US20110089040A1 - Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials - Google Patents
Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials Download PDFInfo
- Publication number
- US20110089040A1 US20110089040A1 US12/905,788 US90578810A US2011089040A1 US 20110089040 A1 US20110089040 A1 US 20110089040A1 US 90578810 A US90578810 A US 90578810A US 2011089040 A1 US2011089040 A1 US 2011089040A1
- Authority
- US
- United States
- Prior art keywords
- bath
- gold
- copper
- silver
- cyanide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
Definitions
- the invention relates to electrolytic deposition in the form of a thick gold alloy layer and the method of fabricating the same.
- the depositions obtained by these known methods have, however, a cadmium content of between 1 and 10%.
- Cadmium facilitates deposition of thick layers, i.e. between 1 and 800 microns and provides a yellow coloured alloy while reducing the quantity of copper contained in the alloy.
- cadmium is extremely toxic and prohibited in some countries.
- the invention therefore relates to a method for the galvanoplastic deposition of a gold alloy on an electrode dipped in a bath that includes metal gold in the form of alkaline aurocyanide, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, characterized in that the alloy metals are copper, in the form of double copper and potassium cyanide, and silver, in cyanide form, allowing a mirror-bright yellow gold alloy to be deposited on the electrode.
- the invention also concerns an electrolytic deposition in the form of a gold alloy obtained from a method according to any of the preceding claims, whose thickness is comprised between 1 and 800 microns and which includes copper, characterized in that it includes silver as the third main compound in a proportion of 75% gold, 21% copper and 4% silver to obtain a bright 3N colour.
- the invention concerns an electrolytic deposition of a gold alloy with a 3N colour which, surprisingly, includes Au—Cu—Ag as its main compounds in proportions that are not known, to obtain the 3N colour, i.e. bright yellow.
- the electrolysis is preferably followed by a heat treatment at a temperature of between 200 and 450 degrees Celsius for 1 to 30 minutes in order to obtain a deposition of optimum quality.
- the bath according to the invention provides a deposition in proportions of around 75% gold, 21% copper and 4% silver, corresponding to a 3N colour, 18 carat deposition, very different proportions from the usual electrolytic depositions for this colour, which tend to be depositions of around 75% gold, 12.5% copper and 12.5% silver.
- the bath may also contain a brightener.
- a brightener This is preferably a butynediol derivative, a pyridinio-propanesulfonate or a mixture of the two, a tin salt, sulfonated castor oil, methylimidozole, dithiocarboxylic acid such as thiocarbamide, thiobarbituric acid, imidazolidinthion or thiomalic acid.
- the electrolytic bath is contained in a polypropylene or PVC bath holder with a heat insulating coating.
- the bath is heated using quartz, PTFE, porcelain or stabilised stainless steel thermo-plungers. Good cathodic rod movement and electrolyte flow must be maintained.
- the anodes are made of platinum plated titanium, stainless steel, ruthenium, iridium or alloys of the latter two.
- the present invention is not limited to the illustrated example but is capable of various variants and alterations which will be clear to those skilled in the art.
- the bath may contain the following metals: Zr, Se, Te, Sb, Sn, Ga, As, Sr, Be, Bi in negligible quantities.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/452,364 US9567684B2 (en) | 2009-10-15 | 2014-08-05 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US15/898,330 US20180171499A1 (en) | 2009-10-15 | 2018-02-16 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US16/847,699 US20200240030A1 (en) | 2009-10-15 | 2020-04-14 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09173198.4 | 2009-10-15 | ||
EP09173198.4A EP2312021B1 (fr) | 2009-10-15 | 2009-10-15 | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/452,364 Division US9567684B2 (en) | 2009-10-15 | 2014-08-05 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US15/898,330 Continuation US20180171499A1 (en) | 2009-10-15 | 2018-02-16 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
Publications (1)
Publication Number | Publication Date |
---|---|
US20110089040A1 true US20110089040A1 (en) | 2011-04-21 |
Family
ID=41820241
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/905,788 Abandoned US20110089040A1 (en) | 2009-10-15 | 2010-10-15 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US14/452,364 Active 2031-06-26 US9567684B2 (en) | 2009-10-15 | 2014-08-05 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US15/898,330 Abandoned US20180171499A1 (en) | 2009-10-15 | 2018-02-16 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US16/847,699 Pending US20200240030A1 (en) | 2009-10-15 | 2020-04-14 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/452,364 Active 2031-06-26 US9567684B2 (en) | 2009-10-15 | 2014-08-05 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US15/898,330 Abandoned US20180171499A1 (en) | 2009-10-15 | 2018-02-16 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US16/847,699 Pending US20200240030A1 (en) | 2009-10-15 | 2020-04-14 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
Country Status (6)
Country | Link |
---|---|
US (4) | US20110089040A1 (ko) |
EP (1) | EP2312021B1 (ko) |
JP (1) | JP5563421B2 (ko) |
KR (1) | KR101297476B1 (ko) |
CN (1) | CN102041527B (ko) |
HK (1) | HK1157415A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2505691B1 (fr) * | 2011-03-31 | 2014-03-12 | The Swatch Group Research and Development Ltd. | Procédé d'obtention d'un dépôt d'alliage d'or 18 carats 3N |
WO2018066007A1 (en) * | 2016-10-06 | 2018-04-12 | Valmet Plating S.R.L. | A galvanic and thermal process to obtain the coloration of metals, in particular precious metals |
CN107299364A (zh) * | 2017-06-07 | 2017-10-27 | 常州富思通管道有限公司 | 一种镀锌光亮剂及其制备方法 |
Citations (29)
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US2596454A (en) * | 1949-09-10 | 1952-05-13 | Metals & Controls Corp | Gold alloys |
US2660554A (en) * | 1950-11-10 | 1953-11-24 | Barnet D Ostrow | Bright gold and gold alloy plating baths |
US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
US2976180A (en) * | 1957-12-17 | 1961-03-21 | Hughes Aircraft Co | Method of silver plating by chemical reduction |
US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
US3642589A (en) * | 1969-09-29 | 1972-02-15 | Fred I Nobel | Gold alloy electroplating baths |
US3666640A (en) * | 1971-04-23 | 1972-05-30 | Sel Rex Corp | Gold plating bath and process |
US3878066A (en) * | 1972-09-06 | 1975-04-15 | Manfred Dettke | Bath for galvanic deposition of gold and gold alloys |
US4168214A (en) * | 1978-06-14 | 1979-09-18 | American Chemical And Refining Company, Inc. | Gold electroplating bath and method of making the same |
US4192723A (en) * | 1977-08-29 | 1980-03-11 | Systemes De Traitements De Surfaces S.A. | Aqueous solution of monovalent gold and ammonium sulfite complex, process for the preparation thereof and electrolytic bath obtained therefrom for the plating of gold or gold alloys |
US4358351A (en) * | 1980-05-31 | 1982-11-09 | Degussa Aktiengesellschaft | Alkaline bath for the electrolytic deposition of low carat yellow colored gold alloy layers |
US4591415A (en) * | 1983-12-22 | 1986-05-27 | Learonal, Inc. | Plating baths and methods for electro-deposition of gold or gold alloys |
JPS62164890A (ja) * | 1986-01-16 | 1987-07-21 | Seiko Instr & Electronics Ltd | 金銀銅合金めつき液 |
US4687557A (en) * | 1985-03-01 | 1987-08-18 | Heinz Emmenegger | Gold alloys and galvanic bath for the electrolytic deposit thereof |
US4980035A (en) * | 1987-08-21 | 1990-12-25 | Engelhard Corporation | Bath for electrolytic deposition of a gold-copper-zinc alloy |
US5006208A (en) * | 1989-09-06 | 1991-04-09 | Degussa Aktiengesellschaft | Galvanic gold alloying bath |
US5085744A (en) * | 1990-11-06 | 1992-02-04 | Learonal, Inc. | Electroplated gold-copper-zinc alloys |
US5169514A (en) * | 1990-02-20 | 1992-12-08 | Enthone-Omi, Inc. | Plating compositions and processes |
US5244593A (en) * | 1992-01-10 | 1993-09-14 | The Procter & Gamble Company | Colorless detergent compositions with enhanced stability |
EP0566054A1 (en) * | 1992-04-15 | 1993-10-20 | LeaRonal, Inc. | Electroplated gold-copper-silver alloys |
US5340529A (en) * | 1993-07-01 | 1994-08-23 | Dewitt Troy C | Gold jewelry alloy |
US6576114B1 (en) * | 1995-11-03 | 2003-06-10 | Enthone Inc. | Electroplating composition bath |
US20040079449A1 (en) * | 2001-02-07 | 2004-04-29 | Hirokazu Kanekiyo | Iron base rare earth alloy powder and compound comprising iron base rare earth alloy powder and permanent magnet using the same |
US20040195107A1 (en) * | 2001-08-24 | 2004-10-07 | Lionel Chalumeau | Electrolytic solution for electrochemical deposition gold and its alloys |
US6814850B1 (en) * | 1999-06-17 | 2004-11-09 | Umicore Galvanotechnik Gmbh | Acid bath for electrodeposition of glossy gold and gold alloy layers and a gloss additive for same |
US20060011471A1 (en) * | 2003-12-23 | 2006-01-19 | Eric Grippo | Process for manufacturing a ceramic element for a watch case and element obtained by this process |
US20060254924A1 (en) * | 2004-01-16 | 2006-11-16 | Canon Kabushiki Kaisha | Plating solution, process for producing a structure with the plating solution, and apparatus employing the plating solution |
US20060283714A1 (en) * | 2005-06-02 | 2006-12-21 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
WO2009037180A1 (fr) * | 2007-09-21 | 2009-03-26 | G. Aliprandini | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques |
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FR1259407A (fr) | 1960-03-10 | 1961-04-28 | Maison Murat | Bain électrolytique pour dépôt épais d'alliage or-cuivre |
DE1460993A1 (de) | 1965-07-23 | 1970-07-23 | Kieninger & Obergfell | Elektrisches Programmsteuergeraet,vorzugsweise fuer elektrische Haushaltsgeraete,insbesondere Waschmaschinen und Geschirrspuelmaschinen |
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-
2009
- 2009-10-15 EP EP09173198.4A patent/EP2312021B1/fr active Active
-
2010
- 2010-10-15 KR KR1020100100585A patent/KR101297476B1/ko active IP Right Grant
- 2010-10-15 CN CN201010552012.7A patent/CN102041527B/zh active Active
- 2010-10-15 US US12/905,788 patent/US20110089040A1/en not_active Abandoned
- 2010-10-15 JP JP2010232903A patent/JP5563421B2/ja active Active
-
2011
- 2011-10-27 HK HK11111618.6A patent/HK1157415A1/xx unknown
-
2014
- 2014-08-05 US US14/452,364 patent/US9567684B2/en active Active
-
2018
- 2018-02-16 US US15/898,330 patent/US20180171499A1/en not_active Abandoned
-
2020
- 2020-04-14 US US16/847,699 patent/US20200240030A1/en active Pending
Patent Citations (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2596454A (en) * | 1949-09-10 | 1952-05-13 | Metals & Controls Corp | Gold alloys |
US2660554A (en) * | 1950-11-10 | 1953-11-24 | Barnet D Ostrow | Bright gold and gold alloy plating baths |
US2724687A (en) * | 1952-05-08 | 1955-11-22 | Spreter Victor | Baths for the deposit of gold alloys by electroplating |
US2976180A (en) * | 1957-12-17 | 1961-03-21 | Hughes Aircraft Co | Method of silver plating by chemical reduction |
US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
US3642589A (en) * | 1969-09-29 | 1972-02-15 | Fred I Nobel | Gold alloy electroplating baths |
US3666640A (en) * | 1971-04-23 | 1972-05-30 | Sel Rex Corp | Gold plating bath and process |
US3878066A (en) * | 1972-09-06 | 1975-04-15 | Manfred Dettke | Bath for galvanic deposition of gold and gold alloys |
US4192723A (en) * | 1977-08-29 | 1980-03-11 | Systemes De Traitements De Surfaces S.A. | Aqueous solution of monovalent gold and ammonium sulfite complex, process for the preparation thereof and electrolytic bath obtained therefrom for the plating of gold or gold alloys |
US4168214A (en) * | 1978-06-14 | 1979-09-18 | American Chemical And Refining Company, Inc. | Gold electroplating bath and method of making the same |
US4358351A (en) * | 1980-05-31 | 1982-11-09 | Degussa Aktiengesellschaft | Alkaline bath for the electrolytic deposition of low carat yellow colored gold alloy layers |
US4591415A (en) * | 1983-12-22 | 1986-05-27 | Learonal, Inc. | Plating baths and methods for electro-deposition of gold or gold alloys |
US4687557A (en) * | 1985-03-01 | 1987-08-18 | Heinz Emmenegger | Gold alloys and galvanic bath for the electrolytic deposit thereof |
JPS62164890A (ja) * | 1986-01-16 | 1987-07-21 | Seiko Instr & Electronics Ltd | 金銀銅合金めつき液 |
US4980035A (en) * | 1987-08-21 | 1990-12-25 | Engelhard Corporation | Bath for electrolytic deposition of a gold-copper-zinc alloy |
US5006208A (en) * | 1989-09-06 | 1991-04-09 | Degussa Aktiengesellschaft | Galvanic gold alloying bath |
US5169514A (en) * | 1990-02-20 | 1992-12-08 | Enthone-Omi, Inc. | Plating compositions and processes |
US5085744A (en) * | 1990-11-06 | 1992-02-04 | Learonal, Inc. | Electroplated gold-copper-zinc alloys |
US5244593A (en) * | 1992-01-10 | 1993-09-14 | The Procter & Gamble Company | Colorless detergent compositions with enhanced stability |
EP0566054A1 (en) * | 1992-04-15 | 1993-10-20 | LeaRonal, Inc. | Electroplated gold-copper-silver alloys |
US5256275A (en) * | 1992-04-15 | 1993-10-26 | Learonal, Inc. | Electroplated gold-copper-silver alloys |
US5340529A (en) * | 1993-07-01 | 1994-08-23 | Dewitt Troy C | Gold jewelry alloy |
US6576114B1 (en) * | 1995-11-03 | 2003-06-10 | Enthone Inc. | Electroplating composition bath |
US6814850B1 (en) * | 1999-06-17 | 2004-11-09 | Umicore Galvanotechnik Gmbh | Acid bath for electrodeposition of glossy gold and gold alloy layers and a gloss additive for same |
US20040079449A1 (en) * | 2001-02-07 | 2004-04-29 | Hirokazu Kanekiyo | Iron base rare earth alloy powder and compound comprising iron base rare earth alloy powder and permanent magnet using the same |
US20040195107A1 (en) * | 2001-08-24 | 2004-10-07 | Lionel Chalumeau | Electrolytic solution for electrochemical deposition gold and its alloys |
US20060011471A1 (en) * | 2003-12-23 | 2006-01-19 | Eric Grippo | Process for manufacturing a ceramic element for a watch case and element obtained by this process |
US20060254924A1 (en) * | 2004-01-16 | 2006-11-16 | Canon Kabushiki Kaisha | Plating solution, process for producing a structure with the plating solution, and apparatus employing the plating solution |
US20060283714A1 (en) * | 2005-06-02 | 2006-12-21 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
WO2009037180A1 (fr) * | 2007-09-21 | 2009-03-26 | G. Aliprandini | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques |
US20100206739A1 (en) * | 2007-09-21 | 2010-08-19 | The Swatch Group Research And Development Ltd. | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids |
Non-Patent Citations (1)
Title |
---|
Machine translation of the WO 2009/037180 A1, December 31, 2012, pages 1-4. * |
Also Published As
Publication number | Publication date |
---|---|
CN102041527B (zh) | 2014-09-17 |
JP5563421B2 (ja) | 2014-07-30 |
HK1157415A1 (en) | 2012-06-29 |
US20200240030A1 (en) | 2020-07-30 |
EP2312021A1 (fr) | 2011-04-20 |
JP2011084815A (ja) | 2011-04-28 |
EP2312021B1 (fr) | 2020-03-18 |
US20180171499A1 (en) | 2018-06-21 |
US20150027898A1 (en) | 2015-01-29 |
US9567684B2 (en) | 2017-02-14 |
KR20110041424A (ko) | 2011-04-21 |
CN102041527A (zh) | 2011-05-04 |
KR101297476B1 (ko) | 2013-08-16 |
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