USD770992S1 - Electrode cover for a plasma processing apparatus - Google Patents

Electrode cover for a plasma processing apparatus Download PDF

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Publication number
USD770992S1
USD770992S1 US29/544,070 US201529544070F USD770992S US D770992 S1 USD770992 S1 US D770992S1 US 201529544070 F US201529544070 F US 201529544070F US D770992 S USD770992 S US D770992S
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processing apparatus
plasma processing
electrode cover
view
electrode
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Susumu Tauchi
Takashi Uemura
Kohei Sato
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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JPD2015-13037F JP1546800S (enrdf_load_stackoverflow) 2015-06-12 2015-06-12
JP2015-013037 2015-06-12

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JP (1) JP1546800S (enrdf_load_stackoverflow)
TW (1) TWD175854S (enrdf_load_stackoverflow)

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USD793572S1 (en) * 2015-06-10 2017-08-01 Tokyo Electron Limited Electrode plate for plasma processing apparatus
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD827592S1 (en) 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD828419S1 (en) * 2016-02-23 2018-09-11 Joy Global Underground Mining Llc Idler roller
USD830435S1 (en) 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD836573S1 (en) 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD840365S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD840364S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD847982S1 (en) * 2016-02-04 2019-05-07 Atos Medical Ab Heat exchanger base plate
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD870314S1 (en) * 2017-08-31 2019-12-17 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD891923S1 (en) * 2017-11-12 2020-08-04 Yun Lin Container lid
TWD208174S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208176S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208177S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208178S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器之部分
TWD208175S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
USD904305S1 (en) * 2019-02-25 2020-12-08 Petram Technologies, Inc. Electrode cage for a plasma blasting probe
USD907593S1 (en) * 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD916038S1 (en) * 2019-03-19 2021-04-13 Hitachi High-Tech Corporation Grounded electrode for a plasma processing apparatus
USD920521S1 (en) 2019-05-08 2021-05-25 Reza Jalinous Double coil
USD922589S1 (en) 2020-09-08 2021-06-15 Reza Jalinous Coil
USD926996S1 (en) 2019-05-14 2021-08-03 Reza Jalinous Coil
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD954986S1 (en) * 2019-10-18 2022-06-14 Hitachi High-Tech Corporation Electrode cover for a plasma processing device
USD970020S1 (en) 2019-05-09 2022-11-15 Reza Jalinous Double coil
USD971167S1 (en) * 2019-08-28 2022-11-29 Applied Materials, Inc. Lower shield for a substrate processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD979080S1 (en) 2019-06-27 2023-02-21 Reza Jalinous MRI tower coil stand
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD980394S1 (en) * 2020-04-01 2023-03-07 Watermann Polyworks Gmbh Sealing apparatus
USD981459S1 (en) * 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1010135S1 (en) 2019-05-20 2024-01-02 Reza Jalinous Coil
USD1034491S1 (en) * 2020-07-27 2024-07-09 Applied Materials, Inc. Edge ring
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1047884S1 (en) * 2021-10-22 2024-10-22 Nuflare Technology, Inc. Susceptor cover
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1062662S1 (en) * 2023-03-30 2025-02-18 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
USD1063595S1 (en) * 2023-03-30 2025-02-25 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1082729S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor cover
USD1082728S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor
USD1082731S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor

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USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD793572S1 (en) * 2015-06-10 2017-08-01 Tokyo Electron Limited Electrode plate for plasma processing apparatus
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD825505S1 (en) * 2015-06-18 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
USD861757S1 (en) 2015-12-28 2019-10-01 Ntn Corporation Inner ring for tapered roller bearing
USD830435S1 (en) 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
USD830434S1 (en) * 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
USD847982S1 (en) * 2016-02-04 2019-05-07 Atos Medical Ab Heat exchanger base plate
USD828419S1 (en) * 2016-02-23 2018-09-11 Joy Global Underground Mining Llc Idler roller
USD908755S1 (en) 2016-02-23 2021-01-26 Joy Global Underground Mining Llc Idler roller
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD913977S1 (en) 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD907593S1 (en) * 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD840365S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD827592S1 (en) 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840364S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD870314S1 (en) * 2017-08-31 2019-12-17 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD891923S1 (en) * 2017-11-12 2020-08-04 Yun Lin Container lid
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD208174S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208175S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器
TWD208178S (zh) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 半導體製造用晶圓支持器之部分
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USD992615S1 (en) * 2018-12-07 2023-07-18 Tokyo Electron Limited Focus ring
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
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USD916038S1 (en) * 2019-03-19 2021-04-13 Hitachi High-Tech Corporation Grounded electrode for a plasma processing apparatus
USD920521S1 (en) 2019-05-08 2021-05-25 Reza Jalinous Double coil
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USD971167S1 (en) * 2019-08-28 2022-11-29 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD954986S1 (en) * 2019-10-18 2022-06-14 Hitachi High-Tech Corporation Electrode cover for a plasma processing device
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USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD980394S1 (en) * 2020-04-01 2023-03-07 Watermann Polyworks Gmbh Sealing apparatus
USD1034491S1 (en) * 2020-07-27 2024-07-09 Applied Materials, Inc. Edge ring
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
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USD922589S1 (en) 2020-09-08 2021-06-15 Reza Jalinous Coil
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USD1021832S1 (en) 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane
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USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
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USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD981459S1 (en) * 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate
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USD1062662S1 (en) * 2023-03-30 2025-02-18 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring
USD1063595S1 (en) * 2023-03-30 2025-02-25 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

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