WO2019030876A1 - Dispositif d'attribution de composant - Google Patents

Dispositif d'attribution de composant Download PDF

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Publication number
WO2019030876A1
WO2019030876A1 PCT/JP2017/029009 JP2017029009W WO2019030876A1 WO 2019030876 A1 WO2019030876 A1 WO 2019030876A1 JP 2017029009 W JP2017029009 W JP 2017029009W WO 2019030876 A1 WO2019030876 A1 WO 2019030876A1
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WO
WIPO (PCT)
Prior art keywords
component
mounting
imaging
abnormality
illumination
Prior art date
Application number
PCT/JP2017/029009
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English (en)
Japanese (ja)
Inventor
雅史 天野
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to JP2019535523A priority Critical patent/JP6804653B2/ja
Priority to PCT/JP2017/029009 priority patent/WO2019030876A1/fr
Publication of WO2019030876A1 publication Critical patent/WO2019030876A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • This specification discloses a component allocation device.
  • Patent Document 1 discloses an arrangement determination method for determining the arrangement of components in each component supply unit of a plurality of component mounters so that the mounting time of each component mounter can be balanced best.
  • the following blocks are sequentially executed in this sequencing method. That is, for the first block, a component arrangement table is created in which the mounting speed is arranged in the order of high to low, or the component shape is sorted in the order of small to large.
  • component supply units are allocated in order from the upstream component mounting machine without changing the order of components in the component array table, and boundaries between component mounting machines are initialized on the component array table.
  • the next block repeats the calculation of the mounting time for each component mounting machine after moving the boundary between the component mounting machines on the component array table, and the parts are balanced so that the mounting time for each component mounting machine can be most balanced.
  • the arrangement of parts in the parts supply unit is determined.
  • the above-described arrangement determination method is premised on a state in which no abnormality has occurred in all the component mounting machines, and some cameras among the imaging devices for imaging components that the plurality of component mounting machines have respectively No mention is made of the case where an abnormality occurs.
  • an abnormality occurs in some imaging devices, if the arrangement of the components is determined so that the mounting of the components is not allocated at all to the component mounting machine having the imaging device in which the abnormality occurs, the mounting efficiency significantly decreases.
  • the present disclosure relates to the mounting efficiency of the entire mounting line even when an abnormality occurs in at least a part of the functions of any of the imaging devices of the plurality of component mounters constituting the mounting line.
  • the main object of the present invention is to provide a parts allocation apparatus that can suppress the decrease in
  • the present disclosure takes the following measures in order to achieve the above-mentioned main objects.
  • the component allocation device of the present disclosure is a component allocation device that allocates components to be mounted on each component mounter in a mounting line including a plurality of component mounters having image pickup devices for component imaging, and a plurality of the component mounters are When an abnormality occurs in at least a part of the functions of any of the imaging devices among the imaging devices that each has, mounting of a component that requires the use of the function in which the abnormality occurs is another imaging device in which the abnormality does not occur
  • the gist of the present invention is to assign the component mounting machine of the item (b) to the component mounting machine having the imaging device in which the abnormality has occurred.
  • the component allocation device of the present disclosure uses the function in which the abnormality occurs.
  • the necessary component mounting is allocated to other component mounting machines having an imaging device in which no abnormality has occurred.
  • the component allocation device of the present disclosure allocates components that do not require the use of the function in which the abnormality has occurred to a component mounter having an imaging device in which the abnormality has occurred.
  • the allocation apparatus of the present disclosure can suppress a decrease in mounting efficiency over the entire mounting line, as compared to one in which no component is allocated to a component mounter having an imaging device in which an abnormality has occurred.
  • FIG. 1 is a block diagram of a component mounting system 1;
  • FIG. 2 is a block diagram of a component mounter 10;
  • FIG. 6 is a configuration diagram of a head 30 and a part camera 40.
  • FIG. 6 is a block diagram showing an electrical connection relationship between a control device 70 and a management device 100. It is a flow chart which shows an example of parts allocation processing.
  • FIG. 7 is an explanatory view showing how parts are allocated to the mounters A to C.
  • FIG. 7 is an explanatory view showing how parts are allocated to the mounters A to C.
  • FIG. 7 is an explanatory view showing how parts are allocated to the mounters A to C.
  • It is a block diagram of the head 130 of a modification.
  • FIG. 1 is a block diagram of the component mounting system 1.
  • FIG. 2 is a block diagram of the component mounter 10.
  • FIG. 3 is a block diagram of the head 30 and the part camera 40.
  • FIG. 4 is a block diagram showing the electrical connection between the control device 70 and the management device 100.
  • the horizontal direction in FIG. 2 is the X-axis direction
  • the front-rear direction is the Y-axis direction
  • the vertical direction is the Z-axis direction.
  • the component mounting system 1 is provided with the screen printing machine 2, the component mounting machine 10, the reflow oven 4, the management apparatus 100 which manages the whole system, etc., as shown in FIG.
  • the screen printing machine 2 prints a wiring pattern (solder surface) on the lower substrate B via the pattern holes by pressing the solder on the screen while rolling the solder on the screen with a squeegee into the pattern holes formed in the screen.
  • the component mounter 10 adsorbs an electronic component (hereinafter simply referred to as "component") P and mounts it on a substrate B on which solder is printed.
  • the reflow furnace 4 melts the solder on the substrate B by heating the substrate B on which the component is mounted, and performs solder bonding.
  • the component mounting machine 10 mounts various components P having different sizes and shapes, such as chip components such as chip resistors and irregular shaped components such as connectors, and IC components such as QFP (Quad Flat Package) and BGA (Ball Grid Array). It is configured as a possible universal mounter. As shown in FIG. 2, the component mounter 10 includes a component supply device 22, a substrate transfer device 24, an XY robot 26, a head 30, a mark camera 28, a part camera 40, and a control device 70 (see FIG. 4). .
  • the component mounting system 1 of the present embodiment includes a plurality of component mounters 10 having the same configuration.
  • the component supply device 22 supplies the component P to the component supply position.
  • the component supply device 22 is mounted on the front of the component mounter 10 so as to be arranged along the X-axis direction (left-right direction), and has a tape containing a plurality of components (chip components etc.) P of the same type. It includes a tape feeder for supplying, and a tray feeder for supplying a tray installed at the front of the component mounter 10 and containing a plurality of components (such as IC components) P of the same type.
  • the substrate transfer device 24 has a pair of conveyor belts which are provided at intervals in the front and rear direction and are spanned in the left-right direction.
  • the substrate B is transported by the conveyor belt of the substrate transport device 24 from left to right in the drawing.
  • the XY robot 26 moves the head 30 in the XY axis direction.
  • a Y-axis slider 26b which is movably supported and movable in the Y-axis direction (front-rear direction) by the drive of a Y-axis motor.
  • the head 30 is detachably attached to the X-axis slider 26a.
  • the head 30 removed from one component mounter 10 can be attached to another component mounter 10 of the component mounting system 1.
  • the head 30 is a rotary head, and as shown in FIG. 3, a head body 31 as a rotating body, and a plurality of nozzle holders 32 arranged circumferentially with respect to the head body 31 and supported so as to be able to move up and down. Equipped with A suction nozzle 33 is removably attached to the tip of each nozzle holder 32. Further, although not shown, the head 30 rotates an R-axis motor for rotating the head main body 31 so as to turn the plurality of nozzle holders 32 around the central axis of the head main body 31 and rotates the plurality of nozzle holders 32 around their respective axes. And a Z-axis motor for moving up and down the nozzle holder 32 (suction nozzle 33) at a predetermined turning position among the plurality of nozzle holders 32.
  • the mark camera 28 is provided on the head 30, and picks up an image of the component P supplied from the component supply device 22 from above to recognize the position of the component, and is attached to the substrate B transported by the substrate transport device 24.
  • the reference mark is imaged from above to recognize the substrate position.
  • the parts camera 40 is detachably provided between the parts supply device 22 and the substrate transfer device 24.
  • the part camera 40 removed from a certain component mounter 10 can be attached to another component mounter 10 of the component mounting system 1.
  • the parts camera 40 captures an image of a component sucked by the head 30 from below and recognizes the suction posture (suction deviation).
  • the parts camera 40 includes an illumination device 41, a lens 48, and an imaging device 49 (CCD, CMOS, etc.).
  • the illumination device 41 includes a side illumination unit 42 and an epi-illumination unit (coaxial epi-illumination unit) 44.
  • the side-reflection illumination unit 42 applies light obliquely to the subject, and includes a plurality of light emitters (LEDs) 43 arranged in a ring around the lens 48 in top view.
  • LEDs light emitters
  • the epi-illumination unit 44 applies light to the subject from the same direction as the optical axis of the lens 48, and the half mirror 46 and the half mirror 46 disposed at an oblique angle of 45 degrees with respect to the optical axis of the lens 48.
  • a light emitter (LED) 45 for emitting light in a direction (horizontal direction) orthogonal to the optical axis of the lens 48.
  • the illumination device 41 emits total illumination that emits light from the side illumination portion 42 and the epi illumination portion 44, side illumination that emits light only from the side illumination portion 42, and illuminates light from only the epi illumination portion 44.
  • a plurality of illumination patterns including coaxial illumination (coaxial illumination).
  • the part camera 40 switches the illumination pattern to any of a plurality of illumination patterns by setting the shape data of the component P, and under the optimum imaging condition for each component type Take an image.
  • the part camera 40 irradiates the light by total illumination so that uniform light can be applied to the parts P to obtain stable reflected light. Take an image.
  • the parts camera 40 performs imaging by emitting light by side-illumination in order to clearly grasp the outline of the terminal P with respect to the component P having a ball-shaped terminal such as a BGA (Ball Grid Array).
  • BGA Ball Grid Array
  • the control device 70 is configured as a microprocessor centering on the CPU 71 and, in addition to the CPU 71, includes a ROM 72, an HDD 73, a RAM 74, an input / output interface 75, and the like. These are connected via a bus 76.
  • a position sensor (not shown) that detects the position of the XY robot 26 in the XY axis direction, image signals from the part camera 40 and the mark camera 28, and the like are input to the control device 70.
  • the control device 70 the component supply device 22 and the substrate transfer device 24, the X axis motor and Y axis motor of the XY robot 26, Z axis motor of the head 30, R axis motor and ⁇ axis motor, parts camera 40, mark Various control signals to the camera 28 and the like are output.
  • the management apparatus 100 is configured, for example, as a general-purpose computer, and includes a CPU 101, a ROM 102, an HDD 103, a RAM 104, an input / output interface 105, and the like as shown in FIG.
  • An input signal from the input device 107 is input to the management apparatus 100 via the input / output interface 105.
  • a display signal to the display 108 is output from the management device 100 via the input / output interface 105.
  • the HDD 103 stores job information and a part allocation program.
  • the job information is information for instructing each component mounter 10 to perform the suction operation and the mounting operation, and information on the substrate B, information on the type of the component P (shape data), a target of the component P The mounting position, information on the head 30, and the like are included.
  • the component allocation program is a program for allocating components P (tape feeders and tray feeders) to be mounted on the component mounters 10 so that the mounting operation performed by the component mounters 10 is optimized. .
  • the management device 100 is communicably connected to the control devices 70 of the plurality of component mounters 10, and exchanges various information and control signals with the plurality of component mounters 10.
  • the component mounting process is executed by the control device 70 of each component mounter 10 when receiving job information from the management device 100.
  • the CPU 71 of the control device 70 controls the XY robot 26 to move the head 30 above the component supply position, and controls the Z-axis motor to supply the component to the component supply position. P is adsorbed to the adsorption nozzle 33.
  • the CPU 71 repeats the operation of controlling the R-axis motor to turn the nozzle holder 32 and controlling the Z-axis motor to cause the next suction nozzle 33 to suction the component P until the planned number of components P is suctioned. .
  • the CPU 71 controls the XY robot 26 to move the head 30 above the part camera 40, and controls the part camera 40 to image the part P attracted to the suction nozzle 33.
  • the control of the parts camera 40 controls the illumination device 41 so that light is emitted by the illumination pattern suitable for imaging of the part P based on the shape data of the adsorbed part P, and imaging is performed so that the part P is imaged It is performed by controlling the element 49.
  • the CPU 71 irradiates light with the corresponding illumination pattern and picks up an image for each component type Do.
  • the CPU 71 determines the suction position shift of the component P sucked by the suction nozzle 33 based on the obtained captured image, and corrects the target mounting position of the component P. Then, the CPU 71 controls the XY robot 26 to move the suction nozzle 33 above the target mounting position, lower the suction nozzle 33 by the Z-axis motor, mount the component P on the substrate B, and mount the component. finish. The CPU 71 repeats the operation of mounting each component P at each target mounting position when the component P is suctioned by the plurality of suction nozzles 33.
  • FIG. 5 is a flowchart showing an example of component allocation processing executed by the CPU 101 of the management apparatus 100.
  • the CPU 101 of the management device 100 first determines whether the component P to be mounted on each component mounter 10 has been allocated (S100). If the CPU 101 determines that allocation has not been completed, it allocates components P to be mounted to each of the component mounters 10 in a combination in which the mounting efficiency is highest in the component mounting system 1 (S110).
  • the CPU 101 extracts all combinations of components P that can be allocated to each component mounter 10.
  • the CPU 101 calculates the required time (mounting time) when each component mounting machine 10 performs the mounting operation in the extracted combination. Then, the CPU 101 determines a combination with the smallest difference in mounting time of the component mounters 10 as a combination with the highest mounting efficiency. On the other hand, when the CPU 101 determines that the assignment is completed, the processing of S110 is skipped.
  • the CPU 101 determines whether or not a failure occurs in the partial illumination of the illumination device 41 (S120).
  • the failure of the partial illumination means a failure of one of the side illumination unit 42 and the incident illumination unit 44.
  • total illumination and side illumination can not be performed when the side illumination unit 42 fails, and total illumination and incident illumination can not be performed when the incident illumination unit 44 fails.
  • the failure of the partial illumination can be determined based on, for example, the luminance value of the captured image obtained by capturing the part P by the part camera 40.
  • the CPU 101 determines that a failure does not occur in the partial lighting of the lighting device 41, it ends the component allocation process.
  • the CPU 101 determines that a failure occurs in the partial lighting of the lighting device 41, the restriction that the component P requiring imaging using the broken lighting is not allocated to the component mounting machine 10 in which the partial lighting fails.
  • the allocation of the component P to each component mounting machine 10 is changed so that the mounting efficiency becomes the highest (S130), and the component allocation processing is ended.
  • the CPU 101 among all the combinations extracted in the process of S110, a component that requires imaging using the failed illumination with respect to the component mounter 10 in which the partial illumination has failed. Extract combinations excluding combinations that allocate P.
  • the CPU 101 calculates the mounting time of each component mounting machine 10 in each of the extracted combinations, and determines the combination with the smallest difference in mounting time of each component mounting machine 10.
  • CPU101 allocates the components P which should be mounted with respect to each component mounting machine 10 in consideration of the said other restrictions, when there exist other restrictions other than the failure of a part illumination.
  • Other restrictions include, for example, the restriction on the mounting order of the parts P due to the size of the parts P, the mounting position, and the electrical characteristics.
  • FIG. 6 to 8 are explanatory diagrams showing how parts are allocated to component mounters A to C.
  • FIG. For convenience of explanation, the component mounting system in the figure is provided with three component mounters A to C. If no failure occurs in any of the lighting devices of the component mounters A to B, the management device allocates the components 1 to 9 to be mounted to the respective component mounters A to C so as to achieve the highest mounting efficiency. .
  • the component mounter A requires the component 1 that requires imaging using a total illumination, the component 4 that requires imaging using an epi-illumination, and imaging using a side-illuminated illumination Part 7 is allocated.
  • the component mounting machine B is allocated a component 2 that requires imaging using a total illumination, a component 5 that requires imaging using an epi-illumination, and a component 8 that requires imaging using a side-illuminated illumination .
  • the component mounting machine C is allocated a component 3 that requires imaging using a total illumination, a component 6 that requires imaging using an epi-illumination, and a component 9 that requires imaging using a side-illuminated illumination .
  • the management device is, as shown in FIG. 7, another component 7 to 9 assigned to the component mounting machine B without failure It is conceivable that components are allocated to the component mounting machines A and C and no component is allocated to the component mounting machine B at all.
  • the mounting time of the other component mounting machines A and C is increased, and the mounting efficiency is significantly reduced.
  • the management apparatus as shown in FIG. Allocating to C, instead, parts 7 and 9 which do not require total illumination and epi-illumination (parts requiring side illumination) 7 and 9 are allocated to the component mounting machine B. As a result, it is possible to balance the mounting time in each of the component mounting machines A to C, and to suppress the reduction in mounting efficiency.
  • the part camera 40 corresponds to an imaging device
  • the component mounter 10 corresponds to a component mounter
  • the management device 100 corresponds to a component allocation device.
  • the illumination device 41 corresponds to the illumination device
  • the imaging device 49 corresponds to the imaging device.
  • the management apparatus 100 (parts allocation apparatus) according to the present embodiment described above is abnormal when at least a part of functions of one of the part cameras 40 of the part mounters 10 respectively has an abnormality.
  • the part mounting machine 10 having the part camera 40 in which no abnormality has occurred is allocated to the mounting of the part that requires the use of the function that has occurred.
  • the management apparatus 100 allocates the mounting of a component that does not require the use of the function in which the abnormality has occurred to the component mounter 10 having the part camera 40 in which the abnormality has occurred.
  • the management apparatus 100 can suppress a decrease in mounting efficiency in the entire mounting line, as compared with the case where no component is allocated to the component mounting machine 10 having the part camera 40 in which the abnormality has occurred.
  • the plurality of component mounters 10 have the side radiation irradiating unit 42 and the epi-illumination irradiating unit 44 as the lighting device 41 of the part camera 40, switch the illumination for each component type and It was assumed to be imaging.
  • the plurality of component mounters 10 have a plurality of side-reflection illumination units with different angles at which light impinges on the subject as the illumination device 41 of the part camera 40, and switches the illumination for each component type May be taken.
  • the management apparatus mounts the parts that require the use of the part of the side-mounted lighting units. Is allocated to the other component mounting machine in which the part of the side illumination units does not break down; instead, the mounting of parts that do not require the use of the part of the side illumination units is performed in the part of the side illumination units Assigns to the failed component mounting machine.
  • the plurality of component mounters 10 have the side radiation irradiating unit 42 and the epi-illumination irradiating unit 44 as the illumination device 41 of the part camera 40, and switch the illumination pattern for each component type Was taken.
  • the plurality of component mounters 10 have a plurality of illumination units (red, blue, etc.) capable of emitting light of different colors as the illumination device 41 of the part camera 40, and switch the illumination color for each component type
  • the component P may be imaged.
  • the management apparatus performs the mounting of the parts that require the use of the lighting unit.
  • the lighting unit is allocated to the other component mounting machine which has not failed, and instead, the mounting of components which do not require the use of the lighting unit is allocated to the component mounting machine in which the lighting unit is broken.
  • the plurality of component mounters 10 are provided with the parts camera 40 that images the component P absorbed by the suction nozzle 33 from below.
  • the plurality of component mounters 10 may be provided with a side camera 138 that images the component P sucked by the suction nozzle 33 from the side.
  • the side camera 138 is provided on the head 130.
  • the management apparatus is a component that does not have a failure in the side surface camera 138 that is a component requiring imaging by the side camera 138.
  • the parts which are allocated to the mounting machine 10 and which do not require imaging with the side camera 138 are allocated to the part mounting machine 10 in which the side camera 138 has failed.
  • the head 130 is detachably attached to the X-axis slider 26a of the component mounter 10, similarly to the head 30 of the embodiment.
  • the component mounter 10 can replace and attach the head 130 and the head 30.
  • the CPU 101 assigns the component P to be mounted to each component mounter 10 taking into consideration the other constraints.
  • the CPU 101 may be able to extract only allocations in which the balance of mounting times of the component mounting machines 10 is significantly lost. After determining the allocation of the component P with the smallest difference in the mounting time of each component mounter 10, the CPU 101 may determine whether the difference in the mounting time exceeds a predetermined value.
  • each component mounter 10 in the case of replacement may also be considered. For example, with respect to a tall component having a height in the height direction, there may be a case where a constraint to be mounted at the end of the component mounter 10 on the most downstream side of the component mounting system 1 is provided. This is because the tall component becomes an obstacle after the tall component is mounted, making it difficult to mount other components. For example, in the example of FIG.
  • the component 9 when the component 9 is the tall component to be mounted at the end, the component 9 can not be allocated to the component mounter B as shown in FIG. Assigned to If the CPU 101 determines that the difference in mounting time of each component mounting machine exceeds a predetermined value as a result of allocation, the CPU 101 is provided in the part camera 40 provided in the component mounting machine C and the component mounting machine B It is also possible to consider the assignment in the case of replacing the selected parts camera 40.
  • the present disclosure is applicable to, for example, the manufacturing industry of component mounting machines and component mounting systems.

Abstract

L'invention concerne un dispositif d'attribution de composant qui attribue des composants à monter, à chaque machine de montage de composant dans une ligne de montage comprenant une pluralité de machines de montage de composant ayant un dispositif d'imagerie permettant de capturer des images de composants. Si une erreur s'est produite dans au moins certaines fonctions de l'un des dispositifs d'imagerie parmi les dispositifs d'imagerie disposés dans chaque machine de la pluralité de machines de montage de composant, ce dispositif d'attribution de composant : attribue un montage de composant nécessitant l'utilisation d'une fonction pour laquelle une erreur s'est produite à une autre machine de montage de composant ayant un dispositif d'imagerie qui n'a pas d'erreur ; et attribue le montage de composants ne nécessitant pas l'utilisation de la fonction ayant l'erreur à la machine de montage de composant ayant le dispositif d'imagerie ayant l'erreur.
PCT/JP2017/029009 2017-08-09 2017-08-09 Dispositif d'attribution de composant WO2019030876A1 (fr)

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JP2019535523A JP6804653B2 (ja) 2017-08-09 2017-08-09 部品割付装置
PCT/JP2017/029009 WO2019030876A1 (fr) 2017-08-09 2017-08-09 Dispositif d'attribution de composant

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114073176A (zh) * 2019-06-27 2022-02-18 株式会社富士 元件安装机以及对基板作业系统

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Publication number Priority date Publication date Assignee Title
JPS62155599A (ja) * 1985-12-27 1987-07-10 松下電器産業株式会社 電子部品実装方法
JPH0760579A (ja) * 1993-08-31 1995-03-07 Toshiba Corp 部品実装作業割付方法及びその装置
JP2005072025A (ja) * 2003-08-21 2005-03-17 Juki Corp 電子部品実装装置
JP2006157063A (ja) * 2006-03-13 2006-06-15 Matsushita Electric Ind Co Ltd 部品供給カセットの配列決定方法
JP2013143470A (ja) * 2012-01-11 2013-07-22 Fuji Mach Mfg Co Ltd 部品実装方法
WO2015193975A1 (fr) * 2014-06-17 2015-12-23 富士機械製造株式会社 Procédé d'implantation de composants électroniques, et système d'implantation de composants électroniques
WO2017037879A1 (fr) * 2015-09-01 2017-03-09 富士機械製造株式会社 Dispositif d'attribution de travail

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62155599A (ja) * 1985-12-27 1987-07-10 松下電器産業株式会社 電子部品実装方法
JPH0760579A (ja) * 1993-08-31 1995-03-07 Toshiba Corp 部品実装作業割付方法及びその装置
JP2005072025A (ja) * 2003-08-21 2005-03-17 Juki Corp 電子部品実装装置
JP2006157063A (ja) * 2006-03-13 2006-06-15 Matsushita Electric Ind Co Ltd 部品供給カセットの配列決定方法
JP2013143470A (ja) * 2012-01-11 2013-07-22 Fuji Mach Mfg Co Ltd 部品実装方法
WO2015193975A1 (fr) * 2014-06-17 2015-12-23 富士機械製造株式会社 Procédé d'implantation de composants électroniques, et système d'implantation de composants électroniques
WO2017037879A1 (fr) * 2015-09-01 2017-03-09 富士機械製造株式会社 Dispositif d'attribution de travail

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114073176A (zh) * 2019-06-27 2022-02-18 株式会社富士 元件安装机以及对基板作业系统
CN114073176B (zh) * 2019-06-27 2023-07-18 株式会社富士 元件安装机以及对基板作业系统

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