US20090126542A1 - Sheet cutting device and cutting method - Google Patents

Sheet cutting device and cutting method Download PDF

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Publication number
US20090126542A1
US20090126542A1 US11/996,060 US99606006A US2009126542A1 US 20090126542 A1 US20090126542 A1 US 20090126542A1 US 99606006 A US99606006 A US 99606006A US 2009126542 A1 US2009126542 A1 US 2009126542A1
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United States
Prior art keywords
sheet
cutter blade
cutting
cut
adherend
Prior art date
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Abandoned
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US11/996,060
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English (en)
Inventor
Hideaki Nonaka
Kan Nakata
Yoshiaki Sugishita
Kenji Kobayashi
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Lintec Corp
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Lintec Corp
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Publication date
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Assigned to LINTEC CORPORATION reassignment LINTEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOBAYASHI, KENJI, NAKATA, KAN, NONAKA, HIDEAKI, SUGISHITA, YOSHIAKI
Publication of US20090126542A1 publication Critical patent/US20090126542A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/10—Means for treating work or cutting member to facilitate cutting by heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/005—Manipulators for mechanical processing tasks
    • B25J11/0055—Cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/04—Gripping heads and other end effectors with provision for the remote detachment or exchange of the head or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/06—Programme-controlled manipulators characterised by multi-articulated arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/143—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
    • B26D1/153—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with inclined cutting member
    • B26D1/1535—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with inclined cutting member for thin material, e.g. for sheets, strips or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/10—Making cuts of other than simple rectilinear form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/015—Means for holding or positioning work for sheet material or piles of sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/22—Safety devices specially adapted for cutting machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/3846—Cutting-out; Stamping-out cutting out discs or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0385—Rotary scoring blade
    • Y10T83/0393—With means to rotate blade
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0448—With subsequent handling [i.e., of product]
    • Y10T83/0467—By separating products from each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0524—Plural cutting steps
    • Y10T83/0538—Repetitive transverse severing from leading edge of work
    • Y10T83/0543—Alternately forming products of less than total width of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8798—With simple oscillating motion only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8821—With simple rectilinear reciprocating motion only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9457—Joint or connection

Definitions

  • the present invention relates to a sheet cutting device and a cutting method, particularly to a sheet cutting device and a cutting method capable of cutting a sheet along a preset track and performing the cutting of the sheet with high precision.
  • wafers are stuck with a protective sheet for protecting circuit surface thereof, and stuck with a heat sensitive adhesive sheet on the rear surface or front surface thereof.
  • the following methods are known. That is, using a raw strip sheet in which plane-shape sheets corresponding to the shape of the wafer are temporarily stuck on a release liner, the sheet is peeled off from the release liner with a peel plate, and then stuck onto the wafer; or using a raw strip sheet in which a strip of sheet is temporarily stuck on a strip of release liner, the sheet is peeled off from the release liner, stuck onto a wafer, and then cut off along the periphery of the wafer, thus the sheet is stuck onto the wafer (refer to, for example, patent document 1).
  • Patent document 1 Japanese Patent No. 2919938
  • the cutting device in the sticking apparatus disclosed in the patent document 1 is disposed immediately above the sticking table for supporting the wafer, and the sticking apparatus is arranged to be obliged to use such the cutting device, the rotation center of which is on a straight line running through the center of the wafer. Therefore, there is such a disadvantage that an extremely precise alignment between the rotation center of the cutting device and the rotation center of the wafer is required.
  • the cutting direction is to be circumferential direction along the periphery of the wafer, and thereby the cutting device is not adapted to the cutting operation of other plane shapes, for example, the cutting in the direction along the outer periphery of a polygon shape; thus, resulting in a poor versatility as a cutting device.
  • the cutting device is positioned above the wafer, there is such a disadvantage as well that, when a failure occurs on the device, the cutter blade may accidentally touch a hand of a worker while carrying out removal operation of the wafer or maintenance operation, resulting in an injury.
  • the present invention has been proposed in view of the above disadvantages. It is an object of the present invention to provide a sheet cutting device and a cutting method capable of adjusting the posture of a cutter in cutting operation, and even when cutting position is changed accompanying the adjusting of the posture of the cutter, the cutting diameter can be maintained precisely to a preset value; moreover the cutting operation can be carried out without restriction of cutting shape.
  • a sheet cutting device to cut a sheet stuck on an adherend on a sticking table comprising: a robot body and a cutter blade supported on a free-end of the robot body, wherein
  • the robot body is a multi-joint robot having a plurality of joints and these joints are controlled based on numerical information.
  • a sheet cutting device to cut a sheet stuck on an adherend on a sticking table comprising: a robot body disposed beside the sticking table and a cutter blade supported on a free-end of the robot body and arranged so as to move along a preset track, wherein
  • the robot body includes a tool holding chuck on the free-end side, and the cutter blade is detachably attached thereto via the tool holding chuck.
  • the cutter blade may built-in a heater therein.
  • the cutter blade may be arranged so as to vibrate via a vibrating device.
  • the robot body supports the cutter blade so as to adjust the posture of the cutter blade when cutting the sheet along the outer periphery of the adherend.
  • a posture of the cutter blade in the sheet cutting operation maintains a toe-in angle with which the center line of the cutter blade is inclined with respect to the cutting direction viewed from the top in the cutting direction, and a blade edge of the cutter blade is positioned closer to the outer periphery of the adherend than the back portion of the cutter blade.
  • the posture of the cutter blade in the sheet cutting operation may be arranged so as to maintain a camber angle with which the center line of the cutter blade is inclined viewed from the front in the cutting direction, and the sheet can also be cut with no protrusion out of the outer periphery of the adherend.
  • the posture of the cutter blade in the sheet cutting operation maintains a caster angle with which the center line of the cutter blade is inclined in the cutting direction viewed from the side in the cutting direction, and the angle formed between the sheet and the blade edge is kept at an acute angle.
  • an inspection means for inspecting cutter blades is disposed in the vicinity of the robot body.
  • the present invention adopts such a sheet cutting method to cut a sheet stuck on an adherend on a sticking table that
  • a multi-joint robot body having a plurality of joints controlled based on numerical information and holding a cutter blade on a free-end of the robot body in a state enabling to adjust a posture of the cutter blade, and
  • the sheet is cut by movement of the cutter blade along a preset track.
  • the present invention adopts such a sheet cutting method to cut a sheet stuck on an adherend on a sticking table, wherein
  • a cutting device is used, a robot body of which is disposed beside the sticking table and holds a cutter blade on a free end thereof in a state enabling to adjust a posture of the cutter blade, and
  • the cutting device includes a cutter blade and the sheet is cut by movement of the cutter blade along a preset track.
  • the sheet may be cut in a state that the cutter blade is heated.
  • the cutter blade may also cut the sheet while being vibrated.
  • the cutter blade maintains a camber angle with which the center line of the cutter blade is inclined viewed from the front in the cutting direction, and the sheet is cut with no protrusion out of the outer periphery of the adherend.
  • the cutter blade maintains a caster angle with which the center line of the cutter blade is inclined in the cutting direction viewed from the side in the cutting direction, and the sheet is cut while keeping the angle formed between the sheet and the blade edge at an acute angle.
  • the sheet is an adhesive sheet temporarily stuck on a strip of release liner as an adherend via an adhesive, and the adhesive sheet and adhesive are cut without cutting the release liner.
  • the sheet is an adhesive sheet temporarily stuck on a strip of release liner as an adherend via an adhesive
  • a partial cutting is made to form a cutoff line without completely cutting the release liner and/or adhesive sheet.
  • the robot body is controlled in a manner of NC (Numerical Control), the movement amount of the respective joints with respect to a workpiece is controlled based on the corresponding numerical information respectively, and each movement amount is controlled through a program. Therefore, being different from the conventional cutting means, the position of the cutter blade does not have to be changed manually whenever the wafer size is altered. Also, in the conventional cutting means, deviation of cutting diameter caused by the alteration of the posture of the cutter blade had to be adjusted every time of the alterations.
  • the robot body of the present invention can maintain the cutting diameter precisely to a preset value no matter how the posture of the cutter blade is changed.
  • the cutter blade is detachably attached via the tool holding chuck, the cutter blade can be replaced easily and swiftly.
  • the cutter blade incorporates the heater therein, the adhesive sheet can be cut more easily.
  • the cutting performance can be enhanced.
  • the cutter blade is capable to adjust its posture by controlling the joints of the robot, the cutting angle can be altered corresponding to the stiffness and thickness of the sheet, the sectional configuration of the outer periphery of the adherend and the like; thus cutting operation can be achieved in accordance with the purpose.
  • the sheet can be cut with no protrusion out of the outer periphery of the adherend.
  • the sheet cutting force can be reduced.
  • FIG. 1 is a front view schematically showing a sheet sticking apparatus in accordance with an embodiment.
  • FIG. 2 is a perspective view schematically showing the sheet sticking apparatus.
  • FIG. 3 is an enlarged perspective view showing a front-end portion of a cutting device.
  • FIG. 4 is an enlarged perspective view of a cutter blade and an inspection means.
  • FIG. 5 is a partial cross sectional view of a table and the cutting device.
  • FIG. 6 is an explanatory view showing cutting operation of an adhesive sheet while keeping a toe-in angle.
  • FIG. 7 is an explanatory view showing cutting operation of an adhesive sheet while keeping a camber angle.
  • FIG. 8 is an explanatory view showing cutting operation of an adhesive sheet while keeping a caster angle.
  • FIG. 9 is an enlarged cross sectional view showing a state of cut of the adhesive sheet stuck on a wafer.
  • FIG. 1 is a front view schematically showing a sheet sticking apparatus to which a cutting device according to the present invention is applied; and FIG. 2 is a schematic perspective view thereof.
  • a sheet sticking apparatus 10 comprises: a sheet feed-out unit 12 disposed in the upper portion of a base 11 ; a table 13 for supporting a wafer W as an adherend; a press roller 14 for imparting a press force to an adhesive sheet S fed out to the upper surface side of the wafer W to stick the adhesive sheet S to the wafer W; a cutting device 15 for cutting the adhesive sheet S along the outer edge of the wafer W after sticking the adhesive sheet S to the wafer W; an inspection means 16 (refer to FIG.
  • a cutter blade 63 (which will be described later) of the cutting device 15 ; a stock device 17 for storing cutter blades 63 and the like; a peeling apparatus 18 for peeling off unnecessary adhesive sheet S 1 outside the wafer W from the upper surface of the table 13 ; and a winding apparatus 19 for winding the unnecessary adhesive sheet S 1 .
  • the sheet feed-out unit 12 comprises: a support roller 20 for supporting a rolled raw strip sheet L in which a strip of adhesive sheet S is temporarily stuck on one surface of a strip of a release liner PS; a peel plate 22 with which the raw strip sheet L fed out from the support roller 20 is sharply folded back to peel off the adhesive sheet S from the release liner PS; a collection roller 23 for collecting the release liner PS by winding the same; a plurality of guide rollers 25 to 31 disposed between the support roller 20 and the collection roller 23 ; a buffer roller 33 disposed between the guide rollers 25 and 26 ; a tension measuring means 35 disposed between the guide rollers 27 and 28 , which includes a load cell 39 and a tension measuring roller 40 supported by the load cell 39 and positioned at the base side of the peel plate 22 ; and a sticking-angle maintaining means 37 for integrally supporting the peel plate 22 , guide rollers 27 , 28 , 29 , and the tension measuring means 35 , which interacts with the press roller 14 to maintain the sticking angle
  • the guide rollers 27 and 29 are provided with brake shoes 32 , 42 respectively. These brake shoes 32 and 42 are arranged so as, when sticking the adhesive sheet S to the wafer W, to be moved toward/away from the corresponding guide rollers 27 , 29 , by means of cylinders 38 and 48 respectively, to nip the adhesive sheet S to restrain the feeding thereof.
  • the sheet feed-out unit 12 and the tension measuring means 35 and the sticking-angle maintaining means 37 , which constitute the sheet feed-out unit, are the identical to those disclosed in the Japanese Patent Application Laid-Open No. 2005-198806 applied by the applicant of the present invention. Therefore, detailed description thereof will be omitted herein.
  • the table 13 comprises: an outer table 51 having a substantially square shape in plane view; and an inner table 52 having a substantially circular shape in plane view.
  • the outer table 51 is configured in a concave-shape so as to receive the inner table 52 in a state that a gap C is formed between the outer edge of the inner table 52 and the outer table 51 , and is arranged so as to move in the vertical direction with respect to the base 11 via a uniaxial robot 54 .
  • the inner table 52 is arranged so as to move in the vertical direction with respect to the outer table 51 via a uniaxial robot 56 .
  • the outer table 51 and the inner table 52 are arranged so as to move integrally in the vertical direction as well as to move in the vertical direction independently each other. Owing to this, the outer table 51 and the inner table 52 are arranged to be adjustable to a predetermined level position corresponding to the thickness of the adhesive sheet S and the wafer W.
  • the press roller 14 is supported via a portal frame 57 .
  • cylinders 59 , 59 are provided on the upper surface side of the portal frame 57 .
  • the press roller 14 is arranged so as to move in the vertical direction owing to the operation of these cylinders 59 .
  • the portal frame 57 is arranged to be movable in the X-direction in FIG. 1 via a uniaxial robot 60 and a guide rail 61 .
  • the cutting device 15 comprises a robot body 62 and a cutter blade 63 supported on the free-end side of the robot body 62 .
  • the robot body 62 includes a base section 64 , first to sixth arms 65 A to 65 F, which are disposed on the upper surface side of the base section 64 so as to be rotatable in the directions indicated with arrows A to F respectively, and a tool holding chuck 69 attached to the front end side of the sixth arm 65 F; i.e., on the free-end side of the robot body 62 .
  • Each of the second, third and fifth arms 65 B, 65 C, 65 E is provided rotatably within a Y ⁇ Z plane in FIG.
  • each of the first, fourth and sixth arms 65 A, 65 D, 65 F is provided rotatably about the axis thereof.
  • the robot body 62 in this embodiment is controlled by NC (Numerical Control). That is, the movement amount of the respective joints with respect to a workpiece is controlled based on numerical information corresponding thereto, and every movement amount thereof is controlled through a program.
  • NC Genetic Control
  • the robot body 62 of the embodiment can maintain the cutting diameter precisely to a preset value no matter how the posture of the cutter blade is altered.
  • the cutter blade 63 is arranged so as to be moved to a position outside of the area above the table 13 ; i.e., a position beside the table 13 to escape therefrom during non-cutting operation.
  • the tool holding chuck 69 comprises a cutter blade receiver 70 having a substantially cylindrical shape and three chuck claws 71 disposed at positions substantially 120° away from each other in the peripheral direction of the cutter blade receiver 70 , which detachably holds the cutter blade 63 and a suction arm 100 to be described later.
  • Each of the chuck claws 71 has a pointed-edge portion 71 A, inner end of which forms an acute angle, and is arranged so as to move forward/backward in the radial direction with respect to the center of the cutter blade receiver 70 by pneumatic pressure.
  • the cutter blade 63 comprises a blade holder 63 A constituting a base portion and a blade 63 B inserted into the front end of the blade holder 63 A and fixed thereto.
  • the blade holder 63 A has a substantially cylindrical shape, and at the positions substantially 120° away from each other in the peripheral direction of the circumferential surface thereof, grooves 72 having a length extending from the base end to an intermediate portion thereof are formed along the axial direction.
  • the pointed-edge portions 71 A of the chuck claws 71 are arranged to engage with these grooves 72 , and thereby the position of the cutter blade 63 with respect to the tool holding chuck 69 is maintained to be constant.
  • the blade holder 63 A is equipped with a heater (not shown) and a vibrating device (not shown) therein, and is arranged so as to heat the blade 63 B with the heater as well as to vibrate the blade 63 B with the vibrating device.
  • a heater a coil heater can be exemplified; and as the vibrating device, an ultrasonic vibrating device can be exemplified.
  • the cutter blade inspection means 16 is arranged with a camera disposed along with the cutting device 15 .
  • the cutter blade inspection means 16 is for detecting defects of the blade edge 63 D in the cutter blade 63 or adhered state of the adhesive on the blade edge 63 D. It is arranged so that, when a defect is detected or when the amount of the adhesive adhered to the blade exceeds an allowable range, a signal is outputted to a control device (not shown); and corresponding to the signal, the robot body 62 automatically replaces the cutter blade 63 with another one stored in the stock device 17 .
  • the stock device 17 includes a first stocker 17 A for storing each cutter blade 63 and a second stocker 17 B for storing suction arms 100 to suck and hold the wafer W.
  • the cutting device 15 is arranged to be used as a transfer device as well; and thus has such a versatility is provided that, when a suction arm 100 is held in stead of the cutter blade, the wafer can be transferred.
  • the suction arm 100 comprises an arm holder 100 A, which is formed with the same grooves 72 as those of the blade holder 63 A, and a Y-shaped arm section 100 B, which is attached to the arm holder 100 A and has vacuum holes 100 C communicating with a decompression device (not shown) in the front ends thereof.
  • Other suction arms 100 are I-shaped arms having different shapes and arms for sucking different size wafers, and there is such an arrangement as suction arms for handling semiconductor wafers of 8 inch, 12 inch or the like can be stocked.
  • the peeling apparatus 18 comprises a small diameter roller 80 and a large diameter roller 81 .
  • a moving frame F supports the small diameter roller 80 and the large diameter roller 81 .
  • the moving frame F comprises a front frame F 1 and a rear frame F 2 , relatively disposed along the Y-direction in FIG. 2 , the rear frame F 2 being coupled with the front frame F 1 via a connecting member 83 .
  • the rear frame F 2 is supported by a uniaxial robot 85 , while the front frame F 1 is supported by the guide rail 61 . Owing to this, the moving frame F is movable in X-direction in FIG. 2 .
  • An arm member 84 supports the large diameter roller 81 as shown in FIG. 1 .
  • the arm member 84 is arranged so that a cylinder 88 can move the large diameter roller 81 in the direction closer to/away from the small diameter roller 80 by the cylinder 88 .
  • the winding apparatus 19 comprises: a drive roller 90 supported by the moving frame F; and a winding roller 93 , which is supported at the free-end of the rotation arm and abutted on the circumferential surface of the drive roller 90 via a spring 92 to nip the unnecessary adhesive sheet S 1 .
  • a drive motor M is disposed at the shaft end of the drive roller 90 , and it is arranged so that, when the drive roller 90 is driven to rotate by the motor M, the winding roller 93 follows the drive roller 90 to rotate; thereby the unnecessary adhesive sheet S 1 is wound thereon. Note that as the wound amount increases, the winding roller 93 shifts rightward in FIG. 1 against the force of the spring
  • the above angles ⁇ 1 to ⁇ 3 will be described again in other words with reference to the modes shown in FIGS. 6 to 8 .
  • the toe-in angle ⁇ 1 is an angle in a state that the blade edge 63 D of the blade 63 B is closer to the outer periphery of the wafer W than a back portion 63 E;
  • the camber angle ⁇ 2 is an angle in a state that the front end portion 63 F of the blade 63 B is positioned at an outer side than the base portion 63 J;
  • the caster angle ⁇ 3 is an angle in a state that the base portion 63 J of the blade 63 B precedes the front end portion 63 F in the cutting direction.
  • the camber angle is an angle in which the base portion 63 J of the blade 63 B is positioned at the outer side than the front end portion 63 F.
  • the angle formed between the blade edge 63 D and the adhesive sheet S has to be simply an acute angle. Accordingly, there may be such an inclined posture in which the base portion 63 J is positioned behind the front end portion 63 F in the cutting direction.
  • the cutting device 15 is kept in a position where the cutter blade 63 escapes in a position beside the table 13 . And after the adhesive sheet S is stuck onto the upper surface of the wafer W as shown in FIG. 5 , the robot body 62 performs a predetermined operation so that the cutter blade 63 moves to a position above the table 13 .
  • the blade 63 B cuts the adhesive sheet S along the outer shape of the wafer while maintaining the toe-in angle ⁇ 1 , camber angle ⁇ 2 and caster angle ⁇ 3 (refer to FIGS. 6 to 8 ).
  • the blade 63 B may be heated by the coil heater, or may be vibrated by the ultrasonic vibrating device. Owing to this, the adhesive sheet S can be cut matching with the outer periphery of the wafer W in a state that the cutting resistance is reduced to an extremely small level.
  • the adhesive sheet S can be cut close to an intersection P of the upper surface W 1 and the side end surface W 2 of the wafer W. Accordingly, outer periphery of the adhesive sheet S does not protrude out of the outer periphery of the wafer W. Therefore, when the wafer W stuck with the adhesive sheet S is subjected to grinding processing on the rear surface thereof in the following process, such a disadvantage can be prevented that a grinder catches a protruding portion of the sheet.
  • the cutting device 15 removes cutter blade 63 B from the tool holding chuck 69 , and replaces the same with the suction arm 100 .
  • the cutter blade 63 B is subjected to an inspection of the blade edge 63 D by the inspection means 16 .
  • the unacceptable cutter blade 63 B is not used, and a signal is outputted to the control device (not shown) to replace the cutter blade 63 B with a new one, and the unacceptable cutter blade 63 B is stored in the stock device 17 .
  • the cutting device 15 supporting the suction arm 100 sucks the wafer W after completion of cutting the adhesive sheet S, and transfers the same to the next process; and then transfers a next wafer W to be stuck with the adhesive sheet S from a wafer stocker (not shown) to the table 13 .
  • the cutting device performs an operation to store the suction arm 100 to the second stocker 17 B, and attaches a new cutter blade 63 to the tool holding chuck 69 ; thus to prepare for the next cutting operation.
  • the peeling device 16 winds the unnecessary adhesive sheet S 1 . Note that since the winding operation is the identical to the operation disclosed in the Japanese Patent Application Laid-Open No. 2005-198806, detailed description thereof will be omitted.
  • the adhesive sheet S stuck on the wafer W is cut along the outer periphery of the wafer W.
  • the present invention is not limited to the above. Taking as a target an adhesive sheet temporarily stuck on a strip of release liner via an adhesive as an adherend, the adhesive sheet and the adhesive can be cut without cutting the release liner, or the release liner and/or adhesive sheet can be partially cut to form a cutoff line without cutting the same completely.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Cutting Devices (AREA)
  • Control Of Cutting Processes (AREA)
US11/996,060 2005-08-04 2006-07-21 Sheet cutting device and cutting method Abandoned US20090126542A1 (en)

Applications Claiming Priority (5)

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JP2005226334 2005-08-04
JP2005-226334 2005-08-04
JP2006015783A JP4452691B2 (ja) 2005-08-04 2006-01-25 シート切断装置及び切断方法
JP2006-015783 2006-01-25
PCT/JP2006/314484 WO2007015379A1 (ja) 2005-08-04 2006-07-21 シート切断装置及び切断方法

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JP (1) JP4452691B2 (enExample)
KR (1) KR101213966B1 (enExample)
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DE (1) DE112006002063T5 (enExample)
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US20140216221A1 (en) * 2013-02-07 2014-08-07 Nhk Spring Co., Ltd. Method of punching out a damper from a damper material having a constraint layer, punching apparatus used for the method, and attaching apparatus with the punching apparatus
EP2916350A1 (en) * 2014-03-05 2015-09-09 Applied Materials, Inc. Interleaf structure for a processing apparatus and processing apparatus with interleaf structure
US10625425B2 (en) * 2017-03-08 2020-04-21 Honda Motor Co., Ltd. Position and posture adjustment method
CN111906951A (zh) * 2020-07-30 2020-11-10 重庆电子工程职业学院 一种室内装修用地砖切割装置
US11224986B2 (en) * 2019-06-18 2022-01-18 Disco Corporation Cutting apparatus and method of changing consumable parts
US12194615B1 (en) * 2020-02-10 2025-01-14 The United States of America as represented by the Secretary of the U.S. Navy Surface removal system

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US20110000350A1 (en) * 2008-02-22 2011-01-06 Comelz S.P.A. Machine for cutting hides and the like and sheet-like materials in general, with simplified-access worktable
US20140216221A1 (en) * 2013-02-07 2014-08-07 Nhk Spring Co., Ltd. Method of punching out a damper from a damper material having a constraint layer, punching apparatus used for the method, and attaching apparatus with the punching apparatus
US10183414B2 (en) * 2013-02-07 2019-01-22 Nhk Spring Co., Ltd. Method of punching out a damper from a damper material having a constraint layer, punching apparatus used for the method, and attaching apparatus with the punching apparatus
EP2916350A1 (en) * 2014-03-05 2015-09-09 Applied Materials, Inc. Interleaf structure for a processing apparatus and processing apparatus with interleaf structure
US10625425B2 (en) * 2017-03-08 2020-04-21 Honda Motor Co., Ltd. Position and posture adjustment method
US11224986B2 (en) * 2019-06-18 2022-01-18 Disco Corporation Cutting apparatus and method of changing consumable parts
US12194615B1 (en) * 2020-02-10 2025-01-14 The United States of America as represented by the Secretary of the U.S. Navy Surface removal system
CN111906951A (zh) * 2020-07-30 2020-11-10 重庆电子工程职业学院 一种室内装修用地砖切割装置

Also Published As

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WO2007015379A1 (ja) 2007-02-08
US8186254B2 (en) 2012-05-29
CN101237973A (zh) 2008-08-06
CN101237973B (zh) 2011-06-01
TWI349606B (enExample) 2011-10-01
DE112006002063T5 (de) 2008-07-10
JP4452691B2 (ja) 2010-04-21
TW200720037A (en) 2007-06-01
JP2007062004A (ja) 2007-03-15
KR101213966B1 (ko) 2012-12-20
KR20080031940A (ko) 2008-04-11
US20100089216A1 (en) 2010-04-15

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