US10667448B2 - Electronic component mounting method - Google Patents

Electronic component mounting method Download PDF

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US10667448B2
US10667448B2 US15/319,236 US201415319236A US10667448B2 US 10667448 B2 US10667448 B2 US 10667448B2 US 201415319236 A US201415319236 A US 201415319236A US 10667448 B2 US10667448 B2 US 10667448B2
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mounters
board
mounting
lane
production
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US20170127582A1 (en
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Yoshihiro Yasui
Marie TERAZAWA
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Fuji Corp
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Fuji Corp
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Publication of US20170127582A1 publication Critical patent/US20170127582A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/084—Product tracking, e.g. of substrates during the manufacturing process; Component traceability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Definitions

  • the present application relates to an electronic component mounting method used by an electronic component mounting system configured from multiple connected component mounters equipped with dual conveyance lanes and twin mounting heads.
  • Equipment such as solder printers, component mounters, reflow ovens, and board inspection machines is used to produce boards mounted with many electronic components.
  • this equipment is connected to configure a board production line that acts as an electronic component mounting system.
  • component mounters provided with a board conveyance device that includes a conveyance lane for loading and unloading boards, and a component transfer device including a mounting head that picks up electronic components from a component supply device and mounts them on a board are typical.
  • electronic component mounting system configured from multiple connected component mounters are common.
  • a first board loaded into a first conveyance lane is mounted with electronic components using a first mounting head
  • a second board loaded into a second conveyance lane is mounted with electronic components using a second mounting head.
  • first, electronic components are mounted onto a first board loaded into a first conveyance lane using a first mounting head and a second mounting head, during which time a second board is loaded into a second lane.
  • first mounting head and a second mounting head When mounting onto the first board is complete, electronic components are mounted onto the second board loaded into the second conveyance lane using the first mounting head and the second mounting head, during which time the completed first board is unloaded from the first conveyance lane and the next board is loaded. Thereafter, mounting is performed using the first mounting head and the second mounting head alternately at the first conveyance lane and the second conveyance lane.
  • an independent production method has an advantage in that it is possible to perform changeover work at the second conveyance lane while the first board is being produced at the first conveyance lane.
  • an independent production method has a disadvantage in that the mounting heads are idle in a standby state when boards are being loaded into each conveyance lane.
  • a dual production method has an advantage in that mounting heads are not in a standby state while boards are being loaded and unloaded.
  • a dual production method has disadvantages in that the production speeds of the first board and the second board cannot be changed, and complex control is required to prevent the mounting heads from interfering with each other, with mounting heads needing to be in a standby state in order to avoid interference.
  • a component mounting system provided with multiple component mounting devices lined up, the component mounting devices being provided with a board conveyance conveyor configured from a board conveyance path along which multiple types of boards are conveyed, and multiple component mounting means that perform consecutive mounting of components onto multiple types of boards.
  • Each component mounting device of this component mounting system provided with multiple component mounting means performs component mounting operations with respect to one type of board, with each board conveyance path being established such that each type of board is conveyed separately.
  • Patent literature 2 discloses a mounting conditions determining method for determining mounting conditions at a production line provided with multiple component mounters that each include multiple conveyance lanes.
  • This mounting conditions determining method includes a step for allocating board types to each set of conveyance lanes formed from a series of paths, a setting step for setting each of the multiple component mounters as a dedicated device that performs mounting for only one type of board, and a step for determining the quantity of dedicated devices and the quantity of shared devices by changing multiple dedicated devices for at least one shared device. Further, in the embodiment shown in FIGS.
  • the first mounter and second mounter are dedicated for the R lane
  • the third mounter and fourth mounter are dedicated mounters for the F lane
  • the fifth mounter dedicated for the R lane and the sixth mounter dedicated for the F lane are changed for a single shared device.
  • Patent Literature 1 JP-4978398
  • Patent literature 2 JP-A-2009-231812
  • an object of the present application is to provide an electronic component mounting method and electronic component mounting system in which boards are produced with good efficiency on two conveyance lanes using an independent production method in a case in which there is a difference in the quantity of components on two types of boards, a case in which there is a difference in the production quantity of the two boards, or the like.
  • the electronic component mounting method includes: setting a portion of multiple electronic component mounters as independent production mounters and the remaining portion of the multiple electronic component mounters as second lane dedicated mounters; allocating mounting of a first set of electronic components on a first board to a first mounting head of the independent production mounters; and allocating mounting of a second set of electronic components on a second board to a second mounting head of the independent production mounters and to a first mounting head and a second mounting head of the second lane dedicated mounters, the electronic component mounting method being a method in which at least one of the component quantity or the component types are different for the first set of electronic components to be mounted on the first board and the second set of electronic components to be mounted on the second board, and using an electronic component mounting system in which multiple component mounters are arranged in series with respective first conveyance lanes of the component mounters connected in series and respective second conveyance lanes of the component mounters connected in series, the component mounters being equipped with a board conveyance device having a first conveyanc
  • first and second boards, and first and second conveyance lanes are given the prefixes “first” and “second” in this manner merely to distinguish the items from each other; this labeling is purely arbitrary.
  • mounting of a first set of electronic components on the first board for which the mounting load is light is allocated to the first mounting heads of the independent production mounters
  • mounting of a second set of electronic components on the second board for which the mounting load is heavy is allocated to the second mounting heads of the independent production mounters and to the first mounting heads and the second mounting heads of the second lane dedicated mounters.
  • mounting for the first board for which the mounting load is light is allocated to the first mounting heads of only a portion of the multiple component mounters, that is, to a smaller number of mounting heads.
  • mounting for the second board for which the mounting load is heavy is allocated to the first mounting heads of the remaining portion of the multiple component mounters, and to the second mounting heads of all of the component mounters, that is, to a larger number of mounting heads.
  • the present disclosure can be considered as an improved independent production method.
  • At least one of the first mounting heads on the first conveyance lane side for which there is tendency for idle time to occur with conventional independent conveyance methods is allocated to the second conveyance lane, thus the mounting load is allocated evenly across all the mounting heads.
  • the idle time of mounting heads is reduced, improving the operating rate, meaning that panels are produced efficiently by the electronic component mounting system.
  • FIG. 1 is a plan view for illustrating the configuration of an electronic component mounting system, which is an embodiment of the present disclosure.
  • FIG. 2 shows an example of conditions set by a control section in which six component mounters are allocated as independent production mounters and second lane dedicated mounters using the embodiment of an electronic component mounting method.
  • FIG. 3 is a bar chart showing cycle times for first individual machines and second individual machines when producing the bottom surface and the top surface of a double-sided board as a first board and a second board under the setting conditions shown in FIG. 2 .
  • FIG. 4 shows an example of production conditions for a double-sided board when all six component mounters are set to be independent production mounters using a conventional independent production method.
  • FIG. 5 is a bar chart showing cycle times for first individual machines and second individual machines when producing the bottom surface and the top surface of a double-sided board as a first board and a second board under the setting conditions using a conventional independent production method shown in FIG. 4 .
  • FIG. 6 is a flowchart showing the flow for calculating the allocation by the control section of the six component mounters into independent production mounters and second lane dedicated mounters.
  • FIG. 1 is a plan view for illustrating the configuration of electronic component mounting system 1 , which is an embodiment of the present disclosure.
  • Electronic component mounting system 1 uses an embodiment of an electronic component mounting method described later on.
  • Electronic component mounting system 1 is configured from six machines, component mounters 21 to 26 , that have the same configuration.
  • FIG. 1 details of component mounter 23 , arranged as the third mounter from the upstream side, are shown, with outlines of the second and fourth mounters, component mounters 22 and 24 , shown simply by dashed lines.
  • Each of the component mounters 21 to 26 are types with dual conveyance lanes and twin mounting heads, capable of producing two types of boards, K 1 and K 2 , in parallel.
  • Component mounters 21 to 26 are configured from board conveyance device 3 , component transfer device 4 , component supply device 5 , and so on assembled on base 9 .
  • Board conveyance device 3 is provided near the center of component mounters 21 to 26 in the lengthwise direction (Y-axis direction).
  • Board conveyance device 3 is a so-called dual-conveyance lane type device provided with first conveyance lane 31 and second conveyance lane 32 , which are parallel to each other.
  • First board K 1 is loaded into first conveyance lane 31 and stopped at a component mounting position; then, first board K 1 is unloaded after electronic components have been mounted.
  • the first conveyance lanes 31 of the six component mounters 21 to 26 are connected in series and first board K 1 is conveyed through each mounter in order.
  • second board K 2 is loaded into second conveyance lane 32 and stopped at a component mounting position; then, second board K 2 is unloaded after electronic components have been mounted.
  • the second conveyance lanes 32 of the six component mounters 21 to 26 are also connected in series and second board K 2 is conveyed through each mounter in order.
  • First conveyance lane 31 and second conveyance lane 32 have substantially the same construction, so descriptions are given mainly regarding first conveyance lane 31 .
  • first conveyance lane 31 is configured from a pair of guide rails, a pair of conveyor belts, and so on.
  • the pair of guide rails extend parallel to each other in the X-axis direction on base 9 .
  • the pair of conveyor belts are each guided by the guide rails and move with first board K 1 loaded on them.
  • First conveyance lane 31 is provided with a clamp device that positions first board K 1 at a component mounting position provided near the middle of the conveyance lane.
  • Component transfer device 4 is a twin mounting head type device that holds mounting heads 41 and 42 and is able to move in the X-axis direction and Y-axis direction.
  • Component transfer device 4 is configured from mounting heads 41 and 42 , pair of fixed rails 43 and 44 , two head movement rails 45 and 46 , a servo motor, which is not shown, and so on.
  • the pair of fixed rails 43 and 44 are provided intersecting with first conveyance lane 31 and second conveyance lane 32 above board conveyance device 3 .
  • the pair of fixed rails 43 and 44 are provided spaced apart from and parallel to each other.
  • First movement rail 45 and second movement rail 46 span between the pair of fixed rails 43 and 44 , and are able to move in the Y-axis direction (shown by arrows A 1 and A 2 in FIG. 1 ) along fixed rails 43 and 44 .
  • First mounting head 41 is supported on first movement rail 45 and is movable in the X-axis direction (shown by arrow A 3 in FIG. 1 ).
  • Second mounting head 42 is supported on second movement rail 46 and is movable in the X-axis direction (shown by arrow A 4 in FIG. 1 ).
  • Y-axis direction movement of first movement rail 45 and second movement rail 46 , and X-axis direction movement of first mounting head 41 and second mounting head 42 are each independently driven by separate servo motors.
  • First mounting head 41 is provided adjacent to first conveyance lane 31 to be capable of movement, and is capable of mounting electronic components on first board K 1 on first conveyance lane 31 and on second board K 2 on second conveyance lane 32 .
  • second mounting head 42 is provided adjacent to second conveyance lane 32 to be capable of movement, and is capable of mounting electronic components on first board K 1 on first conveyance lane 31 and on second board K 2 on second conveyance lane 32 .
  • control is performed such that there is no interference.
  • Component supply device 5 is provided at the front and rear in the lengthwise direction of component mounter 2 .
  • Component supply device 5 is configured such that multiple tape-type feeders 51 are loadable side by side.
  • Component supply device 5 is not restricted to this and may be configured from a tray-type feeder, or a mixture of tape-type feeders 51 and a tray-type feeder.
  • Component supply device 5 at the bottom in FIG. 1 supplies electronic components to first mounting head 41
  • component supply device 5 at the top in FIG. 1 supplies electronic components to second mounting head 42 .
  • Each component mounter 21 to 26 is controlled from system control section 6 , which is connected via a communication line.
  • a solder printer and solder inspection machine which are not shown, are provided on the upstream side of electronic component mounting system 1 configured from six component mounters 21 to 26 , and a board inspection machine and reflow oven are provided on the downstream side, thus configuring a board production line.
  • Host computer 7 that controls the entire board production line cooperates with system control section 6 .
  • the electronic component mounting method of the present embodiment is performed by control of system control section 6 , host computer 7 , or a combination system control section 6 and host computer 7 .
  • the portion controlling the electronic component mounting method of the present embodiment is referred to simply as the control section.
  • the electronic component mounting method of the present embodiment will be described.
  • the electronic component mounting method of the present embodiment is performed when at least one of the component quantity or the component types are different between a first set of electronic components to be mounted on first board K 1 to be produced at electronic component mounting system 1 and a second set of electronic components to be mounted on second board K 2 to be produced at electronic component mounting system 1 . That is, the electronic component mounting method of the present embodiment is performed when the types of the first board and the second board are different. Also, a first production quantity N 1 , which is the quantity of first boards K 1 to be produced, and a second production quantity N 2 , which is the quantity of second boards K 2 to be produced, are determined in advance.
  • first board K 1 and second board K 2 for example, one may consider the combination of the bottom surface and the top surface of a double-sided board.
  • Electronic component mounting system 1 handles the top side and the bottom side of the double-sided board internally as boards of a different type to each other.
  • the quantity of electronic components to be mounted on the double-sided board many components are to be mounted on the top surface and few component are to be mounted on the bottom surface. Further, usually, the production quantity is the same for the top surface and the bottom surface of a double-sided board.
  • first board K 1 and two second boards K 2 are combined as a set to make one final product.
  • the production quantity of first board K 1 will be half the production quantity of second board K 2 .
  • the size relationship of the component quantity is uncertain for the first set of electronic components to be mounted on first board K 1 and the second set of electronic components to be mounted on second board K 2 .
  • the control section considers the component quantities and production quantities of two types of boards, and determines to produce first board K 1 for which the mounting load is light at first conveyance lane 31 , and to produce second board K 2 for which the mounting load is heavy at second conveyance lane K 2 .
  • first and second boards K 1 and K 2 , and first and second conveyance lanes 31 and 32 are given the prefixes “first” and “second” merely to distinguish the items from each other; this labeling is purely arbitrary.
  • first conveyance lane 31 and first mounting head 41 are arranged at the bottom of FIG. 1 and second conveyance lane 32 and second mounting head 42 are arranged at the top of FIG. 1
  • the labels “first” and “second” may be switched.
  • the control section sets a portion of the six component mounters 21 to 26 as independent production mounters 2 D, and sets the remaining portion as second lane dedicated mounters 2 S.
  • independent production mounters 2 D electronic components are mounted on first board K 1 on first conveyance lane 31 using first mounting head 41
  • electronic components are mounted on second board K 2 on second conveyance lane 32 using second mounting head 42 .
  • second lane dedicated mounters 2 S first board K 1 is passed through first conveyance lane 31 , and electronic components are mounted on second board K 2 on second conveyance lane 32 using first mounting head 41 and second mounting head 42 . That is, with second lane dedicated mounter 2 S, first mounting head 41 is allocated to help at second conveyance lane 32 .
  • Control section has a control target to match first production required time T 1 , which is a time estimated to be required for the production of first production quantity N 1 of first boards K 1 , and second production required time T 2 , which is a time estimated to be required for the production of second production quantity N 2 of second boards K 2 .
  • first production required time T 1 which is a time estimated to be required for the production of first production quantity N 1 of first boards K 1
  • second production required time T 2 which is a time estimated to be required for the production of second production quantity N 2 of second boards K 2 .
  • the control section appropriately allocates the six component mounters 21 to 26 as independent production mounters 2 D and second lane dedicated mounters 2 S.
  • first individual machine cycle time CT 1 of each independent production mounter 2 D is balanced to be approximately the same.
  • first individual machine cycle time CT 1 includes mounting time and conveyance time.
  • Mounting time is the time required to mount electronic components allocated to first mounting head 41 of each independent production mounter 2 D on first board K 1 .
  • Conveyance time is the sum of the time for loading and positioning of first board K 1 by each first conveyance lane 31 of independent production mounter 2 D before component mounting, and the time for unloading following release of first board K 1 after component mounting.
  • Second individual machine cycle time CT 2 similar to first individual machine cycle time CT 1 , includes mounting time and conveyance time.
  • Mounting time is the time required to mount electronic components allocated to second mounting head 42 of each independent production mounter 2 D on second board K 2 , and the time required to mount electronic components allocated to first mounting head 41 and second mounting head 42 of each second lane dedicated mounters 2 S on second board K 2 .
  • conveyance time is the sum of the time for loading and positioning of second board K 2 by each second conveyance lane 32 of the six component mounters 21 to 26 before component mounting, and the time for unloading following release of second board K 2 after component mounting.
  • FIG. 2 shows an example of conditions set by the control section in which six components mounters 21 to 26 are allocated as independent production mounters 2 D and second lane dedicated mounters 2 S using the embodiment of an electronic component mounting method.
  • first board K 1 to be produced at first conveyance lane 31 is the bottom surface of a double-sided board
  • second board K 2 to be produced at second conveyance lane 32 is the top surface of the same double-sided board.
  • mounting is performed by conveying the board once each through first conveyance lane 31 and second conveyance lane 32 , the order being unimportant.
  • the first and second mounters from the upstream side of component mounting system 1 , component mounters 21 and 22 , are allocated as second lane dedicated mounters 2 S.
  • second lane dedicated mounters 2 S electronic components are mounted on second board K 2 using first mounting head 41 and second mounting head 42 .
  • the third to sixth mounters from the upstream side, component mounters 23 to 26 are allocated as independent production mounters 2 D.
  • independent production mounters 2 D as shown by arrow D 1 , electronic components are mounted on first board K 1 using first mounting head 41 , and, as shown by arrow D 2 , electronic components are mounted on second board K 2 using second mounting head 42 .
  • FIG. 3 is a bar chart showing cycle times CT 1 and CT 2 for first individual machines and second individual machines when producing the bottom surface and the top surface of a double-sided board as a first board K 1 and a second board K 2 under the setting conditions shown in FIG. 2 .
  • first individual machine cycle time CT 1 is shown by a white bar
  • second individual machine cycle time CT 2 is shown by a shaded bar.
  • first individual machine cycle times CT 1 for each independent production mounter 2 D ( 23 to 26 ) are largely balanced.
  • the small first individual machine cycle time CT 1 shown for second lane dedicated mounters 2 S ( 21 and 22 ) represents the pass-through conveyance time of first board K 1 .
  • the maximum value for first individual machine cycle time CT 1 occurs for the third component mounter 23 . This value is taken as first lane cycle time LT 1 . Conveyance timing for conveying first board K 1 downstream in order in first conveyance lane 31 is determined based on first lane cycle time LT 1 , thus determining the production speed of first board K 1 .
  • second individual cycle times CT 2 of each of the six component mounters 21 to 26 are largely balanced.
  • the maximum value for second individual machine cycle time CT 2 occurs for the fifth component mounter 25 .
  • This value is taken as second lane cycle time LT 2 .
  • Conveyance timing for conveying second board K 2 downstream in order in second conveyance lane 32 is determined based on second lane cycle time LT 2 , thus determining the production speed of second board K 2 .
  • first lane cycle time LT 1 and second lane cycle time LT 2 are approximately the same. This means that the bottom surface and the top surface of the double-sided board are produced at approximately the same production speed.
  • FIG. 4 shows an example of production conditions for a double-sided board when all six component mounters 21 to 26 are set to be independent production mounters 2 J using a conventional independent production method.
  • the conventional independent production method with all of the component mounters 21 to 26 , as shown by arrow J 1 , electronic components are mounted on first board K 1 using first mounting head 41 . Also, with all of the component mounters 21 to 26 , as shown by arrow J 2 , electronic components are mounted on second board K 2 using second mounting head 42 .
  • FIG. 5 is a bar chart showing cycle times CT 1 J and CT 2 J for first individual machines and second individual machines when producing the bottom surface and the top surface of a double-sided board as a first board K 1 and a second board K 2 under the setting conditions using the conventional independent production method shown in FIG. 4 .
  • first individual machine cycle time CT 1 J is shown by a white bar
  • second individual machine cycle time CT 2 J is shown by a shaded bar.
  • first individual machine cycle times CT 1 J of all of the mounters are largely balanced.
  • the maximum value for first individual machine cycle time CT 1 J occurs for the second component mounter 22 .
  • This value is taken as first lane cycle time LT 1 J.
  • second individual machine cycle times CT 2 J of all of the mounters are largely balanced.
  • the maximum value for first individual machine cycle time CT 2 J occurs for the first component mounter 21 . This value is taken as second lane cycle time LT 2 J.
  • first lane cycle time LT 1 J is substantially smaller than second lane cycle time LT 2 J. This means that there is a large difference in the production speed of the bottom surface and the production speed of the top surface of the double-sided board. Also, first conveyance lane 31 and first mounting head 41 are idle for a time corresponding to second lane cycle time LT 2 J minus first lane cycle time LT 1 J.
  • second lane cycle time LT 2 using the present embodiment is reduced by around 30% compared to second lane cycle time LT 2 J using the conventional independent production method. That is, according to the electronic component mounting method of the present embodiment, the time required for production of the double-sided board is reduced by around 30%.
  • the control section estimates first production required time T 1 and second production required time T 2 based on estimation conditions of the six component mounters 21 to 26 provisionally allocated as independent production mounters 2 D and second lane dedicated mounters 2 S; the control section then actually allocates the six component mounters 21 to 26 as independent production mounters 2 D and second lane dedicated mounters 2 S based on the estimation results.
  • a representative example of an estimation calculating method that corresponds to so-called simulation as outlined above is described below.
  • FIG. 6 is a flowchart showing the flow for calculating the allocation by the control section of the six component mounters 21 to 26 as independent production mounters 2 D and second lane dedicated mounters 2 S.
  • the calculating flow performed by the control section includes initial setting step S 1 , cycle time estimation step S 2 , determining step S 3 , change settings step S 4 , and final setting step S 5 .
  • initial setting step S 1 the control section assumes initial estimation conditions in which all six component mounters 21 to 26 are all provisionally set as independent production mounters 2 D. This is similar to a setting condition of the conventional independent production method shown as an example in FIG. 4 .
  • cycle time estimation step S 2 the control section allocates a first set of electronic components to first mounting heads 41 of independent production mounters 2 D at that point, then estimates first individual machine cycle time CT 1 required for mounting onto first board K 1 at each independent production mounter 2 D. Also, the control section takes the maximum value of first individual machine cycle time CT 1 as first lane cycle time LT 1 . Similarly, the control section allocates a second set of electronic components to second mounting head 42 of independent production mounters 2 D at that point and to first mounting head 41 and second mounting head 42 of second lane dedicated mounters 2 S at that point, then estimates the second individual machine cycle times CT 2 required each for mounting by the multiple component mounters 21 to 26 onto the second board. Further, the control section takes the maximum value of second individual machine cycle time CT 2 as second lane cycle time LT 2 .
  • control section appropriately allocates the first set of electronic components such that the first individual cycle times CT 1 of each independent production mounter 2 D are largely balanced.
  • control section appropriately allocates the second set of electronic components such that the second individual cycle times CT 2 of all six of the component mounters 21 to 26 are largely balanced.
  • Various known technology can be applied for a method of appropriately allocating many electronic components to be mounted to multiple mounting heads of multiple component mounters. For example, there are simple methods that allocate each component mounter 21 to 26 so as to optimize only the types of electronic components and mounting quantity of electronic components; or there are more subtle methods that perform optimization considering the arrangement order of tape-type feeders 51 in component supply device 5 and the mounting order of the electronic components.
  • control section is able to acquire values corresponding to first and second individual machine cycle times CT 1 J and CT 2 J, and first and second lane cycle times LT 1 J and LT 2 J by the conventional independent production method shown in FIG. 5 .
  • the control section determines whether first production required time T 1 calculated by multiplying first lane cycle time LT 1 J by first production quantity N 1 and second production required time T 2 calculated by multiplying second lane cycle time LT 2 J by second production quantity N 2 are approximately the same. However, because for production of the double-sided board, first production quantity N 1 and second production quantity N 2 are the same, the control section may determine whether first lane cycle time LT 1 J and second lane cycle time LT 2 J are approximately the same.
  • first lane cycle time LT 1 J is substantially smaller than second lane cycle time LT 2 J; in other words, first production required time T 1 is smaller than second production required time T 2 .
  • the control section proceeds to change settings step S 4 .
  • step S 4 the control section performs setting changes to the allocation of one of the independent production mounters 2 D at that point to a second lane dedicated mounter 2 S, thus changing the estimation conditions, and then returns to cycle time estimation step S 2 .
  • the control section selects the component mounter with the largest second individual machine cycle time CT 2 to be allocated as a second lane dedicated mounter 2 S.
  • the independent production mounter 2 D hindering the shortening of second lane cycle time LT 2 is allocated as a second lane dedicated mounter 2 S with priority. Accordingly, the independent production mounter 2 D which is the bottleneck of second production required time T 2 is able to be resolved.
  • the control section may select any of component mounters 21 to 26 to be allocated as a second lane dedicated mounter 2 S.
  • the control section in order to resolve the independent production mounter that is the bottleneck, allocates the first component mounter 21 (refer to FIG. 5 ), which has the largest second individual machine cycle time CT 2 , as a second lane dedicated mounter 2 S.
  • the control section For the selection criteria for the component mounter to be allocated as a second lane dedicated mounter 2 S, there are two methods, separate method 1 and separate method 2 .
  • the control section from the independent production mounters 2 D at that point, allocates a component mounter that includes a second mounting head 42 to which many components are allocated as a second lane dedicated mounter 2 S.
  • the control section performs a simulation to select the component mounter to allocated as a second lane dedicated mounter 2 S. As described above, the control section, first, supposes for all cases of allocating any one of the independent production mounters 2 D at that point as a second lane dedicated mounter 2 S.
  • control section estimates each second lane cycle time LT 2 using the same method as in cycle time estimating step S 2 .
  • the control section actually allocates the independent production mounter 2 D for which the second lane cycle time LT 2 is minimized as a second lane dedicated mounter 2 S.
  • the control section changes estimation conditions by allocating the first component mounter 21 as a second lane dedicated mounter 2 S, and then returns to cycle time estimation step S 2 . Thereafter, the control section repeats cycle time estimation step S 2 , determining step S 3 , and change settings step S 4 until first production required time T 1 and second production required time T 2 are approximately the same. With production of a double-sided board, the control section may repeat each step S 2 to S 4 until first lane cycle time LT 1 J becomes larger than or approximately the same as second lane cycle time LT 2 J.
  • first production required time T 1 is still smaller than second production required time T 2 . Therefore, in the second change settings step S 4 , the control section, from the second to sixth component mounters 22 to 26 set as independent production mounters 2 D, changes estimation conditions by allocating the second component mounter 22 as a second lane dedicated mounter 2 S. Then, the control section returns to perform cycle time estimation step S 2 for a third time.
  • the control section is able to achieve values corresponding to the first and second individual machine cycle times CT 1 and CT 2 , and the first and second lane cycle times LT 1 and LT 2 shown in FIG. 3 .
  • the control section proceeds to final setting step S 5 .
  • final setting step S 5 the control section actually allocates the six component mounters 21 to 26 as independent production mounters 2 D and second lane dedicated mounters 2 S based on the estimation conditions at that point. Specifically, the control section, as per the setting changes in the first and second change setting steps S 4 , finally sets first and second component mounters 21 and 22 as second lane dedicated mounters 2 S. Also, the control section finally sets the third to sixth component mounters 23 to 26 , for which settings were not changed, as independent production mounters 2 D. In this way, the control section appropriately allocates the six component mounters 21 to 26 as independent production mounters 2 D and second lane dedicated mounters 2 S.
  • the electronic component mounting method of the present embodiment includes setting a portion of multiple electronic component mounters 21 to 26 as independent production mounters 2 D and the remaining portion of the multiple electronic component mounters 21 to 26 as second lane dedicated mounters 2 S; allocating mounting of a first set of electronic components on a first board K 1 to first mounting head 41 of independent production mounters 2 D; and allocating mounting of a second set of electronic components on a second board K 2 to second mounting head 42 of the independent production mounters 2 D and to first mounting head 41 and second mounting head 42 of second lane dedicated mounters 2 S, the electronic component mounting method being a method in which at least one of the component quantity or the component types are different for the first set of electronic components to be mounted on the first board K 1 and the second set of electronic components to be mounted on the second board K 2 , and using an electronic component mounting system in which multiple component mounters 21 to 26 are arranged in series with respective first conveyance lanes 31 of the component mounters connected in series and respective second conveyance lanes 32 of the component mounters connected in series, the component mounters
  • first board K 1 for which the mounting load is light is produced at first conveyance lane 31
  • second board K 2 for which the mounting load is heavy is produced at second conveyance lane 32 .
  • mounting of a first set of electronic components on first board K 1 for which the mounting load is light is allocated to first mounting heads 41 of the independent production mounters 2 D
  • mounting of a second set of electronic components on second board K 2 for which the mounting load is heavy is allocated to second mounting heads 42 of the independent production mounters 2 D and to first mounting heads 41 and second mounting heads 42 of the second lane dedicated mounters 2 D.
  • first board K 1 for which the mounting load is light is allocated to first mounting heads 41 of only a portion, 23 to 26 , of the six component mounters 21 to 26 .
  • second board K 2 for which the mounting load is heavy is allocated to first mounting heads 31 of the remaining portion, 21 and 22 , of the six component mounters, and to second mounting heads 42 of all of the component mounters 21 to 26 .
  • the present disclosure can be considered as an improved independent production method.
  • At least one of first mounting heads 41 on the first conveyance lane 31 side for which there is tendency for idle time to occur with conventional independent conveyance methods is allocated to second conveyance lane 32 , thus the mounting load is allocated evenly across all mounting heads 41 and 42 .
  • the idle time of mounting heads 41 and 42 is reduced, improving the operating rate, meaning that panels are produced efficiently by electronic component mounting system 1 .
  • the electronic component mounting method of the present embodiment allocates the six component mounters 21 to 26 as independent production mounters 2 D and second lane dedicated mounters 2 S such that first production required time T 1 that is an estimate of the time required to produce first production quantity N 1 of first board K 1 and second production required time T 2 that is an estimate of the time required to produce second production quantity N 2 of second board K 2 are approximately the same, wherein first production quantity N 1 , which is the quantity of first board K 1 to be produced, and second production quantity N 2 , which is the quantity of second board K 2 to be produced, are predetermined.
  • first production required time T 1 and second production required time T 2 are approximately the same, the idle time of mounting heads 41 and 42 is greatly reduced, greatly improving the operating rate, and allowing boards to be produced with an entirely higher level of efficiency.
  • first production required time T 1 and second production required time T 2 are estimated based on estimation conditions of the six component mounters 21 to 26 provisionally allocated as independent production mounters 2 D and second lane dedicated mounters 2 S; and then the six component mounters 21 to 26 are actually allocated as independent production mounters 2 D and second lane dedicated mounters 2 S based on the estimation results.
  • the electronic component mounting method of the present embodiment is more reliable than a method that relies on experience or intuition, and reliably allows boards to be produced efficiently.
  • the electronic component mounting method of the present embodiment includes initial setting step S 1 of deciding initial estimation conditions by provisionally setting all six component mounters 21 to 26 as independent production mounters 2 D, cycle time estimating step S 2 of allocating the first set of electronic components to first mounting head 41 of independent production mounters 2 D at that point, estimating first individual machine cycle time CT 1 that is the time required for mounting onto first board K 1 for each of independent production mounters 2 D, then taking the largest value of first individual machine cycle time CT 1 as first lane cycle time LT 1 , allocating the second set of electronic components to second mounting head 42 of independent production mounters 2 D at that point and to first mounting head 41 and second mounting head 42 of second lane dedicated mounters 2 S at that point, estimating second individual machine cycle time CT 2 that is the time required for mounting onto second board K 2 for each of the six component mounters 21 to 26 , and then taking the largest value of second individual machine cycle time CT 2 as second lane cycle time LT 2 , determining step S 3 of determining whether first production required time T 1 obtained by multiplying
  • second lane dedicated mounters 2 S are increased one by one, a subtle simulation with high reliability is performed, and boards are reliably able to be produced efficiently.
  • the first set of electronic components are appropriately allocated to first mounting heads 41 of the independent component mounters 2 D at that point such that first individual machine cycle times CT 1 of each of the independent component mounters 2 D approximately balance
  • the second set of electronic components are appropriately allocated to second mounting heads 42 of the independent component mounters 2 D at that point and to first mounting heads 41 and second mounting head 42 of the second lane dedicated mounters 2 S at that point such that second individual machine cycle times CT 2 of each of the six component mounters 21 to 26 approximately balance.
  • the component mounter with the largest second individual machine cycle time CT 2 from among the independent production mounters 2 D at that point, or the component mounter for which second mounting head 42 has the largest quantity of components allocated from among the independent production mounters 2 D at that point, is allocated as a second lane dedicated mounter 2 S.
  • the independent production mounter 2 D hindering the shortening of second lane cycle time LT 2 is allocated as a second lane dedicated mounter 2 S with priority, allowing the independent production mounter 2 D that is the bottleneck of second production required time T 2 to be resolved.
  • the load is evenly spread between each of the six component mounters 21 to 26 , meaning that boards are able to be produced with an entirely higher level of efficiency.
  • step S 4 calculations are performed for all cases of allocating any one of the independent production mounters 2 D at that point as a second lane dedicate mounter 2 S, and for each case, using the same method as cycle time estimation step S 2 , each second lane cycle time LT 2 is estimated, and the independent production mounter 2 D for which second lane cycle time LT 2 is smallest is actually allocated as a second lane dedicated mounter 2 S.
  • first board K 1 is the bottom surface of a double-sided board
  • second board K 2 is the top surface of the double-sided board.
  • Electronic component mounting system 1 of the present embodiment includes: six component mounters 21 to 26 arranged in series with respective first conveyance lanes 31 of the component mounters connected in series and respective second conveyance lanes 32 of the component mounters connected in series, the component mounters being equipped with board conveyance device 3 having first conveyance lane 31 that loads and unloads first board K 1 and second conveyance lane 32 that loads and unloads second board K 2 , and board transfer device 4 having first mounting head 41 , provided adjacent to first conveyance lane 31 , that is capable of movement and of mounting electronic components on first board K 1 loaded on first conveyance lane K 1 and of mounting electronic components on second board K 2 loaded on second conveyance lane K 2 , and second mounting head 42 , provided adjacent to second conveyance lane 32 , that is capable of movement and of mounting electronic components on first board K 1 loaded on first conveyance lane 31 and of mounting electronic components on second board K 2 loaded on second conveyance lane 32 , wherein electronic component mounting system 1 , when at least one of the component quantity or the component types are
  • the present disclosure may be applied as electronic component mounting system 1 .
  • the effects of an embodiment of electronic component mounting system 1 are the same as the effects of the electronic component mounting method of the first embodiment.
  • the control section may proceed to change settings step S 4 again without proceeding to final setting step S 5 .
  • the control section from the component mounters 23 to 26 set as independent production mounters 2 D at that point, that is, the third to the sixth component mounter, the component mounter with the largest second individual machine cycle time CT 2 , that is the fifth component mounter 25 (refer to FIG. 3 ) is allocated as a second lane dedicated mounter 2 S.
  • the control section may grasp that the first lane cycle time LT 1 is now larger than the second lane cycle time LT 2 , thus reversing their size relationship. By this, the control section proceeds to final setting step S 5 from the fourth determining step S 3 . Also, in final setting step S 5 , the control section may compare a case of two second lane dedicated mounters 2 S (as shown in FIGS. 3 and 4 ) and a case of three second lane dedicated mounters 2 S, and then make a final determination.
  • a simulation may be performed for every allocation of the six component mounters 21 to 26 as independent production mounters 2 D and second lane dedicated mounters 2 S.
  • each component mounter 21 to 26 could be either an independent production mounter 2 D or a second lane dedicated mounter 2 S
  • simulations may be performed two to the power of six times, that is, sixty-four times.
  • first production required time T 1 and second production required time T 2 may be appropriately allocated as independent production mounters 2 D and second lane dedicated mounters 2 S to achieve the time ratio. Accordingly, first and second conveyance lanes with a production performance ratio (mounting work performance ratio) in accordance with the time ratio is achieved.
  • a production performance ratio mounting work performance ratio

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
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JP6670585B2 (ja) * 2015-10-30 2020-03-25 Juki株式会社 管理装置
WO2018146772A1 (fr) * 2017-02-09 2018-08-16 株式会社Ｆｕｊｉ Dispositif d'optimisation pour chaîne de production
WO2019030876A1 (fr) * 2017-08-09 2019-02-14 株式会社Ｆｕｊｉ Dispositif d'attribution de composant
JP7018379B2 (ja) * 2018-11-28 2022-02-10 株式会社Fuji 電子部品装着システムの制御装置
CN115623771B (zh) * 2022-12-16 2023-03-21 深圳市易通自动化设备有限公司 贴片机及其机头

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6618935B1 (en) * 1999-04-30 2003-09-16 Siemens Aktiengesellschaft Method for equipping substrates with components
US20070130756A1 (en) * 2005-11-30 2007-06-14 Hitachi High-Tech Instruments Co., Ltd. Electronic component mounting apparatus
WO2009060705A1 (fr) 2007-11-09 2009-05-14 Fuji Machine Mfg. Co., Ltd. Procédé et système de montage de pièces de circuit électrique
WO2009104384A2 (fr) 2008-02-21 2009-08-27 Panasonic Corporation Procédé et dispositif pour déterminer une condition de montage, procédé de montage de composant, appareil de montage et programme
JP2009231812A (ja) 2008-02-27 2009-10-08 Panasonic Corp 実装条件決定方法、実装条件決定装置、部品実装方法、部品実装機及びプログラム
JP2009231808A (ja) 2008-02-25 2009-10-08 Panasonic Corp 実装条件決定方法
JP2009239257A (ja) 2008-03-03 2009-10-15 Panasonic Corp 実装条件決定方法
US20100175246A1 (en) * 2007-09-27 2010-07-15 Panasonic Corporation Component mounting system and component mounting method
US20100249971A1 (en) 2008-01-23 2010-09-30 Yasuhiro Maenishi Component mounting condition determination method
US20100325860A1 (en) * 2008-02-21 2010-12-30 Yasuhiro Maenishi Mounting condition determining method
DE102009042651A1 (de) 2009-09-23 2011-03-31 Siemens Electronics Assembly Systems Gmbh & Co. Kg Vefahren zum Bestücken von Substraten mit Bauelementen
US20110197775A1 (en) 2008-10-03 2011-08-18 Panasonic Corporation Electronic component mounting system and electronic component mounting method
CN102469759A (zh) 2010-11-02 2012-05-23 雅马哈发动机株式会社 安装模式决定方法及元件安装系统
JP2012160592A (ja) 2011-02-01 2012-08-23 Panasonic Corp 部品実装装置および部品実装方法
JP2014103317A (ja) 2012-11-21 2014-06-05 Yamaha Motor Co Ltd 表面実装機および表面実装方法
JP2017059615A (ja) * 2015-09-15 2017-03-23 ヤマハ発動機株式会社 基板生産システム及びプリント基板の処理装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4834525B2 (ja) * 2006-11-21 2011-12-14 パナソニック株式会社 実装条件決定方法

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6618935B1 (en) * 1999-04-30 2003-09-16 Siemens Aktiengesellschaft Method for equipping substrates with components
US20070130756A1 (en) * 2005-11-30 2007-06-14 Hitachi High-Tech Instruments Co., Ltd. Electronic component mounting apparatus
JP4978398B2 (ja) 2007-09-27 2012-07-18 パナソニック株式会社 部品実装システム及び部品実装方法
US20100175246A1 (en) * 2007-09-27 2010-07-15 Panasonic Corporation Component mounting system and component mounting method
WO2009060705A1 (fr) 2007-11-09 2009-05-14 Fuji Machine Mfg. Co., Ltd. Procédé et système de montage de pièces de circuit électrique
US20100249971A1 (en) 2008-01-23 2010-09-30 Yasuhiro Maenishi Component mounting condition determination method
US20100325860A1 (en) * 2008-02-21 2010-12-30 Yasuhiro Maenishi Mounting condition determining method
WO2009104384A2 (fr) 2008-02-21 2009-08-27 Panasonic Corporation Procédé et dispositif pour déterminer une condition de montage, procédé de montage de composant, appareil de montage et programme
JP2009231808A (ja) 2008-02-25 2009-10-08 Panasonic Corp 実装条件決定方法
JP2009231812A (ja) 2008-02-27 2009-10-08 Panasonic Corp 実装条件決定方法、実装条件決定装置、部品実装方法、部品実装機及びプログラム
JP2009239257A (ja) 2008-03-03 2009-10-15 Panasonic Corp 実装条件決定方法
US20110197775A1 (en) 2008-10-03 2011-08-18 Panasonic Corporation Electronic component mounting system and electronic component mounting method
DE102009042651A1 (de) 2009-09-23 2011-03-31 Siemens Electronics Assembly Systems Gmbh & Co. Kg Vefahren zum Bestücken von Substraten mit Bauelementen
CN102469759A (zh) 2010-11-02 2012-05-23 雅马哈发动机株式会社 安装模式决定方法及元件安装系统
JP2012099654A (ja) 2010-11-02 2012-05-24 Yamaha Motor Co Ltd 実装モード決定方法及び部品実装システム
JP2012160592A (ja) 2011-02-01 2012-08-23 Panasonic Corp 部品実装装置および部品実装方法
JP2014103317A (ja) 2012-11-21 2014-06-05 Yamaha Motor Co Ltd 表面実装機および表面実装方法
JP2017059615A (ja) * 2015-09-15 2017-03-23 ヤマハ発動機株式会社 基板生産システム及びプリント基板の処理装置

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
English translation of the Japanese Office Action dated Aug. 29, 2018 in Patent Application No. 2016-528695.
Extended European Search Report dated Jun. 26, 2017 in Patent Application No. 14895031.4.
International Search Report dated Sep. 22, 2014, in PCT/JP2014/066063 filed Jun. 17, 2014.
Office Action dated Apr. 26, 2018 in Japanese Patent Application No. 2016-528695 English translation only, 4 pages.

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JP6663845B2 (ja) 2020-03-13
CN106465576A (zh) 2017-02-22
US20170127582A1 (en) 2017-05-04
CN106465576B (zh) 2020-04-03
EP3160218A1 (fr) 2017-04-26
EP3160218A4 (fr) 2017-07-26
JPWO2015193975A1 (ja) 2017-04-20
WO2015193975A1 (fr) 2015-12-23

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