WO2009104384A2 - Procédé et dispositif pour déterminer une condition de montage, procédé de montage de composant, appareil de montage et programme - Google Patents

Procédé et dispositif pour déterminer une condition de montage, procédé de montage de composant, appareil de montage et programme Download PDF

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Publication number
WO2009104384A2
WO2009104384A2 PCT/JP2009/000653 JP2009000653W WO2009104384A2 WO 2009104384 A2 WO2009104384 A2 WO 2009104384A2 JP 2009000653 W JP2009000653 W JP 2009000653W WO 2009104384 A2 WO2009104384 A2 WO 2009104384A2
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WO
WIPO (PCT)
Prior art keywords
board
mounter
mounting
component
mounters
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Application number
PCT/JP2009/000653
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English (en)
Other versions
WO2009104384A3 (fr
Inventor
Yasuhiro Maenishi
Yoshiaki Awata
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Panasonic Corporation
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Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Publication of WO2009104384A2 publication Critical patent/WO2009104384A2/fr
Publication of WO2009104384A3 publication Critical patent/WO2009104384A3/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes

Definitions

  • the present invention relates to a method of determining a mounting condition for mounting components on a board, and relates particularly to a mounting condition determining method in a production line equipped with a mounter including a plurality of carrier lanes in parallel on which the board is carried.
  • a mounter which mounts electronic components on a printed circuit board and so on, is expected to manufacture, with a shorter takt time, a mounted board that is mounted with a plurality of components.
  • takt time means mounting time that is determined with respect to each mounter, and is the time required for mounting a predetermined number of components on a piece of board.
  • a suggested method is to manufacture a plurality of types of mounted boards with a shorter takt time by selecting a mounter that is to mount components to be mounted on a board from among a plurality of mounters in which different sets of components are previously arranged, and carrying the selected board to the mounter (for example, see Patent Citation 1).
  • This allows improvement of the throughput (the number of mounted boards manufactured per unit time) of the production line.
  • the present invention is conceived for solving the above problems, and it is an object of the present invention to ensure a high operating rate for every mounter without suspending the mounter even during the change of elements, and to provide a mounting condition determining method for determining a component mounting condition that achieves enhanced area productivity.
  • the mounting condition determining method is a mounting condition determining method for determining a mounting condition for component mounting in a production line in which a plurality of mounters, each of which includes a plurality of carrier lanes and mounts a component on a board, are connected to each other, the mounting condition determining method including: assigning, per set of carrier lanes lined up to form a route, one of a plurality of board types to each carrier lane included in the set such that boards of the plurality of board types are carried on the plurality of carrier lanes; and setting the plurality of mounters as dedicated mounters, so as to determine the condition for the component mounting such that the dedicated mounters mount components on the boards of the plurality of board types, each of the dedicated mounters mounting a component only on a board of one board type and being only equipped with an element required for mounting the component on the board of the one board type.
  • the mounting condition is further determined such that each of the dedicated mounters mounts the component on the board when the board is carried onto a carrier lane assigned with the board type of the board on which the dedicated mounter is to mount the component, and carries out the board downstream without mounting the component on the board when the board is carried onto a carrier lane other than the carrier lane assigned with the board type of the board on which the dedicated mounter is to mount the component.
  • one board type is assigned to one carrier lane.
  • only one board type is assigned to one mounter. Therefore, each mounter manufactures only a board of one type and is allowed to mount components on the board when the board of the board type to be manufactured is carried onto a carrier lane assigned to the board type of the board to be manufactured.
  • each mounter can carry out the board downstream, judging that a board of a board type other than the board type to be manufactured by the mounter has been carried in.
  • each mounter includes a plurality of carrier lanes, thereby allowing manufacturing of boards of a plurality of board types in a single production line. This improves area productivity accordingly.
  • the number of pickup nozzles for picking up the component is further determined for each of the dedicated mounters, and an arrangement of the dedicated mounters is further determined such that a dedicated mounter determined to have a larger number of pickup nozzles is disposed more upstream in the production line, the pickup nozzles being included in a mounting head that mounts the component on the board.
  • a mounting head having a larger number of pickup nozzles picks up smaller components. Therefore, the mounter disposed more upstream mounts smaller components, and thus a mounter disposed downstream has only to mount other components avoiding the smaller components, so that component mounting is facilitated.
  • the mounting condition determining method further includes determining the numbers of dedicated and shared mounters included in the production line, by replacing more than one dedicated mounter with at least one shared mounter, the more than one dedicated mounter being arbitrarily selected from among the dedicated mounters in the setting and the at least one shared mounter being a mounter that is to mount the components on the boards of the plurality of board types.
  • one board type is assigned to one carrier lane.
  • more than one dedicated mounter is replaced with at least one shared mounter after setting all the mounters as dedicated mounters in the setting.
  • the dedicated mounter mounts components only on a board of one type and is allowed to perform the mounting when a board of the board type to be mounted with the components is carried onto the carrier lane assigned to the board type.
  • each dedicated mounter can carry out the board downstream, judging that a board type other than the board type to be manufactured by the mounter has been carried in.
  • this structure makes it possible to arrange a maximum number of dedicated mounters that achieve excellent performance in change of elements, and to determine an arrangement of the mounters in the production line by reducing the number of the mounters to a minimum.
  • each mounter includes a plurality of carrier lanes, thereby allowing manufacturing of boards of a plurality of board types in a single production line. This improves area productivity accordingly.
  • the numbers of the dedicated and the shared mounters are determined such that the at least one shared mounter mounts a component of which the number to be mounted on the board is smaller, and the dedicated mounter mounts a component of which the number to be mounted on the board is larger, from among components to be mounted by mounting units achieving same performance required for mounting the components on the boards of the plurality of board types.
  • mounter it is wasteful to use a mounter as a dedicated mounter, depending on the breakdown of the component types. That is, when all the mounters are used as dedicated mounters, there is a case where such dedicated mounters include a dedicated mounter that is to mount a small number of components. For usage of mounters, it is wasteful to use a dedicated mounter just for mounting such a small number of components. If this is the case, the numbers of dedicated mounters and shared mounters are determined such that a part of the mounters is used as a shared mounter, not as a dedicated mounter. With this, it is possible to reduce the number of the mounters. With this, it is possible to ensure a maximum operating rate for every mounter without suspending the mounter even during the change of elements, and to determine the component mounting condition for the mounter, which achieves enhanced area productivity.
  • the numbers of the dedicated and the shared mounters are further determined by replacing the more than one dedicated mounter among the dedicated mounters with the one shared mounter such that the one shared mounter mounts components scheduled to be mounted by the more than one dedicated mounter each of which includes a mounting unit of a same type.
  • the component mounting method is a component mounting method for performing component mounting in a production line in which a plurality of mounters, each of which includes a plurality of carrier lanes and mounts a component on a board, are connected to each other, and in the component mounting method, one of a plurality of board types is assigned to each of the plurality of carrier lanes, at least one mounter is assigned to each of the plurality of board types in order to avoid overlapping of the mounters assigned among the plurality of board types, the at least one mounter mounting a component only on a board of the one board type and being only equipped with an element required for mounting the component on the board of the one board type, and the component mounting method includes: judging, in each of the plurality of mounters, to which one of the plurality of carrier lanes the board has been carried in; and mounting, in each of the plurality of mounters, the component on the board when the board is carried onto a carrier lane assigned to the board type that is assigned to the at least one mounter,
  • a board type is assigned to a carrier lane.
  • only one board type is assigned to a mounter. Therefore, this allows each mounter to manufacture only a board of one type, and to mount components on a board of the board type to be manufactured when the board is carried onto the carrier lane assigned to the board type.
  • each mounter can carry out the board downstream, judging that the board of a type other than the board type to be manufactured by the mounter has been carried in.
  • each mounter includes a plurality of carrier lanes, thereby allowing manufacturing of boards of a plurality of board types in a single production line. This improves area productivity accordingly.
  • the present invention can be realized not only as a mounting condition determining method or a component mounting method including these characteristic steps but also as a mounting condition determining apparatus or a mounter that implements, as units, the characteristic steps included in the mounting condition determining method or the component mounting method, and also as a program causing a computer to execute the characteristic steps included in the mounting condition determining method or the component mounting method.
  • a program can be distributed through recording media such as Compact Disc-Read Only Memories (CD-ROMs) or communication networks such as the Internet.
  • FIG. 1 is an external view showing a structure of a component mounting system according to a first embodiment of the present invention
  • FIG. 2 is a plan view showing the main structure of an interior portion of a mounter
  • FIG. 3 is an external view of a support pin plate, support pins, and so on
  • FIG. 4 is a pattern diagram showing a positional relationship between a mounting head and a component cassette
  • FIG. 5 is an example of a component tape on which components are stored on a reel
  • FIG. 6 is a block diagram showing a functional structure of a mounting condition determining apparatus in the first embodiment
  • FIG. 1 is an external view showing a structure of a component mounting system according to a first embodiment of the present invention
  • FIG. 2 is a plan view showing the main structure of an interior portion of a mounter
  • FIG. 3 is an external view of a support pin plate, support pins, and so on
  • FIG. 4 is a pattern diagram showing a positional relationship between a mounting head and a component cassette
  • FIG. 5
  • FIG. 7 is a diagram showing an example of mounting point data
  • FIG. 8 is a diagram showing an example of a component library
  • FIG. 9 is a diagram showing an example of target takt time data
  • FIG. 10 is a flowchart showing an example of an operation of the mounting condition determining apparatus in the first embodiment
  • FIG. 11 is an example of a mounter that mounts components on a board of board type A
  • FIG. 12 is an example of a mounter that mounts components on a board of board type B
  • FIG. 13 is a diagram showing an example of a production line in which the mounters shown in FIGS. 11 and 12 are arranged in order of the number of pickup nozzles
  • FIG. 14 is a diagram showing an example of the production line in which the mounters shown in FIGS.
  • FIG. 11 and 12 are arranged in order of the number of pickup nozzles;
  • FIG. 15 is another example of the mounter that mounts components on a board of board type B;
  • FIG. 16 is a diagram showing an example of the production line in which the mounters shown in FIGS. 11 and 15 are arranged in order of the number of pickup nozzles;
  • FIG. 17 is an example of an unpreferable production line including the mounters shown in FIGS. 11 and 15;
  • FIG. 18 is a flowchart showing the operation of the mounter;
  • FIG. 19 is a block diagram showing a functional structure of a mounting condition determining apparatus in a second embodiment;
  • FIG. 20 is a diagram showing an example of target-number-of-mounters data;
  • FIG. 21 is a flowchart showing an example of an operation of the mounting condition determining apparatus in the second embodiment
  • FIG. 22 is an example of a mounter that mounts components on a board of board type A
  • FIG. 23 is an example of a mounter that mounts components on a board of board type B
  • FIG. 24 is a diagram showing an example of a production line in which the mounters shown in FIGS. 22 and 23 are arranged in order of the number of pickup nozzles
  • Fig. 25 is a diagram showing an example of a production line in which the two dedicated mounters MC3 and MC6 shown in FIG. 24 are replaced with a shared mounter MC7;
  • FIG. 26 is a diagram showing an example of a production line in which the two dedicated mounters MC3 and MC6 shown in FIG. 24 are replaced with a shared mounter MC7;
  • FIG. 27 is a diagram showing an example of a production line in which the mounters shown in FIGS. 22 and 23 are arranged in order of the number of pickup nozzles;
  • FIG. 28 is a diagram showing an example of a production line in which the two dedicated mounters MC3 and MC4 shown in FIG. 27 are replaced with a shared mounter MC8;
  • FIG. 29 is a diagram showing an example of a production line in which the two dedicated mounters MC3 and MC4 shown in FIG. 27 are replaced with a shared mounter MC9.
  • FIG. 1 is an external view showing the structure of a component mounting system 10 that implements a mounting condition determining method according to the present invention.
  • the component mounting system 10 is a production line for manufacturing a circuit board by mounting components on a board and includes a mounting condition determining apparatus 100 and a plurality of mounters 200 (nine mounters in an example shown in FIG. 1).
  • the mounting condition determining apparatus 100 is an apparatus that implements a mounting condition determining method according to the invention.
  • the mounting condition determining apparatus 100 determines a mounting condition so as to ensure a high operating rate for the mounters included in the production line as a whole and to achieve enhanced area productivity.
  • a mounter 200 is an apparatus that mounts, as a part of the component mounting system 10, components such as electronic components, under a condition determined by the mounting condition determining apparatus 100.
  • the plurality of mounters 200 sequentially mount components while sending a board from upstream to downstream. That is, one of the mounters 200 disposed upstream receives the board and mounts components on the board. Then, the board mounted with the components is sent out to another one of the mounters 200 disposed downstream. Thus, the board is sequentially sent to the respective mounters 200, and components are mounted onto the board.
  • FIG. 2 is a plan view showing the main structure of an interior portion of the mounter 200.
  • a direction in which a board is carried is x-axis direction
  • a cross direction with respect to the mounter, which intersects orthogonal to the x-axis direction in the horizontal plane, is y-axis direction.
  • the mounter 200 includes carrier lanes 215 and 216 on which two boards 21 and 22 are carried respectively and two mounting units 210a and 210b that mount components on these two boards. Boards of different board types can be carried on the carrier lanes 215 and 216. Note that even a single piece of board is regarded as of different board types because the front and rear surfaces of the single piece of board are mounted with different types of components at different mounting positions, and so on.
  • the carrier lane 215 is disposed on the side of the mounting unit 210a, and the carrier lane 210 is disposed on the side of mounting unit 210b such that each of them stands parallel to the x-axis direction.
  • the carrier lane 215 includes a stationary rail 215a and a movable rail 215b each of which is parallel to the x-axis direction.
  • the position of the stationary rail 215a is previously fixed, and the movable rail 215b can move in a y-axis direction along the length of the y-axis direction with respect to the board 21 to be carried.
  • the carrier lane 216 as with the carrier lane 215, includes a stationary rail 216a and a movable rail 216b. Then, the position of the stationary rail 216a is previously fixed, and the movable rail 216b can move in a y-axis direction along the length of the y-axis direction with respect to the board 22 to be carried.
  • each of the boards 21 and 22 is separately carried on the carrier lanes 215 and 216.
  • the two mounting units 210a and 210b cooperatively perform the mounting operation on the boards 21 and 22.
  • each of the mounting units 210a and 210b has the same structure. That is, the mounting unit 210a includes: a component supply unit 211a, a mounting head 213a, a nozzle station 218a, and a component recognition camera (not shown). Likewise, the mounting unit 210b includes: a component supply unit 211b, a mounting head 213b, a nozzle station 218b, and a component recognition camera (not shown).
  • the detailed structure of the mounting unit 210a shall be described. Note that the detailed structure of the mounting unit 210b is the same as that of the mounting unit 210a, and therefore the description thereof shall not be repeated.
  • the component supply unit 211a includes an array of component cassettes 212a containing component tape.
  • the component tape for example, is tape on which components of an identical type are arranged, and that the component tape is supplied wound up on a reel or the like.
  • the components to be arranged on the component tape are, for example, chips including, specifically, 0402 chip components (chip components sized 0.4 mm X 0.2 mm in size) or 1005 chip components (chip components of 1.0 mm X 0.5 mm in size).
  • the mounting head 213a can have, for example, maximum 10 pickup nozzles, and can mount maximum 10 components on the boards 21 and 22 by picking up the components from the component supply unit 211a.
  • the nozzle station 218a is a table on which replacement pickup nozzles for dealing with component types in different shapes are placed.
  • the component recognition camera is used for capturing an image of each component picked up by the mounting head 213a, and checking the pickup status of the component two-dimensionally or three-dimensionally.
  • support pins for supporting the board from the rear surface are used when the components are mounted on the board, and a support pin plate into which to thrust these support pins is provided immediately beneath the carrier lanes 215 and 216 (immediately beneath the boards 22 and 21 shown in FIG. 2).
  • FIG. 3 is an external view of a support pin plate 502, support pins 510, and so on.
  • an operator Prior to the mounting of an electronic component 508, an operator inserts the support pins 510 into pin holes 504 on the support pin plate 502.
  • the boards 21 and 22 are placed thereon, and the electronic component 508 is mounted on the board 21 and 22 by the mounting head 213a and 213b.
  • the board manufacturing method for the mounter 200 which performs the mounting, as described above, on boards of the plurality of board types, includes two major methods referred to as “synchronous mode” and “asynchronous mode. "
  • the "synchronous mode" is a mode in which component mounting is started after boards are carried onto the two carrier lanes. That is, the component mounting is not started when a board is carried onto only one of the lanes.
  • two mounting heads alternately mount components on two pieces of boards. Note that the two pieces of board are regarded as a large single piece of board so that an order of such component mounting by the two mounting heads is determined with respect to the large single piece of board.
  • the synchronous mode may also be a mode in which the component mounting is started after boards are carried onto two or more of the carrier lanes.
  • the "asynchronous mode" is a mode in which component mounting is started after a board is carried onto one of a plurality of carrier lanes.
  • two mounting heads alternately mount components on a board. That is, for example, when the board 21 is carried onto the carrier lane 215 first, the two mounting heads cooperatively operate to mount the components on the board 21 that is on the carrier lane 215. Furthermore, when the board 22 is subsequently carried onto the carrier lane 216, the two mounting heads cooperatively operate to mount components on the board 22 that is on the carrier lane 216.
  • FIG. 4 is a pattern diagram showing the positional relationship between the mounting head 213a and the component cassette 212a.
  • the mounting head 213a attached with the 10 pickup nozzles nz can pick up components from each of maximum 10 components cassettes 212a simultaneously (in one up-and-down motion).
  • FIG. 5 is an example of the component tape on which the components are provided on the reel.
  • the components such as chip-type components are stored in a plurality of storage recesses 221a that are continuously formed with regular spacing on the carrier tape 221 shown in FIG. 5 and are wrapped with cover tape 222 attached to the top surface. Then, the carrier tape 221, thus attached with the cover tape 222, is supplied to the user in the form of tape wound upon a reel 223 and having just a predetermined length. Furthermore, such carrier tape 221 and cover tape 222 constitute the component tape. Note that the component tape may have a structure other than the structure shown in Fig. 5.
  • the mounting unit 210a of the mounter 200 as described above moves the mounting head 213a to the component supply unit 211a, and causes the mounting head 213a to pick up the components supplied from the component supply unit 211a. Then, the mounting unit 210a moves the mounting head 213a to above the component recognition camera at a regular speed, and causes the component recognition camera to capture images of all the components picked up by the mounting head 213a and to precisely detect the picking positions of the components. Furthermore, the mounting unit 210a moves the mounting head 213a to, for example, the board 21, and causes all the picked-up components to be sequentially mounted at the mounting points on the board 21. The mounting unit 210a mounts all of predetermined components on the board 21 by repeating this picking up, movement, and mounting performed by the mounting head 213a. Likewise, the mounting unit 210a mounts all the predetermined components on the board 22.
  • the mounting unit 210b mounts all the predetermined components on the boards 21 and 22 through repeated performance of the picking up, movement, and mounting by the mounting head 213b.
  • the mounting units 210a and 210b alternately mount components on the boards 21 and 22: one picks up components from the component supply unit while the other is mounting other components; on the other hand, one mounts components while the other is picking up other components from the component supply unit. That is, the mounter 200 is structured as a mounter known as alternate-mounting apparatus.
  • each mounter 200 either the board 21 or board 22 that is to be the board to be mounted with the components is previously determined as a mounting condition. According to the mounting condition, the two mounting units 210a and 210b mount the components only on the board that is to be mounted with the components. Therefore, one of the boards 21 and 22 that is not to be mounted with the components is not mounted with the components and carried to a subsequent mounter.
  • FIG. 6 is a block diagram showing a functional structure of a mounting condition determining apparatus 100 in the present embodiment.
  • the mounting condition determining apparatus 100 is a computer that performs processing including determination of the mounting condition so as to ensure a high operating rate for the mounters in the production line as a whole and to achieve enhanced area productivity.
  • This mounting condition determining apparatus 100 includes: an operation control unit 101, a display unit 102, an input unit 103, a memory unit 104, a program storage unit 105, a communication I/F (interface) unit 106, and a database unit 107.
  • This mounting condition determining apparatus 100 which is realized through execution of a program according to the present invention by a general-purpose computer system such as a personal computer, also operates as a stand-alone simulator (mounting condition determination tool) when not connected to the mounter 200.
  • the mounter 200 may include, internally, the function of this mounting condition determining apparatus 100.
  • the operation control unit 101 which is a Central Processing Unit (CPU), a numeric data processor or the like, is a processing unit that loads, so as to execute, a necessary program from the program storage unit 105 to the memory unit 104 according to the instruction from the operator and so on, and controls each of the constituent elements from 102 to 107 based on the result of the execution.
  • CPU Central Processing Unit
  • numeric data processor or the like
  • the display unit 102 is a Cathode-Ray Tube (CRT), a Liquid Crystal Display (LCD) or the like
  • the input unit 103 is a keyboard, a mouse or the like. These are used for communication between the mounting condition determining apparatus 100 and the operator and so on under the control of the operation control unit 101.
  • the communication I/F unit 106 is a Local Area Network (LAN) adopter or the like, and is used for communication between the mounting condition determining apparatus 100 and the mounter 200 and so on.
  • the memory unit 104 is a Random Access Memory (RAM) or the like which provides a work area for the operation control unit 101.
  • the program storage unit 105 is a hard disk or the like in which different programs for implementing the functions of the mounting condition determining apparatus 100 are stored.
  • the programs are programs for determining a condition for the mounting performed by the mounter 200 and include, as functions (as a processing unit that functions when executed by the operation control unit 101): a board type assigning unit 105a, a mounting condition optimizing unit 105b, and a sort unit 105c.
  • the board type assigning unit 105a is an example of an assigning unit within the scope of the claims, and is a processing unit that obtains a target takt time that is a target value for a line takt time for each of the carrier lanes carrying the board of the same board type, and also assigns, to each of the carrier lanes, the board type to be carried on the carrier lane.
  • the "line takt time” is a maximum takt time among the takt times for the respective mounters included in the production line.
  • the "takt time” is determined with respect to each carrier lane included in the mounter 200. That is, the line takt time indicates the time required for manufacturing a piece of component-mounted board in the production line.
  • the mounting condition optimizing unit 105b is an example of a dedicated-mounter setting unit within the scope of the claims, and is a processing unit that determines a component mounting condition with respect to each board type.
  • the sort unit 105c is a processing unit that determines the arrangement of the mounters 200 by disposing, more upstream in the production line, a mounter 200 including a mounting head having a larger number of pickup nozzles nz that pick up components.
  • the database unit 107 is a hard disk or the like that stores: mounting point data 107a that is data used for the determination of a mounting condition performed by the mounting condition determining apparatus 100 and so on, a component library 107b, target takt time data 107c, and so on.
  • FIGS. 7 to 9 show, respectively, examples of: the mounting point data 107a, the component library 107b, and the target takt time data 107c.
  • FIG. 7 is a diagram showing an example of the mounting point data 107a.
  • the mounting point data 107a is collected information indicating mounting points for all the components to be mounted.
  • a mounting point pi is made up of: component type ci, x-axis xi, y-axis yi, control data and mounting angle
  • the component type corresponds to the component name in the component library 107b shown in FIG. 8: the x-axis and y-axis correspond to the coordinates of the mounting point (coordinates indicating a particular point on the board); and the control data indicates constraint information regarding the mounting of the component (usable type of pickup nozzles nz, maximum movement acceleration for the mounting head, and so on).
  • the mounting angle indicates the angle at which the nozzle picking up a component of the component type ci should rotate.
  • NC Numeric Control
  • FIG. 8 is a diagram showing an example of the component library 107b.
  • the component library 107b is a library of collected information unique to every single component type that the mounter 200 can deal with.
  • This component library 107b includes: component size, takt time (takt time unique to a component type under a given condition), and other constraint information (usable type of pickup nozzles nz, recognition method to be employed by the component recognition camera, maximum acceleration ratio of the mounting head, and so on) with respect to each component type (component name). Note that the figure also shows for reference, component appearance for each component type.
  • the component library 107b may also include other information such as the color and shape of the component.
  • FIG. 9 is a diagram showing an example of the target takt time data 107c.
  • the target takt time data 107c is collected information indicating the target takt time with respect to each of the carrier lanes carrying the board of the same board type.
  • This target takt time data 107c includes "carrier lane”, “board type”, and "target takt time”.
  • the “carrier lane” is a carrier lane for which the target takt time is to be obtained. To be more specific, it is a term for specifying the carrier lane 215 or carrier lane 216.
  • the carrier lane is also referred to as, for example: an F-lane for the carrier lane 215, and an R-lane for the carrier lane 216.
  • the "board type” is the type of a board carried on the target carrier lane.
  • the type of the board to be carried on the R-lane, which is the carrier lane 216, is board type A.
  • the "target takt time” is a target value for the line takt time.
  • the "target takt time” for the R-lane is 100 s (sec). This is the target for manufacturing a type-A board at 100 s per board.
  • FIG. 10 is a flowchart showing an example of an operation of the mounting condition determining apparatus 100 in the present embodiment.
  • the operation of the mounting condition determining apparatus 100 shall be described with specific examples by reference to the carrier lane 215 as F-lane and the carrier lane 216 as R-lane.
  • the board type assigning unit 105a obtains a target takt time for each board type from the target takt time data 107c, and assigns, to each of the carrier lanes, the board type to be carried on the carrier lane (S2). For example, it is assumed that 100 s is obtained as the target takt time for the board type A and 100 s is obtained as the target takt time for the board type B from the target takt time data 107c shown in FIG. 9. It is also assumed that the board type A is assigned to the R-lane, and the board type B is assigned to the F-lane.
  • the mounting condition optimizing unit 105b optimizes the following, with respect to each board type, by using the mounting point data 107a and the component library 107b: the number of the mounters 200; the type and arrangement of the component cassettes 212a and 212b to be provided at the component supply units 211a and 211b of the mounters 200; the type of pickup nozzles to be placed at the nozzle stations 218a and 218b; the number of pickup nozzles to be included in the mounting heads 213a and 213b; the arrangement of the support pins 510 on the support pin plate 502 (the position of the pin holes 504 into which the support pins 510 are inserted), and the component mounting order (S4, Loop A).
  • the above optimization processing it is possible to use known techniques, which is not the main object of the present invention. Therefore, the detailed description thereof shall be omitted.
  • the mounting condition may satisfy the target takt time with respect to each board type and also allow manufacturing of the board of the board type.
  • the mounting condition may also allow each mounter to manufacture only the board of one board type that is assigned, irrespective of whether or not the target takt time is satisfied.
  • the mounting condition optimizing unit 105b performs optimization by assigning a carrier lane to each board type. For example, the mounting condition optimizing unit 105b assigns the board type A to the R-lane so that the type-A board is manufactured in the R-lane, and assigns the board type B to the F-lane so that the type-B board is manufactured in the F-lane, to subsequently perform the optimization with respect to each board type. Note that a plurality of board types should not be assigned to a single carrier lane. That is, one carrier lane is always assigned with only one board type.
  • one mounter 200 manufactures the board of only one board type. That is, the mounter 200 dedicatedly manufactures the board of one board type, not manufacturing boards of a plurality of board types.
  • the mounter 200 as described above is an example of the "dedicated mounter" within the scope of the claims.
  • FIG. 11 shows, it is determined to perform the component mounting by using the mounter MC1 including two mounting heads 213a and 213b each having 12 pickup nozzles and the mounter MC2 including two mounting heads 213a and 213b each having 8 pickup nozzles.
  • the numerals appended to the mounting heads 213a and 213b in the figures below indicate the number of pickup nozzles.
  • the arrangement of components in the component supply units 211a and 211b is determined such that only the components to be mounted on the type-A board are arranged in the component supply units 211a and 211b.
  • the arrangement of the support pins which is appropriate for supporting the type-A board from the rear surface of the board, is determined. Note that it is sufficient to determine the arrangement of the support pins in the R-lane, which is appropriate for supporting the type-A board from the rear surface of the board, and that the support pins need not be arranged in the F-lane because no component is to be mounted on the board therein.
  • the type of pickup nozzles required for picking up only components of the component types to be mounted on the type-A board is determined, and the type of pickup nozzles to be used in the mounting heads 213a and 213b and the type of pickup nozzles to be placed at the nozzle stations 218a and 218b are determined.
  • the arrangement of components in the component supply units 211a and 211b is determined so that only the components to be mounted on the type-B board are arranged in the component supply units 211a and 211b.
  • the arrangement of the support pins which is appropriate for supporting the type-B board from the rear surface of the board, is determined. Note that it is sufficient to determine the arrangement of the support pins in the F-lane, which is appropriate for supporting the type-B board from the rear surface of the board, and that the support pins need not be arranged in the R-lane because components are not mounted on the board therein.
  • the type of pickup nozzles required for picking up only components of the component types to be mounted on the type-B board is determined, and the type of pickup nozzles to be used in the mounting heads 213a and 213b and the type of pickup nozzles to be placed at the nozzle stations 218a and 218b are determined.
  • the sort unit 105c determines an arrangement order, in the production line, of the mounters 200 optimized in the optimization processing (S4, Loop A) such that a mounter equipped with a mounting head having a larger number of pickup nozzles is disposed more upstream (S6).
  • S4, Loop A optimization processing
  • a mounting head having a larger number of pickup nozzles picks up smaller components. Therefore, a mounter disposed more upstream mounts smaller components, and thus a mounter disposed downstream has only to mount other components avoiding the smaller components, so that component mounting is facilitated.
  • the mounters 200 are arranged, as FIG. 13 shows, in the following order: from upstream, the mounter MC1 (having 12 pickup nozzles), the mounter MC3 (having 12 pickup nozzles), the mounter MC2 (having 8 pickup nozzles), and the mounter MC4 (having 3 pickup nozzles). Note that, as FIG. 13 shows, in the following order: from upstream, the mounter MC1 (having 12 pickup nozzles), the mounter MC3 (having 12 pickup nozzles), the mounter MC2 (having 8 pickup nozzles), and the mounter MC4 (having 3 pickup nozzles). Note that, as FIG.
  • the mounters MC1 and MC3 may be switched in the arrangement order, so as to allow the following order: from upstream, the mounter MC3 (having 12 pickup nozzles), the mounter MC1 (having 12 pickup nozzles), the mounter MC2 (having 8 pickup nozzles), and the mounter MC4 (having 3 pickup nozzles).
  • the mounter MC 5 includes: a mounting head 213a having 8 pickup nozzles and a mounting head 213b having 12 pickup nozzles. Under such conditions, in the case of determining the arrangement order of a total of four mounters 200 as shown in FIGS. 11 and 15, the mounters 200 are arranged, as FIG.
  • FIG. 16 shows, in the following order: from upstream, the mounter MC1 (having 12 pickup nozzles), the mounter MC5 (having 12 or 8 pickup nozzles), the mounter MC2 (having 8 pickup nozzles), and the mounter MC4 (having 3 pickup nozzles).
  • the mounters MC1 and MC5 in the arrangement order as FIG. 17 shows so as to allow the following order: from upstream, the mounter MC5 (having 12 or 8 pickup nozzles), the mounter MC1 (having 12 pickup nozzles), the mounter MC2 (having 8 pickup nozzles), and the mounter 4 (having 3 pickup nozzles).
  • the mounter MC1 has to mount smaller components using 12 nozzles after larger components are mounted by the mounter MC 5 using 8 nozzles. This requires the mounting head of the mounter MC1 to move avoiding the larger components mounted on the board that is being carried on the F-lane. This, as a result, increases the up-and-down movement distance of the mounting head of the mounter MC1, causing movement time for the mounting head to increase. Accordingly, this gives rise to a problem of increasing the takt time for mounted-board manufacturing. Therefore, such a production line is not preferable.
  • FIG. 18 is a flowchart showing the operation of the mounter 200.
  • the mounter 200 sequentially mounts the components on the board in accordance with the mounting condition determined by the mounting condition determining apparatus 100.
  • the mounter 200 stands by until the board is carried in (S12), and when a board is carried in (YES in S12), the control unit (not shown) of the mounter 200 judges whether or not the board carried in is of the board type to be mounted with the component s(S14). Whether or not the board is of the board type to be mounted with the components is judged according to the difference in carrier lane to which the board has been carried in. For example, assuming that the production line includes four mounters 200 as shown in FIG.
  • the mounter MC1 judges that the board carried in is of the board type to be mounted with the components (that is, board type A) when the board is carried onto the R-lane of the mounter MC1, and judges that the board carried in is not of the board type to be mounted with the components when the board is carried onto the F-lane.
  • the mounter MC 3 judges that the board carried in is of the board type to be mounted with the components (that is, board type B) when the board is carried onto the F-lane of the mounter MC3, and judges that the board carried in is not of the board type to be mounted with the components when the board is carried onto the R-lane.
  • the mounter 200 mounts the components on the board and sends out the board downstream (S16).
  • the mounter 200 sends out the board downstream without mounting the components on the board (S18).
  • the mounter 200 repeatedly performs the above processing (S12 to S18) until manufacturing of all the boards is completed (S20).
  • each mounter manufactures only the board of one board type and mounts the components on the board of the type to be manufactured when the board is carried onto the carrier lane assigned to the board type.
  • each mounter carries out the board downstream, judging that the board of the board type other than the board type to be manufactured by the mounter has been carried in.
  • the mounter with which elements are being changed is suspending the component mounting and only sends out downstream the board carried in, but the other mounters with which changing of elements is not performed can continue manufacturing the board of the assigned board type.
  • the mounters MC1 and MC2 with which elements are being changed only send out downstream a board (of board type B) carried in, but the mounters MC3 and MC4 continue manufacturing the type-B board. Accordingly, even while elements are being changed, it is possible to secure a high operating rate for every mounter without suspending the mounter.
  • each mounter manufacturing only the board of one board type, it is possible to set the mounting condition focusing only on the manufacturing of the board type. Therefore, it is sufficient to optimize, with respect to each mounter, the mounting condition focusing only on reducing the takt time for manufacturing the board of one board type. Accordingly, it is possible to minimize the takt time for the board manufacturing at each mounter.
  • the takt time for manufacturing the board of one board type affects the takt time for manufacturing the board of another board type, and this makes it difficult to concurrently minimize the takt times for manufacturing the boards of different types.
  • the mounter can focus on minimizing only the takt time for manufacturing the board of the one board type, thus allowing minimization of the takt time for manufacturing the board of the board type.
  • each mounter includes a plurality of carrier lanes, thereby allowing manufacturing of boards of a plurality of board types in a single production line. This improves area productivity accordingly.
  • the present embodiment assumes that the mounter 200 includes two carrier lanes, but three or more carrier lanes may be included.
  • the mounter may perform the mounting only on the board that is carried onto two of the carrier lanes. Note that three or more types of boards may be manufactured in the case where three or more carrier lanes are provided.
  • mounter 200 in the present embodiment is assumed as the alternate mounting apparatus, the mounter 200 is not limited to the alternate mounting apparatus but may also be a mounter that performs the mounting with one mounting head.
  • the structure of the component mounting system according to the second embodiment is the same as what is shown in FIG. 1.
  • the structure of the mounter is the same as what is shown in FIGS. 2 to 5. Therefore, the detailed description thereof shall not be repeated here.
  • the second embodiment is different from the first embodiment in the structure of the mounting condition determining apparatus 100. Hereinafter, the description shall be given centering on the points different from the first embodiment.
  • FIG. 19 is a block diagram showing a functional structure of a mounting condition determining apparatus 100 in the present embodiment.
  • the mounting condition determining apparatus 100 is a computer that performs processing including determination of a mounting condition so as to ensure a high operating rate for mounters included in the production line as a whole and achieve enhanced area productivity.
  • This mounting condition determining apparatus 100 includes: an operation control unit 101, a display unit 102, an input unit 103, a memory unit 104, a program storage unit 105, a communication I/F (interface) unit 106, and a database unit 107.
  • This mounting condition determining apparatus 100 is realized through execution of a program according to the present invention by a general-purpose computer system such as a personal computer, and also operates as a stand-alone simulator (mounting condition determination tool) when unconnected to the mounter 200.
  • the mounter 200 may include, internally, the function of this mounting condition determining apparatus 100.
  • the operation control unit 101 is a Central Processing Unit (CPU), a numeric data processor or the like, and is a processing unit that loads and executes a necessary program from the program storage unit 105 to the memory unit 104 according to the instruction from the operator and so on, and controls each of the constituent elements from 102 to 107 based on the execution result.
  • CPU Central Processing Unit
  • numeric data processor or the like
  • the display unit 102 is a Cathode-Ray Tube (CRT), a Liquid Crystal Display (LCD) or the like
  • the input unit 103 is a keyboard, a mouse, or the like. These are used for communication between the mounting condition determining apparatus 100 and the operator and so on under the control of the operation control unit 101.
  • the communication I/F unit 106 is a Local Area Network (LAN) adopter or the like, and is used for communication between the mounting condition determining apparatus 100 and the mounter 200 and so on.
  • the memory unit 104 is a Random Access Memory (RAM) or the like which provides a work area for the operation control unit 101.
  • the program storage unit 105 is a hard disk or the like in which different programs for implementing the functions of the mounting condition determining apparatus 100 are stored.
  • the programs are programs for determining the conditions for the mounting performed by the mounter 200 and include, as functions (as a processing unit that functions when executed by the operation control unit 101): a board type assigning unit 105a, a mounting condition optimizing unit 105b, a sort unit 105c, and a merge unit 105d.
  • the board type assigning unit 105a is an example of an assigning unit within the scope of the claims, and is a processing unit that obtains a target takt time that is a target value for a line takt time for each of the carrier lanes carrying the board of the same board type and also assigns a board type, to each of the carrier lanes, the board type to be carried on the carrier lane.
  • the "line takt time” is the largest takt time of takt times for the respective mounters included in the production line.
  • the "takt time” is determined with respect to each carrier lane included in the mounter 200. That is, the line takt time indicates the time required for manufacturing a piece of component-mounted board in the production line.
  • the mounting condition optimizing unit 105b is an example of a dedicated-mounter setting unit within the scope of the claims, and is a processing unit that determines a component mounting condition with respect to each board type.
  • the merge unit 105d is a processing unit that determines the number of the mounters 200 as a component mounting condition by replacing two mounters 200 with a mounter 200 in the case where the target takt time is satisfied even when the components that have been mounted by the two mounters 200 are mounted by the mounter 200.
  • the sort unit 105c is a processing unit that determines the arrangement of the mounters 200 by disposing, more upstream in the production line, a mounter 200 having a mounting head including a larger number of pickup nozzles nz that pick up components.
  • the database unit 107 is a hard disk or the like that stores: mounting point data 107a that is data used for the determination of a mounting condition performed by the mounting condition determining apparatus 100 and so on, a component library 107b, target takt time data 107c, target-number-of-mounters data 107d, and so on.
  • the mounting point data 107a, the component library 107b, and the target takt time data 107c are the same as what is shown in FIGS. 7 to 9, respectively.
  • FIG. 20 is a diagram showing an example of the target-number-of-mounters data 107d.
  • the target-number-of-mounters data 107d includes the "target number of mounters” that is the target value for the number of mounters 200 included in the production line.
  • the "target number of mounters” indicates a maximum permissible value for the number of the mounters 200 included in the production line. The figure shows that the "target number of mounters" is five.
  • FIG. 21 is a flowchart showing an example of an operation of the mounting condition determining apparatus 100 in the present embodiment.
  • the operation of the mounting condition determining apparatus 100 shall be described with specific examples, assuming the carrier lane 215 as F-lane and the carrier lane 216 as R-lane.
  • the board type assigning unit 105a obtains the target takt time for each board type from the target takt time data 107c, and assigns, to each carrier lane, the board type to be carried onto the carrier lane (S32). For example, it is assumed that 100 s is obtained as the target takt time for the board type A and 100 s is obtained as the target takt time for the board type B, from the target takt time data 107c shown in FIG. 9. It is also assumed that the board type A is assigned to the R-lane, and the board type B is assigned to the F-lane.
  • the mounting condition optimizing unit 105b optimizes the following, with respect to each board type, by using the mounting point data 107a and the component library 107b: the number of mounters 200; the type and arrangement of the component cassettes 212a and 212b to be provided at the component supply units 211a and 211b of the mounters 200; the type of pickup nozzles to be placed at the nozzle stations 218a and 218b; the number of pickup nozzles to be included in the mounting heads 213a and 213b; the arrangement of the support pins 510 on the support pin plate 502 (the position of the pin holes 504 into which the support pins 510 are inserted), and the component mounting order (S34, Loop A).
  • the above optimization processing it is possible to use known techniques, which is not the main object of the present invention. Therefore, the detailed description thereof shall be omitted.
  • the mounting condition may satisfy the target takt time with respect to each board type and may also allow manufacturing of the board of the board type.
  • the mounting condition may also allow each mounter to manufacture only the board of one board type that is assigned, irrespective of whether or not the target takt time is satisfied.
  • the mounting condition optimizing unit 105b performs optimization by assigning a carrier lane to each board type. For example, the mounting condition optimizing unit 105b assigns the board type A to the R-lane such that the type-A board is manufactured on the R-lane, and assigns the board type B to the F-lane such that the type-B board is manufactured on the F-lane, to subsequently perform optimization with respect to each board type.
  • a plurality of board types should not be assigned to a single carrier lane. That is, a carrier lane is always assigned with only one board type.
  • the number of large components is relatively small as compared to the number of small components.
  • a mounter 200 mounts components only on the board of one board type. That is, the mounter 200 mounts the components dedicatedly on the board of one board type, not mounting the components on boards of a plurality of board types.
  • the mounter 200 that mounts components only on the board of one board type is referred to as a "dedicated mounter” and the mounter 200 that mounts components on boards of a plurality of board types is referred to as a "shared mounter”.
  • the dedicated mounter MC1 is a mounter 200 that includes two mounting heads 213a and 213b each having 12 pickup nozzles.
  • the dedicated mounter MC2 has the same structure as the dedicated mounter MC1.
  • the dedicated mounter MC3 is a mounter 200 that includes two mounting heads 213a and 213b each having 3 pickup nozzles.
  • the arrangement of components in the component supply units 211a and 211b is determined such that only the components to be mounted on the type-A board are arranged in the component supply units 211a and 211b.
  • the arrangement of the support pins which is appropriate for supporting the type-A board from the rear surface of the board, is determined. Note that it is sufficient to determine the arrangement of the support pins in the R-lane, which is appropriate for supporting the type-A board from the rear surface of the board, and that the support pins need not be arranged in the F-lane because no component is to be mounted on the board therein.
  • the type of pickup nozzles required for picking up only the components of the component types to be mounted on the type-A board is determined, and the type of pickup nozzles to be used in the mounting heads 213a and 213b and the type of pickup nozzles to be placed at the nozzle stations 218a and 218b are determined.
  • the takt time for the dedicated mounters MC1, MC2, and MC3 to mount the components on the type-A board is 100 sec, 98 sec, and 30 sec, respectively.
  • the takt time for the dedicated mounter MC3 is well below those for the two dedicated mounters MC1 and MC2 because the dedicated mounter MC3 has a smaller number of large components to be mounted.
  • the dedicated mounter MC3 including the mounting head having 3 pickup nozzles is a mounter for mounting large components.
  • the dedicated mounter MC4 is a component mounter 200 that includes two mounting heads 213a and 213b each having 12 pickup nozzles.
  • the dedicated mounter MC5 is a component mounter 200 that includes two mounting heads 213a and 213b each having 8 pickup nozzles.
  • the dedicated mounter MC6 is a component mounter 200 that includes two mounting heads 213a and 213b each having 3 pickup nozzles.
  • the arrangement of components in the component supply units 211a and 211b is determined such that only components to be mounted on the type-B board are provided in the component supply units 211a and 211b.
  • each of the dedicated mounters MC4 to MC6 the arrangement of the support pins, which is appropriate for supporting the type-B board from the rear surface of the board, is determined. Note that it is sufficient to determine the arrangement of the support pins in the F-lane, which is appropriate for supporting the type-B board from the rear surface of the board, and that the support pins need not be arranged in the R-lane because no component is to be mounted on the board therein.
  • the type of pickup nozzles required for picking up only components of the component types to be mounted on the type-B board is determined, and the type of pickup nozzles to be used in the mounting heads 213a and 213b and the type of pickup nozzles to be placed at the nozzle stations 218a and 218b are determined.
  • the takt time for the dedicated mounters MC4, MC5, and MC6 to mount the components on the type-B board is 100 sec, 96 sec, and 40 sec, respectively.
  • the takt time for the dedicated mounter MC6 is well below those for the two dedicated mounters MC4 and MC5 because the dedicated mounter MC5, which includes a mounting head having 3 pickup nozzles, is to mount a smaller number of large components.
  • the sort unit 105c determines an arrangement order, in the production line, of the mounters 200 (here, dedicated mounters) optimized in the optimization processing (S34, Loop A) such that a mounter including a mounting head having a larger number of pickup nozzles is disposed more upstream (S36).
  • a mounting head having a larger number of pickup nozzles picks up smaller components. Therefore, a mounter disposed more upstream mounts smaller components, and thus a mounter disposed downstream has only to mount other components avoiding the smaller components, so that component mounting is facilitated.
  • the mounters 200 are arranged, as FIG. 24 shows, in the following order: from upstream, the dedicated mounter MC1 (having 12 pickup nozzles), the dedicated mounter MC2 (having 12 pickup nozzles), the dedicated mounter MC4 (having 12 pickup nozzles), the dedicated mounter MC5 (having 8 pickup nozzles), the dedicated mounter MC3 (having 3 pickup nozzles), and the dedicated mounter MC6 (having 3 pickup nozzles).
  • the order of the dedicated mounters MC1, MC2, and MC4 may be switched among these three dedicated mounters.
  • the order of the dedicated mounters MC3 and MC6 may be reversal.
  • the merge unit 105d arbitrarily selects two dedicated mounters, which are assigned with different board types to be manufactured and each of which includes a mounting head having an equal number of pickup nozzles, from among a plurality of dedicated mounters obtained from the optimization processing (S34, Loop A).
  • the two dedicated mounters may be selected by giving priority to dedicated mounters with a shorter takt time.
  • the number of pickup nozzles included in the mounting head 213a and 213b corresponds to the description in the claims that reads "performance required for mounting the components".
  • the mounting heads included in the dedicated mounter MC3 that mounts the components on the type-A board and the mounting heads included in the dedicated mounter MC6 that mounts the components on the type-B board have an equal number of pickup nozzles, and the takt times for these mounters are shorter than the takt time for the other dedicated mounters. For this reason, it is assumed that the merge unit 105d has selected the dedicated mounters MC3 and MC6.
  • the merge unit 105d calculates the takt time for the board to be mounted by the shared mounter (S40). That is, the merge unit 105d, when assuming that the boards of a plurality of board types that have been mounted with the components by the two dedicated mounters are mounted with the components by a mounter 200 (shared mounter) achieving the same performance as the two dedicated mounters, calculates the takt time for the board to be mounted by the shared mounter.
  • FIG. 25 shows a production line and takt time when the two dedicated mounters are replaced with a shared mounter.
  • the merge unit 105d has replaced the dedicated mounters MC3 and MC6 shown in FIG. 24 with a shared mounter MC7 including a mounting head having pickup nozzles (3 pickup nozzles) equal in number to these dedicated mounters.
  • the shared mounter MC7 includes, in the component supply units 211a and 211b, all the components that the dedicated mounter MC3 is to mount on the type-A board, and all the components that the dedicated mounter MC6 is to mount on the type-B board.
  • the mounting heads 213a and 213b of the shared mounter MC7 cooperatively mount these components on the type-A board and type-B board. Assume that the takt times for the shared mounter MC7 to manufacture the type-A board and the type-B board have been calculated as 70 sec and 80 sec, respectively.
  • the merge unit 105d judges whether or not each of the calculated takt times for the boards of the plurality of board types is not over the target takt time (S42). When the takt times for the boards of all the plurality of board types are not over the target takt time (YES in S42), the merge unit 105d updates the composition of the mounters 200 in the production line by replacing the two dedicated mounters with one shared mounter (S44). Note that the merge unit 105d, when updating, determines an arrangement order of the mounters 200 in the production line as in the sort processing (S36) such that a mounter including a mounting head having a larger number of pickup nozzles is disposed more upstream.
  • both of the takt times for the shared mounter MC7 to manufacture the type-A board (70 sec) and to manufacture the type-B board (80 sec) are below the target takt time (100 sec). Therefore, the dedicated mounters MC3 and MC6 are replaced with the shared mounter MC7.
  • the shared mounter MC7 is disposed most downstream in the production line for the reason of including a relatively small number of pickup nozzles (3 pickup nozzles) as compared to the other component mounters (dedicated mounters MC1 to MC5).
  • the dedicated mounters MC3 and MC6 are not replaced with the shared mounter MC7, and the arrangement order of the six dedicated mounters MC1 to MC6 shown in FIG. 24 is determined.
  • the merge unit 105d judges whether or not any pair of mounters 200 that is not yet selected in the selection processing (S38) is present (S46). When any unselected pair of mounters 200 is present (YES in S46), the merge unit 105d repeatedly performs the processing from S38.
  • the merge unit 105d judges whether or not the number of the mounters 200 having been determined by the processing so far is not over the target number of the mounters indicated by the target-number-of-mounters data 107d (S48). When the number of the mounters 200 is below the target number of the mounters (YES in S48), the mounting condition determining apparatus 100 finishes the processing.
  • mounters 200 are provided in the production line shown in FIG. 25, and the target number of mounters indicated by the target-number-of-mounters data 107d is five. Accordingly, the number of the mounters 200 is not over the target number of mounters (YES in S48), and therefore the mounting condition determining apparatus 100 finishes the processing.
  • the merge unit 105d arbitrarily selects two dedicated mounters, which are assigned with different board types to be manufactured and each of which includes a mounting head having an equal number of pickup nozzles, from among a plurality of dedicated mounters obtained in the processing so far (S50).
  • the selection criterion may be such that, as with the case of S38, priority is given to a dedicated mounter with a shorter takt time.
  • the merge unit 105d updates the composition of the mounters 200 in the production line by replacing the selected two dedicated mounters with a shared mounter (S52). Note that the merge unit 105d, when updating, determines an arrangement order of the mounters 200 in the production line as in the sort processing (S36) such that a mounter including a mounting head having a larger number of pickup nozzles is disposed more upstream.
  • FIG. 26 shows, when replacing two dedicated mounters MC3 and MC6 with a shared mounter MC7, even in the case where the takt time for the shared mounter MC 7 to manufacture the type-B board (102 sec) is over the target takt time (100 sec), the two dedicated mounters MC3 and MC6 are replaced with the shared mounter MC7, and the arrangement order of the mounters 200 in the production line is determined.
  • the merge unit 105d repeatedly performs the processing in S50 and S52 until the number of the mounters 200 becomes not over the target number of mounters (NO in S48).
  • each component mounter 200 mounts components only on the board of the board type assigned to the mounter, and sends out, when a board of another board type is carried in, the board of the other board type to another component mounter 200 disposed downstream.
  • each mounter mounts components only on the board of one board type, and performs, when the board of the board type to be mounted with the components is carried onto the carrier lane assigned to the board type, the component mounting on the board.
  • each mounter carries out the board downstream, judging that a board of a board type other than the board type to be manufactured by the mounter has been carried in.
  • the mounters MC1 and MC2 with which elements are being changed only send out downstream a board (of board type B) carried in, but the mounters MC4, MC5, and MC7 continue manufacturing the type-B board. Accordingly, even while the elements are being changed, it is possible to secure a high operating rate for every mounter without suspending the mounter.
  • each mounter manufacturing only the board of one board type, it is possible to set the mounting condition focusing only the manufacturing of the board type. Therefore, it is sufficient to optimize, with respect to each mounter, the mounting condition focusing only on reducing the takt time for manufacturing the board of one board type. Accordingly, it is possible to minimize the takt time for the board manufacturing at each mounter.
  • the takt time for manufacturing the board of one board type affects the takt time for manufacturing the board of another board type, and this makes it difficult to concurrently minimize the takt times for manufacturing the boards of different types.
  • the mounter can focus on minimizing the takt time for manufacturing the board of the one board type, thus allowing minimization of the takt time for manufacturing the board of the board type.
  • each mounter includes a plurality of carrier lanes, thereby allowing manufacturing boards of a plurality of board types in a single production line. This improves area productivity accordingly.
  • the mounter 200 includes two carrier lanes, three or more carrier lanes may be included.
  • the mounter 200 may mount components only on the boards to be mounted with the components, which is carried onto two of the carrier lanes. Note that three or more types of boards may be manufactured in the case where three or more carrier lanes are provided.
  • the mounter 200 is assumed as an alternate mounting apparatus; however, the mounter 200 is not limited to the alternate mounting apparatus but may also be a mounter that mounts components using one mounting head.
  • two dedicated mounters each including a mounting head having an equal number of pickup nozzles
  • the two dedicated mounters may also be replaced with a shared mounter even in the case where the mounting heads of the two dedicated mounters have different numbers of nozzles.
  • FIG. 27 shows, assume a production line including: two dedicated mounters including 3 pickup nozzles, a dedicated mounter including 8 pickup nozzles, and three dedicated mounters including 12 pickup nozzles.
  • the takt times for the dedicated mounters MC3 and MC6 including 3 pickup nozzles are 30 sec and 100 sec, respectively, and that, when these two dedicated mounters are replaced with a shared mounter, the takt time for the board to be manufactured by the shared mounter exceeds the target takt time.
  • the takt times for the dedicated mounters MC1, MC2, and MC4 including 12 pickup nozzles are 100 sec, 98 sec, and 50 sec, respectively, and that, when any two of these three dedicated mounters are replaced with a shared mounter, the takt time for the board to be manufactured by the shared mounter exceeds the target takt time.
  • the merge unit 105d judges whether or not it is possible to replace, with one shared mounter, the dedicated mounter MC3 including 3 pickup nozzles and having a shortest takt time and the dedicated mounter MC4 including 12 pickup nozzles and having a second shortest takt time, and replaces these dedicated mounters with a shared mounter when judging that the replacement is possible.
  • the merge unit 105d judges whether or not it is possible to mount components on the board by using a shared mounter MC8 including 8 pickup nozzles, by adopting an intermediate value between the numbers of the pickup nozzles (3 and 12 pickup nozzles) included in the two dedicated mounters. That is, the dedicated mounter MC3 including 3 pickup nozzles mounts large components, and the dedicated mounter MC4 including 12 pickup nozzles mounts small components, and the merge unit 105d judges whether or not it is possible to pick up, so as to mount onto the board, these large and small components with the 8 pickup nozzles included in the shared mounter MC8, which are for mounting medium components.
  • the merge unit 105d optimizes the mounting condition for the component mounting performed by the shared mounter MC8.
  • the dedicated mounters MC3 and MC4 are replaced with a shared mounter MC8 when each of the takt times for the type-A board and the type-B board (65 sec and 95 sec, respectively) is not over the target takt time (100 sec).
  • the arrangement of the mounters 200 is determined such that a mounter 200 including a larger number of pickup nozzles is disposed more upstream.
  • the merge unit 105d optimizes the condition for mounting components on the type-A board and the type-B board by using a shared mounter MC9, which includes a mounting head 213a having 12 pickup nozzles equal in number to the pickup nozzles included in the mounting head of the dedicated mounter MC4, and which includes, on the other hand, three pickup nozzles equal in number to the pickup nozzles included in the mounting head of the dedicated mounter MC3.
  • the dedicated mounters MC3 and MC4 are replaced with a shared mounter MC9 when each of the takt times for the type-A board and type-B board (90 sec and 100 sec, respectively) is not over the target takt time (100 sec).
  • a mounter 200 including a larger number of pickup nozzles should be disposed more upstream, but there is a case where such an arrangement is not possible due to the difference in number of pickup nozzles included in the two mounting heads of the shared mounter MC9.
  • the shared mounter MC9 includes a mounting head 213b having a smaller number of pickup nozzles (3 nozzles) than the number of pickup nozzles (8 nozzles) included in the mounting head of the dedicated mounter MC5.
  • only one of the processing from S38 to S46 and the processing from S48 to S52 shown in FIG. 21 may be performed. That is, when, in FIG. 21, performing the processing from S38 to S46 without performing the processing from S48 to S52, it is possible to ensure that the line takt time is not over the target takt time. On the other hand, when, in FIG. 21, performing the processing from S48 to S52 without performing the processing from S38 to S46, it is not possible to ensure that the line takt time is not over the target takt time, but it is possible to ensure the number of mounters is not over the target number of mounters.
  • the present invention is applicable to a mounting condition determining method in a production line equipped with mounters including a plurality of carrier lanes on which a board is carried, and is particularly applicable to a mounting condition determining method or the like that achieves improvement in throughput so as to maximize a throughput for the production line as a whole.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Afin d'assurer un taux de production élevé pour chaque appareil de montage, sans interruption de l'appareil pendant le changement d'éléments, et pour déterminer une condition de montage de composant permettant d'obtenir une productivité de zone accrue, une carte de type A et une carte de type B sont respectivement montées sur une piste R et une piste F. De plus, la condition de montage de composant est déterminée de sorte que des appareils de montage (MC1) et (MC2) montent des composants uniquement sur la carte de type A, et des appareils de montage (MC3) et (MC4) montent des composants uniquement sur la carte de type B.
PCT/JP2009/000653 2008-02-21 2009-02-18 Procédé et dispositif pour déterminer une condition de montage, procédé de montage de composant, appareil de montage et programme WO2009104384A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008040532 2008-02-21
JP2008-040532 2008-02-21
JP2008-045964 2008-02-27
JP2008045964 2008-02-27

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WO2009104384A2 true WO2009104384A2 (fr) 2009-08-27
WO2009104384A3 WO2009104384A3 (fr) 2009-10-15

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3331338A4 (fr) * 2015-07-29 2019-03-27 FUJI Corporation Machine de montage de composants
US10667448B2 (en) 2014-06-17 2020-05-26 Fuji Corporation Electronic component mounting method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252546A (ja) * 1993-02-23 1994-09-09 Matsushita Electric Ind Co Ltd 実装基板生産システム
US5692292A (en) * 1994-09-02 1997-12-02 Fuji Machine Mfg. Co., Ltd. Transfer type circuit board fabricating system
JP2004128245A (ja) * 2002-10-03 2004-04-22 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252546A (ja) * 1993-02-23 1994-09-09 Matsushita Electric Ind Co Ltd 実装基板生産システム
US5692292A (en) * 1994-09-02 1997-12-02 Fuji Machine Mfg. Co., Ltd. Transfer type circuit board fabricating system
JP2004128245A (ja) * 2002-10-03 2004-04-22 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10667448B2 (en) 2014-06-17 2020-05-26 Fuji Corporation Electronic component mounting method
EP3331338A4 (fr) * 2015-07-29 2019-03-27 FUJI Corporation Machine de montage de composants

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