US20180171499A1 - Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials - Google Patents
Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials Download PDFInfo
- Publication number
- US20180171499A1 US20180171499A1 US15/898,330 US201815898330A US2018171499A1 US 20180171499 A1 US20180171499 A1 US 20180171499A1 US 201815898330 A US201815898330 A US 201815898330A US 2018171499 A1 US2018171499 A1 US 2018171499A1
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- United States
- Prior art keywords
- bath
- copper
- gold
- cyanide
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
Definitions
- the invention relates to electrolytic deposition in the form of a thick gold alloy layer and the method of fabricating the same.
- the depositions obtained by these known methods have, however, a cadmium content of between 1 and 10%.
- Cadmium facilitates deposition of thick layers, i.e. between 1 and 800 microns and provides a yellow coloured alloy while reducing the quantity of copper contained in the alloy.
- cadmium is extremely toxic and prohibited in some countries.
- the invention therefore relates to a method for the galvanoplastic deposition of a gold alloy on an electrode dipped in a bath that includes metal gold in the form of alkalineaurocyanide, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, characterized in that the alloy metals are copper, in the form of double copper and potassium cyanide, and silver, in cyanide form, allowing a mirror-bright yellow gold alloy to be deposited on the electrode.
- the invention also concerns an electrolytic deposition in the form of a gold alloy obtained from a method according to any of the preceding claims, whose thickness is comprised between 1 and 800 microns and which includes copper, characterized in that it includes silver as the third main compound in a proportion of 75% gold, 21% copper and 4% silver to obtain a bright 3N colour.
- the invention concerns an electrolytic deposition of a gold alloy with a 3N colour which, surprisingly, includes Au—Cu—Ag as its main compounds in proportions that are not known to obtain the 3N colour, i.e. bright yellow.
- the electrolysis is preferably followed by a heat treatment at a temperature of between 200 and 450 degrees Celsius for 1 to 30 minutes in order to obtain a deposition of optimum quality.
- the bath according to the invention provides a deposition in proportions of around 75% gold, 21% copper and 4% silver, corresponding to a 3N colour, 18 carat deposition, very different proportions from the usual electrolytic depositions for this colour, which tend to be depositions of around 75% gold, 12.5% copper and 12.5% silver.
- the bath may also contain a brightener.
- a brightener This is preferably a butynediol derivative, a pyridinio-propanesulfonate or a mixture of the two, a tin salt, sulfonated castor oil, methylimidozole, dithiocarboxylic acid such as thiocarbamide, thiobarbituric acid, imidazolidinthion orthiomalic acid.
- the electrolytic bath is contained in a polypropylene or PVC bath holder with a heat insulating coating.
- the bath is heated using quartz, PTFE, porcelain or stabilised stainless steel thermo-plungers. Good cathodic rod movement and electrolyte flow must be maintained.
- the anodes are made of platinum plated titanium, stainless steel, ruthenium, iridium or alloys of the latter two.
- the present invention is not limited to the illustrated example but is capable of various variants and alterations which will be clear to those skilled in the art.
- the bath may contain the following metals: Zr, Se, Te, Sb, Sn, Ga, As, Sr, Be, Bi in negligible quantities.
- the wetting agent may be of any type that can wet in an alkaline cyanide medium.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
A method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, where the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode.
Description
- This application claims priority from European Patent Application No. 09173198.4 filed Oct. 15, 2009, the entire disclosure of which is incorporated herein by Reference.
- The invention relates to electrolytic deposition in the form of a thick gold alloy layer and the method of fabricating the same.
- In the field of decorative plating, methods are known for producing yellow coloured, electrolytic depositions of gold, with a grade equal to or more than 9 carats, which is ductile, with a thickness of 10 microns and with a high level of tarnish resistance. These depositions are obtained by electrolysis in an alkaline galvanic bath containing 0.1 to 3 g.l−1 cadmium, in addition to gold and copper.
- The depositions obtained by these known methods have, however, a cadmium content of between 1 and 10%. Cadmium facilitates deposition of thick layers, i.e. between 1 and 800 microns and provides a yellow coloured alloy while reducing the quantity of copper contained in the alloy. However, cadmium is extremely toxic and prohibited in some countries.
- 18 carat gold alloys without any cadmium, which contain copper and zinc, are also known. However, these depositions have an excessively pink hue (too rich in copper). Finally, these depositions have poor corrosion resistance which means they tarnish quickly.
- It is an object of the present invention to overcome all or part of the aforementioned drawbacks, by providing a manufacturing method for depositing a thick, yellow coloured, gold alloy layer which has neither zinc nor cadmium as its main constituents.
- The invention therefore relates to a method for the galvanoplastic deposition of a gold alloy on an electrode dipped in a bath that includes metal gold in the form of alkalineaurocyanide, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, characterized in that the alloy metals are copper, in the form of double copper and potassium cyanide, and silver, in cyanide form, allowing a mirror-bright yellow gold alloy to be deposited on the electrode.
- According to other advantageous features of the invention:
-
- the bath includes 1 to 10 g.l−1 gold metal in the form of alkaline aurocyanide;
- the bath includes 30 to 80 g.l−1 copper metal in the form of alkaline double cyanide;
- the bath includes 10 mg.l−1 to 1 g.l−1 silver metal in complex form;
- the bath includes 15 to 35 g.l−1 cyanide;
- he wetting agent has a concentration of between 0.05 and 10 ml.l−1
- the wetting agent is chosen from among polyoxyalkenic, ether phosphate, lauryl sulphate, dimethyldodecylamine-N-oxide, dimethyl(dodecyl) ammonium propane sulfonate;
- the bath includes a concentration of amine between 0.01 and 5 ml.l−1;
- the bath includes a concentration of depolarizer of between 0.1 mg.l−1 and 20 mg.l−1;
- the bath includes phosphate, carbonate, citrate, sulphate, tartrate, gluconate and/or phosphonate type conductive salts;
- the temperature of the bath is kept between 50 and 80° C.;
- the pH of the bath is kept between 8 and 12;
- the method is performed with a current density of between 0.05 and 1.5 A.dm−2;
- the bath respects a proportion of 9.08% gold, 90.85% copper and 0.07% silver.
- The invention also concerns an electrolytic deposition in the form of a gold alloy obtained from a method according to any of the preceding claims, whose thickness is comprised between 1 and 800 microns and which includes copper, characterized in that it includes silver as the third main compound in a proportion of 75% gold, 21% copper and 4% silver to obtain a bright 3N colour.
- The invention concerns an electrolytic deposition of a gold alloy with a 3N colour which, surprisingly, includes Au—Cu—Ag as its main compounds in proportions that are not known to obtain the 3N colour, i.e. bright yellow.
- In the example deposition above, there is a gold alloy, free of toxic metals or metalloids, and in particular free of cadmium, with a 3N yellow colour, a thickness of 200 microns, excellent brightness and with a very high level of resistance to wear and tarnishing.
- This deposition is obtained by electrolysis in an electrolytic bath of the type:
-
- Au: 5.5 g.l−1;
- Cu: 55 g.l−1;
- Ag: 40 mg.l−1;
- KCN: 26 g.l−1;
- pH: 10.5;
- Temperature: 65° C.;
- Current density: 0.3 A.dm−2;
- Wetting agent: 0.05 ml.l−1 NN_Dimethyldodecyl N-oxide;
- Iminodiacetic: 20 g.l−1;
- Ethylenediamene: 0.5 ml:l;
- Gallium, selenium or tellurium: 10 mg.l−1.
- The electrolysis is preferably followed by a heat treatment at a temperature of between 200 and 450 degrees Celsius for 1 to 30 minutes in order to obtain a deposition of optimum quality.
- These conditions provide a cathodic yield of 98 mg.A.min−1 with a deposition speed of around 10 μm per hour in the case of the example.
- Thus, surprisingly, the bath according to the invention provides a deposition in proportions of around 75% gold, 21% copper and 4% silver, corresponding to a 3N colour, 18 carat deposition, very different proportions from the usual electrolytic depositions for this colour, which tend to be depositions of around 75% gold, 12.5% copper and 12.5% silver.
- The bath may also contain a brightener. This is preferably a butynediol derivative, a pyridinio-propanesulfonate or a mixture of the two, a tin salt, sulfonated castor oil, methylimidozole, dithiocarboxylic acid such as thiocarbamide, thiobarbituric acid, imidazolidinthion orthiomalic acid.
- In these examples, the electrolytic bath is contained in a polypropylene or PVC bath holder with a heat insulating coating. The bath is heated using quartz, PTFE, porcelain or stabilised stainless steel thermo-plungers. Good cathodic rod movement and electrolyte flow must be maintained. The anodes are made of platinum plated titanium, stainless steel, ruthenium, iridium or alloys of the latter two.
- Of course, the present invention is not limited to the illustrated example but is capable of various variants and alterations which will be clear to those skilled in the art. In particular, the bath may contain the following metals: Zr, Se, Te, Sb, Sn, Ga, As, Sr, Be, Bi in negligible quantities.
- Moreover, the wetting agent may be of any type that can wet in an alkaline cyanide medium.
Claims (12)
1. A method for the galvanoplastic deposition of a gold alloy on an electrode, the method comprising:
(a) dipping an electrode into a bath, wherein the hath comprises:
gold metal in alkaline aurocyanide form,
copper metal in copper and double potassium cyanide form,
silver metal in cyanide form,
organometallic compounds,
a wetting agent,
a sequestering agent, and
free cyanide,
wherein the bath has a proportion of 9.08% gold, 90.85% copper, and 0.07% silver, and the bath does not comprise cadmium or zinc; and then,
(b) galvanoplastically depositing a bright 3N colour gold alloy made of 75% gold, 21% copper, and 4% silver on the electrode, wherein the gold alloy has a thickness of 200 to 800 μm.
2. The method according to claim 1 , wherein the bath comprises 5.5 g.l−1 of gold metal in alkaline aurocyanide form, 55 g.l−1 of copper metal in copper and double alkaline cyanide form, and 40 mg.l−1 of silver metal in cyanide form.
3. The method according to claim 2 , wherein the bath comprises from 13 to 35 g.l−1 of cyanide.
4. The method according to claim 1 , wherein a concentration of the wetting agent is between 0.05 and 10 ml.l−1.
5. The method according to claim 1 , wherein the wetting agent is selected from the group consisting of poly-oxy-alkenic, ether phosphate, lauryl sulphate, dimethyldodecylamine-N-oxide, and a dimethyl(dodecyl) ammonium propane sulfonate.
6. The method according to claim 1 , wherein the bath further comprises an amine, and wherein a concentration of the amine is between 0.01 and 5 ml.l−1.
7. The method according to claim 1 , wherein the bath further comprises a depolariser, and wherein a concentration of the depolariser is between 0.1 mg.l−1 to 20 mg.l−1.
8. The method according to claim 1 , wherein the bath further comprises at least one conductive salt selected from the group consisting of a phosphate, a carbonate, a citrate, a sulphate, a tartrate, a gluconate, and a phosphonate conductive salt.
9. The method according to claim 1 , wherein the temperature of the hath is kept between 50 and 80° C.
10. The method according to claim 1 , wherein the pH of the bath is kept between 8 and 12.
11. The method according to claim 1 , wherein the galvanoplastically depositing (b) is performed at a current density of between 0.3 A dm−2.
12-13. (canceled)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/898,330 US20180171499A1 (en) | 2009-10-15 | 2018-02-16 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US16/847,699 US20200240030A1 (en) | 2009-10-15 | 2020-04-14 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09173198.4 | 2009-10-15 | ||
EP09173198.4A EP2312021B1 (en) | 2009-10-15 | 2009-10-15 | Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals |
US12/905,788 US20110089040A1 (en) | 2009-10-15 | 2010-10-15 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US15/898,330 US20180171499A1 (en) | 2009-10-15 | 2018-02-16 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
Related Parent Applications (1)
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US12/905,788 Continuation US20110089040A1 (en) | 2009-10-15 | 2010-10-15 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US16/847,699 Continuation US20200240030A1 (en) | 2009-10-15 | 2020-04-14 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
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US20180171499A1 true US20180171499A1 (en) | 2018-06-21 |
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Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
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US12/905,788 Abandoned US20110089040A1 (en) | 2009-10-15 | 2010-10-15 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US14/452,364 Active 2031-06-26 US9567684B2 (en) | 2009-10-15 | 2014-08-05 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US15/898,330 Abandoned US20180171499A1 (en) | 2009-10-15 | 2018-02-16 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US16/847,699 Pending US20200240030A1 (en) | 2009-10-15 | 2020-04-14 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
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US12/905,788 Abandoned US20110089040A1 (en) | 2009-10-15 | 2010-10-15 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
US14/452,364 Active 2031-06-26 US9567684B2 (en) | 2009-10-15 | 2014-08-05 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
Family Applications After (1)
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US16/847,699 Pending US20200240030A1 (en) | 2009-10-15 | 2020-04-14 | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
Country Status (6)
Country | Link |
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US (4) | US20110089040A1 (en) |
EP (1) | EP2312021B1 (en) |
JP (1) | JP5563421B2 (en) |
KR (1) | KR101297476B1 (en) |
CN (1) | CN102041527B (en) |
HK (1) | HK1157415A1 (en) |
Families Citing this family (3)
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CN107299364A (en) * | 2017-06-07 | 2017-10-27 | 常州富思通管道有限公司 | A kind of zinc-plating brightener and preparation method thereof |
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2009
- 2009-10-15 EP EP09173198.4A patent/EP2312021B1/en active Active
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2010
- 2010-10-15 JP JP2010232903A patent/JP5563421B2/en active Active
- 2010-10-15 CN CN201010552012.7A patent/CN102041527B/en active Active
- 2010-10-15 KR KR1020100100585A patent/KR101297476B1/en active IP Right Grant
- 2010-10-15 US US12/905,788 patent/US20110089040A1/en not_active Abandoned
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2011
- 2011-10-27 HK HK11111618.6A patent/HK1157415A1/en unknown
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- 2014-08-05 US US14/452,364 patent/US9567684B2/en active Active
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Also Published As
Publication number | Publication date |
---|---|
JP5563421B2 (en) | 2014-07-30 |
HK1157415A1 (en) | 2012-06-29 |
EP2312021B1 (en) | 2020-03-18 |
US20150027898A1 (en) | 2015-01-29 |
JP2011084815A (en) | 2011-04-28 |
CN102041527B (en) | 2014-09-17 |
US9567684B2 (en) | 2017-02-14 |
US20110089040A1 (en) | 2011-04-21 |
EP2312021A1 (en) | 2011-04-20 |
KR101297476B1 (en) | 2013-08-16 |
CN102041527A (en) | 2011-05-04 |
US20200240030A1 (en) | 2020-07-30 |
KR20110041424A (en) | 2011-04-21 |
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