JP7301973B2 - 検査装置 - Google Patents
検査装置 Download PDFInfo
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- JP7301973B2 JP7301973B2 JP2021536455A JP2021536455A JP7301973B2 JP 7301973 B2 JP7301973 B2 JP 7301973B2 JP 2021536455 A JP2021536455 A JP 2021536455A JP 2021536455 A JP2021536455 A JP 2021536455A JP 7301973 B2 JP7301973 B2 JP 7301973B2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8845—Multiple wavelengths of illumination or detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
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- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
部品が実装された基板の検査用画像を用いて該部品の実装検査を行なう検査装置であって、
前記基板のR,G,Bの3つの単色画像を取得する撮像装置と、
前記取得された3つの単色画像の各輝度値により基板色を設定し、該設定した基板色の補色を算出し、該算出した補色の各色成分のうち輝度値が最も大きい色成分を決定し、前記取得された3つの単色画像のうち前記決定した色成分の単色画像を前記検査用画像に設定する画像処理装置と、
を備えることを要旨とする。
部品が実装された基板の検査用画像を用いて該部品の実装検査を行なう検査装置であって、
前記基板のR,G,Bの3つの単色画像を取得する撮像装置と、
前記取得された3つの単色画像において前記部品が有する電極部と該電極部と反射率が異なる電極周辺部とを少なくとも含む所定領域内におけるコントラストをそれぞれ算出し、前記3つの単色画像のうち前記コントラストが最も大きい色成分の単色画像を前記検査用画像に設定する画像処理装置と、
を備えることを要旨とする。
G'=(Max+Min)-G …(2)
B'=(Max+Min)-B …(3)
C=Lmax/Lmin …(5)
Claims (2)
- 部品が実装された基板の検査用画像を用いて該部品の実装検査を行なう検査装置であって、
前記基板のR,G,Bの3つの単色画像を取得する撮像装置と、
前記取得された3つの単色画像の各輝度値により基板色を設定し、該設定した基板色の補色を算出し、該算出した補色の各色成分のうち輝度値が最も大きい色成分を決定し、前記取得された3つの単色画像のうち前記決定した色成分の単色画像を前記検査用画像に設定する画像処理装置と、
を備え、
前記画像処理装置は、前記3つの単色画像において輝度値のヒストグラムをそれぞれ作成し、該作成した各ヒストグラムにおいて最頻の輝度値の組合せを前記基板色に設定する、
検査装置。 - 請求項1に記載の検査装置であって、
R,G,Bの3つの単色光を前記基板に対して独立して照射可能な照明装置を備え、
前記撮像装置は、前記照明装置から独立して照射される前記3つの単色光でそれぞれ前記基板を撮像することにより前記3つの単色画像を取得する単色カメラである、
検査装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/029471 WO2021019610A1 (ja) | 2019-07-26 | 2019-07-26 | 検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021019610A1 JPWO2021019610A1 (ja) | 2021-02-04 |
JP7301973B2 true JP7301973B2 (ja) | 2023-07-03 |
Family
ID=74229868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021536455A Active JP7301973B2 (ja) | 2019-07-26 | 2019-07-26 | 検査装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220252524A1 (ja) |
EP (1) | EP4007480A4 (ja) |
JP (1) | JP7301973B2 (ja) |
CN (1) | CN114128418B (ja) |
WO (1) | WO2021019610A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024009410A1 (ja) * | 2022-07-05 | 2024-01-11 | 株式会社Fuji | 部品有無判定方法および画像処理システム |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010014530A (ja) | 2008-07-03 | 2010-01-21 | Omron Corp | 基板外観検査方法および基板外観検査装置 |
JP2016130663A (ja) | 2015-01-13 | 2016-07-21 | オムロン株式会社 | 検査装置及び検査装置の制御方法 |
JP2017181188A (ja) | 2016-03-29 | 2017-10-05 | Ckd株式会社 | 基板検査装置 |
JP2018138871A (ja) | 2017-02-24 | 2018-09-06 | 株式会社レクザム | 基板検査装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2532513B2 (ja) * | 1987-09-29 | 1996-09-11 | 松下電器産業株式会社 | 物体有無検査方法 |
JPH02231510A (ja) * | 1989-03-02 | 1990-09-13 | Omron Tateisi Electron Co | 基板検査装置 |
JPH1140983A (ja) | 1997-07-18 | 1999-02-12 | Matsushita Electric Ind Co Ltd | 基板マーク認識装置 |
JP3668383B2 (ja) * | 1998-02-27 | 2005-07-06 | 松下電器産業株式会社 | 電子部品実装装置 |
KR20030026839A (ko) * | 2001-09-26 | 2003-04-03 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 화상처리를 이용한 검사대상물의 표면검사방법 및 그 장치 |
JP2004053477A (ja) * | 2002-07-22 | 2004-02-19 | Dainippon Printing Co Ltd | 色ムラ検査方法及び装置 |
WO2006066205A2 (en) * | 2004-12-19 | 2006-06-22 | Ade Corporation | System and method for inspection of a workpiece surface using multiple scattered light collectors |
JP2007198773A (ja) * | 2006-01-24 | 2007-08-09 | Omron Corp | 基板検査方法および基板検査装置 |
JP2008292398A (ja) * | 2007-05-28 | 2008-12-04 | Omron Corp | 部品電極の浮き不良の検査方法および基板検査装置 |
JP4389982B2 (ja) * | 2007-08-09 | 2009-12-24 | オムロン株式会社 | 基板外観検査装置 |
CN100566540C (zh) * | 2007-10-17 | 2009-12-02 | 太阳油墨(苏州)有限公司 | 印刷电路板的外观检查方法 |
US8023121B2 (en) * | 2008-04-18 | 2011-09-20 | Coinsecure, Inc. | Method for optically collecting numismatic data and associated algorithms for unique identification of coins |
JP5524495B2 (ja) * | 2009-03-10 | 2014-06-18 | 富士機械製造株式会社 | 撮像システムおよび電子回路部品装着機 |
JP2014135425A (ja) * | 2013-01-11 | 2014-07-24 | Djtech Co Ltd | プリント基板の品質管理システム |
JP2019152518A (ja) * | 2018-03-02 | 2019-09-12 | セイコーエプソン株式会社 | 検査装置、検査システム、及び検査方法 |
-
2019
- 2019-07-26 WO PCT/JP2019/029471 patent/WO2021019610A1/ja unknown
- 2019-07-26 US US17/629,757 patent/US20220252524A1/en active Pending
- 2019-07-26 JP JP2021536455A patent/JP7301973B2/ja active Active
- 2019-07-26 CN CN201980098594.5A patent/CN114128418B/zh active Active
- 2019-07-26 EP EP19939279.6A patent/EP4007480A4/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010014530A (ja) | 2008-07-03 | 2010-01-21 | Omron Corp | 基板外観検査方法および基板外観検査装置 |
JP2016130663A (ja) | 2015-01-13 | 2016-07-21 | オムロン株式会社 | 検査装置及び検査装置の制御方法 |
JP2017181188A (ja) | 2016-03-29 | 2017-10-05 | Ckd株式会社 | 基板検査装置 |
JP2018138871A (ja) | 2017-02-24 | 2018-09-06 | 株式会社レクザム | 基板検査装置 |
Also Published As
Publication number | Publication date |
---|---|
EP4007480A4 (en) | 2022-08-03 |
CN114128418B (zh) | 2023-10-20 |
EP4007480A1 (en) | 2022-06-01 |
CN114128418A (zh) | 2022-03-01 |
WO2021019610A1 (ja) | 2021-02-04 |
US20220252524A1 (en) | 2022-08-11 |
JPWO2021019610A1 (ja) | 2021-02-04 |
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