JP5563421B2 - Method for obtaining yellow gold alloy deposits by electroplating without using toxic metals - Google Patents

Method for obtaining yellow gold alloy deposits by electroplating without using toxic metals Download PDF

Info

Publication number
JP5563421B2
JP5563421B2 JP2010232903A JP2010232903A JP5563421B2 JP 5563421 B2 JP5563421 B2 JP 5563421B2 JP 2010232903 A JP2010232903 A JP 2010232903A JP 2010232903 A JP2010232903 A JP 2010232903A JP 5563421 B2 JP5563421 B2 JP 5563421B2
Authority
JP
Japan
Prior art keywords
bath
gold
copper
silver
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010232903A
Other languages
Japanese (ja)
Other versions
JP2011084815A (en
Inventor
クリストファ・ヘンツィロース
ギド・プランカート
Original Assignee
ザ・スウォッチ・グループ・リサーチ・アンド・ディベロップメント・リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ザ・スウォッチ・グループ・リサーチ・アンド・ディベロップメント・リミテッド filed Critical ザ・スウォッチ・グループ・リサーチ・アンド・ディベロップメント・リミテッド
Publication of JP2011084815A publication Critical patent/JP2011084815A/en
Application granted granted Critical
Publication of JP5563421B2 publication Critical patent/JP5563421B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/18Processes for applying liquids or other fluent materials performed by dipping
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/58Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/005Jewels; Clockworks; Coins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

本発明は、厚い金合金層形態の電解析出物およびその製造方法に関する。   The present invention relates to an electrolytic deposit in the form of a thick gold alloy layer and a method for producing the same.

装飾めっきの分野において、9カラット以上の品位を有し、延性があり、10ミクロンの厚さを有し、高度の耐変色性を有する、黄色をした金の電解析出を製造する方法が知られている。これらの析出物は、金および銅に加えて0.1から3g・l-1のカドミウムを含むアルカリ性の電解浴における電気分解によって得られる。 In the field of decorative plating, there is a known method for producing a yellow gold electrodeposition having a grade of 9 carats or more, ductility, a thickness of 10 microns and a high degree of discoloration resistance. It has been. These deposits are obtained by electrolysis in an alkaline electrolytic bath containing 0.1 to 3 g · l −1 cadmium in addition to gold and copper.

しかし、これらの既知の方法で得られる析出物は、1から10%の間のカドミウム含有率を有する。カドミウムは、厚い層、すなわち、1から800ミクロンの間の層の析出を促進し、合金に含まれる銅の量を減少させながら、黄色をした合金をもたらす。しかし、カドミウムは、極めて有毒であり、いくつかの国において禁止されている。   However, the precipitates obtained by these known methods have a cadmium content of between 1 and 10%. Cadmium promotes the deposition of thick layers, ie between 1 and 800 microns, resulting in a yellowed alloy while reducing the amount of copper contained in the alloy. However, cadmium is extremely toxic and is banned in some countries.

銅および亜鉛を含む、カドミウムを含まない18カラットの合金も知られている。しかし、これらの析出物は、過度にピンク色の色調(銅が過剰)を有する。最後に、これらの析出物は、耐食性が乏しく、このことは急速に変色することを意味している。   Also known is an 18 carat alloy free of cadmium containing copper and zinc. However, these deposits have an excessively pink hue (copper excess). Finally, these deposits have poor corrosion resistance, which means that they rapidly change color.

その主成分として亜鉛もカドミウムも有さない、厚い、黄色をした金合金層を析出させるための製造方法を提供することによって、前述の欠点の全てまたは一部を克服することが本発明の目的である。   It is an object of the present invention to overcome all or part of the aforementioned drawbacks by providing a manufacturing method for depositing a thick, yellowish gold alloy layer that does not have zinc or cadmium as its main component. It is.

したがって、本発明は、アルカリ性の金シアン化物、有機金属化合物の形態の金属金、湿潤剤、金属イオン封鎖剤および遊離シアン化物を含む浴に浸漬させた電極に、金合金を電気めっき析出させる方法に関し、特に、前記浴が、複合の銅およびカリウムシアン化物(double copper and potassium cyanide) の形態の銅、およびシアン化物形態の銀を含み、鏡のように輝く黄色の金合金を電極上に析出させることを特徴とする。   Accordingly, the present invention provides a method for electroplating a gold alloy on an electrode immersed in a bath containing alkaline gold cyanide, metal gold in the form of an organometallic compound, a wetting agent, a sequestering agent and free cyanide. In particular, the bath contains copper in the form of double copper and potassium cyanide and silver in the form of cyanide and deposits a mirror-like yellow gold alloy on the electrode. It is characterized by making it.

本発明の他の有利な特徴によれば、
−上記浴は、アルカリ性のシアン化金形態の1から10g・l-1の金属金を含み、
−上記浴は、アルカリ性の複合シアン化物(double cyanide)形態の30から80g・l-1の金属銅を含み、
−上記浴は、錯体形態の10mg・l-1から1g・l-1の銀金属を含み、
−上記浴は、15から35g・l-1のシアン化物を含み、
−湿潤剤は、0.05から10ml・l-1の間の濃度を有し、
−湿潤剤は、ポリオキシアルケン、エーテルホスフェート、ラウリルサルフェート、ジメチルドデシルアミン−N−オキシド、ジメチル(ドデシル)アンモニウムプロパンスルホネートのうちから選択され、
−上記浴は、0.01から5ml・l-1の間の濃度のアミンを含み、
−上記浴は、0.1mg・l-1から20mg・l-1の間の濃度の減極剤を含み、
−上記浴は、リン酸塩、炭酸塩、クエン酸塩、硫酸塩、酒石酸塩、グルコン酸塩および/またはホスホン酸塩タイプの導電塩を含み、
−上記浴の温度は、50から80℃の間に保たれ、
−上記浴のpHは、8から12の間に保たれ、
−当該方法は、0.05から1.5A・dm-2の間の電流密度を用いて実施され、
−上記浴は、9.08%の金、90.85%の銅および0.07%の銀の比率を守る。
According to another advantageous feature of the invention,
The bath contains 1 to 10 g · l −1 metallic gold in alkaline gold cyanide form;
The bath contains 30 to 80 g · l −1 metallic copper in the form of an alkaline double cyanide;
The bath contains 10 mg · l −1 to 1 g · l −1 silver metal in complex form;
The bath contains 15 to 35 g · l −1 cyanide,
The wetting agent has a concentration between 0.05 and 10 ml·l −1 ;
The wetting agent is selected from among polyoxyalkenes, ether phosphates, lauryl sulfate, dimethyl dodecyl amine-N-oxide, dimethyl (dodecyl) ammonium propane sulfonate;
The bath contains an amine in a concentration between 0.01 and 5 ml·l −1 ;
The bath comprises a depolarizer at a concentration between 0.1 mg · l −1 and 20 mg · l −1 ;
The bath comprises phosphate, carbonate, citrate, sulfate, tartrate, gluconate and / or phosphonate type conductive salts;
The temperature of the bath is kept between 50 and 80 ° C.,
The pH of the bath is kept between 8 and 12,
The method is carried out using a current density between 0.05 and 1.5 A · dm −2 ;
-The bath protects the ratio of 9.08% gold, 90.85% copper and 0.07% silver.

本発明は、請求項のいずれかに記載の方法から得られた金合金形態の電解析出物に関わり、厚さが1から800ミクロンの間に構成され、銅を含み、そして、第3の主要化合物として銀を、75%の金、21%の銅および4%の銀の比率で含んでいて、輝く3N色が得られることを特徴とするものである。   The present invention relates to an electrolytic deposit in the form of a gold alloy obtained from the method according to any of the claims, comprising a thickness between 1 and 800 microns, comprising copper, and a third It contains silver as a main compound in a ratio of 75% gold, 21% copper and 4% silver, and is characterized in that a bright 3N color can be obtained.

本発明は、3N色を有する金合金の電解析出に関わり、驚くべきことに、Au−Cu−Agを主要化合物として知られていない比率で含むものであり、3N色すなわち輝きを呈する黄色が得られる。   The present invention relates to the electrolytic deposition of gold alloys having a 3N color, and surprisingly includes Au—Cu—Ag in a proportion not known as a main compound, and the can get.

上記の実施形態の析出物には、毒性の金属またはメタロイドを含まない、特にカドミウムを含まない、3N黄色、200ミクロンの厚さ、優れた輝きを有し、極めて高度の摩耗および変色に対する耐性を有する金合金が存在する。   The deposits of the above embodiments are free of toxic metals or metalloids, especially cadmium free, 3N yellow, 200 microns thick, excellent shine, and extremely resistant to abrasion and discoloration. There are gold alloys.

この析出物は、次のタイプの電気分解によって電解浴にて得られる。
−金:5.5g・l-1
−銅:55g・l-1
−銀:40mg・l-1
−KCN:26g・l-1
−pH:10.5;
−温度:65℃;
−電流密度:0.3A・dm-2
−湿潤剤:0.05ml・l-1NN_ジメチルドデシルN−オキシド;
−イミノ二酢酸:20g・l-1
−エチレンジアミン:0.5ml・l-1
−ガリウム、セレンまたはテルル:10mg・l-1
This deposit is obtained in an electrolytic bath by the following type of electrolysis.
-Gold: 5.5 g · l -1 ;
-Copper: 55 g · l -1 ;
-Silver: 40 mg · l -1 ;
-KCN: 26 g · l -1 ;
-PH: 10.5;
-Temperature: 65 ° C;
Current density: 0.3 A · dm −2 ;
-Wetting agent: 0.05 ml·l -1 NN_dimethyldodecyl N-oxide;
-Iminodiacetic acid: 20 g · l -1 ;
Ethylenediamine: 0.5 ml·l −1 ;
-Gallium, selenium or tellurium: 10 mg · l -1

好ましくは、電気分解後に、最適な品質の析出物を得るために、200から450℃の間の温度における1から30分間の熱処理を行う。   Preferably, after electrolysis, a heat treatment is carried out for 1 to 30 minutes at a temperature between 200 and 450 ° C. in order to obtain optimal quality precipitates.

これらの条件は、98mg・A・min-1の陰極の収率をもたらし、上記実施形態の場合、1時間当たり約10μmの析出速度をもたらす。 These conditions result in a cathode yield of 98 mg · A · min −1 and , in the case of the above embodiment, a deposition rate of about 10 μm per hour.

したがって、驚くべきことに、本発明による浴は、3N色、18カラット析出物に対応する、約75%の金、21%の銅および4%の銀の比率の析出物をもたらし、当該比率は、上記の色に関する通常の電解析出における比率(約75%の金、12.5%の銅および12.5%の銀と言う比率になる傾向にある)とは非常に異なっている。   Thus, surprisingly, the bath according to the present invention yields a deposit with a ratio of about 75% gold, 21% copper and 4% silver, corresponding to a 3N color, 18 carat deposit, which ratio is , Very different from the ratio in normal electrolytic deposition for the above colors (which tends to be about 75% gold, 12.5% copper and 12.5% silver).

上記浴は光沢剤も含み得る。これは好ましくは、ブチンジオール誘導体、ピリジノ−プロパンスルホネートまたは前記二者の混合物、スズ塩、ロート油、メチルイミダゾール、チオカルバミドなどのジチオカルボン酸、チオバルビツール酸、イミダゾリジンチオンまたはチオリンゴ酸である。   The bath may also contain a brightener. This is preferably a butynediol derivative, pyridino-propane sulfonate or a mixture of the two, tin salts, funnel oil, dithiocarboxylic acids such as methylimidazole, thiocarbamide, thiobarbituric acid, imidazolidinethione or thiomalic acid.

これらの実施形態において、上記電解浴は、断熱被覆されたポリプロピレンまたはPVC浴保持器に収容される。上記浴は、石英、PTFE、磁器、または安定化ステンレス鋼の浸漬電熱器(thermo-plunger)を用いて加熱する。良好な陰極棒の動きおよび電解液の流れを保つ必要がある。陽極は、白金めっきチタン、ステンレス鋼、ルテニウム、イリジウムまたは後二者の合金からなる。   In these embodiments, the electrolytic bath is housed in a heat-insulated polypropylene or PVC bath cage. The bath is heated using a quartz-, PTFE-, porcelain, or stabilized stainless steel thermo-plunger. It is necessary to maintain good cathode rod movement and electrolyte flow. The anode is made of platinum-plated titanium, stainless steel, ruthenium, iridium or the latter two alloys.

当然、本発明は、示した実施形態に限定されることはなく、当業者には明らかである様々な変形および変更が可能である。特に、上記浴は、極微量の以下の金属:Zr、Se、Te、Sb、Sn、Ga、As、Sr、Be、Biを含み得る。   Of course, the present invention is not limited to the embodiments shown, and various modifications and changes will be apparent to those skilled in the art. In particular, the bath may contain trace amounts of the following metals: Zr, Se, Te, Sb, Sn, Ga, As, Sr, Be, Bi.

さらに、湿潤剤は、アルカリ性シアン化物媒体中でぬれることができる任意のタイプのものであってよい。
Further, the wetting agent may be of any type that can be wetted in the alkaline cyanide medium.

Claims (11)

アルカリ性シアン化物形態の金属金、複合アルカリ性シアン化物形態の金属銅、および、シアン化物形態の金属銀、湿潤剤、金属イオン封鎖剤および遊離シアン化物を含む浴に浸漬した電極に、金合金を電気めっき析出させる方法であって、前記浴が、鏡のように輝く黄色の金合金を前記電極上に析出させ、前記浴が、9.08重量%の金、90.85重量%の銅および0.07重量%の銀の比率に守られており、析出物が75重量%の金、21重量%の銅および4重量%の銀を含み、輝く3N色が得られる、ことを特徴とする金合金の電気めっき析出方法。 Gold alloy is electroplated on an electrode immersed in a bath containing metallic gold in alkaline cyanide form, metallic copper in composite alkaline cyanide form, and metallic silver in cyanide form, wetting agent, sequestering agent and free cyanide. A method of plating deposition, wherein the bath deposits a mirror-like yellow gold alloy on the electrode, the bath comprising 9.08 wt % gold, 90.85 wt % copper and 0 0.07% by weight silver, characterized in that the deposit contains 75% by weight gold, 21% by weight copper and 4% by weight silver, giving a brilliant 3N color Electroplating deposition method for alloys. 前記浴が、アルカリ性シアン化金形態の5.5g・l-1の金属金、55g・l-1の複合アルカリ性シアン化物形態の金属銅および錯体形態の40mg・l-1の金属銀を含むことを特徴とする、請求項1に記載の方法。 The bath comprises 5.5 g · l −1 metallic gold in alkaline gold cyanide form, 55 g · l −1 metallic copper in complex alkaline cyanide form and 40 mg · l −1 metallic silver in complex form The method of claim 1, wherein: 前記浴が、15から35g・l-1の遊離シアン化物を含むことを特徴とする、請求項2に記載の方法。 The process according to claim 2, characterized in that the bath contains 15 to 35 g · l -1 free cyanide. 前記湿潤剤が、ポリオキシアルケン、エーテルホスフェート、ラウリルサルフェート、ジメチルドデシルアミン−N−オキシド、および、ジメチル(ドデシル)アンモニウムプロパンスルホネートからなる群から選択されることを特徴とする、請求項1から3のいずれかに記載の方法。   The humectant is selected from the group consisting of polyoxyalkenes, ether phosphates, lauryl sulfate, dimethyl dodecyl amine-N-oxide, and dimethyl (dodecyl) ammonium propane sulfonate. The method in any one of. 前記湿潤剤が、0.05から10ml・l-1の間の濃度を含むことを特徴とする、請求項4に記載の方法。 5. A method according to claim 4, characterized in that the wetting agent comprises a concentration between 0.05 and 10 ml·l −1 . 前記浴が、0.01から5ml・l-1の間の濃度のアミンを含み、ここでアミンがエチレンジアミンであることを特徴とする、請求項1から5のいずれかに記載の方法。 6. A process according to any one of claims 1 to 5, characterized in that the bath comprises an amine concentration between 0.01 and 5 ml·l −1 , wherein the amine is ethylenediamine. 前記浴が、リン酸塩、炭酸塩、クエン酸塩、硫酸塩、酒石酸塩、グルコン酸塩および/またはホスホン酸塩を導電塩として含むことを特徴とする、請求項1から6のいずれかに記載の方法。   7. The bath according to claim 1, characterized in that the bath contains phosphate, carbonate, citrate, sulfate, tartrate, gluconate and / or phosphonate as conductive salts. The method described. 前記浴の温度が、50から80℃の間に維持されることを特徴とする、請求項1から7のいずれかに記載の方法。   The method according to any one of claims 1 to 7, characterized in that the temperature of the bath is maintained between 50 and 80 ° C. 前記浴のpHが、8から12の間に維持されることを特徴とする、請求項1から8のいずれかに記載の方法。   9. A method according to any of claims 1 to 8, characterized in that the pH of the bath is maintained between 8 and 12. 0.3A・dm-2の電流密度で実施されることを特徴とする、請求項1から9のいずれかに記載の方法。 The method according to claim 1, wherein the method is performed at a current density of 0.3 A · dm −2 . 請求項1から10のいずれかに記載の方法から得られる金合金形態の電解析出物であって、厚さが1から800ミクロンの間であり、銅を含み、そして、第3の主要化合物として銀を含み、輝く3N色が得られること、および、75重量%の金、21重量%の銅および4重量%の銀を含み、輝く3N色が得られることを特徴とする電解析出物。 Electrodeposit in the form of a gold alloy obtained from the method according to any of claims 1 to 10, having a thickness between 1 and 800 microns, comprising copper, and a third main compound Electrolytic deposits characterized in that a shining 3N color is obtained with silver as a light source and a shining 3N color with 75% by weight gold, 21% by weight copper and 4% by weight silver. .
JP2010232903A 2009-10-15 2010-10-15 Method for obtaining yellow gold alloy deposits by electroplating without using toxic metals Active JP5563421B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09173198.4 2009-10-15
EP09173198.4A EP2312021B1 (en) 2009-10-15 2009-10-15 Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals

Publications (2)

Publication Number Publication Date
JP2011084815A JP2011084815A (en) 2011-04-28
JP5563421B2 true JP5563421B2 (en) 2014-07-30

Family

ID=41820241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010232903A Active JP5563421B2 (en) 2009-10-15 2010-10-15 Method for obtaining yellow gold alloy deposits by electroplating without using toxic metals

Country Status (6)

Country Link
US (4) US20110089040A1 (en)
EP (1) EP2312021B1 (en)
JP (1) JP5563421B2 (en)
KR (1) KR101297476B1 (en)
CN (1) CN102041527B (en)
HK (1) HK1157415A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2505691B1 (en) 2011-03-31 2014-03-12 The Swatch Group Research and Development Ltd. Process for obtaining a gold alloy deposit of 18 carat 3N
WO2018066007A1 (en) * 2016-10-06 2018-04-12 Valmet Plating S.R.L. A galvanic and thermal process to obtain the coloration of metals, in particular precious metals
CN107299364A (en) * 2017-06-07 2017-10-27 常州富思通管道有限公司 A kind of zinc-plating brightener and preparation method thereof

Family Cites Families (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2127676A (en) * 1938-04-21 1938-08-23 Claude H Coleman Process of tempering gold and silver alloys
US2141157A (en) * 1938-08-23 1938-12-20 Metals & Controls Corp Alloy
US2229463A (en) * 1939-10-21 1941-01-21 Handy & Harman Alloy
US2596454A (en) * 1949-09-10 1952-05-13 Metals & Controls Corp Gold alloys
US2660554A (en) * 1950-11-10 1953-11-24 Barnet D Ostrow Bright gold and gold alloy plating baths
CH286123A (en) * 1952-05-08 1952-10-15 Spreter Victor Bath for the galvanic deposition of gold alloys.
US2976180A (en) * 1957-12-17 1961-03-21 Hughes Aircraft Co Method of silver plating by chemical reduction
FR1259407A (en) 1960-03-10 1961-04-28 Maison Murat Electrolytic bath for thick deposit of gold-copper alloy
DE1460993A1 (en) 1965-07-23 1970-07-23 Kieninger & Obergfell Electrical program control device, preferably for electrical household appliances, especially washing machines and dishwashers
US3475292A (en) * 1966-02-10 1969-10-28 Technic Gold plating bath and process
GB1156186A (en) 1966-09-26 1969-06-25 Sel Rex Corp Gold Plating
BE743946A (en) 1969-01-07 1970-05-28
US3642589A (en) * 1969-09-29 1972-02-15 Fred I Nobel Gold alloy electroplating baths
US3666640A (en) * 1971-04-23 1972-05-30 Sel Rex Corp Gold plating bath and process
DE2121150C3 (en) 1971-04-24 1980-08-21 Schering Ag, 1000 Berlin Und 4619 Bergkamen Process for the electrodeposition of gold alloys
CH529843A (en) 1971-07-09 1972-10-31 Oxy Metal Finishing Europ S A Bath for the electrolytic deposition of gold alloys and its use in electroplating
FR2181455B1 (en) * 1972-04-25 1974-08-30 Parker Ste Continentale
DE2244434C3 (en) * 1972-09-06 1982-02-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Aqueous bath for the galvanic deposition of gold and gold alloys
US3834879A (en) * 1973-05-11 1974-09-10 J Chin Plated coins
JPS6014115B2 (en) * 1977-07-05 1985-04-11 オクシ メタル インダストリ−ズ コ−ポレ−シヨン Shiny low karat silver-gold electrodeposition
CH621367A5 (en) 1977-07-08 1981-01-30 Systemes Traitements Surfaces Electrolytic bath for plating gold-copper-cadmium alloys and its use in galvanoplasty
JPS5433834A (en) * 1977-08-22 1979-03-12 Citizen Watch Co Ltd Golddcopper alloy plating solution
CH622829A5 (en) * 1977-08-29 1981-04-30 Systemes Traitements Surfaces
FR2405312A1 (en) 1977-10-10 1979-05-04 Oxy Metal Industries Corp Bath for electrodeposition of gold-zinc alloys - contains alkali sulphite, gold-sulphite complex, zinc salt, complex or chelate, complexing or chelating agent and metal
US4168214A (en) * 1978-06-14 1979-09-18 American Chemical And Refining Company, Inc. Gold electroplating bath and method of making the same
DE3020765A1 (en) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt ALKALINE BATH FOR GALVANIC DEPOSITION OF LOW-CARAINE PINK TO YELLOW-COLORED GOLD ALLOY LAYERS
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
US4626324A (en) 1984-04-30 1986-12-02 Allied Corporation Baths for the electrolytic deposition of nickel-indium alloys on printed circuit boards
CH662583A5 (en) * 1985-03-01 1987-10-15 Heinz Emmenegger GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS.
JPS62164889A (en) * 1986-01-16 1987-07-21 Seiko Instr & Electronics Ltd Gold-silver-copper alloy plating solution
JPS62164890A (en) * 1986-01-16 1987-07-21 Seiko Instr & Electronics Ltd Gold-silver-copper alloy plating solution
JPH067210B2 (en) * 1986-08-12 1994-01-26 沖電気工業株式会社 Plug-in optical connector
DE3878783T2 (en) * 1987-08-21 1993-07-22 Engelhard Ltd BATH FOR ELECTROPLATING A GOLD-COPPER-ZINC ALLOY.
JPH01247570A (en) 1988-03-29 1989-10-03 Furukawa Electric Co Ltd:The Formation of film of multicomponent substance by beam sputtering
GB8903818D0 (en) 1989-02-20 1989-04-05 Engelhard Corp Electrolytic deposition of gold-containing alloys
DE3929569C1 (en) * 1989-09-06 1991-04-18 Degussa Ag, 6000 Frankfurt, De
US5045411A (en) * 1990-01-10 1991-09-03 P.M. Refining, Inc. Alloy compositions
GB2242200B (en) 1990-02-20 1993-11-17 Omi International Plating compositions and processes
CH680927A5 (en) 1990-10-08 1992-12-15 Metaux Precieux Sa
US5085744A (en) * 1990-11-06 1992-02-04 Learonal, Inc. Electroplated gold-copper-zinc alloys
US5244593A (en) * 1992-01-10 1993-09-14 The Procter & Gamble Company Colorless detergent compositions with enhanced stability
US5256275A (en) * 1992-04-15 1993-10-26 Learonal, Inc. Electroplated gold-copper-silver alloys
JPH067210A (en) * 1992-06-29 1994-01-18 Mitsubishi Materials Corp Method for manufacturing metallic article having inclined pattern
US5340529A (en) * 1993-07-01 1994-08-23 Dewitt Troy C Gold jewelry alloy
CA2235408A1 (en) * 1995-11-03 1997-05-15 Enthone-Omi, Inc. Electroplating processes compositions and deposits
JP2832344B2 (en) * 1996-05-21 1998-12-09 大蔵省造幣局長 Manufacturing method of plated body
DE19629658C2 (en) 1996-07-23 1999-01-14 Degussa Cyanide-free galvanic bath for the deposition of gold and gold alloys
CN1205360C (en) * 1999-06-17 2005-06-08 德古萨电解技术有限公司 Acid bath for galvanic deposition of shining gold and gold alloy layers and brightener therefor
JP4023138B2 (en) * 2001-02-07 2007-12-19 日立金属株式会社 Compound containing iron-based rare earth alloy powder and iron-based rare earth alloy powder, and permanent magnet using the same
FR2828889B1 (en) * 2001-08-24 2004-05-07 Engelhard Clal Sas ELECTROLYTIC BATH FOR THE ELECTROCHEMICAL DEPOSITION OF GOLD AND ITS ALLOYS
KR100442519B1 (en) * 2002-04-09 2004-07-30 삼성전기주식회사 Alloy Plating Solution for Surface Treatment of Modular PCB
EP1548525B2 (en) * 2003-12-23 2017-08-16 Rolex Sa Ceramic element for watch case and method of manufacturing the same
JP4566667B2 (en) * 2004-01-16 2010-10-20 キヤノン株式会社 Plating solution, method of manufacturing structure using plating solution, and apparatus using plating solution
JP2005214903A (en) 2004-01-30 2005-08-11 Kawaguchiko Seimitsu Co Ltd Method of manufacturing dial with index, and dial with index manufactured using the same
SG127854A1 (en) * 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes
EP3170924A1 (en) * 2007-04-19 2017-05-24 Enthone, Inc. Electrolyte and method for electrolytic deposition of gold-copper alloys
CH710184B1 (en) * 2007-09-21 2016-03-31 Aliprandini Laboratoires G Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids.
WO2015038636A1 (en) * 2013-09-10 2015-03-19 Apple Inc. Crystalline gold alloys with improved hardness

Also Published As

Publication number Publication date
CN102041527A (en) 2011-05-04
US20110089040A1 (en) 2011-04-21
KR101297476B1 (en) 2013-08-16
KR20110041424A (en) 2011-04-21
CN102041527B (en) 2014-09-17
US20150027898A1 (en) 2015-01-29
US20200240030A1 (en) 2020-07-30
US20180171499A1 (en) 2018-06-21
US9567684B2 (en) 2017-02-14
HK1157415A1 (en) 2012-06-29
JP2011084815A (en) 2011-04-28
EP2312021A1 (en) 2011-04-20
EP2312021B1 (en) 2020-03-18

Similar Documents

Publication Publication Date Title
US10619260B2 (en) Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids
US20200240030A1 (en) Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials
JPS6223078B2 (en)
US10793961B2 (en) Method of obtaining a 18 carats 3N gold alloy
WO2016020812A1 (en) Electrolytic bath, electrolytic deposition method and item obtained with said method
CH704795A2 (en) Electroplating process useful for the deposition of mirror bright yellow gold alloy on electrode immersed in bath in the manufacture of thick film, where the bath comprises gold metal, organometallic compound and wetting agent
CN116917549A (en) Method for electroplating electrodeposition and related electroplating cell
CH701980A2 (en) Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals.

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130122

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130418

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20131029

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140220

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20140227

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140513

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140612

R150 Certificate of patent or registration of utility model

Ref document number: 5563421

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250