USD937231S1 - Power semiconductor package - Google Patents

Power semiconductor package Download PDF

Info

Publication number
USD937231S1
USD937231S1 US29/730,568 US202029730568F USD937231S US D937231 S1 USD937231 S1 US D937231S1 US 202029730568 F US202029730568 F US 202029730568F US D937231 S USD937231 S US D937231S
Authority
US
United States
Prior art keywords
semiconductor package
power semiconductor
view
ornamental design
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/730,568
Inventor
Kuldeep Saxena
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolfspeed Inc
Original Assignee
Wolfspeed Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolfspeed Inc filed Critical Wolfspeed Inc
Priority to US29/730,568 priority Critical patent/USD937231S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAXENA, KULDEEP
Priority to TW110304008F priority patent/TWD220287S/en
Priority to TW109305308F priority patent/TWD220260S/en
Priority to US29/811,014 priority patent/USD969762S1/en
Assigned to WOLFSPEED, INC. reassignment WOLFSPEED, INC. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Application granted granted Critical
Publication of USD937231S1 publication Critical patent/USD937231S1/en
Assigned to U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION reassignment U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WOLFSPEED, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of a power semiconductor package showing my new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a front view thereof;
FIG. 6 is a rear view thereof;
FIG. 7 is a side view thereof; and,
FIG. 8 is an opposite side view thereof.
The broken lines shown in the drawings depict portions of the power semiconductor package that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power semiconductor package, as shown and described.
US29/730,568 2020-04-06 2020-04-06 Power semiconductor package Active USD937231S1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US29/730,568 USD937231S1 (en) 2020-04-06 2020-04-06 Power semiconductor package
TW110304008F TWD220287S (en) 2020-04-06 2020-09-21 Power semiconductor package
TW109305308F TWD220260S (en) 2020-04-06 2020-09-21 Power semiconductor package
US29/811,014 USD969762S1 (en) 2020-04-06 2021-10-11 Power semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/730,568 USD937231S1 (en) 2020-04-06 2020-04-06 Power semiconductor package

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/811,014 Division USD969762S1 (en) 2020-04-06 2021-10-11 Power semiconductor package

Publications (1)

Publication Number Publication Date
USD937231S1 true USD937231S1 (en) 2021-11-30

Family

ID=78703986

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/730,568 Active USD937231S1 (en) 2020-04-06 2020-04-06 Power semiconductor package
US29/811,014 Active USD969762S1 (en) 2020-04-06 2021-10-11 Power semiconductor package

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/811,014 Active USD969762S1 (en) 2020-04-06 2021-10-11 Power semiconductor package

Country Status (2)

Country Link
US (2) USD937231S1 (en)
TW (2) TWD220260S (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340347A (en) * 1964-10-12 1967-09-05 Corning Glass Works Enclosed electronic device
USD259559S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259782S (en) * 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD421421S (en) * 1998-11-19 2000-03-07 Honda Tsushin Kogyo Co., Ltd. Connector receptacle for IC card
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US20170133315A1 (en) * 2014-07-30 2017-05-11 Kyocera Corporation Electronic component housing package, and electronic device comprising same
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD853343S1 (en) 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD874411S1 (en) 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
US10600744B2 (en) * 2016-11-15 2020-03-24 Rohm Co., Ltd. Semiconductor device
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4391408A (en) * 1980-09-05 1983-07-05 Augat Inc. Low insertion force connector
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
USD288922S (en) * 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
JPS60239043A (en) * 1984-05-14 1985-11-27 Oki Electric Ind Co Ltd Manufacture of package for semiconductor device
USD288557S (en) * 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
KR880014671A (en) * 1987-05-27 1988-12-24 미다 가쓰시게 Resin Filled Semiconductor Device
US5172213A (en) * 1991-05-23 1992-12-15 At&T Bell Laboratories Molded circuit package having heat dissipating post
US5434357A (en) * 1991-12-23 1995-07-18 Belcher; Donald K. Reduced semiconductor size package
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD358806S (en) * 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
JP2522186B2 (en) * 1993-10-15 1996-08-07 日本電気株式会社 Semiconductor package
JP3362530B2 (en) * 1993-12-16 2003-01-07 セイコーエプソン株式会社 Resin-sealed semiconductor device and method of manufacturing the same
US5486720A (en) * 1994-05-26 1996-01-23 Analog Devices, Inc. EMF shielding of an integrated circuit package
JPH09307051A (en) * 1996-05-15 1997-11-28 Toshiba Corp Semiconductor device sealed by resin and method of manufacturing it
USD396212S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396213S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396211S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
US5959842A (en) * 1998-05-14 1999-09-28 Lucent Technologies Inc. Surface mount power supply package and method of manufacture thereof
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
JP2003077939A (en) * 2001-09-05 2003-03-14 Mitsubishi Electric Corp Semiconductor device and method of manufacturing same
US6891276B1 (en) * 2002-01-09 2005-05-10 Bridge Semiconductor Corporation Semiconductor package device
JP4294405B2 (en) * 2003-07-31 2009-07-15 株式会社ルネサステクノロジ Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
JP1603175S (en) * 2017-10-19 2018-05-07
JP1603359S (en) * 2017-10-19 2018-05-07
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package

Patent Citations (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340347A (en) * 1964-10-12 1967-09-05 Corning Glass Works Enclosed electronic device
USD259559S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259782S (en) * 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD421421S (en) * 1998-11-19 2000-03-07 Honda Tsushin Kogyo Co., Ltd. Connector receptacle for IC card
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD874411S1 (en) 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
US20170133315A1 (en) * 2014-07-30 2017-05-11 Kyocera Corporation Electronic component housing package, and electronic device comprising same
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
US10600744B2 (en) * 2016-11-15 2020-03-24 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device

Non-Patent Citations (8)

* Cited by examiner, † Cited by third party
Title
Cree, Inc., "C2M1000170J: Silicon Carbide Power MOSFET, C2M MOSFET Technology, N-Channel Enhancement Mode," Dec. 2017, 10 pages.
Cree, Inc., "C3M0065090J: Silicon Carbide Power MOSFET, C3M MOSFET Technology, N-Channel Enahnancement Mode," Jun. 2019, 10 pages.
Cree, Inc., "C3M0065100J: Silicon Carbide Power MOSFET, C3M MOSFET Technology, N-Channel Enhancement Mode," Apr. 2017, 10 pages.
Cree, Inc., "C3M0075120J: Silicon Carbide Power MOSFET, C3M MOSFET Technology, N-Channel Enhancement Mode," Jul. 2017, 10 pages.
Cree, Inc., "C3M0120090J: Silicon Carbide Power MOSFET, C3M MOSFET Technology, N-Channel Enhancement Mode," Jan. 2018, 10 pages.
Cree, Inc., "C3M0120100J: Silicon Carbide Power MOSFET, C3M MOSFET Technology, N-Channel Enhancement Mode," Apr. 2017, 10 pages.
Cree, Inc., "C3M0280090J: Silicon Carbide Power MOSFET, C3M MOSFET Technology, N-Channel Enhancement Mode," Jan. 2018, 10 pages.
Examination Report for Taiwanese Patent Application No. 109305308, dated May 4, 2021, 6 pages.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module

Also Published As

Publication number Publication date
USD969762S1 (en) 2022-11-15
TWD220287S (en) 2022-08-01
TWD220260S (en) 2022-08-01

Similar Documents

Publication Publication Date Title
USD937231S1 (en) Power semiconductor package
USD900749S1 (en) Power strip
USD908365S1 (en) Power scrubber
USD935413S1 (en) Power strip
USD935412S1 (en) Power strip
USD997551S1 (en) Earphone case
USD978114S1 (en) Earphone
USD968072S1 (en) Backpack
USD948042S1 (en) Combined controller
USD934187S1 (en) Integrated circuit package
USD993201S1 (en) Semiconductor module
USD936591S1 (en) Inverter
USD947783S1 (en) Power strip
USD949966S1 (en) Envelope
USD986168S1 (en) Power converter
USD972047S1 (en) Robot
USD1003242S1 (en) Power inverter
USD1019926S1 (en) Solar fan
USD976852S1 (en) Power module
USD1004964S1 (en) Earphone case
USD914598S1 (en) Inverter
USD966772S1 (en) Instant warmer
USD981225S1 (en) Package
USD966620S1 (en) Bump cap
USD1023318S1 (en) Oral appliance

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY