine was added, and as a control (2), an ethylenediamine was prepared by removing 2-mercaptobenzothiazole from solution H. The plating was performed under the same conditions as above when 300 mg ZL was added.
  • the plating speed was examined using a plating bath with the addition of 0.01 mol 1 Z litnole of the alkylamines shown in Table 10.
  • the plating method was the same as that used in Examples 11 to 14 as plating specimens, with a bath load of 0.8 dm 2 / L, a temperature of 60 ° C, and a stirring time of 1 hour. Was done.
  • the results are shown in Table 10.
  • the increase in the plating speed was observed in each case as compared with the control base without alkylamine added.
  • the precipitates exhibited a uniform appearance of bright yellow to semi-gloss on the bases of all the examples, indicating a good precipitation state. Further, during the plating operation, no gold precipitate was formed in the bath in any of the examples.
  • An electroless plating solution (") having the following composition was prepared, and its stability, plating speed, and plating stability when stored at room temperature were examined.
  • the plating method is the same as the conditions described in Examples 11 to 1.
  • control (1) the case where only ethylenediamine was removed from the following composition (J)
  • control (2) the case where only 2-menolecaptobenzimidazole was removed
  • control (3) the same stability and plating rate were examined as above, and the results are shown in Table 11.
  • a plating solution (K) having the following composition was prepared. Using this solution as ffl, Example U-1 Plating was performed under the conditions described above, and the plating speed and stability during plating were examined. In comparison, when ethylenediamine was excluded from the following composition (K) (control (1)), 6-ethoxy1-2-mercaptobenzonitrazole was added. The plating speed and the stability were also examined in the same manner when excluding (control (2)) and when excluding both (control (3)). The results are shown in Table 12.
  • Example 24-26 The appearance of the precipitate was reddish yellow and matte in the control (1), and the surface condition was poor in the controls (2) and (3) due to the adhesion of gold decomposition products. However, the examples were bright yellow, semi-glossy, and had the best appearance. Example 24-26
  • the plating solutions of various compositions shown in the columns of Example 24, Example 25, and Example 26 in Table 13 were prepared and plated.
  • liquids of each composition were prepared by removing the alkylamine compound from these compositions, and the same procedure was performed.
  • the plating method was as follows. The samples described in Examples 11 to 14 were used as plating samples, and immersion was performed at 60 ° C for 3 hours with stirring.
  • the electroless plating solution according to the present invention has extremely high stability, and prevents the formation of precipitates in the bath in the storage state and the use state after the bath has been built, and keeps the plating bath in a stable state. It can be used for a long time and can be used repeatedly in this bath. It is possible to perform plating, and the conventional plating bath has the disadvantage that it must be used immediately after the bathing, while the work time is not limited. U have the advantages
  • the electroless gold plating solution according to the present invention to which an alkylamine compound has been added has been improved in terms of the polishing speed because it has been regarded as a problem with the conventionally used electroless gold plating solution.
  • the plating speed is remarkably fast, and the plating speed does not decrease even under a high bath load. Therefore, it has an excellent advantage that it is possible to perform a treatment for a large number of objects in a short time.
  • the persistence of the plating speed makes it possible to perform thickening in a relatively short time.
  • FIG. 11 is a diagram showing the results obtained by Examples 11 to 14 and the controls (2) and (3) in comparison with each other.
  • the vertical axis represents the thickness of the plated film (m), and the horizontal axis represents the thickness. Time (hr) is shown.

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
PCT/JP1992/001538 1992-11-25 1992-11-25 Electroless gold plating bath WO1994012686A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE69224914T DE69224914T2 (de) 1992-11-25 1992-11-25 Stromloses goldbeschichtungsbad
US08/256,369 US5470381A (en) 1992-11-25 1992-11-25 Electroless gold plating solution
PCT/JP1992/001538 WO1994012686A1 (en) 1992-11-25 1992-11-25 Electroless gold plating bath
DE0630991T DE630991T1 (de) 1992-11-25 1992-11-25 Stromloses goldbeschichtungsbad.
EP92924008A EP0630991B1 (en) 1992-11-25 1992-11-25 Electroless gold plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1992/001538 WO1994012686A1 (en) 1992-11-25 1992-11-25 Electroless gold plating bath

Publications (1)

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WO1994012686A1 true WO1994012686A1 (en) 1994-06-09

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PCT/JP1992/001538 WO1994012686A1 (en) 1992-11-25 1992-11-25 Electroless gold plating bath

Country Status (4)

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US (1) US5470381A (en, 2012)
EP (1) EP0630991B1 (en, 2012)
DE (2) DE69224914T2 (en, 2012)
WO (1) WO1994012686A1 (en, 2012)

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JP5610500B1 (ja) * 2014-05-21 2014-10-22 小島化学薬品株式会社 有機金錯体

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US6383269B1 (en) 1999-01-27 2002-05-07 Shipley Company, L.L.C. Electroless gold plating solution and process
JP3466521B2 (ja) * 1999-10-04 2003-11-10 新光電気工業株式会社 置換型無電解金めっき液及び無電解金めっき方法
EP1090825A3 (de) 1999-10-07 2002-04-10 Österreichische Bundesbahnen Zweiachsiger Eisenbahngüterwagen
DE10018025A1 (de) 2000-04-04 2001-10-18 Atotech Deutschland Gmbh Verfahren zum Erzeugen von lötfähigen Oberflächen und funktionellen Oberflächen auf Schaltungsträgern
JP3482402B2 (ja) * 2001-06-29 2003-12-22 日本エレクトロプレイテイング・エンジニヤース株式会社 置換金メッキ液
JP4375702B2 (ja) * 2001-10-25 2009-12-02 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． めっき組成物
US6911230B2 (en) * 2001-12-14 2005-06-28 Shipley Company, L.L.C. Plating method
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KR100953612B1 (ko) * 2003-06-02 2010-04-20 삼성에스디아이 주식회사 생체물질 고정용 기판 및 이의 제조방법
US7419536B2 (en) * 2003-06-05 2008-09-02 Nikko Materials Co., Ltd. Electroless gold plating liquid
JP4603320B2 (ja) * 2003-10-22 2010-12-22 関東化学株式会社 無電解金めっき液
WO2005098088A1 (ja) * 2004-04-05 2005-10-20 Nippon Mining & Metals Co., Ltd. 無電解金めっき液
US7390354B2 (en) * 2004-07-09 2008-06-24 Nikko Materials Co., Ltd. Electroless gold plating solution
CN1981347A (zh) * 2004-07-15 2007-06-13 积水化学工业株式会社 导电性微粒、导电性微粒的制造方法、和各向异性导电材料
JP2006111960A (ja) 2004-09-17 2006-04-27 Shinko Electric Ind Co Ltd 非シアン無電解金めっき液及び無電解金めっき方法
JP3945814B2 (ja) * 2004-11-15 2007-07-18 日鉱金属株式会社 無電解金めっき液
US20070175359A1 (en) * 2006-02-01 2007-08-02 Kilnam Hwang Electroless gold plating solution and method
US20070175358A1 (en) * 2006-02-01 2007-08-02 Kilnam Hwang Electroless gold plating solution
GB0903642D0 (en) * 2009-02-27 2009-09-30 Bae Systems Plc Electroless metal deposition for micron scale structures
DE102009041264A1 (de) 2009-09-11 2011-03-24 IPHT Jena Institut für Photonische Technologien e.V. Verfahren zur Herstellung von optisch aktiven Nanostrukturen
JP4831710B1 (ja) * 2010-07-20 2011-12-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液及び無電解金めっき方法
KR101444687B1 (ko) * 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100347339C (zh) * 2002-01-30 2007-11-07 关东化学株式会社 无电解镀金液
JP5610500B1 (ja) * 2014-05-21 2014-10-22 小島化学薬品株式会社 有機金錯体

Also Published As

Publication number Publication date
EP0630991A1 (en) 1994-12-28
DE69224914T2 (de) 1998-10-22
EP0630991B1 (en) 1998-03-25
DE69224914D1 (de) 1998-04-30
DE630991T1 (de) 1995-07-13
EP0630991A4 (en, 2012) 1995-01-18
US5470381A (en) 1995-11-28

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